Base material and preparation method thereof, electric connector and electronic equipment

Abstract

The invention provides a base material and a preparation method thereof, an electric connector and electronic equipment. The base material comprises a first preset mass part of organic high-molecular polymer, a second preset mass part of carbon material and a third preset mass part of resin composite material. The base material has relatively low weight and good heat-conducting property, also has excellent low dielectric loss performance, electromagnetic shielding performance, flexibility and bendability, can be suitable for various application scenes needing bending or folding, can reduce the dielectric loss of the electric connector in a signal transmission process when being applied to the preparation of the electric connector, and improves the signal transmission performance of the electric connector. The fidelity and transmission efficiency of signal transmission are improved, external electromagnetic interference can be effectively suppressed, and the stability and reliability of radio frequency transmission are improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a substrate and a preparation method thereof, an electrical connector, and an electronic device. Background Art

[0002] In the field of radio frequency communication and high-frequency signal transmission, flexible circuit boards are a commonly used device structure for transmitting radio frequency signals and protecting electronic components. The substrates of traditional flexible circuit boards have some limitations, such as insufficient thermal conductivity, mechanical strength, and electromagnetic shielding capabilities. Summary of the invention

[0003] In order to solve the problems existing in the related art, the present disclosure provides a substrate and a preparation method thereof, an electrical connector, and an electronic device.

[0004] According to a first aspect of an exemplary embodiment of the present disclosure, a substrate is provided, wherein the substrate includes a composite material of an organic high molecular polymer in a first preset mass fraction, a carbon material in a second preset mass fraction, and a resin in a third preset mass fraction.

[0005] In some exemplary embodiments, the substrate includes the following components expressed in parts by weight:

[0006] 2.46-3.62 parts by mass of organic high molecular polymer;

[0007] 0.51-1.43 parts by mass of carbon material;

[0008] Resin 35.32-44.86 parts by mass.

[0009] In some exemplary embodiments, the substrate includes the following components expressed in parts by weight:

[0010] 2.73-3.39 parts by weight of organic high molecular polymer;

[0011] 0.64-1.25 parts by mass of carbon material;

[0012] Resin 38.41-42.13 parts by mass.

[0013] In some exemplary embodiments, the organic high molecular polymer includes one or more of polytetrafluoroethylene, polyimide, polyarylether, and polyaryletherketone.

[0014] In some exemplary embodiments, the resin includes epoxy resin and / or polyimide resin.

[0015] In some exemplary embodiments, the carbon material includes one or more of carbon fiber, carbon nanotube, and graphene.

[0016] According to a second aspect of an exemplary embodiment of the present disclosure, a method for preparing a substrate is provided. The method is used to prepare the above-mentioned substrate, and the method comprises:

[0017] Dispersing a first preset mass fraction of an organic high molecular polymer and a second preset mass fraction of a carbon material in a solvent, and performing ultrasonic activation treatment to obtain a first dispersed system;

[0018] Adding a third preset mass fraction of resin into the first dispersion system, stirring and mixing, to obtain a second dispersion system;

[0019] The second dispersed system is dried under first preset conditions to obtain the substrate.

[0020] In some exemplary embodiments, the first preset condition includes: a first preset temperature of 130° C.-180° C., and / or a first preset time of 30 min-60 min.

[0021] In some exemplary embodiments, the preparation method further comprises: forming the substrate into a substrate having a preset shape by extruding or calendering the substrate.

[0022] According to a third aspect of an exemplary embodiment of the present disclosure, there is provided an electrical connector, the electrical connector comprising:

[0023] The first dielectric layer comprises the above-mentioned substrate; a signal line is arranged on a first surface of the first dielectric layer.

[0024] In some exemplary embodiments, the electrical connector further comprises:

[0025] A first ground layer, wherein the first ground layer is disposed on a first surface of the first dielectric layer, and an area covered by the first ground layer is different from an area where the signal line is located;

[0026] A second dielectric layer, wherein the second dielectric layer covers the first ground layer, and the second dielectric layer includes the above-mentioned substrate.

