Forming process of dielectric waveguide filter

Abstract

The invention discloses a forming process of a dielectric waveguide filter. The forming process comprises the following steps of sheet matching, laser slicing, lamination punching, filling, isostatic pressing and cutting. According to the invention, a high-performance three-dimensional integrated dielectric waveguide can be realized, and a high-integration-level combined dielectric waveguide is realized through a low-temperature co-fired ceramic (LTCC) three-dimensional integration technology; the preparation process is simple, the waveguide structure is accurate and adjustable, and the performance is excellent; the method is not limited by jig forming.

Description

Technical Field

[0001] The invention relates to the technical field of filters, and in particular to a molding process of a dielectric waveguide filter. Background Art

[0002] There are many types of filters, and different types are used in different frequency ranges and occasions. Dielectric filters are formed by coupling between dielectric resonators. Dielectric resonator filters have high Q values, low insertion loss, small size, and light weight. They are widely used in wireless base stations, satellite communications, navigation systems, electronic countermeasures and other systems.

[0003] The LTCC process has unique advantages in realizing dielectric waveguides because it can integrate waveguide structures into multilayer ceramics, thereby achieving miniaturized and high-performance microwave and millimeter-wave circuits. Summary of the invention

[0004] In order to solve the defects of the prior art, the present invention provides a forming process of a dielectric waveguide filter, comprising the following steps: 1) Matching: Prepare ceramic diaphragms according to design requirements; 2) Laser slicing: Laser slicing the prepared ceramic diaphragm to form sheets to be laminated into blocks; 3) Layer punching: Multiple layers of sheets are stacked together to form a block; then the block is laser punched to form blind holes on the block; 4) Filling: Fill the blind hole with filling material to prevent the blind hole from deforming, forming a block to complete the hole filling; 5) Isostatic pressing: Put the filled block into warm water for isostatic pressing; 6) Cutting: Take the isostatically pressed blocks out of the warm water and cut them into products that meet the size requirements.

[0005] Preferably, the laser slicing includes: placing the prepared ceramic diaphragm into a material box of a laser slicing device, setting laser parameters, setting workpiece thickness, setting upper and lower limits of the workpiece, and starting automatic operation after the coordinates of each point of the first piece are detected by a three-dimensional instrument and are qualified.

[0006] Preferably, the blind hole is a deep hole.

[0007] Preferably, the filling material is silica gel, ink, resin or pins.

[0008] Preferably, the isostatic pressing comprises: clamping the hole-filled bar block up and down with aluminum alloy plates, then placing the bar block into a vacuum bag for vacuum packaging, and then placing the vacuum-packed bar block into warm water for isostatic pressing.

[0009] Preferably, vacuum packaging is performed by a vacuum packaging machine.

[0010] Preferably, set the pressure parameters, pressing time, and preheating time before pressing, and click automatic operation to start the operation after checking that they are qualified.

[0011] Preferably, the cutting comprises: taking out the isostatically pressed bar block from warm water, measuring the bar block thickness and blind hole depth; then placing the bar block on a preheating table for a certain period of time to soften the bar block sufficiently; then applying hot peeling paper, and then cutting the bar block to form a product that meets the size requirements.

[0012] Preferably, the cubes are placed on a preheating table and preheated for 10-15 minutes.

[0013] Preferably, the blocks are automatically cut according to size requirements through an editing program.

[0014] The advantages and beneficial effects of the present invention are: The present invention can realize high-performance three-dimensional integrated dielectric waveguides, and realize highly integrated combined dielectric waveguides through low-temperature co-fired ceramic (LTCC) three-dimensional integration technology.

[0015] The invention has simple preparation process, accurate and adjustable waveguide structure and excellent performance.

[0016] The present invention is not limited by the jig molding.

[0017] The present invention also has the following characteristics: 1) In the laser slicing step, laser slicing has high precision, fast speed, good consistency, is not limited by fixture forming, and is suitable for mass production.

[0018] 2) In the lamination punching step, multiple layers are laminated and then laser-drilled for deep holes, which has good consistency and is easy to operate, making it suitable for mass production.

[0019] 3) In the filling step, silicone has a wider applicability due to its plasticity and can be used to fill blind holes with different pore diameters and depths, but it is not easy to remove and is not suitable for mass production; ink and resin do not need to be removed after filling and can be removed by debinding and sintering, but they cannot fill tight and deep blind holes and are more suitable for filling shallow blind holes; therefore, the present invention preferably uses pin filling, which can effectively fill blind holes with different pore diameters and depths, and is easy to remove, and is suitable for mass production.

[0020] 4) During the isostatic pressing step, the isostatic pressing pressure can be adjusted according to different materials, and it has a wide range of applicability.

[0021] 5) During the cutting step, the blocks can be automatically cut according to size requirements through the editing program, which has wide applicability. DETAILED DESCRIPTION

[0022] The specific implementation of the present invention is further described below in combination with schemes and examples. The following examples are only used to more clearly illustrate the technical solutions of the present invention, and cannot be used to limit the protection scope of the present invention.

