Solvent-based photosensitive dry film acrylic resin for PCB (Printed Circuit Board) and preparation method of solvent-based photosensitive dry film acrylic resin

Abstract

The invention relates to solvent-based photosensitive dry film acrylic resin for a PCB (Printed Circuit Board) and a preparation method of the solvent-based photosensitive dry film acrylic resin, and belongs to the technical field of photosensitive dry films. The solvent-based photosensitive dry film acrylic resin for the PCB comprises the following components: modified acrylic resin, modified white carbon black, a reaction monomer, a photoinitiator, an antioxidant, a defoaming agent and deionized water, according to the solvent-based photosensitive dry film acrylic resin for the PCB, the white carbon black is modified, an organic group with higher thermal stability is introduced, and meanwhile, the dispersity and compatibility of the white carbon black in a system are improved by utilizing the compatibilizer, so that the mechanical strength and high-temperature resistance of a film material are remarkably enhanced.

Description

Technical Field

[0001] The invention belongs to the technical field of photosensitive dry films and relates to a solvent-based photosensitive dry film acrylic resin for PCB and a preparation method thereof. Background Art

[0002] Photosensitive dry film plays a vital role in the production process of printed circuit boards. It is a key raw material. In order to meet the special needs of circuit boards working in long-term high-temperature environments, photosensitive dry films must exhibit excellent high-temperature resistance and strong adhesion. In order to meet these requirements, some specific high-temperature resistant fillers are usually added to the coating of photosensitive dry film, such as white carbon black, silicon nitride, aluminum oxide and zirconium oxide. In addition, epoxy resin prepolymers with excellent adhesion properties are selected and further enhanced by photocuring. However, in the application of acrylic resin, if the amount of epoxy group used is too much, it may have a negative impact on the material's high-temperature yellowing resistance and aging resistance. In order to overcome this problem, people try to add some fillers to make up for the defects. However, these fillers often have poor fluidity in acrylic resins and are prone to agglomeration, making it difficult to disperse evenly. This poor dispersion problem will ultimately limit the further improvement of high-temperature resistance, thereby affecting the performance and reliability of the entire circuit board. Summary of the invention

[0003] The object of the present invention is to provide a solvent-sensitive photosensitive dry film acrylic resin for PCB and a preparation method thereof. The solvent-sensitive photosensitive dry film acrylic resin for PCB prepared by the present invention significantly enhances the mechanical strength and high temperature resistance of the film material by modifying white carbon black and introducing an organic group with stronger thermal stability, and by using a compatibilizer to improve the dispersion and compatibility of white carbon black in the system.

[0004] The purpose of the present invention can be achieved through the following technical solutions:

[0005] A solvent-sensitive photosensitive dry film acrylic resin for PCB includes the following components in parts by weight: 62-70 parts of modified acrylic resin, 9-10 parts of modified white carbon black, 21-24 parts of reactive monomers, 0.4-0.6 parts of photoinitiators, 0.2-0.3 parts of antioxidants, 0.4-0.6 parts of defoaming agents and 7-10 parts of deionized water;

[0006] As a preferred technical solution of the present invention, the reaction monomer is formed by mixing triethylene glycol diacrylate and tetrahydrofuran methacrylate in a mass ratio of 1.5:1; the photoinitiator is photoinitiator 1173; the antioxidant is hindered phenol antioxidant AO-80; and the defoaming agent is fatty alcohol polyoxyethylene ether.

[0007] The invention discloses a method for preparing the modified white carbon black, comprising the following steps:

[0008] Step S1, mixing white carbon black, anhydrous ethanol and a silane coupling agent, filtering out a solid, washing it with anhydrous ethanol for three times, and drying it to obtain silane-modified white carbon black;

[0009] Step S2, under a nitrogen atmosphere, adding anhydrous ethanol, coniferyl aldehyde and an initiator to the silane-modified silica, stirring the mixture at a constant temperature, centrifuging, washing with anhydrous ethanol for three times, and placing the mixture in an oven for vacuum drying to obtain prefabricated silica;

[0010] Step S3, after mixing dianisidine and anhydrous ethanol, add prefabricated white carbon black, heat and stir, filter out the solid, wash it with anhydrous ethanol for 3 times, vacuum dry it, add a compatibilizer, melt extrude it, and pelletize it to obtain modified white carbon black.

