Control method and system for multiple exposure of PS on substrate and storage medium

Abstract

The invention relates to a control method and system for multiple exposure of PS on a substrate and a storage medium, and relates to the technical field of liquid crystal displayers, and the method comprises the following steps: carrying out first exposure on the substrate based on preset halftone exposure parameters; developing the substrate after the first exposure; after the pattern is formed, performing second exposure on the substrate; and baking the substrate based on preset baking parameters. The invention has the effect of reducing the influence on the PS characteristic in the manufacturing process.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid crystal displays, and in particular to a control method, system and storage medium for multiple exposures of PS on a substrate. Background Art

[0002] Liquid Crystal Display (LCD) is a flat panel display device that uses the optical properties of liquid crystal to display images. Thin-Film-Transistor Liquid Crystal Display (TFT-LCD) is a type of liquid crystal display, which is widely used in consumer electronics, televisions, industrial control and medical equipment.

[0003] TFT-LCD includes a substrate portion, a liquid crystal layer, a polarizing plate, a backlight source, and a driving circuit, and the substrate portion includes an array substrate (Array Substrate) and a color filter substrate (Color Filter Substrate). In order to maintain the gap between the array substrate and the color filter substrate on the TFT-LCD architecture, it is generally necessary to set a photo spacer (PS) on the array substrate or the color filter substrate. In the process of manufacturing PS in TFT-LCD, the array substrate and the color filter substrate are generally subjected to the steps of Cleaning (cleaning)-Coating (coating)-VCD (vacuum drying)-HP (PreBake)-Cooling (cooling)-Exposure (Halftone Mask exposure)-Developer (development)-Oven (baking) in sequence, so as to manufacture the PS between the array substrate and the color filter substrate.

[0004] Since the exposure process (ie, Exposure) adopts Halftone Mask exposure (halftone exposure), and halftone exposure is prone to insufficient photocuring, thermal deformation is prone to occur during the baking process after development, which has a great impact on the manufactured PS characteristics. Summary of the invention

[0005] In order to reduce the impact on PS characteristics during the manufacturing process, the present invention provides a control method, system and storage medium for multiple exposures of PS on a substrate.

[0006] In a first aspect, the present invention provides a method for controlling multiple exposures of PS on a substrate, using the following technical solution:

[0007] A method for controlling multiple exposures of PS on a substrate, comprising:

[0008] Performing a first exposure on the substrate based on preset halftone exposure parameters;

[0009] developing the substrate after the first exposure;

[0010] After the pattern is formed, the substrate is exposed for a second time;

[0011] The substrate is baked based on preset baking parameters.

[0012] Optionally, the specific steps of performing a second exposure on the substrate include:

[0013] Get substrate type and environment information;

[0014] Determine environmental interference value based on environmental information;

[0015] Selecting a preset exposure reference interval based on the environmental interference value to determine the exposure selection amount;

[0016] Determine exposure control information according to the exposure selection amount;

[0017] Determine the exposure selection end according to the substrate type;

[0018] The exposure selection end controls the preset exposure device with the exposure control information to perform a second exposure on the substrate.

[0019] Optionally, a method for determining the environmental interference value includes:

[0020] Retrieve ambient light value, ambient light angle value and ambient temperature value based on ambient information;

[0021] Calculate the difference between the ambient light angle value and the preset exposure reference angle value and use it as the ambient light angle deviation value;

[0022] According to the corresponding relationship between the ambient light angle deviation value and the preset angle deviation influence value, the angle deviation influence value corresponding to the ambient light angle deviation value is determined;

[0023] Determine the ambient light impact value corresponding to the ambient light value according to the corresponding relationship between the ambient light value and the preset ambient light impact value;

[0024] Determine the ambient temperature impact value based on the ambient temperature value;

[0025] The sum of the ambient light impact value, the angle deviation impact value and the ambient temperature impact value is calculated and used as the comprehensive environmental impact value, and the comprehensive environmental impact value is used as the environmental interference value.

[0026] Optionally, a method for determining the ambient temperature impact value includes:

[0027] Obtaining a developing time value and developer material information when developing a substrate;

[0028] According to the corresponding relationship between the substrate type and the preset substrate wetting unit value, a substrate wetting unit value corresponding to the substrate type is determined;

[0029] Calculate the product value between the substrate wetting unit value and the developing time value and use it as the estimated value of substrate wetting;

[0030] According to the correspondence between the developer material information and the preset material drying reference value, the material drying reference value corresponding to the developer material information is determined;

[0031] Calculate the product value between the material drying reference value and the ambient temperature value and use it as the ambient temperature drying reference value;

[0032] Calculate the product of the ambient temperature drying reference value and the preset unit drying time value and use it as the ambient temperature drying estimated value;

[0033] Calculate the difference between the estimated value of substrate wetness and the estimated value of ambient temperature dryness and use it as the residual value of substrate wetness;

[0034] According to the corresponding relationship between the substrate wetness remaining value and the preset wetness influence value, the wetness influence value corresponding to the substrate wetness remaining value is determined, and the wetness influence value is used as the ambient temperature influence value.

