Packaging structure, optical module and optical communication equipment

Abstract

The invention provides a packaging structure, an optical module and optical communication equipment, the packaging structure is a transistor-shaped packaging structure, and the packaging structure comprises a tube cap which is provided with a transparent window; the tube seat is matched with the tube cap to form a cavity structure; the HCSEL chip is arranged in the cavity structure, the plane where the HCSEL chip is located is parallel to the bearing surface of the tube seat, and an optical signal emitted by the HCSEL chip faces the transparent window; wherein a detection unit is arranged in the HCSEL chip, and the detection unit is used for detecting the power of an optical signal emitted by the HCSEL chip. The horizontal cavity surface laser chip integrated with the detection unit is arranged in the packaging structure, so that the most simplified packaging form is realized, the packaging process is simplified, and the packaging volume is reduced.

Description

Technical Field

[0001] The present application relates to the field of optical communications, and in particular to a packaging structure, an optical module and an optical communication device. Background Art

[0002] Optical communication devices are important hardware components in optical communication services, and their function is to realize the mutual conversion between electrical signals and optical signals. With the continuous acceleration of optical network services and the increase in the demand for smooth upgrades, the market has seen the coexistence of two or more generations of optical network products. For example, the compatibility and smooth transition of passive optical networks XG passive optical networks and 10G Ethernet passive optical networks, as well as higher-speed network services.

[0003] For the underlying optical devices, it is necessary to support the simultaneous transmission of multiple optical signals with different rates and wavelengths to meet the needs of coexistence of multiple ports with different rates and wavelengths. Therefore, the underlying optical devices require high-density and high-integration packaging requirements in different packaging forms. The current common packaging technologies include vertical three-dimensional technology and horizontal packaging technology. The above packaging technologies require multiple material components to be packaged multiple times, the process is complicated, the packaging takes a long time, and the packaging shape is large. Therefore, how to achieve high-density and high-integration packaging requirements is an urgent problem to be solved. Summary of the invention

[0004] The present application provides a packaging structure, an optical module and an optical communication device. By arranging a horizontal cavity surface laser chip with an integrated detection unit in the packaging structure, the most simplified packaging form is achieved, the packaging process is simplified, and the packaging volume is reduced.

[0005] In a first aspect, a packaging structure is provided, which is a transistor-shaped packaging structure, and includes: a tube cap, in which a transparent window is provided; a tube base, which cooperates with the tube cap to form a cavity structure; a horizontal cavity surface laser HCSEL chip, which is arranged in the cavity structure, wherein the plane where the HCSEL chip is located is parallel to the bearing surface of the tube base, and the optical signal emitted by the HCSEL chip is directed toward the transparent window; wherein a detection unit is provided in the HCSEL chip, and the detection unit is used to detect the optical signal power emitted by the HCSEL chip.

[0006] In the packaging structure provided in the present application, by setting the HCSEL chip, it is possible to emit a light signal toward the transparent window of the tube cap when the chip is set horizontally. In the packaging process, there is no need to add an additional optical reflector, which simplifies the packaging process and reduces the packaging volume. In addition, based on the use of the HCSEL chip, a detection unit is integrated on the HCSEL chip. In the packaging process, there is no need to add an additional monitoring backlight, which simplifies the packaging process, reduces the packaging volume, and achieves the simplest packaging form.

[0007] In combination with the first aspect, in some implementations of the first aspect, the HCSEL chip is in the form of an electro-absorption modulated laser EML, wherein: the HCSEL chip in the form of an EML includes a light emitting unit and an electro-absorption unit, the light emitting unit is used to emit a light beam, the electro-absorption unit is used to generate a photocurrent signal, the photocurrent signal is used to modulate the light beam to generate a light signal emitted by the HCSEL chip, wherein the detection unit is an electro-absorption unit, and the power of the light signal emitted by the HCSEL chip is determined according to the photocurrent signal. Thus, the power of the light signal emitted by the HCSEL chip can be detected by the photocurrent fed back by the electro-absorption unit, thereby achieving high density and high integration of the HCSEL chip, and no additional backlight monitoring is required in the packaging structure, thereby simplifying the packaging.

[0008] In combination with the first aspect, in some implementations of the first aspect, the horizontal cavity surface laser chip is in a distributed feedback DFB form, and in the HCSEL chip in the DFB form, the light detection unit is composed of a photoresistor. By arranging a photoresistor on the HCSEL chip to detect the power of the optical signal emitted by the HCSEL chip, the high density and high integration of the HCSEL chip are achieved, and there is no need to add an additional backlight monitor in the packaging structure, thereby simplifying the packaging.

[0009] In combination with the first aspect, in certain implementations of the first aspect, a horizontal cavity surface laser chip includes a first electrode, a second electrode and a semiconductor substrate, wherein the semiconductor substrate includes a first region, a second region and an isolation groove, the first region and the second region are respectively located on both sides of the isolation groove, wherein: a light-emitting layer and a reflective bevel are arranged in the first region, wherein: the light-emitting layer includes a first light-emitting edge and a second light-emitting edge, the first light-emitting edge is connected to one side of the semiconductor substrate, and the second light-emitting edge is connected to the reflective bevel; a detection unit is arranged in the second region, wherein: the detection unit and the light-emitting layer are located in the same plane.

[0010] Thus, by setting a detection unit in the chip, a high-density, high-integration chip structure is achieved. In addition, according to the division of the isolation groove, the first light emitting edge of the light-emitting layer is connected to the substrate of the semiconductor, and the light signal received by the second detection unit comes from the second light emitting edge of the light-emitting layer, that is, the light-emitting edge on the side of the reflective bevel in the specific HCSEL chip, thereby avoiding the placement of the isolation groove and the isolation area in the opposite direction of the light-emitting edge of the HCSEL chip to place the detection unit, thereby optimizing the chip structure and saving chip space. In the case where one of the side walls of the isolation groove is a reflective bevel, it is possible to further save space and optimize the structural design of the HCSEL chip.

[0011] In combination with the first aspect, in some implementations of the first aspect, the isolation groove includes a first side wall, and the first side wall is a reflective slope, that is, the specific position of the isolation groove is defined by the reflective slope, thereby saving space and optimizing the structural design of the HCSEL chip.

[0012] In combination with the first aspect, in certain implementations of the first aspect, a horizontal cavity surface laser chip includes a first electrode, a second electrode and a semiconductor substrate, wherein a light-emitting layer, a reflective bevel, a beam splitting unit and a light detection unit are provided in the semiconductor substrate, wherein: the light-emitting layer includes a first light emitting edge and a second light emitting edge, and the first emitting edge is connected to one side of the semiconductor substrate; the beam splitting unit includes an input port, a first output port and a second output port, the input port is connected to the second light emitting edge, the first output port is connected to the detection unit, and the second output port is connected to the reflective bevel.

[0013] By setting a detection unit in the chip, a high-density, high-integration chip structure is achieved. In addition, by setting a beam splitter on the second emission side of the semiconductor substrate, it is possible to avoid setting an isolation groove and an isolation area in the opposite direction of the light-emitting side of the HCSEL chip to place the detection unit, thereby optimizing the chip structure and saving chip space.