[0027] In some exemplary embodiments, the electrical connector further comprises:

[0028] a second grounding layer, wherein the second grounding layer covers the second dielectric layer;

[0029] A third grounding layer covers the second surface of the first dielectric layer.

[0030] In some exemplary embodiments, the electrical connector further comprises:

[0031] a first shielding layer, wherein the first shielding layer covers a surface of the second grounding layer; and / or,

[0032] A second shielding layer covers a surface of the third grounding layer.

[0033] In some exemplary embodiments, the thickness of the first dielectric layer and the second dielectric layer are both 50 μm-70 μm; and / or,

[0034] The thickness of the first ground layer, the second ground layer and the third ground layer are all 10 μm-14 μm.

[0035] In some exemplary embodiments, the thickness of the first shielding layer and the second shielding layer are both 18 μm-22 μm.

[0036] According to a fourth aspect of an exemplary embodiment of the present disclosure, there is provided an electronic device, wherein the electronic device includes the above-mentioned electrical connection component.

[0037] The beneficial effects of the present disclosure include but are not limited to: the substrate provided by the present disclosure has low weight and good thermal conductivity, and also has excellent low dielectric loss performance, electromagnetic shielding performance, flexibility and bendability, and can be suitable for various application scenarios that require bending or folding. In particular, when the substrate is used to prepare electrical connectors, it can reduce the dielectric loss of the electrical connectors during signal transmission, improve the fidelity and transmission efficiency of signal transmission, and can effectively suppress external electromagnetic interference, thereby improving the stability and reliability of radio frequency transmission.

[0038] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings incorporated into the specification and constituting a part of the specification illustrate embodiments of the present disclosure and are used together with the description to explain the principles of the embodiments of the present disclosure. In these drawings, similar reference numerals are used to represent similar elements. The drawings described below are some embodiments of the present disclosure, rather than all embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 is a schematic structural diagram of a substrate according to an exemplary embodiment of the present disclosure;

[0041] Figure 2 is a schematic diagram of a method for preparing a substrate according to an exemplary embodiment of the present disclosure;

[0042] Figure 3 It is a schematic structural diagram of an electrical connector according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the technical solution of the present disclosure will be clearly and completely described in combination with the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other without conflict.

[0044] In the related art, PI (polyimide) and LCP (liquid crystal polymer) are commonly used as substrates for flexible circuit boards. PI has advantages in mechanical strength and rigidity, but PI has relatively low flexibility, which is limited in some applications with high bending or folding requirements, and PI has relatively high dielectric loss, resulting in greater signal attenuation and energy loss in high-frequency applications. Although LCP has a lower dielectric constant, it has poor bending resistance and is expensive.

[0045] Based on this, an exemplary embodiment of the present disclosure provides a substrate, which includes a composite material of an organic high molecular polymer in a first preset mass fraction, a carbon material in a second preset mass fraction, and a resin in a third preset mass fraction.

[0046] A second preset mass fraction of carbon material with low dielectric loss characteristics and a first preset mass fraction of an organic high molecular polymer with stable performance and corrosion resistance are selected to be mixed to obtain a mixed fiber, which is then compounded with a third preset mass fraction of a resin to form a substrate. When used to prepare electrical connectors, such as flexible circuit boards, the dielectric loss of the electrical connectors during signal transmission can be reduced, and the fidelity and transmission efficiency of signal transmission can be improved; the substrate also has excellent electromagnetic shielding properties, can effectively suppress external electromagnetic interference, and improve the stability and reliability of radio frequency transmission; in addition, the mixed fiber formed by a mixture of organic high molecular polymers and carbon materials and the substrate compounded with the resin have certain flexibility and bendability, and can be suitable for various application scenarios that require bending or folding. Figure 1 The schematic diagram of the structure of the substrate provided by the exemplary embodiment of the present disclosure is shown as follows: Figure 1 As shown, the hybrid fiber 30 is compounded with the resin matrix 20 to form the substrate 10 provided by the exemplary embodiment of the present disclosure.

