Step type connector suitable for high frequency band and wide frequency band
By designing step connectors, the metal ‘L’ type circuit solder board connector and main printed circuit board on the step printed circuit board are solved, and the electrical signal loss problem caused by the height difference between the connector and the printed circuit board under the wide band in the high frequency band is solved, achieving efficient transmission of radio frequency signals.
Patent Information
- Application Number
- CN202411768869.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-03-11
AI Technical Summary
In the wide band of high frequency band, the height difference between the connector and the printed circuit board causes an increase in the loss of the input and output feeding network, affecting the transmission of the RF signal.
A step-type connector is designed, including a connector, a step-printed circuit board and a main printed circuit board. It is connected by soldering. A metal ‘L’ type circuit soldering board is installed on the step-type circuit board to connect the connector and the main printed circuit board to reduce electrical signal loss.
This structure greatly reduces the loss of the input and output feeding network in the frequency band of 2-18GHz, ensures the smooth transmission of RF signals, and is simple in design and low in cost, suitable for RF circuit board design.
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Figure CN119602002A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of printed circuits, in particular to a stepped connector suitable for high frequency and wide frequency bands. Background Art
[0002] A connector is a bridge for electronic signal communication between different electronic devices. Connectors are an indispensable part of electronic devices. They improve the production process, making connections that originally required permanent connections detachable, making the design and production process more convenient and flexible, and reducing production and maintenance costs. With the high speed and digitalization of signal transmission, the transmission of connectors and the performance of each interconnection have a more significant impact on the overall system. In order to achieve the transmission of a large amount of electronic data in a shorter time, in addition to increasing the transmission path of electronic signals between the transmitted electronic devices, more measures are taken to increase the frequency of electronic signals transmitted between electronic devices. As the frequency increases, connectors must consider whether high-frequency electronic signals can be fully transmitted between multiple electronic devices, so the design difficulty of connectors is also increasing. Summary of the invention
[0003] In order to solve the above problems, the present invention provides a stepped connector suitable for high frequency and wide bandwidth, including a connector, a stepped printed circuit board, and a main printed circuit board; the connector, the stepped printed circuit board, and the main printed circuit board are connected in sequence by welding.
[0004] Furthermore, there is a metal circuit soldering plate on the stepped printed circuit board; the metal circuit soldering plate is overall 'L'-shaped, including a top soldering pad, a microstrip line, and a bottom soldering pad; the top soldering pad is welded to the connector, and the bottom soldering pad is welded to the main printed circuit board; the microstrip line is arranged between the top soldering pad and the bottom soldering pad, and is used to connect the top soldering pad and the bottom soldering pad.
[0005] Furthermore, a main printed circuit board radio frequency line exists on the main printed circuit board, and the main printed circuit board radio frequency line is welded and connected to the step printed circuit board.
[0006] Furthermore, the height range of the stepped printed circuit board is: 0~1 / 10λ.
[0007] Furthermore, the connector, top pad, microstrip line, bottom pad, and main printed circuit board radio frequency line are all made of electrically conductive metals, including: silver, copper, gold, aluminum, sodium, molybdenum, tungsten, zinc, nickel, iron, platinum, tin, and lead.
[0008] The present invention provides a stepped connector suitable for high frequency and wide frequency band, which has the following beneficial effects: The present invention proposes a connection structure suitable for high frequency bands and when there is a certain height difference between the connector position and the printed circuit board, which can greatly reduce the loss of the input and output feeding network and smoothly complete the transmission of radio frequency signals. The structure is simple in design and low in cost, and can be widely used in radio frequency circuit board design. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0010] Figure 1 A schematic diagram of the structure of the device provided by the present invention; Figure 2 A schematic diagram of the structure of a stepped printed circuit board provided by the present invention; Figure 3 A circuit structure diagram provided by the present invention when there is no height difference between the connector position and the printed circuit board; Figure 4 The device structure simulation curve (I) and Figure 3 Simulation curve of the structure shown (a); Figure 5 The device structure simulation curve (II) and Figure 3 Simulation curve of the structure shown (b).
[0011] In the figure, 1. main printed circuit board; 2. step printed circuit board; 3. connector; 21. top pad; 22. bottom pad. DETAILED DESCRIPTION
[0012] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.
[0013] The following is a detailed description of the implementation method of the present invention in conjunction with the accompanying drawings. Only some embodiments are described, not all embodiments. For the purpose of clarity, representations and descriptions that are not related to the present invention are omitted in the drawings and descriptions.
[0014] In order to have a clearer understanding of the technical features, purposes and beneficial effects of the present invention, the technical solution of the present invention is now described in detail below. Obviously, the implementation cases described are part of the embodiments of the present invention, not all of the embodiments, and cannot be understood as limiting the scope of the implementation of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present invention.
[0015] like Figure 1 As shown, the present invention provides a stepped connector suitable for high frequency and wide bandwidth, comprising a connector 3, a stepped printed circuit board 2, and a main printed circuit board 1; the connector 3, the stepped printed circuit board 2, and the main printed circuit board 1 are connected in sequence by welding.
[0016] like Figure 2 As shown, there is a metal circuit soldering plate on the stepped printed circuit board 2; the metal circuit soldering plate is overall 'L'-shaped, including a top soldering pad 21, a microstrip line, and a bottom soldering pad 22; the top soldering pad 21 is welded to the connector 3, and the bottom soldering pad 22 is welded to the main printed circuit board 1; the microstrip line is arranged between the top soldering pad 21 and the bottom soldering pad 22, and is used to connect the top soldering pad 21 and the bottom soldering pad 22.
