Phase change energy storage type radiator

Abstract

The invention discloses a phase change energy storage type radiator, and relates to the technical field of heat dissipation of missile-borne electronic equipment, the phase change energy storage type radiator comprises a packaging base body, the packaging base body is filled with a solid phase change material, a heat conduction elastic piece in a stretching state is fixedly arranged in the solid phase change material, and the packaging base body is provided with a heat conduction surface for conducting heat with a heating element. One end of the heat-conducting elastic piece extends out of the solid-phase phase-change material and is fixedly connected with the heat-conducting surface in a heat-conducting manner, and the contraction direction of the heat-conducting elastic piece in a stretched state faces the heat-conducting surface, so that the solid-phase phase-change material is in contact with the heat-conducting surface. According to the invention, the heat-conducting elastic piece in the stretched state is arranged in the solid-phase phase-change material, so that the solid-phase phase-change material can be always kept in contact with the heat-conducting surface, heat can be more quickly and widely transferred into the solid-phase phase-change material through the heat-conducting elastic piece, and the space occupied by the length of the heat-conducting elastic piece can be saved; and more solid phase change materials are added in a limited volume.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation of missile-borne electronic equipment, and in particular to a phase-change energy storage type radiator. Background Art

[0002] In the past few decades, with the rapid development of science and technology, the electronics industry has made significant progress and its application areas have continued to expand. However, the increased integration of electronic devices has brought about a significant increase in heat dissipation. At the same time, the trend of lightweight and miniaturization of electronic devices has put forward higher requirements for heat dissipation. Under different working conditions, the power and heat dissipation of electronic devices are different. Especially under abnormal conditions, a sudden increase in current will cause a large amount of heat flow. If this heat cannot be effectively dissipated, the temperature of the entire electronic device will increase significantly, seriously affecting the normal use of the equipment, and may even cause the device to fail completely. Therefore, how to efficiently manage and dissipate heat has become a key technical issue.

[0003] Traditional heat dissipation methods, such as fan heat dissipation and natural convection heat dissipation, can reduce the temperature of the equipment to a certain extent, but they often have problems such as low efficiency and high energy consumption. Therefore, it is particularly important to develop an efficient and energy-saving heat dissipation technology. At present, sensible heat storage and latent heat storage are mainly used for the thermal design of missile-borne electronic equipment. Among them, sensible heat storage is to store energy by increasing the temperature of metal components, but its energy storage density is low, and a large system is required to meet the heat dissipation requirements, which is not ideal for missile-borne systems with limited weight and volume. In contrast, latent heat storage technology can absorb a large amount of heat when the temperature of the phase change material remains basically unchanged, and its unit mass storage energy is much greater than sensible heat storage, so it has attracted much attention. The core of phase change energy storage technology is phase change material. The ideal phase change material should have the characteristics of suitable phase change temperature, large phase change enthalpy, safety, non-toxicity, and non-corrosiveness. According to the physical and chemical properties, phase change energy storage materials can be divided into organic materials and inorganic materials. Inorganic phase change materials such as molten salts, metals, alloys, etc. are not suitable for the field of electronic equipment heat dissipation because the phase change temperature of molten salts is too high and the unit volume mass of metals and alloys is large. Organic phase change materials, represented by paraffin, have the advantages of large latent heat of melting, stable physicochemical properties, non-toxic and non-corrosive, and their phase change temperature is suitable for the heat dissipation needs of electronic equipment. However, the thermal conductivity of organic materials such as paraffin is low, which seriously hinders the heat dissipation rate. Therefore, the research focus in recent years has been on enhancing the heat transfer performance of organic phase change materials, including adding fins, porous materials, nanoparticles and other high thermal conductivity materials to phase change materials. Through these improvement measures, it is expected to significantly improve the heat dissipation efficiency of organic phase change materials and meet the heat dissipation needs of modern electronic equipment.

