POP packaging structure, preparation method thereof and electronic equipment

Abstract

The invention provides a POP packaging structure, a preparation method thereof and electronic equipment, and the POP packaging structure comprises a first packaging unit; the first side of the second packaging unit deviates from the first side of the first packaging unit, and the second packaging unit is provided with at least one threading channel penetrating in the thickness direction; the middle section of the conductive lead is arranged in the threading channel, the first end of the conductive lead is connected with the first side of the first packaging unit, and the second end of the conductive lead is connected with the first side of the second packaging unit; and the plastic packaging body is arranged on the first side of the first packaging unit and the first side of the second packaging unit, is connected with the first packaging unit and the second packaging unit, and wraps the conductive lead.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and more specifically, to a POP packaging structure and a preparation method thereof and an electronic device. Background Art

[0002] In the prior art, POP packaging solutions often use BGA solder ball interconnection or copper pillar array interconnection, which have problems such as low packaging density and high cost. For example, the solder ball interconnection method has limited packaging density due to the limitation of solder ball size; and although the copper pillar interconnection solution improves the integration, its production cost is relatively high. Summary of the invention

[0003] The present application provides a new technical solution for a POP packaging structure, which can at least solve at least one of the problems of low packaging density and high cost of the existing POP packaging structure.

[0004] The present application also provides a new technical solution for a method for preparing a POP packaging structure.

[0005] The present application also provides a new technical solution for electronic equipment.

[0006] According to a first aspect of the present application, a POP packaging structure is provided, comprising: a first packaging unit; a second packaging unit, wherein a first side of the second packaging unit faces away from a first side of the first packaging unit, and the second packaging unit is provided with at least one threading channel penetrating in a thickness direction thereof; at least one conductive lead, wherein a middle section of the conductive lead is provided in the threading channel, a first end of the conductive lead is connected to a first side of the first packaging unit, and a second end of the conductive lead is connected to a first side of the second packaging unit; and a plastic packaging body, wherein the plastic packaging body is provided on first sides of the first packaging unit and the second packaging unit, the plastic packaging body connects the first packaging unit and the second packaging unit, and covers the conductive lead.

[0007] Optionally, the POP packaging structure further includes: a support body, wherein the support body is disposed between a first side of the first packaging unit and a second side of the second packaging unit, and the plastic packaging body covers at least a portion of the support body.

[0008] Optionally, the POP packaging structure includes a plurality of the supporting bodies.

[0009] Optionally, at least a portion of the support body is formed as a conductive column, and the conductive column electrically connects the first packaging unit and the second packaging unit.

[0010] Optionally, the support body is an insulator.

[0011] Optionally, the support body is disposed at an edge of a first side of the first packaging unit.

[0012] Optionally, the threading channel is an avoidance hole or an avoidance gap.

[0013] Optionally, the POP packaging structure includes a plurality of the conductive leads, and the threading channel is configured to allow the plurality of the conductive leads to pass through.

[0014] According to the second aspect of the present application, a preparation method of a POP packaging structure is provided, comprising: connecting a support body between a first packaging unit and a second packaging unit, wherein the first side of the second packaging unit faces away from the first side of the first packaging unit, and the second packaging unit is provided with at least one threading channel extending through the thickness direction thereof; arranging a middle section of a conductive lead in the threading channel, and connecting the first end of the conductive lead to the first side of the first packaging unit, and connecting the second end of the conductive lead to the first side of the second packaging unit; performing plastic sealing on the first side of the first packaging unit and the first side of the second packaging unit, and the plastic sealing body obtained by plastic sealing connects the first packaging unit and the second packaging unit and covers the conductive lead to obtain a POP packaging structure.

[0015] Optionally, the POP packaging structure further comprises: cutting off the area where the support body of the POP packaging structure is located.

[0016] According to a third aspect of the present application, an electronic device is provided, comprising the POP packaging structure described in any one of the above items.

