Laminated ceramic electronic component

Abstract

The purpose of the present invention is to reduce the influence of thermal stress due to solder shrinkage while suppressing an increase in the size of a component in a laminated ceramic electronic component. A laminated ceramic electronic component (10) according to the present invention is provided with: a laminated body (12); a first external electrode (30a) provided so as to extend from the first end surface (12e) of the laminate (12) to the first main surface (12a) and the second main surface (12b); and a second external electrode (30b) provided so as to extend from the second end surface (12f) of the laminated body (12) to the first main surface (12a) and the second main surface (12b), the first external electrode (30a) having a first main surface inclined portion (35ma) formed so as to extend from the first main surface (12a) side of the laminated body (12) to the first end surface (12e) side, and the second external electrode (30b) having a second main surface inclined portion (37ma) formed so as to extend from the first main surface (12a) side of the laminated body (12) to the second end surface (12f) side. The first main surface inclined part (35ma) covers a ridge line part formed by the first main surface (12a) and the first end surface (12e) of the laminated body (12), and the second main surface inclined part (37ma) covers a ridge line part formed by the first main surface (12a) and the second end surface (12f) of the laminated body (12).

Description

Technical Field

[0001] The present invention relates to a laminated ceramic electronic component. Background Art

[0002] In the past, a laminated ceramic capacitor is known as a laminated ceramic electronic component. It is known that a general laminated ceramic capacitor includes a laminated body in which a plurality of internal electrode layers and dielectric layers are alternately laminated, and an external electrode electrically connected to the internal electrode layer. In general, a laminated ceramic capacitor is mounted on a substrate by soldering on the substrate using a method such as reflow soldering.

[0003] On the other hand, the solder used to bond the external electrodes of the multilayer ceramic capacitor to the substrate shrinks due to temperature changes, generating thermal stress, which causes problems such as cracks to form in the multilayer ceramic capacitor body due to the thermal stress.

[0004] As a means for solving such a problem, for example, Patent Document 1 discloses a technique in which an epoxy-based thermosetting resin layer for absorbing stress is provided on a baked electrode layer of an external electrode.

[0005] Prior Art Literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 11-162771 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] However, the above-mentioned conventional technology has the following problems: that is, if a stress absorbing resin layer is provided on the external electrode, the size of the multilayer ceramic capacitor itself increases accordingly, resulting in disadvantages such as a decrease in the degree of freedom in mounting.

[0010] The present invention has been made in view of such problems, and its object is to provide a laminated ceramic electronic component and a method for manufacturing a laminated ceramic electronic component that can suppress the increase in component size and reduce the influence of thermal stress caused by solder shrinkage in a laminated ceramic electronic component such as a laminated ceramic capacitor.

[0011] Technical solutions to solve problems

[0012] The laminated ceramic electronic component of the present invention is a laminated ceramic electronic component comprising: a laminated body including a plurality of laminated ceramic layers, and including a first main surface and a second main surface opposite to each other in a height direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the stacking direction of the plurality of ceramic layers, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the stacking direction and the width direction, and including a first internal electrode layer alternately laminated with the plurality of ceramic layers and exposed at the first end surface, and a first internal electrode layer alternately laminated with the plurality of ceramic layers and exposed at the first end surface. A second internal electrode layer in which ceramic layers are alternately stacked and exposed at the second end face; a first external electrode, which is arranged to extend from the first end face of the stack to the first main face and the second main face respectively; and a second external electrode, which is arranged to extend from the second end face of the stack to the first main face and the second main face respectively, the first external electrode having a first main face inclined portion formed to extend from the first main face side of the stack to the first end face side, and the second external electrode having a second main face inclined portion formed to extend from the first main face side of the stack to the second end face side.

[0013] In the laminated ceramic electronic component involved in the present invention, the first external electrode has a first main surface inclined portion formed to extend from the first main surface side of the laminate to the first end surface side, and the second external electrode has a second main surface inclined portion formed to extend from the first main surface side of the laminate to the second end surface side, thereby alleviating stress concentration on the joint portion between the first external electrode and the laminate and the joint portion between the second external electrode and the laminate, thereby suppressing the generation of cracks in the laminate.

[0014] Effects of the Invention

[0015] According to the present invention, it is possible to provide a multilayer ceramic electronic component that can suppress an increase in the size of the component and reduce the influence of thermal stress due to solder shrinkage.

[0016] The above-mentioned object, other objects, features and advantages of the present invention will become more apparent from the following description of specific embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a perspective view showing the appearance of a multilayer ceramic capacitor according to a first embodiment of the present invention.

[0018] Figure 2 It is a front view showing a multilayer ceramic capacitor according to a first embodiment of the present invention.

[0019] Figure 3 It is a side view showing a multilayer ceramic capacitor according to a first embodiment of the present invention.

[0020] Figure 4 yes Figure 1 Cross-sectional view at line IV-IV.

[0021] Figure 5 yes Figure 1 Cross-sectional view at line V-V.

[0022] Figure 6 is with Figure 4 A plan view showing the structure of the internal electrode layers of the multilayer ceramic capacitor according to the first embodiment of the present invention, corresponding to the cross-sectional view taken along the line VI-VI.

[0023] Figure 7 is with Figure 4 A side view showing a structure in the vicinity of an external electrode of the multilayer ceramic capacitor according to the first embodiment of the present invention, corresponding to a region R of FIG.

[0024] Figure 8 is with Figure 4 A side view showing another structural example of the vicinity of the external electrodes of the multilayer ceramic capacitor according to the first embodiment of the present invention, corresponding to the region R.

[0025] Fig. 9 is with Figure 4 A cross-sectional view showing a structure in the vicinity of an external electrode of the multilayer ceramic capacitor according to the first embodiment of the present invention, corresponding to a region R of FIG.

[0026] Fig.10 is with Figure 4 A cross-sectional view showing another structural example of the vicinity of the external electrodes of the multilayer ceramic capacitor according to the first embodiment of the present invention, corresponding to the region R of FIG.

[0027] Fig.11 It is a front view showing a multilayer ceramic capacitor according to Modification 1 of the first embodiment of the present invention.

[0028] Fig.12 It is a side view showing a multilayer ceramic capacitor according to Modification 2 of the first embodiment of the present invention.

[0029] Fig.13 It is a side view showing a multilayer ceramic capacitor according to Modification 2 of the first embodiment of the present invention.

[0030] Fig.14 It is a diagram for explaining a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention.

[0031] Fig.15 It is a diagram for explaining a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention.

[0032] Fig.16It is a diagram for explaining a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention.

[0033] Fig.17 It is a perspective view showing the appearance of a multilayer ceramic capacitor according to a second embodiment of the present invention.

[0034] Fig.18 yes Fig.17 This is a cross-sectional view taken along line XVIII-XVIII.

[0035] Fig.19 It is a perspective view showing the appearance of a multilayer ceramic capacitor according to a third embodiment of the present invention.

[0036] Fig. 20 yes Fig.19 A cross-sectional view taken along line XX-XX is involved. DETAILED DESCRIPTION

[0037] A. First Embodiment

[0038] 1. Multilayer ceramic capacitors

[0039] As a multilayer ceramic capacitor according to an embodiment of the present invention, a two-terminal multilayer ceramic capacitor 10 will be described.

[0040] Figure 1 It is a perspective view showing the appearance of a multilayer ceramic capacitor according to a first embodiment of the present invention. Figure 2 It is a front view showing a multilayer ceramic capacitor according to a first embodiment of the present invention. Figure 3 It is a side view showing a multilayer ceramic capacitor according to a first embodiment of the present invention. Figure 4 yes Figure 1 Cross-sectional view at line IV-IV. Figure 5 yes Figure 1 Cross-sectional view at line V-V. Figure 6 is with Figure 4 A plan view showing the structure of the internal electrode layers of the multilayer ceramic capacitor according to the first embodiment of the present invention, corresponding to the cross-sectional view taken along the line VI-VI.

[0041] like Figures 1 to 4 As shown, the multilayer ceramic capacitor 10 includes a multilayer body 12 and external electrodes 30 disposed on the surface of the multilayer body 12 .

[0042] The stack 12 has a rectangular parallelepiped shape. In the stack 12, corners and ridges may be formed with edges or may be rounded. In addition, the so-called corner is a portion where three adjacent faces of the stack 12 intersect, and the so-called ridge is a portion where two adjacent faces of the stack 12 intersect.

[0043] The stack 12 has a first main surface 12a and a second main surface 12b opposite to each other, a first side surface 12c and a second side surface 12d connecting the first main surface 12a and the second main surface 12b and opposite to each other, and a first end surface 12e and a second end surface 12f connecting the first main surface 12a and the second main surface 12b and opposite to each other in a direction orthogonal to the first side surface 12c and the second side surface 12d.

[0044] The first main surface 12a and the second main surface 12b, the first side surface 12c and the second side surface 12d, and the first end surface 12e and the second end surface 12f may be formed with projections and depressions in all or part of them.

[0045] Here, the direction connecting the first main surface 12a and the second main surface 12b of the stacked body 12 is defined as the height direction x, the direction connecting the first side surface 12c and the second side surface 12d in the direction orthogonal to the height direction x is defined as the width direction y, and the direction connecting the first end surface 12e and the second end surface 12f orthogonal to the height direction x and the width direction y is defined as the length direction z. In addition, in the following description, with respect to the stacked ceramic capacitor 10 including the stacked body 12 and the external electrode 30 described later, the dimension in the length direction z is referred to as the L dimension, the dimension in the height direction x is referred to as the T dimension, and the dimension in the width direction y is referred to as the W dimension. These terms are used in the following description.

[0046] In particular, Figure 4 as well as Figure 5 As shown, the laminate 12 includes a plurality of stacked ceramic layers 14 and a plurality of internal electrode layers 16 that are mutually opposed and spaced apart inside the plurality of stacked ceramic layers 14. The plurality of internal electrode layers 16 are each individually disposed on each of the plurality of ceramic layers 14. Therefore, the plurality of internal electrode layers 16 are each disposed between the layers of the plurality of stacked ceramic layers 14.

[0047] In the laminated body 12 , a plurality of ceramic layers 14 and a plurality of internal electrode layers 16 are arranged and stacked along the height direction x.

[0048] The stack 12 has an inner layer portion 18 in which a plurality of internal electrode layers 16 are opposed to each other in a stacking direction connecting the first main surface 12a and the second main surface 12b, an outer layer portion 20a on the first main surface side located between the electrode layer closest to the first main surface 12a among the plurality of internal electrode layers 16 and the first main surface 12a, and an outer layer portion 20b on the second main surface side located between the electrode layer closest to the second main surface 12b among the plurality of internal electrode layers 16 and the second main surface 12b.

