In-situ laser shock peening light beam path planning method and system, in-situ laser shock peening process implementation method and system, equipment and medium

Abstract

The invention relates to a beam path planning method and system for in-situ laser shock peening, a process implementation method and system, equipment and a medium. The light beam path planning method comprises the following steps: acquiring a three-dimensional design model of a to-be-strengthened part and a structured light signal of the surface of the to-be-strengthened part; performing reverse modeling on the to-be-strengthened part based on the structured light signal to obtain a reverse model; accurately matching the three-dimensional design model with the reverse model to obtain corresponding spatial position parameters and spatial path parameters of the central position of each pulse laser beam and the preset path in the reverse model, and performing laser shock peening treatment on the to-be-peened part according to the spatial position parameters, the spatial path parameters and each pulse laser parameter. Rapid matching, recognition and implementation of the large-scale structure in-situ moving beam laser shock peening process can be achieved, and the precision and efficiency of on-site laser shock peening machining are greatly improved.

Description

Technical Field

[0001] The present invention belongs to the field of laser processing technology, and specifically relates to beam path planning, process implementation methods, systems, equipment and media for in-situ laser shock strengthening. Background Art

[0002] Laser shock peening (LSP) is a surface fatigue resistance manufacturing technology that uses high power density (GW / cm 2 The laser of short pulse (ns level) passes through the transparent confinement layer (water, etc.) and irradiates the surface of the metal material. The absorption protective layer (black tape, aluminum foil, etc.) coated on the surface absorbs the laser energy in a very short time, generating a high-pressure (GPa level) plasma shock wave, which propagates into the interior of the metal material. The force effect of the high-pressure shock wave causes the surface of the material to strain at a very high strain rate (10 6 s -1 ) undergoes dynamic plastic deformation, which changes the surface microstructure and forms residual compressive stress at a depth of millimeters, which can significantly improve the fatigue resistance, wear resistance, stress corrosion cracking resistance and other properties of metal materials. It has been widely used in aircraft engines, gas turbines, aircraft and other equipment.

[0003] In the related technologies, the early application of laser shock peening technology was mainly for small parts, such as aero-engine blades and ducts, etc., using fixed laser shock peening equipment and the technical solution of "fixed beam and moving parts". During the strengthening process, the small parts were fixed on the robot arm, and the laser shock peening treatment of the parts was achieved through reverse relative movement. The positional relationship between the beam and the robot was fixed, and a three-dimensional coordinate system was used. Therefore, it was only necessary to set the position of each spot of the strengthening process on the small parts, and the process was simple. However, when the laser shock peening technology was applied to large parts such as aircraft beam frames, since large parts were difficult to disassemble and could not be moved, the technical solution of "moving beam and fixing parts" could only be used instead. At this time, the positional relationship between the part to be strengthened and the robot arm and the beam of the large structure was not fixed, and there were more than two three-dimensional coordinate systems. It was difficult to associate the spatial positions of the three, and the beam movement lacked accurate spatial position parameters. At present, the alignment of the starting point of the strengthening process can only be achieved through manual naked eye observation and repeated adjustment. The entire adjustment process was time-consuming, inefficient, greatly affected by human factors, and poor accuracy. It was impossible to ensure the accurate and efficient implementation of the dynamic beam laser shock peening process on the spot of large structures. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a beam path planning, process implementation method, system, equipment and medium for in-situ laser shock strengthening, so as to solve the above-mentioned technical difficulties such as the alignment of the starting point of the strengthening process can only be achieved through manual visual observation and repeated adjustment, the entire adjustment process is time-consuming and inefficient, the human factor has a great influence, the accuracy is poor, and it is impossible to ensure the accurate and efficient implementation of the on-site dynamic beam laser shock strengthening process for large structures.

