Coil filling and sealing device for high-temperature servo valve and filling method of coil filling and sealing device

Abstract

The coil filling and sealing device for the high-temperature servo valve comprises a mold formed by detachably and fixedly connecting a left mold and a right mold, a plurality of glue filling cavities with cavity openings located in the upper end face of the mold are formed in the mold, a coil is centrally positioned and installed in the glue filling cavities, and glue filling holes located in the outer sides of the glue filling cavities and vertically formed are formed in the mold. The orifice of the glue injection hole is located in the upper end face of the mold, the glue injection hole is communicated with the glue pouring cavity through a glue pouring groove horizontally formed in the mold, glue pouring liquid which is heated and injected into the glue injection hole is immersed into the glue pouring cavity through the glue pouring groove, and pouring sealing of the coil is achieved. Based on the structural characteristics of the coil for the high-temperature servo valve, the mold with the glue pouring cavity, the glue pouring hole and the glue pouring groove is designed, the technological process of the glue pouring process is optimized, bubble-free coil potting is achieved, meanwhile, it is ensured that the shape of crack pouring glue is regular, and the problem that the potting quality is affected due to the fact that bubbles exist in glue after potting in a traditional mode is solved; and after encapsulation, the colloid is regular in appearance, good in encapsulation consistency and high in encapsulation efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of potting, and in particular relates to a coil potting device for a high-temperature servo valve and a potting method thereof. Background Art

[0002] The electro-hydraulic servo valve is an important control element in the electro-hydraulic servo control system. It is a hydraulic control valve that receives analog electrical signals and outputs modulated flow and pressure accordingly. It has the advantages of fast dynamic response, high control accuracy, and long service life. It has been widely used in aviation, aerospace, shipbuilding, metallurgy, chemical industry and other fields.

[0003] The coil is an important part of the electro-hydraulic servo valve, which generally includes a skeleton, enameled wire, lead wire, glass fiber yarn, insulating film, epoxy glue, etc. The coil will face many problems if it is directly exposed to the air for a long time. The complex components of the air, such as water, oil, dust, etc., as well as the acid-base environment, will accelerate the aging and oxidation process of the coil, which not only brings safety hazards, but also significantly shortens its service life. Effective protective measures have become the key to ensuring the performance and safety of the coil. Therefore, epoxy potting glue is often used to fill and seal the coil to isolate the air and achieve the purpose of moisture-proof, oil-proof, dust-proof, high temperature resistance and aging. Commonly used epoxy potting glue is a type of epoxy resin liquid potting material made of epoxy resin as the main component and adding appropriate curing agent.

[0004] The process of coil potting includes several key steps: ① Thoroughly mix and stir the epoxy resin and curing agent in the corresponding proportion to obtain epoxy potting glue; ② Preheat the epoxy potting glue and the coil assembly placed in the fixture at 80°C for 10 to 15 minutes; ③ After preheating, introduce the potting glue into the preheated fixture for natural precipitation. After the colloid is fully formed, place it in a high and low temperature box for high-temperature curing; ④ Generally, the temperature is increased step by step according to the step temperature. Temperature control and curing time are crucial. Step-by-step temperature curing helps to reduce internal stress and improve the performance and stability of the colloid. Qualitative; ⑤ Take the cured coil out of the glue potting fixture and conduct high and low temperature tests and other performance tests; Using the above glue potting process, in view of the ratio of epoxy resin glue and curing agent, the storage time of epoxy resin glue, whether the stirring and mixing degree is uniform and sufficient, the curing temperature, the length of operation time and many other factors, the coil glue potting is prone to the following problems and defects: 1. There are a small amount of bubbles inside the epoxy potting glue after curing; 2. There is excess colloid in the coil lead wire; 3. The shape of the coil colloid is irregular. Therefore, in order to improve the quality of coil potting and make the potted coil meet the shape requirements of the appearance, it is necessary to make improvements. Summary of the invention

[0005] The technical problem solved by the present invention is as follows: a coil potting device for a high-temperature servo valve and a filling method thereof are provided. Based on the structural characteristics of the coil for a high-temperature servo valve, a mold with a glue potting cavity, a glue injection hole and a glue potting groove is designed, and the process of the glue potting process is optimized to achieve bubble-free potting of the coil while ensuring that the shape of the potting colloid is regular, thereby solving the problem that bubbles exist in the colloid after potting in the traditional way and affect the potting quality. After potting, the colloid has a regular shape, good potting consistency and high potting efficiency.