[0014] In combination with the first aspect, in some implementations of the first aspect, the packaging structure further includes a refrigerator, and the HCSEL chip is flatly attached to the refrigerator. The refrigerator is used to cool the HCSEL chip, thereby stabilizing the optical signal output of the HCSEL chip.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the HCSEL chip includes a light outlet, which is a spherical structure; or the reflective slope is a spherical structure. Thus, by integrating a lens or a structure having a similar effect to a lens on the chip, a high-density, high-integration chip structure is achieved.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, wherein:

[0017] The packaging structure is a single-transmit mode optical transmitter; or the packaging structure also includes one or more optical transmitter chips, and the packaging structure is a multi-transmit mode optical transmitter, thereby simplifying the packaging structure of the transmitting end, reducing the packaging volume, and reducing the cost of the optical device; or the packaging structure also includes one or more optical receiver chips, and the packaging structure is a one-transmit-one-receive mode or one-transmit-multiple-receive mode optical transmitter and receiver, thereby simplifying the packaging structure of the transmitting end and the receiving end, reducing the packaging volume, and reducing the cost of the optical device; or the packaging structure also includes one or more optical transmitter chips and one or more optical receiver chips, and the packaging structure is a multi-transmit-multiple-receive mode optical transmitter and receiver, thereby simplifying the packaging structure of the transmitting end and the receiving end, reducing the packaging volume, and reducing the cost of the optical device.

[0018] In a second aspect, an optical module is provided, comprising an electrical chip and the first aspect and any possible packaging structure thereof, wherein: the electrical chip is used to generate an electrical signal, the electrical signal carries data; and the HCSEL chip is used to generate an optical signal based on the electrical signal.

[0019] In combination with the second aspect, in certain implementations of the second aspect, it includes an electrical chip, an optical receiving component and the first aspect and any possible packaging structure thereof, wherein: the electrical chip is used to generate an electrical signal, and the electrical signal carries data; the HCSEL chip is used to generate an optical signal based on the electrical signal; the optical receiving component is used to receive another optical signal and convert it into another electrical signal; and the electrical chip is also used to obtain another data based on another electrical signal.

[0020] In a third aspect, an optical communication device is provided, comprising N boards, each of the N boards comprising one or more optical modules of the second aspect and any possible implementation thereof, and the third aspect and any possible implementation thereof.

[0021] In a fourth aspect, a packaging method is provided for preparing the packaging structure of the first aspect and any possible implementation thereof.

[0022] In a fifth aspect, an optical chip is provided, comprising a first electrode, a second electrode and a semiconductor substrate, wherein the semiconductor substrate comprises a first region, a second region and an isolation groove, the first region and the second region are respectively located on both sides of the isolation groove, wherein: a light-emitting layer and a reflective slope are arranged in the first region, wherein: the light-emitting layer comprises a first light-emitting edge and a second light-emitting edge, the first light-emitting edge is connected to one side of the semiconductor substrate, and the second light-emitting edge is connected to the reflective slope; a detection unit is arranged in the second region, wherein: the detection unit and the light-emitting layer are located in the same plane.

[0023] Thus, by setting a detection unit in the chip, a high-density, high-integration chip structure is achieved. In addition, according to the division of the isolation groove, the first light emitting edge of the light-emitting layer is connected to the substrate of the semiconductor, and the light signal received by the second detection unit comes from the second light emitting edge of the light-emitting layer, that is, the light-emitting edge on the side of the reflective bevel in the specific HCSEL chip, thereby avoiding the placement of the isolation groove and the isolation area in the opposite direction of the light-emitting edge of the HCSEL chip to place the detection unit, thereby optimizing the chip structure and saving chip space. In the case where one of the side walls of the isolation groove is a reflective bevel, it is possible to further save space and optimize the structural design of the HCSEL chip.

[0024] In conjunction with the fifth aspect, in certain implementations of the fifth aspect, the isolation groove includes a first side wall, and the first side wall is a reflective slope, that is, the specific position of the isolation groove is defined by the reflective slope, thereby saving space and optimizing the structural design of the HCSEL chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of an EML TO packaging structure provided in an embodiment of the present application.

[0026] Figure 2 It is a schematic diagram of another EML TO packaging method provided in an embodiment of the present application.

[0027] Figure 3 It is a schematic diagram of another EML TO packaging structure provided in an embodiment of the present application.

[0028] Figure 4 It is a schematic diagram of another EML TO packaging method provided in an embodiment of the present application.

[0029] Figure 5 It is a schematic diagram of a DFB TO packaging structure provided in an embodiment of the present application.

[0030] Figure 6 It is a schematic diagram of another EML TO packaging method provided in an embodiment of the present application.

[0031] Figure 7 It is a schematic diagram of a packaging structure of an HCSEL chip including an EML form provided in an embodiment of the present application.

[0032] Figure 8 It is a three-dimensional schematic diagram of a packaging structure of an HCSEL chip including an EML form provided in an embodiment of the present application.

[0033] Fig. 9 It is a schematic diagram of a packaging method of an HCSEL chip including an EML form provided in an embodiment of the present application.

[0034] Fig.10 It is a schematic diagram of a packaging structure of a HCSEL chip including a DFB form provided in an embodiment of the present application.

[0035] Fig.11 It is a three-dimensional schematic diagram of the packaging structure of the HCSEL chip including the DFB form provided in the embodiment of the present application.

[0036] Fig.12 It is a schematic diagram of a packaging method of a HCSEL chip including a DFB form provided in an embodiment of the present application.

[0037] Fig.13 It is a schematic diagram of the structure of an HCSEL chip provided in an embodiment of the present application.

[0038] Fig.14 It is a schematic diagram of the structure of another HCSEL chip provided in an embodiment of the present application.

[0039] Fig.15 It is a schematic diagram of the structure of another HCSEL chip provided in an embodiment of the present application.

[0040] Fig.16 It is a schematic diagram of a packaging structure provided in an embodiment of the present application as a light emitting device.

[0041] Fig.17 It is a schematic diagram of a packaging structure provided in an embodiment of the present application as an optical transceiver device.

[0042] Fig.18 This is an optical module provided in an embodiment of the present application.

[0043] Fig.19 This is another optical module provided in an embodiment of the present application.

[0044] Fig. 20 It is an optical communication device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0046] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0047] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0048] In the description of the embodiments of the present application, the terms "upper", "lower", "vertical", "horizontal", etc. indicate orientations or positional relationships that are defined relative to the orientations or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They may change accordingly according to changes in the orientations of the components placed in the drawings, and therefore cannot be understood as limitations on the present application.

[0049] The terms "including" and "having" and any variations thereof in the embodiments of the present application shown below are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0050] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions, and embodiments or designs described as "exemplary" or "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. The use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way for easy understanding.

[0051] In the embodiments of the present application, the same reference numerals are used to represent the same components or parts. In addition, the various parts in the drawings are not drawn to scale, and the sizes and dimensions of the parts shown in the drawings are only exemplary and should not be understood as limiting the present application.

[0052] Optical communication devices are important hardware components in optical communication services, and their function is to realize the mutual conversion between electrical signals and optical signals. With the continuous acceleration of optical network services and the increase in the demand for smooth upgrades, the market has seen the coexistence of two and more generations of optical network products. For example, the compatibility and smooth transition of passive optical networks XG passive optical networks (10-Gigabit PassiveOptical Network, XG PON) and 10G Ethernet passive optical networks (10G-ethernet passive opticalnetwork, 10G-EPON), as well as higher-speed network services. For underlying optical devices, it is necessary to support the simultaneous transmission of multiple optical signals with different rates and wavelengths to meet the needs of coexistence of multiple ports with different rates and wavelengths. Therefore, the underlying optical devices require high-density and high-integration packaging requirements in different packaging forms.