[0005] To achieve the above purpose, the technical solution of this application is as follows: In a first aspect, the present application provides a beam path planning method for in-situ laser shock peening, wherein the beam path planning method for in-situ laser shock peening is used to plan the spatial positioning and movement path of a moving beam during laser shock peening, and the beam path planning method for in-situ laser shock peening comprises the following steps: Acquire a three-dimensional design model of the part to be strengthened and a structured light signal on the surface of the part to be strengthened; Based on the structured light signal, reverse modeling is performed on the part to be enhanced to obtain a reverse model; The three-dimensional design model is accurately matched with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model.

[0006] Optionally, at least one of a triangulation method, a nearest point iteration algorithm and a non-uniform rational B-spline surface fitting algorithm is used to perform reverse modeling on the part to be strengthened.

[0007] Optionally, the three-dimensional design model and the inverse model are accurately matched by an image matching method.

[0008] Optionally, the three-dimensional design model is accurately matched with the reverse model obtained by reverse modeling through at least one of a fast point feature histogram algorithm, a point cloud key point detection algorithm and a random sampling consistency algorithm in the image matching method.

[0009] Optionally, the preset path is obtained by the following method: Obtain the material, specification and fatigue working stress distribution of the part to be strengthened; The preset path is determined according to the material, specification and fatigue working stress distribution.

[0010] In a second aspect, the present application further provides a process implementation method for in-situ laser shock peening, wherein the process implementation method for in-situ laser shock peening comprises the following steps: Acquire a three-dimensional design model of the part to be strengthened and a structured light signal on the surface of the part to be strengthened; Based on the structured light signal, reverse modeling is performed on the part to be enhanced to obtain a reverse model; Accurately matching the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model; The laser shock peening treatment is performed on the part to be peened according to the spatial position parameters, the spatial path parameters and the preset corresponding pulse laser parameters.

[0011] In a third aspect, the present application further provides a beam path planning system for in-situ laser shock peening, wherein the beam path planning system for in-situ laser shock peening is used to plan the path of a movable beam during laser shock peening, and the beam path planning system for in-situ laser shock peening comprises: An acquisition module is configured to obtain a three-dimensional design model of the part to be enhanced and a structured light signal on the surface of the part to be enhanced; A reverse modeling module is configured to perform reverse modeling on the part to be enhanced based on the structured light signal to obtain a reverse model; The matching module is configured to accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model.

[0012] In a fourth aspect, the present application further provides a process implementation system for in-situ laser shock peening, wherein the process implementation of in-situ laser shock peening includes: An acquisition module is configured to obtain a three-dimensional design model of the part to be enhanced and a structured light signal on the surface of the part to be enhanced; A reverse modeling module is configured to perform reverse modeling on the part to be enhanced based on the structured light signal to obtain a reverse model; A matching module is configured to accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model; The processing module is configured to perform laser shock peening on the part to be peened according to the spatial position parameters, the spatial path parameters and preset corresponding pulse laser parameters.

[0013] In a fifth aspect, the present application further provides an electronic device, the electronic device comprising: one or more processors; The storage device is used to store one or more programs, and when the one or more programs are executed by the one or more processors, the electronic device implements the method as described above.

[0014] In a sixth aspect, the present application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor of a computer, enables the computer to execute the method as described above.

[0015] As described above, the beam path planning, process implementation method, system, equipment and medium of the in-situ laser shock peening of the present invention have the following beneficial effects: The present application obtains a three-dimensional design model of the part to be strengthened and a structured light signal on the surface of the part to be strengthened, and based on the structured light signal, performs reverse modeling of the part to be strengthened to obtain a reverse model, and accurately matches the three-dimensional design model with the reverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the reverse model. According to the spatial position parameters, spatial path parameters and the preset corresponding pulse laser parameters, laser shock strengthening is performed on the part to be strengthened, which can realize rapid matching, identification and implementation of dynamic beam laser shock strengthening process for large structures, and greatly improve the accuracy and efficiency of on-site laser shock strengthening processing.