[0049] The internal electrode layer 16 includes a first internal electrode layer 16a extending to the first end surface 12e and a second internal electrode layer 16b extending to the second end surface 12f. The plurality of first internal electrode layers 16a and second internal electrode layers 16b are opposed to each other via the ceramic layer 14 in the inner layer portion 18, thereby functioning as a main body of a capacitor for storing electric charge.

[0050] The first principal surface side outer layer portion 20 a is an assembly of a plurality of ceramic layers 14 located between the electrode layer closest to the first principal surface 12 a among the plurality of internal electrode layers 16 and the first principal surface 12 a .

[0051] The second main surface side outer layer portion 20 b is an assembly of a plurality of ceramic layers 14 located between the electrode layer closest to the second main surface 12 b among the plurality of internal electrode layers 16 and the second main surface 12 b.

[0052] The inner layer portion 18 is a region sandwiched between the first main surface side outer layer portion 20 a and the second main surface side outer layer portion 20 b .

[0053] The laminate 12 includes a first side surface outer layer portion 22a located between the inner layer portion 18 and the first side surface 12c and a second side surface outer layer portion 22b located between the inner layer portion 18 and the second side surface 12d. These side surface outer layer portions are also referred to as W spaces.

[0054] The first side surface outer layer portion 22 a is located on the first side surface 12 c side and is an assembly of a plurality of ceramic layers 14 located between the first side surface 12 c and the outermost surface of the inner layer portion 18 on the first side surface 12 c side.

[0055] The second side surface outer layer portion 22 b is located on the second side surface 12 d side and is an assembly of a plurality of ceramic layers 14 located between the second side surface 12 d and the outermost surface of the inner layer portion 18 on the second side surface 12 d side.

[0056] The laminate 12 has a first side surface outer layer portion 22a located between the inner layer portion 18 and the first end surface 12e, a first end surface outer layer portion 24a located between the inner layer portion 18 and the second side surface 12d, and a second end surface outer layer portion 24b located between the inner layer portion 18 and the second end surface 12f. In addition, these end surface outer layer portions are also referred to as L intervals.

[0057] The first end surface side outer layer portion 24a is located on the first end surface 12e side and is an aggregate of lead electrode portions of a plurality of ceramic layers 14 and a plurality of first internal electrode layers 16a located between the first end surface 12e and the outermost surface of the inner layer portion 18 on the first end surface 12e side.

[0058] The second end surface side outer layer portion 24b is located on the second end surface 12f side and is an aggregate of lead electrode portions of the plurality of ceramic layers 14 and the plurality of second internal electrode layers 16b located between the second end surface 12f and the outermost surface of the inner layer portion 18 on the second end surface 12f side.

[0059] The size of the laminate 12 is not particularly limited.

[0060] For example, as the ceramic material of the ceramic layer 14, BaTiO 3 、CaTiO 3 、SrTiO 3 , or CaZrO 3 In addition, materials in which a secondary component such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound whose content is less than that of the main component are added to these main components can also be used.

[0061] In addition, when piezoelectric ceramics are used for the stack 12, the stacked ceramic electronic component functions as a ceramic piezoelectric element. As specific examples of piezoelectric ceramic materials, for example, PZT (lead zirconate titanate) ceramic materials and the like can be cited. In addition, when semiconductor ceramics are used for the stack 12, the stacked ceramic electronic component functions as a thermistor element. As specific examples of semiconductor ceramic materials, for example, spinel ceramic materials and the like can be cited. In addition, when magnetic ceramics are used for the stack 12, the stacked ceramic electronic component functions as an inductor element. In addition, when it functions as an inductor element, the internal electrode layer becomes a coil-shaped conductor. As specific examples of magnetic ceramic materials, for example, ferrite ceramic materials and the like can be cited.

[0062] The thickness of the ceramic layer 14 in the laminated body 12 after firing is preferably about 0.4 μm or more and 5.0 μm or less.

[0063] The number of stacked ceramic layers 14 is preferably 10 or more and 700 or less, which is the sum of the number of ceramic layers 14 constituting the inner layer portion 18 and the number of ceramic layers 14 constituting the first main surface side outer layer portion 20a and the second main surface side outer layer portion 20b.

[0064] The laminate 12 includes a plurality of first internal electrode layers 16a and a plurality of second internal electrode layers 16b as the plurality of internal electrode layers 16. The plurality of first internal electrode layers 16a and the plurality of second internal electrode layers 16b are substantially parallel to the first main surface 12a and the second main surface 12b, and are buried along the height direction x of the laminate 12 so as to be alternately arranged with the ceramic layers 14 interposed therebetween.

[0065] In addition, in each figure, in order to simplify the description, the plurality of first internal electrode layers 16a are assumed to include two first internal electrode layers 16a arranged from top to bottom along the height direction x, and the plurality of second internal electrode layers 16b are assumed to include two second internal electrode layers 16b arranged from top to bottom along the height direction x. However, these are examples, and the number of first internal electrode layers 16a and second internal electrode layers 16b may be any number other than the examples described later.

[0066] The first internal electrode layer 16 a and the second internal electrode layer 16 b are disposed on each of the plurality of ceramic layers 14 and are located inside the laminate 12 .

[0067] The structure of the internal electrode layer 16 is described below by taking the first internal electrode layer 16a as an example. Figure 6 As shown, the first internal electrode layer 16a is preferably substantially rectangular when viewed in the height direction x. Specifically, the first internal electrode layer 16a has a substantially rectangular shape having one side along the length direction z as a long side and one side along the width direction y as a short side.

[0068] The first internal electrode layer 16a includes: a first opposing electrode portion 26a, which is not exposed from the surface of the stack 12 and is opposite to the second internal electrode layer 16b; and a first lead electrode portion 28a, which is located on one end side of the first internal electrode layer 16a along the length direction z, extends from the first opposing electrode portion 26a and is led to the surface of the first end face 12e of the stack 12 and is exposed from the stack 12.

[0069] The shape of the first counter electrode portion 26a of the first internal electrode layer 16a is preferably a rectangular shape when viewed in the height direction x. However, the corners may be rounded when viewed in the height direction x, or may be inclined (conical) when viewed in the height direction x. In addition, the shape may be a cone that is inclined as it moves in any direction along the length direction z when viewed in the height direction x.

[0070] The shape of the first lead electrode portion 28a of the first internal electrode layer 16a is also preferably a rectangular shape when viewed in the height direction x. However, the corners may be rounded when viewed in the height direction x, or may be inclined (conical) when viewed in the height direction x. In addition, the shape may be a cone that is inclined as it moves in any direction along the length direction z when viewed in the height direction x.

[0071] The W dimension of the first counter electrode portion 26a of the first internal electrode layer 16a and the W dimension of the first lead electrode portion 28a may be the same as shown in the figure, or one of them may be smaller than the other.

[0072] The first internal electrode layer 16 a of the internal electrode layer 16 can be made of a suitable conductive material such as a metal such as Ni, Cu, Ag, Pd, Au, or an alloy containing at least one of these metals such as an Ag—Pd alloy, but is not limited thereto.

[0073] In the laminate 12, as Figures 4 to 6 As shown, the first internal electrode layer 16a and the second internal electrode layer 16b are formed line-symmetrically with respect to the inner layer portion 18 about the height direction x. Therefore, the above-mentioned structure of the first internal electrode layer 16a and various forms of the shape when viewed in the height direction x are also applicable to the second internal electrode layer 16b that is reversed in the length direction z.

[0074] Specifically, the second internal electrode layer 16 b has a substantially rectangular shape having one side along the longitudinal direction z as a long side and one side along the width direction y as a short side.

[0075] The second internal electrode layer 16b includes: a second opposing electrode portion 26b, which is not exposed from the surface of the stack 12 and is opposite to the first internal electrode layer 16a; and a second lead electrode portion 28b, which is located on one end side of the second internal electrode layer 16b along the length direction z, extends from the second opposing electrode portion 26b and is led to the surface of the second end face 12f of the stack 12 and is exposed from the stack 12.

[0076] The shape of the second counter electrode portion 26b of the second internal electrode layer 16b is preferably a rectangular shape when viewed in the height direction x. However, the corners may be rounded when viewed in the height direction x, or may be inclined (conical) when viewed in the height direction x. In addition, the shape may be a cone that is inclined as it moves in any direction along the length direction z when viewed in the height direction x.

[0077] The shape of the second lead electrode portion 28b of the second internal electrode layer 16b is also preferably a rectangular shape when viewed in the height direction x. However, the corners may be rounded when viewed in the height direction x, or may be inclined (conical) when viewed in the height direction x. In addition, the shape may be a cone that is inclined as it moves in any direction along the length direction z when viewed in the height direction x.

[0078] The W dimension of the second counter electrode portion 26b of the second internal electrode layer 16b and the W dimension of the second lead electrode portion 28b may be the same as shown in the figure, or one of them may be smaller than the other.

[0079] In the present embodiment, in the internal electrode layer 16, the first opposing electrode portion 26a of the internal electrode of the first internal electrode layer 16a and the second opposing electrode portion 26b of the second internal electrode layer 16b are opposed to each other via the ceramic layer 14, thereby forming capacitance and exhibiting capacitor characteristics.

[0080] The thickness of each of the first internal electrode layer 16 a and the second internal electrode layer 16 b is not particularly limited, but is preferably about 0.2 μm or more and 2.0 μm or less, for example.

[0081] The number of each of the first internal electrode layer 16 a and the second internal electrode layer 16 b is not particularly limited, but is preferably 10 or more and 700 or less in total.

[0082] The external electrode 30 includes a first external electrode 30 a and a second external electrode 30 b . The first external electrode 30 a and the second external electrode 30 b are two independent electrodes and are not connected to the same internal electrode layer 16 .

[0083] Next, the external appearance structure of the external electrode 30 will be described.

[0084] The first external electrode 30a is preferably electrically connected to the first internal electrode layer 16a, and is arranged on the first end surface 12e, a part of the first main surface 12a, and a part of the second main surface 12b. More specifically, the first external electrode 30a has a first end surface exposed portion 35e arranged on the surface of the first end surface 12e of the stack 12. The first external electrode 30a preferably further has: a first main surface exposed portion 35a extending from the first end surface 12e along the contour of the stack 12 via a first main surface inclined portion 35ma described later and covering a part of the first main surface 12a; and a third main surface exposed portion 35b extending from the first end surface 12e along the contour of the stack 12 and covering a part of the second main surface 12b. In addition, the first external electrode 30a may be arranged only on the first end surface 12e and a part of the first main surface 12a or a part of the second main surface 12b. Alternatively, the first external electrode 30 a may be arranged so as to slightly extend from the first end surface 12 e to a portion of the first side surface 12 c and a portion of the second side surface 12 d .