[0006] The technical solution adopted by the present invention is: a coil potting device for a high-temperature servo valve, comprising a mold formed by a left mold and a right mold that are detachably fixedly connected, the mold is provided with a plurality of glue potting cavities with cavity openings located on the upper end face of the mold, and the coil is centrally positioned and installed in the glue potting cavity, the mold is provided with glue injection holes located outside the glue potting cavity and vertically arranged, and the openings of the glue injection holes are located on the upper end face of the mold, the glue injection holes are connected to the glue potting cavity through a glue potting groove horizontally arranged inside the mold, and the glue potting liquid injected into the glue injection hole is heated and immersed in the glue potting cavity through the glue potting groove to achieve potting and sealing of the coil.

[0007] Among them, the side walls of the left and right molds facing each other are both provided with semicircular grooves with the same number and corresponding positions on the upper end faces, and when the left and right molds are fixedly connected and molded, the two semicircles are butted to form a glue injection hole.

[0008] Furthermore, the side walls of the left and right molds facing each other are formed with square grooves with the same number and corresponding positions on the upper end faces, and when the left and right molds are fixedly connected and molded, the two square grooves are butted to form a glue injection cavity.

[0009] Furthermore, a long groove located between the semicircular groove and the square groove is formed on the side walls of the left mold and the right mold facing each other, and the two long grooves form a glue pouring groove when the left mold and the right mold are fixedly connected and molded.

[0010] Furthermore, the depth of the groove above the right mold side wall is greater than the depth of the groove above the left mold side wall, and the bottom surface of the square groove on the right mold is provided with a threaded hole located in the middle of the bottom surface of the glue pouring cavity after the left and right molds are combined, and the lower end of the glue pouring core shaft with external threads at both ends passes through the center hole of the coil and is adapted to be connected with the threaded hole, and the positioning block above the coil is threadedly connected to the upper end of the glue pouring core shaft and presses the coil to position it in the glue pouring cavity.

[0011] Furthermore, notches corresponding to the positions and used for mold opening are formed at the edges of the side walls of the left mold and the right mold facing each other.

[0012] Furthermore, countersunk holes are formed on the two end plates of the outer side wall of the right mold, and through holes corresponding to the positions of the countersunk holes are formed on the left mold. The right mold and the left mold are detachably fixed together by countersunk bolts that pass through the countersunk holes and the through holes and are adapted to be connected to the butterfly nuts on the outside of the left mold.

[0013] The filling method based on the coil filling device for high temperature servo valve comprises the following steps:

[0014] 1) Apply mold release agent on the wall of the left and right molds for forming the glue filling cavity, glue injection hole and glue filling groove;

[0015] 2) The side walls with square grooves on the left and right molds are arranged facing each other and fit together, a coil is placed in each glue pouring cavity, and the lower end of the glue pouring mandrel passes through the center hole of the coil and is adapted to be connected with the threaded hole on the bottom surface of the glue pouring cavity. After the positioning block is threadedly connected with the upper end of the glue pouring mandrel, the coil is pressed and positioned in the glue pouring cavity. Then, the countersunk bolt is passed through the countersunk hole on the right mold and the through hole on the left mold in turn, and then adapted to be connected with the butterfly nut and tightened, completing the installation of the coil in the mold;

[0016] 3) Place the mold with the coil installed on a heating platform and heat it to 100°C. At the same time, inject epoxy potting glue into the injection hole, so that the pure glue liquid enters the glue potting tank along the injection hole under high temperature and then immerses into the glue potting cavity until the glue liquid fills the entire coil and is flush with the coil frame;

