High-efficiency heat dissipation IC board packaging structure and method

Abstract

The invention relates to the technical field of chip packaging, in particular to an efficient heat dissipation IC board packaging structure and method. Comprising a shell, a clamping assembly is arranged in the shell, a machining hole matched with the clamping assembly in position is formed in the upper surface of the shell, a heat preservation shell is arranged on one side of the shell, a coil pipe is arranged in the heat preservation shell, one end of the coil pipe penetrates through the heat preservation shell to be connected with a metering pump, one end of the metering pump is connected with a heat preservation box through a guide pipe, and the other end of the coil pipe penetrates through the heat preservation shell to be connected with a storage cylinder. A negative pressure assembly is arranged on the side, away from the shell, of the coil pipe, a drying assembly is arranged on the side, close to the heat preservation shell, in the shell, and a temperature monitoring assembly is arranged at one end of the drying assembly. Compared with the prior art, when the airflow temperature measured by the temperature sensor exceeds a threshold value, a temperature signal is sent to the processor, the metering pump is started again, then the water body with the temperature rising is conveyed into the storage barrel to be stored, low-temperature water in the heat preservation box is further conveyed into the coil pipe again, and then the heat dissipation efficiency of the device is improved conveniently.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, in particular to a high-efficiency heat dissipation IC board packaging structure and method. Background Art

[0002] A package substrate is a basic component of an integrated circuit (IC) chip that supports and connects the IC chip's pins and provides the necessary electrical and mechanical support. Package substrates are typically made of insulating materials such as glass fiber reinforced epoxy (FR-4) or higher-grade materials such as quartz and polyimide (PI), which provide good electrical insulation and mechanical strength. IC (integrated circuit) board packaging typically requires soldering, the process of connecting the IC chip to the pads on the PCB (printed circuit board). Specifically, the IC chip's pins are typically soldered to the PCB's pads using surface mount technology (SMT) to ensure a good electrical connection and mechanical fixation.

[0003] Chinese patent publication number CN 205810782 U describes a highly efficient heat-dissipating IC board packaging structure, comprising a housing and an IC board. Heat dissipation holes are provided on the mounting plate to facilitate heat dissipation, and inlet and outlet fans are provided on either side of the housing to circulate air within the housing and accelerate heat dissipation. However, this device has drawbacks in practice. The fan used to dissipate heat from the IC board being processed within the device is ineffective. Furthermore, during the heat dissipation process, the fan exchanges airflow between the inside and outside of the device, but since the outside air contains moisture, this can further damage the IC board. Summary of the Invention

[0004] The present invention overcomes the deficiencies of the prior art and provides a high-efficiency heat dissipation IC board packaging structure and method.

[0005] To achieve the above-mentioned purpose, an efficient heat dissipation IC board packaging structure is designed, comprising a shell, a clamping assembly is provided in the shell, a processing hole matching the position of the clamping assembly is provided on the upper surface of the shell, an insulation shell is provided on one side of the shell, a coil is provided in the insulation shell, one end of the coil passes through the insulation shell to be connected to a metering pump, one end of the metering pump is connected to an insulation box through a conduit, the other end of the coil passes through the insulation shell to be connected to a storage cylinder, a negative pressure assembly is provided on the side of the coil away from the shell, a drying assembly is provided on the side of the shell close to the insulation shell, and a temperature monitoring assembly is provided at one end of the drying assembly.

[0006] The clamping assembly includes an electric telescopic rod, a U-shaped plate, a cylinder, and a flexible clamping block. The lower inner wall of the shell is connected to one end of the electric telescopic rod, the other end of the electric telescopic rod is connected to the U-shaped plate, the two side walls of the U-shaped plate are respectively connected to the cylinder, and the inner side of the cylinder shaft is connected to the flexible clamping block.

[0007] A control valve is provided on the pipeline between the storage cylinder and the coil, the outlet of the storage cylinder is connected to the drainage pipe, and a press valve is provided on the drainage pipe.