[0016] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work. In the drawings: Figure 1 A flow chart of a beam path planning method for in-situ laser shock peening shown as an exemplary embodiment of the present application; Figure 2 for Figure 1 A flowchart of a method for obtaining a preset path in the illustrated embodiment; Figure 3 A flow chart of a beam path planning method for in-situ laser shock peening shown as another exemplary embodiment of the present application; Figure 4 A flowchart of a process implementation method for in-situ laser shock strengthening shown in a specific embodiment of the present application; Figure 5 for Figure 4 A schematic diagram of the structure of the hardware used in the illustrated embodiment; Figure 6A block diagram of a beam path planning system for in-situ laser shock peening according to an exemplary embodiment of the present application.

[0018] Figure 7 A block diagram of a system for implementing an in-situ laser shock peening process according to an exemplary embodiment of the present application.

[0019] Figure 8 A schematic diagram of the structure of a computer system suitable for implementing an electronic device of an embodiment of the present application is shown. DETAILED DESCRIPTION

[0020] The following will describe the embodiments of the present invention with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention, not for limiting the scope of protection of the present invention.

[0021] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0022] In the following description, numerous details are discussed to provide a more thorough explanation of embodiments of the present invention; however, it is apparent to one skilled in the art that embodiments of the present invention may be practiced without these specific details.

[0023] See also Figure 1 , Figure 1 The flowchart of a beam path planning method for in-situ laser shock peening is shown as an exemplary embodiment of the present application. The beam path planning method for in-situ laser shock peening is used to plan the path of a movable beam during the laser shock peening process.

[0024] like Figure 1 As shown, in an exemplary embodiment of the present application, the beam path planning method for in-situ laser shock peening includes steps S110 to S130, which are described in detail as follows: Step S110. Acquire a three-dimensional design model of the part to be strengthened and a structured light signal of the surface of the part to be strengthened; It should be noted that the structured light signal can be obtained by collecting the surface of the part to be enhanced after the dual-source surface structured light scanning process, and can be collected by a digital camera with a charge-coupled device image sensor (ie, a CCD camera); Step S120. Based on the structured light signal, reverse modeling is performed on the part to be enhanced to obtain a reverse model; It should be noted that at least one of the triangulation method, the nearest point iteration algorithm and the non-uniform rational B-spline surface fitting algorithm is used to reverse model the part to be strengthened, and the specific steps are as follows: first, according to the acquired structured light signal reflected by the part to be strengthened, a phase demodulation algorithm is used to interpret the change in the structured light phase caused by the height difference on the object surface, and the three-dimensional point cloud information of the object to be measured is calculated according to the change; secondly, the radius filtering and uniform down-sampling methods are used to organize and pre-process the data point set to ensure the quality and applicability of the data, and then the NURBS algorithm is used to determine the position of the surface control point, and further according to the preliminary fitting effect, the parameter optimization method is used to adjust the weight parameters to optimize the fitting degree of the surface, so as to complete the reverse modeling of the part to be strengthened.

[0025] Step S130. Accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model.

[0026] Exemplarily, the three-dimensional design model and the inverse model obtained by inverse modeling are accurately matched by at least one of the fast point feature histogram algorithm, the point cloud key point detection algorithm and the random sampling consistency ICP algorithm in the image matching method. The specific steps are as follows: first, the fast point feature histogram algorithm is used to analyze and process the three-dimensional design model and the inverse model respectively, and the fast point feature histogram descriptors of the two models are obtained; secondly, a key point feature-based method is used to match the point cloud key points with the obtained fast point feature histogram descriptors, and the pose transformation matrix between the matching point pairs is obtained, and the pose transformation matrix between the two models is calculated according to the pose transformation matrix between each pair of key points. The matrix is ​​used as the initial transformation matrix, and the ICP algorithm based on random sampling consistency is used for fine point cloud registration to obtain an accurate pose transformation matrix, and the obtained fine transformation matrix is ​​used to perform coordinate transformation and pose transformation on the three-dimensional design model to complete the accurate matching with the inverse model.

