Electronic chip packaging equipment with protection structure

Abstract

The invention relates to the technical field of chip packaging, and particularly discloses electronic chip packaging equipment with a protection structure, the electronic chip packaging equipment comprises a rack and a working frame mounted on the rack, and the rack is provided with a transmission piece for conveying workpieces; the conveying part comprises a conveying belt rotationally connected to the rack, and a power mechanism used for driving the conveying belt to move is arranged on the rack. A plurality of sets of machining frames used for installing workpieces are installed on the conveying belt, a bearing plate is vertically connected to the working frames in a sliding mode through a power piece, and a dispensing mechanism used for dispensing operation is installed on the bearing plate. In the stroke that the power piece drives the bearing plate to slide upwards and the stroke that the linkage piece drives the extrusion plate to slide downwards, the extrusion plate drives the pressing block to slide downwards, the packaged workpiece is extruded through the pressing block, gaps in the middle of the whole chip are reduced, and therefore the chip can be packaged more firmly, and the chip packaging efficiency is improved. And a fault of the chip caused by a gap in a later period is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field, and in particular to an electronic chip packaging device with a protective structure. Background Art

[0002] Chip is a general term for semiconductor component products, also known as microcircuit, microchip, integrated circuit. It refers to a silicon wafer containing an integrated circuit, which is very small and is often a part of a computer or other electronic device. Semiconductor is a general term for a class of materials. Integrated circuits are a large collection of circuits made of semiconductor materials. Chips are products formed by different types of integrated circuits or a single type of integrated circuit. Chips have very strict production conditions and must be kept at a constant temperature and humidity. Even the dust particle size in the air needs to be controlled. Exposed chips will be corroded by air dust and affected by static electricity. In order to ensure the integrity of the chip, the chip needs to use membrane technology and micro-processing technology to layout, paste, fix, and connect the lead terminals on the frame or substrate, and fix them by encapsulating with a plastic insulating medium.

[0003] Chip packaging refers to the shell used to install semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. After the chip is installed in the package board, the package board needs to be fixed on the substrate. Most existing technologies use glue dispensing and adhesion. Glue is dispensed on the package board by a glue dispenser, and then the glue dispensing surface of the package board is pressed down toward the substrate, and the glue is cooled.

[0004] The chip packaging equipment in the prior art, such as the Chinese patent with application number 202321417649.4, authorization announcement number CN220233147U, and name of an electronic chip packaging equipment with a protective structure, discloses an electronic chip packaging equipment with a protective structure, which belongs to the field of electronic chip packaging technology, including a base; a protective shell connected to the top of the base, and the inner wall of the protective shell is provided with a guide fan. In the above patent, the chip package can be clamped and positioned, and the chip package can be moved and controlled by a moving component, which is convenient for the chip packaging machine to process the chip package, and the guide fan inside the installation shell can be used to blow and guide the inside of the protective shell.

[0005] Another example is the Chinese patent with application number 202223601612.5, authorization announcement number CN219246637U, and name of a silicon-based optoelectronic chip packaging device. The above patent discloses a silicon-based optoelectronic chip packaging device, including a base; a workbench is fixedly connected to the top of the base; a support plate is fixedly connected to one end of the top of the workbench; two groups of fixed rods are fixedly connected to the side of the support plate away from the workbench; the two groups of fixed rods are fixed at a right angle to the support plate; the two groups of fixed rods are slidably connected to the end of the support plate away from the support plate with a clamping rod; and a moving rod is slidably connected to the middle of the support plate. In the above patent, the operator starts the electric telescopic rod, so that the electric telescopic rod drives the moving rod to move forward and backward, and then drives the clamping rods to move closer to or away from each other, so as to fix the pads of different specifications, thereby facilitating the packaging of optoelectronic chips of different specifications.

