Low-power-consumption communication circuit board wiring structure

Abstract

The invention relates to the technical field of wiring structures, and discloses a low-power-consumption communication circuit board wiring structure, which comprises a shell internally provided with a plurality of layers of circuit boards for protecting the whole device; the wiring structure is arranged on the multilayer circuit board and is used for providing enough electric energy; the control module is fixed on the multi-layer circuit board and is used for controlling the start and stop states of each functional module on the multi-layer circuit board; the differential signal wiring module is fixed on the multilayer circuit board and is used for transmitting high-frequency signals; and the decoupling capacitor module is fixed on the multilayer circuit board and is used for reducing power supply noise and stabilizing power supply voltage. By introducing a special coating made of a high-conductivity material into the multilayer circuit board wiring structure and integrating advanced signal adjustment and calibration functions in the differential signal wiring module, the loss in the electric energy transmission process is effectively reduced, and the integrity and anti-interference capability of signals are remarkably improved in high-frequency signal transmission.

Description

Technical Field

[0001] The invention relates to the technical field of wiring structures, and in particular to a low-power consumption communication circuit board wiring structure. Background Art

[0002] In the development of modern communication equipment, the design and wiring structure of circuit boards have become one of the key factors affecting the overall performance of the system. With the continuous advancement of communication technology, circuit boards not only bear the heavy task of signal transmission, but also need to take into account the functions of power management, thermal management and electromagnetic compatibility. Traditional communication circuit board designs usually adopt multi-layer wiring structures to cope with increasingly complex signal transmission requirements and ensure that the signal can still maintain sufficient integrity and stability during high-frequency and long-distance transmission.

[0003] Existing circuit board wiring structures usually use traditional conductive materials and wiring methods. Although they can meet basic power transmission needs, under high load and complex environments, the power transmission efficiency is often low and is prone to large power loss.

[0004] In terms of power management, most existing technologies use fixed voltage regulation and current distribution methods, which are difficult to dynamically adjust according to changes in the real-time system load, resulting in low power utilization efficiency. In addition, when dealing with sudden power failures, the response speed is slow, which can easily cause system instability or even damage.

[0005] In view of the deficiencies of the prior art, the present invention provides an improved low-power communication circuit board wiring structure to overcome the deficiencies of the prior art. Summary of the invention

[0006] In view of the shortcomings of the prior art, the present invention provides a low-power communication circuit board wiring structure, which solves the problem that the existing circuit board wiring structure usually adopts traditional conductive materials and wiring methods. Although it can meet the basic power transmission needs, the power transmission efficiency is often low under high load and complex environment, and it is easy to have large power loss.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a low-power communication circuit board wiring structure, including: a shell, a multi-layer circuit board is arranged inside, which is used to protect the entire device; a wiring structure, which is arranged on the multi-layer circuit board, and is used to provide sufficient electric energy; a control module, which is fixed on the multi-layer circuit board, and is used to control the start and stop status of each functional module on the multi-layer circuit board; a differential signal wiring module, which is fixed on the multi-layer circuit board, and is used for the transmission of high-frequency signals; a decoupling capacitor module, which is fixed on the multi-layer circuit board, and stabilizes the power supply voltage; a power management module, which is fixed on the multi-layer circuit board, and is used to manage the distribution and regulation of power.

[0008] Preferably, the wiring structure includes a circuit groove, which is opened in the multi-layer circuit board. The wiring structure includes power line 1, and power line 1 is connected to power line 2. Power line 1 and power line 2 are arranged in the circuit groove. A special coating of highly conductive materials copper and graphene is provided in the circuit groove. The coating is connected to the circuit elements on the chip through metal bumps to provide sufficient electrical energy to improve the power supply quality of the chip.

[0009] Preferably, the wiring structure includes a grounding lead 1, the grounding lead 1 is connected to a grounding lead 2, the grounding lead 1 and the grounding lead 2 are arranged in a line groove, the power line 1 and the grounding lead 1 form a forked finger shape, the power line 1 and the grounding lead 1 are both connected to a terminal head, and the outer wall of the terminal head is fixed inside the outer shell.

[0010] Preferably, a plurality of heat dissipation holes are opened inside the multi-layer circuit board, and a plurality of heat sinks are fixed inside the multi-layer circuit board.

[0011] Preferably, the control module includes a signal processing unit, a logic control unit and a monitoring unit, which are used to process input signals, perform predetermined logic operations and monitor the working status of each functional module on the multi-layer circuit board respectively. The control module also includes a fault detection unit, which is used to detect circuit abnormalities and trigger a protection mechanism.