[0047] In an exemplary embodiment provided by the present disclosure, the substrate includes the following components expressed in parts by mass: 2.46-3.62 parts by mass of organic high molecular polymer, 0.51-1.43 parts by mass of carbon material, and 35.32-44.86 parts by mass of resin.

[0048] An organic high molecular polymer with excellent high temperature resistance and corrosion resistance is selected, and a mixed fiber is mixed with a carbon material with low dielectric loss characteristics. The mixed fiber is compounded with a resin to form a substrate. The substrate is used to prepare electrical connectors. For example, when it is used to prepare flexible circuit boards, the dielectric loss of the flexible circuit boards during signal transmission can be reduced, and the fidelity and transmission efficiency of signal transmission can be improved. The substrate also has excellent electromagnetic shielding properties, can effectively suppress external electromagnetic interference, and improve the stability and reliability of radio frequency transmission. In addition, the mixed fiber mixed with the organic high molecular polymer and the carbon material and the substrate compounded with the resin have certain flexibility and bendability, and can be suitable for various application scenarios that require bending or folding.

[0049] Within the component content range of 2.46-3.62 parts by mass of organic high molecular polymer, 0.51-1.43 parts by mass of carbon material, and 35.32-44.86 parts by mass of resin, the substrate provided by the exemplary embodiment of the present disclosure has a low weight and good thermal conductivity, and also has excellent low dielectric loss performance, electromagnetic shielding performance, flexibility and bendability, and can be suitable for various application scenarios that require bending or folding, such as in the preparation of electrical connectors.

[0050] In an exemplary embodiment provided by the present disclosure, the substrate includes the following components expressed in parts by mass: 2.73-3.39 parts by mass of an organic high molecular polymer; 0.64-1.25 parts by mass of a carbon material; and 38.41-42.13 parts by mass of a resin.

[0051] The substrate formed by 2.73-3.39 parts by mass of organic high molecular polymer, 0.64-1.25 parts by mass of carbon material, and 38.41-42.13 parts by mass of resin has better thermal conductivity, low dielectric loss performance, electromagnetic shielding performance, flexibility and bendability, and is more suitable for various application scenarios that require bending or folding, such as in the preparation of electrical connectors such as flexible circuit boards.

[0052] In the exemplary embodiments provided in the present disclosure, the organic high molecular polymer includes one or more of polytetrafluoroethylene, polyimide, polyarylether, and polyaryletherketone.

[0053] Polytetrafluoroethylene, polyimide, polyarylether and polyaryletherketone are all organic polymers with excellent insulation properties, chemical corrosion resistance, wear resistance, high strength and other characteristics, and these organic polymers have low dielectric loss characteristics, flexibility and bendability. A mixed fiber made of one or more of polytetrafluoroethylene, polyimide, polyarylether and polyaryletherketone and carbon material is selected and compounded with resin to form a substrate. The substrate is used to prepare electrical connectors, which can reduce the dielectric loss of the electrical connectors during signal transmission and improve the fidelity and transmission efficiency of signal transmission. In addition, the substrate also has certain flexibility and bendability, and can be suitable for various application scenarios that require bending or folding.

[0054] In an exemplary embodiment provided by the present disclosure, the resin includes epoxy resin and / or polyimide resin.

[0055] Epoxy resin and polyimide resin are two types of resins with excellent performance. Epoxy resin has strong adhesion, generates a three-dimensional network structure during the curing process, has a high cross-linking density, and has a small curing shrinkage rate; and after curing, epoxy resin has high strength, modulus and elongation, and a small thermal expansion coefficient. Polyimide resin has excellent high temperature resistance, mechanical properties, dielectric properties, and thermal stability. Therefore, epoxy resin and polyimide resin can be used as base resins to prepare the substrate provided by the exemplary embodiments of the present disclosure. In addition, epoxy resin and polyimide resin can also be used together as a base resin to prepare the substrate provided by the exemplary embodiment of the present disclosure. Epoxy resin has good adhesion properties, can be cured at low temperature, and has good miscibility, but its high temperature resistance is relatively weak. Polyimide resin has good comprehensive properties and high temperature resistance, but its bonding strength is not high enough. Therefore, the properties of epoxy resin and polyimide resin have certain complementarity. When epoxy resin and polyimide resin are mixed in a certain mass ratio as a base resin, for example, epoxy resin and polyimide resin are mixed in a mass ratio of 1:0.56 to 1:1.34 as a base resin to prepare the substrate provided by the exemplary embodiment of the present disclosure, a substrate with good mechanical properties and high temperature resistance can be obtained.