[0017] 4) The operator uses heat-insulating rubber gloves to place the mold filled with potting glue in an electric vacuum box for drying. The coil filled with glue is affected by the vacuum in the electric vacuum box, causing a large amount of air overflowing from the glue at the gap of the coil and the trace bubbles contained in the potting glue itself to burst and overflow and be sucked away, and then the glue automatically fills the original gap and the space occupied by the bubbles;

[0018] 5) For the coils that need to be filled with glue, fill them with glue for the second time through the corresponding glue injection holes, so that the gaps and concave parts are filled with glue;

[0019] 6) Place the mold with the coil and degassed in the electric vacuum box in a high-temperature drying oven, and use a step-by-step heating method to cure the coil after glue filling at high temperature;

[0020] 7) Use the notches at both ends of the side walls of the left and right molds to separate the left and right molds, and complete the demoulding and cleaning of the coil after demoulding.

[0021] In the above step 4), the vacuum degree of the electric vacuum box is 86KPa to 96KPa when it is working, and the electric vacuum box is evacuated at a working temperature of 30℃±5℃ for 15min to 20min, and then the temperature is raised to 80℃±5℃ and dried for 1h, and then the temperature of the electric vacuum box is lowered to room temperature 25℃ and the pressure is removed before the mold can be taken out;

[0022] In the above step 6), the step-by-step heating method is as follows: the temperature in the high-temperature drying oven is increased to 110°C ± 2°C for 1 hour; then, the temperature in the high-temperature drying oven is increased to 150°C ± 2°C for 2 hours; then, the temperature in the high-temperature drying oven is increased to 165°C ± 2°C for 1 hour; finally, the temperature in the high-temperature drying oven is increased to 200°C ± 2°C for 2 hours.

[0023] The advantages of the present invention compared with the prior art are:

[0024] 1. This technical solution is based on the structural characteristics of the coil for high-temperature servo valves. A mold with a glue pouring cavity, a glue injection hole and a glue pouring groove is designed. The coil is positioned and installed in the glue pouring cavity by a glue pouring mandrel connected to a threaded hole passing through the center hole of the coil and the bottom surface of the glue pouring cavity and a positioning block threadedly connected to the glue pouring mandrel to press the coil, thereby ensuring the stability of the coil position during the glue pouring process, thereby ensuring the glue pouring quality, so that the shape of the colloid outside the coil is regular and consistent and the thickness is uniform;

[0025] 2. This technical solution optimizes the process of glue potting to achieve bubble-free potting of the coil while ensuring the regular shape of the potting colloid, solving the problem of bubbles in the colloid after traditional potting that affects the potting quality. The colloid has a regular shape after potting, good potting consistency, and high potting efficiency.

[0026] 3. This technical solution provides conditions for rapid demoulding after glue pouring and drying by setting corresponding notches on the plate surface at the outer edge of the side walls of the left and right molds facing each other, which is convenient for demoulding;

[0027] 4. This technical solution has a simple structure, novel design, and reasonable process, which overcomes the problems of poor colloid fluidity and bubbles generated during glue filling. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the mold structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the structure of the mold of the present invention placed on a heating platform;

[0030] Figure 3 This is a schematic diagram of the structure of the mold of the present invention placed in an electric heating vacuum box;

[0031] Figure 4 This is a schematic diagram of the structure of the mold of the present invention placed in a high-temperature drying oven. DETAILED DESCRIPTION

[0032] The following will be combined with the embodiments of the present invention Figure 1-4, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that, in this document, unless otherwise stated, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc., are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0034] In this document, the terms "comprises", "comprising" or any other variation thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further limitations. The elements defined by the sentence "comprising a ..." do not exclude the presence of other identical elements in the process, method, article or device comprising the elements.