[0012] Preferably, the differential signal wiring module includes a signal amplification unit, a filtering unit and a signal equalization unit, which are used to amplify the differential signal, filter out noise and equalize signal transmission respectively. The differential signal wiring module also includes an impedance matching unit, which is used to ensure impedance matching of signal transmission and reduce reflection and interference. Specifically, the signal amplification unit is used to amplify the signal according to the level of the input differential signal, and the amplification factor is ,in, is the output voltage, is the input voltage, and the gain is dynamically adjusted according to the following formula:

[0013] in, is the feedback resistor, The input resistor filter unit is used to filter out noise signals. The transfer function of the filter is:

[0014] in, is the complex frequency, is the resistance value, For the capacitance value, by selecting the appropriate and value, to effectively suppress high frequency noise: The signal equalization unit is used to compensate for the frequency response attenuation in signal transmission. The frequency response function of the equalization unit is:

[0015] in, is the signal frequency, The cut-off frequency is adjusted by the equalization unit. value, optimize the transmission characteristics of high-frequency signals Impedance matching unit is used to ensure the characteristic impedance of the signal line With external load impedance Match and meet the following conditions to reduce signal reflection:

[0016] in, is the inductance of the signal line, is the capacitance of the signal line, and by adjusting the impedance matching circuit, ensure that conditions to achieve the best signal transmission quality.

[0017] Preferably, the differential signal wiring module also includes a signal adjustment unit, a common mode noise suppression unit and a signal monitoring unit, which are used to adjust the signal strength, suppress common mode noise and monitor the signal quality in real time respectively. The differential signal wiring module also includes an automatic calibration unit, which is used to automatically calibrate the signal path during operation to maintain the best transmission effect.

[0018] Preferably, the decoupling capacitor module includes a capacitance adjustment unit, a noise suppression unit and a power supply stabilization unit, which are used to adjust the capacitance value, suppress power supply noise and stabilize the supply voltage respectively. The decoupling capacitor module also includes a transient voltage protection unit, which is used to provide transient protection when the voltage fluctuates to prevent circuit damage.

[0019] Preferably, the power management module includes a voltage regulating unit, a current distribution unit and a load detection unit, which are used to respectively adjust the voltage, distribute the current and detect the load condition. The power management module also includes a power optimization unit, which is used to optimize the power efficiency according to the real-time load, and includes an emergency power-off unit, which is used to quickly cut off the power supply under abnormal circumstances.

[0020] Preferably, the control module also includes a data storage unit, a timing control unit and a communication interface unit, which are used to respectively store working parameters, the operating timing of the control module and to communicate data with other modules or external devices. The control module also includes a power management interface unit, which is used to communicate with the power management module.

[0021] Working principle: The multi-layer circuit board realizes efficient power transmission through the wiring structure. The power line 1 and power line 2 in the line slot use the high conductivity coating of copper and graphene to transmit power, and optimize the power transmission and signal quality through the forked power line and ground lead. The power is transmitted to the circuit elements on the chip through the metal bumps to ensure that the chip obtains sufficient power; the control module is responsible for managing the start and stop status of the functional modules on the multi-layer circuit board, realizing signal processing and logic operations through signal processing, logic control and monitoring functions, and ensuring the safe operation of the circuit through fault detection; the differential signal wiring module handles high-frequency signal transmission, amplifies the differential signal, filters out noise, balances signal transmission, and reduces reflection and interference through impedance matching, while adjusting The module can improve signal strength, suppress common-mode noise, monitor signal quality, and automatically calibrate the signal path during operation to maintain the best transmission effect; the decoupling capacitor module can reduce power supply noise, stabilize the supply voltage, and prevent circuit damage through transient voltage protection when the voltage fluctuates; the power management module can adjust the voltage and current distribution, detect the load condition, optimize the power efficiency, and quickly cut off the power supply under abnormal conditions. In addition, the control module manages the working parameters and operation sequence through data storage and timing control, and communicates data with external devices through the communication interface, and adjusts the power status through the interaction with the power management module through the power management interface. The heat dissipation holes and heat sink dissipate the heat generated during the working process in the multi-layer circuit board to ensure the stable operation of the entire device.

[0022] The present invention provides a low-power communication circuit board wiring structure. It has the following beneficial effects: 1. The present invention introduces a special coating of highly conductive materials into the wiring structure of a multi-layer circuit board and integrates advanced signal conditioning and calibration functions into a differential signal wiring module. The present invention effectively reduces the loss during power transmission and significantly improves the signal integrity and anti-interference capability in high-frequency signal transmission. The automatic calibration and dynamic adjustment functions ensure that the circuit board can maintain efficient and stable operation under changing environmental conditions. It is particularly suitable for communication systems that require precise signal processing and high energy efficiency.