[0053] Optical modules are the core components of optical communication. The coaxial optical devices included in the optical modules are important optoelectronic devices for realizing the conversion of electrical and optical signals and optoelectronic signals. The packaging of coaxial optical devices can adopt transistor outline (TO) packaging. TO packaging has the characteristics of being relatively simple and low-cost, and is widely used in optical device products in the fields of PON, wireless, and network interconnection protocols. TO packaging includes multiple modes, such as: transmit optical sub-assembly (TOSA), receive optical sub-assembly (ROSA), bidirectional optical sub-assembly (BOSA), triplexer optical transceiver assembly, quad-optical sub-assembly (Quad-OSA), etc.

[0054] In the TO package structure, the laser chip is the core component, which is used to transmit optical signals. The laser chip can be classified into the electro-absorption modulation (EML) form and the distributed feedback (DFB) form according to the form. The following is a brief introduction to the EML package structure and the DFB package structure.

[0055] Figure 1 Schematic diagram of an EML TO packaging structure provided by an embodiment of the present application. It adopts traditional vertical three-dimensional packaging technology. The packaging structure includes a tube base 110, a refrigerator 120, a radio frequency signal substrate 130, a heat sink 140, a chip 150, a monitoring backlight 160, a first capacitor 170, a thermistor 180 and a second capacitor 190. Among them:

[0056] The base 110 has a surface on which a chip 150 and other passive components are carried.

[0057] The refrigerator 120 may specifically refer to a thermoelectric cooler (TEC), which utilizes the thermoelectric effect of semiconductor materials for cooling.

[0058] The radio frequency signal substrate 130 is used to transmit radio frequency signals.

[0059] The heat sink 140 is used to absorb and disperse heat.

[0060] The chip 150 may specifically refer to a chip on carrier (COC) on an EML substrate, which is used to receive an externally modulated electrical signal and convert the electrical signal into an optical signal for output.

[0061] The monitoring backlight 160 may specifically refer to a modulation photodiode (mPD), which is used to receive and detect the power of a modulated optical signal.

[0062] Figure 2 Schematic diagram of another EML TO packaging method provided by an embodiment of the present application. Figure 2 As shown, corresponding to Figure 1 The EML TO packaging structure includes steps S110-S170:

[0063] S110: Use silver glue to attach the cooler flatly to the tube holder; or use Au-Sn solder to fix the cooler eutectic to the tube holder and bake it at high temperature to complete the curing.

[0064] S120: Use silver glue to stick the heat sink upright on the surface of the cured refrigerator to complete high-temperature baking and curing.

[0065] S130: Use silver glue to stick the monitor backlight on the 8-degree slope of the heat sink and complete high-temperature baking and curing.

[0066] S140: Use silver glue to sequentially mount the first capacitor, the thermistor, and the second capacitor on one side of the heat sink, and complete high-temperature baking and curing.

[0067] S150: Use silver glue to mount the chip on the surface of the heat sink at 90 degrees, and then bake it at high temperature to solidify it again.

[0068] S160: When a separate RF signal substrate is used, the RF signal substrate 130 is mounted on the pillar of the tube holder at a 90-degree angle using silver glue, and then high-temperature baking and curing are completed.

[0069] S170: Complete the required gold wire bonding between all internal components and the external sealing welding caps.

[0070] Figure 3 Schematic diagram of another EML TO package structure provided by an embodiment of the present application. It adopts horizontal packaging. The package structure includes a tube base 210, a thermistor 220, a first capacitor 230, a monitoring backlight 240, a second capacitor 250, a refrigerator 260, an optical reflector 270, a chip 280 and a tube cap 290. Among them:

[0071] The base 210, thermistor 220, first capacitor 230, monitoring backlight 240, second capacitor 250, refrigerator 260 and chip 280 are connected to the Figure 1 The same is true in , so I will not repeat it here.

[0072] In addition, an optical reflector 270 is also provided in the horizontal packaging structure, which is used to change the emission direction of the optical signal of the chip 280 .

[0073] Figure 4 Schematic diagram of another EML TO packaging method provided by an embodiment of the present application. Figure 3 The EML TO packaging structure, the specific packaging process includes steps S210-S270:

[0074] S210: Use silver glue to attach the cooler flatly to the tube holder; or use Au-Sn solder to fix the cooler eutectic to the tube holder, and bake it at high temperature to complete the curing.

[0075] S220: Use silver glue to stick the chip flat on the refrigerator and bake it at high temperature to solidify it.

[0076] S230: Attach the optical reflector flatly to the chip at an angle of 45°, place the optical reflector in front of the laser diode of the chip, and bake at high temperature for curing.

[0077] S240: Attach the side-light-collecting monitoring backlight flatly behind the laser diode of the chip and bake it at high temperature to solidify it.

[0078] S250: Use silver glue to stick the transition pad flat on the refrigerator and bake it at high temperature to fix it.

[0079] S260: stacking thermistor, first capacitor, second capacitor and other components flatly on the transition pad in sequence, and baking at high temperature to solidify.

[0080] S270: Complete the required gold wire bonding between all internal components and the external sealing welding caps.

[0081] Figure 5 Schematic diagram of a DFB TO package structure provided in an embodiment of the present application. It adopts traditional vertical three-dimensional packaging technology, and the package structure includes a tube seat 310, a pad 320, a monitoring backlight 330, a tube cap 340, a substrate 350, and a chip 360. Among them:

[0082] The tube socket 310 may specifically refer to a DFB stamping tube socket, on which the chip 360 and other passive components are packaged.

[0083] The spacer 320 is used to adjust the position of the chip 360 .

[0084] The chip 360 may specifically refer to a DFB chip.

[0085] Other components such as monitoring backlight 330, cap 340 and Figure 1 and Figure 2 Similar, no further elaboration is required here.

[0086] Figure 6 Schematic diagram of another EML TO packaging method provided by an embodiment of the present application. Figure 5 The EML TO packaging structure, the specific packaging process includes steps S310-S340:

[0087] S310: Use silver glue to stick the pad obliquely on the tube holder with an 8-degree groove bevel.

[0088] S320: Lay the monitoring backlight layer flat on the pad, and bake it at high temperature to solidify it.

[0089] S330: stack the substrate and chip at 90 degrees in sequence and lay them flat on the pillar of the tube holder to complete eutectic fixation.

[0090] S340: Complete the required gold wire bonding between all internal components and the external sealing welding caps.

[0091] Among the above three packaging structures, EML vertical three-dimensional technology packaging requires multiple material components to be packaged multiple times, the process is complicated, the packaging is time-consuming, and the packaging shape is large; EML horizontal packaging requires an external optical reflector, the process is complicated, and the packaging volume is large; DFB vertical three-dimensional technology packaging requires the addition of gaskets and stamped tube sockets, the packaging is complicated, the process is complicated, it is time-consuming, the packaging cost is high, and the packaging volume is large.

[0092] In view of this, the present application provides a packaging structure, an optical module and an optical communication device, which realizes the simplest packaging form, simplifies the packaging process and reduces the packaging volume by arranging a horizontal cavity surface laser chip with an integrated detection unit in the packaging structure.