[0035] Optionally, the method for selecting the exposure selection amount includes:

[0036] Calculate the difference between the two end values ​​of the exposure reference interval and use it as the reference interval deviation value;

[0037] Calculate the difference between the environmental interference value and the reference interval deviation value and use it as the environmental interference deviation value;

[0038] Calculate the quotient between the environmental interference deviation value and the reference interval deviation value and use it as the environmental interference adjustment value;

[0039] Determine whether the environmental interference value is greater than the reference interval deviation value;

[0040] If yes, then the sum of the environmental interference adjustment value and the smaller end value of the exposure reference interval is calculated and used as the exposure selection amount;

[0041] If not, the sum of the environmental interference adjustment value and the larger end value of the exposure reference interval is calculated and used as the exposure selection amount.

[0042] Optionally, the method for determining the exposure control information includes:

[0043] Retrieving halftone exposure amount based on halftone exposure parameter;

[0044] Calculate the difference between the exposure selection amount and the halftone exposure amount and use it as the exposure deviation value;

[0045] Determining whether the exposure deviation value is within a preset exposure reference deviation range;

[0046] If yes, then retrieve halftone control information based on the halftone exposure parameter, and use the halftone control information as exposure control information;

[0047] If not, then the halftone exposure time value and the halftone exposure reference value are retrieved based on the halftone exposure parameter;

[0048] Calculate the quotient between the exposure selection amount and the halftone exposure reference value and use it as the selected exposure time value;

[0049] According to the correspondence between the selected exposure time value, the halftone exposure reference value and the preset exposure selection control information, the exposure selection control information corresponding to the selected exposure time value and the halftone exposure reference value is determined, and the exposure selection control information is used as the exposure control information.

[0050] Optionally, the method further includes calculating the quotient between the exposure selection amount and the halftone exposure reference value and using the quotient as the exposure time value, which is specifically as follows:

[0051] According to the correspondence between the halftone exposure time value and the preset time base deviation interval, the time base deviation interval corresponding to the halftone exposure time value is determined;

[0052] Determine whether the selected exposure time value is within the time base deviation interval;

[0053] If yes, continue to output the selected exposure time value;

[0054] If not, then based on the selected exposure time value, select the end value with the smaller difference between the time reference deviation interval and use it as the end value of the time selection interval;

[0055] Calculate the quotient between the exposure selection amount and the end value of the time selection interval and use it as a reference value for exposure selection;

[0056] According to the correspondence between the time selection interval end value, the exposure selection reference value and the preset exposure adjustment control information, the exposure adjustment control information corresponding to the time selection interval end value and the exposure selection reference value is determined, and the exposure adjustment control information is used as the exposure control information.

[0057] Optionally, the method for determining the exposure selection end includes:

[0058] Based on the substrate type, retrieve the substrate upper end position point, substrate lower end position point and PS reference position point;

[0059] Calculate the distance between the upper end position point of the substrate and the PS reference position point and use it as the upper end distance value;

[0060] Calculate the distance between the lower end position point of the substrate and the PS reference position point and use it as the lower end distance value;

[0061] Determine whether the upper distance value is greater than the lower distance value;

[0062] If yes, the preset exposure lower end is used as the exposure selection end;

[0063] If not, the preset exposure upper end is used as the exposure selection end.

[0064] In a second aspect, the present invention provides a control system for multiple exposures of PS on a substrate, which adopts the following technical solution:

[0065] A control system for multiple exposures of PS on a substrate, comprising:

[0066] An acquisition module is used to acquire substrate type, environmental information, developing time value and developing liquid material information;

[0067] A memory for storing a program of the method for controlling multiple exposures of PS on a substrate as described in the first aspect;

[0068] The processor loads and executes the program in the memory.

[0069] In a third aspect, the present invention provides a computer storage medium capable of storing a corresponding program, which is convenient for reducing the impact on PS characteristics during the manufacturing process, and adopts the following technical solution:

[0070] A computer-readable storage medium stores a computer program that can be loaded by a processor and execute the method for controlling multiple exposures of PS on a substrate as described in the first aspect.

[0071] In summary, the present invention includes at least one of the following beneficial technical effects:

[0072] 1. After the substrate is exposed for the first time, it is developed, then exposed for the second time, and then baked, so that the substrate is exposed for multiple times before baking, thereby strengthening the degree of light curing and reducing the thermal deformation in the baking process, and finally achieving the purpose of reducing the impact on PS characteristics during the manufacturing process;

[0073] 2. By acquiring the substrate type and environmental information and determining the environmental interference value, the exposure selection amount is selected to determine the exposure control information, the exposure selection end is determined by the substrate type, and then the exposure selection end controls the preset exposure device with the exposure control information to perform a second exposure on the substrate, thereby improving the exposure accuracy of the second exposure of the substrate;

[0074] 3. Retrieve the ambient light value, ambient light angle value and ambient temperature value through environmental information, and calculate the ambient light angle deviation value to query and determine the angle deviation impact value, determine the ambient light impact value through ambient light value query to determine the ambient temperature impact value, and then calculate the comprehensive environmental impact value and use it as the environmental interference value, thereby improving the accuracy of the obtained environmental interference value. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] Figure 1 is a flow chart of a method for controlling multiple exposures of PS on a substrate according to an embodiment of the present application;

[0076] Figure 2 is a method flow chart of specific steps of performing a second exposure on a substrate according to an embodiment of the present application;

[0077] Figure 3 is a flow chart of a method for determining an environmental interference value in an embodiment of the present application;

[0078] Figure 4 is a flow chart of a method for determining an ambient temperature impact value in an embodiment of the present application;

[0079] Figure 5 is a flow chart of a method for selecting an exposure selection amount according to an embodiment of the present application;

[0080] Figure 6 is a flow chart of a method for determining exposure control information according to an embodiment of the present application;

[0081] Figure 7 is a flowchart of a method for calculating a quotient between an exposure selection amount and a halftone exposure reference value and taking it as a step after selecting an exposure time value according to an embodiment of the present application;

[0082] Figure 8 It is a flow chart of a method for determining an exposure selection end according to an embodiment of the present application. DETAILED DESCRIPTION

[0083] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0084] A method for controlling multiple exposures of PS on a substrate obtains substrate type, environmental information, development time value and developer material information, and performs a second exposure after the substrate is exposed and developed for the first time and before baking, thereby enhancing the degree of light curing and reducing thermal deformation in the baking process, and ultimately achieving the purpose of reducing the impact on PS characteristics during the manufacturing process.