[0008] The negative pressure assembly includes a servo motor, a connecting shaft, and a fan blade. The fan blade is provided on the side of the coil away from the shell. The fan blade is connected to one end of the connecting shaft, and the other end of the connecting shaft is connected to the servo motor.

[0009] One side of the insulation shell is provided with a plurality of negative pressure through holes that match the position of the negative pressure assembly, and one side of the shell is provided with a plurality of exhaust holes, and the side where the exhaust holes are located is arranged opposite to the side where the negative pressure through holes are located.

[0010] The drying component includes a frame, a cavity plate, a metal mesh plate, and a handle. The side of the shell close to the insulation shell is connected to the frame. A slot is provided on one side of the frame, and the cavity plate is slidably connected in the slot. The metal mesh plate is installed in the cavity plate. One end of the cavity plate is connected to the handle, and the cavity plate is filled with desiccant.

[0011] The temperature monitoring component includes a positioning rod and a temperature sensor, which is located at one end of the drying component frame and is connected to the temperature sensor through the positioning rod.

[0012] A transparent observation window is provided on one side of the shell.

[0013] A dust cover is provided on one side of the processing hole.

[0014] To achieve the above objectives, a method for designing an efficient heat dissipation IC board packaging structure is provided, comprising the following steps: S1, place the IC board between the two flexible clamping blocks of the clamping assembly, start the cylinder, the cylinder drives one end of the cylinder shaft to move, and further drives the two flexible clamping blocks to move relative to each other, flexibly clamping and fixing the IC board; S2, after clamping and fixing, drive the electric telescopic rod to further adjust the height of the U-shaped plate. After adjustment, weld the IC board inside the shell through the processed hole; S3, start the metering pump to transport the low-temperature water inside the insulation box to the coil; S4, start the negative pressure component to perform wind cooling, and monitor the air flow temperature in real time through the temperature monitoring component; S5: When the water temperature inside the coil rises, the air flow temperature measured by the temperature sensor exceeds the threshold, and a temperature signal is sent to the processor and controller, which drives the metering pump and control valve to start, and the water with rising temperature is transported to the storage cylinder, and the low-temperature water inside the insulation box is further transported to the coil; S6, when the internal cavity of the storage cylinder is full of water, the press valve is opened to discharge the internal high-temperature water through the drainage pipe.

[0015] Compared with the prior art, when the air flow temperature measured by the temperature sensor exceeds the threshold, the present invention further sends a temperature signal to the processor, and the controller is electrically controlled and connected to the processor, and then sends a signal to enable the controller to drive the metering pump and the control valve. At this time, the control valve opens, and the metering pump starts again, and then the water with rising temperature is transported to the storage cylinder for storage, and the low-temperature water inside the insulation box is further transported to the coil again, thereby facilitating the improvement of the heat dissipation efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention.

[0017] Figure 2 This is a structural diagram of the present invention from another perspective.

[0018] Figure 3 It is a side view of the present invention.

[0019] Figure 4 It is a schematic diagram of the cross-sectional structure of the present invention from a top view.

[0020] Figure 5 It is a schematic diagram of the cross-sectional structure of the present invention from the side.

[0021] Figure 6 It is a structural schematic diagram of the coil of the present invention.

[0022] Figure 7 It is a structural schematic diagram of the clamping assembly of the present invention.

[0023] See also Figures 1 to 7 , among which, 1 is the shell, 2 is the processing hole, 3 is the insulation shell, 4 is the coil, 5 is the frame body, 6 is the dust cover, 7 is the exhaust hole, 8 is the electric telescopic rod, 9 is the U-shaped plate, 10 is the cylinder, 11 is the flexible clamping block, 12 is the cylinder shaft, 13 is the servo motor, 14 is the connecting shaft, 15 is the fan blade, 16 is the control switch, 17 is the cavity plate, 18 is the metal mesh plate, 19 is the handle, 20 is the positioning rod, 21 is the temperature sensor, 22 is the processor, 23 is the controller, 24 is the metering pump, 25 is the insulation box, 26 is the catheter, 27 is the storage cylinder, 28 is the control valve, 29 is the drainage tube, 30 is the press valve, 32 is the negative pressure component, 33 is the drying component, 34 is the temperature monitoring component, 35 is the negative pressure through hole, and 36 is the observation window. DETAILED DESCRIPTION