[0085] The second external electrode 30b is preferably electrically connected to the second internal electrode layer 16b, and is arranged on the second end surface 12f, a part of the first main surface 12a, and a part of the second main surface 12b. More specifically, the second external electrode 30b has a second end surface exposed portion 37f arranged on the surface of the second end surface 12f of the stack 12. The second external electrode 30b preferably further has: a second main surface exposed portion 37a extending from the second end surface 12f along the contour of the stack 12 via a second main surface inclined portion 37ma described later and covering a part of the first main surface 12a; and a fourth main surface exposed portion 37b extending from the second end surface 12f along the contour of the stack 12 and covering a part of the second main surface 12b. In addition, the second external electrode 30b may be arranged only on the second end surface 12f and a part of the first main surface 12a or a part of the second main surface 12b. In addition, the second outer electrode 30b may be arranged so as to slightly extend from the second end surface 12f to a part of the first side surface 12c and a part of the second side surface 12d.

[0086] Furthermore, the first external electrode 30 a of the external electrode 30 has a first main surface inclined portion 35 ma formed so as to extend from the first main surface 12 a to the first end surface 12 e of the laminate 12 .

[0087] The first main surface inclined portion 35ma is a plane that is located between the first main surface exposed portion 35a and the first end surface exposed portion 35e of the first external electrode 30a and is formed to be bent relative to each of the first main surface exposed portion 35a and the first end surface exposed portion 35e. The first main surface inclined portion 35ma is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the first main surface inclined portion 35ma is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the first main surface inclined portion 35ma.

[0088] Similarly, the second external electrode 30 b of the external electrode 30 has a second main surface inclined portion 37 ma formed to extend from the first main surface 12 a to the second end surface 12 f of the laminate 12 .

[0089] The second main surface inclined portion 37ma is a plane that is located between the second main surface exposed portion 37a and the second end surface exposed portion 37f of the second external electrode 30b and is formed to be bent relative to each of the second main surface exposed portion 37a and the second end surface exposed portion 37f. The second main surface inclined portion 37ma is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the second main surface inclined portion 37ma is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the second main surface inclined portion 37ma.

[0090] Next, the internal structure of the external electrode 30 will be described.

[0091] The first external electrode 30 a of the external electrode 30 preferably includes a first base electrode layer 32 a disposed on the laminate 12 and containing a conductive metal, and a first plating layer 34 a disposed to cover the first base electrode layer 32 a .

[0092] The second external electrode 30b of the external electrode 30 preferably includes a second base electrode layer 32b disposed on the laminate 12 and containing a conductive metal, and a second plating layer 34b disposed to cover the second base electrode layer 32b.

[0093] The base electrode layer 32 including the first base electrode layer 32a and the second base electrode layer 32b preferably includes at least one layer selected from a sintered layer and a thin film layer. Hereinafter, the sintered layer as the base electrode layer 32 will be described.

[0094] The sintered layer is a layer obtained by applying a conductive paste containing a glass component and a metal to the laminate 12 and sintering it. The glass component of the sintered layer includes at least one selected from B, Si, Ba, Mg, Al, Li, etc. The metal of the sintered layer includes, for example, at least one selected from Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc.

[0095] The sintered layer may be obtained by simultaneously firing a stacked sheet having an internal electrode layer 16 and a ceramic layer 14, which will be the basis of the stacked body 12, and a conductive paste applied to the stacked sheet. Alternatively, the sintered layer may be obtained by firing the stacked sheet to obtain the stacked body 12, and then applying a conductive paste to the stacked body 12 and sintering the stacked body 12. The sintered layer may be a single layer or a plurality of layers.

[0096] When the first base electrode layer 32a and the second base electrode layer 32b of the base electrode layer 32 are formed as sintered layers, the thickness of the first end surface exposed portion 35e and the second end surface exposed portion 37f is preferably, for example, 1 μm or more and 11 μm or less. In addition, the thickness of the first main surface exposed portion 35a and the second main surface exposed portion 37a is preferably, for example, 1 μm or more and 11 μm or less. In addition, the thickness of the first external electrode 30a and the second external electrode 30b, when there is a portion from the first end surface 12e to a portion of the first side surface 12c and a portion of the second side surface 12d, and when there is a portion from the second end surface 12f to a portion of the first side surface 12c and a portion of the second side surface 12d, is preferably, for example, 1 μm or more and 11 μm or less.

[0097] Among them, the so-called thickness of the sintered layer, in the case of the first end face exposed portion 35e and the second end face exposed portion 37f, is the thickness at the center portion in the height direction x; in the case of the first main surface exposed portion 35a and the second main surface exposed portion 37a, it is the thickness at the center portion in the length direction z; with respect to the first external electrode 30a and the second external electrode 30b, respectively, when there is a portion that goes around from the first end face 12e to a part of the first side face 12c and a part of the second side face 12d, and when there is a portion that goes around from the second end face 12f to a part of the first side face 12c and a part of the second side face 12d, it means the thickness at the center portion in the width direction y.

[0098] Next, the thin film layer serving as the base electrode layer 32 will be described. When the base electrode layer 32 is provided by a thin film layer, the thin film layer is formed as a layer having an average thickness of 1 μm or less by deposition of metal particles.

[0099] Next, the plating layer 34 will be described. The plating layer 34 includes a first plating layer 34a in the first external electrode 30a and a second plating layer 34b in the second external electrode 30b. The plating layer 34 is preferably Figure 4 as well as Figure 5 As shown in the figure, the first plating layer 34a is formed to cover the entire surface so that the base electrode layer 32 is not exposed to the outside. Specifically, the first plating layer 34a is preferably provided from the portion corresponding to the first end surface exposed portion 35e of the first base electrode layer 32a to the portion corresponding to the first main surface exposed portion 35a and the third main surface exposed portion 35b. Similarly, the second plating layer 34b is preferably provided from the portion corresponding to the second end surface exposed portion 37f of the second base electrode layer 32b to the portion corresponding to the second main surface exposed portion 37a and the fourth main surface exposed portion 37b.

[0100] The plating layer 34 includes at least one metal selected from, for example, Cu, Ni, Sn, Ag, Pd, an Ag—Pd alloy, Au, and the like.

[0101] The plating layer 34 may be formed of a single layer or a plurality of layers. When formed of a plurality of layers, for example, a two-layer structure of a Ni plating layer and a Sn plating layer is preferable.

[0102] By providing the plating layer 34 composed of a Ni plating layer as a layer directly in contact with the base electrode layer 32, it is possible to prevent the base electrode layer 32 from being corroded by the solder used for mounting when mounting the multilayer ceramic capacitor 10. In addition, by providing the plating layer 34 composed of a Sn plating layer as an upper layer of the plating layer 34 composed of a Ni plating layer, when the multilayer ceramic capacitor 10 is mounted on a mounting substrate, the wettability of the solder used for mounting can be improved, and mounting can be facilitated.

[0103] The thickness of each plating layer 34 is preferably 1 μm to 11 μm. By setting the thickness of each plating layer 34 to 1 μm, the first main surface inclined portion 35ma and the second main surface inclined portion 37ma can be formed without excessively increasing the size of the chip.

[0104] In addition, the external electrode 30 may be formed only of the plating layer 34 without providing the base electrode layer 32. That is, the multilayer ceramic capacitor 10 may also be a structure including a plating layer electrically connected to the first internal electrode layer 16a and a plating layer electrically connected to the second internal electrode layer 16b. In this case, a catalyst may be provided on the surface of the stack 12 as a pretreatment, thereby forming the external electrode 30 from the plating layer 34 alone.

[0105] When the external electrode 30 is formed by the plating layer 34 alone, it is preferred to include a lower plating electrode formed on the surface of the laminate 12 and an upper plating electrode formed on the surface of the lower plating electrode. The upper plating electrode can be formed as needed, and the external electrode 30 can also be composed of only the lower plating electrode.

[0106] The upper plated electrode and the lower plated electrode each preferably contain at least one metal selected from Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, or Zn, or an alloy containing the metal. In particular, the lower plated electrode is preferably formed using Ni having a solder resist property that suppresses corrosion caused by solder used for mounting, and the upper plated electrode is preferably formed using Sn or Au that improves wettability of solder used for mounting.

[0107] Furthermore, for example, when the first internal electrode layer 16 a and the second internal electrode layer 16 b are formed using Ni, the lower plated electrode is preferably formed using Cu having good bonding properties with Ni.

[0108] The plating layer 34 arranged without providing the base electrode layer 32 has the upper plating electrode as the outermost layer, but may be configured such that another plating electrode is further formed on the surface of the upper plating electrode.

[0109] The thickness of each plating layer 34 disposed without providing the base electrode layer 32 is preferably 2 μm or more and 11 μm or less. In addition, the plating layer 34 preferably does not contain glass. The metal ratio per unit volume of the plating layer 34 is preferably 99 volume % or more.

[0110] In the multilayer ceramic capacitor 10 according to the embodiment of the present invention, in the external electrodes 30, the first external electrode 30a has the first main surface inclined portion 35ma, and the second external electrode 30b has the second main surface inclined portion 37ma, thereby achieving the following effects. Figure 4 and as Figure 4 An enlarged view of the main part of the region R Figure 7 As shown, the ridgeline portion in the first external electrode 30a is formed by the first main surface exposed portion 35a and the first main surface inclined portion 35ma, and the first end surface exposed portion 35e and the first main surface inclined portion 35ma, respectively, and these ridgeline portions have an obtuse angle that is gentler than the approximately right angle of the ridgeline portion formed by the previous first main surface exposed portion 35a and the first end surface exposed portion 35e.

[0111] Thus, the thermal stress caused by the shrinkage of the solder applied to the first external electrode 30a is dispersed to the ridge formed by the first main surface exposed portion 35a and the first main surface inclined portion 35ma, and the ridge formed by the first end surface exposed portion 35e and the first main surface inclined portion 35ma. Furthermore, each ridge has an obtuse angle, so stress is less likely to be concentrated compared to the conventional ridge formed at a substantially right angle. As a result, stress concentration on the boundary portion between the first main surface exposed portion 35a and the first end surface exposed portion 35e can be alleviated, and crack generation in the stacked body 12 can be suppressed.

[0112] Therefore, the multilayer ceramic capacitor 10 does not need to provide a stress absorbing structure such as a conductive resin layer in the first external electrode 30 a , and can suppress the increase in the size of the component and reduce the influence of thermal stress caused by solder shrinkage.

