Package of integrated circuit with heat dissipation

Abstract

The invention relates to a package of an integrated circuit with heat dissipation. An integrated circuit package includes a support plate having a mounting surface. An electronic chip having a back surface and a front surface is mounted on the mounting surface, the front surface being electrically connected to the mounting surface of the support plate. A deformable thermally conductive film covers at least a portion of the backside of the electronic chip such that the film is in contact with the backside.

Description

[0001] Priority claim

[0002] This application claims priority to French Patent Application No. 2309295 filed on September 5, 2023, the contents of which are incorporated herein by reference in their entirety to the maximum extent permitted by law. Technical Field

[0003] Embodiments and examples relate to the field of microelectronics, particularly the field of integrated circuit packaging, and more particularly to heat dissipation structures in integrated circuit packaging. Background Art

[0004] Heat sink structures are often provided to dissipate heat generated by the face of an electronic chip containing an integrated circuit present in a package.

[0005] These heat dissipation structures conventionally comprise a heat sink, such as a copper plate, attached to the face of the electronic chip using a layer of thermal interface material, such as a mixture of silicon and copper well known to those skilled in the art.

[0006] In particular, the thermal interface material layer enables heat transfer between the chip and the heat sink so that the heat sink can dissipate the heat outside the package and so that the temperature of the integrated circuit does not reach a value that would cause it to degrade.

[0007] That is, the thermal interface material is the weak link in the thermal chain because its thermal conductivity is lower than that of the heat sink.

[0008] In this regard, the thickness of the thermal interface material layer should be reduced to improve the heat dissipation of the package. However, it is known that the adhesion of the thermal interface material layer is limited, and reducing the thickness of the thermal interface material layer will deteriorate the mechanical strength of the on-chip heat sink.

[0009] Furthermore, the thermal material layer deteriorates over the lifetime of the package and may contain defects such as voids, which can affect the mechanical strength of the heat sink and degrade the thermal performance of the package.

[0010] Therefore, there is a need to improve the thermal performance of integrated circuit packages. Summary of the invention

[0011] In one embodiment, an integrated circuit package includes: a support board having a mounting surface; an electronic chip having a back side and a front side, the electronic chip being mounted on the mounting surface so that the front side is electrically connected to the mounting surface of the support board; and a deformable thermally conductive film, for example made of metal, configured to cover and contact at least a portion of the back side of the chip.

[0012] The deformable thermally conductive film can adapt to the shape of a chip or other component mounted on a support plate.

[0013] Such a film therefore does not require a thermal interface material to be attached to the chip, thus enabling improved heat dissipation within the package. The film also guarantees the mechanical strength of the package during its lifetime, which prevents the risk of degradation of the thermal performance of the package.

[0014] Moreover, in the case of completely covering the chip, the film can act as a heat sink, while the film is advantageously thinner than the heat sinks of the prior art. Therefore, the cost of manufacturing the film is lower than that of the heat sink, and in this case the package can be made smaller.

[0015] Thus, a package according to this aspect benefits from improved thermal performance throughout its lifetime.

[0016] According to an embodiment, the thermally conductive film is soldered to at least a portion of the back side of the chip.

[0017] The film is affixed to the back side of the chip and enables direct heat removal without an intermediary such as a thermal interface material layer between the film and the chip.

[0018] According to an embodiment, the thermally conductive film is attached to at least a portion of the back side of the chip using an adhesive.

[0019] The adhesive is typically glue or double-sided tape that enables the film to be attached to the back side of the chip while having better thermal conductivity than thermal interface materials for a given thickness.

[0020] According to an embodiment, the support plate comprises an opening penetrating through the thickness of the support plate until it opens onto the mounting surface, and the thermally conductive film further covers the mounting surface and seals the opening.

[0021] The openings form channels in the support plate, enabling vacuum lamination to be performed during the manufacture of the package. Vacuum lamination is a technique suitable for attaching the film to the chip to avoid the presence of air between the adhesive and the back of the chip, thus improving the fixation of the film to the chip.