[0004] The phase change heat transfer process in the phase change energy storage radiator is mainly affected by the combined effects of heat conduction and convection. Adding fins to the phase change material is mainly to improve the heat conduction effect. Adding porous materials, nanoparticles and other methods can greatly inhibit the convection effect while improving the heat conduction effect. Simply improving the thermal conductivity of the phase change material will always have limited effect on the improvement of the heat absorption effect. For some application fields such as missiles that have high safety requirements and sudden surges in heat generation, a heat dissipation enhancement system that is both stable and reliable and has strong thermal protection capabilities is urgently needed. Summary of the invention

[0005] The purpose of the present invention is to provide a phase change energy storage radiator to solve the problems existing in the above-mentioned prior art, which can ensure the efficient heat conduction of the phase change material without affecting the convection of the phase change material.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] A phase-change energy storage heat sink comprises a packaging substrate, the interior of the packaging substrate is filled with a solid-phase phase change material, a heat-conducting elastic member in a stretched state is fixedly arranged in the solid-phase phase change material, the packaging substrate has a heat-conducting surface for heat conduction with a heating element, one end of the heat-conducting elastic member is fixedly connected to the heat-conducting surface in a heat-conducting manner, and the contraction direction of the heat-conducting elastic member in the stretched state is toward the heat-conducting surface, so that the solid-phase phase change material contacts the heat-conducting surface under the push of the heat-conducting elastic member.

[0008] In an exemplary embodiment, at least two of the thermally conductive elastic members in a stretched state are uniformly disposed in the solid phase change material.

[0009] In an exemplary embodiment, a pressurizing mechanism is provided on a side of the solid phase change material away from the heat transfer surface, and the pressure provided by the pressurizing mechanism is directed toward the heat transfer surface.

[0010] In an exemplary embodiment, the pressurizing mechanism includes a pressurizing plate, and the pressurizing plate is in contact with a surface of the solid-phase phase change material that is away from the heat conduction surface.

[0011] In an exemplary embodiment, a side of the packaging substrate corresponding to the pressure plate is configured as an open structure, and a cover body is provided to close the open structure.

[0012] In an exemplary embodiment, the pressurizing mechanism further includes a first telescopic mechanism disposed on the cover body, and a movable end of the first telescopic mechanism is fixedly connected to the pressurizing plate.

[0013] In an exemplary embodiment, the other end of the thermally conductive elastic member is fixedly connected to the pressure plate.

[0014] In an exemplary embodiment, a gap is provided between the solid phase change material and the side surface of the packaging substrate adjacent to the heat conducting surface, and the gap is used for allowing the liquid phase change material converted from the solid phase change material to flow after being melted by heat.

[0015] In an exemplary embodiment, a return plate is provided in the gap, and the side surface of the return plate is tightly fitted with the adjacent return plate or the side wall of the packaging substrate; a second telescopic mechanism is provided on the adjacent surface corresponding to the return plate, and the movable end of the second telescopic mechanism is fixedly connected to the return plate.

[0016] In an exemplary embodiment, a heat dissipation fin is disposed on a side of the heat conduction surface facing the solid-phase phase change material.

[0017] Compared with the prior art, the present invention has achieved the following technical effects:

[0018] By fixing a heat-conducting elastic member in a stretched state in the solid phase phase change material, one end of the heat-conducting elastic member extends out to be fixedly connected to the heat conduction surface for heat conduction, and the contraction direction of the heat-conducting elastic member in the stretched state is toward the heat conduction surface, so that the solid phase phase change material is in contact with the heat conduction surface. After the solid phase phase change material close to the heat conduction surface melts, the restraint of the heat-conducting elastic member in the stretched state in this part disappears, the stored elastic potential energy is released, and the contraction distance is certain, so that the next layer of solid phase phase change material that has not yet undergone phase change continues to be close to the heat conduction surface, and the molten liquid phase phase change material is squeezed into the cavity vacated by the solid phase phase change material, so as to reduce the hindrance of the liquid phase phase change material with a low thermal conductivity coefficient that absorbs enough latent heat to the heat conduction, so that the phase change heat absorption process is carried out uninterruptedly between the solid phase phase change material and the high-temperature heat conduction surface, thereby continuously and efficiently absorbing the heat generated by the heating element.

[0019] At the same time, one end of the thermally conductive elastic member is fixedly connected to the heat conduction surface in a thermally conductive manner. The heat transferred from the heating element to the heat conduction surface will also be transferred to the thermally conductive elastic member. The thermally conductive elastic member is tightly coated with the solid-phase phase change material. The heat can be transferred to the interior of the solid-phase phase change material faster and wider through the thermally conductive elastic member, thereby further enhancing the heat dissipation effect.

