Precise conductive circuit printing mold and preparation method thereof
By designing precision conductive line printing molds, using through holes and protective coatings on the substrate, the problems of bulky equipment, high cost, low production efficiency and low accuracy in the production of conductive line in the prior art are solved, and efficient and flexible conductive line preparation is achieved.
Patent Information
- Application Number
- CN202411931425.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-03-11
AI Technical Summary
The existing conductive line production technology has the problem of bulky equipment, high cost, low production efficiency, high energy consumption and low accuracy, and the inability to prepare micron-scale lines.
Design a precision conductive line printing mold, including through holes and protective coatings on the substrate along the thickness direction, and control the line shape of the conductive paste through the through holes to achieve flexible and efficient conductive line preparation.
It realizes low-cost, flexible and efficient preparation of conductive lines, improves production efficiency, can prepare micron-scale lines, and improves the high temperature and corrosion resistance of the mold through protective coatings.
Smart Images
Figure CN119603877A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of conductive circuit printing, and in particular to a precision conductive circuit printing mold and a preparation method thereof. Background Art
[0002] The current conductive circuit production is generally screen printing (inkjet printing or additive coating followed by wet / dry etching) and heated air curing. The equipment is bulky, costly, inefficient, and energy consuming, which has a significant impact on the parts that do not require conductive circuit production. On the other hand, if the conductive circuit is produced using the traditional dispensing process, the precision is low, micron-level circuits cannot be produced, and the curing method is limited (curing of some products will also affect other components in the device). Summary of the invention
[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a precision conductive circuit printing mold and a preparation method thereof, which can prepare conductive circuits at low cost, flexibly and efficiently.
[0004] According to the first embodiment of the present invention, a precision conductive circuit printing mold comprises a substrate, wherein the substrate is provided with at least one through hole extending vertically along the thickness direction thereof.
[0005] The surface of the substrate and the inner sidewall of the through hole are also coated with a protective coating.
[0006] Wherein, the diameter of the through hole is 1-3000 μm, and the thickness of the protective coating is 1-10 μm.
[0007] Preferably, the material of the substrate is selected from one or more of silicon carbide, silicon nitride, ceramics, high entropy alloys, nickel-chromium alloys or Invar alloys.
[0008] Preferably, the material of the protective coating includes aluminum oxide or diamond.
[0009] Preferably, the cross-section of the through hole is circular or rectangular.
[0010] In some of the embodiments, positioning holes and fixing grooves are also provided on the substrate.
[0011] In some embodiments, the positioning holes are respectively opened at both ends of the substrate along the thickness direction of the substrate.
[0012] The cross section of the positioning hole is circular, and the diameter of the positioning hole is 0.1-1 mm.
[0013] In some embodiments, the fixing grooves are respectively opened on two end surfaces of the substrate.
[0014] Preferably, the vertical cross-section of the fixing groove is rectangular, and the width of the fixing groove is 0.5-2 mm.
[0015] The method for preparing a precision conductive circuit printing mold according to the second aspect of the present invention is used to prepare the precision conductive circuit printing mold of any one of the first aspects, comprising the following steps:
[0016] S1, providing substrate;
[0017] S2, opening at least one through hole extending vertically through the substrate along the thickness direction thereof, wherein the diameter of the through hole is 1-3000 μm;
[0018] S3, coating a protective coating on the surface of the substrate and the inner sidewall of the through hole, wherein the thickness of the protective coating is 1-10 μm;
[0019] S4, polishing the surface of the rough mold to obtain the precision conductive circuit printing mold.
[0020] In some embodiments, in step S1, the material of the substrate is selected from one or more of silicon carbide, silicon nitride, ceramic, high entropy alloy, nickel-chromium alloy or Invar alloy;
[0021] In the step S3, the protective coating is coated by using a physical vapor deposition or chemical vapor deposition process.