[0085] Reference Figure 1 The embodiment of the present invention discloses a method for controlling multiple exposures of PS on a substrate, which comprises:

[0086] Step S100: performing a first exposure on the substrate based on preset halftone exposure parameters.

[0087] The halftone exposure parameters refer to the exposure parameters corresponding to halftone exposure of the substrate. The halftone exposure parameters are obtained after pre-input by the operator. The substrate is exposed for the first time using the halftone exposure parameters, thereby performing preliminary photocuring on the PS on the substrate.

[0088] Step S101: developing the substrate after the first exposure.

[0089] After the first exposure, the substrate is placed in a prepared developer to develop the substrate so as to display the pattern on the substrate.

[0090] Step S102: After the pattern is formed, the substrate is exposed for the second time.

[0091] After the pattern on the substrate is formed, the substrate is exposed for a second time to enhance the degree of light curing. The second exposure is different from the first exposure and does not require the use of a specific wavelength and mask.

[0092] Step S103: baking the substrate based on preset baking parameters.

[0093] The baking parameters refer to the parameters used in the final baking process of the substrate, and the baking parameters are obtained after being pre-entered by the operator. By performing at least two exposures before baking the substrate, the degree of light curing is enhanced, and the thermal deformation in the baking process is reduced, thereby ultimately achieving the purpose of reducing the impact on PS characteristics during the manufacturing process.

[0094] exist Figure 1 In step S102, in order to further ensure the rationality of the second exposure of the substrate, it is necessary to perform further separate analysis and calculation on the second exposure of the substrate. Figure 2 The steps shown are explained in detail.

[0095] Reference Figure 2 , the specific steps of performing the second exposure on the substrate include the following steps:

[0096] Step S200: Acquire substrate type and environment information.

[0097] The substrate type refers to the type of structure to which the substrate belongs, including but not limited to PS on Array structure type, COA+Non POA structure type, etc. The substrate type is obtained after being pre-input by the operator. Environmental information refers to information such as the light and temperature of the environment in which the substrate is exposed for the second time. The environmental information is obtained by real-time detection and retrieval of the light sensor and temperature sensor preset in the environment in which the substrate is exposed for the second time.

[0098] Step S201: determining an environmental interference value according to environmental information.

[0099] The environmental interference value refers to the interference value caused by the environment to the second exposure. The environmental interference value is determined by analyzing the environmental information to facilitate subsequent use. The specific analysis process of the environmental interference value refers to step S300 to step S305.

[0100] Step S202: selecting a preset exposure reference interval based on the environmental interference value to determine the exposure selection amount.

[0101] The exposure selection amount refers to the exposure amount selected when the substrate is exposed for the second time. The exposure selection amount is determined by selecting the preset exposure reference interval using the environmental interference value, which is convenient for subsequent use.

[0102] Step S203: Determine exposure control information according to the exposure selection amount.

[0103] The exposure control information refers to the control information for controlling a preset exposure device to expose a substrate, and the exposure device refers to a device for exposing a substrate. The exposure control information is determined by analyzing the exposure selection amount, which is convenient for subsequent use. The specific analysis process of the exposure control information refers to steps S600 to S606.

[0104] Step S204: determining an exposure selection end according to the substrate type.

[0105] The exposure selection end refers to the end face of the substrate selected during the second exposure, and the exposure selection end is obtained by querying from a database storing different substrate types and corresponding exposure selection ends, and the database is obtained after pre-input. The exposure selection end is determined by querying the substrate type for convenience in subsequent use.

[0106] Step S205: controlling a preset exposure device with the exposure control information at the exposure selection end to perform a second exposure on the substrate.

[0107] The exposure control information is used to control a preset exposure device to perform a second exposure on the substrate at the exposure selection end of the substrate, thereby further improving and strengthening the degree of light curing during the second exposure.

[0108] exist Figure 2 In step S201, in order to further ensure the rationality of the environmental interference value, it is necessary to further analyze and calculate the environmental interference value. Figure 3 The steps shown are explained in detail.

[0109] Reference Figure 3 , the method for determining the environmental interference value includes the following steps:

[0110] Step S300: Retrieve the ambient light value, ambient light angle value and ambient temperature value based on the ambient information.

[0111] Among them, the ambient light value refers to the light intensity value of the environment in which the substrate is located during the second exposure, the ambient light angle value refers to the angle value corresponding to the ambient light in which the substrate is located during the second exposure, and the ambient temperature value refers to the temperature value of the environment in which the substrate is located during the second exposure. The ambient light value, ambient light angle value, and ambient temperature value are retrieved through the environmental information for easy subsequent use.

[0112] Step S301: Calculate the difference between the ambient light angle value and the preset exposure reference angle value and use it as the ambient light angle deviation value.

