Miniaturized high-integration low-noise optical module

Abstract

The utility model relates to a miniaturized high-integration low-noise optical module, which comprises a lower shell, a heat dissipation pad is arranged on the lower shell, an optical device is arranged on the heat dissipation pad, and the heat dissipation pad is connected with an upper shell through a detachable structure. A radiator is arranged on the lower shell corresponding to the radiating pad; the optical device comprises a PCB, and the PCB is fixedly connected with the lower shell through a fixing piece and correspondingly connected with a lead area on the upper shell through a flexible wire. And the optical device is correspondingly provided with a flexible board, and the flexible board is matched with the upper shell and the lower shell to form connection of the corresponding PCB and flexible pressing and positioning of the optical device, so that the miniaturized high-integration low-noise optical module structure is formed.

Description

Technical Field

[0001] The utility model relates to optical communication technology and optical communication use equipment, specifically, a miniaturized, highly integrated, low-noise optical module. Background Art

[0002] Fiber optic communication optical modules have the advantages of large transmission capacity, strong anti-interference ability, and small size. However, in some special occasions, such as aerospace, a stronger anti-seismic structure is required to ensure the reliability of the product, and more reliable customized optical modules are required to replace standard optical modules.

[0003] For example, miniaturized optical modules have the characteristics of small internal space, compact structure, and complex parts.

[0004] At present, the main problems and disadvantages of small optical modules are:

[0005] 1) The electrical connection between the PCBA and the device is directly connected by pin welding, which is prone to failure under vibration conditions;

[0006] 2) The optical device and the module housing are not properly matched, resulting in low heat dissipation effect and low reliability;

[0007] 3) The overall structural layout is unreasonable, resulting in poor reliability of the product in terms of impact resistance and vibration resistance in extreme environments.

[0008] Therefore, it is necessary to provide a miniaturized, highly integrated, low-noise optical module to solve the above problems. Utility Model Content

[0009] The utility model aims to provide a miniaturized, highly integrated, low-noise optical module.

[0010] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0011] A miniaturized, highly integrated, low-noise optical module comprises a lower shell, a heat dissipation pad is arranged on the lower shell, an optical device is arranged on the heat dissipation pad, and the heat dissipation pad is connected to an upper shell through a detachable structure;

[0012] A radiator is provided at the lower shell corresponding to the heat dissipation pad;

[0013] The optical device includes a PCB, which is fixedly connected to the lower shell via a fixing member and connected to the lead area on the upper shell via a flexible wire;

[0014] A soft board is provided corresponding to the optical device, and the soft board cooperates with the upper shell and the lower shell to form a connection with the corresponding PCB and a flexible pressing and positioning of the optical device, forming a miniaturized, highly integrated, low-noise optical module structure.

[0015] Furthermore, the lower shell is used as a base, and a corresponding slot area for loading components is opened on it.

[0016] Furthermore, the heat dissipation pad is made of a flexible material, and the heat dissipation pad flexibly supports the optical device and effectively connects to the heat sink to form a flexible support and efficient heat dissipation integrated structure.

[0017] Furthermore, before the flexible board is set, epoxy glue needs to be applied to the slot area corresponding to the device loading.

[0018] Furthermore, the soft board is fixed by welding, and the soft board needs to be in a bent state during welding.

[0019] Furthermore, the detachable structure is a bolt connection structure.

[0020] Furthermore, the fixing member is a screw.

[0021] Compared with the prior art, the layout of the utility model is more reasonable, the electrical connection reliability of the product is higher, and the heat dissipation effect is better. In particular, a flexible board is used to connect the PCBA and the device, and a bending method is used to make the connection have a surplus, which completely improves the fracture failure problem of the multi-channel electrical connection during the vibration process. At the same time, the upper shell and the lower shell are used to produce a hard limit on the optical device, and the compression amount of the heat dissipation pad is combined to produce a soft limit on the optical emission component, so that the optical device can achieve both good heat dissipation effect and good fixing effect, further improving the stability and reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is one of the structural schematic diagrams of the utility model;

[0023] Figure 2 yes Figure 1 Large maps were issued for some areas;

[0024] Figure 3 This is the second structural diagram of the utility model;