[0022] Compared with the prior art, the present invention has at least the following beneficial effects:
[0023] The precision conductive circuit printing mold of the embodiment of the present invention has multiple nano-scale through holes that penetrate up and down in the thickness direction on the substrate, and the line type of the conductive paste printing is controlled by the through holes on the substrate. According to actual needs, the through holes on the substrate can be designed as a single hole or multiple holes arranged at intervals on the same straight line, which can realize the simultaneous preparation of multiple lines based on different application scenarios. It is flexible and efficient and can greatly improve production efficiency. In addition, a protective coating is also provided on the surface of the substrate and the inner wall of the through hole, which plays a role of high temperature resistance and corrosion resistance. In addition, the substrate structure of the precision conductive circuit printing mold of the embodiment of the present invention is simple, and the replacement and maintenance costs are low.
[0024] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:
[0026] Figure 1 is a structural schematic diagram of a precision conductive circuit printing mold according to an embodiment of the present invention;
[0027] Figure 2 for Figure 1 AA section view in. DETAILED DESCRIPTION
[0028] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inside" and "outside" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0029] As a specific embodiment of the present invention, refer to Figure 1 and Figure 2 As shown, the precision conductive circuit printing mold of the embodiment of the present invention may include a substrate 1, and at least one through hole 2 penetrating from top to bottom is opened on the substrate 1 along the thickness direction thereof.
[0030] The surface of the substrate 1 and the inner sidewalls of the through-hole 2 are also coated with a protective coating.
[0031] Preferably, the diameter of the through hole 2 is 1-3000 μm, and the thickness of the protective coating is 1-10 μm.
[0032] That is to say, the precision conductive circuit printing mold of the embodiment of the present invention has a plurality of nano-scale through holes 2 that penetrate up and down in the thickness direction on the substrate 1, and the line type of the conductive paste printing is controlled by the through holes 2 on the substrate 1. According to actual needs, the through holes 2 on the substrate 1 can be designed as a single hole or multiple holes arranged at intervals on the same straight line, which can realize the simultaneous preparation of multiple lines based on different application scenarios, which is flexible and efficient and can greatly improve production efficiency. In addition, a protective coating is also provided on the surface of the substrate 1 and the inner wall of the through hole 2, which plays a role of high temperature resistance and corrosion resistance, protects the substrate 1 from loss, and extends the service life of the substrate 1. In addition, the substrate 1 of the precision conductive circuit printing mold of the embodiment of the present invention has a simple structure and low replacement and maintenance costs.
[0033] As an example, when the precision conductive circuit printing mold of the embodiment of the present invention is used, the conductive paste is first accurately filled into the through hole 2 of the substrate 1. According to the size of the through hole 2 and the thickness requirement of the required circuit, the flow control uses a precision screw pump to accurately control the flow of the conductive paste to ensure the accuracy and consistency of the printing process. During the printing process, a high-precision mechanical positioning device and an advanced optical alignment system are used to accurately position and fix the mold and the printing platform. Through this collaborative operation mechanism, the relative position accuracy between the mold and the substrate can be firmly controlled within ±5 microns, thereby effectively ensuring that the conductive circuit can be accurately and correctly printed on the predetermined position, greatly improving the accuracy and reliability of circuit preparation.
[0034] Among them, the printing platform adopts a high-precision marble platform with a flatness error within ±2μm, which effectively ensures the parallelism and verticality between the mold and the substrate, ensuring that the conductive circuit can be accurately printed at the predetermined position.
[0035] Finally, the slurry introduced into the through-hole on the mold is precisely sintered by laser: an innovative design concept of multiple laser heads arranged side by side is adopted to construct a large rectangular spot. The arrangement of multiple laser heads can be flexibly and scientifically adjusted according to the porous structure characteristics of the mold and the circuit area required for sintering. The spacing between laser heads is usually set between 1-10 cm. Generally, a laser with a wavelength of 300-1500nm is selected. By intelligently controlling the power output and working state of each laser head, a continuous heating curve is cleverly constructed, so that the conductive slurry can be evenly heated during the sintering process, effectively avoiding circuit defects caused by local overheating or overcooling, and comprehensively improving the quality and performance of the circuit.