[0113] The exposure reference angle value refers to the reference angle value corresponding to when the exposure device exposes the substrate, and the exposure reference angle value is obtained after pre-input. The ambient light angle deviation value refers to the deviation value corresponding to when there is a deviation in the ambient light angle. The difference between the ambient light angle value and the preset exposure reference angle value is calculated and used as the ambient light angle deviation value for subsequent use.

[0114] Step S302: determining an angle deviation influence value corresponding to the ambient light angle deviation value according to a correspondence between the ambient light angle deviation value and a preset angle deviation influence value.

[0115] The angle deviation impact value refers to the value of the degree of influence of the illumination angle deviation on the exposure, and the angle deviation impact value is obtained by querying from a database storing different angle deviation impact values ​​and corresponding angle deviation impact values, and the database is obtained after pre-input. The angle deviation impact value is determined by querying the ambient illumination angle deviation value, which is convenient for subsequent use.

[0116] Step S303: determining an ambient lighting impact value corresponding to the ambient lighting value according to the corresponding relationship between the ambient lighting value and the preset ambient lighting impact value.

[0117] The ambient light impact value refers to the value of the degree of influence of the ambient light intensity on the exposure, and the ambient light impact value is obtained by querying from a database storing different ambient light values ​​and corresponding ambient light impact values, and the database is obtained after pre-input. The ambient light impact value is determined by querying the ambient light value, which is convenient for subsequent use.

[0118] Step S304: determining the ambient temperature impact value according to the ambient temperature value.

[0119] The ambient temperature impact value refers to the degree of influence of the ambient temperature on the exposure. The ambient temperature impact value is determined by analyzing the ambient temperature value to facilitate subsequent use.

[0120] Step S305: Calculate the sum of the ambient light impact value, the angle deviation impact value and the ambient temperature impact value and use it as the ambient comprehensive impact value, and use the ambient comprehensive impact value as the ambient interference value.

[0121] Among them, the comprehensive environmental impact value refers to the comprehensive impact degree of the environment on exposure. It is calculated by taking the sum of the environmental light impact value, the angle deviation impact value and the environmental temperature impact value as the comprehensive environmental impact value, and taking the comprehensive environmental impact value as the environmental interference value, thereby improving the accuracy of the obtained environmental interference value.

[0122] exist Figure 3 In step S304, in order to further ensure the rationality of the ambient temperature impact value, it is necessary to further analyze and calculate the ambient temperature impact value. Figure 4 The steps shown are explained in detail.

[0123] Reference Figure 4 , the method for determining the ambient temperature impact value includes the following steps:

[0124] Step S400: acquiring a developing time value and developer material information when developing a substrate.

[0125] The developing time value refers to the time value of developing the substrate, and the developing liquid material information refers to the material type information corresponding to the developing liquid used when developing the substrate. The developing time value and the developing liquid material information are obtained after being pre-input by the operator.

[0126] Step S401: determining a substrate wetting unit value corresponding to the substrate type according to a correspondence between the substrate type and a preset substrate wetting unit value.

[0127] The substrate wetness unit value refers to the wetness value corresponding to different types of substrates when they are wetted per unit time. The substrate wetness unit value is obtained by querying from a database storing different substrate types and corresponding substrate wetness unit values. The database is obtained after pre-input. The substrate wetness unit value is determined by querying the substrate type to facilitate subsequent use.

[0128] Step S402: Calculate the product value between the substrate wetness unit value and the development time value and use it as the estimated value of substrate wetness.

[0129] The estimated value of substrate wetness refers to the estimated value of the wetness degree of the substrate after development, which is calculated by multiplying the substrate wetness unit value and the development time value and used as the estimated value of substrate wetness for subsequent use.

[0130] Step S403: determining the material drying reference value corresponding to the developer material information according to the correspondence between the developer material information and the preset material drying reference value.

[0131] The material drying reference value refers to the reference drying value of the developer material at a unit temperature, and the material drying reference value is obtained by querying from a database storing different developer material information and corresponding material drying reference values, and the database is obtained after pre-input. The material drying reference value is determined by querying the developer material information, which is convenient for subsequent use.

[0132] Step S404: Calculate the product value between the material drying reference value and the ambient temperature value and use it as the ambient temperature drying reference value.

[0133] The ambient temperature drying reference value refers to the reference drying value when the ambient temperature is used to dry the substrate. The product value between the material drying reference value and the ambient temperature value is calculated and used as the ambient temperature drying reference value for convenience in subsequent use.

[0134] Step S405: Calculate the product of the ambient temperature drying reference value and the preset unit drying time value and use it as the ambient temperature drying estimated value.

[0135] The unit drying time value refers to the reference time value corresponding to drying the developer on the substrate, and the unit drying time value is obtained after pre-input. The ambient temperature drying estimated value refers to the estimated drying value when the substrate is dried at the unit drying time value, and the product value of the ambient temperature drying reference value and the preset unit drying time value is calculated and used as the ambient temperature drying estimated value for subsequent use.

[0136] Step S406: Calculate the difference between the estimated value of substrate wetness and the estimated value of ambient temperature dryness and use it as the remaining value of substrate wetness.

[0137] The substrate wetness remaining value refers to the remaining wetness value on the substrate after drying. The difference between the estimated substrate wetness value and the estimated ambient temperature drying value is calculated and used as the substrate wetness remaining value for subsequent use.

[0138] Step S407: determining a wetness influence value corresponding to the substrate wetness remaining value according to the corresponding relationship between the substrate wetness remaining value and the preset wetness influence value, and using the wetness influence value as the ambient temperature influence value.