[0020] Compared with disposing the elastic member outside the solid phase change material in a compressed state, disposing the thermal conductive elastic member in a stretched state inside the solid phase change material can save the space occupied by the elastic member itself and add more phase change material in a limited volume.

[0021] Other technical solutions disclosed in the present invention also have the following technical advantages:

[0022] By arranging heat dissipation ribs on the side of the heat conduction surface facing the solid-phase phase change material, when the solid-phase phase change material approaches the heat conduction surface under the action of the heat conductive elastic member, the heat dissipation ribs will be embedded in the softened phase change material together with the heat conductive elastic member, thereby further increasing the heat conduction area of ​​the heat conduction surface in contact with the phase change material, accelerating the phase change heat absorption rate of the phase change material, enhancing the heat absorption capacity of the heating element, and achieving a lower thermal protection temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic structural diagram of a phase-change energy storage radiator disclosed in a specific embodiment of the present invention;

[0025] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0026] Figure 3 for Figure 1 A top view of the package substrate in FIG.

[0027] Among them, 1. cover; 2. pressure plate; 3. thermal conductive elastic member; 4. solid phase change material; 5. packaging base; 6. heat dissipation ribs; 7. heat conduction surface. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. People familiar with the technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that the structures, proportions, sizes, etc. drawn in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that the present invention can be implemented, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0030] It should also be noted that in the embodiments of the present application, the same figure mark is used to represent the same component or the same part.

[0031] The purpose of the present invention is to provide a phase change energy storage radiator to solve the problems existing in the prior art, which can ensure the efficient heat conduction of the phase change material without affecting the convection of the phase change material.

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] Please refer to Figures 1 to 3 The present embodiment provides a phase change energy storage heat sink, including a packaging substrate 5, the interior of the packaging substrate 5 is filled with a solid phase change material 4, a heat conductive elastic member 3 in a stretched state is fixedly arranged in the solid phase change material 4, the packaging substrate 5 has a heat conduction surface 7 for heat conduction with a heating element, one end of the heat conductive elastic member 3 extends out of the solid phase change material 4 and is fixedly connected to the heat conduction surface 7 in a heat conductive manner, and the contraction direction of the heat conductive elastic member 3 in the stretched state is toward the heat conduction surface 7, so that the solid phase change material 4 is in contact with the heat conduction surface 7.

[0034] The working principle of this embodiment is:

[0035] During the process of pouring the phase change material, the thermally conductive elastic member 3 is stretched to its longest length. After the phase change material is completely solidified, the elastic potential energy of the thermally conductive elastic member 3 is retained, and then the subsequent packaging steps are completed.

[0036] When in use, the heat transfer surface 7 of the package substrate 5 is in direct contact with the heat dissipation surface of the heating element. To avoid a large contact heat group, the contact surface can be coated with thermal grease. The heat generated by the heating element is transferred to the heat transfer surface 7, and then transferred to the solid phase change material 4 in contact with it through the heat transfer surface 7. In the early stage of heat dissipation, the heat will quickly diffuse to the entire radiator through heat conduction. At this stage, the heat is stored in the radiator in the form of sensible heat. As heat is continuously absorbed by the radiator, the temperature of the heat conduction surface 7 continues to rise. When the temperature is higher than the melting point of the solid phase phase change material 4, the solid phase phase change material 4 close to the heat conduction surface 7 begins to melt, and the phase change heat absorption process begins to occur. When the solid phase phase change material 4 on the contact surface melts, the restraint on the thermal conductive elastic member 3 in the stretched state in this part disappears, releasing the stored elastic potential energy and shrinking a certain distance, so that the next layer of solid phase phase change material 4 that has not yet undergone phase change continues to be close to the heat conduction surface 7, and the molten liquid phase phase change material is squeezed into the cavity vacated by the solid phase phase change material 4, so as to reduce the hindrance of the liquid phase phase change material with lower thermal conductivity to heat conduction, so that the phase change heat absorption process is carried out uninterruptedly between the solid phase phase change material 4 and the high-temperature heat conduction surface 7, thereby continuously and efficiently absorbing the heat generated by the heating element.