[0056] In the exemplary embodiments provided in the present disclosure, the carbon material includes one or more of carbon fiber, carbon nanotube, and graphene.

[0057] Carbon fiber, carbon nanotubes, and graphene are all carbon materials with excellent mechanical properties, electromagnetic shielding properties, and low dielectric loss properties. One or more of carbon fiber, carbon nanotubes, and graphene are used as carbon materials, mixed with organic high molecular polymers to form a hybrid fiber, and then compounded with resin to form a substrate. When the substrate is used to prepare electrical connectors, it can effectively suppress external electromagnetic interference, improve the stability and reliability of radio frequency transmission, and reduce the dielectric loss of electrical connectors during signal transmission, thereby improving the fidelity and transmission efficiency of signal transmission.

[0058] The exemplary embodiments of the present disclosure provide a method for preparing a substrate, such as Figure 2 As shown, the preparation method comprises:

[0059] S100: dispersing a first preset mass fraction of an organic high molecular polymer and a second preset mass fraction of a carbon material in a solvent, and performing ultrasonic activation treatment to obtain a first dispersed system.

[0060] For example, ethanol and / or acetone are used as solvents, a first preset mass fraction of organic high molecular polymer and a second preset mass fraction of carbon material are added into the ethanol and / or acetone solvents for dispersion and mixing, and ultrasonic treatment is performed to activate the organic high molecular polymer and carbon material mixed fibers in the solvent to obtain a first dispersed system.

[0061] S200: adding a third preset mass fraction of resin into the first dispersed system, stirring and mixing, to obtain a second dispersed system.

[0062] A third preset mass fraction of resin is added to the first dispersion system of mixed fibers dispersed with organic high molecular polymers and carbon materials, and stirred for a certain period of time, for example, 30 to 60 minutes, so that the components in the system are fully mixed to obtain a second dispersion system.

[0063] S300: Drying the second dispersed system under the first preset condition to obtain a substrate.

[0064] The second dispersed system is dried and solidified under the first preset conditions, and the solvent is removed to obtain the desired substrate.

[0065] In the preparation method of the substrate provided by the exemplary embodiment of the present disclosure, an organic high molecular polymer and a carbon material are dispersed and mixed in a solvent to obtain a mixed fiber system, and then the mixed fiber system is compounded with a resin to obtain a substrate. When the prepared substrate is used to prepare an electrical connector, the dielectric loss of the electrical connector during signal transmission can be reduced, and the fidelity and transmission efficiency of the signal transmission can be improved; the substrate also has excellent electromagnetic shielding performance, can effectively suppress external electromagnetic interference, and improve the stability and reliability of radio frequency transmission; in addition, the substrate also has a certain degree of flexibility and bendability, and can be applied to various application scenarios that require bending or folding. The raw materials organic high molecular polymer, carbon material and resin used in the preparation method are relatively common and easily available materials, and the production cost is low.

[0066] In the exemplary embodiment provided in the present disclosure, the first preset condition includes: the first preset temperature is 130° C.-180° C., and the first preset time is 30 min-60 min.

[0067] The second dispersed system containing organic high molecular polymer, carbon material and resin is dried at a first preset temperature of 130-180°C, for example, at a first preset temperature of 130°C, 150°C or 180°C, for a first preset time of 30-60 min, for example, 30 min, 40 min, 50 min or 60 min, and the solvent in the system is removed to obtain the desired substrate.

[0068] In an exemplary embodiment provided by the present disclosure, before drying the second dispersed system under the first preset condition, the preparation method further includes: coating the second dispersed system into a film.