[0139] The wetness impact value refers to the influence degree value of the residual wetness of the substrate after drying at the ambient temperature. The wetness impact value is obtained by querying from a database storing different substrate wetness residual values ​​and corresponding wetness impact values, and the database is obtained after pre-input. The wetness impact value is determined by querying the substrate wetness residual value, and the wetness impact value is used as the ambient temperature impact value, thereby improving the accuracy of the obtained ambient temperature impact value.

[0140] exist Figure 2 In step S202, in order to further ensure the rationality of the exposure selection, it is necessary to further analyze and calculate the exposure selection. Figure 5 The steps shown are explained in detail.

[0141] Reference Figure 5 , the method for selecting the exposure selection amount includes the following steps:

[0142] Step S500: Calculate the difference between the two end values ​​of the exposure reference interval and use it as the reference interval deviation value.

[0143] The reference interval deviation value refers to the degree value corresponding to the deviation range of the reference interval. The difference between the two end values ​​of the exposure reference interval is calculated and used as the reference interval deviation value for convenience in subsequent use.

[0144] Step S501: Calculate the difference between the environmental interference value and the reference interval deviation value and use it as the environmental interference deviation value.

[0145] The environmental interference deviation value refers to the deviation value between the environmental interference and the interval deviation. The difference between the environmental interference value and the reference interval deviation value is calculated and used as the environmental interference deviation value for convenience in subsequent use.

[0146] Step S502: Calculate the quotient between the environmental interference deviation value and the reference interval deviation value and use it as the environmental interference adjustment value.

[0147] The environmental interference adjustment value refers to the adjustment value corresponding to the environmental interference, and is calculated by taking the quotient between the environmental interference deviation value and the reference interval deviation value as the environmental interference adjustment value for subsequent use.

[0148] Step S503: Determine whether the environmental interference value is greater than the reference interval deviation value. If yes, execute step S504; if no, execute step S505.

[0149] Here, by judging whether the environmental interference value is greater than the reference interval deviation value, it is judged whether to adjust from the smaller end of the reference interval.

[0150] Step S504: Calculate the sum of the environmental interference adjustment value and the smaller end value of the exposure reference interval and use it as the exposure selection value.

[0151] Among them, when the environmental interference value is greater than the deviation value of the reference interval, it means that the adjustment is made from the smaller end of the reference interval at this time. Therefore, the sum of the environmental interference adjustment value and the smaller end value of the exposure reference interval is calculated and used as the exposure selection amount, thereby improving the accuracy of the obtained exposure selection amount.

[0152] Step S505: Calculate the sum of the environmental interference adjustment value and the larger end value of the exposure reference interval and use it as the exposure selection value.

[0153] Among them, when the environmental interference value is not greater than the reference interval deviation value, it means that no adjustment is made from the smaller end of the reference interval at this time. Therefore, the sum of the environmental interference adjustment value and the larger end value of the exposure reference interval is calculated and used as the exposure selection amount, thereby improving the accuracy of the obtained exposure selection amount.

[0154] exist Figure 2 In step S203, in order to further ensure the rationality of the exposure control information, it is necessary to further analyze and calculate the exposure control information. Figure 6 The steps shown are explained in detail.

[0155] Reference Figure 6 , the method for determining the exposure control information comprises the following steps:

[0156] Step S600: obtaining a halftone exposure value based on a halftone exposure parameter.

[0157] Among them, the halftone exposure refers to the exposure amount corresponding to the halftone exposure. The halftone exposure amount is called through the halftone exposure parameters to facilitate subsequent use.

[0158] Step S601: Calculate the difference between the selected exposure amount and the halftone exposure amount and use it as the exposure deviation value.

[0159] Among them, the exposure deviation value refers to the deviation value corresponding to the deviation between the exposure selection amount and the exposure amount during halftone exposure. By calculating the difference between the exposure selection amount and the halftone exposure amount and using it as the exposure deviation value, it is convenient for subsequent use.

[0160] Step S602: Determine whether the exposure deviation value is within a preset exposure reference deviation interval. If yes, execute step S603; if no, execute step S604.

[0161] The exposure reference deviation interval refers to the reference deviation interval that can be allowed when continuing to use halftone exposure, and the exposure reference deviation interval is obtained after pre-input. By judging whether the exposure deviation value is within the preset exposure reference deviation interval, it is judged whether to continue to use the halftone exposure parameters for exposure.

[0162] Step S603: Retrieve halftone control information based on the halftone exposure parameter, and use the halftone control information as exposure control information.

[0163] The halftone control information refers to the control information corresponding to the operation of the exposure device when halftone exposure is adopted. When the exposure deviation value is within the preset exposure reference deviation range, it means that the halftone exposure parameters are continued to be adopted for exposure. Therefore, the halftone control information is retrieved through the halftone exposure parameters, and the halftone control information is used as the exposure control information, thereby improving the accuracy of the acquired exposure control information.

[0164] Step S604: Retrieve the halftone exposure time value and the halftone exposure reference value based on the halftone exposure parameter.

[0165] Among them, the halftone exposure time value refers to the duration value corresponding to the halftone exposure, and the halftone exposure reference value refers to the reference value corresponding to the unit time when the halftone exposure is adopted. When the exposure deviation value is not within the preset exposure reference deviation range, it means that the halftone exposure parameters are not continued to be used for exposure at this time, so the halftone exposure time value and the halftone exposure reference value are retrieved through the halftone exposure parameters for convenience of subsequent use.