[0022] According to an embodiment, the package includes a mold resin disposed on the mounting surface of the support board such that the resin coats the chip and exposes a backside of the chip, and the thermally conductive film is further configured to cover an upper surface of the mold resin.

[0023] The film is also compatible with packages comprising a molding resin, making it possible to protect the electronic chip by exposing the back side of the chip to make contact with the thermally conductive film.

[0024] According to an embodiment, the chip is configured to have a hot spot that releases heat during operation, and the thermally conductive film is configured to cover the hot spot of the chip.

[0025] Thermal simulation tools or alternatively thermal sensors are used to detect hot spots, in other words, areas of the chip that may have temperature spikes during its operation. The location of these hot spots (once they are identified) can be taken into account to determine the shape of the membrane. Thus, identifying the hot spots of the chip enables shaping the membrane in such a way that it covers these hot spots while limiting the amount of material used to manufacture the membrane.

[0026] According to an embodiment, the membrane has a thickness between 5 μm and 0.5 mm.

[0027] This membrane thickness range generally enables the package to be made smaller and may be defined by the choice of material for the membrane so that it is deformable.

[0028] According to one embodiment, the elastic modulus of the thermal conductive film is 10 -5 and between 100-150Gpa.

[0029] Therefore, membranes with these elastic modulus values ​​are deformable enough to adapt to the morphology of the chip without the risk of detachment.

[0030] According to an embodiment, the thermally conductive film also covers the mounting surface of the support plate and is connected to the thermally conductive element of the support plate.

[0031] Thermally conductive elements such as solder beads, interconnect networks, and electrical contacts to the board may advantageously form additional channels with the membrane to remove heat from underneath the package.

[0032] According to an embodiment, the package includes a component mounted on a mounting surface of a support plate, wherein the thermally conductive film also covers the mounting surface of the support plate and includes an opening capable of accommodating the component.

[0033] Depending on the design constraints of the package, for example related to the presence of components mounted on the surface, openings can be made in the thermally conductive film. Such openings thus enable the film to be fixed to the mounting surface of chips and boards without covering these components and subsequently hampering their operation.

[0034] According to an embodiment, the thermally conductive film also covers at least a portion of a side surface of the electronic chip.

[0035] The film may, for example, cover at least a portion of the back side of the chip and extend up to the edge of the chip in order to optimize the dissipation of heat.

[0036] According to another aspect, a method for manufacturing an integrated circuit package including a support plate having a mounting surface is proposed, the method comprising: mounting an electronic chip having a back side and a front side on the mounting surface of the support plate so that the front side is electrically connected to the mounting surface; and covering a portion of the back side of the chip with a deformable thermally conductive film so that the film is in contact with the back side.

[0037] According to one embodiment, covering a portion of the back side by a thermally conductive film comprises attaching the film to at least a portion of the back side of the chip using an adhesive.

[0038] According to one embodiment, the method includes forming an opening through the thickness of the support plate to open onto the mounting surface, wherein the membrane is attached to at least a portion of the back side by creating a vacuum between the membrane and the support plate using the opening so that the membrane covers the mounting surface and seals the opening.

[0039] According to one embodiment, the film has a thickness between 5 μm and 0.5 mm.

[0040] According to one embodiment, the thermally conductive film is metal.

[0041] According to one embodiment, the elastic modulus of the thermally conductive film is 10 -5 and between 100-150Gpa.

[0042] According to one embodiment, covering a portion of the back side with a thermally conductive film includes performing chemical vapor deposition on at least a portion of the back side of the chip.

[0043] According to one embodiment, the method includes forming a mold resin on a mounting surface of a support plate such that the mold resin coats the chip and exposes the back surface, and a thermally conductive film covers an upper surface of the mold resin.

[0044] According to one embodiment, the method comprises identifying a hot spot of the chip by thermal simulation of the chip during operation, wherein covering a portion of the back side by a thermally conductive film is performed such that the film covers the hot spot of the chip.

[0045] According to one embodiment, the method further comprises connecting the membrane to a thermally conductive element of the support plate.