[0027] In the related art, when the laser shock strengthening technology is applied to large components such as aircraft beam frames, since large components are difficult to disassemble and cannot be moved, the only option is to use the "beam moving, component fixed" technical solution. At this time, the positional relationship between the part of the large structure to be strengthened and the robot arm and the light beam is not fixed, and there are more than two three-dimensional coordinate systems. It is difficult to associate the spatial positions of the three, and the movement of the light beam lacks accurate spatial position parameters. At present, the alignment of the starting point of the strengthening process can only be achieved through manual naked eye observation and repeated adjustments. After analyzing the related technology, the inventor found that the entire adjustment process is time-consuming, inefficient, greatly affected by human factors, and poor precision, and cannot guarantee the accurate and efficient implementation of the dynamic beam laser shock strengthening process on site for large structures. Therefore, the inventors considered obtaining a three-dimensional design model of the part to be strengthened and a structured light signal on the surface of the part to be strengthened, and based on the structured light signal, reverse modeling the part to be strengthened to obtain a reverse model, and accurately match the three-dimensional design model with the reverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the reverse model, and perform laser shock strengthening on the part to be strengthened according to the spatial position parameters, spatial path parameters and the preset corresponding pulse laser parameters, which can realize rapid matching, identification and implementation of dynamic beam laser shock strengthening process for large structures, and greatly improve the accuracy and efficiency of on-site laser shock strengthening processing.

[0028] See also Figure 2 , Figure 2 The figure is a flow chart of a method for obtaining a preset path in an exemplary embodiment of the present application.

[0029] like Figure 2 As shown, in an exemplary embodiment of the present application, Figure 1 The method for obtaining the preset path in the illustrated embodiment includes the following steps: Step S210. Obtaining the material, specification and fatigue working stress distribution of the part to be strengthened; Step S220: Determine a preset path according to the material, specification and fatigue working stress distribution.

[0030] Exemplarily, according to the material, specification and fatigue working stress distribution, the specific steps for determining the preset path are as follows: based on the surface characteristics of the part to be strengthened (such as the chamfers, bottom corners and other parts of the aircraft's 7050-T7451 aluminum alloy main load-bearing bulkhead structure), the working stress distribution under fatigue load is obtained through finite element simulation analysis, and the area where the working stress exceeds the preset yield strength amplitude threshold of the material (for example, 40%) is determined as the part to be strengthened; within the part to be strengthened, in the area where the working stress is distributed gradually from large to small, the preset light beam path starts from the maximum working stress line and is arranged in a "snake-like" manner to both sides.

[0031] like Figure 2 As shown, in an exemplary embodiment of the present application, the metal additive component post-processing method includes at least the following steps S210 to S240, which are described in detail as follows: Step S310. Acquire a three-dimensional design model of the part to be strengthened and a structured light signal of the surface of the part to be strengthened; Step S320: Based on the structured light signal, reverse modeling is performed on the part to be enhanced to obtain a reverse model; Step S330. Accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model.

[0032] Step S340: Perform laser shock peening on the part to be peened according to the spatial position parameters, spatial path parameters and preset corresponding pulse laser parameters.

[0033] In the present application, the preset corresponding pulse laser parameters include spot size, energy, pulse width and other parameters.