[0023] 2. The power management module of the present invention integrates intelligent voltage regulation, current distribution, power optimization and emergency power-off functions. By real-time monitoring of the system's load and power status, it dynamically adjusts the power output to achieve the optimization of energy utilization efficiency. At the same time, the emergency power-off unit provides a powerful protection mechanism that can quickly cut off the power supply when the system encounters an abnormal situation to prevent the spread of faults and ensure the safe operation of equipment and systems. This intelligent power management method greatly improves the stability and safety of the system. 3. The present invention introduces advanced heat dissipation management and decoupling capacitor modules into the circuit board design, and the present invention can maintain stable operation of the device under long-term high-load working conditions. The reasonable configuration of heat dissipation holes and heat sinks ensures that the system can still dissipate heat efficiently under high temperature conditions, avoiding component damage caused by overheating. The dynamic adjustment and transient voltage protection functions of the decoupling capacitor module effectively prevent power supply fluctuations from damaging the circuit, further improving the durability and overall reliability of the device, so that the present invention has strong adaptability and long-term stability in practical applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A perspective view of the present invention; Figure 2 is a schematic diagram of the present invention; Figure 3 is a schematic diagram of the present invention; Figure 4 It is a schematic diagram of the control module framework of the present invention; Figure 5 This is a schematic diagram of the differential signal wiring module framework of the present invention; Figure 6 It is a schematic diagram of the signal conditioning unit framework of the present invention; Figure 7 It is a schematic diagram of the framework of the decoupling capacitor module of the present invention; Figure 8 It is a schematic diagram of the framework of the power management module of the present invention; Fig. 9 It is a schematic diagram of the control module framework of the present invention.

[0025] Among them, 1. Shell; 2. Multi-layer circuit board; 3. Line slot; 4. Power cord one; 5. Power cord two; 6. Ground lead one; 7. Ground lead two; 8. Terminal block; 9. Heat dissipation hole; 10. Heat sink; 11. Control module; 12. Differential signal wiring module; 13. Decoupling capacitor module; 14. Power management module. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the specification of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Example: Please refer to the attached Figure 1 -Attached Figure 3The embodiment of the present invention provides a low-power communication circuit board wiring structure, including: a housing 1, inside which a multi-layer circuit board 2 is arranged for protecting the entire device; a wiring structure, which is arranged on the multi-layer circuit board 2 and is used to provide sufficient electric energy; a control module 11, which is fixed on the multi-layer circuit board 2 and is used to control the start and stop states of each functional module on the multi-layer circuit board 2; a differential signal wiring module 12, which is fixed on the multi-layer circuit board 2 and is used for the transmission of high-frequency signals; a decoupling capacitor module 13, which is fixed on the multi-layer circuit board 2 and stabilizes the power supply voltage; a power management module 14, which is fixed on the multi-layer circuit board 2 and is used to manage the distribution and regulation of power.

[0028] Specifically, the housing 1 is provided with a multilayer circuit board 2 inside thereof for protecting the entire device; the wiring structure is provided on the multilayer circuit board 2 for providing sufficient electric energy; the control module 11 is fixed on the multilayer circuit board 2 for controlling the start and stop status of each functional module on the multilayer circuit board 2; the differential signal wiring module 12 is fixed on the multilayer circuit board 2 for transmitting high-frequency signals; the decoupling capacitor module 13 is fixed on the multilayer circuit board 2 for reducing power supply noise and stabilizing the power supply voltage; the power management module 14 is fixed on the multilayer circuit board 2 for managing the distribution and regulation of power supply. The present invention realizes low power consumption, high efficiency and stable operation of the circuit board by reasonably designing the wiring structure and the position and function distribution of each module, and effectively reduces power supply noise, improves the signal transmission quality, and thus improves the reliability and service life of the entire device.

[0029] Please see attached Figure 1 -Attached Figure 3 The wiring structure includes a line groove 3, which is opened in the multi-layer circuit board 2. The wiring structure includes a power line 1 4, and the power line 1 4 is connected to a power line 2 5. The power line 1 4 and the power line 2 5 are arranged in the line groove 3. A special coating is provided in the line groove 3, which is a highly conductive material copper and graphene. The coating is connected to the circuit elements on the chip through metal bumps to provide sufficient electrical energy to improve the power supply quality of the chip.

[0030] Specifically, the wiring structure includes a line groove 3, which is opened in the multilayer circuit board 2, and the wiring structure includes a power line 1 4, which is connected to a power line 2 5, and the power line 1 4 and the power line 2 5 are arranged in the line groove 3, and a special coating is arranged in the line groove 3, and the coating is composed of high-conductivity materials copper and graphene, and the coating is connected to the circuit elements on the chip through metal bumps, and is used to provide sufficient electric energy to improve the power supply quality of the chip. This technical solution effectively reduces the loss in the power transmission process by arranging a high-conductivity material coating in the line groove 3 and utilizing the excellent conductivity of copper and graphene, ensuring that the power line can stably supply power to the chip, improving the power supply quality of the chip, and thus enhancing the overall performance and reliability of the circuit board.

[0031] Please see attached Figure 1 -Attached Figure 3 The wiring structure includes a grounding lead 6, which is connected to a grounding lead 2 7. The grounding lead 6 and the grounding lead 2 7 are arranged in a line groove 3. The power line 4 and the grounding lead 6 form a forked finger shape. The power line 4 and the grounding lead 6 are both connected to a terminal 8, and the outer wall of the terminal 8 is fixed inside the shell 1.