[0035] Coil potting device for high temperature servo valve, such as Figure 1 As shown, a mold 1 is formed by a detachable fixed mold of a left mold 2 and a right mold 3, and a plurality of glue-pouring cavities 4 with cavity openings located on the upper end surface of the mold 1 are formed on the mold 1, and a coil 5 is centrally positioned and installed in the glue-pouring cavity 4, and a glue-pouring hole 6 located outside the glue-pouring cavity 4 and vertically arranged is formed on the mold 1, and the orifice of the glue-pouring hole 6 is located on the upper end surface of the mold 1, and the glue-pouring hole 6 is connected with the glue-pouring cavity 4 through a glue-pouring groove 7 horizontally arranged inside the mold 1, and the glue-pouring liquid heated and injected into the glue-pouring hole 6 is immersed in the glue-pouring cavity 4 through the glue-pouring groove 7, so as to realize the filling and sealing of the coil 5;

[0036] The specific molding structure of the glue injection hole 6, the glue pouring groove 7 and the glue pouring cavity 4 is as follows: the side walls on the opposite sides of the left mold 2 and the right mold 3 are formed with semicircular grooves with the same number and corresponding positions of notches located on the upper end faces, and the two semicircles are butted together to form the glue injection hole 6 when the left mold 2 and the right mold 3 are fixedly connected and molded; specifically, the side walls on the opposite sides of the left mold 2 and the right mold 3 are formed with square grooves with the same number and corresponding positions of notches located on the upper end faces, and the two square grooves are butted together to form the glue pouring cavity 4 when the left mold 2 and the right mold 3 are fixedly connected and molded; specifically, the side walls on the opposite sides of the left mold 2 and the right mold 3 are formed with long grooves located between the semicircular grooves and the square grooves, and the two long grooves form the glue pouring groove 7 when the left mold 2 and the right mold 3 are fixedly connected and molded.

[0037] The positioning and installation structure of the coil 5 in the glue pouring cavity 4 is as follows: the depth of the groove above the side wall of the right mold 3 is greater than the depth of the groove above the side wall of the left mold 2, and the bottom surface of the square groove on the right mold 3 is provided with a threaded hole located in the middle of the bottom surface of the glue pouring cavity 4 after the left mold 2 and the right mold 3 are molded together, and the lower end of the glue pouring core shaft 8 with external threads at both ends passes through the center hole of the coil 5 and is adapted to be connected with the threaded hole, and the positioning block 9 above the coil 5 is threadedly connected to the upper end of the glue pouring core shaft 8 and presses the coil 5 to be positioned in the glue pouring cavity 4.

[0038] In order to facilitate demoulding of the left mold 2 and the right mold 3 after glue pouring, a notch 10 corresponding to the position and used for mold opening is formed at the edge of the side wall of the left mold 2 and the right mold 3 on the opposite side; in the above structure, by providing the notch 10 corresponding to the position on the plate surface at the outer edge of the side wall of the left mold 2 and the right mold 3 on the opposite side, conditions are provided for rapid demoulding after glue pouring and drying, which is convenient for demoulding;

[0039] The detachable fixed structure of the left mold 2 and the right mold 3 is specifically as follows: countersunk holes are formed on the plate surfaces at both ends of the outer wall of the right mold 3, and a through hole corresponding to the position of the countersunk hole is formed on the left mold 2. The right mold 3 and the left mold 2 are detachably fixed together by countersunk bolts 12 that pass through the countersunk holes and the through holes and are adapted to be connected to the butterfly nuts 11 on the outside of the left mold 2.

[0040] In the above structure, based on the structural characteristics of the coil 5 for the high-temperature servo valve, a mold 1 with a glue pouring cavity 4, a glue injection hole 6 and a glue pouring groove 7 is designed, and the coil 5 is positioned and installed in the glue pouring cavity 4 by a glue pouring core shaft that passes through the center hole of the coil 5 and is connected to the threaded hole on the bottom surface of the glue pouring cavity 4, and a positioning block 9 that is threadedly connected to the glue pouring core shaft to press the coil 5, to ensure the stability of the position of the coil 5 during the glue pouring process, thereby ensuring the glue pouring quality, so that the shape of the outer colloid of the coil 5 is regular and consistent and the thickness is uniform.