[0011] As a preferred technical solution of the present invention, in step S1, the stirring and mixing is stirring at a speed of 500-600 r / min for 30-40 min; and the drying is vacuum drying at a temperature of 80° C. to constant weight.

[0012] As a preferred technical solution of the present invention, in step S1, the mass ratio of white carbon black, anhydrous ethanol and silane coupling agent is 15-16:50-60:6.5-7.3; the silane coupling agent is mercaptopropylmethyldimethoxysilane.

[0013] As a preferred technical solution of the present invention, in step S2, the constant temperature stirring is stirring at a temperature of 40-45°C for 5-6h; and the vacuum drying is vacuum drying at a temperature of 80°C to constant weight.

[0014] As a preferred technical solution of the present invention, in step S2, the mass ratio of the silane-modified white carbon black, anhydrous ethanol, coniferyl aldehyde and initiator is 22-24:70-80:5.2-6.0:0.22-0.24; and the initiator is ammonium cerium nitrate.

[0015] As a preferred technical solution of the present invention, in step S3, the heating and stirring is stirring at a temperature of 50-60°C for 6-7h; and the temperature of the melt extrusion is 190-200°C.

[0016] As a preferred technical solution of the present invention, in step S3, the mass ratio of the dianisidine, anhydrous ethanol, prefabricated white carbon black and the compatibilizer is 1.6-1.8:30-40:11-12:20-22; the compatibilizer is a terpolymer of styrene-methyl methacrylate-glycidyl methacrylate.

[0017] The invention discloses a preparation method of the modified acrylic resin, comprising the steps of stirring and mixing acrylic acid, butyl methacrylate, methacrylic acid, sodium dodecyl sulfate, silane coupling agent NQ-62 and deionized water at a rotation speed of 900-1000 r / min for 60-80 min, adding initiator VA-044 and stirring at a constant temperature of 82-86° C. for 2-3 h to obtain the modified acrylic resin.

[0018] As a preferred technical solution of the present invention, the mass ratio of acrylic acid, butyl methacrylate, methacrylic acid, silane coupling agent NQ-62, initiator VA-044, sodium dodecyl sulfate and deionized water is 11-13:12-15:25-29:4.4-4.6:0.6-0.8:1.2-1.5:50-60.

[0019] The invention discloses a method for preparing the solvent-sensitive photosensitive dry film acrylic resin for PCB, comprising the following steps: uniformly mixing modified acrylic resin, modified white carbon black, reactive monomer, photoinitiator, antioxidant, defoamer and deionized water, and curing to obtain the solvent-sensitive photosensitive dry film acrylic resin.

[0020] Beneficial effects of the present invention:

[0021] The solvent-sensitive photosensitive dry film acrylic resin for PCB prepared by the present invention significantly enhances the mechanical strength and high temperature resistance of the film material by modifying white carbon black and introducing an organic group with stronger thermal stability, and by using a compatibilizer to improve the dispersion and compatibility of white carbon black in the system. DETAILED DESCRIPTION

[0022] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention are described in detail below in combination with the embodiments.

[0023] Example 1

[0024] A solvent-sensitive photosensitive dry film acrylic resin for PCB comprises the following components in parts by weight: 62 parts of modified acrylic resin, 9 parts of modified white carbon black, 21 parts of reactive monomers, 0.4 parts of photoinitiators, 0.2 parts of antioxidants, 0.4 parts of defoaming agents and 7 parts of deionized water; the reactive monomers are prepared by mixing triethylene glycol diacrylate and tetrahydrofuran methacrylate in a mass ratio of 1.5:1; the photoinitiator is photoinitiator 1173; the antioxidant is hindered phenol antioxidant AO-80; and the defoaming agent is fatty alcohol polyoxyethylene ether.

[0025] The preparation method of the modified acrylic resin comprises the following steps: stirring and mixing acrylic acid, butyl methacrylate, methacrylic acid, sodium dodecyl sulfate, silane coupling agent NQ-62 and deionized water at a rotation speed of 900 r / min for 60 minutes, adding initiator VA-044 and stirring at a constant temperature of 82° C. for 2 hours to obtain the modified acrylic resin; wherein the mass ratio of acrylic acid, butyl methacrylate, methacrylic acid, silane coupling agent NQ-62, initiator VA-044, sodium dodecyl sulfate and deionized water is 11:12:25:4.4:0.6:1.2:50.