[0032] Specifically, the ground lead 1 6 is connected to the ground lead 2 7, the ground lead 1 6 and the ground lead 2 7 are arranged in the line slot 3, the power line 1 4 and the ground lead 1 6 form a forked finger shape, the power line 1 4 and the ground lead 1 6 are both connected to a terminal 8, and the outer wall of the terminal 8 is fixed inside the housing 1. This technical solution effectively reduces electromagnetic interference and enhances the anti-interference ability of the circuit board by designing the power line 1 4 and the ground lead 1 6 into a forked finger shape, so that the power line and the ground line are alternately distributed in space, and at the same time, the power line and the ground line are reliably connected to the inside of the housing 1 through the terminal 8, ensuring the stability and safety of the circuit, thereby further improving the overall performance of the circuit board.

[0033] Please see attached Figure 1 -Attached Figure 3 A plurality of heat dissipation holes 9 are opened inside the multilayer circuit board 2 , and a plurality of heat sinks 10 are fixed inside the multilayer circuit board 2 .

[0034] Specifically, by arranging a plurality of heat dissipation holes 9 and fixing a plurality of heat sinks 10 inside the multi-layer circuit board 2, the heat dissipation capacity of the circuit board is effectively improved, ensuring that the circuit board can quickly dissipate heat under high load or long-term working conditions, avoiding component damage or performance degradation due to overheating, thereby extending the service life of the circuit board and improving the stability and reliability of the overall system.

[0035] Please see attached Figure 4 The control module 11 includes a signal processing unit, a logic control unit and a monitoring unit, which are used to process input signals, perform predetermined logic operations and monitor the working status of each functional module on the multi-layer circuit board 2 respectively. The control module 11 also includes a fault detection unit for detecting circuit abnormalities and triggering a protection mechanism.

[0036] Specifically, the control module 11 receives and analyzes input signals from different sources through the signal processing unit to ensure the accuracy and timely processing of the signals. The logic control unit performs various operations according to preset logic conditions, such as switch control, mode switching and function coordination, so as to realize efficient collaborative work of various functional modules. The monitoring unit monitors the operating status of each functional module on the multi-layer circuit board 2 in real time, including key parameters of voltage, current and temperature, to ensure that the system operates under normal conditions. The fault detection unit quickly identifies possible faults or abnormal conditions by analyzing the operating parameters of each module, and triggers protection mechanisms when necessary, such as power off, alarm or automatic restart, to avoid the expansion of faults or damage to equipment.

[0037] Through the coordinated work of multiple units of the control module 11, accurate processing of input signals and logical management of system operations are ensured. Real-time monitoring and fault detection functions enable the system to maintain stable operation under complex working conditions and respond quickly under abnormal circumstances to protect the circuit board and its components from damage, thereby improving the reliability and safety of the entire system, further extending the service life of the equipment, and improving the stability and efficiency of the overall performance.

[0038] Please see attached Figure 5 The differential signal wiring module 12 includes a signal amplification unit, a filtering unit and a signal equalization unit, which are used to amplify the differential signal, filter out noise and equalize signal transmission respectively. The differential signal wiring module 12 also includes an impedance matching unit, which is used to ensure impedance matching of signal transmission and reduce reflection and interference. Specifically, the signal amplification unit is used to amplify the signal according to the level of the input differential signal, and the amplification factor is ,in, is the output voltage, is the input voltage, and the gain is dynamically adjusted according to the following formula:

[0039] in, is the feedback resistor, The input resistor is used to filter out noise signals. The transfer function of the filter is:

[0040] in, is the complex frequency, is the resistance value, For the capacitance value, by selecting the appropriate and value, to effectively suppress high frequency noise: The signal equalization unit is used to compensate for the frequency response attenuation in signal transmission. The frequency response function of the equalization unit is:

[0041] in, is the signal frequency, is the cut-off frequency, and the equalizer unit adjusts value, optimize the transmission characteristics of high-frequency signals Impedance matching unit is used to ensure the characteristic impedance of the signal line With external load impedance Match and meet the following conditions to reduce signal reflection:

[0042] in, is the inductance of the signal line, is the capacitance of the signal line, and by adjusting the impedance matching circuit, ensure that conditions to achieve the best signal transmission quality.

[0043] Specifically, the signal amplification unit receives the input differential signal and automatically adjusts the amplification factor according to its level to ensure that the signal has sufficient strength during transmission. The filtering unit effectively filters out high-frequency noise and other interference components during transmission by analyzing and processing the signal spectrum, thereby ensuring the purity and integrity of the transmitted signal. The signal equalization unit is used to compensate for the attenuation of different frequency components in signal transmission, especially in long-distance transmission. The gain of each frequency component can be adjusted to maintain a flat frequency response of the signal, thereby ensuring the quality and accuracy of the signal at the receiving end. The impedance matching unit adjusts the impedance of the circuit to keep the source impedance and load impedance of the signal consistent, thereby minimizing signal reflection and transmission loss, and ensuring that the signal can be transmitted to the receiving end efficiently and stably.