[0069] The second dispersed system is coated into a film of a preset thickness as required, or can also be coated into a film of a preset size and thickness. For example, if the prepared substrate is to be used to prepare electrical connectors such as flexible circuit boards, the second dispersed system can be coated into a strip. After coating, the coated film is dried under the first preset conditions.

[0070] In an exemplary embodiment provided in the present disclosure, the preparation method further includes: forming a substrate having a preset shape by extruding or calendering the substrate.

[0071] After the second dispersed system is coated into a film and dried and solidified to obtain a substrate, the substrate can be formed into a desired shape by extrusion or calendaring according to subsequent application requirements, and the thickness and size of the substrate can be controlled. For example, when the prepared substrate is used to prepare an electrical connector, the cured substrate is formed into a strip by extrusion or calendaring, or the substrate can be formed into a shape close to the electrical connector according to the specific shape of the electrical connector to be prepared, so as to reduce subsequent processing steps.

[0072] In the exemplary embodiments provided in the present disclosure, the organic high molecular polymer includes one or more of polytetrafluoroethylene, polyimide, polyarylether, and polyaryletherketone.

[0073] Polytetrafluoroethylene, polyimide, polyarylether and polyaryletherketone are all organic polymers with excellent insulation properties, chemical corrosion resistance, wear resistance, high strength and other characteristics, and these organic polymers have low dielectric loss characteristics, flexibility and bendability. A mixed fiber made of one or more of polytetrafluoroethylene, polyimide, polyarylether and polyaryletherketone and carbon material is selected and compounded with resin to form a substrate. The substrate is used to prepare electrical connectors, which can reduce the dielectric loss of the electrical connectors during signal transmission and improve the fidelity and transmission efficiency of signal transmission. In addition, the substrate also has certain flexibility and bendability, and can be suitable for various application scenarios that require bending or folding.

[0074] In an exemplary embodiment provided by the present disclosure, the resin includes epoxy resin and / or polyimide resin.

[0075] Epoxy resin and polyimide resin are two types of resins with excellent performance. Epoxy resin has strong adhesion, generates a three-dimensional network structure during the curing process, has a high cross-linking density, and has a small curing shrinkage rate; and after curing, epoxy resin has high strength, modulus and elongation, and a small thermal expansion coefficient. Polyimide resin has excellent high temperature resistance, mechanical properties, dielectric properties, and thermal stability. Therefore, epoxy resin and polyimide resin can be used as base resins to prepare the substrate provided by the exemplary embodiments of the present disclosure. In addition, epoxy resin and polyimide resin can also be used together as a base resin to prepare the substrate provided by the exemplary embodiment of the present disclosure. Epoxy resin has good adhesion properties, can be cured at low temperature, and has good miscibility, but its high temperature resistance is relatively weak. Polyimide resin has good comprehensive properties and high temperature resistance, but its bonding strength is not high enough. Therefore, the properties of epoxy resin and polyimide resin have certain complementarity. When epoxy resin and polyimide resin are mixed in a certain mass ratio as a base resin, for example, epoxy resin and polyimide resin are mixed in a mass ratio of 1:0.56 to 1:1.34 as a base resin to prepare the substrate provided by the exemplary embodiment of the present disclosure, a substrate with good mechanical properties and high temperature resistance can be obtained.

[0076] In the exemplary embodiments provided in the present disclosure, the carbon material includes one or more of carbon fiber, carbon nanotube, and graphene.

[0077] Carbon fiber, carbon nanotubes, and graphene are all carbon materials with excellent mechanical properties, electromagnetic shielding properties, and low dielectric loss properties. One or more of carbon fiber, carbon nanotubes, and graphene are used as carbon materials, mixed with organic high molecular polymers to form a hybrid fiber, and then compounded with resin to form a substrate. When the substrate is used to prepare electrical connectors, it can effectively suppress external electromagnetic interference, improve the stability and reliability of radio frequency transmission, and reduce the dielectric loss of electrical connectors during signal transmission, thereby improving the fidelity and transmission efficiency of signal transmission.