[0026] The preparation method of the modified white carbon black comprises the following steps:

[0027] Step S1, mixing white carbon black, anhydrous ethanol and a silane coupling agent, filtering out solids, washing with anhydrous ethanol for 3 times, and drying to obtain silane-modified white carbon black; wherein the mixing is; the drying is vacuum drying at 80° C. to constant weight; the mass ratio of the white carbon black, anhydrous ethanol and the silane coupling agent is 15:50:6.5; the silane coupling agent is mercaptopropylmethyldimethoxysilane;

[0028] Step S2, under a nitrogen atmosphere, adding anhydrous ethanol, coniferyl aldehyde and an initiator to the silane-modified silica, mixing and stirring at a constant temperature, centrifuging, washing with anhydrous ethanol for 3 times, placing in an oven for vacuum drying, and obtaining prefabricated silica; wherein the constant temperature stirring is stirring at a temperature of 40° C. for 5 hours; the vacuum drying is vacuum drying at a temperature of 80° C. to constant weight; the mass ratio of the silane-modified silica, anhydrous ethanol, coniferyl aldehyde and initiator is 22:70:5.2:0.22; the initiator is ammonium cerium nitrate;

[0029] Step S3, after mixing dianisidine and anhydrous ethanol, add prefabricated silica and heat and stir, filter out the solid, wash it with anhydrous ethanol for 3 times, vacuum dry it, add a compatibilizer, melt extrude it, and pelletize it to obtain modified silica; wherein the heating and stirring is stirring at a temperature of 50°C for 6 hours; the temperature of the melt extrusion is 190°C; the mass ratio of dianisidine, anhydrous ethanol, prefabricated silica and compatibilizer is 1.6:30:11:20; the compatibilizer is a styrene-methyl methacrylate-glycidyl methacrylate terpolymer.

[0030] A method for preparing a solvent-sensitive photosensitive dry film acrylic resin for PCB comprises the following steps: uniformly mixing modified acrylic resin, modified white carbon black, reactive monomer, photoinitiator, antioxidant, defoamer and deionized water, and curing to obtain the solvent-sensitive photosensitive dry film acrylic resin for PCB.

[0031] Example 2

[0032] A solvent-sensitive photosensitive dry film acrylic resin for PCB comprises the following components in parts by weight: 66 parts of modified acrylic resin, 9.5 parts of modified white carbon black, 22 parts of reactive monomers, 0.5 parts of photoinitiators, 0.25 parts of antioxidants, 0.5 parts of defoaming agents and 8 parts of deionized water; the reactive monomers are prepared by mixing triethylene glycol diacrylate and tetrahydrofuran methacrylate in a mass ratio of 1.5:1; the photoinitiator is photoinitiator 1173; the antioxidant is hindered phenol antioxidant AO-80; and the defoaming agent is fatty alcohol polyoxyethylene ether.

[0033] The preparation method of the modified acrylic resin comprises the following steps: stirring and mixing acrylic acid, butyl methacrylate, methacrylic acid, sodium dodecyl sulfate, silane coupling agent NQ-62 and deionized water at a rotation speed of 950 r / min for 70 minutes, adding initiator VA-044 and stirring at a constant temperature of 84° C. for 2.5 hours to obtain the modified acrylic resin; wherein the mass ratio of acrylic acid, butyl methacrylate, methacrylic acid, silane coupling agent NQ-62, initiator VA-044, sodium dodecyl sulfate and deionized water is 12:14:27:4.5:0.7:1.4:55.

[0034] The preparation method of the modified white carbon black comprises the following steps:

[0035] Step S1, mixing white carbon black, anhydrous ethanol and a silane coupling agent, filtering out solids, washing with anhydrous ethanol for 3 times, and drying to obtain silane-modified white carbon black; wherein the mixing is; the drying is vacuum drying at 80° C. to constant weight; the mass ratio of the white carbon black, anhydrous ethanol and the silane coupling agent is 15.5:55:6.9; the silane coupling agent is mercaptopropylmethyldimethoxysilane;

[0036] Step S2, under a nitrogen atmosphere, adding anhydrous ethanol, coniferyl aldehyde and an initiator to the silane-modified silica, mixing and stirring at a constant temperature, centrifuging, washing with anhydrous ethanol for 3 times, placing in an oven for vacuum drying, and obtaining prefabricated silica; wherein the constant temperature stirring is stirring at a temperature of 42° C. for 5.5 hours; the vacuum drying is vacuum drying at a temperature of 80° C. to constant weight; the mass ratio of the silane-modified silica, anhydrous ethanol, coniferyl aldehyde and initiator is 23:75:5.6:0.23; the initiator is ammonium cerium nitrate;