[0006] It is well known that the chip packaging process is the process of assembling integrated circuits into the final chip product. Simply put, it is to place the bare integrated circuit chips produced by the foundry on a substrate that serves as a carrier, lead out the pins, and then fix and package them into a whole. In the chip packaging process, glue is usually required to bond the substrate and the shell together, so as to facilitate the storage and transportation of the chip in the later stage. During the use of the chip packaging equipment in the prior art, after the substrate and the shell are bonded, the shell and the substrate are not pressed. Therefore, after the glue is air-dried and formed, there is a gap between the substrate and the shell, which affects the use of the chip in the later stage to a certain extent. Summary of the invention

[0007] The object of the present invention is to provide an electronic chip packaging device with a protective structure to solve the problems raised in the above background technology.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an electronic chip packaging device with a protective structure, comprising a frame and a working frame installed on the frame, a transmission member for conveying workpieces being installed on the frame; the transmission member comprises a conveyor belt rotatably connected to the frame, and a power mechanism for driving the conveyor belt to move is provided on the frame; a plurality of processing frames for installing workpieces are installed on the conveyor belt, and a carrying plate is vertically slidably connected to the working frame through a power member, and a gluing mechanism for gluing operation is installed on the carrying plate; an extrusion plate is vertically slidably connected to the working frame, a pressure block is installed on the extrusion plate, and the carrying plate and the extrusion plate are connected by a linkage member; when the gluing operation of the workpiece is completed, the power member drives the carrying plate to slide upward in a stroke, and drives the extrusion plate to slide downward in a stroke through a linkage member, so that the extrusion plate drives the pressure block to slide downward to extrude the workpiece.

[0009] Furthermore, a clamping member is arranged between the processing frame and the workpiece, and the clamping member and the supporting plate are connected through a trigger member; when the power member drives the supporting plate to drive the dispensing mechanism to slide close to one side of the workpiece, the trigger member drives the clamping member to fix the workpiece to improve the stability of the workpiece during the dispensing operation.

[0010] Furthermore, an adapting groove is provided on the extrusion plate, and the pressing block is slidably connected to the extrusion plate through the adapting groove; and a plurality of groups of buffer springs are arranged between the pressing block and the adapting groove.

[0011] Furthermore, the linkage member includes a linkage rod rotatably connected to the working frame, a linkage gear is installed on the linkage rod, a first rack is fixedly connected to the bearing plate, a second rack is fixedly connected to the extrusion plate, and the first rack and the second rack are respectively meshed on both sides of the linkage gear.

[0012] Furthermore, a plurality of vertical grooves are provided on the side walls of the processing frame, and positioning blocks are fixedly connected to the supporting plate and the extrusion plate, and each positioning block is slidably connected in a corresponding vertical groove to improve the stability of the supporting plate and the extrusion plate when sliding.

[0013] Furthermore, the clamping member comprises clamping plates slidably connected to both sides of the processing frame, the surfaces of the clamping plates are fixedly connected with anti-slip parts, and a limiting unit is arranged between each of the clamping plates and the processing frame.

[0014] Furthermore, the trigger member includes a wedge-shaped connecting block fixedly connected to the side wall of the clamping plate, a trigger rod is fixedly connected to the bearing plate, the end of the trigger rod is wedge-shaped, and the trigger rod intermittently abuts against the wedge-shaped connecting block.

[0015] Furthermore, a compression spring is provided between each of the clamping plates and the processing frame, and the elastic force of the compression spring drives the clamping plates on both sides to move away from each other to facilitate the disassembly of the workpiece.

[0016] Furthermore, the limiting unit includes a limiting block fixedly connected to the bottom of the clamping plate, and the processing frame is provided with a limiting groove adapted to the limiting block. When the clamping plate slides on the processing frame, the limiting block is slidably connected in the limiting groove.

[0017] Furthermore, each of the processing frames is connected to the conveyor belt via a fastener; the fastener comprises a fastening block fixedly connected to the side wall of the processing frame, a threaded groove is provided on the fastening block, the threaded groove is connected to the conveyor belt, and a bolt is threadedly connected inside the threaded groove.

[0018] Compared with the prior art, the beneficial effect of the present invention is that: when the workpiece dispensing operation is completed, the power part drives the carrier plate to slide upward during the stroke, and drives the extrusion plate to slide downward through the linkage part, so that the extrusion plate drives the pressure block to slide downward to squeeze the workpiece, and the pressure block is used to extrude the packaged workpiece to reduce the gap in the middle of the entire chip, so that the chip packaging can be tightened, thereby meeting the work needs, avoiding the chip failure due to the gap in the later stage, and further meeting the work needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0020] Figure 1 A schematic diagram of the overall structure provided by an embodiment of the present invention;

[0021] Figure 2 A schematic diagram of the overall structure from another perspective provided by an embodiment of the present invention;

[0022] Figure 3 A schematic diagram of the structure of the power component installation method provided in an embodiment of the present invention;