[0166] Step S605: Calculate the quotient between the exposure selection value and the halftone exposure reference value and use it as the selected exposure time value.

[0167] Among them, the selected exposure time value refers to the duration value required for exposure based on the halftone exposure reference value. The quotient between the exposure selection amount and the halftone exposure reference value is calculated and used as the selected exposure time value for convenience in subsequent use.

[0168] Step S606: Determine exposure selection control information corresponding to the selected exposure time value and the halftone exposure reference value according to the correspondence between the selected exposure time value, the halftone exposure reference value and the preset exposure selection control information, and use the exposure selection control information as the exposure control information.

[0169] The exposure selection control information refers to the control information corresponding to the operation of the exposure device controlled according to the exposure selection amount, and the exposure selection control information is obtained by querying from a database storing different selected exposure time values, halftone exposure reference values ​​and corresponding exposure selection control information, and the database is obtained after pre-input. The exposure selection control information is determined by querying the selected exposure time value and the halftone exposure reference value, and the exposure selection control information is used as the exposure control information, thereby improving the accuracy of the acquired exposure control information.

[0170] exist Figure 6 After step S605, in order to further ensure the rationality of the exposure control information, it is necessary to further analyze and calculate the exposure control information. Figure 7 The steps shown are explained in detail.

[0171] Reference Figure 7 The steps after calculating the quotient between the exposure selection amount and the halftone exposure reference value and using it as the exposure time value include the following steps:

[0172] Step S700: determining a time reference deviation interval corresponding to the halftone exposure time value according to a correspondence between the halftone exposure time value and a preset time reference deviation interval.

[0173] The time base deviation interval refers to the base interval within which the deviation is allowed when the time does not need to be adjusted. The time base deviation interval is obtained by querying from a database storing different halftone exposure time values ​​and corresponding time base deviation intervals. The database is obtained after pre-input. The time base deviation interval is determined by querying the halftone exposure time value to facilitate subsequent use.

[0174] Step S701: Determine whether the selected exposure time value is within the time reference deviation interval. If yes, execute step S702; if no, execute step S703.

[0175] Here, it is determined whether the selected exposure time value is within the time reference deviation interval, thereby determining whether subsequent adjustment is required.

[0176] Step S702: Continue to output the selected exposure time value.

[0177] When the selected exposure time value is within the time reference deviation interval, it means that no subsequent adjustment is required at this time, so the selected exposure time value continues to be output.

[0178] Step S703: based on the selected exposure time value, select the end value with the smaller difference from the time reference deviation interval and use it as the end value of the time selection interval.

[0179] Among them, the end value of the time selection interval refers to the end value of the interval that is smaller than the selected exposure time value. When the selected exposure time value is not within the time base deviation interval, it means that subsequent adjustment is required at this time. Therefore, the difference between the two end values ​​of the selected exposure time value and the time base deviation interval is calculated, and the end value corresponding to the smaller difference is used as the end value of the time selection interval, which is convenient for subsequent use.

[0180] Step S704: Calculate the quotient between the exposure selection amount and the end value of the time selection interval and use it as the exposure selection reference value.

[0181] Among them, the exposure selection reference value refers to the reference value selected for a unit time during exposure. The quotient between the exposure selection amount and the end value of the time selection interval is calculated and used as the exposure selection reference value for subsequent use.

[0182] Step S705: Determine the exposure adjustment control information corresponding to the time selection interval end value and the exposure selection reference value according to the correspondence between the time selection interval end value, the exposure selection reference value and the preset exposure adjustment control information, and use the exposure adjustment control information as the exposure control information.

[0183] The exposure adjustment control information refers to the control information after the exposure is adjusted, and the exposure adjustment control information is obtained by querying from a database storing different time selection interval end values, exposure selection reference values ​​and corresponding exposure adjustment control information, and the database is obtained after pre-input. The exposure adjustment control information is determined by querying the time selection interval end value and the exposure selection reference value, and the exposure adjustment control information is used as the exposure control information, thereby improving the accuracy of the acquired exposure control information.

[0184] exist Figure 2 In step S204, in order to further ensure the rationality of the exposure selection end, it is necessary to further analyze and calculate the exposure selection end separately, specifically by Figure 8 The steps shown are explained in detail.

[0185] Reference Figure 8 , the method for determining the exposure selection end includes the following steps:

[0186] Step S800: Retrieve the substrate upper end position point, substrate lower end position point and PS reference position point based on the substrate type.

[0187] Among them, the upper end position point of the substrate refers to the position point where the upper end of the substrate is located, the lower end position point of the substrate refers to the position point where the lower end of the substrate is located, and the PS reference position point refers to the center position point corresponding to the PS of the substrate. The type position database is queried by the substrate type and the upper end position point of the substrate, the lower end position point of the substrate and the PS reference position point of the substrate are retrieved to facilitate subsequent use. The type position database stores the upper end position point of the substrate, the lower end position point of the substrate and the PS reference position point corresponding to different substrate types, and the type position database is obtained after pre-input by the operator.

[0188] Step S801: Calculate the distance between the upper end position point of the substrate and the PS reference position point and use it as the upper end distance value.

[0189] The upper end distance value refers to the distance between the PS and the upper end of the substrate. The distance between the upper end position point of the substrate and the PS reference position point is calculated and used as the upper end distance value for convenience in subsequent use.