[0023] The technical solutions specifically implemented in the present invention are as follows: A forming process of a dielectric waveguide filter comprises the following steps: 1) Matching: Prepare ceramic diaphragms according to design requirements; 2) Laser slicing: Laser slicing the prepared ceramic diaphragm to form sheets to be laminated into blocks; The laser slicing includes: placing the prepared ceramic diaphragm into a material box of the laser slicing device, setting laser parameters, setting the workpiece thickness, setting the upper and lower limits of the workpiece, and starting automatic operation after the coordinates of each point of the first piece are detected by a three-dimensional instrument to be qualified; In this step, laser slicing has high precision, fast speed, good consistency, is not limited by jig forming, and is suitable for mass production; 2) Lamination punching: Multiple layers of sheets are laminated together to form a block; then the block is laser punched to form blind holes on the block; the blind holes are deep holes; In this step, multiple layers are laminated and then deep holes are drilled by laser, which has good consistency and is easy to operate, suitable for mass production; 3) Filling: Fill the blind hole with a shaping material to prevent the blind hole from deforming, forming a block to complete the hole filling; The shaping material is silica gel, ink, resin or pins; Silicone has a wider range of applications due to its plasticity and can fill blind holes of different diameters and depths, but it is not easy to remove and is not suitable for mass production; After filling, ink and resin do not need to be removed and can be removed by debinding and sintering. However, they cannot fill tight and deep blind holes and are more suitable for filling shallow blind holes. Therefore, in this step, pin filling is preferably used, which can effectively fill blind holes of different hole diameters and hole depths, and is convenient to remove, and is suitable for mass production; 5) Isostatic pressing: Put the filled block into warm water for isostatic pressing; The isostatic pressing includes: clamping the filled bar block up and down with aluminum alloy plates, then placing it in a vacuum bag for vacuum packaging, and then placing the vacuum-packed bar block in warm water for isostatic pressing; performing vacuum packaging with a vacuum packaging machine; setting pressure parameters, pressing time, and preheating time before pressing, and clicking automatic operation to start the operation after checking that it is qualified; In this step, the isostatic pressure can be adjusted according to different materials, and it has wide applicability; 6) Cutting: Take the isostatically pressed block out of the warm water, measure the thickness of the block and the depth of the blind hole; then put the block on the preheating table for 10-15 minutes to soften the block sufficiently; then apply the hot stripping paper, and then cut the block to form a product that meets the size requirements; In this step, the blocks can be automatically cut according to size requirements through the editing program, which has wide applicability.

[0024] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A forming process of a dielectric waveguide filter, characterized in that: The steps include: 1) Matching: Prepare ceramic diaphragms according to design requirements; 2) Laser slicing: Laser slicing the prepared ceramic diaphragm to form a sheet to be laminated into a block; 3) Lamination punching: Multiple layers of sheets are laminated together to form a block; then the block is laser punched to form blind holes on the block; 4) Filling: Fill the blind hole with a filling material to prevent the blind hole from deforming, forming a block that completes the hole filling; 5) Isostatic pressing: Put the filled block into warm water for isostatic pressing; 6) Cutting: Take the isostatically pressed bar blocks out of the warm water and then cut them into products that meet the size requirements.

2. The forming process of the dielectric waveguide filter according to claim 1, characterized in that: The laser slicing includes: placing the prepared ceramic diaphragm into a material box of a laser slicing device, setting laser parameters, setting workpiece thickness, setting upper and lower limits of the workpiece, and starting automatic operation after the coordinates of each point of the first piece are detected by a three-dimensional instrument to be qualified.

3. The forming process of the dielectric waveguide filter according to claim 1, characterized in that: The blind hole is a deep hole.

4. The forming process of the dielectric waveguide filter according to claim 1, characterized in that: The filling material is silica gel, ink, resin or pins.

5. The forming process of the dielectric waveguide filter according to claim 1, characterized in that: The isostatic pressing comprises: clamping the hole-filled bar block up and down with aluminum alloy plates, placing the bar block in a vacuum bag for vacuum packaging, and then placing the vacuum-packed bar block in warm water for isostatic pressing.

6. The forming process of the dielectric waveguide filter according to claim 5, characterized in that: The vacuum packaging is carried out by a vacuum packaging machine.

7. The forming process of the dielectric waveguide filter according to claim 5, characterized in that: Before pressing, set the pressure parameters, pressing time, and preheating time. After checking that everything is qualified, click automatic operation to start the operation.

8. The forming process of the dielectric waveguide filter according to claim 1, characterized in that: The cutting comprises: taking out the isostatically pressed bar block from warm water, measuring the thickness of the bar block and the depth of the blind hole; then placing the bar block on a preheating table for a certain period of time to soften the bar block sufficiently; then pasting hot peeling paper, and then cutting the bar block to form a product that meets the size requirements.

9. The forming process of the dielectric waveguide filter according to claim 8, characterized in that: Place the cubes on a preheating table and preheat for 10-15 minutes.

10. The forming process of the dielectric waveguide filter according to claim 8, characterized in that: The blocks are automatically cut according to size requirements through the editing program.