Tile type TR module based on 3D stacking
By adopting 3D stacking technology in the TR module, the RF processing board and the power control board are integrated into the structural parts, solving the problems of low integration and large size of the existing TR modules, achieving higher integration and smaller size.
Patent Information
- Application Number
- CN202411772855.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-03-11
AI Technical Summary
The existing TR modules are not very integrated, with large size and thickness.
The tile-type TR module design based on 3D stacking is adopted. The first RF processing board, the second RF processing board and the control power board are integrated into the structural parts through a multi-layer PCB board, and signal transmission is achieved through soldering and gold wire connection.
It improves the integration of the tile TR module, reduces the size of the module, and has a simple assembly process.
Smart Images
Figure CN119601953A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of phased array antennas, and in particular to a 3D stacked tile-type TR module. Background Art
[0002] As the performance of phased array antenna systems improves, the assembly process of phased array antennas is gradually developing towards ultra-miniaturization, three-dimensionalization, and high integration. At present, active phased arrays are mainly divided into two types of integration: brick-type and tile-type. Conventional tile-type TR modules use structural parts to connect various functional components layer by layer, resulting in low integration of TR modules and large size and thickness.
[0003] In view of this, this application is hereby filed. Summary of the invention
[0004] The technical problem to be solved by the present invention is that the existing TR module has a low integration level and is large in size and thickness.
[0005] In order to solve the above technical problems, the present invention is implemented by the following technical solutions:
[0006] A tile-type TR module based on 3D stacking is proposed, including: a first RF processing board, used to amplify RF signals; a second RF processing board, used to perform amplitude and phase adjustment and power division feeding on the RF signals; a control power board, used to match the amplitudes and supply power to the first RF processing board and the second RF processing board; the second RF processing board is located above the first RF processing board, and the control power board is located above the second RF processing board; the first RF processing board and the second RF processing board are welded by multiple solder balls, and the second RF processing board and the control power board are welded by multiple solder balls; the control power board is connected to a power access connector; the second RF processing board is connected to an RF signal processor; the first RF processing board is connected to an insulator; and the insulator is connected to an antenna end.
[0007] Furthermore, the power access connector and the RF signal processor are located above the control power board; the insulator is located below the first RF processing board, and the insulator is bonded to the first RF processing board through a gold wire.
[0008] Furthermore, the first radio frequency processing board and the second radio frequency processing board are respectively connected to a monolithic microwave integrated circuit.
[0009] Furthermore, the 3D stacking-based tile-type TR module also includes: a structural part; the first RF processing board, the second RF processing board, the control power board, the solder ball, the power access connector, the RF signal processor, the insulator, the gold wire and the monolithic microwave integrated circuit are all integrated inside the structural part.
[0010] Furthermore, the structural component includes: a heat dissipation plate; the heat dissipation plate is located at the bottom of the structural component.
[0011] Furthermore, the dimensions of the structural member are 40 mm×40 mm×12 mm.
[0012] Compared with the prior art, the present invention has the following advantages and beneficial effects: the first RF processing board, the second RF processing board and the power control board are integrated into the structural member by 3D stacking of multi-layer PCB boards, thereby improving the integration of the tile-type TR module, reducing the size of the tile-type TR module, and simplifying the assembly process. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0014] Figure 1 A schematic diagram of the structure of a 3D stacked tiled TR module provided in an embodiment of the present invention.
[0015] Marks and corresponding parts names in the attached drawings:
[0016] 1-first RF processing board, 2-second RF processing board, 3-control power board, 4-solder ball, 5-power access connector, 6-RF signal processor, 7-insulator, 8-gold wire, 9-monolithic microwave integrated circuit, 10-structural part, 11-heat sink. DETAILED DESCRIPTION
[0017] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.
[0018] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is apparent to one of ordinary skill in the art that these specific details are not necessarily employed to practice the present invention. In other embodiments, in order to avoid obscuring the present invention, well-known structures, circuits, materials, or methods are not specifically described.
[0019] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "one embodiment," "an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. In addition, it will be appreciated by those of ordinary skill in the art that the figures provided herein are for illustrative purposes and that the figures are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0020] In the description of the present invention, the directions or positional relationships indicated by terms such as “front”, “rear”, “left”, “right”, “up”, “down”, “vertical”, “horizontal”, “high”, “low”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the scope of protection of the present invention.