[0078] The exemplary embodiment of the present disclosure provides a method for preparing a medium, the medium comprising a substrate provided by the exemplary embodiment of the present disclosure, and a signal line disposed on a surface of the substrate, the preparation method comprising:

[0079] S400: Obtaining a substrate provided by the exemplary embodiment of the present disclosure, and activating a preset portion of the substrate.

[0080] Obtain the substrate provided by the exemplary embodiment of the present disclosure, and activate the preset position of the substrate according to the signal line design and arrangement of the prepared medium, so as to prepare for the subsequent deposition of metal materials to form the preset signal lines. For example, by means of ultraviolet laser, the preset position of the substrate where the metal signal line needs to be arranged is precisely activated. The ultraviolet laser method does not destroy the substrate itself as a whole, and only activates the preset position.

[0081] S500: Immersing the activated substrate in a preset solution under a second preset condition, so that a metal material is deposited on a preset position of the substrate to form a preset signal line, thereby obtaining a medium.

[0082] The activated substrate is immersed in a preset solution, and metal materials, such as copper metal, are deposited in the preset solution at the activated preset positions on the substrate, while metal materials are not deposited at the unactivated positions. Under the second preset condition, a preset signal line is formed at the preset position of the substrate to obtain a medium.

[0083] The method for preparing the medium provided by the exemplary embodiment of the present disclosure combines the signal line with the substrate by electrochemical deposition, which can achieve precise linear bonding, ensure the bonding quality of the signal line and the substrate, and further ensure good contact performance and signal transmission effect of the signal line.

[0084] In the exemplary embodiment provided in the present disclosure, the second preset condition includes: the second preset temperature is 30-40° C., and the second preset time is 15-25 minutes.

[0085] The activated substrate is immersed in a preset solution, and metal material will be deposited on the activated preset parts of the substrate in the preset solution, while metal material will not be deposited on the unactivated parts. At a second preset temperature of 30-40°C, for example, at a second preset temperature of 30°C, 35°C or 40°C, and immersed for a second preset time of 15-25 minutes, for example, for a second preset time of 15 minutes, 20 minutes or 25 minutes, a preset signal line is formed at the preset part of the substrate to obtain a medium.

[0086] In an exemplary embodiment provided by the present disclosure, the preset solution includes copper sulfate and sodium hypophosphite in a preset concentration ratio.

[0087] The preset solution includes copper sulfate and sodium hypophosphite. Sodium hypophosphite is used as a reducing agent to reduce copper ions in the preset solution into metallic copper and deposit them on the preset positions after activation of the substrate. The metallic copper will not be deposited on the unactivated positions. Under the second preset condition, a preset signal line, i.e., a copper signal line, is formed at the preset position of the substrate to obtain a medium.

[0088] In the exemplary embodiment provided in the present disclosure, the preset concentration ratio is 1:4.8-1:6.2.

[0089] The preset concentration ratio of copper sulfate and sodium hypophosphite in the preset solution is 1:4.8-1:6.2. Within this preset concentration ratio range, sodium hypophosphite can fully reduce the copper ions in the preset solution into metallic copper, which is deposited on the preset position after the substrate is activated, while the metallic copper will not be deposited on the unactivated position. Under the second preset condition, a preset signal line, i.e., a copper signal line, is formed at the preset position of the substrate to obtain a medium.

[0090] like Figure 3 As shown, the exemplary embodiment of the present disclosure provides an electrical connector 40 , which includes: a first dielectric layer 90 , the first dielectric layer 90 includes a substrate provided by the exemplary embodiment of the present disclosure; a signal line 130 is disposed on a first surface of the first dielectric layer.

[0091] The substrate provided by the exemplary embodiment of the present disclosure has low dielectric loss and excellent electromagnetic shielding performance. A metal signal line 130 is deposited on the substrate by electrochemical deposition to form a first dielectric layer 90. The first dielectric layer 90 has low dielectric loss during signal transmission of the electrical connector 40, high fidelity and transmission efficiency of signal transmission, and can effectively suppress external electromagnetic interference, thereby improving the stability and reliability of radio frequency transmission. In addition, the first dielectric layer 90 has certain flexibility and bendability, and can be applied to various application scenarios that require bending or folding. Figure 3As shown, in the exemplary embodiment provided by the present disclosure, the electrical connector also includes: a first grounding layer 80, the first grounding layer 80 is arranged on the first surface of the first dielectric layer 90, and the coverage area of ​​the first grounding layer 80 is different from the area where the signal line 130 is located; a second dielectric layer 70, the second dielectric layer 70 covers the first grounding layer 80, and the second dielectric layer 70 includes the substrate provided by the exemplary embodiment of the present disclosure.