[0036] In summary, the precision conductive circuit printing mold according to the embodiment of the present invention can significantly reduce the cost of equipment investment and floor space, can flexibly process products of different sizes and morphologies, and has high production efficiency. In addition, the mold only acts on the area where the conductive circuit needs to be designed, without affecting other areas, and the multi-pores can realize the simultaneous preparation of different circuits.
[0037] Preferably, the material of the substrate 1 is selected from one or more of silicon carbide, silicon nitride, ceramics, high entropy alloys, nickel-chromium alloys or Invar alloys.
[0038] Specifically, the above materials are selected as the substrate, which are resistant to high temperatures, have high mechanical strength, low expansion coefficient and high chemical stability, and can maintain a stable state in a complex and changeable process environment.
[0039] Preferably, the material of the protective coating may include alumina or diamond.
[0040] In other words, the protective coating coated with alumina or diamond material has a high melting point and stable chemical properties, which can significantly enhance the high temperature resistance and corrosion resistance of the mold substrate, enabling it to better meet the stringent requirements of precision conductive circuit preparation in special environments, and the material cost is low.
[0041] In some embodiments, the cross section of the through hole 2 is circular or rectangular.
[0042] Specifically, the cross-sectional shape of the through hole 2 can be set according to actual circuit printing requirements, so that when the conductive paste passes through the through hole 2, it can adapt to different scenarios and the printing of different circuits.
[0043] In some of the embodiments, positioning holes and fixing grooves are also provided on the substrate 1 .
[0044] Specifically, a positioning hole is opened on the substrate 1 for positioning the mounting member when it is connected to the substrate 1, and the fixing groove is adapted to the mounting member when it is connected to the substrate 1 to provide a connection position.
[0045] In some embodiments, positioning holes are respectively provided at both ends of the substrate 1 along the thickness direction of the substrate 1.
[0046] The cross section of the positioning hole is circular, and the diameter of the positioning hole is 0.1-1 mm.
[0047] Specifically, arranging the positioning holes in this form is conducive to accurate positioning from both ends (for example, both ends in the length direction of the substrate 1) when the printing mold is installed, which can effectively limit the translation and rotational freedom of the mold in the plane, and ensure the accuracy of the relative position of the mold and other equipment components. Among them, when setting the diameter of the positioning hole, a smaller diameter such as 0.1-0.3mm is suitable for precision conductive circuit printing molds that have extremely high requirements for positioning accuracy and have a smaller overall mold size and relatively light loads. Positioning holes with a diameter between 0.3-1mm can be used for molds that are slightly larger in size and bear a certain load. The larger diameter can provide stronger positioning stability, and can also adapt to a certain degree of processing errors and assembly tolerances, ensuring the positioning reliability of the mold during normal use.
[0048] Preferably, the distance between the positioning hole and the corresponding end surface of the substrate 1 (the two end surfaces along the length direction of the substrate 1) is 2-3 cm.
[0049] In some of the embodiments, fixing grooves are respectively provided on two end surfaces of the substrate 1 .
[0050] Preferably, the vertical cross-section of the fixing groove is rectangular, and the width of the fixing groove is 0.5-2 mm.
[0051] Specifically, two fixing grooves are respectively provided at two end faces of the substrate (i.e., the end faces at both ends along the length direction of the substrate 1). This layout is convenient for fixing the printing mold from both ends, and in conjunction with external fixing devices (such as bolts, clamps, etc.), the mold can be firmly fixed on the installation plane to prevent the mold from being displaced during operation. Among them, the fixing groove is set in the form of a rectangular groove, which has a simple structure, is relatively easy to process, and can provide a large contact area to cooperate with the fixing component.