[0037] As a preferred solution of this embodiment, a plurality of thermally conductive elastic parts 3 in a stretched state are evenly arranged in the solid-phase phase change material 4. The plurality of thermally conductive elastic parts 3 can improve the contact effect between the solid-phase phase change material 4 and the heat conduction surface 7 to prevent the solid-phase phase change material 4 from being subjected to uneven force, thereby causing a gap to be generated between the solid-phase phase change material 4 and the heat conduction surface 7.

[0038] In order to ensure that the elastic potential energy of the thermally conductive elastic member 3 is released smoothly and to squeeze the high-temperature liquid phase change material into the cavity vacated by the solid phase change material 4, a gap for the liquid phase change material to flow needs to be left between the completely solidified solid phase change material 4 and one or more side surfaces of the packaging substrate 5 that are thermally adjacent to the conduction surface, that is, the size of the solid phase change material 4 should be appropriately smaller than the size of the inner cavity of the packaging substrate 5, and the volume of the inner cavity of the packaging substrate 5 should be sufficient to accommodate the liquid phase change material whose volume may increase after the solid phase change material 4 is completely melted.

[0039] Since the heat-conducting elastic member 3 still has a certain axial length after shrinking, the next layer of solid phase change material 4 that has not undergone phase change may not be able to fit tightly with the heat conduction surface 7, resulting in a decrease in heat transfer efficiency. To solve this problem, two situations need to be considered, but both should be understood on the premise that most solid phase change materials 4 will first soften and then melt in the process of absorbing heat in the form of latent heat to produce phase change, such as paraffin. Under this premise:

[0040] In the first case, when the phase change energy storage radiator of this embodiment is arranged above or diagonally above the heating element: during the gradual softening of the solid phase change material 4, under the action of its own gravity, the thermal conductive elastic part 3 will be embedded in the softened phase change material until the phase change material is tightly fitted to the heat conduction surface 7.

[0041] The second case is when the phase change energy storage radiator of this embodiment is set at other positions of the heating element: at this time, the gravity of the solid-phase phase change material 4 itself can no longer play a role. As a preferred solution of this embodiment, a pressurizing mechanism is set on the side of the solid-phase phase change material 4 away from the heat conduction surface 7 to apply a thrust that replaces gravity, so that the thermal conductive elastic part 3 is embedded in the softened phase change material.

[0042] Specifically, the pressurizing mechanism includes a first telescopic mechanism arranged on the side wall of the packaging substrate 5 away from the heat conduction surface 7, the movable end of the first telescopic mechanism abuts against the solid phase change material 4, and the thrust of the first telescopic mechanism causes the thermal conductive elastic member 3 to be embedded in the softened phase change material.

[0043] As a preferred solution of this embodiment, the pressurizing mechanism also includes a pressurizing plate 2 which is in contact with the surface of the solid-phase phase change material 4 away from the heat conduction surface 7. The movable end of the first telescopic mechanism is fixedly connected to the pressurizing plate 2, and the smooth movement of the solid-phase phase change material 4 is ensured by the pressurizing plate 2.

[0044] Furthermore, one side of the packaging substrate 5 corresponding to the pressure plate 2 is configured as an opening structure for loading the solid phase change material 4 , and is provided with a cover body 1 for closing the opening structure, and the first telescopic mechanism is provided on the cover body 1 .

[0045] It is understandable that the setting of the pressure mechanism is not limited to the second case mentioned above. In the first case, the pressure mechanism can also be set as needed, such as providing a greater pressure to make the thermally conductive elastic member 3 embed into the softened phase change material as quickly as possible. At this time, the pressure mechanism can only include the pressure plate 2, and the additional pressure is the gravity of the pressure plate 2; it can also include the pressure plate 2 and the first telescopic mechanism at the same time, and the additional pressure is the gravity of the pressure plate 2 and the thrust of the telescopic mechanism.