[0113] The angle β formed by the first main surface exposed portion 35a and the first main surface inclined portion 35ma of the first external electrode 30a formed on the first main surface 12a side is defined as follows: Figure 7 As shown, the intersection of the straight lines extending parallel to the first main surface exposed portion 35a and the first end surface exposed portion 35e is set to O, the position of the ridge formed by the first main surface inclined portion 35ma and the first main surface exposed portion 35a is set to P, the position of the ridge formed by the first main surface inclined portion 35ma and the first end surface exposed portion 35e is set to Q, and the angle ∠OPQ in this case is set to ∠OPQ=α, at this time, β=180°-α.

[0114] The angle β is preferably not less than 120° and not more than 170°. When the angle β is less than 120°, the intersection angle between the first main surface inclined portion 35ma and the first main surface exposed portion 35a becomes smaller, which may impair the stress concentration reduction effect at the ridge portion formed by the first main surface inclined portion 35ma and the first main surface exposed portion 35a, or the first main surface inclined portion 35ma may intersect the stack 12 to expose its surface. When the angle β is greater than 170°, the intersection angle between the first main surface inclined portion 35ma and the first end surface exposed portion 35e becomes smaller, which may impair the stress concentration reduction effect at the ridge portion formed by the first main surface inclined portion 35ma and the first end surface exposed portion 35e, or the first main surface inclined portion 35ma may intersect the stack 12 to expose its surface.

[0115] Specifically, for example, the angle β is measured as follows. The multilayer ceramic capacitor 10 is polished along the width direction y until the W dimension becomes 1 / 2 to expose the LT cross section, and the LT cross section exposed by polishing is photographed using a microscope (VHK series manufactured by KEYENCE), and the photographed surface is observed using software attached to the microscope.

[0116] Based on observation, the following point is defined as the position P of the ridge portion formed by the first main surface inclined portion 35ma and the first main surface exposed portion 35a, that is, this point is the intersection of a straight line extending parallel to the first end surface 12e of the stack 12 when viewed from above in LT and the surface of the first main surface exposed portion 35a of the first external electrode 30a which is the farthest from the surface of the stack 12 along the height direction x, and is the point which is closest to the first end surface 12e.

[0117] In addition, the following point is defined as the position Q of the ridge portion formed by the first main surface inclined portion 35ma and the first end surface exposed portion 35e, that is, the point is the intersection of a straight line extending parallel to the first main surface 12a of the stack 12 and the surface of the first end surface exposed portion 35e which is the farthest from the surface of the stack 12 along the length direction z, and is the point which is closest to the first main surface 12a.

[0118] Furthermore, the intersection of a parallel line L1 passing through point P and extending parallel to the first main surface 12a and a parallel line L2 passing through point Q and extending parallel to the first end surface 12e is defined as the intersection O of the straight lines extending parallel to the first main surface exposed portion 35a and the first end surface exposed portion 35e.

[0119] Thus, the line connecting the point P and the point Q is viewed as the first main surface inclined portion 35ma on the LT plane, ∠OPQ is measured as the angle α as an actual measurement value, and the angle β is calculated.

[0120] In the above description, the first main surface inclined portion 35ma is a perfect plane, that is, a straight line in LT plan view, but the first main surface inclined portion 35ma may not be a perfect plane, that is, may not be a straight line in LT plan view. Figure 8 This is an example in which the first main surface inclined portion 35ma is configured as a curved surface. Figure 8 In FIG. 1 , a solid line is an example of a surface that is curved to be convex upward, and a long dashed line is an example of a surface that is curved to be convex downward.

[0121] Furthermore, in this case, the curvature radius of the first main surface inclined portion 35ma is preferably in the range of 50 μm to ∞. If the curvature radius is in this range, the first main surface inclined portion 35ma can be well formed, and the stress dispersion effect at the ridge formed by the first main surface exposed portion 35a and the first main surface inclined portion 35ma and the ridge formed by the first end surface exposed portion 35e and the first main surface inclined portion 35ma can be fully obtained.

[0122] In the above description, the points P, Q, and O used to evaluate the position, range, and angle β of the first main surface inclined portion 35ma in the first external electrode 30a are formed on the LT plane which is the same plane, and the straight lines passing through the points P, Q, and O are mutually orthogonal, but these straight lines may be observed and measured as if they are not mutually orthogonal. The same is true for the evaluation of the position, range, and angle β of the second main surface inclined portion 37ma in the second external electrode 30b.

[0123] Next, the internal structure of the first main surface inclined portion 35ma and its vicinity will be described.

[0124] The first main surface inclined portion 35ma may be as follows Figure 4 as well as Fig. 9 As shown in the figure, the surface formed on the first plating layer 34a may be as shown in the figure. Fig.10 As shown, the first main surface inclined portion 35ma is formed across the first base electrode layer 32a and the first plating layer 34a. When the first external electrode 30a is formed only of the plating layer 34, the first main surface inclined portion 35ma is formed on the plating layer 34.

[0125] In particular, by forming the first main surface inclined portion 35ma across the first base electrode layer 32a and the first plating layer 34a, cracking of the laminate 12 can be more effectively suppressed, and the influence of thermal stress due to solder shrinkage can be more effectively reduced.

[0126] In addition, although the first main surface inclined portion 35ma of the first external electrode 30a is taken as an example in the above description, Figure 1 as well as Figure 4The second main surface inclined portion 37ma of the second external electrode 30b shown in FIG. 1 also has the same structure as the first main surface inclined portion 35ma. Figures 7 to 10 In this case, the first main surface inclined portion 35ma and the second main surface inclined portion 37ma may have the same shape or different shapes.

[0127] Regarding the dimensions of the multilayer ceramic capacitor 10 of the present embodiment, the L dimension is preferably 0.1 mm or more and 6.0 mm or less. In addition, the T dimension is preferably 10 μm or more and 300 μm or less. Furthermore, when the T dimension is 10 μm or more and 300 μm or less, the effect of the structure of the main surface inclined portion and the side surface inclined portion described later can be more significantly exerted, which is preferred. The W dimension is preferably 0.1 mm or more and 6.0 mm or less.

[0128] (Variation 1 of the First Embodiment)

[0129] Next, refer to Fig.11 Another modification 1 of the multilayer ceramic capacitor 10 according to the first embodiment will be described. Fig.11 In the modification example 1 shown, in the external electrode 30, the first external electrode 30a further has a third main surface inclined portion 35mb, and the second external electrode 30b further has a fourth main surface inclined portion 37mb. The third main surface inclined portion 35mb is formed to span from the second main surface 12b of the stacked body 12 to the first end surface 12e. The fourth main surface inclined portion 37mb is formed to span from the second main surface 12b of the stacked body 12 to the second end surface 12f.

[0130] The third main surface inclined portion 35mb is a plane that is located between the third main surface exposed portion 35b and the first end surface exposed portion 35e of the first external electrode 30a and is formed to be bent relative to the third main surface exposed portion 35b and the first end surface exposed portion 35e. The third main surface inclined portion 35mb is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the third main surface inclined portion 35mb is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the third main surface inclined portion 35mb.

[0131] The fourth main surface inclined portion 37mb is a plane that is located between the fourth main surface exposed portion 37b and the second end surface exposed portion 37f of the second external electrode 30b and is formed to be bent relative to each of the fourth main surface exposed portion 37b and the second end surface exposed portion 37f. The fourth main surface inclined portion 37mb is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the fourth main surface inclined portion 37mb is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the fourth main surface inclined portion 37mb.

[0132] The structures of the third main surface inclined portion 35mb and the fourth main surface inclined portion 37mb are also similar to those of the first main surface inclined portion 35ma and the second main surface inclined portion 37ma. Figures 7 to 10 In this case, the third main surface inclined portion 35mb and the fourth main surface inclined portion 37mb may have the same shape or different shapes.

[0133] According to this modification 1, the thermal stress caused by the solder shrinkage applied to the first external electrode 30a is more concentrated on the third main surface inclined portion 35mb than on the first end surface exposed portion 35e and the third main surface exposed portion 35b. As a result, the stress concentration on the joint between the first external electrode 30a and the stacked body 12 in the first main surface exposed portion 35a can be alleviated, and the occurrence of cracks in the stacked body 12 can be suppressed.

[0134] Similarly, the thermal stress caused by the solder shrinkage applied to the second external electrode 30b is more concentrated on the fourth main surface inclined portion 37mb than on the first end surface exposed portion 35e and the fourth main surface exposed portion 37b. As a result, the stress concentration on the joint between the second external electrode 30b and the laminate 12 in the first main surface exposed portion 35a can be alleviated, and the occurrence of cracks in the laminate 12 can be suppressed.

[0135] Therefore, the multilayer ceramic capacitor 10 does not need to provide a stress absorbing structure such as a conductive resin layer in the external electrode 30 , and can suppress the increase in the size of the component and reduce the influence of thermal stress caused by solder shrinkage.

[0136] (Variation 2 of the first embodiment)

[0137] Next, refer to Fig.12 as well as Fig.13 Modification 2 of the multilayer ceramic capacitor 10 of the present embodiment will be described. Fig.12 as well as Fig.13 In the shown variant example 2, the first external electrode 30a of the external electrode 30 also has a first side inclined portion 35mac formed to extend from the first main surface 12a of the stack 12 to the first side surface 12c, and a second side inclined portion 35mad formed to extend from the first main surface 12a of the stack 12 to the second side surface 12d.

[0138] The first side inclined portion 35mac is a plane located at an edge along the length direction z on the first side surface 12c side of the stacked body 12 of the first main surface exposed portion 35a of the first external electrode 30a, and is formed to be bent relative to the first main surface exposed portion 35a. The first side inclined portion 35mac is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the first side inclined portion 35mac is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the first side inclined portion 35mac.

[0139] The second side inclined portion 35mad is a plane located at an edge along the length direction z on the second side 12d side of the stacked body 12 of the first main surface exposed portion 35a of the first external electrode 30a, and is formed to be bent relative to the first main surface exposed portion 35a. The second side inclined portion 35mad is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the second side inclined portion 35mad is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the second side inclined portion 35mad.

[0140] The structures of the first side inclined portion 35mac and the second side inclined portion 35mad are also similar to those of the first main surface inclined portion 35ma and the second main surface inclined portion 37ma. Figures 7 to 10 Various descriptions referred to by replacing the WT plane are directly applicable. Therefore, the angle formed by the first main surface exposed portion 35a and the first side inclined portion 35mac of the first external electrode 30a formed on the first main surface side is preferably greater than 120° and less than 170° in a WT top view. Similarly, the angle formed by the first main surface exposed portion 35a and the second side inclined portion 35mad is preferably greater than 120° and less than 170° in a WT top view.