[0034] like Figure 4 As shown, in a specific embodiment, the laser shock peening method (the system used is as shown in Figure 5 As shown, the system includes an intense pulse laser 1, a multi-joint light guide arm 2, a laser head 3, a reverse modeling box 4, two dual-source surface structure light sources 5, a CCD camera 6, a control terminal 7, a control bus 8 and a multi-axis robot arm 9) The steps are as follows: In the overall finite element model of large equipment such as aircraft, extract the three-dimensional design model, material, specification (i.e. size) and fatigue working stress distribution of the part to be strengthened; According to the material, specification (i.e., size) and fatigue working stress distribution, the laser spot position and path of the laser shock strengthening process are determined. Specifically, based on the surface characteristics of the part to be strengthened (such as the chamfers and bottom corners of the main load-bearing bulkhead structure of the aircraft 7050-T7451 aluminum alloy), the working stress distribution under fatigue load is obtained through finite element simulation analysis, and the area where the working stress exceeds the preset yield strength amplitude threshold of the material (such as 40%) is determined as the part to be strengthened; within the part to be strengthened, in the gradient distribution area of ​​the working stress from large to small, the preset beam path starts from the maximum working stress line and is arranged in a "snake-like" manner to both sides; The laser energy, pulse width, spot size and other parameters of each pulse are determined in the control terminal 7. Specifically, according to the local surface characteristics of the 7050-T7451 aluminum alloy structure, the curvature radius of the chamfer R zone is 3mm, and the laser spot diameter used is determined to be 3mm; referring to the residual stress result database of 7050-T7451 aluminum alloy laser shock hardening, the row of pulse lasers on the maximum working stress line adopts a high power density of 5.66GW / cm 2 (Specific parameters are energy 8J, pulse width 20ns, spot diameter 3mm), at this time, the residual compressive stress tends to saturation; along the working stress gradient, the laser power density gradually decreases, which are 4.24GW / cm 2 (Specific parameters are energy 6J, pulse width 20ns, spot diameter 3mm), 2.83GW / cm 2 (Specific parameters are energy 4J, pulse width 20ns, spot diameter 3mm; The control terminal 7 controls the mobile multi-axis robot arm 9, and excites the dual-source surface structured light 5 to scan the part to be strengthened, and controls the CCD camera 6 to collect the structured light signal on the surface of the part to be treated, and performs reverse modeling based on the NURBS surface fitting algorithm through the control terminal 7 based on the structured light signal. The specific steps are: first, according to the acquired structured light signal reflected by the part to be strengthened, a phase demodulation algorithm is used to interpret the change of the structured light phase caused by the height difference of the object surface, and the three-dimensional point cloud information of the object to be measured is calculated according to the change; the radius filtering and uniform downsampling methods are used to organize and pre-process the data point set to ensure the quality and applicability of the data, and then the NURBS algorithm is used to determine the position of the surface control point, and further according to the preliminary fitting effect, the parameter optimization method is used to adjust the weight parameter to optimize the fitting degree of the surface, and the reverse modeling of the part to be strengthened is completed, the reverse model of the part to be strengthened is obtained, and the temporary three-dimensional space coordinate system of the part to be strengthened (that is, the three-dimensional space coordinate corresponding to the reverse model) is obtained; In the control terminal 7, FPFH point cloud feature extraction, ISS point cloud key point detection and ICP algorithm based on random sampling are used to accurately match the original 3D design model 11 with the reverse model 10 (i.e., coincidence matching). The specific steps are as follows: first, the fast point feature histogram algorithm is used to analyze and process the 3D design model and the reverse model respectively, and the fast point feature histogram descriptors of the two models are obtained; secondly, the key point feature-based method is used to match the key points of the point cloud with the obtained fast point feature histogram descriptors, and the pose transformation matrix between the matching point pairs is obtained. The pose conversion matrix between the key points is calculated comprehensively, and the pose conversion matrix between the two models is calculated. The matrix is ​​used as the initial conversion matrix, and the ICP algorithm based on random sampling consistency is used for fine point cloud registration to obtain an accurate pose conversion matrix. The obtained fine conversion matrix is ​​used to perform coordinate conversion and pose conversion on the three-dimensional design model to complete the precise matching with the inverse model, and then the laser spot position and path 13 parameters in the original three-dimensional design model 11 are automatically assigned to the inverse model 10, so as to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path 14 in the inverse model; By controlling the multi-axis robot arm 9 to pull the multi-joint light guide arm 2 at the control terminal 7, aligning the light outlet of the laser head 3 with the laser spot position of the actual processing and the first laser spot position of the path 14, the strong pulse laser 1 is excited, and the strong pulse laser passes through the multi-joint light guide arm 2 and the laser head 3 and irradiates the surface of the component to be strengthened; Then, the multi-axis robot arm 9 is controlled to move according to the processing path, and the laser is excited accordingly to realize the subsequent processing of the light spot, so as to perform laser strengthening impact treatment on the part to be strengthened quickly and accurately.