[0046] According to one embodiment, the method includes mounting a component on a mounting surface of a support plate and forming an opening in a thermally conductive film such that after covering a portion of the back surface with the thermally conductive film, the opening accommodates the component.

[0047] According to one embodiment, the method comprises covering a portion of a side surface of the electronic chip with a thermally conductive film, while covering a portion of a back surface with the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Other advantages and features of the present invention will become apparent after reviewing the detailed description of non-limiting examples and embodiments and from the accompanying drawings, in which:

[0049] Figure 1 schematically illustrates a cross-sectional view of an integrated circuit package;

[0050] Figure 2 schematically illustrates a cross-sectional view of a package;

[0051] Figure 3 schematically illustrates a cross-sectional view of a package;

[0052] Figure 4 schematically illustrates a cross-sectional view of a package;

[0053] Figure 5 A top view of the package is schematically illustrated;

[0054] Figure 6 schematically illustrates a cross-sectional view of a package; and

[0055] Figures 7 to 13 The diagram shows the method for manufacturing the above Figures 1 to 6 The steps of a method for packaging an integrated circuit are described. DETAILED DESCRIPTION

[0056] Figure 1 A cross-sectional view of an integrated circuit package BT is schematically illustrated.

[0057] The package BT comprises an electronic (integrated circuit-IC) chip CHP containing one or more integrated circuits and a support plate SUB having a mounting surface FM. The support plate SUB may be, for example, a supporting substrate. Such a support plate SUB may comprise an interconnection network INTCNX and electrical contacts PAD (pads) located on the mounting surface FM and electrically connected to the interconnection network INTCNX.

[0058] The chip CHP comprises a back side FS1 and a front side FL1 , which comprise integrated circuit components such as transistors, for example.

[0059] The chip CHP is mounted on the mounting surface FM of the support plate SUB according to “flip chip” type mounting.

[0060] More specifically, the front side FL1 of the chip CHP may be electrically connected to the electrical contacts PAD of the support board SUB by using solder beads SLD1 embedded in the underfill UNDFLL material known to those skilled in the art.

[0061] Furthermore, the support board SUB may be provided with solder beads SLD2 which are attached to the face of the support board SUB opposite to the mounting face FM and which enable the package BT to be connected to, for example, a printed circuit board (not shown in the figure). The interconnection network INTCNX of the support board SUB is typically configured to electrically couple the electrical contacts PAD to the solder beads SLD2 and to transfer signals between the electronic chip CHP and the circuits of the printed circuit board.

[0062] However, during the operation of the chip CHP, the integrated circuit of the chip CHP generates heat, which can be diffused through the back side FS1 of the chip CHP and also diffused on the side EDG of the chip CHP. The heat emitted by the chip CHP causes the temperature inside the package BT to rise, and if the temperature exceeds a certain value, the integrated circuit may be degraded.

[0063] In this respect, the package BT advantageously comprises a deformable thermally conductive film FLM, for example made of a metal such as copper (Cu) or aluminum (Al). The film FLM can also be a copper film having a face coated with nickel (Ni), coated with a nickel platinum (NiPd) alloy or coated with aluminum.

[0064] The film FLM is configured to cover and be in contact with the back side FS1 of the chip CHP, for example by being attached to this portion of the back side FS1 using an adhesive GL, such as Figure 1 as shown in .

[0065] The thermally conductive film FLM adapts to the shape of a chip or other component mounted on the support board SUB and can be attached to the chip CHP using a thermally conductive adhesive GL.

[0066] The thermal performance of the package is thus improved. The film also ensures mechanical strength during the lifetime of the package, which prevents the risk of degradation of the thermal performance of the package.

[0067] Here, the film FLM completely covers the back side FS1 of the chip CHP and acts as a conventional heat sink by protecting the chip and by dissipating the heat to the outside of the package BT, while being thinner and cheaper than the heat sinks of the prior art.

[0068] Furthermore, the film FLM also covers at least a portion of the side EDG of the chip CHP, through which the heat can also be diffused, thereby enabling optimized heat dissipation.