[0037] Step S3, after mixing dianisidine and anhydrous ethanol, add prefabricated silica and heat and stir, filter out the solid and wash it with anhydrous ethanol for 3 times, vacuum dry, add a compatibilizer and melt extrude it, and pelletize it to obtain modified silica; wherein the heating and stirring is stirring at a temperature of 55°C for 6.5h; the temperature of the melt extrusion is 195°C; the mass ratio of dianisidine, anhydrous ethanol, prefabricated silica and compatibilizer is 1.7:35:11.5:21; the compatibilizer is a styrene-methyl methacrylate-glycidyl methacrylate terpolymer.

[0038] A method for preparing a solvent-sensitive photosensitive dry film acrylic resin for PCB comprises the following steps: uniformly mixing modified acrylic resin, modified white carbon black, reactive monomer, photoinitiator, antioxidant, defoamer and deionized water, and curing to obtain the solvent-sensitive photosensitive dry film acrylic resin for PCB.

[0039] Example 3

[0040] A solvent-sensitive photosensitive dry film acrylic resin for PCB comprises the following components in parts by weight: 70 parts of modified acrylic resin, 10 parts of modified white carbon black, 24 parts of reactive monomers, 0.6 parts of photoinitiators, 0.3 parts of antioxidants, 0.6 parts of defoaming agents and 10 parts of deionized water; the reactive monomers are prepared by mixing triethylene glycol diacrylate and tetrahydrofuran methacrylate in a mass ratio of 1.5:1; the photoinitiator is photoinitiator 1173; the antioxidant is hindered phenol antioxidant AO-80; and the defoaming agent is fatty alcohol polyoxyethylene ether.

[0041] The preparation method of the modified acrylic resin comprises the following steps: stirring and mixing acrylic acid, butyl methacrylate, methacrylic acid, sodium dodecyl sulfate, silane coupling agent NQ-62 and deionized water at a rotation speed of 1000 r / min for 80 minutes, adding initiator VA-044 and stirring at a constant temperature of 86° C. for 3 hours to obtain the modified acrylic resin; wherein the mass ratio of acrylic acid, butyl methacrylate, methacrylic acid, silane coupling agent NQ-62, initiator VA-044, sodium dodecyl sulfate and deionized water is 13:15:29:4.6:0.8:1.5:60.

[0042] The preparation method of the modified white carbon black comprises the following steps:

[0043] Step S1, mixing white carbon black, anhydrous ethanol and a silane coupling agent, filtering out solids, washing with anhydrous ethanol for 3 times, and drying to obtain silane-modified white carbon black; wherein the mixing is; the drying is vacuum drying at 80° C. to constant weight; the mass ratio of the white carbon black, anhydrous ethanol and the silane coupling agent is 16:60:7.3; the silane coupling agent is mercaptopropylmethyldimethoxysilane;

[0044] Step S2, under a nitrogen atmosphere, adding anhydrous ethanol, coniferyl aldehyde and an initiator to the silane-modified silica, mixing and stirring at a constant temperature, centrifuging, washing with anhydrous ethanol for 3 times, placing in an oven for vacuum drying, and obtaining prefabricated silica; wherein the constant temperature stirring is stirring at a temperature of 45° C. for 6 hours; the vacuum drying is vacuum drying at a temperature of 80° C. to constant weight; the mass ratio of the silane-modified silica, anhydrous ethanol, coniferyl aldehyde and initiator is 24:80:6.0:0.24; the initiator is ammonium cerium nitrate;

[0045] Step S3, after mixing dianisidine and anhydrous ethanol, add prefabricated silica and heat and stir, filter out the solid, wash it with anhydrous ethanol for 3 times, vacuum dry it, add a compatibilizer, melt extrude it, and pelletize it to obtain modified silica; wherein the heating and stirring is stirring at a temperature of 60°C for 7h; the temperature of the melt extrusion is 200°C; the mass ratio of dianisidine, anhydrous ethanol, prefabricated silica and compatibilizer is 1.8:40:12:22; the compatibilizer is a terpolymer of styrene-methyl methacrylate-glycidyl methacrylate.