[0035] See also Figure 6 , Figure 6 It is a block diagram of the beam path planning system for in-situ laser shock peening of the present application, and the beam path planning system for in-situ laser shock peening is used to plan the path of the movable beam during the laser shock peening process.

[0036] like Figure 6 As shown, the beam path planning system M600 for in-situ laser shock peening includes: The acquisition module M610 is configured to acquire a three-dimensional design model of the part to be enhanced and a structured light signal on the surface of the part to be enhanced; The reverse modeling module M620 is configured to perform reverse modeling on the part to be enhanced based on the structured light signal to obtain a reverse model; The matching module M630 is configured to accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model.

[0037] See also Figure 7 , Figure 7 The block diagram of the in-situ laser shock peening process implementation system of the present application.

[0038] like Figure 7 As shown, the in-situ laser shock strengthening process implementation system M700 includes: The acquisition module M710 is configured to acquire a three-dimensional design model of the part to be enhanced and a structured light signal on the surface of the part to be enhanced; The reverse modeling module M720 is configured to perform reverse modeling on the part to be enhanced based on the structured light signal to obtain a reverse model; The matching module M730 is configured to accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model; The processing module M740 is configured to perform laser shock peening on the part to be peened according to the spatial position parameters, the spatial path parameters and the preset corresponding pulse laser parameters.

[0039] It should be noted that the beam path planning system for in-situ laser shock peening provided in the above embodiment and the beam path planning method for in-situ laser shock peening provided in the above embodiment belong to the same concept, and the process implementation system for in-situ laser shock peening provided in the above embodiment and the process implementation method for in-situ laser shock peening belong to the same concept, wherein the specific manner in which each module and unit performs the operation has been described in detail in the method embodiment and will not be repeated here. In actual applications, the beam path planning system for in-situ laser shock peening and the process implementation system for in-situ laser shock peening provided in the above embodiment can allocate the above functions to different functional modules as needed, that is, divide the internal structure of the device into different functional modules to complete all or part of the functions described above, and this is not limited here.

[0040] An embodiment of the present application also provides an electronic device, including: one or more processors; a storage device for storing one or more programs, when the one or more programs are executed by the one or more processors, the electronic device implements the beam path planning method for in-situ laser shock peening or the process implementation method for in-situ laser shock peening provided in the above-mentioned embodiments.

[0041] Figure 8The structure diagram of the computer system suitable for implementing the electronic device of the embodiment of the present application is shown. It should be noted that: Figure 8 The computer system 800 of the electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0042] like Figure 8 As shown, the computer system 800 includes a central processing unit (CPU) 801, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 802 or the program loaded from the storage part 808 to the random access memory (RAM) 803, such as executing the method described in the above embodiment. In the RAM 803, various programs and data required for system operation are also stored. The CPU 801, the ROM 802 and the RAM 803 are connected to each other through the bus 804. The input / output (I / O) interface 805 is also connected to the bus 804.

[0043] The following components are connected to the I / O interface 805: an input section 806 including a keyboard, a mouse, etc.; an output section 807 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 808 including a hard disk, etc.; and a communication section 809 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to the I / O interface 805 as needed. A removable medium 811, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 810 as needed so that a computer program read therefrom is installed into the storage section 808 as needed.

[0044] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication part 809, and / or installed from a removable medium 811. When the computer program is executed by a central processing unit (CPU) 801, various functions defined in the system of the present application are executed.

[0045] It should be noted that the computer-readable medium shown in the embodiment of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier, which carries a computer-readable computer program. This propagated data signal may take a variety of forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device. A computer program contained on a computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0046] The flowchart and block diagram in the accompanying drawings illustrate the possible architecture, functions and operations of the system, method and computer program product according to various embodiments of the present application. Wherein, each box in the flowchart or block diagram can represent a module, a program segment, or a part of the code, and the above-mentioned module, program segment, or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0047] The units involved in the embodiments described in this application may be implemented by software or hardware, and the units described may also be set in a processor. The names of these units do not, in some cases, constitute limitations on the units themselves.