[0069] Furthermore, the film FLM has a thickness between 5 μm and 0.5 mm. This film thickness range can be defined according to the choice of the material used for the film, so as to make it deformable and to enable the package BT to be made smaller in the case where the film is used instead of a heat sink. A person skilled in the art will know how to adjust the thickness of the film in such a way as to make it deformable according to the material used.

[0070] Thermally conductive film FLM also has 10 -5 and an elastic modulus between 100-150GPa.

[0071] Therefore, films with these elastic modulus values ​​are deformable enough to adapt to the morphology of the chip without risk of film detachment, especially if the films are attached by using adhesive GL.

[0072] The adhesive GL may be a glue, such as the non-conductive glue EA6900 sold by DOW or the conductive glue 2100A sold by Henkel. The adhesive GL may also be a double-sided tape, such as the tape PC07 sold by Boyd. The adhesive GL is preferably thermally conductive and generally has better adhesion than thermal interface materials.

[0073] Figure 2 Schematically illustrates a cross-sectional view of a package BT. Figure 1 Elements common to the packages in FIG. 1 have the same reference numerals and will not be described in detail again.

[0074] The heat conducting film FLM is, for example, soldered to the back side FS1 of the chip CHP and completely covers the back side FS1. Alternatively, the heat conducting film FLM can also be formed on the back side FS1 according to chemical vapor deposition of a thin metal layer by sputtering.

[0075] Therefore, the back side FS1 and the side EDG of the chip are directly covered by the film FLM without an intermediate layer, thereby reducing the thermal link between the chip CHP and the outside of the package BT. Therefore, heat dissipation is improved.

[0076] A thermally conductive film FLM is also soldered or formed on the mounting surface FM of the support board SUB. The film FLM is connected to thermally conductive elements of the support board SUB, for example to non-operating electrical contacts PAD (ie not used for transmitting electrical signals), which are coupled to the beads SLD2 via an interconnection network INTCNX.

[0077] The solder ball SLD2, the interconnect network INTCNX and the electrical contact PAD can advantageously form an additional channel with the film FLM for dissipating heat from under the package BT, thereby helping to improve the heat dissipation of the package BT.

[0078] Figure 3 Schematically illustrates a cross-sectional view of a package BT. Figure 1 Elements common to the packages in FIG. 1 have the same reference numerals and will not be described in detail again.

[0079] The support plate SUB comprises an opening FNT1 which passes through the thickness of the plate SUB until opening onto the mounting face FM.

[0080] The film FLM is also attached to the support plate SUB by means of an adhesive GL so as to cover the plate SUB and seal the opening FNT1 .

[0081] The opening FNT1 forms a channel in the support plate SUB, enabling attachment of the film FLM by vacuum lamination performed during the manufacture of the package BT.

[0082] Therefore, the presence of air between the adhesive GL and the back surface FS1 and the side surface EDG of the chip CHP is reduced, and thus the fixation of the film FLM on the chip CHP and the heat dissipation are improved.

[0083] Figure 4 Schematically illustrates a cross-sectional view of a package BT. Figure 1 Elements common to the packages in FIG. 1 have the same reference numerals and will not be described in detail again.

[0084] In some cases the chip CHP may have hot spots during operation which release heat in a more localized manner on the back side FS1 or the side EDG of the chip CHP.

[0085] The heat conductive film FLM is attached on the back side FS1 of the chip CHP and covers a part of the back side FS1 , in particular, covers the hot spot of the chip CHP located on this part of the back side FS1 .

[0086] The package BT further comprises a heat sink CPT, for example made of copper, attached to the support plate SUB using an adhesive GL2 (for example similar to the adhesive GL described above) and to the back side FS1 of the chip CHP and to the film FLM via a layer of thermal interface material TIM.

[0087] In particular, a thermal interface material TIM layer of a first thickness covers the portion of the back side FS1 not covered by the film FLM, and a thermal interface material TIM layer of a second thickness (lower than the first thickness) covers the film FLM.

[0088] The package BT then benefits from a more efficient heat dissipation over the parts of the chip CHP where most heat is generated, due to the film FLM.