[0046] At the same time, one end of the thermally conductive elastic member 3 is fixedly connected to the heat conduction surface 7 in a heat-conducting manner. The heat transferred from the heating element to the heat conduction surface 7 will also be transferred to the thermally conductive elastic member 3. The thermally conductive elastic member 3 is tightly wrapped by the solid-phase phase change material 4. The heat can be transferred to the inside of the solid-phase phase change material 4 faster and wider through the thermally conductive elastic member 3, thereby further enhancing the heat dissipation effect.

[0047] To ensure the heat conduction effect, the heat conduction surface 7 of the package base 5 is made of a material with a high thermal conductivity, such as metals, carbon materials, ceramics and some composite materials with good heat conduction effect. In this embodiment, copper is preferably used in consideration of cost, strength, priority and other aspects. Other parts of the package base 5 can also be made of the above materials, and metal aluminum is preferably used in consideration of cost.

[0048] The heat-conductive elastic member 3 may be a tension spring made of a material having a high thermal conductivity and sufficient elasticity and strength, or any other structure in the prior art that can achieve the same effect.

[0049] The use of a tension spring can save the space occupied by the initial length of the spring compared to a compression spring, and more phase change material can be added within a limited volume. Moreover, the spring itself has a high thermal conductivity coefficient. The tension spring embedded in the phase change material can enhance the thermal conductivity effect, and part of the heat can be transferred through the tension spring to further enhance the heat exchange.

[0050] In addition, the temperature control effect on the heating element can be regulated by changing the elastic potential energy stored in the thermally conductive elastic member 3: the temperature maintained by the thermally conductive surface 7 is related to the tension applied by the thermally conductive elastic member 3 to the solid phase change material 4. The greater the tension applied, the better the heat dissipation effect, and the faster the temperature of the thermally conductive surface 7 drops. When the applied tension increases to a certain extent, the heat absorption capacity of the phase change material reaches its limit, and the thermally conductive surface 7 reaches the lowest temperature that can be controlled by the material.

[0051] As a preferred solution of this embodiment, a return plate is arranged between the solid-phase phase change material 4 and the adjacent surface with a gap, and the side surface of the return plate is tightly fitted with the adjacent return plate or the side wall of the packaging substrate 5; a second telescopic mechanism is arranged on the adjacent surface corresponding to the return plate, and the movable end of the second telescopic mechanism is fixedly connected to the return plate.

[0052] When the heating element is working, heat is generated, and the solid phase phase change material 4 absorbs the heat and melts, while the temperature remains almost unchanged, thereby suppressing the temperature rise of the heating element and preventing the device from overheating. When the heating element stops working, the liquid phase phase change material releases the absorbed heat into the surrounding environment and solidifies, preparing to resist the next thermal shock. Before the liquid phase phase change material solidifies, the second telescopic mechanism drives the return plate to push the liquid phase phase change material to the middle of the packaging substrate 5, and re-forms a gap for the liquid phase phase change material to flow when the solid phase phase change material 4 absorbs heat and melts. At the same time, the other end of the thermal conductive elastic member 3 away from the heat conduction surface 7 is extended out of the solid phase phase change material 4 and fixedly connected to the pressure plate 2. When the first telescopic mechanism drives the pressure plate 2 to retract, the thermal conductive elastic member 3 is stretched.

[0053] As a preferred solution of this embodiment, a heat dissipation rib 6 is provided on the side of the heat conduction surface 7 facing the solid-phase phase change material 4. When the solid-phase phase change material 4 approaches the heat conduction surface 7 under the action of the thermal conductive elastic member 3, the heat dissipation rib 6 will be embedded in the softened phase change material together with the thermal conductive elastic member 3, thereby further increasing the heat conduction area of ​​the heat conduction surface 7 in contact with the phase change material, accelerating the phase change heat absorption rate of the phase change material, enhancing the heat absorption capacity of the heating element, and achieving a lower thermal protection temperature.