[0017] According to the POP packaging structure of the present application, the first packaging unit and the second packaging unit are interconnected by the arranged conductive leads. Compared with large-sized solder balls and copper pillars, the conductive leads occupy less space, reducing the space occupied in the horizontal direction, so that more electronic components and interconnection structures can be integrated in a limited space, which can effectively improve the packaging density and interconnection density; at the same time, the use of conductive leads reduces the dependence on copper pillars, reduces production costs, and makes the entire production process more economical and efficient; in addition, the threading channel arranged on the second packaging unit allows the conductive leads to pass directly through, thereby realizing the interconnection between the first packaging unit and the first side of the second packaging unit, so that the interconnection between the first packaging unit and the second packaging unit is not limited by the distance between the two, which is convenient for production and manufacturing.

[0018] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0020] Figure 1 is a schematic structural diagram of a POP packaging structure according to an embodiment provided by the present application;

[0021] Figure 2 This is a structural schematic diagram of a POP packaging structure at a viewing angle after a first packaging unit is connected to a support body according to an embodiment provided by the present application;

[0022] Figure 3 This is a structural schematic diagram of a POP packaging structure at another viewing angle after a first packaging unit is connected to a support body according to an embodiment provided by the present application;

[0023] Figure 4 is a structural schematic diagram of a second packaging unit of a POP packaging structure according to an embodiment provided by the present application;

[0024] Figure 5 This is a schematic structural diagram of a POP packaging structure after a second packaging unit is connected to a conductive lead according to an embodiment of the present application;

[0025] Figure 6 This is a structural schematic diagram of a POP packaging structure after a first packaging unit and a second packaging unit are connected via a support body according to an embodiment provided by the present application;

[0026] Figure 7 It is a schematic structural diagram of a POP packaging structure before plastic packaging according to an embodiment provided in the present application.

[0027] Reference numerals

[0028] 100. POP packaging structure;

[0029] 10. The first packaging unit;

[0030] 20. Second packaging unit; 21. Threading channel;

[0031] 30. Conductive lead; 40. Plastic package; 50. Support body. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0034] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0035] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0036] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0037] The following first describes in detail the POP packaging structure 100 according to an embodiment of the present application with reference to the accompanying drawings.

[0038] like Figures 1 to 7 As shown, the POP packaging structure 100 according to the embodiment of the present application includes: a first packaging unit 10 , a second packaging unit 20 , at least one conductive lead 30 and a plastic package body 40 .

[0039] Specifically, the first side of the second packaging unit 20 is away from the first side of the first packaging unit 10, and the second packaging unit 20 is provided with at least one threading channel 21 penetrating through the thickness direction thereof. The middle section of the conductive lead 30 is provided in the threading channel 21, the first end of the conductive lead 30 is connected to the first side of the first packaging unit 10, and the second end of the conductive lead 30 is connected to the first side of the second packaging unit 20. The plastic packaging body 40 is provided on the first sides of the first packaging unit 10 and the second packaging unit 20, and the plastic packaging body 40 connects the first packaging unit 10 and the second packaging unit 20, and covers the conductive lead 30.

[0040] In other words, if Figures 1 to 7 As shown, the POP packaging structure 100 according to the embodiment of the present application mainly includes a plurality of packaging units, a conductive lead 30 and a plastic package body 40, wherein the plurality of packaging units include a first packaging unit 10 and a second packaging unit 20. Taking two packaging units as an example, the packaging unit located at the bottom may be the first packaging unit 10, and the packaging unit located at the top may be the second packaging unit 20. The first packaging unit 10 is mainly composed of a first PCB board and a first electronic component (e.g., a chip, etc.), and the first electronic component can be mounted on the first side (e.g., the upper side) of the first PCB board, and the first side of the first PCB board is the first side of the first packaging unit 10; the second packaging unit 20 is mainly composed of a second PCB board and a second electronic component (e.g., a chip, etc.), and the second electronic component can be mounted on the first side (e.g., the upper side) of the second PCB board, and the first side of the second PCB board is the first side of the first packaging unit 10.

[0041] Specifically, the second packaging unit 20 is provided with a threading channel 21 penetrating along its thickness direction, that is, the second PCB board of the second packaging unit 20 is provided with a threading channel 21 penetrating along its thickness direction in the chip mounting area, so that the end of the conductive lead 30 can pass through the second packaging unit 20, so that the middle section of the conductive lead 30 can be set in the threading channel 21.