[0092] The first grounding layer 80 is disposed on the first surface of the first dielectric layer 90, and the first grounding layer 80 may be a copper-plated layer, for example. The second dielectric layer 70 covers the first grounding layer 80, and the second dielectric layer 70 includes the substrate provided by the exemplary embodiment of the present disclosure, so the second dielectric layer 70 has low dielectric loss during the signal transmission process of the electrical connector, high fidelity and transmission efficiency of the signal transmission, and can effectively suppress external electromagnetic interference, and improve the stability and reliability of radio frequency transmission; in addition, the second dielectric layer 70 has certain flexibility and bendability, and can be applied to various application scenarios that require bending or folding.

[0093] In the exemplary embodiment provided by the present disclosure, the thickness of the first dielectric layer and the second dielectric layer are both 50-70 μm.

[0094] When the thickness of the first dielectric layer and the second dielectric layer is 50-70 μm, the electrical connector can have lower dielectric loss during signal transmission, higher signal transmission fidelity and transmission efficiency, and can effectively suppress external electromagnetic interference and improve the stability and reliability of radio frequency transmission.

[0095] like Figure 3 As shown, in the exemplary embodiment provided by the present disclosure, the electrical connector further includes: a second grounding layer 60 , which covers the second dielectric layer 70 ; and a third grounding layer 110 , which covers the second surface of the first dielectric layer 90 .

[0096] The second grounding layer 60 and the third grounding layer 110 can improve signal integrity and eliminate interference during signal transmission of the electrical connector. The second grounding layer 60 and the third grounding layer 110 can be copper-plated layers.

[0097] like Figure 3 As shown, in the exemplary embodiment provided by the present disclosure, the thickness of the first ground layer 80 , the second ground layer 60 , and the third ground layer 110 are all 10-14 μm.

[0098] To ensure impedance matching, the thicknesses of the first ground layer 80 , the second ground layer 60 and the third ground layer 110 are consistent, all of which are 10-14 μm.

[0099] like Figure 3As shown, in the exemplary embodiment provided by the present disclosure, the electrical connector also includes: a first shielding layer 50 , which covers the surface of the second grounding layer 60 ; and a second shielding layer 120 , which covers the surface of the third grounding layer 110 .

[0100] The first shielding layer 50 and the second shielding layer 120 may be electromagnetic shielding films, which can effectively suppress electromagnetic interference of the electrical connector during signal transmission, while also reducing attenuation of the transmission signal and reducing incompleteness of the transmission signal.

[0101] In an exemplary embodiment provided by the present disclosure, the thickness of the first shielding layer and the second shielding layer are both 18-22 μm.

[0102] The thickness of the first shielding layer and the second shielding layer is in the range of 18-22 μm, which can effectively suppress the electromagnetic interference of the electrical connector during signal transmission without increasing the weight of the electrical connector too much.

[0103] An exemplary embodiment of the present disclosure provides an electronic device, and the electronic device includes the electrical connection member provided by the exemplary embodiment of the present disclosure.

[0104] In order to more clearly explain the technical solution of the present disclosure, according to the preparation method of the substrate provided in the exemplary embodiment of the present disclosure, the amount of each raw material component of the substrate is adjusted to prepare the substrate, and an electrical connector including the substrate is obtained, and the electromagnetic shielding efficiency and dielectric loss factor D of the electrical connector are measured. f Table 1 lists some examples 1-6. It should be noted that the adjustment of the dosage of each raw material component of the substrate selected in Table 1 does not limit the protection scope of the present disclosure.