[0041] The filling method based on the coil filling device for high temperature servo valve comprises the following steps:

[0042] 1) Apply mold release agent on the groove walls of the left mold 2 and the right mold 3 for forming the glue pouring cavity 4, the glue injection hole 6 and the glue pouring groove 7;

[0043] 2) The side walls with square grooves on the left mold 2 and the right mold 3 are arranged facing each other and fit together, the coil 5 is placed in each glue pouring cavity 4, and the lower end of the glue pouring mandrel 8 passes through the center hole of the coil 5 and is adapted to be connected with the threaded hole on the bottom surface of the glue pouring cavity 4, the positioning block 9 is threadedly connected with the upper end of the glue pouring mandrel 8, and the coil 5 is pressed and positioned in the glue pouring cavity 4, and then the countersunk bolt 12 is sequentially passed through the countersunk hole on the right mold 3 and the through hole on the left mold 2, and then adapted to be connected with the butterfly nut 11 and tightened, and the installation of the coil 5 in the mold 1 is completed;

[0044] 3) Place the mold 1 with the coil 5 installed on the heating platform 13 and heat it to 100°C. At the same time, use a willow stick to inject epoxy potting glue into the injection hole 6, so that the pure glue liquid enters the glue potting groove 7 along the injection hole 6 under high temperature and then immerses into the glue potting cavity 4 until the glue liquid fills the entire coil 5 and is flush with the coil frame; use the heating platform 13 to improve the fluidity of the potting glue. After heating, the fluidity of the glue liquid can be increased, so that the glue liquid can smoothly enter the glue potting groove 7 from the injection hole 6 and then immerse into the glue potting cavity 4, until the glue liquid fills the entire coil frame;

[0045] 4) The operator uses heat-insulating rubber gloves to place the mold 1 filled with potting glue in the electric vacuum box 14 for drying. The coil 5 filled with glue is affected by the vacuum in the electric vacuum box 14, so that a large amount of air overflowing from the glue at the gap of the coil 5 and the trace bubbles contained in the potting glue itself are broken and overflowed and sucked away, and then the glue automatically fills the original gap and the space occupied by the bubbles; specifically, the vacuum degree of the electric vacuum box 14 is 86KPa~96KPa when working, and the electric vacuum box 14 is vacuumed for 15min~20min at an operating temperature of 30℃±5℃, and then the temperature is raised to 80℃±5℃ for drying for 1h, and then the temperature of the electric vacuum box 14 is reduced to room temperature 25℃ and the pressure is removed before the mold 1 can be taken out. If there are bubbles, just poke them;

[0046] 5) Perform secondary glue filling on the coil 5 that needs glue filling through the corresponding glue injection hole 6, so that the gaps and concave parts are filled with glue;

[0047] 6) Place the mold 1 equipped with the coil 5 and degassed by the electric vacuum box 14 in a high-temperature drying oven 15, and use a step-by-step heating method to perform high-temperature curing on the coil 5 after glue filling; specifically, the step-by-step heating method is as follows: raise the temperature in the high-temperature drying oven 15 to 110°C±2°C for 1 hour; then, raise the temperature in the high-temperature drying oven 15 to 150°C±2°C for 2 hours; then, raise the temperature in the high-temperature drying oven 15 to 165°C±2°C for 1 hour; finally, raise the temperature in the high-temperature drying oven 15 to 200°C±2°C for 2 hours, and demould after the high-temperature drying oven 15 cools down to room temperature;

[0048] 7) The left mold 2 and the right mold 3 are separated by using the notches 10 at both ends of the side walls on the opposite sides of the left mold 2 and the right mold 3, so as to complete the demoulding of the coil 5 and the cleaning after demoulding; by setting corresponding notches 10 on the plate surface at the outer edge of the side walls on the opposite sides of the left mold 2 and the right mold 3, conditions are provided for rapid demoulding after the glue is poured and dried, so as to facilitate demoulding and cleaning of the residual glue on the upper end surface of the skeleton and the installation line and the root.