[0141] Similarly, the second external electrode 30b of the external electrode 30 also has a fifth side inclined portion 37mac formed to extend from the first main surface 12a of the stack 12 to the first side surface 12c, and a sixth side inclined portion 37mad formed to extend from the first main surface 12a of the stack 12 to the second side surface 12d.

[0142] The fifth side inclined portion 37mac is a plane located at the edge of the second main surface exposed portion 37a of the second external electrode 30b on the first side surface 12c side of the stacked body 12 along the longitudinal direction z, and is formed to be bent relative to the second main surface exposed portion 37a. The fifth side inclined portion 37mac is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the fifth side inclined portion 37mac is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the fifth side inclined portion 37mac.

[0143] The sixth side inclined portion 37mad is a plane located at the edge of the second main surface exposed portion 37a of the second external electrode 30b on the second side surface 12d side of the stacked body 12 along the longitudinal direction z, and is formed to be bent relative to the second main surface exposed portion 37a. The sixth side inclined portion 37mad is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the sixth side inclined portion 37mad is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the second side inclined portion 35mad.

[0144] The structures of the fifth side inclined portion 37mac and the sixth side inclined portion 37mad are also similar to those of the first main surface inclined portion 35ma and the second main surface inclined portion 37ma. Figures 7 to 10 Various descriptions referred to by replacing the WT plane are directly applicable. Therefore, the angle formed by the first main surface exposed portion 35a of the first external electrode 30a formed on the first main surface side and the fifth side inclined portion 37mac is preferably 120° or more and 170° or less in a WT top view. Similarly, the angle formed by the first main surface exposed portion 35a and the sixth side inclined portion 37mad is preferably 120° or more and 170° or less in a WT top view.

[0145] Furthermore, in variant example 2, the first external electrode 30a of the external electrode 30 also has a third side inclined portion 35mbc formed to extend from the second main surface 12b of the stack 12 to the first side surface 12c, and a fourth side inclined portion 35mbd formed to extend from the first main surface 12a of the stack 12 to the second side surface 12d.

[0146] The third side inclined portion 35mbc is a plane located at an edge along the length direction z of the third main surface exposed portion 35b of the first external electrode 30a on the first side surface 12c side of the stacked body 12, and is formed to be bent relative to the third main surface exposed portion 35b. The third side inclined portion 35mbc is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the third side inclined portion 35mbc is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the third side inclined portion 35mbc.

[0147] The fourth side inclined portion 35mbd is a plane formed at an edge along the length direction z of the third main surface exposed portion 35b of the first external electrode 30a on the second side surface 12d side of the laminate 12. The fourth side inclined portion 35mbd is preferably formed so as to cover the ridgeline of the laminate 12. That is, the second side inclined portion 35mad is preferably formed so as not to intersect the laminate 12 and so as not to expose the surface of the laminate 12 on the fourth side inclined portion 35mbd.

[0148] The structures of the third side inclined portion 35mbc and the fourth side inclined portion 35mbd are similar to those of the first main surface inclined portion 35ma and the second main surface inclined portion 37ma. Figure 7 as well as Figure 8 Various descriptions referred to by replacing the WT plane are directly applicable. Therefore, the angle formed by the third main surface exposed portion 35b and the third side inclined portion 35mbc of the first external electrode 30a formed on the second main surface side is preferably 120° or more and 170° or less in a WT top view. Similarly, the angle formed by the third main surface exposed portion 35b and the fourth side inclined portion 35mbd is preferably 120° or more and 170° or less in a WT top view.

[0149] Similarly, the second external electrode 30b of the external electrode 30 further includes a seventh side inclined portion 37mbc formed to extend from the second main surface 12b of the stacked body 12 to the first side surface 12c, and an eighth side inclined portion 37mbd formed to extend from the second main surface 12b of the stacked body 12 to the second side surface 12d.

[0150] The seventh side inclined portion 37mbc is a plane formed at an edge along the length direction z of the fourth main surface exposed portion 37b of the second external electrode 30b on the first side surface 12c side of the laminate 12. The seventh side inclined portion 37mbc is preferably formed so as to cover the ridgeline portion of the laminate 12. That is, the seventh side inclined portion 37mbc is preferably formed so as not to intersect the laminate 12 and so as not to expose the surface of the laminate 12 on the seventh side inclined portion 37mbc.

[0151] The eighth side inclined portion 37mbd is a plane formed at an edge along the longitudinal direction z of the fourth main surface exposed portion 37b of the second external electrode 30b on the second side surface 12d side of the laminate 12. The eighth side inclined portion 37mbd is preferably formed so as to cover the ridgeline portion of the laminate 12. That is, the eighth side inclined portion 37mbd is preferably formed so as not to intersect the laminate 12 and so as not to expose the surface of the laminate 12 on the eighth side inclined portion 37mbd.

[0152] The structures of the seventh side inclined portion 37mbc and the eighth side inclined portion 37mbd are similar to those of the first main surface inclined portion 35ma and the second main surface inclined portion 37ma. Figure 7 as well as Figure 8Various descriptions referred to by replacing the WT plane are directly applicable. Therefore, the angle formed by the fourth main surface exposed portion 37b and the seventh side inclined portion 37mbc of the second external electrode 30b formed on the second main surface side is preferably 120° or more and 170° or less in a WT plan view. Similarly, the angle formed by the fourth main surface exposed portion 37b and the eighth side inclined portion 37mbd is preferably 120° or more and 170° or less in a WT plan view.

[0153] According to this modification 2, the thermal stress caused by the shrinkage of the solder applied to the first external electrode 30a is concentrated on the first side inclined portion 35mac, the second side inclined portion 35mad, the third side inclined portion 35mbc, and the fourth side inclined portion 35mbd in addition to the first main surface inclined portion 35ma and the third main surface inclined portion 35mb. As a result, the stress concentration on the joint between the first external electrode 30a and the laminated body 12 in the first main surface exposed portion 35a and the third main surface exposed portion 35b can be further alleviated, and the occurrence of cracks in the laminated body 12 can be more effectively suppressed.

[0154] Similarly, the thermal stress caused by the solder shrinkage applied to the second external electrode 30b is concentrated on the fifth side inclined portion 37mac, the sixth side inclined portion 37mad, the seventh side inclined portion 37mbc, and the eighth side inclined portion 37mbd in addition to the second main surface inclined portion 37ma and the fourth main surface inclined portion 37mb. As a result, the stress concentration on the joint between the second external electrode 30b and the laminate 12 in the second main surface exposed portion 37a and the fourth main surface exposed portion 37b can be further alleviated, and the occurrence of cracks in the laminate 12 can be more effectively suppressed.

[0155] Therefore, the multilayer ceramic capacitor 10 does not need to provide a stress absorbing structure such as a conductive resin layer in the external electrode 30 , and can further suppress the increase in the size of the component and further reduce the influence of thermal stress caused by solder shrinkage.

[0156] In addition, the first side inclined portion 35mac, the second side inclined portion 35mad, the third side inclined portion 35mbc, and the fourth side inclined portion 35mbd may all have the same shape or may have shapes different from each other. Similarly, the fifth side inclined portion 37mac, the sixth side inclined portion 37mad, the seventh side inclined portion 37mbc, and the eighth side inclined portion 37mbd may all have the same shape or may have shapes different from each other.

[0157] In this modification 2, the thickness of each layer of the plating layer 34 is also preferably not less than 1 μm and not more than 11 μm. By setting the thickness of each layer of the plating layer 34 to not less than 1 μm and not more than 11 μm, the first side inclined portion 35mac, the second side inclined portion 35mad, the third side inclined portion 35mbc, and the fourth side inclined portion 35mbd of the first external electrode 30a and the fifth side inclined portion 37mac, the sixth side inclined portion 37mad, the seventh side inclined portion 37mbc, and the eighth side inclined portion 37mbd of the second external electrode 30b can be formed without excessively increasing the size of the small piece.

[0158] In addition, the first side inclined portion 35mac, the second side inclined portion 35mad, the third side inclined portion 35mbc and the fourth side inclined portion 35mbd of the first external electrode 30a, and the fifth side inclined portion 37mac, the sixth side inclined portion 37mad, the seventh side inclined portion 37mbc and the eighth side inclined portion 37mbd of the second external electrode 30b can each be connected to Fig. 9 The first main surface inclined portion 35ma shown in the figure is similarly constituted as a surface formed on the first plating layer 34a, and may also be similar to the first main surface inclined portion 35ma shown in the figure. Fig.10 The first main surface inclined portion 35ma shown is similarly configured as a surface formed across two layers, namely, the first foundation electrode layer 32a and the first plating layer 34a.

[0159] In addition, when the first external electrode 30a and the second external electrode 30b are formed only by the plating layer 34, each of the above-mentioned side inclined portions becomes a surface formed on the plating layer 34. In particular, each of the above-mentioned side inclined portions is formed by straddling the first base electrode layer 32a and the first plating layer 34a, thereby being able to more effectively suppress the occurrence of cracks in the laminate 12 and more effectively reduce the influence of thermal stress caused by solder shrinkage.

[0160] 2. Manufacturing method of multilayer ceramic capacitor

[0161] As a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention, the method for manufacturing a multilayer ceramic capacitor according to the above-described embodiment will be described.

[0162] (Prepare)

[0163] First, a dielectric sheet for the ceramic layer 14 and a conductive paste for the internal electrode layer 16 are prepared. In addition, as for the dielectric sheet, a dielectric sheet with a first internal electrode layer 16a, a dielectric sheet with a second internal electrode layer 16b, and a dielectric sheet without an internal electrode layer 16 are prepared. The dielectric sheet and the conductive paste contain a binder and a solvent, respectively. The binder and the solvent can use a known binder and solvent. The conductive paste is a paste containing a conductive material, for example, a paste in which an organic binder and an organic solvent are added to metal powder.

[0164] (Production of laminated sheets)

[0165] Next, a conductive paste is printed on the dielectric sheet into an internal electrode pattern of a given shape corresponding to each shape of the internal electrode layer 16 by a method such as screen printing, gravure printing, or printing using an inkjet printer. Thus, a conductive paste is applied to a portion of the dielectric sheet that is to be configured as the first internal electrode layer 16a, forming a conductive paste layer. Hereinafter, such a dielectric sheet is referred to as a first coated dielectric sheet. In addition, a conductive paste is applied to a portion of the dielectric sheet that is to be configured as the second internal electrode layer 16b, forming a conductive paste layer. Hereinafter, such a dielectric sheet is referred to as a second coated dielectric sheet. In addition, regarding the dielectric sheet, a dielectric sheet for an outer layer that does not have an internal electrode pattern is also produced.