[0052] As an example, on the end surface of the substrate, the rectangular fixing groove can be arranged vertically (the thickness direction of the substrate 1 is the length direction of the fixing groove) or horizontally (the thickness direction of the substrate is the width direction of the fixing groove).
[0053] The method for preparing a precision conductive circuit printing mold according to the second aspect of the present invention is used to prepare the precision conductive circuit printing mold of any one of the first aspects, comprising the following steps:
[0054] S1, providing substrate;
[0055] S2, opening at least one through hole extending vertically through the substrate along the thickness direction thereof, wherein the diameter of the through hole is 1-3000 μm;
[0056] S3, coating a protective coating on the surface of the substrate and the inner wall of the through hole, wherein the thickness of the protective coating is 1-10 μm;
[0057] S4, polishing the surface of the rough mold to obtain a precision conductive circuit printing mold.
[0058] Specifically, according to the method for preparing a precision conductive circuit printing mold according to an embodiment of the present invention, a nano-scale through hole can be prepared on a substrate using laser or micro-nano processing technology, and then a protective coating can be applied to the surface of the substrate and the inner side wall of the through hole. For example, the protective coating can be applied using a physical vapor deposition or chemical vapor deposition process to obtain a rough mold. Finally, the surface of the rough mold is polished to obtain a precision conductive circuit printing mold, thereby reducing the resistance of the slurry during the filling process.
[0059] In some embodiments, in step S1, the material of the substrate is selected from one or more of silicon carbide, silicon nitride, ceramic, high entropy alloy, nickel-chromium alloy or Invar alloy.
[0060] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.
Claims
1. A precision conductive circuit printing mold, characterized in that: The substrate comprises a substrate, wherein at least one through hole is formed along the thickness direction of the substrate and passes through the substrate vertically. The surface of the substrate and the inner sidewall of the through hole are also coated with a protective coating. Wherein, the diameter of the through hole is 1-3000 μm, and the thickness of the protective coating is 1-10 μm.
2. The precision conductive circuit printing mold according to claim 1, characterized in that: The material of the substrate is selected from one or more of silicon carbide, silicon nitride, ceramics, high entropy alloy, nickel-chromium alloy or Invar alloy.
3. The precision conductive circuit printing mold according to claim 1, characterized in that: The material of the protective coating includes aluminum oxide or diamond.
4. The precision conductive circuit printing mold according to claim 1, characterized in that: The cross section of the through hole is circular or rectangular.
5. The precision conductive circuit printing mold according to claim 1, characterized in that: The base material is also provided with positioning holes and fixing grooves.
6. The precision conductive circuit printing mold according to claim 5, characterized in that: The positioning holes are respectively opened at both ends of the substrate along the thickness direction of the substrate. The cross section of the positioning hole is circular, and the diameter of the positioning hole is 0.1-1 mm.
7. The precision conductive circuit printing mold according to claim 5, characterized in that: The fixing grooves are respectively opened on two end surfaces of the substrate.
8. The precision conductive circuit printing mold according to claim 7, characterized in that: The vertical cross section of the fixing groove is rectangular, and the width of the fixing groove is 0.5-2 mm.
9. A method for preparing a precision conductive circuit printing mold, characterized in that: The steps include: S1, providing substrate; S2, opening at least one through hole extending vertically through the substrate along the thickness direction thereof, wherein the diameter of the through hole is 1-3000 μm; S3, coating the surface of the substrate and the inner wall of the through hole with a protective coating to obtain a rough mold, wherein the thickness of the protective coating is 1-10 μm; S4, polishing the surface of the rough mold to obtain the precision conductive circuit printing mold.
10. The method for preparing a precision conductive circuit printing mold according to claim 9, characterized in that: In step S1, the material of the substrate is selected from one or more of silicon carbide, silicon nitride, ceramic, high entropy alloy, nickel-chromium alloy or Invar alloy; In the step S3, the protective coating is coated by using a physical vapor deposition or chemical vapor deposition process.