[0093] The present application provides a packaging structure, which is a transistor outline (TO) packaging structure, and the packaging structure includes:

[0094] The tube cap and the tube seat cooperate to form a cavity structure, wherein a transparent window is arranged in the tube cap.

[0095] The horizontal cavity surface-emitting laser (HCSEL) chip is arranged in the cavity structure formed by the tube cap and the tube base. The plane where the HCSEL chip is located is parallel to the bearing surface of the tube base, and the optical signal emitted by the HCSEL chip is directed toward the transparent window, so that the optical signal is transmitted outward through the transparent window arranged on the tube cap. In the HCSEL chip, a detection unit is arranged, or it can also be called an integrated photo detector (PD). The detection unit is used to detect the power of the optical signal emitted by the HCSEL chip.

[0096] In the packaging structure provided in the present application, by setting the HCSEL chip, it is possible to emit a light signal toward the transparent window of the tube cap when the chip is set horizontally. In the packaging process, there is no need to add an additional optical reflector, which simplifies the packaging process and reduces the packaging volume. In addition, based on the use of the HCSEL chip, a detection unit is integrated on the HCSEL chip. In the packaging process, there is no need to add an additional monitoring backlight, which simplifies the packaging process, reduces the packaging volume, and achieves the simplest packaging form.

[0097] Next, the packaging structure of the present application is described in conjunction with the HCSEL chip being an EML-type HCSEL chip, specifically the HCSEL chip being a DFB-type HCSEL chip.

[0098] Figure 7 Schematic diagram of a packaging structure of an HCSEL chip including an EML in an embodiment of the present application. Figure 7 As shown, the packaging structure includes a tube base 710, a cooler 720, a substrate 730, an HCSEL chip 740, a tube cap 750, a spacer 760 and a thermistor 770.

[0099] The tube base 710 and the tube cap 750 cooperate to form a cavity structure. The plane where the HCSEL chip 740 is located is parallel to the bearing surface of the tube base, and the optical signal emitted by the HCSEL chip is directed toward the transparent window, so that the optical signal is transmitted outward through the transparent window set on the tube cap.

[0100] The HCSEL chip 740 specifically refers to an HCSEL chip in the form of an EML, which includes a light emitting unit and an electric absorption unit. The light emitting unit is used to emit a light beam, and the electric absorption unit is used to generate a photocurrent signal. The photocurrent signal generated by the electric absorption unit is used to modulate the light beam emitted by the light emitting unit to generate a light signal emitted by the HCSEL chip. In this case, the detection unit is the electric absorption unit. The power of the light signal emitted by the HCSEL chip is determined according to the photocurrent signal. Under the same operating point voltage, the greater the current input to the HCSEL chip, the greater the power of the light signal emitted by the HCSEL chip, and the greater the photocurrent generated by the electric absorption unit. The two are positively correlated, indicating that the photocurrent signal generated by the electric absorption unit can play a role similar to an integrated light detector and can be used as a detection unit. Therefore, the light signal power emitted by the HCSEL chip can be detected by the photocurrent fed back by the electric absorption unit, thereby achieving high density and high integration of the HCSEL chip, and no additional backlight monitoring is required in the packaging structure, simplifying the packaging.

[0101] Specifically, the plane where the HCSEL chip 740 is located is parallel to the bearing surface of the tube holder, which can be understood as any of the following forms, or other forms similar to any of the following forms:

[0102] (a) The HCSEL chip 740 is flatly attached to the supporting surface of the tube holder 710;

[0103] (b) The packaging structure further includes a refrigerator 720, which is disposed on the supporting surface of the tube holder, and the HCSEL chip 740 is flatly attached to the refrigerator 720;

[0104] (c) A substrate 720 is disposed on the supporting surface of the tube holder 710, and the HCSEL chip 730 is flatly attached to the substrate 720;

[0105] (d) A substrate 730 is disposed on the supporting surface of the tube holder 710, a cooler is mounted on the surface of the substrate 730, and an HCSEL chip 740 is flatly attached to the cooler.

[0106] In such Figure 7 In the structure shown, the transparent window provided on the tube cap 750 can be as follows Figure 7 As shown in (a), it is a lens structure for focusing the optical signal emitted by the HCSEL chip 740 so that the optical signal is collimated. Figure 7 As shown in (b), it is a window without any structure, or a window including a transparent medium, and the present application does not limit this. In this case, the lens interface can be set on the light outlet of the HCSEL chip 740. The specific setting method will be described later in conjunction with Fig.15 Provide explanation.

[0107] Figure 8 It is a three-dimensional schematic diagram of a packaging structure of an HCSEL chip including an EML form provided in an embodiment of the present application. Figure 8 The tube holder 810, thermistor 820, tube cap 830, cooler 840 and HCSEL chip 850 are provided with Figure 7 The middle tube holder 710, thermistor 770, tube cap 750, cooler 720 and HCSEL chip 740 correspond to each other and will not be described in detail here.

[0108] Fig. 9 Schematic diagram of a packaging method for an HCSEL chip in the form of an EML provided in an embodiment of the present application. Figure 7 and Figure 8 The packaging structure includes steps S910 to S940.

[0109] S910: Use silver glue to stick the cooler flat on the tube holder and bake it at high temperature to solidify it.

[0110] S920: Use silver glue to mount the carrier board and chip stack on the surface of the cooler.

[0111] S930: On top of the cooler, the pads and thermistors are stacked one on one side of the chip to complete high-temperature baking and curing.

[0112] S940: Complete the required gold wire bonding connections between internal components and weld the external tube caps to complete the package.

[0113] In the packaging structure and method of the HCSEL chip in the above-mentioned EML form, by setting the HCSEL chip, it is possible to transmit an optical signal toward the transparent window of the tube cap when the chip is set horizontally. During the packaging process, there is no need to add an additional optical reflector, which simplifies the packaging process and reduces the packaging volume. In addition, on the basis of using the HCSEL chip, the photocurrent signal fed back by the absorption unit of the HCSEL chip in the EML form is used as feedback. During the packaging process, there is no need to add an additional monitoring backlight, which simplifies the packaging process and reduces the packaging volume. In addition, the HCSEL chip can be directly flat on the tube seat, and the lead is directly connected to the signal pin made of light, without adding a radio frequency signal substrate to ensure high-speed signal drainage. Alternatively, the HCSEL chip can be directly flat on the refrigerator, without adding a heat sink to guide the heat dissipation. Thereby achieving the simplest packaging form.

[0114] Fig.10 FIG. 1 is a schematic diagram of a packaging structure of a HCSEL chip including a DFB form provided in an embodiment of the present application. Fig.10 As shown, the packaging structure includes a tube base 1010 , a substrate 1020 , an HCSEL chip 1030 and a tube cap 1040 .

[0115] The tube base 1010 and the tube cap 1040 cooperate to form a cavity structure. The plane where the HCSEL chip 1030 is located is parallel to the bearing surface of the tube base, and the optical signal emitted by the HCSEL chip is directed toward the transparent window, so that the optical signal is transmitted outward through the transparent window provided on the tube cap.