[0023] Figure 4 A schematic diagram of the structure of a processing frame provided in an embodiment of the present invention installed on a conveying member;

[0024] Figure 5 A schematic diagram of a local working state structure provided by an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of the structure of the linkage member installation method provided in an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of the structure of the dispensing mechanism in the installation state provided by an embodiment of the present invention;

[0027] Figure 8 A schematic diagram of the structure of the trigger member in a separated state provided by an embodiment of the present invention;

[0028] Fig. 9 A schematic diagram of a processing frame structure provided by an embodiment of the present invention;

[0029] Fig.10 A schematic diagram of a partial structure of a clamping mechanism provided in an embodiment of the present invention;

[0030] Fig.11A schematic diagram of the structure of a clamping mechanism in a partially deployed state provided by an embodiment of the present invention;

[0031] Fig.12 A schematic diagram of the local structure of a supporting member provided in an embodiment of the present invention.

[0032] Explanation of the accompanying drawings: 1. frame; 2. working frame; 3. transmission member; 4. power member; 5. bearing plate; 6. dispensing mechanism; 7. processing frame; 8. workpiece; 9. clamping member; 91. clamping plate; 92. wedge-shaped connecting block; 93. extrusion spring; 94. limit block; 95. limit groove; 96. anti-slip part; 10. trigger rod; 11. extrusion plate; 12. pressure block; 13. linkage member; 131. first rack; 132. linkage gear; 133. linkage rod; 134. second rack; 14. fastening block; 15. adapter groove; 16. buffer spring. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figure 1-Figure 12 The present invention provides a technical solution: an electronic chip packaging device with a protective structure, comprising a frame 1 and a working frame 2 installed on the frame 1, a transmission member 3 for conveying a workpiece 8 is installed on the frame 1; the transmission member 3 comprises a conveyor belt rotatably connected to the frame 1, and a power mechanism for driving the conveyor belt to move is provided on the frame 1; a plurality of processing frames 7 for mounting the workpiece 8 are installed on the conveyor belt, and a carrying plate 5 is vertically slidably connected to the working frame 2 through a power member 4, and a glue dispensing mechanism 6 for glue dispensing operation is installed on the carrying plate 5; an extrusion plate 11 is vertically slidably connected to the working frame 2, a pressing block 12 is installed on the extrusion plate 11, and the carrying plate 5 is connected to the extrusion plate 11 through a linkage member 13 for transmission; when the glue dispensing operation of the workpiece 8 is completed, the power member 4 drives the carrying plate 5 to slide upward in the stroke in which the extrusion plate 11 is driven downward through the linkage member 13, so that the extrusion plate 11 drives the pressing block 12 to slide downward to extrude the workpiece 8.

[0035] Specifically, the electronic chip packaging equipment with a protective structure includes a frame 1 and a working frame 2 installed on the frame 1. A transmission member 3 for conveying a workpiece 8 is installed on the frame 1, wherein the transmission member is a prior art and is used to convey the workpiece 8. The transmission member 3 includes a conveyor belt rotatably connected to the frame 1, and a power mechanism for driving the conveyor belt to move is provided on the frame 1. When in use, the conveyor belt is driven to move by the power mechanism, and the workpiece 8 is driven to operate by the conveyor belt. The conveyor belt is installed with multiple groups of processing frames 7 for installing the workpiece 8, and a supporting plate 5 is vertically slidably connected to the working frame 2 through a power member 4, and a dispensing mechanism 6 for dispensing operation is installed on the supporting plate 5. Specifically, the dispensing mechanism 6 is a prior art and is used for chip packaging operations. A pressing plate 11 is vertically slidably connected to the working frame 2, and a pressing block 12 is installed on the pressing plate 11. The pressing block 12 is used to squeeze the packaged chip, so as to make the packaged chip more stable, reduce the gap, and avoid affecting the use of the later chip. The carrier plate 5 and the extrusion plate 11 are connected by a linkage 13, thereby reducing the use of a driving source and further improving the practicality of the device. Specifically, in actual use, when the dispensing operation of the workpiece 8 is completed, the power member 4 drives the carrier plate 5 to slide upward, and drives the extrusion plate 11 to slide downward through the linkage 13, so that the extrusion plate 11 drives the pressing block 12 to slide downward, and the workpiece 8 is squeezed. The packaged workpiece 8 is squeezed by the pressing block 12, reducing the gap in the middle of the entire chip, so that the chip package can be tightened, so as to meet the work needs, avoid the situation where the chip fails due to the gap in the later stage, and further meet the work needs.