[0166] The laminated sheet is produced using the dielectric sheets prepared as described above. That is, a predetermined number of dielectric sheets for outer layers without internal electrode patterns are stacked, and the first coated dielectric sheets and the second coated dielectric sheets are stacked alternately or in a desired arrangement order on the outer layers. Furthermore, a predetermined number of dielectric sheets for outer layers without internal electrode patterns are stacked on the outer layers to produce the laminated sheet. In addition, the order of producing the laminated products is not limited to the above, and may be carried out in any order or simultaneously in parallel.

[0167] (Fabrication of stacked blocks)

[0168] Next, the laminated sheets are pressed in the lamination direction of the dielectric sheets by isostatic pressing or the like, thereby producing a laminated block.

[0169] (Preparation of laminated sheets)

[0170] The stacked block is cut into a given size to obtain a plurality of stacked small pieces. At this time, the corners and ridges of the stacked small pieces may be rounded by barrel grinding or the like.

[0171] (Production of laminated body)

[0172] The stacked small sheets are fired to produce the stacked body 12. The firing temperature depends on the material of the dielectric sheet and the material of the internal electrode layer 16, but is preferably 900°C or higher and 1400°C or lower.

[0173] (Formation of external electrodes)

[0174] (When the base electrode layer is a sintered layer)

[0175] The case where the base electrode layer 32 is formed by a sintered layer will be described. When forming the sintered layer, a conductive paste containing a glass component and a metal is prepared and applied. Then, a sintering process is performed to form the base electrode layer 32.

[0176] Specifically, conductive paste corresponding to the first end face exposed portion 35e and the second end face exposed portion 37f is respectively applied and sintered on the first end face 12e and the second end face 12f of the stack 12 to form the first base electrode layer 32a of the first external electrode 30a and the second base electrode layer 32b of the second external electrode 30b.

[0177] Here, as a method for applying the conductive paste, for example, a method such as dipping or screen printing is used. In addition, the temperature of the calcination treatment is preferably 700° C. or higher and 900° C. or lower.

[0178] (When the base electrode layer is a thin film layer)

[0179] The case where the base electrode layer 32 is formed by a thin film layer is described. When forming a thin film layer, a mask or the like is provided to cover a portion other than a desired portion where the external electrode 30 is to be formed, and a thin film forming method such as sputtering or evaporation is performed on the exposed desired portion. The base electrode layer 32 formed by a thin film layer is set to be a layer of 1 μm or less in which metal particles are deposited.

[0180] (When the base electrode layer is a plating layer)

[0181] The case where the base electrode layer 32 is formed by the plating layer is described. The first end face 12e and the second end face 12f of the stacked body 12 are respectively subjected to plating treatment, and a base plating film as the first end face exposed portion 35e and the second end face exposed portion 37f is formed on the portion of the internal electrode layer 16 exposed to the outside. When performing the plating treatment, either electrolytic plating or electroless plating can be used, but electroless plating requires pretreatment using a catalyst or the like in order to increase the deposition speed of the plating layer, which has the disadvantage of complicating the process. Therefore, it is usually preferred to use electrolytic plating. As a specific example of the plating treatment, drum plating is preferably used.

[0182] As needed, when the base electrode layer 32 is set to a structure including a lower plated electrode formed on the surface of the stack 12 and an upper plated electrode formed on the surface of the lower plated electrode, the above-mentioned base plated film is set as the lower plated electrode, and the upper plated electrode formed on the surface of the lower plated electrode is formed by a plating treatment similar to the above-mentioned plating treatment.

[0183] (Production of plating layer)

[0184] The plating layer 34 is formed. In addition, the plating layer 34 may be formed on the surface of each of the first base electrode layer 32a and the second base electrode layer 32b, or may be directly formed on the laminate 12. In the present embodiment, the plating layer 34 is formed along the surface shape of each of the first base electrode layer 32a and the second base electrode layer 32b as a sintered layer. More specifically, a Ni plating layer is formed on the first base electrode layer 32a and the second base electrode layer 32b as the first plating layer 34a and the second plating layer 34b, and a Sn plating layer is further formed on the surface thereof.

[0185] In addition, when the plating layer 34 is directly formed on the laminate 12, it can be formed by the following method. That is, the first end face 12e and the second end face 12f of the laminate 12 are plated to form a base plating film on the portion of the internal electrode layer 16 exposed to the outside. When the plating process is performed, either electrolytic plating or electroless plating can be used, but electroless plating requires pretreatment using a catalyst or the like in order to increase the deposition speed of the plating layer, which has the disadvantage of complicating the process. Therefore, it is usually preferred to use electrolytic plating.

[0186] When performing the plating treatment, a barrel plating method can be utilized.

[0187] (Formation of inclined portion)

[0188] The inclined portions to be the first main surface inclined portion 35ma and the second main surface inclined portion 37ma are formed when forming the external electrode 30. The inclined portions may be formed after the first base electrode layer 32a and the second base electrode layer 32b of the external electrode 30 are formed and before the first plating layer 34a and the second plating layer 34b are formed, or may be formed after the first plating layer 34a and the second plating layer 34b are formed.

[0189] As for a specific method of forming the inclined portion, laser processing or sandblasting is preferably used.

[0190] In addition, although the formation of the first main surface inclined portion 35ma of the first external electrode 30a is taken as an example in the following description, the third main surface inclined portion 35mb, the first side surface inclined portion 35mac, the second side surface inclined portion 35mad, the third side surface inclined portion 35mbc, and the fourth side surface inclined portion 35mbd of the first external electrode 30a are formed in the same manner. In addition, the second main surface inclined portion 37ma, the fourth main surface inclined portion 37mb, the fifth side surface inclined portion 37mac, the sixth side surface inclined portion 37mad, the seventh side surface inclined portion 37mbc, and the eighth side surface inclined portion 37mbd of the second external electrode 30b are formed in the same manner.

[0191] (Laser Processing)

[0192] First, a method of forming the inclined portion by laser processing will be described.

[0193] like Fig.14 As shown, the small piece 101 is positioned and fixed on the small piece mounting table 40. The small piece 101 is a semi-finished product of the multilayer ceramic capacitor 10 in which the first external electrode 30a and the second external electrode 30b are formed on the laminated body 12 after firing.

[0194] The laser processing machine 50 irradiates the ridgeline Rd extending in the width direction y formed by the first main surface exposed portion 35a and the first end surface exposed portion 35e of the first external electrode 30a of the small piece 101 with laser LB. Specifically, the laser LB is set as the target angle on the LT plane to an angle α as a depression angle from the LW plane toward the bottom along the height direction x, and scans along the width direction y to remove the ridgeline Rd, thereby performing chamfering. In addition, Fig.14 In FIG. 1 , the cut surface Cf of the first external electrode 30 a shows the irradiation position of the laser beam LB on the ridge portion Rd. The cut surface Cf is set so as not to intersect the laminate 12 .

[0195] Thus, an inclined portion is formed between the first main surface exposed portion 35 a and the first end surface exposed portion 35 e .

[0196] (Sandblasting)

[0197] Next, a method of forming the inclined portion by sandblasting will be described.

[0198] like Fig.15 As shown, a single or a plurality of small pieces 101 are positioned and fixed on a small piece support 60. The small piece support 60 is tilted so as to have an elevation angle directed upward along the height direction x corresponding to the angle α as the target angle of the small piece 101 on the LT plane. Thus, the cut surface Cf of the first external electrode 30a is parallel to the LW plane.

[0199] Furthermore, the surface of the fixed small piece 101 is covered by the mask 70. The mask 70 has a slit 70x having a position and shape corresponding to the position and shape of the inclined portion, and the small piece 101 covered by the mask 70 is placed in a state where only the ridgeline portion Rd of the first external electrode 30a is exposed through the slit 70x when viewed in the longitudinal direction z.

[0200] For such a small piece 101, the projection material SB is projected onto the mask 70 in a direction parallel to the LW plane to remove the ridgeline portion Rd of the first external electrode 30a exposed from the slit 70x, thereby chamfering. In addition, the opening size of the slit 70x is set to correspond to the position of the cut surface Cf of the ridgeline portion Rd and the cut surface Cf does not intersect the stacked body 12.

[0201] Thus, an inclined portion is formed between the first main surface exposed portion 35 a and the first end surface exposed portion 35 e .

[0202] When the first main surface exposed portion 35a and the first end surface exposed portion 35e before the inclined portion is formed are formed by the first foundation electrode layer 32a and the second foundation electrode layer 32b, the inclined portion is also formed as the foundation electrode layer 32. The above-mentioned plating layer 34 is formed on these foundation electrode layers 32, thereby obtaining Fig.16 The first external electrode 30a having the first main surface inclined portion 35ma is shown. In this case, the first main surface inclined portion 35ma, the ridge portion formed by the first main surface inclined portion 35ma and the first main surface exposed portion 35a, and the ridge portion formed by the first main surface inclined portion 35ma and the first end surface exposed portion 35e are each formed with a gentle rounded corner accompanying the formation of the first plating layer 34a.

[0203] On the other hand, when the first main surface exposed portion 35a and the first end surface exposed portion 35e before the inclined portion is formed by laminating the first base electrode layer 32a and the second base electrode layer 32b and the first plating layer 34a and the second plating layer 34b, the inclined portion is also formed by laminating these layers. Specifically, when only the first plating layer 34a and the second plating layer 34b are removed as the ridgeline portion Rd, as shown in FIG. Fig. 9 As shown, the surface of the first main surface inclined portion 35ma is formed by the first plating layer 34a and the second plating layer 34b, respectively.

[0204] In addition, when the first foundation electrode layer 32a and the second foundation electrode layer 32b and the first plating layer 34a and the second plating layer 34b are removed as the ridge portion Rd, Fig.10 The surface of the illustrated first main surface inclined portion 35 ma is formed by the first and second foundation electrode layers 32 a and 32 b and the first and second plating layers 34 a and 34 b , respectively.

[0205] In these cases, the first main surface inclined portion 35ma is formed into a roughly planar shape, and the ridge portion formed by the first main surface inclined portion 35ma and the first main surface exposed portion 35a and the ridge portion formed by the first main surface inclined portion 35ma and the first end surface exposed portion 35e are respectively formed with edges accompanied by laser processing or sand blasting.

[0206] In this manner, the multilayer ceramic capacitor 10 according to the embodiment of the present invention can be obtained.

[0207] B. Second Embodiment

[0208] 1. Multilayer ceramic capacitors

[0209] A multilayer ceramic capacitor 110 is described as an example of a multilayer ceramic electronic component according to a second embodiment of the present invention. Fig.17 It is a perspective view showing the appearance of a multilayer ceramic capacitor according to a second embodiment of the present invention. Fig.18 yes Fig.17 A cross-sectional view taken along line XVIII-XVIII. Regarding the multilayer ceramic capacitor 110 , components corresponding to those of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0210] The multilayer ceramic capacitor 110 includes a multilayer body 12 and an external electrode 130. Hereinafter, each structure will be described in the order of the multilayer body 12 and the external electrode 130.