[0116] HCSEL chip 1030 specifically refers to a DFB-type HCSEL chip, which realizes single-mode optical signal output by introducing periodic refractive index modulation in the waveguide structure. In the DFB-type HCSEL chip, the detection unit can be composed of a photoresistor. By setting a photoresistor on the HCSEL chip, the optical signal power emitted by the HCSEL chip can be detected, thereby realizing high density and high integration of the HCSEL chip, and no additional backlight monitoring is required in the packaging structure, simplifying the packaging. The integrated structure of the specific chip is then combined with Figures 13 to 14 Provide explanation.

[0117] Specifically, the plane where the HCSEL chip 1030 is located is parallel to the bearing surface of the tube holder, which can be understood as any of the following forms, or other forms similar to any of the following forms:

[0118] (a) The HCSEL chip 1030 is flatly attached to the supporting surface of the tube holder 1010;

[0119] (b) The packaging structure further includes a refrigerator, which is disposed on the supporting surface of the tube holder, and the HCSEL chip 1030 is flatly attached to the refrigerator;

[0120] (c) A substrate 1020 is disposed on the supporting surface of the tube holder 1010, and the HCSEL chip 1030 is flatly attached to the substrate 1020;

[0121] (d) A substrate 1020 is disposed on the supporting surface of the tube holder 1010 , a cooler is mounted on the surface of the substrate 1020 , and an HCSEL chip 1030 is flatly attached to the cooler.

[0122] In such Fig.10 In the structure shown, the transparent window provided on the tube cap 1040 can be as follows Fig.10 As shown in (a), it is a lens structure, which is used to focus the optical signal emitted by the HCSEL chip 1030 so that the optical signal is collimated and emitted. Fig.10 As shown in (b), it is a window without any structure, or a window including a transparent medium, and the present application does not limit this. In this case, the lens structure can be integrated on the HCSEL chip 1030. The specific setting method will be described later in conjunction with Fig.15 Provide explanation.

[0123] Fig.11It is a three-dimensional schematic diagram of the packaging structure of the HCSEL chip including the DFB form provided in the embodiment of the present application. Fig.11 The tube base 1110, substrate 1120, HCSEL chip 1130 and tube cap 1140 are provided with Fig.10 The middle tube holder 1010, the substrate 1020, the HCSEL chip 1030 and the tube cap 1040 correspond to each other and are not described in detail here.

[0124] Fig.12 Schematic diagram of a packaging method for a HCSEL chip in a DFB form provided in an embodiment of the present application. Fig.10 and Fig.11 The packaging structure includes steps S1010 and S1020.

[0125] S1210: Attach the HCSEL chip flatly to the tube socket; or attach the substrate flatly to the tube socket, and then stack the HCSEL chip on the substrate and attach it flatly; or attach the cooler flatly to the tube socket, and then stack the HCSEL chip on the cooler and attach it flatly; or attach the substrate flatly to the tube socket, and then stack the cooler on the substrate and then stack the HCSEL chip on the cooler and attach it flatly.

[0126] S1220: Complete the required gold wire bonding connections between internal components and weld the external tube caps to complete the package.

[0127] In the packaging structure and method of the HCSEL chip in the above-mentioned DFB form, by setting the HCSEL chip, it is possible to emit a light signal toward the transparent window of the tube cap when the chip is set horizontally. During the packaging process, there is no need to add an additional optical reflector, which simplifies the packaging process and reduces the packaging volume. In addition, on the basis of using the HCSEL chip, a detection unit is integrated on the HCSEL chip. During the packaging process, there is no need to add an additional monitoring backlight, which simplifies the packaging process and reduces the packaging volume. In addition, there is no need to add extra resistors or capacitors, and the simplest packaging form is achieved.

[0128] Fig.13 Schematic diagram of the structure of a HCSEL chip provided in an embodiment of the present application. Fig.13 As shown, the HCSEL chip includes a first electrode 1310, a second electrode 1320 and a semiconductor substrate 1330. The first electrode 1310 and the second electrode 1320 may be disposed on the same surface or different surfaces of the semiconductor substrate 1330. The first electrode 1310 may refer to a P-type metal, and the second electrode 1330 may refer to an N-type metal. In some implementations, the first electrode 1310 may include a P-type metal and an InGaAsP material, which is not limited in the present application.

[0129] In some implementations, the HCSEL chip further includes a light reflecting element. The light reflecting element is used to form a resonant cavity in the first region, and after the photons are amplified by the mode selection of the resonant cavity, an outgoing light signal is formed. The specific structure of the light reflecting element can be as follows: Fig.13 (a) and Fig.13 (b) There are two ways of composition. Fig.13 In (a), the light reflecting element includes a deep reactive ion etching (DRB) grating 1341. Fig.13 In (b), the light reflecting element includes a high reflectivity (HR) film 1341 attached to one side of the semiconductor substrate 1330. In some implementations, an anti-reflection (AR) film 1342 is also attached to one side of the light outlet. In some implementations, such as Fig.13 The methods shown in (a) and (b) can be combined with each other, and this application does not limit this.

[0130] The semiconductor substrate 1330 specifically includes a first region, a second region and an isolation trench 1370. The first region and the second region are located on both sides of the isolation trench 1370, that is, the first region and the second region are isolated by the isolation trench 1370. The division of the first region and the second region can refer to Fig.13 (e). Among them:

[0131] The first region is provided with a light-emitting layer 1350. The light-emitting layer 1350 may be composed of an active material or an active material connected to a passive material. The light-emitting layer 1350 includes a first light-emitting edge and a second light-emitting edge, the first light-emitting edge is connected to one side of the semiconductor substrate, and the second light-emitting edge is connected to the reflective bevel 1380. In the light-emitting layer, the second light-emitting edge is used to emit a first light signal. After the second laser emitting edge emits a light signal, a portion of the light signal passes through the connected reflective bevel 1380 to form a second light signal perpendicular to the plane where the HCSEL chip is located, and is emitted from the HCSEL chip, and a portion of the light signal passes through the connected reflective bevel 1380 to form a third light signal parallel to the plane where the HCSEL chip is located, passes through the isolation groove 1370, and enters the second region.

[0132] The second region is provided with a detection unit 1360, wherein the detection unit 1360 and the light emitting layer 1350 are located in the same plane, so as to receive the third light signal entering the second region and detect the light signal. Fig.13As shown in (d), the detection unit 1360 may include an amplification unit 1370, which may be a semiconductor optical amplifier (SOA) for amplifying the third optical signal, thereby facilitating the detection unit to perform optical detection.

[0133] It should be understood that the present application does not limit the location of the isolation groove 1370. The isolation groove is used to isolate the light-emitting layer in the first area and the detection unit in the second area to prevent problems such as photoelectric crosstalk. In some implementations, the isolation groove includes a first side wall, and the first side wall is a reflective slope 1380. That is, the specific location of the isolation groove is defined by the reflective slope, thereby saving space and optimizing the structural design of the HCSEL chip.

[0134] It should be understood that the present application does not limit the specific angle of the reflective bevel 1380 in the first region, for example, the angle of the reflective bevel 1380 may be 45°. In some cases, the reflective bevel 1380 may also refer to a reflector. In some cases, the reflective bevel 1380 is formed by etching.