[0017] There is a main printed circuit board radio frequency line on the main printed circuit board 1, and the main printed circuit board radio frequency line is welded and connected to the step printed circuit board 2; the height range of the step printed circuit board 2 is: 0~1 / 10λ.
[0018] The connector 3, the top pad 21, the microstrip line, the bottom pad 22, and the main printed circuit board radio frequency line are all made of electrically conductive metals, including: silver, copper, gold, aluminum, sodium, molybdenum, tungsten, zinc, nickel, iron, platinum, tin, and lead.
[0019] Embodiment: The overall structure consists of a connector, a step printed circuit board, and a main printed circuit board. The connector can support any model. The connector model used in the actual object in this embodiment is JSSMP(M)-JYD15-S. The connector is welded to the top pad of the step printed circuit board, and the RF line of the main printed circuit board is connected to the bottom pad of the step printed circuit board. The connector can support any model, and the size, material, number of layers and thickness of the step printed circuit board can also be adjusted according to its own needs. The height of the step printed circuit board can reach up to 1 / 10λ.
[0020] like Figure 3 As shown, when there is no height difference between the connector position and the printed circuit board, the connector can be directly welded to the printed circuit board, and the impedance characteristics of the transmission line segment can be obtained using HFSS software. Similarly, the structure described in this patent also uses HFSS software to obtain the corresponding impedance characteristics. In the simulation, the port settings of ports Pin1 and Pin2 are both wave ports, the impedance is set to 50 ohms, and the solution frequency is set to 1-20GHz.
[0021] like Figure 4 As shown, the m1 curve is the S11 result of the structure described in this patent, and the m2 curve is the attached Figure 4It can be seen that the reflection coefficient of the structure described in this embodiment is below -20dB in the 2-18G or even wider frequency band, and the matching is good. Figure 3 The structure shown has poor matching at high frequencies.
[0022] like Figure 5 As shown, the m1 curve is the S21 result of the structure described in this patent, and the m2 curve is the attached Figure 4 It can be seen that the transmission coefficient of the structure described in this embodiment is close to 0 in the 2-18G or even wider frequency band, and the forward transmission is almost lossless. Figure 3 The transmission loss of the structure shown increases sharply in the high frequency band.
[0023] From the simulation results, it can be seen that the structure described in this patent solves the connection problem when there is a non-negligible height difference between the location of the printed circuit board and the location of the connector interface in the high frequency band, greatly reduces the loss of the input and output feeding network, and smoothly completes the transmission of the RF signal. The structure is simple in design, has high flexibility, and is low in cost, and can be widely used in RF circuit board design.
[0024] If the gold wire welding process or the traditional bent pin connector structure is used, the length of the bent pin part is about 1.63mm, which is approximately equal to 0.1 wavelength. Therefore, unlike the circuit design in the low frequency band, in the high frequency circuit, this section of the bent pin is inductive and cannot be ignored, which is equivalent to an inductor connected in series with the circuit. According to HFSS simulation, at 18GHz, the insertion loss of the circuit using the traditional bent pin connector structure is 2.3dB, while the insertion loss of the circuit using the structure described in the present invention is 0.13dB.
[0025] The present invention proposes a connection structure suitable for high frequency bands and when there is a certain height difference between the connector position and the printed circuit board, which can greatly reduce the loss of the input and output feeding network and smoothly complete the transmission of radio frequency signals. The structure is simple in design and low in cost, and can be widely used in radio frequency circuit board design.
[0026] The above is only a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art shall not deviate from the spirit and scope of the present invention, and shall be within the scope of protection of the claims attached to the present invention.
Claims
1. A stepped connector suitable for high frequency and wide bandwidth, characterized in that: It comprises a connector (3), a step printed circuit board (2), and a main printed circuit board (1); the connector (3), the step printed circuit board (2), and the main printed circuit board (1) are connected in sequence by welding.
2. The stepped connector suitable for high frequency and wide bandwidth according to claim 1, characterized in that: A metal circuit soldering plate is provided on the stepped printed circuit board (2); the metal circuit soldering plate is in an L-shape as a whole and comprises a top soldering pad (21), a microstrip line, and a bottom soldering pad (22); the top soldering pad (21) is soldered to the connector (3), and the bottom soldering pad (22) is soldered to the main printed circuit board (1); the microstrip line is provided between the top soldering pad (21) and the bottom soldering pad (22) and is used to connect the top soldering pad (21) and the bottom soldering pad (22).
3. The stepped connector suitable for high frequency and wide bandwidth according to claim 1, characterized in that: A main printed circuit board radio frequency line is present on the main printed circuit board (1), and the main printed circuit board radio frequency line is connected to the step printed circuit board (2) by welding.
4. The stepped connector suitable for high frequency and wide bandwidth according to claim 2, characterized in that: The height range of the stepped printed circuit board (2) is 0 to 1 / 10λ.
5. The stepped connector suitable for high frequency and wide bandwidth according to any one of claims 1 to 3, characterized in that: The connector (3), the top solder pad (21), the microstrip line, the bottom solder pad (22), and the main printed circuit board radio frequency line are all made of metals that can conduct electricity, including: silver, copper, gold, aluminum, sodium, molybdenum, tungsten, zinc, nickel, iron, platinum, tin, and lead.