[0042] In this embodiment, the second package unit 20 is stacked on the upper side of the first package unit 10, the first end of the conductive lead 30 is welded to the first side of the first package unit 10, so that the conductive lead 30 and the first package unit 10 are electrically connected together, and the second end of the conductive lead 30 is welded to the first side of the second package unit 20, so that the conductive lead 30 and the second package unit 20 are electrically connected together, thereby realizing the electrical connection between the first package unit 10 and the second package unit 20. The first side of the first package unit 10 and the first side of the second package unit 20 are both provided with a plastic package 40, the plastic package 40 covers the conductive lead 30 and the entire first side of the second package unit 20, and the plastic package 40 fills the space between the first package unit 10 and the second package unit 20, so as to connect the first package unit 10 and the second package unit 20 together.

[0043] Therefore, according to the POP packaging structure 100 provided in this embodiment, the first packaging unit 10 and the second packaging unit 20 are interconnected by the conductive lead 30 provided. Compared with large-sized solder balls and copper pillars, the conductive lead 30 occupies less space, reduces the space occupied in the horizontal direction, and allows more electronic components and interconnection structures to be integrated in a limited space, which can effectively improve the packaging density and interconnection density; at the same time, the use of the conductive lead 30 reduces the dependence on the copper pillar, reduces the production cost, and makes the entire production process more economical and efficient; in addition, the threading channel 21 provided on the second packaging unit 20 allows the conductive lead 30 to pass directly through, thereby realizing the interconnection of the first packaging unit 10 and the first side of the second packaging unit 20, so that the interconnection of the first packaging unit 10 and the second packaging unit 20 is not limited by the distance between the two, which is convenient for production and manufacturing.

[0044] In some optional examples of the present application, the plastic package body 40 fills the entire threading channel 21, so that the conductive lead 30 can be covered in the threading channel 11, thereby avoiding contact between the conductive lead 30 and the inner wall surface of the threading channel 21, which can effectively improve the reliability of the POP packaging structure 100.

[0045] In some embodiments of the present application, the POP packaging structure 100 further includes: a support body 50 , which is disposed between the first side of the first packaging unit 10 and the second side of the second packaging unit 20 , and the plastic package body 40 covers at least a portion of the support body 50 .

[0046] Specifically, Figures 1 to 3 As shown, a support body 50 is provided between the first side (e.g., the upper side) of the first packaging unit 10 and the second side (e.g., the lower side) of the second packaging unit 20. The support body 50 can connect the first packaging unit 10 and the second packaging unit 20 before they are sealed, so that the first packaging unit 10 and the second packaging unit 20 form an integral structure to facilitate subsequent sealing; and the sealing body 40 formed by the sealing can also cover part of the support body 50 or the entire support body 50, which can effectively enhance the stability of the structure.

[0047] According to one embodiment of the present application, the POP packaging structure 100 includes a plurality of support bodies 50 .

[0048] That is to say, Figure 3 and Figure 7 As shown, the POP packaging structure 100 includes one or more support bodies 50; when the number of the support body 50 is one, the support body 50 may be a long strip or annular structure, etc. When the number of the support body 50 is multiple, the support body 50 may be a columnar structure, and the multiple support bodies 50 may be distributed at intervals along the length direction and / or width direction of the POP packaging structure 100, so that the first packaging unit 10 and the second packaging unit 20 can be reliably connected while occupying a small space.

[0049] In some embodiments of the present application, at least a portion of the support body 50 is formed as a conductive column, and the conductive column electrically connects the first packaging unit 10 and the second packaging unit 20 .

[0050] Specifically, one or more support bodies 50 are configured as conductive pillars, such as copper pillars, etc. The first end of the conductive pillar is fixedly connected to the first packaging unit 10 and forms an electrical connection, and the second end of the conductive pillar is fixedly connected to the second packaging unit 20 and forms an electrical connection. In this way, the support body 50 can not only enhance stability, but also realize the electrical connection between the first packaging unit 10 and the second packaging unit 20, which can further improve the interconnection density of the POP packaging structure 100.

[0051] According to one embodiment of the present application, the support body 50 is an insulator.