[0135] It should be understood that the present application does not limit the specific emission position of the second optical signal on the HCSEL chip. In some cases, the HCSEL chip includes a light outlet, which is used to output the second optical signal. The present application does not limit the specific position of the light outlet. For example, Fig.13 As shown in (a), (b) and (d), the first plane of the semiconductor substrate 1330 may be a plane of the semiconductor substrate 1330 adjacent to the first electrode 1310. Alternatively, Fig.13 As shown in (c), the second plane of the semiconductor substrate 1330 may be a plane of the semiconductor substrate 1330 adjacent to the second electrode 1320. The specific position of the light outlet is determined according to the reflective slope 1380.

[0136] In such Fig.13 In the structure shown, a high-density, high-integration chip structure is achieved by setting a detection unit in the chip. In addition, according to the division of the isolation groove, the first light emitting edge of the light-emitting layer is connected to the substrate of the semiconductor, and the light signal received by the second detection unit comes from the second light emitting edge of the light-emitting layer, that is, the light-emitting edge specifically located on the side of the reflective bevel in the specific HCSEL chip, thereby avoiding the placement of the isolation groove and the isolation area in the opposite direction of the light-emitting edge of the HCSEL chip to place the detection unit, thereby optimizing the chip structure and saving chip space. In the case where one of the side walls of the isolation groove is a reflective bevel, it is possible to further save space and optimize the structural design of the HCSEL chip.

[0137] Fig.14Schematic diagram of another HCSEL chip provided in the embodiment of the present application. Fig.14 As shown, the HCSEL chip includes a first electrode 1410, a second electrode 1420 and a semiconductor substrate 1430. The specific configuration of the first electrode 1410 and the second electrode 1420 is similar to Fig.13 The first electrode 1310 and the second electrode 1320 are similar to those in FIG. 1 , and the light reflecting element 1441 is arranged similar to those in FIG. Fig.13 The arrangement of the light reflecting element 1341 is similar and will not be described again. The semiconductor substrate 1430 specifically includes a light emitting layer 1450 , a detection unit 1460 , a beam splitting unit 1470 and a reflective slope 1480 .

[0138] in, Fig.14 The middle light emitting layer 1450 includes a first light emitting edge and a second light emitting edge, and the first light emitting edge is connected to one side of the semiconductor substrate.

[0139] The light splitting unit 1470 is used to perform light splitting processing on the first optical signal output from the second optical emission side, and includes an input port, a first output port, and a second output port. The specific configuration of the light splitting unit 1470 is as follows: Fig.14 (a) Cross-sectional view from the side and Fig.14 (b) is a cross-sectional view from a top view:

[0140] The input port of the beam splitter unit 1470 is connected to the second light emitting edge, the first output port is connected to the detection unit, and the second output port is connected to the reflective bevel 1480. Thus, after the first optical signal is input into the beam splitter unit from the input port, a portion of the optical signal is output from the first output port, and a portion of the optical signal is output from the second output port. Part of the signal light output from the second port is reflected from the reflective bevel 1480 to form a second optical signal perpendicular to the plane where the HCSEL chip is located, and is emitted from the HCSEL chip. The third optical signal output from the first port is input into the detection unit, and the detection unit performs optical detection on the third optical signal. Among them, the beam splitter unit can also refer to a beam splitter, and the light splitting ratio of the first output port and the second output port can be adjusted.

[0141] In some implementations, the detection unit 1460 includes an amplification unit, Fig.13 Similarly, the amplification unit is used to amplify the third optical signal, thereby facilitating the detection unit to perform optical detection.

[0142] In such Fig.14 In the structure shown, a high-density, high-integration chip structure is achieved by setting a detection unit in the chip. In addition, by setting a beam splitting unit on the second emission side of the semiconductor substrate, it is possible to avoid setting an isolation groove and an isolation area in the opposite direction of the light-emitting side of the HCSEL chip to place the detection unit, thereby optimizing the chip structure and saving chip space.

[0143] It should be understood that Fig.13 , 14 The optical signals (the first optical signal, the second optical signal and the third optical signal) described in the specification may specifically refer to laser signals, or other forms of optical signals, and the present application does not impose any limitation on this.

[0144] Fig.15 Schematic diagram of another HCSEL chip provided in the embodiment of the present application. Fig.15 As shown, the HCSEL chip includes a first electrode, a second electrode, a light reflecting element and a semiconductor substrate. The semiconductor substrate includes a light emitting layer and a reflective slope 1520. The specific arrangement of the first electrode, the second electrode, the light reflecting element, and the specific arrangement of the reflective slope 1520 included in the semiconductor substrate are as follows: Fig.13 and Fig.14 Similar, no further elaboration is required here.

[0145] In some implementations, such as Fig.15 As shown in (a), (b) and (c), the HCSEL chip includes a light outlet, which is a curved surface structure. The specific position of the light outlet is determined according to the reflective bevel 1520. The present application does not limit the specific position of the light outlet. The light outlet is used to output the light signal emitted by the HCSEL chip. After passing through the curved surface structure of the light outlet, the light signal is focused, thereby achieving an effect similar to that of an optical lens, so that the light signal is collimated and emitted from the HCSEL chip. It should be understood that the present application does not limit how to prepare the light outlet as a curved surface structure. In, for example Fig.15 In the case of (a) and (b), the spherical structure is formed by solidification of the adhesive, or it can also be understood as a glue dripping method, that is, using low-refractive index glue to solidify to form a spherical structure, thereby realizing a low-cost and easy-to-prepare spherical structure preparation solution. Fig.15 In case (a), there is an isolation groove 1530 or other uneven topography near the light outlet of the HCSEL chip. In this case, low-refractive-index glue can be used for flattening first, and then a glue drop method can be used to form a curved surface structure at the light outlet of the HCSEL chip. Fig.15 In case (c), the spherical structure is formed by etching the substrate.

[0146] In some implementations, such as Fig.15As shown in (d), a light outlet is provided in the HCSEL chip, and the light outlet has a periodic arrangement structure. The HCSEL chip includes a light outlet, which is used to output the optical signal emitted by the HCSEL chip. After passing through the periodic arrangement structure of the light outlet, the far-field divergence angle of the optical signal is small, thereby achieving an effect similar to that of an optical lens, so that the optical signal is collimated and emitted from the HCSEL chip. In some cases, the periodic arrangement structure is formed by metasurface technology.

[0147] In some implementations, such as Fig.15 As shown in (e) and (f), the reflective bevel 1520 is a curved surface structure, and the reflective bevel 1520 is used to reflect the light signal emitted by the light-emitting layer included in the HCSEL chip. After passing through the curved surface structure of the reflective bevel 1520, the light signal is focused, thereby achieving an effect similar to that of an optical lens, so that the light signal is collimated and emitted from the HCSEL chip. In some cases, the curved surface structure of the reflective bevel 1520 is formed using a grayscale exposure process or other similar processes.

[0148] In such Fig.15 The structural schematic diagram of the HCSEL chip shown in , by integrating a lens or a structure having a similar effect to a lens on the chip, a high-density, high-integration chip structure is achieved.

[0149] The above describes the packaging structure and HCSEL chip structure of the present application in combination with specific embodiments. Next, the specific implementation mode of the packaging structure of the present application is described.

[0150] In some implementations, the package structure may include only one HCSEL chip, and the package structure is a light emitting device in a single-shot mode.

[0151] In some implementations, the packaging structure includes one or more light emitting chips in addition to an HCSEL chip, and the packaging structure is a multi-mode light emitting device, thereby simplifying the packaging structure of the transmitting end, reducing the packaging volume, and reducing the cost of the optical device.

