Film expanding wafer inspection device

Abstract

The invention provides a film expansion wafer inspection device, and relates to the technical field of film expansion wafer inspection. A film-expanded wafer is placed on the top surface of the base, the wafer is positioned above the transparent supporting plate, the cover plate covers and presses the positioning frame to expand the blue film and lighten the lighting equipment, so that the wafer is separated into crystal grains which are arranged at intervals along the cutting line under the effect of film expansion, defective crystal grains are easily found under the illumination of the lighting equipment, the inspection difficulty of the film-expanded wafer is effectively reduced, and the inspection efficiency is improved. And the inspection efficiency and precision are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of film expansion wafer inspection, and in particular to a film expansion wafer inspection device. Background Art

[0002] The expanded film wafer includes the wafer, positioning frame and blue film. The expanded film wafer needs to be cut and inspected before expansion.

[0003] The wafer and the positioning frame are attached to the blue film before cutting, and the wafer is positioned by the positioning frame to improve the cutting accuracy of the wafer. After cutting, since the wafer is stuck with the blue film, it is difficult to identify even if there is mechanical damage, and manual inspection of each die is required, which makes the inspection difficult, inefficient, and the inspection accuracy cannot be guaranteed. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a device for inspecting expanded film wafers, which solves the problems of difficulty, low efficiency and low precision in inspecting expanded film wafers.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] A film expansion wafer inspection device, the film expansion wafer inspection device comprising: a base, a lighting device, a transparent support plate and a cover plate;

[0007] A lighting device is installed on the top surface of the base, and a transparent support plate is installed above the lighting device through a plurality of support rods;

[0008] The cover plate is provided with a through hole, and when the cover plate is covered on the top surface of the base, the transparent support plate passes through the through hole and extends to the top of the cover plate;

[0009] The diameter of the transparent support plate is larger than the wafer diameter of the film expansion wafer, and the diameter of the through hole is smaller than the outer diameter of the positioning frame of the film expansion wafer.

[0010] Preferably, the wafer and the positioning frame are attached to the blue film.

[0011] Preferably, the switch of the lighting device is installed on the top surface of the base, and the lighting device is lit by pressing the switch when the cover is closed, and the lighting device is turned off by resetting the switch when the cover is opened.

[0012] Preferably, the top surface of the base is provided with a limiting block matching the positioning frame, and when the expanded film wafer is placed on the base, the positioning frame is clamped in the area surrounded by the limiting block, so that the wafer is positioned just above the transparent support plate.

[0013] Preferably, the base is hinged to the cover plate.

[0014] Preferably, the cover plate is provided with avoidance holes corresponding one-to-one with the limit blocks.

[0015] Preferably, a clamping clamp is installed on the base, and the clamping clamp is used to press down and lock the free end of the cover plate in the closed state.

[0016] Preferably, the lighting device 11 is an LED lamp bead array adhered to the top surface of the base 10 .

[0017] Preferably, the top surface of the base is configured as an inclined wedge-shaped surface.

[0018] The present invention provides a device for inspecting expanded film wafers. Compared with the prior art, the device has the following beneficial effects:

[0019] In the present invention, the expanded film wafer is placed on the top surface of the base, the wafer is positioned above the transparent support plate, the cover plate is closed to press the positioning frame down to expand the blue film and light up the lighting equipment, so that the wafer is separated into spaced-apart grains along the cutting line under the action of the expansion film, and the defective grains can be easily found under the illumination of the lighting equipment, which effectively reduces the inspection difficulty of the expanded film wafer and improves the inspection efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 Schematic diagram of the structure of the expanded film wafer in an embodiment of the present invention.

[0022] Figure 2 Schematic diagram of the structure of the expanded film wafer inspection device in the embodiment of the present invention when the cover is opened.

[0023] Figure 3 Schematic diagram of the structure of the expanded film wafer inspection device in the cover-closed state according to an embodiment of the present invention.

[0024] The reference numerals in the figure are set as: wafer 01, positioning frame 02, blue film 03, base 10, lighting device 11, transparent support plate 12, support rod 13, switch 14, limit block 15, clamping clamp 16, cover plate 20, through hole 21, avoidance hole 22. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] The embodiments of the present application provide a device for inspecting expanded film wafers, thereby solving the problems of difficulty, low efficiency and low precision in inspecting expanded film wafers.

[0027] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0028] Example:

[0029] like Figure 1-Figure 3 As shown, the present invention provides a device for inspecting an expanded film wafer, the device comprising: a base 10, a lighting device 11, a transparent support plate 12 and a cover plate 20;

[0030] The top surface of the base 10 is installed with a lighting device 11, and a transparent support plate 12 is installed above the lighting device 11 through a plurality of support rods 13;

[0031] The cover plate 20 is provided with a through hole 21. When the cover plate 20 covers the top surface of the base 10, the transparent support plate 12 passes through the through hole 21 and extends to the top of the cover plate 20.