[0021] Embodiment: A 3D stacked tile TR module is proposed, such as Figure 1As shown, it is mainly composed of a first RF processing board 1, a second RF processing board 2, a control power board 3 and a structural member 10. Among them, the first RF processing board 1 is used to amplify the RF signal; the second RF processing board 2 is used to adjust the amplitude and phase and power feed the RF signal; the control power board 3 is used to match the amplitude and power the first RF processing board 1 and the second RF processing board 2. The second RF processing board 2 is located above the first RF processing board 1, and the control power board 3 is located above the second RF processing board 2. The first RF processing board 1 and the second RF processing board 2 are welded by multiple solder balls 4 to facilitate the transmission of RF signals and DC signals; the second RF processing board 2 and the control power board 3 are also welded by multiple solder balls 3 to facilitate the transmission of RF signals and DC signals. The power access connector 5 is located above the control power board 3, and the control power board 3 is connected to the power access connector 5, and the control power supply signal is connected from the power access connector 5 to power the module. The second RF processing board 2 is connected to the RF signal processor 6, and the RF signal is connected from the RF signal processor 6. The first RF processing board 1 is connected to the insulator 7 via a gold wire 8 to ensure efficient transmission of the RF signal, and the RF signal is fed to the antenna end via the insulator 7 .
[0022] In a further embodiment, a monolithic microwave integrated circuit 9 (MMIC) is connected to the first RF processing board 1 and the second RF processing board 2 respectively, for realizing efficient processing of RF signals. These microwave circuits are optimized in layout according to the stacking design, further improving the module performance.
[0023] In another preferred embodiment, the TR module further includes a structural member 10 for integrating the first RF processing board 1, the second RF processing board 2, the control power board 3 and other components to provide a stable mechanical support and electromagnetic shielding effect. A heat sink 11 is provided at the bottom of the structural member 10 to ensure the heat dissipation performance of the module under high-power working conditions. The overall size of the structural member 10 is 40mm×40mm×12mm, which can meet the requirements of radar and communication systems for miniaturized equipment.
[0024] Continue to refer Figure 1 The specific assembly process of the above-mentioned 3D stacked tile TR module is as follows:
[0025] S1: Prepare the first RF processing board 1, the second RF processing board 2 and the control power supply board 3 according to the design requirements;
[0026] S2: solder the boards together using solder balls 4 to form a 3D stacked structure;
[0027] S3: Install the power access connector 5 and the radio frequency signal processor 6 to the control power board 3;
[0028] S4: bonding the first RF processing board 1 to the insulator 7 via the gold wire 8;
[0029] S5: Integrate all components into the structural member 10, and ensure the heat dissipation performance of the module through the heat dissipation plate 11;
[0030] S6: Perform performance test on the module to verify the circuit path integrity and RF processing performance.
[0031] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A 3D stacked tile TR module, characterized in that: include: A first radio frequency processing board (1), used for amplifying radio frequency signals; A second radio frequency processing board (2) is used to perform amplitude and phase adjustment and power division feeding on the radio frequency signal; A control power supply board (3) for amplitude matching and supplying power to the first radio frequency processing board (1) and the second radio frequency processing board (2); The second RF processing board (2) is located above the first RF processing board (1), and the control power board (3) is located above the second RF processing board (2); the first RF processing board (1) and the second RF processing board (2) are welded via a plurality of solder balls (4), and the second RF processing board (2) and the control power board (3) are welded via a plurality of solder balls (4); the control power board (3) is connected to a power access connector (5); the second RF processing board (2) is connected to a RF signal processor (6); the first RF processing board (1) is connected to an insulator (7); and the insulator (7) is connected to an antenna end.
2. The 3D stacked tile TR module according to claim 1, characterized in that: The power access connector (5) and the radio frequency signal processor (6) are located above the control power board (3); the insulator (7) is located below the first radio frequency processing board (1), and the insulator (7) is bonded to the first radio frequency processing board (1) via a gold wire (8).
3. A 3D stacked tiled TR module according to claim 1 or 2, characterized in that: The first radio frequency processing board (1) and the second radio frequency processing board (2) are respectively connected to a monolithic microwave integrated circuit (9).
4. The 3D stacked tile TR module according to claim 3, characterized in that: Also includes: Structural component (10); the first radio frequency processing board (1), the second radio frequency processing board (2), the control power board (3), the solder ball (4), the power access connector (5), the radio frequency signal processor (6), the insulator (7), the gold wire (8) and the monolithic microwave integrated circuit (9) are all integrated inside the structural component (10).
5. The 3D stacked tile TR module according to claim 4, characterized in that: The structural component (10) comprises: a heat dissipation plate (11); the heat dissipation plate (11) is located at the bottom of the structural component (10).
6. A 3D stacked tiled TR module according to claim 4 or 5, characterized in that: The dimensions of the structural member (10) are 40 mm×40 mm×12 mm.