[0152] In some implementations, the packaging structure includes, in addition to an HCSEL chip, one or more optical receiving chips, and the packaging structure is an optical transceiver device in a one-transmit-one-receive mode or a one-transmit-multiple-receive mode, thereby simplifying the packaging structure of the transmitting end and the receiving end, reducing the packaging volume, and reducing the cost of the optical device.

[0153] In some implementations, the packaging structure also includes one or more optical transmitting chips and one or more optical receiving chips. The packaging structure is a multi-transmitting and multi-receiving optical transceiver device, thereby simplifying the packaging structure of the transmitting end and the receiving end, reducing the packaging volume, and reducing the cost of the optical device.

[0154] Fig.161 is a schematic diagram of a case where a packaging structure provided by an embodiment of the present application is a light emitting device. That is, the packaging structure includes an HCSEL chip 1620 and one or more light emitting chips. The HCSEL chip and the light emitting chip in the packaging structure are used to output an optical signal according to the received electrical signal. The one or more light emitting chips can be any chip for emitting an optical signal, such as a vertical cavity surface emitting laser chip, a Fabry-Perot laser chip, an EML chip, a DFB chip, etc., or Figure 13-15 In the HCSEL chip described in the specification, one or more light emitting chips may be the same or different, and this application does not limit this.

[0155] In some implementations, such as Fig.16 As shown in (a), the HCSEL chip and one or more light emitting chips may be located in different planes. The HCSEL chip and one or more light emitting chips may be arranged at different positions of the substrate 1610. Fig.16 In the case shown in (a), the transmission paths of the optical signals emitted by the HCSEL chip 1620 and the optical emitting chip 1640 overlap.

[0156] In some implementations, such as Fig.16 As shown in (b) and (c), the HCSEL chip and one or more light emitting chips may be located in the same plane. Fig.16 As shown in (b) and (c), the HCSEL chip 1620 and the light emitting chip 1640 can be arranged on the same position of the substrate 1610. In some implementations, the transparent window of the cap 1630 can include multiple optical lenses to ensure that the optical signal is collimated and emitted from the packaging structure. Alternatively, the optical lens can also be as shown in FIG. Fig.15 As shown, it is integrated on the HCSEL chip and the light emitting chip, and this application does not limit this.

[0157] Among them, the mounting methods of HCSEL chips, optical transmitter chips and optical receiver chips in optical transceiver devices can be active mounting and passive mounting. Active mounting can be understood as a packaging structure including optical elements with active functions, such as optical modulators, etc. Through active coupling, the unification of multiple light beams in different dimensions can be achieved, that is, the overall package appears to the outside as a single-beam optical path element containing different optical signals. Passive mounting can be understood as a packaging structure that only includes optical elements with passive functions, such as optical isolators, splitters, optical switches, etc. Through passive mounting, the unification of multiple light beams in different dimensions can be achieved, that is, the overall package appears to the outside as a single-beam optical path element containing different optical signals.

[0158] Fig.171 is a schematic diagram of a packaging structure provided in an embodiment of the present application as an optical transceiver device. That is, the packaging structure includes at least an HCSEL chip 1710 and an optical receiving chip. In some implementations, the packaging structure may also include one or more optical receiving chips.

[0159] The HCSEL chip and the optical emission chip in the package structure are used to output optical signals according to the received electrical signals. The optical receiving chip is used to convert the received optical signals into electrical signals and output them. One or more optical emission chips can be any chip for emitting optical signals, such as a vertical cavity surface emitting laser chip, a Fabry-Perot laser chip, an EML chip, a DFB chip, etc., or Figure 13-15 The HCSEL chip described in the present application is not limited to this. One or more light emitting chips may be the same or different, and the present application is not limited to this. One or more light receiving chips may be photodiode chips, photomultiplier tube chips, for example, avalanche photodiode (APD) chips, and the present application is not limited to this. One or more light receiving chips may be the same or different, and the present application is not limited to this.

[0160] In some implementations, such as Fig.17 As shown in (a), at least one column is provided in the packaging structure, wherein the column carries a first chip, and the column is used to adjust the position height of the first chip so that the optical signal emitted by the first chip is aligned with the transparent window provided in the tube cap 1720, or the first chip can receive the optical signal emitted from the transparent window provided in the tube cap 1720, wherein the first chip can be an optical receiving chip, an optical emitting chip, and Figure 13-15 Any of the HCSEL chips described in .

[0161] In some implementations, such as Fig.17 As shown in (a), (b), (c) and (d), at least one prism is provided in the packaging structure, and the prism in the at least one prism can be arranged between the second chip and the transparent window provided in the tube cap 1720, and the prism in the at least one prism is used to adjust the light transmission path between the tube cap and the second chip, so that the light signal emitted by the second chip is aligned with the transparent window provided in the tube cap 1720, or the first chip can receive the light signal emitted from the transparent window provided in the tube cap 1720, wherein the second chip can be a light receiving chip, a light emitting chip and as shown in FIG. Figure 13-15 Any of the HCSEL chips described in .

[0162] The specific arrangement and position of the columns and prisms are determined according to the actual situation. Fig.17As shown in (a), a column and a prism can be provided in the packaging structure so that the light receiving chip 1730 receives the light signal emitted from the transparent window provided in the tube cap 1720. Fig.17 As shown in (b), a set of prisms (two prisms) can be provided in the packaging structure so that the light receiving chip 1730 receives the light signal emitted from the transparent window provided in the tube cap 1720. Fig.17 As shown in (d), two groups of prisms (two prisms in each group) can be provided in the packaging structure so that the optical receiving chips 1731 and 1732 can respectively receive the optical signal emitted from the transparent window provided in the tube cap 1720 through their respective corresponding prism groups.

[0163] In some implementations, such as Fig.17 As shown in (c), the packaging structure also includes a sub-packaging structure, and a third chip is arranged in the sub-packaging structure. The third chip can be a light receiving chip, a light emitting chip, and Figure 13-15 Any of the HCSEL chips described in .

[0164] Among them, the mounting methods of HCSEL chips, optical transmitter chips and optical receiver chips in optical transceiver devices can be active mounting and passive mounting. Active mounting can be understood as a packaging structure including optical elements with active functions, such as optical modulators, etc. Through active coupling, the unification of multiple light beams in different dimensions can be achieved, that is, the overall package appears to the outside as a single-beam optical path element containing different optical signals. Passive mounting can be understood as a packaging structure that only includes optical elements with passive functions, such as optical isolators, splitters, optical switches, etc. Through passive mounting, the unification of multiple light beams in different dimensions can be achieved, that is, the overall package appears to the outside as a single-beam optical path element containing different optical signals.

[0165] In addition, the present application also provides an optical module and an optical communication device, including the above Figure 5-12 or Figure 16-17 Describe the package structure.

[0166] Fig.18 is an optical module provided in an embodiment of the present application, such as Fig.18 As shown, the optical module includes an electric chip 1810 and the above-mentioned packaging structure 1820. The electric chip 1810 is electrically connected to the HCSEL chip in the packaging structure 1820, wherein the electric chip 1810 is used to generate an electric signal, the electric signal carries data, and the HCSEL chip is used to generate an optical signal according to the electric signal. Thus, the optical signal emitted by the HCSEL chip is modulated by the electric chip 1810 to complete the photoelectric conversion of the signal.