[0190] Step S802: Calculate the distance between the lower end position point of the substrate and the PS reference position point and use it as the lower end distance value.

[0191] The lower end distance value refers to the distance between the PS and the lower end of the substrate. The distance between the lower end position point of the substrate and the PS reference position point is calculated and used as the lower end distance value for convenience in subsequent use.

[0192] Step S803: Determine whether the upper distance value is greater than the lower distance value. If yes, execute step S804; if no, execute step S805.

[0193] Among them, by judging whether the upper end distance value is greater than the lower end distance value, it is judged whether the PS of the substrate is close to the lower end.

[0194] Step S804: using the preset exposure lower end as the exposure selection end.

[0195] The exposure lower end refers to the selected end of the lower end of the substrate when performing exposure, and the exposure lower end is obtained after pre-input. When the upper end distance value is greater than the lower end distance value, it means that the PS of the substrate is close to the lower end at this time, so the preset exposure lower end is used as the exposure selection end, thereby improving the accuracy of the acquired exposure selection end.

[0196] Step S805: Using the preset exposure upper end as the exposure selection end.

[0197] The exposure upper end refers to the selection end of the upper end of the substrate when performing exposure, and the exposure upper end is obtained after pre-input. When the upper end distance value is not greater than the lower end distance value, it means that the PS of the substrate is close to the upper end at this time, so the preset exposure upper end is used as the exposure selection end, thereby improving the accuracy of the acquired exposure selection end.

[0198] Furthermore, in order to improve the accuracy of the acquired exposure selection end, the following steps are further included after step S804:

[0199] Step S900: Calculate the difference between the upper distance value and the lower distance value and use it as the upper and lower distance deviation value.

[0200] Among them, the upper and lower distance deviation value refers to the deviation value corresponding to the deviation between the PS of the substrate and the upper and lower ends. The difference between the upper end distance value and the lower end distance value is calculated and used as the upper and lower distance deviation value for convenience in subsequent use.

[0201] Step S901: Calculate the distance between the upper end position point of the substrate and the lower end position point of the substrate and use it as the upper and lower distance value of the substrate.

[0202] Among them, the upper and lower distance value of the substrate refers to the distance value between the upper end and the lower end of the substrate. The distance between the upper end position point of the substrate and the lower end position point of the substrate is calculated and used as the upper and lower distance value of the substrate for convenience in subsequent use.

[0203] Step S902: According to the correspondence between the substrate up-and-down distance value and the preset up-and-down distance deviation reference interval, the up-and-down distance deviation reference interval corresponding to the substrate up-and-down distance value is determined.

[0204] The upper and lower distance deviation reference interval refers to the reference interval in which the upper and lower distance deviation can be tolerated when the upper end is used. The upper and lower distance deviation reference interval is obtained by querying from a database storing different upper and lower distance values ​​of substrates and the corresponding upper and lower distance deviation reference intervals. The database is obtained after pre-input. The upper and lower distance deviation reference interval is determined by querying the upper and lower distance values ​​of the substrate, which is convenient for subsequent use.

[0205] Step S903: Determine whether the up-down distance deviation value is within the up-down distance deviation reference interval. If yes, execute step S904; if no, execute step S905.

[0206] Here, whether the upper end can be adopted is determined by judging whether the upper and lower distance deviation value is within the upper and lower distance deviation reference interval.

[0207] Step S904: using the preset exposure upper end as the exposure selection end.

[0208] Among them, when the upper and lower distance deviation values ​​are within the upper and lower distance deviation reference intervals, it means that the upper end can be used at this time, so the preset exposure upper end is used as the exposure selection end.

[0209] Step S905: Continue to output the exposure selection end.

[0210] Among them, when the upper and lower distance deviation values ​​are not within the upper and lower distance deviation reference intervals, it means that the upper end cannot be used at this time, so the exposure selection end continues to be output.

[0211] Based on the same inventive concept, an embodiment of the present invention provides a control system for multiple exposures of PS on a substrate, comprising:

[0212] An acquisition module is used to acquire substrate type, environmental information, developing time value and developing liquid material information;

[0213] Memory, used to store Figures 1 to 8 A program for controlling a multiple exposure method of PS on a substrate as described in any one of the above;

[0214] The processor loads and executes the program in the memory.

[0215] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0216] An embodiment of the present invention provides a computer-readable storage medium storing a computer program that can be loaded and executed by a processor. Figures 1 to 8 A computer program for a method for controlling multiple exposures of PS on a substrate as described in any one of the above.

[0217] Computer storage media include, for example, various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks or optical disks.

[0218] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A method for controlling multiple exposures of PS on a substrate, characterized in that: include: Performing a first exposure on the substrate based on preset halftone exposure parameters; developing the substrate after the first exposure; After the pattern is formed, the substrate is exposed for a second time; The substrate is baked based on preset baking parameters.

2. The method for controlling multiple exposures of PS on a substrate according to claim 1, characterized in that: The specific steps of performing a second exposure on the substrate include: Get substrate type and environment information; Determine environmental interference value based on environmental information; Selecting a preset exposure reference interval based on the environmental interference value to determine the exposure selection amount; Determine exposure control information according to the exposure selection amount; Determine the exposure selection end according to the substrate type; The exposure selection end controls the preset exposure device with the exposure control information to perform a second exposure on the substrate.