[0036] In the embodiment provided by the present invention, a clamping member 9 is provided between the processing frame 7 and the workpiece 8, and the clamping member 9 is connected to the supporting plate 5 by a trigger transmission, so as to provide power for clamping the workpiece 8, further meeting the working needs. When the power member 4 drives the supporting plate 5 to drive the dispensing mechanism 6 to slide close to one side of the workpiece 8, the trigger member drives the clamping member 9 to fix the workpiece 8, so as to improve the stability of the workpiece 8 during the dispensing operation. Therefore, during use, when the supporting plate 5 slides downward, when the workpiece 8 is being dispensed, the trigger member drives the clamping member 9 to fix the workpiece 8 at this moment. Improve the working efficiency of the entire equipment.

[0037] In the embodiment provided by the present invention, an adapting groove 15 is provided on the extrusion plate 11, and the pressing block 12 is slidably connected to the extrusion plate 11 through the adapting groove 15; and a plurality of groups of buffer springs 16 are arranged between the pressing block 12 and the adapting groove 15 to further meet working requirements.

[0038] In the embodiment provided by the present invention, the linkage member 13 includes a linkage rod 133 rotatably connected to the working frame 2, a linkage gear 132 is installed on the linkage rod 133, a first rack 131 is fixedly connected to the carrier plate 5, a second rack 134 is fixedly connected to the extrusion plate 11, and the first rack 131 and the second rack 134 are respectively meshed on both sides of the linkage gear 132. When the carrier plate 5 slides upward, the extrusion plate 11 is driven to slide downward through the cooperation between the first rack 131, the second rack 134 and the linkage gear 132, so that the pressing block 12 performs an extrusion operation on the workpiece 8.

[0039] In the embodiment provided by the present invention, a plurality of vertical grooves are provided on the side walls of the processing frame 7, and positioning blocks are fixedly connected to the supporting plate 5 and the extrusion plate 11, and each positioning block is slidably connected in the corresponding vertical groove to improve the stability of the supporting plate 5 and the extrusion plate 11 when sliding.

[0040] In the embodiment provided by the present invention, the clamping member 9 includes clamping plates 91 slidably connected to both sides of the processing frame 7, and an anti-slip portion 96 is fixedly connected to the surface of the clamping plate 91. A limiting unit is arranged between each clamping plate 91 and the processing frame 7. The limiting unit includes a limiting block 94 fixedly connected to the bottom of the clamping plate 91, and a limiting groove 95 matched with the limiting block 94 is opened on the processing frame 7. When the clamping plate 91 slides on the processing frame 7, the limiting block 94 is slidably connected in the limiting groove 95, thereby improving the stability of the clamping plate 91 when sliding.

[0041] In the embodiment provided by the present invention, the trigger member includes a wedge-shaped connecting block 92 fixedly connected to the side wall of the clamping plate 91, and a trigger rod 10 is fixedly connected to the carrier plate 5. The end of the trigger rod 10 is wedge-shaped, and the trigger rod 10 intermittently abuts against the wedge-shaped connecting block 92. When the trigger rod 10 slides downward, the clamping plate 91 is driven to slide through the wedge-shaped connecting block 92 to perform an extrusion operation on the workpiece 8.

[0042] In the embodiment provided by the present invention, a compression spring 93 is provided between each clamping plate 91 and the processing frame 7 , and the elastic force of the compression spring 93 drives the clamping plates 91 on both sides to move away from each other to facilitate the disassembly of the workpiece 8 .

[0043] In the embodiment provided by the present invention, each processing frame 7 is connected to the conveyor belt by a fastener; the fastener includes a fastening block 14 fixedly connected to the side wall of the processing frame 7, and a threaded groove is provided on the fastening block 14, which is connected to the conveyor belt, and a bolt is threadedly connected inside the threaded groove, thereby facilitating the installation and disassembly of the processing frame 7.

[0044] It should be noted that the electrical equipment involved in this application can be powered by batteries or external power supply.