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] like Figures 1 to 7As shown, a clamping assembly is provided in the shell 1, and a processing hole 2 is provided on the upper surface of the shell 1 which matches the position of the clamping assembly. An insulation shell 3 is provided on one side of the shell 1, and a coil 4 is provided in the insulation shell 3. One end of the coil 4 passes through the insulation shell 3 to connect to the metering pump 24, and one end of the metering pump 24 is connected to the insulation box 25 through the conduit 26. The other end of the coil 4 passes through the insulation shell 3 to connect to the storage cylinder 27. A negative pressure assembly 32 is provided on the side of the coil 4 away from the shell 1, and a drying assembly 33 is provided on the side of the shell 1 close to the insulation shell 3. A temperature monitoring assembly 34 is provided at one end of the drying assembly 3 for monitoring the air flow temperature.

[0026] The coil 4 is made of metal material.

[0027] The clamping assembly includes an electric telescopic rod 8, a U-shaped plate 9, a cylinder 10, and a flexible clamping block 11. The lower inner wall of the housing 1 is connected to one end of the electric telescopic rod 8, and the other end of the electric telescopic rod 8 is connected to the U-shaped plate 9. The two side walls of the U-shaped plate 9 are connected to the cylinder 10, and the inner side of the cylinder shaft 10 is connected to the flexible clamping block 11. The clamping assembly is placed inside the housing 1 and is used to clamp and secure the IC board.

[0028] A control valve 28 is provided on the pipeline between the storage cylinder 27 and the coil 4 . The outlet of the storage cylinder 27 is connected to a drainage pipe 29 , and a press valve 30 is provided on the drainage pipe 29 .

[0029] The negative pressure assembly 32 includes a servo motor 13 , a connecting shaft 14 , and a fan blade 15 . The fan blade 15 is provided on the side of the coil 4 away from the housing 1 . The fan blade 15 is connected to one end of the connecting shaft 14 , and the other end of the connecting shaft 14 is connected to the servo motor 13 .

[0030] In actual use, the servo motor 13 is fixed to the insulation shell 3. The output shaft of the servo motor 13 passes through the side wall of the insulation shell 3 and is connected to the connecting shaft 14. A control switch 16 is provided on one side of the servo motor 13. The operator activates the servo motor 13 by controlling the control switch 16, which further drives the connecting shaft 14 and the fan blades 15 to rotate, thereby facilitating airflow exchange through the negative pressure effect.

[0031] One side of the insulation shell 3 is provided with a plurality of negative pressure holes 35 that match the position of the negative pressure assembly 32, and one side of the housing 1 is provided with a plurality of exhaust holes 7, with the exhaust holes 7 located on the side opposite to the side of the negative pressure holes 35. The negative pressure holes 35 and the exhaust holes 7 facilitate airflow exchange between the insulation shell 3 and the housing 1 and the outside world, thereby achieving heat dissipation.

[0032] The drying component 33 includes a frame 5, a cavity plate 17, a metal mesh plate 18, and a handle 19. The frame 5 is connected to the side of the shell 1 close to the insulation shell 3. A slot is provided on one side of the frame 5, and the cavity plate 17 is slidably connected in the slot. The metal mesh plate 18 is installed in the cavity plate 17. One end of the cavity plate 17 is connected to the handle 19, and the cavity plate 17 is filled with desiccant.

[0033] The desiccant assembly dries out moisture in the low-temperature airflow, reducing its impact on the IC board. During use, the operator can utilize the sliding fit of the cavity plate 17 and the square slots to facilitate installation and removal of the cavity plate 17 using the handle 19. This further facilitates replacement of the desiccant inside the cavity plate 17. The desiccant dries the airflow, preventing moisture from damaging the IC board.