3. The method for controlling multiple exposures of PS on a substrate according to claim 2, characterized in that: Methods for determining environmental interference values ​​include: Retrieve ambient light value, ambient light angle value and ambient temperature value based on ambient information; Calculate the difference between the ambient light angle value and the preset exposure reference angle value and use it as the ambient light angle deviation value; According to the correspondence between the ambient light angle deviation value and the preset angle deviation influence value, the angle deviation influence value corresponding to the ambient light angle deviation value is determined; Determine the ambient light impact value corresponding to the ambient light value according to the corresponding relationship between the ambient light value and the preset ambient light impact value; Determine the ambient temperature impact value based on the ambient temperature value; The sum of the ambient light impact value, the angle deviation impact value and the ambient temperature impact value is calculated and used as the comprehensive environmental impact value, and the comprehensive environmental impact value is used as the environmental interference value.

4. The method for controlling multiple exposures of PS on a substrate according to claim 3, characterized in that: The methods for determining the ambient temperature impact value include: Obtaining a developing time value and developer material information when developing a substrate; According to the corresponding relationship between the substrate type and the preset substrate wetting unit value, a substrate wetting unit value corresponding to the substrate type is determined; Calculate the product value between the substrate wetting unit value and the developing time value and use it as the estimated value of substrate wetting; According to the correspondence between the developer material information and the preset material drying reference value, the material drying reference value corresponding to the developer material information is determined; Calculate the product of the material drying reference value and the ambient temperature value and use it as the ambient temperature drying reference value; Calculate the product of the ambient temperature drying reference value and the preset unit drying time value and use it as the ambient temperature drying estimated value; Calculate the difference between the estimated value of substrate wetness and the estimated value of ambient temperature dryness and use it as the residual value of substrate wetness; According to the corresponding relationship between the substrate wetness remaining value and the preset wetness influence value, the wetness influence value corresponding to the substrate wetness remaining value is determined, and the wetness influence value is used as the ambient temperature influence value.

5. The method for controlling multiple exposures of PS on a substrate according to claim 2, characterized in that: The methods for selecting the exposure selection amount include: Calculate the difference between the two end values ​​of the exposure reference interval and use it as the reference interval deviation value; Calculate the difference between the environmental interference value and the reference interval deviation value and use it as the environmental interference deviation value; Calculate the quotient between the environmental interference deviation value and the reference interval deviation value and use it as the environmental interference adjustment value; Determine whether the environmental interference value is greater than the reference interval deviation value; If yes, then the sum of the environmental interference adjustment value and the smaller end value of the exposure reference interval is calculated and used as the exposure selection amount; If not, the sum of the environmental interference adjustment value and the larger end value of the exposure reference interval is calculated and used as the exposure selection amount.

6. The method for controlling multiple exposures of PS on a substrate according to claim 2, characterized in that: The method for determining the exposure control information includes: Retrieving halftone exposure amount based on halftone exposure parameter; Calculate the difference between the exposure selection amount and the halftone exposure amount and use it as the exposure deviation value; Determining whether the exposure deviation value is within a preset exposure reference deviation range; If yes, then retrieve halftone control information based on the halftone exposure parameter, and use the halftone control information as exposure control information; If not, then the halftone exposure time value and the halftone exposure reference value are retrieved based on the halftone exposure parameter; Calculate the quotient between the exposure selection amount and the halftone exposure reference value and use it as the selected exposure time value; According to the correspondence between the selected exposure time value, the halftone exposure reference value and the preset exposure selection control information, the exposure selection control information corresponding to the selected exposure time value and the halftone exposure reference value is determined, and the exposure selection control information is used as the exposure control information.

7. The method for controlling multiple exposures of PS on a substrate according to claim 6, characterized in that: The method also includes a step after calculating the quotient between the exposure selection amount and the halftone exposure reference value and using it as the exposure time value, which is as follows: According to the correspondence between the halftone exposure time value and the preset time base deviation interval, the time base deviation interval corresponding to the halftone exposure time value is determined; Determine whether the selected exposure time value is within the time base deviation interval; If yes, continue to output the selected exposure time value; If not, then based on the selected exposure time value, select the end value with the smaller difference between the time reference deviation interval and use it as the end value of the time selection interval; Calculate the quotient between the exposure selection amount and the end value of the time selection interval and use it as a reference value for exposure selection; According to the correspondence between the time selection interval end value, the exposure selection reference value and the preset exposure adjustment control information, the exposure adjustment control information corresponding to the time selection interval end value and the exposure selection reference value is determined, and the exposure adjustment control information is used as the exposure control information.

8. The method for controlling multiple exposures of PS on a substrate according to claim 2, characterized in that: The method for determining the exposure selection end includes: Based on the substrate type, retrieve the substrate upper end position point, substrate lower end position point and PS reference position point; Calculate the distance between the upper end position point of the substrate and the PS reference position point and use it as the upper end distance value; Calculate the distance between the lower end position point of the substrate and the PS reference position point and use it as the lower end distance value; Determine whether the upper distance value is greater than the lower distance value; If yes, the preset exposure lower end is used as the exposure selection end; If not, the preset exposure upper end is used as the exposure selection end.

9. A control system for multiple exposures of PS on a substrate, characterized in that: include: An acquisition module is used to acquire substrate type, environmental information, developing time value and developing liquid material information; A memory for storing a program of a method for controlling multiple exposures of PS on a substrate according to any one of claims 1 to 8; The processor loads and executes the program in the memory.

10. A computer-readable storage medium, characterized in that: A computer program is stored which can be loaded by a processor and executes the method for controlling multiple exposures of PS on a substrate according to any one of claims 1 to 8.

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