[0052] In this embodiment, the support body 50 is made of insulating material, which effectively avoids unnecessary electrical short circuits and can ensure the yield of the POP packaging structure 100. In addition, insulating materials are usually more economical than conductive materials, which can effectively reduce the production cost of the POP packaging structure 100.

[0053] In some embodiments of the present application, the support body 50 is disposed at an edge of the first side of the first packaging unit 10 .

[0054] That is, the support body 50 can be arranged at the edge of the first side of the first packaging unit 10, and such a layout allows the central area of ​​the first packaging unit 10 to retain sufficient space for mounting other components. This design ensures the integration of the central area of ​​the first packaging unit 10, thereby making efficient use of space and ensuring the packaging density of the POP packaging structure 100.

[0055] According to one embodiment of the present application, the threading channel 21 is an avoidance hole or an avoidance gap.

[0056] Specifically, Figures 5 to 7 As shown, the second packaging unit 20 is provided with an avoidance hole penetrating along the thickness direction thereof. The avoidance hole may be a rectangular hole or a circular hole, etc. The inner wall surface of the avoidance hole defines a threading channel 21, thereby providing a shorter arrangement path for the conductive lead 30 at the central position of the second packaging unit 20, which is beneficial to shortening the length of the conductive lead 30 and facilitating production and manufacturing.

[0057] Furthermore, the edge of the second packaging unit 20 is provided with an avoidance gap penetrating along its thickness direction, and the inner wall surface of the avoidance gap defines a threading channel 21 open on one side. The open threading channel 21 is conducive to the conductive lead 30 passing through the threading channel 21, which can effectively improve the production efficiency of the POP packaging structure 100.

[0058] In some embodiments of the present application, the POP packaging structure 100 includes a plurality of conductive leads 30 , and the threading channel 21 is configured to allow the plurality of conductive leads 30 to pass through.

[0059] That is to say, Figure 5 As shown, the first package unit 10 and the second package unit 20 are both provided with a plurality of electrical connection areas (for example, pads of a PCB board or pins of an electronic component, etc.), and the electrical connection areas of the first package unit 10 and the second package unit 20 are connected to each other through a plurality of conductive leads 30. In this embodiment, the size of the threading channel 21 is designed to be relatively large, so that a plurality of conductive leads 30 can pass through the threading channel 21 together, that is, a threading channel 21 can accommodate a plurality of conductive leads 30, thereby effectively improving the integration of the remaining areas, so that more components can be integrated into a limited space.

[0060] like Figure 1 As shown, in some optional examples of the present application, the height of the conductive lead 30 is not higher than (i.e., equal to or lower than) the height of the second packaging unit 20. This design allows a thinner plastic package body 40 to cover the conductive lead 30, which can effectively improve the packaging density.

[0061] In summary, according to the POP packaging structure 100 provided in this embodiment, the first packaging unit 10 and the second packaging unit 20 are interconnected by the conductive lead 30 provided. Compared with large-sized solder balls and copper pillars, the conductive lead 30 occupies less space, so that more electronic components and interconnection structures can be integrated in a limited space, which can effectively improve the packaging density and interconnection density; at the same time, the use of the conductive lead 30 reduces the dependence on the copper pillar, reduces the production cost, and makes the entire production process more economical and efficient; in addition, the threading channel 21 provided on the second packaging unit 20 allows the conductive lead 30 to pass directly through, thereby realizing the interconnection of the first packaging unit 10 and the first side of the second packaging unit 20, so that the interconnection of the first packaging unit 10 and the second packaging unit 20 is not limited by the distance between the two, which is convenient for production and manufacturing.

[0062] The embodiment of the present application further provides a method for preparing a POP packaging structure 100. The POP packaging structure 100 may be the POP packaging structure 100 described in any of the above embodiments. The preparation method includes: S100 to S300.