[0034] The temperature monitoring component 34 includes a positioning rod 20 and a temperature sensor 21 , and is located at one end of the drying component frame 5 and connected to the temperature sensor 21 through the positioning rod 20 .

[0035] During specific use, the temperature sensor 21 is communicatively connected to the processor 22, and the processor 22 is electrically connected to the controller 23. After the temperature sensor 21 sends a signal to the processor 22, the processor 22 drives the start and shut down of components such as the metering pump 24 and the control valve 28 through the controller 23.

[0036] A transparent observation window 36 is provided on one side of the housing 1. During use, a mounting slot is provided on the front sidewall of the housing 1, within which the transparent observation window 36 is fixedly mounted. The transparent observation window 36 is made of transparent acrylic. After processing, the IC board's pins can be directly connected to other components on the circuit board or external devices via soldering.

[0037] A dust cover 6 is provided on one side of the processing hole 2 .

[0038] The method for the above-mentioned efficient heat dissipation IC board packaging structure comprises the following steps: S1, place the IC board between the two flexible clamping blocks 11 of the clamping assembly, start the cylinder 10, and the cylinder 10 drives one end of the cylinder shaft 12 to move, further driving the two flexible clamping blocks 11 to move relative to each other, flexibly clamping and fixing the IC board; S2, after clamping and fixing, drive the electric telescopic rod 8 to further adjust the height of the U-shaped plate 9. After adjustment, weld the IC board inside the housing 1 through the processing hole 2; S3, start the metering pump 24 to deliver the low-temperature water inside the insulation box 25 to the coil 4; S4, start the negative pressure component to perform wind cooling. The negative pressure component is set on one side of the coil 4 to take away the low-temperature airflow from the outer wall of the coil 4, further reducing the temperature of the airflow. At the same time, the airflow temperature is monitored in real time through the temperature monitoring component; S5: When the water temperature inside the coil 4 rises, the airflow temperature measured by the temperature sensor 21 exceeds the threshold value, and a temperature signal is sent to the processor 22 and the controller 23, which activate the metering pump 24 and the control valve 28, thereby transferring the heated water to the storage cylinder 27. The low-temperature water inside the insulation box 25 is then transferred back to the coil 4, thereby improving the heat dissipation efficiency of the device. S6, such as Figure 3 It can be seen that the insulation box 25 is provided with a box cover. The staff can add low-temperature water into the insulation box 25 by opening the box cover. The low-temperature water then absorbs heat and is converted into high-temperature water and further stored in the storage cylinder 27. When the internal cavity of the storage cylinder 27 is full of water, the staff can open the press valve 30 and discharge the internal high-temperature water through the drainage pipe 29. The operation is convenient.

Claims

1. An efficient heat dissipation IC board packaging structure, comprising a housing, characterized in that: The shell (1) is provided with a clamping assembly, and the upper surface of the shell (1) is provided with a processing hole (2) that matches the position of the clamping assembly. A heat-insulating shell (3) is provided on one side of the shell (1), and a coil (4) is provided in the heat-insulating shell (3). One end of the coil (4) passes through the heat-insulating shell (3) to be connected to a metering pump (24), and one end of the metering pump (24) is connected to an insulation box (25) through a conduit (26). The other end of the coil (4) passes through the heat-insulating shell (3) to be connected to a storage cylinder (27). A negative pressure assembly (32) is provided on the side of the coil (4) away from the shell (1), and a drying assembly (33) is provided on the side of the shell (1) close to the heat-insulating shell (3). A temperature monitoring assembly (34) is provided on one end of the drying assembly (33).