[0167] In the package structure, for example Figure 16-17In the case of the integrated structure described in, the electrical chip 1810 can be electrically connected to any chip included in the packaging structure 1820, so that any optical transmitting chip can transmit a corresponding optical signal according to the electrical signal generated by the electrical chip 1810, and any optical receiving chip can convert the received optical signal into another electrical signal, and the electrical chip 1810 can convert the other electrical signal into corresponding data.

[0168] Fig.19 is another optical module provided in the embodiment of the present application, such as Fig.19 As shown, the optical module includes an electrical chip 1910, a light receiving component 1920 and the above-mentioned packaging structure 1930. Among them:

[0169] The electric chip 1910 is electrically connected to the HCSEL chip in the package structure, wherein the electric chip is used to generate an electric signal, the electric signal carries data, and the HCSEL chip is used to generate an optical signal according to the electric signal, so that the optical signal emitted by the HCSEL chip is modulated by the electric chip to complete the photoelectric conversion of the signal.

[0170] The electrical chip 1910 is electrically connected to the optical receiving component 1920, and the optical receiving component 1920 is used to receive another optical signal and convert it into another electrical signal, and the electrical chip 1910 is used to obtain another data according to the other electrical signal. Thus, the electrical chip processes the optical signal received by the optical receiving component to obtain data.

[0171] Fig. 20 is an optical communication device provided in an embodiment of the present application. Fig. 20 As shown, it includes N boards, for example Fig. 20 In (a), board 1, board 2, ..., board N are shown. Each of the N boards includes one or more Fig.18 or Fig.19 The optical module described. Fig. 20 The single board 1 shown in (b) specifically includes an optical module 1, an optical module 2, ..., an optical module M. Each optical module includes a packaging structure. The specific form of the optical communication device is determined according to actual conditions, for example, it can be an optical transmission device, an optical access device, an optical switching device, etc.

[0172] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

Claims

1. A packaging structure, characterized in that: The packaging structure is a transistor-shaped packaging structure, and the packaging structure includes: a tube cap having a transparent window disposed therein; A tube seat, cooperating with the tube cap to form a cavity structure; A horizontal cavity surface laser HCSEL chip is arranged in the cavity structure, the plane where the HCSEL chip is located is parallel to the bearing surface of the tube holder, and the optical signal emitted by the HCSEL chip is directed toward the transparent window; Wherein, a detection unit is provided in the HCSEL chip, and the detection unit is used to detect the power of the optical signal emitted by the HCSEL chip.

2. The packaging structure according to claim 1, characterized in that: The HCSEL chip is in the form of an electro-absorption modulated laser (EML), wherein: The HCSEL chip in the form of an EML includes a light emitting unit and an electro-absorption unit, wherein the light emitting unit is used to emit a light beam, and the electro-absorption unit is used to generate a photocurrent signal, and the photocurrent signal is used to modulate the light beam to generate a light signal emitted by the HCSEL chip, wherein the detection unit is the electro-absorption unit, and the power of the light signal emitted by the HCSEL chip is determined according to the photocurrent signal.

3. The packaging structure according to claim 1, characterized in that: The horizontal cavity surface laser chip is in a distributed feedback DFB form. In the HCSEL chip in the DFB form, the light detection unit is composed of a photoresistor.

4. The packaging structure according to claim 3, characterized in that: The horizontal cavity surface laser chip comprises a first electrode, a second electrode and a semiconductor substrate, wherein the semiconductor substrate comprises a first region, a second region and an isolation groove, the first region and the second region are respectively located on both sides of the isolation groove, wherein: The first region is provided with a light-emitting layer and a reflective inclined surface, wherein: The light emitting layer comprises a first light emitting edge and a second light emitting edge, the first light emitting edge is connected to one side of the semiconductor substrate, and the second light emitting edge is connected to the reflective inclined surface; The detection unit is arranged in the second area, wherein: The detection unit and the light-emitting layer are located in the same plane.

5. The packaging structure according to claim 4, characterized in that: The isolation groove includes a first side wall, and the first side wall is the reflective inclined surface.

6. The packaging structure according to claim 3, characterized in that: The horizontal cavity surface laser chip comprises a first electrode, a second electrode and a semiconductor substrate, wherein a light emitting layer, a reflection slope, a beam splitting unit and the light detection unit are arranged in the semiconductor substrate, wherein: The light emitting layer comprises a first light emitting edge and a second light emitting edge, wherein the first light emitting edge is connected to one side of the semiconductor substrate; The light splitting unit comprises an input port, a first output port and a second output port, the input port is connected to the second light emitting edge, the first output port is connected to the detection unit, and the second output port is connected to the reflective inclined surface.

7. The packaging structure according to any one of claims 1 to 6, characterized in that: The packaging structure also includes a refrigerator, and the HCSEL chip is flatly attached to the refrigerator.

8. The packaging structure according to any one of claims 1 to 7, characterized in that: in: The HCSEL chip comprises a light outlet, and the light outlet is a spherical structure; or The reflecting inclined surface is a spherical structure.

9. The packaging structure according to claim 8, characterized in that: in: The package structure is a light emitting device in a single-shot mode; or The packaging structure further includes one or more light emitting chips, and the packaging structure is a light emitting device in a multi-emission mode; or The packaging structure further includes one or more optical receiving chips, and the packaging structure is an optical transceiver device in a one-transmit-one-receive mode or a one-transmit-multiple-receive mode; or The packaging structure also includes one or more optical transmitting chips and one or more optical receiving chips. The packaging structure is an optical transceiver device in a multi-transmit and multi-receive mode.

10. An optical module, characterized in that: The invention comprises an electric chip and a packaging structure as claimed in any one of claims 1 to 9, wherein: The electrical chip is used to generate an electrical signal, and the electrical signal carries data; The HCSEL chip is used to generate an optical signal according to the electrical signal.

11. An optical module, characterized in that: The invention comprises an electric chip, a light receiving component and a packaging structure as claimed in any one of claims 1 to 9, wherein: The electrical chip is used to generate an electrical signal, and the electrical signal carries data; The HCSEL chip is used to generate an optical signal according to the electrical signal; The optical receiving component is used to receive another optical signal and convert it into another electrical signal; The electrical chip is further used to obtain another data according to the another electrical signal.

12. An optical communication device, characterized in that: It comprises N single boards, each of the N single boards comprises one or more optical modules as claimed in claim 10 or 11.

13. A packaging method, characterized in that: Used to prepare a packaging structure as described in any one of claims 1 to 9.

14. An optical chip, characterized in that: The device comprises a first electrode, a second electrode and a semiconductor substrate, wherein the semiconductor substrate comprises a first region, a second region and an isolation trench, the first region and the second region are respectively located on two sides of the isolation trench, wherein: The first region is provided with a light-emitting layer and a reflective inclined surface, wherein: The light emitting layer comprises a first light emitting edge and a second light emitting edge, the first light emitting edge is connected to one side of the semiconductor substrate, and the second light emitting edge is connected to the reflective inclined surface; A detection unit is provided in the second area, wherein: The detection unit and the light-emitting layer are located in the same plane.

15. The optical chip according to claim 14, characterized in that: The isolation groove includes a first side wall, and the first side wall is the reflective inclined surface.

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