[0089] Figure 5 Schematically illustrates the top view of the packaged BT. Figure 1 The common elements of the packages in FIG. 1 have the same reference numerals and will not be described in detail again. The package BT may include a heat sink CPT and a thermal interface material layer. Figure 5 Not shown.

[0090] Figure 5 The hot spot PC of the chip CHP shown in FIG. 4 can be detected, for example, due to a thermal simulation tool such as the Simcenter Flotherm software of Siemens or a thermal sensor (not shown).

[0091] Once identified the positions of these hot spots PC can be taken into account to define the shape of the film FLM.The film FLM is for example manufactured or formed by chemical vapor deposition so as to cover the hot spots PC while limiting the amount of material of the film FLM.

[0092] Furthermore, the package BT also comprises a component COMP, such as a passive electronic component or an antenna, located on the mounting face FM of the board SUB, and the film FLM comprises an opening FNT2 able to accommodate the component COMP.

[0093] In practice, openings can be made in the thermally conductive film, depending on design constraints of the package BT, for example related to the presence of components mounted on the surface. Such openings thus make it possible to fix the film on the mounting faces of chips and boards without covering these components and thus hindering their operation.

[0094] Figure 6 Schematically illustrates a cross-sectional view of a package BT. Figure 1 Elements common to the packages in FIG. 1 have the same reference numerals and will not be described in detail again.

[0095] The package BT includes a molded resin MLD disposed on the mounting surface FM of the support board SUB such that the resin MLD covers (eg, encapsulates) the chip CHP and exposes the back surface FS1. The resin MLD is typically an epoxy resin mixed with vitreous silica or a metal oxide such as alumina.

[0096] The thermally conductive film FLM uses an adhesive GL (such as the above Figure 1 ) is attached on the back surface FS1 of the chip CHP, and is also attached on the upper surface FS2 of the mold resin MLD package using an adhesive GL.

[0097] The FLM film is also compatible with packaging including molded packages of molded resins, making it possible to protect the electronic chip by exposing the back side of the chip so that the back side of the electronic chip is in contact with the thermally conductive film.

[0098] The resin MDL may also be thermally conductive, in particular when the resin contains metal oxides, and enables the heat generated by the side EDGs of the chip CHP to be transferred towards the film FLM.

[0099] Figures 7 to 13 The diagram shows the method for manufacturing the above Figures 1 to 6 The steps of a method for packaging an integrated circuit are described.

[0100] Figure 7 Illustrated is a step 100 of obtaining a support board SUB comprising a mounting face FM. The support board SUB comprises an interconnection network INTCNX and electrical contacts PAD formed on the mounting face FM and electrically connected to the interconnection network INTCNX.

[0101] Additional electrical contacts PAD may be formed on the mounting surface FM to enable connection to a thermally conductive film, such as described above with respect to Figure 2These electrical contacts PAD are non-operating electrical contacts that are not used to transmit electrical signals.

[0102] Figure 8 The step 101 of attaching an electronic chip CHP on a mounting face FM of a board SUB is illustrated. The chip CHP comprises a back side FS1 and a front side FL1 connected to an electrical contact PAD using solder beads SLD1 embedded in an underfill UNDFLL material.

[0103] Fig. 9 The step 102 of attaching the deformable thermally conductive film FLM on the back side FS1 and the side EDG of the chip CHP using an adhesive GL is illustrated.

[0104] For example, the FLM film may be coated with glue or may be attached to double-sided tape.

[0105] In particular, the film FLM can be pressed toward the chip CHP by applying pressure to the film so that the film is deformed to cover the back side FS1 and the side EDG of the chip CHP.

[0106] The step 102 of attaching the film FLM may be followed by a step of attaching a solder bead SLD2 on the face FL2 of the board SUB opposite to the mounting face FM, in order to obtain Figure 1 The package shown in BT.

[0107] Fig.10 The step 103 of welding the thermal conductive film FLM is shown as above. Fig. 9 An alternative to step 102 described.

[0108] The bonding of the film FLM more specifically includes bonding the film FLM on the back side FS1 and on the side surface EDG of the chip CHP.