[0049] The technical solution optimizes the process of the glue potting process, places the mold with the coil 5 into the electric heating vacuum box 14, and under the influence of vacuum, a large amount of air in the gap of the coil 5 overflows and is sucked away. At the same time, the trace bubbles contained in the epoxy potting glue itself burst and overflow, and the pure glue liquid is immersed in the glue potting cavity 4 in the mold 1, and the bubbles remaining in the gap of the coil 5 are squeezed out, so that the glue liquid in the coil 5 is filled evenly. In addition, high-temperature drying 15 performs step-by-step temperature increase on the coil 5, which can make the epoxy potting glue step-cured at an appropriate temperature, and can make the glue liquid fully cured at different high temperatures, thereby increasing the strength of the colloid and testing the physical properties of the colloid at high temperature. The design of the notch 10 on the mold 1 and the process of applying the release agent are convenient for demolding after the glue liquid is cured.

[0050] This solution achieves bubble-free potting of the coil 5 while ensuring that the shape of the potting colloid is regular, solving the problem of bubbles in the colloid after potting in the traditional way affecting the potting quality. After potting, the colloid has a regular shape, good potting consistency, and high potting efficiency.

[0051] The technical solution has a simple structure, novel design, and reasonable process, and overcomes the problems of poor colloid fluidity and bubbles generated during glue injection.

[0052] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0053] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. Coil potting device for high temperature servo valve, characterized by: The invention comprises a mold (1) formed by a left mold (2) and a right mold (3) which are detachably fixedly connected. The mold (1) is provided with a plurality of glue pouring cavities (4) whose openings are located on the upper end surface of the mold (1), and a coil (5) is centrally positioned and installed in the glue pouring cavity (4). The mold (1) is provided with a glue injection hole (6) which is located outside the glue pouring cavity (4) and is vertically arranged, and the opening of the glue injection hole (6) is located on the upper end surface of the mold (1). The glue injection hole (6) is connected to the glue pouring cavity (4) through a glue pouring groove (7) horizontally arranged inside the mold (1), and the glue pouring liquid heated and injected into the glue injection hole (6) is immersed in the glue pouring cavity (4) through the glue pouring groove (7), thereby realizing the pouring and sealing of the coil (5).

2. The coil potting device for a high temperature servo valve according to claim 1, characterized in that: The side walls of the left mold (2) and the right mold (3) facing each other are both provided with semicircular grooves with the same number and corresponding positions on the upper end faces, and when the left mold (2) and the right mold (3) are fixedly connected and molded, the two semicircles are butted to form a glue injection hole (6).

3. The coil potting device for a high temperature servo valve according to claim 2, characterized in that: The side walls of the left mold (2) and the right mold (3) facing each other are both provided with square grooves with the same number and corresponding positions on the upper end faces, and when the left mold (2) and the right mold (3) are fixedly connected and molded, the two square grooves are butted to form a glue injection cavity (4).

4. The coil potting device for a high temperature servo valve according to claim 3, characterized in that: The side walls of the left mold (2) and the right mold (3) facing each other are provided with a long groove located between the semicircular groove and the square groove, and when the left mold (2) and the right mold (3) are fixedly connected and molded, the two long grooves form a glue pouring groove (7).

5. The coil potting device for a high temperature servo valve according to claim 4, characterized in that: The depth of the groove on the upper side wall of the right mold (3) is greater than the depth of the groove on the upper side wall of the left mold (2); the bottom surface of the square groove on the right mold (3) is provided with a threaded hole located in the middle of the bottom surface of the glue pouring cavity (4) after the left mold (2) and the right mold (3) are molded together; the lower end of the glue pouring mandrel (8) with external threads at both ends passes through the center hole of the coil (5) and is adapted to be connected with the threaded hole; the positioning block (9) above the coil (5) is threadedly connected to the upper end of the glue pouring mandrel (8) and presses the coil (5) to be positioned in the glue pouring cavity (4).

6. The coil potting device for a high temperature servo valve according to claim 1, characterized in that: Notches (10) corresponding to the positions and used for opening the mold are formed at the edges of the side walls of the left mold (2) and the right mold (3) facing each other.