[0048] Another aspect of the present application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor of a computer, causes the computer to execute the beam path planning method for in-situ laser shock peening or the process implementation method for in-situ laser shock peening as described above. The computer-readable storage medium may be included in the electronic device described in the above embodiment, or may exist independently without being assembled into the electronic device.

[0049] Another aspect of the present application also provides a computer program product or a computer program, which includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the beam path planning method for in-situ laser shock peening or the process implementation method for in-situ laser shock peening provided in the above-mentioned various embodiments.

[0050] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A beam path planning method for in-situ laser shock peening, wherein the beam path planning method for in-situ laser shock peening is used to plan the spatial positioning and movement path of a moving beam during in-situ laser shock peening of equipment, characterized in that: The beam path planning method for in-situ laser shock peening comprises the following steps: Acquire a three-dimensional design model of the part to be strengthened and a structured light signal on the surface of the part to be strengthened; Based on the structured light signal, reverse modeling is performed on the part to be enhanced to obtain a reverse model; The three-dimensional design model is accurately matched with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model.

2. The beam path planning method for in-situ laser shock peening according to claim 1, characterized in that: At least one of a triangulation method, a nearest point iteration algorithm and a non-uniform rational B-spline surface fitting algorithm is used to perform reverse modeling on the part to be strengthened.

3. The beam path planning method for in-situ laser shock peening according to claim 1, characterized in that: The three-dimensional design model and the inverse model are accurately matched by an image matching method.

4. The beam path planning method for in-situ laser shock peening according to claim 3, characterized in that: The three-dimensional design model is accurately matched with the reverse model obtained by reverse modeling through at least one of a fast point feature histogram algorithm, a point cloud key point detection algorithm and a random sampling consistency algorithm in the image matching method.

5. The beam path planning method for in-situ laser shock peening according to claim 1, characterized in that: The preset path is obtained by the following method: Obtain the material, specification and fatigue working stress distribution of the part to be strengthened; The preset path is determined according to the material, specification and fatigue working stress distribution.

6. A process implementation method for in-situ laser shock strengthening, characterized in that: The process implementation method of the in-situ laser shock strengthening comprises the following steps: Acquire a three-dimensional design model of the part to be strengthened and a structured light signal on the surface of the part to be strengthened; Based on the structured light signal, reverse modeling is performed on the part to be enhanced to obtain a reverse model; Accurately matching the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model; The laser shock peening treatment is performed on the part to be peened according to the spatial position parameters, spatial path parameters and preset corresponding pulse laser parameters.

7. A beam path planning system for in-situ laser shock peening, wherein the beam path planning system for in-situ laser shock peening is used to plan the spatial positioning and movement path of a moving beam during laser shock peening, and is characterized in that: The beam path planning system for in-situ laser shock peening includes: An acquisition module is configured to obtain a three-dimensional design model of the part to be enhanced and a structured light signal on the surface of the part to be enhanced; A reverse modeling module is configured to perform reverse modeling on the part to be enhanced based on the structured light signal to obtain a reverse model; The matching module is configured to accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model.

8. A process implementation system for in-situ laser shock strengthening, characterized in that: The process implementation system of the in-situ laser shock strengthening comprises: An acquisition module is configured to obtain a three-dimensional design model of the part to be enhanced and a structured light signal on the surface of the part to be enhanced; A reverse modeling module is configured to perform reverse modeling on the part to be enhanced based on the structured light signal to obtain a reverse model; A matching module is configured to accurately match the three-dimensional design model with the inverse model to obtain the spatial position parameters and spatial path parameters corresponding to the center position of each pulse laser and the preset path in the inverse model; The processing module is configured to perform laser shock peening on the part to be peened according to the spatial position parameters, spatial path parameters and preset corresponding pulse laser parameters.

9. An electronic device, characterized in that: The electronic device comprises: one or more processors; A storage device for storing one or more programs, which, when executed by the one or more processors, enables the electronic device to implement the method as claimed in any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor of a computer, the computer is caused to execute the method according to any one of claims 1 to 6.

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