[0046] A method for preparing a solvent-sensitive photosensitive dry film acrylic resin for PCB comprises the following steps: uniformly mixing modified acrylic resin, modified white carbon black, reactive monomer, photoinitiator, antioxidant, defoamer and deionized water, and curing to obtain the solvent-sensitive photosensitive dry film acrylic resin for PCB.

[0047] Comparative Example 1

[0048] Compared with Example 3, the difference in Comparative Example 1 is that step S1 does not use mercaptopropylmethyldimethoxysilane, and the other components, preparation steps and parameters are the same.

[0049] Comparative Example 2

[0050] Compared with Example 3, the difference in Comparative Example 2 is that step S2 does not use coniferyl aldehyde, and the remaining components, preparation steps and parameters are the same.

[0051] Comparative Example 3

[0052] Compared with Example 3, the difference of Comparative Example 3 is that aniline is used instead of dianisidine in step S3, and the other components, preparation steps and parameters are the same.

[0053] Comparative Example 4

[0054] Compared with Example 3, the difference in Comparative Example 4 is that step S3 does not use dianisidine, and the other components, preparation steps and parameters are the same.

[0055] Comparative Example 5

[0056] Compared with Example 3, the difference in Comparative Example 5 is that step S3 does not use styrene-methyl methacrylate-glycidyl methacrylate terpolymer, and the other components, preparation steps and parameters are the same.

[0057] Comparative Example 6

[0058] Compared with Example 3, Comparative Example 6 is different in that the silane coupling agent NQ-62 is not used, and the other components, preparation steps and parameters are the same.

[0059] The photosensitive dry film acrylic resins prepared in Examples 1-3 and Comparative Examples 1-6 were tested as follows. The test results are shown in Table 1.

[0060] Tensile strength test: The tensile properties of the cured film of photosensitive dry film acrylic resin were measured using a UTM5000 electronic universal testing machine. Samples with a size of 20mm×10mm×0.5mm were used, and the crosshead speed was set to 10mm / min. Each sample was measured three times, and the average value was calculated as the final result.

[0061] High temperature resistance test: Bake at 260℃ for 60min and test the change rate of tensile strength.

[0062] Table 1

[0063] Tensile strength(MPa) Tensile strength after baking (MPa) Example 1 30.6 30.3 Example 2 30.8 30.6 Example 3 30.9 30.7 Comparative Example 1 25.6 21.4 Comparative Example 2 26.4 21.7 Comparative Example 3 25.2 21.1 Comparative Example 4 24.5 18.4 Comparative Example 5 24.8 17.6 Comparative Example 6 25.6 20.2

[0064] From the test results in Table 1, it can be seen that the mechanical strength and thermal stability of the photosensitive dry film acrylic resin prepared in Examples 1-3 are significantly better than those in Comparative Examples 1-6. In the present invention, the surface of white carbon is modified by mercaptopropylmethyldimethoxysilane to make its surface hydrophobic, and a high temperature resistant active functional group mercapto is introduced, and a covalent bond is formed with coniferyl aldehyde through a click reaction. The oxygen-containing functional group on coniferyl aldehyde forms a physical crosslink with the silane-modified white carbon through hydrogen bonding and electrostatic action. The other end introduces a high-strength and high temperature resistant biphenyl structure and Schiff base structure through the interaction between the aldehyde group and the amino group of dianisidine. The epoxy group of the styrene-methyl methacrylate-glycidyl methacrylate terpolymer can react with the hydroxyl group of the prefabricated white carbon to form a chemical bond. The styrene phase has good physical compatibility with prefabricated silica, which further increases the binding force of the modified silica in the acrylic resin system and forms a denser structure. In addition, the methyl methacrylate phase and the glycidyl methacrylate phase have good compatibility with the acrylic resin. The silane coupling agent NQ-62 in the modified acrylic resin not only participates in the polymerization reaction of the acrylic resin, but the amino group introduced by it also has good compatibility with the redundant aldehyde group and Schiff base structure of the prefabricated silica, which effectively promotes the dispersion and compatibility of the modified silica in the system, thereby significantly improving the mechanical properties and high temperature resistance of the membrane material.