[0025] Figure 4 yes Figure 3 A magnified view of one of the areas;

[0026] Figure 5 yes Figure 3 An enlarged view of the second area of ​​the partial area;

[0027] Figure 6 yes Figure 5 Enlarged view of some areas. DETAILED DESCRIPTION

[0028] Example:

[0029] See also Figure 1-6, this embodiment shows a miniaturized, highly integrated, low-noise optical module, comprising a lower shell 1, a heat dissipation pad 2 is disposed on the lower shell 1, an optical device 100 is disposed on the heat dissipation pad 2, and the heat dissipation pad 2 is connected to an upper shell 3 through a detachable structure;

[0030] A heat sink 11 is provided at the lower shell 1 corresponding to the heat dissipation pad 2;

[0031] The optical device 100 includes a PCB 4, which is fixedly connected to the lower shell 1 through a fixing member, and is connected to the lead area 31 on the upper shell through a flexible wire 5;

[0032] The optical device 100 is correspondingly provided with a soft board 6, which cooperates with the upper shell 3 and the lower shell 1 to form a connection corresponding to the PCB 4 and a flexible pressing and positioning of the optical device, forming a miniaturized, highly integrated, low-noise optical module structure.

[0033] The lower shell 1 is used as a base and is provided with a slot area 200 corresponding to device loading.

[0034] The heat dissipation pad 2 is made of a flexible material. The heat dissipation pad 2 flexibly supports the optical device 100 and effectively connects to the heat sink 11 to form a flexible support and efficient heat dissipation integrated structure.

[0035] Before the flexible board 6 is installed, epoxy glue needs to be applied to the slot area 200 corresponding to the device loading.

[0036] The soft board 6 is fixed by welding, and during welding, the soft board needs to be in a bent state.

[0037] The detachable structure is a bolt connection structure.

[0038] The fixings are screws.

[0039] Compared with the prior art, the layout of the utility model is more reasonable, the electrical connection reliability of the product is higher, and the heat dissipation effect is better. In particular, a flexible board is used to connect the PCBA and the device, and a bending method is used to make the connection have a surplus, which completely improves the fracture failure problem of the multi-channel electrical connection during the vibration process. At the same time, the upper shell and the lower shell are used to produce a hard limit on the optical device, and the compression amount of the heat dissipation pad is combined to produce a soft limit on the optical emission component, so that the optical device can achieve both good heat dissipation effect and good fixing effect, further improving the stability and reliability of the product.

[0040] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A miniaturized, highly integrated, low-noise optical module, characterized in that: The lower shell comprises a heat dissipation pad, the heat dissipation pad is provided on the lower shell, an optical device is provided on the heat dissipation pad, and the heat dissipation pad is connected to the upper shell through a detachable structure; A radiator is provided at the lower shell corresponding to the heat dissipation pad; The optical device includes a PCB, which is fixedly connected to the lower shell via a fixing member and connected to the lead area on the upper shell via a flexible wire; A soft board is provided corresponding to the optical device, and the soft board cooperates with the upper shell and the lower shell to form a connection with the corresponding PCB and a flexible pressing and positioning of the optical device, forming a miniaturized, highly integrated, low-noise optical module structure.

2. The miniaturized, highly integrated, low-noise optical module according to claim 1, characterized in that: The lower shell is used as a base and is provided with a corresponding slot area for loading components.

3. The miniaturized, highly integrated, low-noise optical module according to claim 1, characterized in that: The heat dissipation pad is made of a flexible material. The heat dissipation pad flexibly supports the optical device and effectively connects to the radiator to form a flexible support and efficient heat dissipation integrated structure.

4. The miniaturized, highly integrated, low-noise optical module according to claim 2, characterized in that: Before setting up the flexible board, epoxy glue needs to be applied to the corresponding slot area where the device is loaded.

5. The miniaturized, highly integrated, low-noise optical module according to claim 1, characterized in that: The soft board is fixed by welding, and the soft board needs to be in a bent state during welding.

6. The miniaturized, highly integrated, low-noise optical module according to claim 1, characterized in that: The detachable structure is a bolt connection structure.

7. The miniaturized, highly integrated, low-noise optical module according to claim 1, characterized in that: The fixings are screws.

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