[0044] Through the coordinated work of each unit in the differential signal wiring module 12, accurate amplification of the differential signal, effective noise filtering and frequency equalization are achieved, thereby ensuring the integrity and stability of the signal in a complex electromagnetic environment. The addition of the impedance matching unit further reduces the reflection and interference problems in signal transmission, ensuring high-fidelity transmission of the signal. This enables the entire system to exhibit higher anti-interference capabilities and better signal quality during high-frequency signal transmission, thereby improving the overall performance and reliability of the communication circuit board, and is suitable for application scenarios with high requirements for signal integrity.

[0045] Please see attached Figure 6 The differential signal wiring module 12 also includes a signal adjustment unit, a common mode noise suppression unit and a signal monitoring unit, which are used to adjust the signal strength, suppress common mode noise and monitor the signal quality in real time respectively. The differential signal wiring module 12 also includes an automatic calibration unit, which is used to automatically calibrate the signal path during operation to maintain the best transmission effect.

[0046] Specifically, the signal conditioning unit dynamically adjusts the amplitude and power of the signal according to the real-time signal transmission requirements to ensure that the signal can maintain appropriate strength under different transmission distances and environmental conditions. The common-mode noise suppression unit effectively reduces the impact of external electromagnetic interference on the signal and enhances the signal's anti-interference ability by detecting and eliminating the common-mode components in the signal. The signal monitoring unit ensures that the signal quality is always in the best state during the transmission process by real-time collection and analysis of various quality indicators of the transmission signal, such as signal-to-noise ratio, frequency response and bit error rate. When the automatic calibration unit detects changes in the impedance or other transmission parameters of the signal path, it can automatically adjust the relevant settings of the signal path to ensure the continuity and stability of signal transmission.

[0047] Through the synergistic effect of multiple units within the differential signal wiring module 12, dynamic adjustment of signal strength, effective suppression of common-mode noise, and real-time monitoring of signal quality are provided, thereby greatly improving the stability and reliability of signal transmission. The introduction of the automatic calibration unit ensures that the signal path is always in the best state during operation, and the signal transmission quality can be effectively guaranteed even in a complex and changeable working environment. This makes the solution particularly suitable for communication systems that require high signal integrity and low interference, and further improves the performance and service life of communication circuit boards in practical applications.

[0048] Please refer to the attached Figure 7 The decoupling capacitor module 13 includes a capacitance adjustment unit, a noise suppression unit and a power supply stabilization unit, which are used to adjust the capacitance value, suppress power supply noise and stabilize the supply voltage respectively. The decoupling capacitor module 13 also includes a transient voltage protection unit, which is used to provide transient protection when the voltage fluctuates to prevent circuit damage.

[0049] Specifically, the capacitor adjustment unit dynamically adjusts the capacitance value according to the circuit working state and load requirements to ensure the best decoupling effect under different working conditions. The noise suppression unit effectively reduces the impact of power supply noise on circuit performance by filtering and suppressing high-frequency noise in the power line, ensuring pure signal transmission. The power stabilization unit ensures the stability of the power supply voltage by real-time monitoring and adjustment of the power supply voltage to avoid circuit instability or failure caused by voltage fluctuations. The transient voltage protection unit responds quickly and provides protection when it detects instantaneous fluctuations or spikes in the power supply voltage to prevent these sudden voltages from damaging circuit components, thereby ensuring the safety and reliability of the circuit.

[0050] Through the synergistic effect of multiple units of the decoupling capacitor module 13, precise adjustment of the capacitance value, effective suppression of power supply noise and stable control of the supply voltage are achieved, thereby ensuring the stable operation of the circuit under complex power supply conditions. The introduction of the transient voltage protection unit further enhances the circuit's anti-interference ability under voltage fluctuations, prevents damage to the circuit by sudden voltage, extends the service life of circuit components, and improves the safety and reliability of the overall system. This solution is particularly suitable for electronic equipment that requires high reliability and stability, and further optimizes the power supply quality and anti-interference performance of the communication circuit board.

[0051] Please see attached Figure 8 The power management module 14 includes a voltage regulating unit, a current distributing unit and a load detecting unit, which are used to respectively regulate the voltage, distribute the current and detect the load condition. The power management module 14 also includes a power optimization unit, which is used to optimize the power efficiency according to the real-time load, and includes an emergency power-off unit, which is used to quickly cut off the power supply under abnormal circumstances.