[0211] (Laminated body)

[0212] The laminated body 12 includes a plurality of laminated ceramic layers 14 and a plurality of internal electrode layers 16. The structure of the laminated body 12 is the same as that of the laminated ceramic capacitor 10 according to the first embodiment, and thus the description thereof will be omitted.

[0213] The material, thickness, number of laminated sheets, etc. of the ceramic layer 14 are the same as those of the multilayer ceramic capacitor 10 according to the first embodiment, and thus description thereof will be omitted.

[0214] The size of the laminate 12 is not particularly limited.

[0215] The internal electrode layer 16 includes a first internal electrode layer 16 a and a second internal electrode layer 16 b .

[0216] The first internal electrode layer 16a includes a first opposing electrode portion 26a opposed to the second internal electrode layer 16b, and a first lead electrode portion 28a located at one end of the first internal electrode layer 16a and extending from the first opposing electrode portion 26a to the first end surface 12e of the stacked body 12. An end of the first lead electrode portion 28a is led out to the first end surface 12e and exposed.

[0217] The second internal electrode layer 16b includes a second opposing electrode portion 26b opposed to the first internal electrode layer 16a, and a second lead electrode portion 28b located at one end of the second internal electrode layer 16b and extending from the second opposing electrode portion 26b to the second end surface 12f of the laminate 12. The end of the second lead electrode portion 28b is led out to the second end surface 12f and exposed.

[0218] The material, thickness, number of layers stacked, etc. of the first internal electrode layers 16 a and the second internal electrode layers 16 b are the same as those of the multilayer ceramic capacitor 10 according to the first embodiment, and thus description thereof will be omitted.

[0219] External electrodes 130 are arranged on the first end surface 12 e side and the second end surface 12 f side of the stacked body 12 .

[0220] The external electrode 130 includes a base electrode layer 132 and an end surface plating layer 133 disposed on the first end surface 12e and the second end surface 12f. Furthermore, the external electrode 130 includes a plating layer 134 covering the base electrode layer 132 and the end surface plating layer 133.

[0221] The external electrode 130 includes a first external electrode 130 a and a second external electrode 130 b .

[0222] The first external electrode 130a is electrically connected to the first internal electrode layer 16a, and is arranged on the surface of the first end surface 12e of the stack 12, a part of the first main surface 12a, and a part of the second main surface 12b. More specifically, the first external electrode 130a has a first end surface exposed portion 135e arranged on the surface of the first end surface 12e of the stack 12. The first external electrode 130a preferably further has a first main surface exposed portion 135a extending from the first end surface 12e along the contour of the stack 12 via a first main surface inclined portion 135ma described later and covering a part of the first main surface 12a, and a third main surface exposed portion 135b extending from the first end surface 12e along the contour of the stack 12 and covering a part of the second main surface 12b. In addition, the first external electrode 130a may not be arranged on a part of the first side surface 12c and a part of the second side surface 12d, but may be arranged on a part of the first side surface 12c and a part of the second side surface 12d.

[0223] The second external electrode 130b is electrically connected to the second internal electrode layer 16b, and is disposed only on the surface of the second end surface 12f, a portion of the first main surface 12a, and a portion of the second main surface 12b of the stack 12. More specifically, the second external electrode 130b has a second end surface exposed portion 137f disposed on the surface of the second end surface 12f of the stack 12. The second external electrode 130b preferably further has a second main surface exposed portion 137a extending from the second end surface 12f along the contour of the stack 12 via a second main surface inclined portion 137ma described later and covering a portion of the first main surface 12a, and a fourth main surface exposed portion 137b extending from the second end surface 12f along the contour of the stack 12 and covering a portion of the second main surface 12b. In addition, the second external electrode 130b may be arranged on a part of the first side surface 12c and a part of the second side surface 12d instead of being arranged on a part of the first side surface 12c and a part of the second side surface 12d.

[0224] In the laminate 12, the first opposing electrode portion 26a of the first internal electrode layer 16a and the second opposing electrode portion 26b of the second internal electrode layer 16b are opposed to each other via the ceramic layer 14, thereby forming an electrostatic capacitor. Therefore, an electrostatic capacitor can be obtained between the first external electrode 130a connected to the first internal electrode layer 16a and the second external electrode 130b connected to the second internal electrode layer 16b, showing the characteristics of a capacitor.

[0225] Furthermore, the first external electrode 130 a of the external electrode 130 has a first main surface inclined portion 135 ma formed to extend from the first main surface 12 a to the first end surface 12 e of the stacked body 12 .

[0226] The first main surface inclined portion 135ma is a plane that is located between the first main surface exposed portion 135a and the first end surface exposed portion 135e of the first external electrode 130a and is formed to be bent relative to each of the first main surface exposed portion 135a and the first end surface exposed portion 135e. The first main surface inclined portion 135ma is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the first main surface inclined portion 135ma is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the first main surface inclined portion 135ma.

[0227] Similarly, the second external electrode 130 b of the external electrode 130 has a second main surface inclined portion 137 ma formed to extend from the first main surface 12 a to the second end surface 12 f of the laminate 12 .

[0228] The second main surface inclined portion 137ma is a plane that is located between the second main surface exposed portion 137a and the second end surface exposed portion 137f of the second external electrode 130b and is formed to be bent relative to each of the second main surface exposed portion 137a and the second end surface exposed portion 137f. The second main surface inclined portion 137ma is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the second main surface inclined portion 137ma is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the second main surface inclined portion 137ma.

[0229] Next, the internal structure of the external electrode 130 will be described.

[0230] The base electrode layer 132 includes a first base electrode layer 132a1, a second base electrode layer 132b1, a third base electrode layer 132a2, and a fourth base electrode layer 132b2. In order to further improve performance, the first base electrode layer 132a1, the second base electrode layer 132b1, the third base electrode layer 132a2, and the fourth base electrode layer 132b2 are formed of a thin film layer including a plurality of thin film electrodes.

[0231] The first foundation electrode layer 132a1 is arranged to cover a portion of the first principal surface 12a on the first end surface 12e side of the stacked body 12. The second foundation electrode layer 132b1 is arranged to cover a portion of the first principal surface 12a on the second end surface 12f side of the stacked body 12.

[0232] The third foundation electrode layer 132a2 is arranged to cover a portion of the second main surface 12b on the first end surface 12e side of the stacked body 12. The fourth foundation electrode layer 132b2 is formed to cover a portion of the second main surface 12b on the second end surface 12f side of the stacked body 12.

[0233] The base electrode layer 132 formed of a thin film layer is preferably formed by a thin film forming method such as sputtering or evaporation. In particular, the base electrode layer 132 formed of a thin film layer is preferably a sputtering electrode formed by sputtering. The electrode formed by sputtering is described below.

[0234] When the base electrode layer 132 is formed by a sputtering electrode, it is preferable to directly form the sputtering electrode on a part of the first main surface 12 a and a part of the second main surface 12 b of the stacked body 12 .

[0235] The base electrode layer 132 formed by the sputtering electrode includes at least one selected from Ni, Cr, Cu, and the like.

[0236] The thickness of the sputtering electrode in the height direction x connecting the first main surface 12 a and the second main surface 12 b is preferably 50 nm to 400 nm, and more preferably 50 nm to 130 nm.

[0237] The end face plating layer 133 includes a first end face plating layer 133 a and a second end face plating layer 133 b .

[0238] The first end surface plating layer 133a is arranged on the first end surface 12e so as to cover a region including the first lead electrode portion 28a of the first internal electrode layer 16a exposed at the first end surface 12e, the first foundation electrode layer 132a1, and the third foundation electrode layer 132a2.

[0239] The second end surface plating layer 133b is arranged on the second end surface 12f so as to cover a region including the second lead electrode portion 28b of the second internal electrode layer 16b exposed at the second end surface 12f, the second foundation electrode layer 132b1, and the fourth foundation electrode layer 132b2.

[0240] In addition, when a sputtering electrode is directly formed on a portion of the first main surface 12a and a portion of the second main surface 12b of the stack 12 to configure a base electrode layer 132 and an end face plating layer 133 is configured on the first end face 12e and the second end face 12f, it is preferred to directly form the first plating layer 134a and the second plating layer 134b described later as the plating layer 134.

[0241] The plating layer 134 includes a first plating layer 134a and a second plating layer 134b. The structure of the plating layer 134 is the same as that of the multilayer ceramic capacitor 10 according to the first embodiment, and thus the description thereof is omitted.

[0242] In addition, the structure of the external electrode 30 described in Modification 1 and Modification 2 of the first embodiment can be applied to the external electrode 130 of the multilayer ceramic capacitor 110 according to the second embodiment.

[0243] The multilayer ceramic capacitor 110 can achieve the same effects as those of the multilayer ceramic capacitor 10 according to the first embodiment.

[0244] 2. Manufacturing method of multilayer ceramic capacitor

[0245] The method for manufacturing the laminated body 12 is the same as the method for manufacturing the laminated ceramic capacitor according to the first embodiment, and thus the description thereof is omitted. Next, a method for manufacturing the external electrode 130 of the laminated ceramic capacitor 110 will be described.

[0246] A first base electrode layer 132a1 and a second base electrode layer 132b1 composed of a thin film layer are formed as base electrode layers 132 on a portion of the first main surface 12a of the stack 12. In addition, a third base electrode layer 132a2 and a fourth base electrode layer 132b2 composed of a thin film layer are formed as base electrode layers 132 on a portion of the second main surface 12b of the stack 12. The thin film layer can be formed by sputtering, for example, from a portion of the first main surface 12a and the second main surface 12b. At this time, depending on the range and conditions of the sputtering method, it can be set not only on a portion of the first main surface 12a and the second main surface 12b, but also on the corners and ridges of the stack 12, the first end surface 12e, and the second end surface 12f.

[0247] The sputtering electrode can be formed of a metal including at least one selected from Ni, Cr, Cu, Ti, and the like.

[0248] In addition, the plating layer formed after forming the base electrode layer 132 is formed as follows.

[0249] On the first end face 12 e and the second end face 12 f of the laminate 12 , the first end face plating layer 133 a and the second end face plating layer 133 b are formed so as to cover the region where the internal electrode layer 16 is exposed and the base electrode layer 132 .

[0250] The first end surface plating layer 133 a and the second end surface plating layer 133 b are formed as Ni plating layers.

[0251] The Ni plating layer is formed by, for example, electric plating using an electric plating solution to which a citric acid-based additive is added or electroless plating utilizing a substitution reaction.