[0045] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electronic chip packaging device with a protective structure, comprising a frame (1) and a working frame (2) mounted on the frame (1), characterized in that: A transmission member (3) for conveying a workpiece (8) is mounted on the frame (1); the transmission member (3) comprises a conveyor belt rotatably connected to the frame (1), and a power mechanism for driving the conveyor belt to move is arranged on the frame (1); The conveyor belt is provided with a plurality of processing frames (7) for installing workpieces (8), and a bearing plate (5) is vertically slidably connected to the working frame (2) via a power member (4), and a dispensing mechanism (6) for dispensing operations is installed on the bearing plate (5); A pressing plate (11) is vertically slidably connected to the working frame (2), a pressing block (12) is installed on the pressing plate (11), and the bearing plate (5) is transmission-connected to the pressing plate (11) via a linkage (13); When the glue dispensing operation of the workpiece (8) is completed, the power member (4) drives the supporting plate (5) to slide upwards, and drives the extrusion plate (11) to slide downwards through the linkage member (13), so that the extrusion plate (11) drives the pressing block (12) to slide downwards, thereby extruding the workpiece (8).

2. The electronic chip packaging device with a protective structure according to claim 1, characterized in that: A clamping member (9) is provided between the processing frame (7) and the workpiece (8), and the clamping member (9) is connected to the carrying plate (5) by a trigger member. When the power member (4) drives the carrier plate (5) to drive the glue dispensing mechanism (6) to slide close to one side of the workpiece (8), the trigger member drives the clamping member (9) to fix the workpiece (8) to improve the stability of the workpiece (8) during the glue dispensing operation.

3. The electronic chip packaging device with a protective structure according to claim 1, characterized in that: The extrusion plate (11) is provided with an adapting groove (15), and the pressing block (12) is slidably connected to the extrusion plate (11) via the adapting groove (15); and a plurality of groups of buffer springs (16) are arranged between the pressing block (12) and the adapting groove (15).

4. The electronic chip packaging device with a protective structure according to claim 3, characterized in that: The linkage member (13) comprises a linkage rod (133) rotatably connected to the working frame (2); a linkage gear (132) is mounted on the linkage rod (133); a first rack (131) is fixedly connected to the bearing plate (5); a second rack (134) is fixedly connected to the extrusion plate (11); the first rack (131) and the second rack (134) are respectively meshed on two sides of the linkage gear (132).

5. The electronic chip packaging device with a protective structure according to claim 4, characterized in that: The processing frame (7) has a plurality of vertical grooves on its side wall, and the bearing plate (5) and the extrusion plate (11) are fixedly connected with positioning blocks, each of which is slidably connected in a corresponding vertical groove to improve the stability of the bearing plate (5) and the extrusion plate (11) when sliding.

6. The electronic chip packaging device with a protective structure according to claim 2, characterized in that: The clamping member (9) comprises clamping plates (91) connected to the two sides of the processing frame (7) in a slidable manner towards each other, an anti-slip portion (96) is fixedly connected to the surface of the clamping plate (91), and a limiting unit is arranged between each clamping plate (91) and the processing frame (7).

7. The electronic chip packaging device with a protective structure according to claim 6, characterized in that: The trigger member comprises a wedge-shaped connecting block (92) fixedly connected to the side wall of the clamping plate (91); a trigger rod (10) is fixedly connected to the carrier plate (5); the end of the trigger rod (10) is wedge-shaped; the trigger rod (10) is intermittently abutted against the wedge-shaped connecting block (92).

8. The electronic chip packaging device with a protective structure according to claim 6, characterized in that: A pressing spring (93) is provided between each of the clamping plates (91) and the processing frame (7), and the elastic force of the pressing spring (93) drives the clamping plates (91) on both sides to move away from each other, so as to facilitate the disassembly of the workpiece (8).

9. The electronic chip packaging device with a protective structure according to claim 6, characterized in that: The limiting unit comprises a limiting block (94) fixedly connected to the bottom of the clamping plate (91); a limiting groove (95) adapted to the limiting block (94) is provided on the processing frame (7); when the clamping plate (91) slides on the processing frame (7), the limiting block (94) is slidably connected in the limiting groove (95).

10. The electronic chip packaging device with a protective structure according to claim 1, characterized in that: Each of the processing frames (7) is connected to the conveyor belt via a fastener; The fastener comprises a fastening block (14) fixedly connected to the side wall of the processing frame (7), the fastening block (14) being provided with a thread groove, the thread groove being connected to the conveyor belt, and a bolt being threadedly connected inside the thread groove.

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