[0032] The diameter of the transparent support plate 12 is larger than the diameter of the wafer 01 of the expanded film wafer, and the diameter of the through hole 21 is smaller than the outer diameter of the positioning frame 02 of the expanded film wafer.

[0033] like Figure 1 As shown, the wafer 01 and the positioning frame 02 are co-centrically attached to the blue film 03 before the wafer is cut.

[0034] The lighting device 11 is an LED lamp bead array adhered to the top surface of the base 10 .

[0035] like Figure 2 , Figure 3 As shown, the switch 14 of the lighting device 11 is installed on the top surface of the base 10. When the cover 20 is closed, pressing the switch 14 turns on the lighting device 11. When the cover 20 is open, the switch 14 is reset to turn off the lighting device 11.

[0036] like Figure 2 , Figure 3As shown, the top surface of the base 10 is provided with a limit block 15 matching the positioning frame 02. When the expanded film wafer is placed on the base 10, the positioning frame 02 is clamped in the area surrounded by the limit block 15, so that the wafer 01 is positioned just above the transparent support plate 12.

[0037] like Figure 2 , Figure 3 As shown, the base 10 is hinged to the cover plate 20 .

[0038] like Figure 2 , Figure 3 As shown, the cover plate 20 is provided with avoidance holes 22 corresponding to the limit blocks 15 one by one, and the avoidance holes 22 provide a passage for the limit blocks 15 to pass through the cover plate 20 to prevent the limit blocks 15 from affecting the closing of the cover plate 20.

[0039] like Figure 2 , Figure 3 As shown, a clamping clamp 16 is installed on the base 10, and the clamping clamp 16 is used to press down and lock the free end of the cover plate 20 in the closed state.

[0040] like Figure 2 , Figure 3 As shown, the top surface of the base 10 is configured as an inclined wedge-shaped surface, which is convenient for the inspector to inspect in a sitting position.

[0041] In summary, compared with the prior art, the present invention has the following beneficial effects:

[0042] In the embodiment of the present invention, the expanded film wafer is placed on the top surface of the base 10, the wafer 01 is positioned above the transparent support plate 12, the cover plate 20 covers the downward pressing positioning frame 02 to expand the blue film 03 and lights up the lighting device 11, so that the wafer 01 is separated into spaced-apart grains along the cutting line under the action of the expansion pattern, and the defective grains can be easily found under the illumination of the lighting device 11, which effectively reduces the inspection difficulty of the expanded film wafer and improves the inspection efficiency and accuracy.

[0043] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0044] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A film expansion wafer inspection device, characterized in that: The expanded film wafer inspection device comprises: a base (10), a lighting device (11), a transparent support plate (12) and a cover plate (20); A lighting device (11) is installed on the top surface of the base (10), and a transparent support plate (12) is installed above the lighting device (11) via a plurality of support rods (13); The cover plate (20) is provided with a through hole (21), and when the cover plate (20) is covered on the top surface of the base (10), the transparent support plate (12) passes through the through hole (21) and extends to the top of the cover plate (20); The diameter of the transparent support plate (12) is greater than the diameter of the expanded film wafer (01), and the diameter of the through hole (21) is smaller than the outer diameter of the positioning frame (02) of the expanded film wafer.

2. The expanded film wafer inspection device according to claim 1, characterized in that: The wafer (01) and the positioning frame (02) are attached to the blue film (03).

3. The expanded film wafer inspection device according to claim 1, characterized in that: The switch (14) of the lighting device (11) is mounted on the top surface of the base (10); when the cover plate (20) is in a closed state, pressing the switch (14) causes the lighting device (11) to light up; when the cover plate (20) is in an open state, resetting the switch (14) causes the lighting device (11) to turn off.

4. The expanded film wafer inspection device according to claim 1, characterized in that: The top surface of the base (10) is provided with a limit block (15) matching the positioning frame (02); when the expanded film wafer is placed on the base (10), the positioning frame (02) is clamped in the area surrounded by the limit block (15), so that the wafer (01) is positioned just above the transparent support plate (12).

5. The expanded film wafer inspection device according to claim 1, characterized in that: The base (10) is hinged to the cover plate (20).

6. The expanded film wafer inspection device according to claim 4, characterized in that: The cover plate (20) is provided with avoidance holes (22) corresponding one-to-one with the limit blocks (15).

7. The expanded film wafer inspection device according to claim 1, characterized in that: A clamping clamp (16) is installed on the base (10), and the clamping clamp (16) is used to press down and lock the free end of the cover plate (20) in a closed state.

8. The expanded film wafer inspection device according to claim 1, characterized in that: The lighting device 11 is an LED lamp bead array adhered to the top surface of the base 10 .

9. The expanded film wafer inspection device according to any one of claims 1 to 8, characterized in that: The top surface of the base (10) is arranged as an inclined wedge-shaped surface.

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