[0052] Specifically, the voltage regulation unit monitors the power supply voltage in real time and dynamically adjusts the output voltage according to the circuit requirements to ensure that each functional module operates at the optimal voltage, thereby avoiding the influence of overvoltage or undervoltage on the circuit performance. The current distribution unit reasonably distributes the current to different circuit paths according to the power requirements of each module to maximize the power utilization rate. The load detection unit detects the load conditions of each module on the circuit board, and feeds back the load changes in real time, and transmits this information to the power management module 14 to adjust the power output to adapt to the dynamic load changes. The power optimization unit analyzes the load data and intelligently optimizes the power distribution strategy to keep the power supply running at high efficiency under different load conditions, thereby reducing energy consumption. When the emergency power-off unit detects an abnormal situation, such as overload, short circuit or severe voltage fluctuation, it immediately cuts off the power supply to prevent the fault from further expanding or causing irreversible damage to the circuit board and its components.

[0053] Through the coordinated work of the various units of the power management module 14, accurate voltage regulation, reasonable current distribution and dynamic load detection are achieved, thereby ensuring the stability and high efficiency of the power supply system under various working conditions. The introduction of the power optimization unit further improves the power utilization efficiency, allowing the system to maintain high-performance operation while reducing energy consumption. The setting of the emergency power-off unit provides a strong safety guarantee for the system, which can respond quickly in abnormal situations and prevent power failures from damaging the system, ultimately improving the overall reliability, safety and service life of the communication circuit board, and is particularly suitable for electronic equipment with high requirements for power management.

[0054] Please see attached Fig. 9The control module 11 also includes a data storage unit, a timing control unit and a communication interface unit, which are used to store working parameters, the operating timing of the control module 11 and to communicate data with other modules or external devices. The control module 11 also includes a power management interface unit for communicating with the power management module 14.

[0055] Specifically, the data storage unit is responsible for storing various operating parameters required for system operation, including initialization settings, dynamic data during operation, and historical records, to ensure that the system can operate efficiently according to preset parameters, and at the same time has the ability to save key data after power failure. The timing control unit performs precise timing management on the control module 11 and its associated functional modules according to a preset time sequence, to ensure that each module is started or shut down at the appropriate time, to avoid resource conflicts and to optimize system performance. The communication interface unit provides a communication bridge with other modules or external devices, and realizes high-speed and stable data transmission through a variety of communication protocols (such as SPI, UART), to ensure smooth information exchange between the control module 11 and other components inside and outside the system. The power management interface unit obtains power status information in real time by working in collaboration with the power management module 14, and adjusts the operation strategy of the control module 11 as needed to optimize power efficiency and extend the system's operating time.

[0056] Through the refined design of each unit in the control module 11, the safe storage of system operating parameters, precise timing control of module operations and effective communication with other modules or external devices are achieved. The data storage unit ensures that the system can stably record and read key data under various working conditions. The timing control unit optimizes the overall response speed and operating efficiency of the system and avoids unnecessary waste of resources. The communication interface unit ensures the data transmission reliability and compatibility between the control module 11 and other modules. The close cooperation between the power management interface unit and the power management module 14 enables the system to flexibly adjust the operating mode according to the actual power supply situation, thereby achieving higher energy efficiency and longer battery life. This design greatly improves the overall performance, reliability and adaptability of the communication circuit board, and is particularly suitable for high-performance electronic systems with strict requirements on operating timing, data communication and power management.

[0057] Example 2: Multilayer circuit board wiring structure and heat dissipation design Hardware Architecture The wiring structure of the low-power communication circuit board in this embodiment adopts the design of a multi-layer circuit board 2, and its internal structure is complex and delicate. In particular, in the design of the wiring structure, the line slot 3 is opened inside the multi-layer circuit board 2, and the power line 4, the ground lead 6 and other key wires are arranged. In order to optimize the conductivity, a special coating of a highly conductive material is used in the line slot 3. These coatings are composed of copper and graphene, and are directly connected to the circuit elements on the chip through metal bumps, ensuring efficient transmission of electric energy and stable power supply. In order to cope with the heating problem during high-load operation, a plurality of heat dissipation holes 9 and heat sinks 10 are also designed inside the circuit board. These heat dissipation components are evenly distributed in key parts of the circuit board to form an efficient heat dissipation channel to ensure that the circuit board can maintain a stable temperature during long-term high-load operation.

[0058] Advantages over existing technologies Compared with the prior art, this embodiment has made significant optimizations in the wiring structure. The use of copper and graphene plating not only improves the efficiency of power transmission, but also greatly reduces power loss. In addition, the improvement of the heat dissipation design, especially the configuration of the heat dissipation holes 9 and the heat sink 10, enables the circuit board to maintain a stable operating state in a high temperature environment, thereby extending the service life of the equipment. This design is particularly suitable for communication equipment that needs to work continuously for a long time and has high requirements for power transmission efficiency and heat dissipation.