[0105] Table 1

[0106]

[0107] It can be seen from the data in Table 1 that the substrate prepared by the substrate preparation method provided by exemplary embodiments 1-6 of the present disclosure, and the electrical connector obtained therefrom, has a high electromagnetic shielding efficiency and a small dielectric loss factor. Therefore, the dielectric loss during signal transmission is low, the fidelity and transmission efficiency of signal transmission are high, and external electromagnetic interference can be effectively suppressed.

[0108] The contents described above may be implemented individually or in combination in various ways, and these variations are all within the protection scope of the present disclosure.

[0109] Finally, it should be noted that in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0110] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A substrate, characterized in that The substrate comprises a composite material of an organic high molecular polymer in a first preset mass fraction, a carbon material in a second preset mass fraction, and a resin in a third preset mass fraction.

2. The substrate according to claim 1, characterized in that The substrate includes the following components expressed in parts by mass: 2.46-3.62 parts by mass of organic high molecular polymer; 0.51-1.43 parts by mass of carbon material; Resin 35.32-44.86 parts by mass.

3. The substrate according to claim 2, characterized in that The substrate includes the following components expressed in parts by mass: 2.73-3.39 parts by weight of organic high molecular polymer; 0.64-1.25 parts by mass of carbon material; Resin 38.41-42.13 parts by mass.

4. The substrate according to any one of claims 1 to 3, characterized in that The organic high molecular polymer includes one or more of polytetrafluoroethylene, polyimide, polyarylether, and polyaryletherketone.

5. The substrate according to any one of claims 1 to 3, characterized in that The resin includes epoxy resin and / or polyimide resin.

6. The substrate according to any one of claims 1 to 3, characterized in that The carbon material includes one or more of carbon fiber, carbon nanotube and graphene.

7. A method for preparing a substrate, characterized in that: The preparation method is used to prepare the substrate according to any one of claims 1 to 6, and the preparation method comprises: Dispersing a first preset mass fraction of an organic high molecular polymer and a second preset mass fraction of a carbon material in a solvent, and performing ultrasonic activation treatment to obtain a first dispersed system; Adding a third preset mass fraction of resin into the first dispersion system, stirring and mixing, to obtain a second dispersion system; The second dispersed system is dried under first preset conditions to obtain the substrate.

8. The method for preparing a substrate according to claim 7, characterized in that: The first preset condition includes: a first preset temperature of 130° C.-180° C., and / or a first preset time of 30 min-60 min.

9. The method for preparing a substrate according to claim 7, characterized in that: The preparation method further comprises: forming the substrate into a substrate with a preset shape by extruding or calendering the substrate.

10. An electrical connector, characterized in that: The electrical connector comprises: A first dielectric layer, wherein the first dielectric layer comprises the substrate according to any one of claims 1 to 6; and a signal line is arranged on a first surface of the first dielectric layer.

11. The electrical connector according to claim 10, characterized in that: The electrical connector also includes: A first ground layer, wherein the first ground layer is disposed on a first surface of the first dielectric layer, and an area covered by the first ground layer is different from an area where the signal line is located; A second dielectric layer, wherein the second dielectric layer covers the first ground layer, and the second dielectric layer comprises the substrate according to any one of claims 1-6.

12. The electrical connector according to claim 11, characterized in that: The electrical connector also includes: a second grounding layer, wherein the second grounding layer covers the second dielectric layer; A third grounding layer covers the second surface of the first dielectric layer.

13. The electrical connector according to claim 12, characterized in that: The electrical connector also includes: a first shielding layer, wherein the first shielding layer covers a surface of the second grounding layer; and / or, A second shielding layer covers a surface of the third grounding layer.

14. The electrical connector according to claim 12, characterized in that: The thickness of the first dielectric layer and the second dielectric layer are both 50 μm-70 μm; and / or, The thickness of the first ground layer, the second ground layer and the third ground layer are all 10 μm-14 μm.

15. The electrical connector according to claim 13, characterized in that: The thickness of the first shielding layer and the second shielding layer are both 18 μm-22 μm.

16. An electronic device, characterized in that: The electronic device comprises the electrical connector according to any one of claims 10-15.

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