[0054] This embodiment uses the latent heat of phase change absorbed by the solid phase change material 4 when it is heated and melted and the sensible heat of the solution to absorb the heat generated by the heating element, thereby achieving thermal protection for the heating element. By applying pressure externally, the solid phase change material 4 is continuously close to the heat conduction surface 7, so that the phase change heat absorption process is concentrated on the high-temperature heat conduction surface 7 and is carried out continuously, thereby continuously and effectively absorbing the heat generated by the heating element, significantly improving the thermal protection capability of the phase change energy storage radiator. The pressure device adopts the form of a tension spring, which can add more phase change materials in a limited volume, and the spring itself has a very high thermal conductivity. Part of the heat can be transferred upward through the spring itself to further enhance the heat exchange. The heat dissipation ribs 6 designed on the heat exchange contact surface increase the heat dissipation area, strengthen the thermal conductivity of the phase change interval, and can further improve the absorption rate of the heat generated by the heating element. Therefore, this embodiment can optimize the thermal protection effect of the heating element while optimizing the weight and volume of the radiator. It has a very broad application prospect for cooling short-term heat dissipation devices such as missile-borne electronic equipment, and can be used as a backup heat dissipation device when an emergency occurs in active heat dissipation.

[0055] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0056] If the present invention discloses or involves components or structures that are fixedly connected to each other, then, unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (for example, connection using bolts or screws), and can also be understood as: a non-detachable fixed connection (for example, riveting, welding). Of course, the mutual fixed connection can also be replaced by an integrated structure (for example, manufactured by one-piece molding using a casting process) (except when it is obviously impossible to use an one-piece molding process).

[0057] In addition, unless otherwise stated, the terms used to indicate positional relationships or shapes in any of the technical solutions disclosed in the present invention include states or shapes that are approximate, similar, or close to them.

[0058] Any component provided by the present invention may be assembled from a plurality of separate components, or may be a separate component manufactured by an integral forming process.

[0059] Adaptive changes made according to actual needs are all within the protection scope of the present invention.

[0060] It should be noted that it is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numerals in the claims should not be regarded as limiting the claims involved.

[0061] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A phase change energy storage radiator, characterized in that: The invention comprises a packaging substrate, wherein the interior of the packaging substrate is filled with a solid phase change material, a heat-conducting elastic member in a stretched state is fixedly arranged in the solid phase change material, the packaging substrate has a heat-conducting surface for heat conduction with a heating element, one end of the heat-conducting elastic member is fixedly connected to the heat-conducting surface in a heat-conducting manner, and the contraction direction of the heat-conducting elastic member in the stretched state is toward the heat-conducting surface, so that the solid phase change material contacts the heat-conducting surface under the push of the heat-conducting elastic member.

2. The phase change energy storage radiator according to claim 1, characterized in that: At least two of the heat-conducting elastic members in a stretched state are evenly arranged in the solid phase change material.

3. The phase change energy storage radiator according to claim 1, characterized in that: A pressurizing mechanism is provided on a side of the solid phase change material away from the heat conduction surface, and the pressure provided by the pressurizing mechanism is directed toward the heat conduction surface.

4. The phase change energy storage radiator according to claim 3, characterized in that: The pressurizing mechanism comprises a pressurizing plate, and the pressurizing plate is in contact with a surface of the solid phase change material on a side away from the heat conducting surface.

5. The phase change energy storage radiator according to claim 4, characterized in that: A side of the packaging substrate corresponding to the pressure plate is arranged as an opening structure, and a cover body is arranged to close the opening structure.

6. The phase-change energy storage radiator according to claim 5, characterized in that: The pressurizing mechanism further comprises a first telescopic mechanism disposed on the cover body, and a movable end of the first telescopic mechanism is fixedly connected to the pressurizing plate.

7. The phase change energy storage radiator according to claim 6, characterized in that: The other end of the heat-conductive elastic member is fixedly connected to the pressure plate.

8. The phase change energy storage radiator according to claim 1, characterized in that: A gap is provided between the solid phase change material and the side surface of the packaging substrate adjacent to the heat conduction surface, and the gap is used for the flow of liquid phase change material converted from the solid phase change material after being melted by heat.

9. The phase-change energy storage radiator according to claim 8, characterized in that: A return plate is provided in the gap, and the side surface of the return plate is tightly fitted with the adjacent return plate or the side wall of the packaging substrate; a second telescopic mechanism is provided on the adjacent surface corresponding to the return plate, and the movable end of the second telescopic mechanism is fixedly connected to the return plate.

10. The phase change energy storage radiator according to claim 1, characterized in that: A heat dissipation fin is arranged on a side of the heat conduction surface facing the solid phase change material.

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