2. The high-efficiency heat dissipation IC board packaging structure according to claim 1, characterized in that: The clamping assembly comprises an electric telescopic rod (8), a U-shaped plate (9), a cylinder (10), and a flexible clamping block (11); the lower inner wall of the housing (1) is connected to one end of the electric telescopic rod (8), the other end of the electric telescopic rod (8) is connected to the U-shaped plate (9), the two side walls of the U-shaped plate (9) are respectively connected to the cylinder (10), and the inner side of the cylinder shaft (10) is connected to the flexible clamping block (11).

3. The high-efficiency heat dissipation IC board packaging structure according to claim 1, characterized in that: A control valve (28) is provided on the pipeline between the storage cylinder (27) and the coil (4); the outlet of the storage cylinder (27) is connected to a drainage tube (29); and a pressing valve (30) is provided on the drainage tube (29).

4. The high-efficiency heat dissipation IC board packaging structure according to claim 1, characterized in that: The negative pressure assembly (32) comprises a servo motor (13), a connecting shaft (14), and a fan blade (15). The fan blade (15) is provided on a side of the coil (4) away from the housing (1). The fan blade (15) is connected to one end of the connecting shaft (14), and the other end of the connecting shaft (14) is connected to the servo motor (13).

5. The high-efficiency heat dissipation IC board packaging structure according to claim 1 or 4, characterized in that: A plurality of negative pressure through holes (35) matching the position of the negative pressure assembly (32) are provided on one side of the heat-insulating shell (3), and a plurality of exhaust holes (7) are provided on one side of the shell (1), wherein the side where the exhaust holes (7) are located is arranged opposite to the side where the negative pressure through holes (35) are located.

6. The high-efficiency heat dissipation IC board packaging structure according to claim 1, characterized in that: The drying assembly (33) comprises a frame (5), a cavity plate (17), a metal mesh plate (18), and a handle (19); the frame (5) is connected to a side of the housing (1) close to the heat-insulating shell (3); a notch is provided on one side of the frame (5), the cavity plate (17) is slidably connected in the notch, the metal mesh plate (18) is installed in the cavity plate (17), one end of the cavity plate (17) is connected to the handle (19), and the cavity plate (17) is filled with a desiccant.

7. The high-efficiency heat dissipation IC board packaging structure according to claim 1, characterized in that: The temperature monitoring component (34) comprises a positioning rod (20) and a temperature sensor (21), and is located at one end of the frame (5) of the drying component (33) and connected to the temperature sensor (21) via the positioning rod (20).

8. The high-efficiency heat dissipation IC board packaging structure according to claim 1, characterized in that: A transparent observation window (36) is provided on one side of the housing (1).

9. The high-efficiency heat dissipation IC board packaging structure according to claim 1, characterized in that: A dust cover (6) is provided on one side of the processing hole (2).

10. A method for packaging an IC board structure with high efficiency heat dissipation according to any one of claims 1 to 9, characterized in that: The steps include: S1, placing the IC board between two flexible clamping blocks (11) of the clamping assembly, starting the cylinder (10), the cylinder (10) drives one end of the cylinder shaft (12) to move, and further drives the two flexible clamping blocks (11) to move relative to each other, so as to flexibly clamp and fix the IC board; S2, after clamping and fixing, driving the electric telescopic rod (8) to further adjust the height of the U-shaped plate (9), and after adjustment, performing welding processing on the IC board inside the housing (1) through the processing hole (2); S3, starting the metering pump (24) to transport the low-temperature water in the insulation box (25) to the coil (4); S4, start the negative pressure component () to perform wind cooling, and monitor the air flow temperature in real time through the temperature monitoring component (); S5, when the temperature of the water inside the coil (4) rises, the air flow temperature measured by the temperature sensor (21) exceeds a threshold value, and a temperature signal is sent to the processor (22) and the controller (23), driving the metering pump (24) and the control valve (28) to start, and the water with the rising temperature is transported to the storage cylinder (27), and the low-temperature water inside the heat preservation box (25) is further transported to the coil (4) for action; S6, when the internal cavity of the storage cylinder (27) is full of water, the pressing valve (30) is opened to discharge the internal high-temperature water through the drainage pipe (29).

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