7. The coil potting device for a high temperature servo valve according to any one of claims 1 to 6, characterized in that: Countersunk holes are formed on both end plates of the outer wall of the right mold (3), and through holes corresponding to the positions of the countersunk holes are formed on the left mold (2). The right mold (3) and the left mold (2) are detachably fixedly connected as a whole by countersunk bolts (12) that pass through the countersunk holes and the through holes and are adapted to be connected to butterfly nuts (11) on the outer side of the left mold (2).

8. A filling method based on a coil filling device for a high temperature servo valve, characterized in that The following steps are involved: 1) Applying a mold release agent on the groove walls of the left mold (2) and the right mold (3) for forming the glue pouring cavity (4), the glue injection hole (6) and the glue pouring groove (7); 2) The side walls of the left mold (2) and the right mold (3) with the square grooves are arranged facing each other and fit together, the coil (5) is placed in each glue pouring cavity (4), and the lower end of the glue pouring mandrel (8) is passed through the center hole of the coil (5) and is adapted to be connected with the threaded hole on the bottom surface of the glue pouring cavity (4), the positioning block (9) is threadedly connected with the upper end of the glue pouring mandrel (8), and the coil (5) is pressed and positioned in the glue pouring cavity (4), and then the countersunk bolt (12) is passed through the countersunk hole on the right mold (3) and the through hole on the left mold (2) in turn, and is adapted to be connected with the butterfly nut (11) and tightened, thereby completing the installation of the coil (5) in the mold (1); 3) placing the mold (1) with the coil (5) installed on it on a heating platform (13) and heating it to 100° C., and at the same time, injecting epoxy potting glue into the injection hole (6), so that the pure glue liquid enters the glue potting groove (7) along the injection hole (6) under high temperature and then immerses into the glue potting cavity (4), until the glue liquid fills the entire coil (5) and is flush with the coil frame; 4) The operator uses heat-insulating rubber gloves to place the mold (1) filled with potting glue in an electric heating vacuum box (14) for drying. The coil (5) filled with the glue is affected by the vacuum in the electric heating vacuum box (14), so that a large amount of air overflowing from the glue at the gap of the coil (5) and a small amount of bubbles contained in the potting glue itself are broken and overflowed and are sucked away, and then the glue automatically fills the original gap and the space occupied by the bubbles; 5) Perform secondary glue filling on the coil (5) that needs glue filling through the corresponding glue injection hole (6), so that the gaps and concave parts are filled with glue; 6) placing the mold (1) equipped with the coil (5) and degassed in the electric vacuum box (14) in a high-temperature drying box (15), and performing high-temperature curing on the glue-filled coil (5) by using a step-by-step heating method; 7) The left mold (2) and the right mold (3) are separated by using the notches (10) at the two ends of the side walls facing each other, thereby completing the demoulding of the coil (5) and cleaning after demoulding.

9. The coil potting device for a high temperature servo valve according to claim 8, characterized in that: In the above step 4), the vacuum degree of the electric vacuum box (14) is 86KPa to 96KPa when it is working, and the electric vacuum box (14) is evacuated at a working temperature of 30°C ± 5°C for 15min to 20min, and then the temperature is raised to 80°C ± 5°C and dried for 1h, and then the temperature of the electric vacuum box (14) is lowered to room temperature 25°C and the pressure is removed before the mold (1) can be taken out.

10. The coil potting device for a high temperature servo valve according to claim 8, characterized in that: In the above step 6), the step-by-step heating method is as follows: the temperature in the high-temperature drying oven (15) is increased to 110°C±2°C for a duration of 1 hour; then, the temperature in the high-temperature drying oven (15) is increased to 150°C±2°C for a duration of 2 hours; then, the temperature in the high-temperature drying oven (15) is increased to 165°C±2°C for a duration of 1 hour; finally, the temperature in the high-temperature drying oven (15) is increased to 200°C±2°C for a duration of 2 hours.

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