[0063] S100, connecting the support body 50 between the first packaging unit 10 and the second packaging unit 20, wherein the first side of the second packaging unit 20 faces away from the first side of the first packaging unit 10, and the second packaging unit 20 is provided with at least one threading channel 21 penetrating along the thickness direction thereof;

[0064] Specifically, electronic components such as chips are first mounted on a first side (e.g., upper side) of a first PCB board to form a first packaging unit 10, and then a support body 50 is mounted on a first side (e.g., upper side) of the first packaging unit 10 to form a first packaging assembly; electronic components such as chips are mounted on a first side (e.g., upper side) of a second PCB board, and a threading channel 21 is provided on the second PCB board along its thickness direction according to the circuit layout to form a second packaging unit 20, and then a second side (e.g., lower side) of the second packaging unit 20 is mounted on an end of the support body 50 away from the first packaging unit 10, so that the first packaging unit 10 and the second packaging unit 20 are connected to an integral structure through the support body 50.

[0065] Alternatively, electronic components such as chips are first mounted on the first side (for example, the upper side) of the second PCB board, and a threading channel 21 is set on the second PCB board along its thickness direction according to the circuit layout to form a second packaging unit 20, and then the support body 50 is mounted on the second side (for example, the lower side) of the second packaging unit 20 to form a second packaging assembly; then electronic components such as chips are mounted on the first side (for example, the upper side) of the first PCB board to form a first packaging unit 10; finally, the first side (for example, the upper side) of the first packaging unit 10 is mounted on an end of the support body 50 away from the second packaging unit 20, so that the first packaging unit 10 and the second packaging unit 20 are connected to an integral structure through the support body 50.

[0066] S200, disposing the middle section of the conductive lead 30 in the threading channel 21, and connecting the first end of the conductive lead 30 to the first side of the first packaging unit 10, and connecting the second end of the conductive lead 30 to the first side of the second packaging unit 20;

[0067] In detail, the conductive lead 30 has a first end and a second end. The first end of the conductive lead 30 is first welded to the pad of the first PCB board on the first packaging unit 10 or the pin of the electronic component, and then the second end of the conductive lead 30 is passed through the threading channel 21 and welded to the pad of the second PCB board on the first packaging unit 10 or the pin of the electronic component, so that the first packaging unit 10 and the second packaging unit 20 are electrically connected to form a component to be plastic-encapsulated.

[0068] Alternatively, the second end of the conductive lead 30 is first welded to the pad of the second PCB board on the second packaging unit 20 or the pin of the electronic component, and then the first end of the conductive lead 30 is passed through the threading channel 21 and welded to the pad of the first PCB board on the first packaging unit 10 or the pin of the electronic component, so that the first packaging unit 10 and the second packaging unit 20 are electrically connected to form a component to be plastic-encapsulated.

[0069] S300 , plastic-sealing the first side of the first packaging unit 10 and the first side of the second packaging unit 20 , and the plastic-sealed body 40 obtained by plastic sealing connects the first packaging unit 10 and the second packaging unit 20 and covers the conductive lead 30 , thereby obtaining a POP packaging structure 100 .

[0070] That is to say, after the conductive lead 30 connects the first packaging unit 10 and the second packaging unit 20, an injection molding process can be performed on the first side of the first packaging unit 10 and the first side of the second packaging unit 20 using a plastic packaging device, so that the plastic packaging body 40 obtained by injection molding covers the conductive lead 30 and the entire first side of the second packaging unit 20, and the plastic packaging body 40 fills the space between the first packaging unit 10 and the second packaging unit 20, so as to connect the first packaging unit 10 and the second packaging unit 20 together, thereby obtaining a POP packaging structure 100.

[0071] Therefore, according to the preparation method of the POP packaging structure 100 of the embodiment of the present application, the first packaging unit 10 and the second packaging unit 20 are connected as a whole through the support body 50, so that the subsequent plastic packaging is more convenient, and the first packaging unit 10 and the second packaging unit 20 are interconnected by the conductive lead 30. Compared with large-size solder balls and copper pillars, the conductive lead 30 occupies less space, reduces the horizontal space occupation, so that more electronic components and interconnection structures can be integrated in a limited space, and the packaging density and interconnection density can be effectively improved; at the same time, the use of the conductive lead 30 reduces the dependence on the copper pillar, reduces the production cost, and makes the entire production process more economical and efficient; in addition, the threading channel 21 set on the second packaging unit 20 allows the conductive lead 30 to pass directly, thereby realizing the interconnection of the first packaging unit 10 and the first side of the second packaging unit 20, so that the interconnection of the first packaging unit 10 and the second packaging unit 20 is not limited by the distance between the two, which is convenient for production and manufacturing.