[0109] Furthermore, the membrane FLM is welded on the board SUB in such a way that it is connected to the additional electrical contacts PAD.

[0110] Step 103 may be followed by the following steps: attaching a solder bead SLD2 (not shown) to the face FL2 of the board SUB opposite to the mounting face FM to obtain Figure 2 The package shown in BT.

[0111] In particular, the solder ball SLD2 and the additional electrical contact PAD are coupled together by the interconnection network INTCNX of the board SUB so as to form an additional channel with the film FLM for dissipating heat under the package BT.

[0112] Fig.11 The step 104 of forming the opening FNT1 and attaching the thermal conductive film FLM is shown as above. Fig. 9 and Fig.10An alternative to steps 102 and 103 described.

[0113] Thermally conductive film FLM can be used with the above Fig. 9 The same as described, and may be coated with glue or attached to double-sided tape, for example.

[0114] The opening FNT1 passes through the thickness of the support plate SUB until it opens onto the mounting surface FM. The opening FNT1 is used to form a vacuum between the film FLM and the support plate SUB, for example by vacuum lamination techniques known to those skilled in the art, so that the film FLM covers the mounting surface FM and seals the opening FNT1.

[0115] Vacuum lamination is a technique that enables the film FLM to be attached to the chip CHP in order to avoid the presence of air between the adhesive GL and the back side FS1 of the chip, thus improving the fixation of the film FLM on the chip CHP.

[0116] Step 104 may be followed by the following steps: attaching a solder bead SLD2 (not shown) to the face FL2 of the board SUB opposite to the mounting face FM to obtain Figure 3 The package shown in BT.

[0117] Fig.12 The step 105 of attaching the film FLM on a portion of the back side FS1 of the chip CHP is illustrated.

[0118] Step 105 is preferably performed after a step of identifying a hot spot of the chip CHP (not shown) and a step of manufacturing the film FLM. The step of identifying a hot spot of the chip CHP can be performed by thermal simulation of the chip CHP during operation or by thermal sensors.

[0119] The step of manufacturing the film FLM enables designing the film FLM and giving it a certain shape so that the film FLM can cover the hot spots of the chip CHP during the step 105 of attaching the film FLM. The attachment of the film FLM can be done in the same way as for example with respect to Fig. 9 The attaching step 102 described above is performed in a similar manner.

[0120] Step 105 may be followed by a step of attaching a solder bead SLD2 (not shown) on the face FL2 of the board SUB opposite to the mounting face FM and a step of attaching a heat sink (not shown) on the film FLM and the board SUB to obtain Figure 4 The package shown in BT.

[0121] Fig.13 The step 106 of chemical vapor deposition of the film FLM is shown, as described above with respect to Fig. 9 and Fig.12 An alternative to steps 102 and 105 described.

[0122] In particular, chemical vapor deposition enables the formation of a film FLM (generally by sputtering) on ​​the back side FS1 and on the side faces EDG of the chip CHP.

[0123] Step 106 may also be performed by using a temporary mask MSK on the back side FS1 and the side EDG of the chip CHP.

[0124] In this way, the film FLM can be formed only on the portion of the back side FS1 of the chip CHP and the side surface EDG that are not covered by the mask MSK.

[0125] Step 106 may be followed by the steps of removing the mask MSK, attaching solder beads SLD2 (not shown) on the face FL2 of the board SUB opposite to the mounting face FM, and attaching a heat sink (not shown) on the film FLM and the board SUB.

Claims

1. An integrated circuit package, comprising: a support plate having a mounting surface; An electronic chip having a back side and a front side, the front side of the electronic chip being mounted on the mounting surface of the support plate and electrically connected to the mounting surface of the support plate; as well as The deformable thermally conductive film is configured to cover and contact at least a portion of the back side of the electronic chip. 2 . The package of claim 1 , wherein the deformable thermally conductive film is soldered to at least a portion of the back side of the electronic chip. 3 . The package of claim 1 , wherein the deformable thermally conductive film is attached to at least a portion of the back side of the electronic chip using an adhesive. 4 . The package according to claim 3 , wherein the support plate comprises an opening that passes through the thickness of the support plate until reaching the mounting surface, and the deformable thermally conductive film further covers the mounting surface and seals the opening.