[0059] Embodiment 3: Advanced signal processing and calibration of differential signal routing module 12 Software Architecture The differential signal wiring module 12 in this embodiment is specially designed for high-frequency signal transmission optimization. The module includes a signal amplification unit, a filtering unit, a signal equalization unit and an impedance matching unit, which are respectively used to amplify the input differential signal, filter out noise, and equalize the frequency response in signal transmission, and reduce signal reflection and interference through impedance matching. In addition, the module is also equipped with a signal adjustment unit for dynamically adjusting the signal strength to meet the needs under different transmission conditions. The common-mode noise suppression unit can detect and eliminate common-mode noise in real time to ensure the purity and integrity of the signal. The signal monitoring unit is responsible for monitoring the signal quality and providing real-time data to adjust the signal processing strategy in time. At the same time, the automatic calibration unit can automatically calibrate the signal path when the signal path parameters change to ensure the continuity and stability of signal transmission.

[0060] Advantages over existing technologies This embodiment integrates the multifunctional differential signal wiring module 12, so that high-frequency signals can still maintain high-quality transmission in complex electromagnetic environments. The introduction of the automatic calibration unit significantly improves the adaptability of the system in different working environments, ensuring the stability and continuity of signal transmission. In addition, the combination of signal monitoring and adjustment functions enables the module to dynamically adjust and optimize the signal state during signal transmission, thereby reducing signal attenuation caused by environmental changes or load fluctuations. This design has obvious advantages in high-frequency communication equipment and can effectively improve the reliability and performance of the system.

[0061] Embodiment 4: Dynamic adjustment and protection mechanism of the decoupling capacitor module 13 Algorithm Implementation In this embodiment, the decoupling capacitor module 13 is specially designed to improve power supply stability and reduce power supply noise. The module integrates a capacitor adjustment unit, a noise suppression unit, a power supply stabilization unit and a transient voltage protection unit. The capacitor adjustment unit can dynamically adjust the capacitance value according to the real-time working state of the circuit to ensure the best decoupling effect under different load conditions. The noise suppression unit significantly reduces the interference of power supply noise on circuit performance by filtering out high-frequency noise in the power line. The power supply stabilization unit ensures that the circuit board can maintain a stable voltage output under different power supply conditions by real-time monitoring and adjustment of the supply voltage. The transient voltage protection unit can respond quickly and provide protection when the voltage fluctuates or spikes instantaneously to prevent circuit components from being damaged due to voltage abnormalities.

[0062] Advantages over existing technologies Compared with the traditional decoupling capacitor design, this embodiment has made significant improvements in dynamic adjustment and protection mechanisms. The introduction of the transient voltage protection unit allows the circuit board to remain stable when the power supply fluctuates violently, avoiding component damage caused by voltage fluctuations in traditional circuit boards. In addition, the dynamic capacitor adjustment function enables the circuit board to provide the best power decoupling effect under various load conditions, greatly improving the stability and anti-interference ability of the system. This design is particularly suitable for communication systems with frequent power supply fluctuations and high requirements for power supply stability.

[0063] Embodiment 5: Intelligent optimization and safety protection of power management module 14 System operation standards The power management module 14 of this embodiment integrates a voltage regulation unit, a current distribution unit, a load detection unit, a power optimization unit and an emergency power-off unit to form an intelligent power management system. The voltage regulation unit can dynamically adjust the output voltage according to the real-time monitored power status to ensure that each functional module operates at the optimal voltage. The current distribution unit is responsible for reasonably distributing the current to different circuit paths according to the power requirements of each module to maximize the power utilization rate. The load detection unit monitors the load conditions of each module on the circuit board in real time. The power optimization unit analyzes these load data and intelligently adjusts the power distribution strategy to ensure that the power supply always maintains efficient operation under different load conditions. When the emergency power-off unit detects an abnormal situation (such as overload, short circuit or severe voltage fluctuation), it immediately cuts off the power supply to prevent the fault from expanding and the equipment from being damaged.

[0064] Advantages over existing technologies Compared with the traditional power management system, this embodiment shows significant advantages in intelligence and safety protection. The introduction of the power optimization unit enables the system to automatically optimize power distribution under different working conditions, improve energy utilization efficiency, and reduce system energy consumption. The emergency power-off unit provides a strong safety guarantee for the system, and can respond quickly in abnormal situations to prevent power failures from causing further damage to the system. This intelligent power management system is particularly suitable for electronic equipment with high requirements for power management and system safety, and significantly improves the reliability and operating efficiency of the system.

[0065] These embodiments describe in detail the specific applications of low-power communication circuit board wiring structures in hardware design, software implementation, signal processing and power management, highlighting the advantages of this technology over existing technologies in improving system stability, signal transmission quality, power efficiency and safety, and further enhancing the overall performance and adaptability of the system.

[0066] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A low-power communication circuit board wiring structure, characterized in that: include; A housing (1) having a multi-layer circuit board (2) disposed therein for protecting the entire device; A wiring structure, which is arranged on the multi-layer circuit board (2) and is used to provide sufficient electrical energy; A control module (11) fixed on the multi-layer circuit board (2) and used to control the start and stop states of various functional modules on the multi-layer circuit board (2); A differential signal wiring module (12), which is fixed on the multi-layer circuit board (2) and is used for transmitting high-frequency signals; A decoupling capacitor module (13) is fixed on the multi-layer circuit board (2) to stabilize the power supply voltage; A power management module (14) is fixed on the multi-layer circuit board (2) and is used to manage the distribution and regulation of power.