[0065] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any indirect modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A solvent-sensitive photosensitive dry film acrylic resin for PCB, characterized in that: The invention comprises the following components in parts by weight: 62-70 parts of modified acrylic resin, 9-10 parts of modified white carbon black, 21-24 parts of reactive monomers, 0.4-0.6 parts of photoinitiator, 0.2-0.3 parts of antioxidant, 0.4-0.6 parts of defoamer and 7-10 parts of deionized water; wherein the preparation method of the modified acrylic resin comprises stirring and mixing acrylic acid, butyl methacrylate, methacrylic acid, sodium dodecyl sulfate, silane coupling agent NQ-62 and deionized water at a speed of 900-1000 r / min for 60-80 minutes, adding initiator VA-044 and stirring at a constant temperature of 82-86°C for 2-3 hours to obtain the modified acrylic resin.

2. The solvent-sensitive photosensitive dry film acrylic resin for PCB according to claim 1, characterized in that: The reaction monomer is prepared by mixing triethylene glycol diacrylate and tetrahydrofuran methacrylate in a mass ratio of 1.5:

1.

3. The solvent-sensitive photosensitive dry film acrylic resin for PCB according to claim 1, characterized in that: The photoinitiator is photoinitiator 1173; the antioxidant is hindered phenol antioxidant AO-80; and the defoaming agent is fatty alcohol polyoxyethylene ether.

4. The solvent-sensitive photosensitive dry film acrylic resin for PCB according to claim 1, characterized in that: The preparation method of the modified white carbon black comprises the following steps: Step S1, mixing white carbon black, anhydrous ethanol and a silane coupling agent, filtering out a solid, washing it with anhydrous ethanol for three times, and drying it to obtain silane-modified white carbon black; Step S2, under a nitrogen atmosphere, adding anhydrous ethanol, coniferyl aldehyde and an initiator to the silane-modified silica, stirring the mixture at a constant temperature, centrifuging, washing with anhydrous ethanol for three times, and placing the mixture in an oven for vacuum drying to obtain prefabricated silica; Step S3, after mixing dianisidine and anhydrous ethanol, add prefabricated white carbon black, heat and stir, filter out the solid, wash it with anhydrous ethanol for 3 times, vacuum dry it, add a compatibilizer, melt extrude it, and pelletize it to obtain modified white carbon black.

5. The solvent-sensitive photosensitive dry film acrylic resin for PCB according to claim 4, characterized in that: In step S1, the stirring and mixing is performed at a speed of 500-600 r / min for 30-40 min; the drying is performed at a temperature of 80° C. under vacuum until constant weight is reached; the mass ratio of the white carbon black, anhydrous ethanol and silane coupling agent is 15-16:50-60:6.5-7.3; and the silane coupling agent is mercaptopropylmethyldimethoxysilane.

6. The solvent-sensitive photosensitive dry film acrylic resin for PCB according to claim 4, characterized in that: In step S2, the constant temperature stirring is stirring at 40-45°C for 5-6h; the vacuum drying is vacuum drying at 80°C to constant weight; the mass ratio of the silane-modified white carbon black, anhydrous ethanol, coniferyl aldehyde and initiator is 22-24:70-80:5.2-6.0:0.22-0.24; and the initiator is ammonium cerium nitrate.

7. The solvent-sensitive photosensitive dry film acrylic resin for PCB according to claim 4, characterized in that: In step S3, the heating and stirring is stirring at a temperature of 50-60°C for 6-7h; the temperature of the melt extrusion is 190-200°C; the mass ratio of the dianisidine, anhydrous ethanol, prefabricated white carbon black and the compatibilizer is 1.6-1.8:30-40:11-12:20-22; and the compatibilizer is a terpolymer of styrene-methyl methacrylate-glycidyl methacrylate.

8. The solvent-sensitive photosensitive dry film acrylic resin for PCB according to claim 1, characterized in that: In the preparation of the modified acrylic resin, the mass ratio of acrylic acid, butyl methacrylate, methacrylic acid, silane coupling agent NQ-62, initiator VA-044, sodium dodecyl sulfate and deionized water is 11-13:12-15:25-29:4.4-4.6:0.6-0.8:1.2-1.5:50-60.

9. A method for preparing a solvent-sensitive photosensitive dry film acrylic resin for PCB according to any one of claims 1 to 8, characterized in that: The preparation method comprises the following steps: uniformly mixing modified acrylic resin, modified white carbon black, reactive monomer, photoinitiator, antioxidant, defoamer and deionized water, and curing to obtain the product.