5. The package according to claim 1 further comprises a molding resin disposed on the mounting surface of the support plate to encapsulate the side surfaces of the electronic chip and leave the back surface of the electronic chip uncovered by the molding resin, and the deformable thermally conductive film is also configured to cover the upper surface of the molding resin. 6 . The package of claim 1 , wherein the electronic chip is configured to have a hot spot that releases heat during operation, and the deformable thermally conductive film is configured to cover the hot spot of the electronic chip. The package of claim 1 , wherein the deformable thermally conductive film has a thickness between 5 μm and 0.5 mm. The package of claim 1 , wherein the deformable thermally conductive film is a metal film.

9. The package according to claim 1, wherein the elastic modulus of the deformable thermally conductive film is within 10 -5 and between 100-150Gpa.

10. The package of claim 1, wherein the deformable thermally conductive film also covers a mounting surface of the support plate and is connected to a thermally conductive element of the support plate.

11. The package of claim 1, further comprising a component mounted on the mounting surface of the support plate, wherein the deformable thermally conductive film further covers the mounting surface of the support plate and comprises an additional opening, wherein the component is located at the additional opening.

12. The package of claim 1, wherein the deformable thermally conductive film also covers at least a portion of a side surface of the electronic chip, the side surface extending between the back surface and the front surface.

13. The package of claim 1 further comprising a heat sink mounted to the deformable thermally conductive film.

14. A method for manufacturing an integrated circuit package, comprising: Mounting the electronic chip to the mounting surface of the support plate; wherein the electronic chip has a back surface and a front surface, and the front surface is electrically connected to the mounting surface; as well as A portion of the back side of the electronic chip is covered by the deformable heat-conductive film so that the deformable heat-conductive film is in contact with the back side.

15. The method of claim 14, wherein the portion of the back surface covered by the deformable thermally conductive film comprises: The deformable thermally conductive film is welded on the portion of the back side of the electronic chip.

16. The method according to claim 14, wherein covering a portion of the back surface with a deformable thermally conductive film comprises: The deformable thermally conductive film is attached to at least a portion of the back side of the electronic chip using an adhesive.

17. The method of claim 16, comprising forming an opening through the thickness of the support plate until it opens onto the mounting surface, wherein covering comprises using the opening to create a vacuum between the deformable thermally conductive film and the support plate so that the deformable thermally conductive film covers the mounting surface and seals the opening.

18. The method of claim 14, wherein the deformable thermally conductive film has a thickness between 5 μm and 0.5 mm. The method of claim 14 , wherein the deformable thermally conductive film is a metal.

20. The method according to claim 14, wherein the elastic modulus of the deformable thermally conductive film is within 10 -5 and between 100-150Gpa.

21. The method of claim 14, wherein covering the portion of the back surface with a deformable thermally conductive film comprises: A chemical vapor deposition of a deformable thermally conductive film is performed on at least a portion of the back side of the electronic chip.

22. The method of claim 14, comprising forming a mold resin on the mounting surface of the support plate such that the mold resin encapsulates sides of the electronic chip and leaves a back surface uncovered, wherein the deformable thermally conductive film also covers an upper surface of the mold resin.

23. The method of claim 14, comprising identifying hot spots of the electronic chip by thermal simulation of the electronic chip during operation, wherein covering the portion of the back surface with the deformable thermally conductive film is performed such that the deformable thermally conductive film covers the hot spots of the electronic chip.

24. The method of claim 14, further comprising coupling the deformable thermally conductive film to a thermally conductive element of a support plate.

25. The method of claim 14, comprising mounting a component on a mounting surface of a support plate and forming an opening in the deformable thermally conductive film at the location of the component.

26. The method of claim 14, comprising covering a portion of a side surface of the electronic chip with the deformable thermally conductive film, and simultaneously covering a portion of a back surface of the electronic chip with the deformable thermally conductive film.

27. The method of claim 14, further comprising mounting a heat sink to the deformable thermally conductive film.

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