2. A low-power communication circuit board wiring structure according to claim 1, characterized in that: The wiring structure comprises a line groove (3), the line groove (3) is opened in the multilayer circuit board (2), the wiring structure comprises a power line 1 (4), the power line 1 (4) is connected to a power line 2 (5), the power line 1 (4) and the power line 2 (5) are arranged in the line groove (3), and a special coating layer is provided in the line groove (3), which is a highly conductive material copper and graphene, and the coating layer is connected to the circuit elements on the chip through metal bumps, so as to provide sufficient electric energy to improve the power supply quality of the chip.

3. A low-power communication circuit board wiring structure according to claim 2, characterized in that: The wiring structure comprises a grounding lead wire 1 (6), the grounding lead wire 1 (6) being connected to a grounding lead wire 2 (7), the grounding lead wire 1 (6) and the grounding lead wire 2 (7) being arranged in a line groove (3), the power line 1 (4) and the grounding lead wire 1 (6) forming a forked finger shape, the power line 1 (4) and the grounding lead wire 1 (6) being both connected to a terminal block (8), the outer wall of the terminal block (8) being fixed inside the housing (1).

4. A low-power communication circuit board wiring structure according to claim 1, characterized in that: A plurality of heat dissipation holes (9) are provided inside the multi-layer circuit board (2), and a plurality of heat dissipation fins (10) are fixed inside the multi-layer circuit board (2).

5. A low-power communication circuit board wiring structure according to claim 1, characterized in that: The control module (11) comprises a signal processing unit, a logic control unit and a monitoring unit, which are used to process input signals, execute predetermined logic operations and monitor the working status of each functional module on the multi-layer circuit board (2), respectively. The control module (11) also comprises a fault detection unit, which is used to detect circuit abnormalities and trigger a protection mechanism.

6. A low-power communication circuit board wiring structure according to claim 1, characterized in that: The differential signal wiring module (12) comprises a signal amplification unit, a filtering unit and a signal equalization unit, which are used to respectively amplify the differential signal, filter out noise and equalize signal transmission. The differential signal wiring module (12) also comprises an impedance matching unit, which is used to ensure impedance matching of signal transmission and reduce reflection and interference. Specifically, the signal amplification unit is used to amplify the signal according to the level of the input differential signal, and the amplification factor is ,in, is the output voltage, is the input voltage, and the gain is dynamically adjusted according to the following formula: in, is the feedback resistor, The input resistor filter unit is used to filter out noise signals. The transfer function of the filter is: in, is the complex frequency, is the resistance value, For the capacitance value, by selecting the appropriate and value, to effectively suppress high frequency noise: The signal equalization unit is used to compensate for the frequency response attenuation in signal transmission. The frequency response function of the equalization unit is: in, is the signal frequency, The cut-off frequency is adjusted by the equalization unit. value, optimize the transmission characteristics of high-frequency signals Impedance matching unit is used to ensure the characteristic impedance of the signal line With external load impedance Match and meet the following conditions to reduce signal reflection: in, is the inductance of the signal line, is the capacitance of the signal line, and by adjusting the impedance matching circuit, ensure that conditions to achieve the best signal transmission quality.

7. A low-power communication circuit board wiring structure according to claim 1, characterized in that: The differential signal wiring module (12) further comprises a signal adjustment unit, a common mode noise suppression unit and a signal monitoring unit, which are used to respectively adjust the signal strength, suppress the common mode noise and monitor the signal quality in real time. The differential signal wiring module (12) further comprises an automatic calibration unit, which is used to automatically calibrate the signal path during operation to maintain an optimal transmission effect.

8. A low-power communication circuit board wiring structure according to claim 1, characterized in that: The decoupling capacitor module (13) comprises a capacitance adjustment unit, a noise suppression unit and a power supply stabilization unit, which are used to adjust the capacitance value, suppress power supply noise and stabilize the supply voltage respectively; the decoupling capacitor module (13) also comprises a transient voltage protection unit, which is used to provide transient protection when the voltage fluctuates to prevent circuit damage.

9. A low-power communication circuit board wiring structure according to claim 1, characterized in that: The power management module (14) comprises a voltage regulating unit, a current distributing unit and a load detecting unit, which are used to respectively regulate voltage, distribute current and detect load conditions. The power management module (14) also comprises a power optimizing unit, which is used to optimize power efficiency according to real-time load, and an emergency power-off unit, which is used to quickly cut off power supply in abnormal situations.

10. A low-power communication circuit board wiring structure according to claim 1, characterized in that: The control module (11) further comprises a data storage unit, a timing control unit and a communication interface unit, which are used to respectively store operating parameters and the operating timing of the control module (11) and to perform data communications with other modules or external devices. The control module (11) further comprises a power management interface unit, which is used to communicate with the power management module.

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