[0072] According to an embodiment of the present application, the POP packaging structure 100 further includes: S400.

[0073] S400 , cutting off the area where the support body 50 of the POP packaging structure 100 is located.

[0074] In this embodiment, the support body 50 can be located at the edge of the POP packaging structure 100. When the required circuit does not exist at the corresponding positions of the support body 50 and the first packaging unit 10 and the second packaging unit 20, the area where the support body 50 of the POP packaging structure 100 is located can be cut off using a cutting device, thereby obtaining a POP packaging structure 100 with a smaller size and a higher packaging density.

[0075] The embodiment of the present application also provides an electronic device, including the POP packaging structure 100 described in any of the above embodiments. Since the POP packaging structure 100 according to the embodiment of the present application has the above technical effects, the electronic device according to the embodiment of the present application also has corresponding technical effects, which will not be described in detail in this embodiment.

[0076] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A POP packaging structure, characterized in that: include: A first packaging unit (10); a second packaging unit (20), wherein a first side of the second packaging unit (20) faces away from a first side of the first packaging unit (10), and the second packaging unit (20) is provided with at least one threading channel (21) penetrating in a thickness direction thereof; at least one conductive lead (30), the middle section of the conductive lead (30) being arranged in the threading channel (21), the first end of the conductive lead (30) being connected to the first side of the first packaging unit (10), and the second end of the conductive lead (30) being connected to the first side of the second packaging unit (20); A plastic packaging body (40), wherein the plastic packaging body (40) is arranged on a first side of the first packaging unit (10) and the second packaging unit (20), the plastic packaging body (40) connects the first packaging unit (10) and the second packaging unit (20), and covers the conductive lead (30).

2. The POP packaging structure according to claim 1, characterized in that: Also includes: A support body (50), the support body (50) being arranged between a first side of the first packaging unit (10) and a second side of the second packaging unit (20), and the plastic packaging body (40) covering at least a portion of the support body (50).

3. The POP packaging structure according to claim 2, characterized in that: The POP packaging structure comprises a plurality of support bodies (50).

4. The POP packaging structure according to claim 2, characterized in that: At least a portion of the support body (50) is formed as a conductive column, and the conductive column electrically connects the first packaging unit (10) and the second packaging unit (20).

5. The POP packaging structure according to claim 2, characterized in that: The support body (50) is an insulator.

6. The POP packaging structure according to claim 2, characterized in that: The support body (50) is arranged at an edge of a first side of the first packaging unit (10).

7. The POP packaging structure according to claim 1, characterized in that: The threading channel (21) is an avoidance hole or an avoidance gap.

8. The POP packaging structure according to claim 1, characterized in that: The POP packaging structure comprises a plurality of conductive leads (30), and the threading channel (21) is configured to allow the plurality of conductive leads (30) to pass through.

9. A method for preparing a POP packaging structure, characterized in that: include: The support body (50) is connected between the first packaging unit (10) and the second packaging unit (20), wherein the first side of the second packaging unit (20) faces away from the first side of the first packaging unit (10), and the second packaging unit (20) is provided with at least one threading channel (21) penetrating along the thickness direction thereof; The middle section of the conductive lead (30) is arranged in the threading channel (21), and the first end of the conductive lead (30) is connected to the first side of the first packaging unit (10), and the second end of the conductive lead (30) is connected to the first side of the second packaging unit (20); The first side of the first packaging unit (10) and the first side of the second packaging unit (20) are plastic-sealed, and the plastic-sealed body (40) obtained by the plastic sealing connects the first packaging unit (10) and the second packaging unit (20) and covers the conductive lead (30), thereby obtaining a POP packaging structure.

10. The method for preparing a POP packaging structure according to claim 9, characterized in that: Also includes: The area where the support body (50) of the POP packaging structure is located is cut away.

11. An electronic device, characterized in that: A POP packaging structure comprising any one of claims 1 to 8.

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