[0252] The desired thickness and metal particle size of the Ni plating layer can be achieved by changing the plating conditions (i.e., conditions such as plating solution temperature, plating solution ion concentration, and current density in the case of electric field plating) when forming the Ni plating layer and performing a heat treatment after the Ni plating layer is formed. In addition, regarding the conditions of the heat treatment, it is preferred to apply the heat treatment at a temperature range of 300° C. to 900° C. for a time of 0.5 to 12 hours.

[0253] Furthermore, Sn plating layers are formed on the Ni plating layer and the first end face 12e where no Ni plating layer is provided, and on the second end face 12f as the first plating layer 134a and the second plating layer 134b. Here, the Sn plating layer is formed by, for example, electric field plating using an electric field plating solution to which a citric acid-based additive is added or electroless plating using a substitution reaction.

[0254] The desired thickness and metal particle size of the Sn plating layer can be achieved by changing the plating conditions when forming the Sn plating layer (i.e., conditions such as the plating solution temperature, the plating solution ion concentration, and conditions such as the current density in the case of electric field plating) and performing a heat treatment after the Sn plating layer is formed.

[0255] The Sn plating layer may be a plating layer including at least one selected from Cu, Ni, Sn, Ag, Pd, Ag-Pd alloy, Au, and the like and formed of a single layer or a plurality of layers.

[0256] Next, when forming the external electrode 130 , inclined portions to be the first main surface inclined portion 135 ma and the second main surface inclined portion 137 ma are formed.

[0257] As a method for forming the inclined portion, it is preferable to use the forming method using laser processing or sandblasting described in the method for manufacturing the multilayer ceramic capacitor in the first embodiment.

[0258] C. Third Embodiment

[0259] 1. Multilayer ceramic capacitors

[0260] A multilayer ceramic capacitor according to an embodiment of the present invention will be described.

[0261] Specifically, the multilayer ceramic capacitor 210 of this embodiment is as follows Figures 1 to 3 The illustrated thin multilayer ceramic capacitor 210 has a T dimension that is small relative to its W dimension.

[0262] A multilayer ceramic capacitor 210 according to a third embodiment of the present invention will be described. Fig.19 It is a perspective view showing the appearance of a multilayer ceramic capacitor according to a third embodiment of the present invention. Fig. 20 yes Fig.19 This is a cross-sectional view taken along the line XX-XX. Regarding the multilayer ceramic capacitor 210 , components corresponding to those of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0263] The multilayer ceramic capacitor 210 includes a multilayer body 12 and an external electrode 230 .

[0264] (Laminated body)

[0265] The laminated body 12 includes a plurality of laminated ceramic layers 14 and a plurality of internal electrode layers 16 .

[0266] The material, thickness, number of laminated sheets, etc. of the ceramic layer 14 are the same as those of the multilayer ceramic capacitor 10 according to the first embodiment, and thus description thereof will be omitted.

[0267] The size of the laminate 12 is not particularly limited.

[0268] The internal electrode layer 16 includes a first internal electrode layer 16 a and a plurality of second internal electrode layers 16 b .

[0269] The first internal electrode layer 16a includes a first opposing electrode portion 26a13 opposing the second internal electrode layer 16b, and a first lead electrode portion 28a located at one end of the first internal electrode layer 16a and extending from the first opposing electrode portion 26a to the first end surface 12e of the laminate 12. An end of the first lead electrode portion 28a is led out to the first end surface 12e and exposed.

[0270] The second internal electrode layer 16b includes a second opposing electrode portion 26b opposed to the first internal electrode layer 16a, and a second lead electrode portion 28b located at one end of the second internal electrode layer 16b and extending from the second opposing electrode portion 26b to the second end surface 12f of the laminate 12. The end of the second lead electrode portion 28b is led out to the second end surface 12f and exposed.

[0271] The material, thickness, number of layers stacked, etc. of the first internal electrode layers 16 a and the second internal electrode layers 16 b are the same as those of the multilayer ceramic capacitor 10 according to the first embodiment, and thus description thereof will be omitted.

[0272] External electrodes 230 are arranged on the first end surface 12 e side and the second end surface 12 f side of the stacked body 12 .

[0273] The external electrode 230 includes a base electrode layer 232 and end surface electrodes 233 disposed on the first end surface 12 e and the second end surface 12 f .

[0274] The external electrode 230 includes a first external electrode 230 a and a second external electrode 230 b .

[0275] The first external electrode 230a is electrically connected to the first internal electrode layer 16a, and is disposed on the surface of the first end surface 12e, a portion of the first principal surface 12a, and a portion of the second principal surface 12b of the stack 12. More specifically, the first external electrode 230a has a first end surface exposed portion 235e disposed on the surface of the first end surface 12e of the stack 12. The first external electrode 130a preferably further has a first principal surface exposed portion 235a extending from the first end surface 12e along the contour of the stack 12 via a first principal surface inclined portion 235ma described later and covering a portion of the first principal surface 12a, and a third principal surface exposed portion 235b extending from the first end surface 12e along the contour of the stack 12 and covering a portion of the second principal surface 12b.

[0276] The first external electrode 230a is electrically connected to the second internal electrode layer 16b, and is disposed on the surface of the first end surface 12e, a portion of the first main surface 12a, and a portion of the second main surface 12b of the stack 12. More specifically, the second external electrode 230b has a second end surface exposed portion 237f disposed on the surface of the second end surface 12f of the stack 12. The second external electrode 230b preferably further has a second main surface exposed portion 237a extending from the second end surface 12f along the contour of the stack 12 via a second main surface inclined portion 237ma described later and covering a portion of the first main surface 12a, and a fourth main surface exposed portion 237b extending from the second end surface 12f along the contour of the stack 12 and covering a portion of the second main surface 12b.

[0277] In the laminate 12, the first opposing electrode portion 26a of the first internal electrode layer 16a and the second opposing electrode portion 26b of the second internal electrode layer 16b are opposed to each other via the ceramic layer 14, thereby forming an electrostatic capacitor. Therefore, an electrostatic capacitor can be obtained between the first external electrode 230a connected to the first internal electrode layer 16a and the second external electrode 230b connected to the second internal electrode layer 16b, showing the characteristics of a capacitor.

[0278] Furthermore, the first external electrode 230 a of the external electrode 230 has a first main surface inclined portion 235 ma formed to extend from the first main surface 12 a to the first end surface 12 e of the stacked body 12 .

[0279] The first main surface inclined portion 235ma is a plane that is located between the first main surface exposed portion 235a and the first end surface exposed portion 235e of the first external electrode 230a and is formed to be bent relative to each of the first main surface exposed portion 235a and the first end surface exposed portion 235e. The first main surface inclined portion 235ma is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the first main surface inclined portion 235ma is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the first main surface inclined portion 235ma.

[0280] Similarly, the second external electrode 230 b of the external electrode 230 has a second main surface inclined portion 237 ma formed to extend from the first main surface 12 a to the second end surface 12 f of the stacked body 12 .

[0281] The second main surface inclined portion 237ma is a plane that is located between the second main surface exposed portion 237a and the second end surface exposed portion 237f of the second external electrode 230b and is formed to be bent relative to each of the second main surface exposed portion 237a and the second end surface exposed portion 237f. The second main surface inclined portion 237ma is preferably formed to cover the ridgeline portion of the stacked body 12. That is, the second main surface inclined portion 237ma is preferably formed not to intersect the stacked body 12, and the surface of the stacked body 12 is not exposed on the second main surface inclined portion 237ma.

[0282] Next, the internal structure of the external electrode 230 will be described.

[0283] The first external electrode 230 a includes a first foundation electrode layer 232 a 1 , a third foundation electrode layer 232 a 2 , and a first end surface electrode 233 a .

[0284] The second external electrode 230 b includes a second foundation electrode layer 232 b 1 , a fourth foundation electrode layer 232 b 2 , and a second end surface electrode 233 b .

[0285] The first foundation electrode layer 232 a 1 is arranged so as to cover a portion of the first main surface 12 a on the first end surface 12 e side of the stacked body 12 .

[0286] The second foundation electrode layer 232 b 1 is arranged so as to cover a portion of the first main surface 12 a on the second end surface 12 f side of the stacked body 12 .

[0287] The third foundation electrode layer 232 a 2 is arranged so as to cover a portion of the second main surface 12 b on the first end surface 12 e side of the stacked body 12 .

[0288] The fourth foundation electrode layer 232 b 2 is arranged so as to cover a portion of the second main surface 12 b on the second end surface 12 f side of the stacked body 12 .

[0289] The first end surface electrode 233 a is located on the surface of the first end surface 12 e , and is arranged so as to cover a part of the first foundation electrode layer 232 a 1 and a part of the third foundation electrode layer 232 a 2 .

[0290] The second end surface electrode 233 b is located on the surface of the second end surface 12 f , and is arranged to cover a portion of the second foundation electrode layer 232 b 1 and a portion of the fourth foundation electrode layer 232 b 2 .

[0291] In addition, the structure of the external electrode 30 described in Modification 1 and Modification 2 of the first embodiment can be applied to the external electrode 230 of the multilayer ceramic capacitor 210 according to the third embodiment.

[0292] The multilayer ceramic capacitor 210 can achieve the same effects as those of the multilayer ceramic capacitor 10 according to the first embodiment.

[0293] 2. Manufacturing method of multilayer ceramic capacitor

[0294] The method for manufacturing the laminated small pieces before firing is the same as the method for manufacturing the laminated ceramic capacitor according to the first embodiment, and thus the description thereof is omitted. Next, the method for manufacturing the external electrode 230 of the laminated ceramic capacitor 210 is described.

[0295] A conductive material is screen-printed on a portion of the first main surface 12a and a portion of the second main surface 12b of the laminate 12 before firing to form a first base electrode layer 232a1, a second base electrode layer 232b1, a third base electrode layer 232a2, and a fourth base electrode layer 232b2 of the base electrode layer 232 composed of a thin film electrode layer. In this case, Ni is preferably used as the conductive material.

[0296] Next, if Fig. 20 As shown in the figure, the laminated body 12 after the first base electrode layer 232a1 and the third base electrode layer 232a2 are formed is fired, and then the first end face 12e is further impregnated with a conductive material, thereby forming the first end face electrode 233a. In this case, Cu is preferably used as the conductive material. Similarly, the laminated body 12 after the second base electrode layer 232b1 and the fourth base electrode layer 232b2 are formed is fired, and then the second end face 12f is further impregnated with a conductive material, thereby forming the second end face electrode 233b.

[0297] The end surface electrodes 233 may be formed by applying a conductive material on the first end surface 12e and the second end surface 12f before firing the laminate 12 after forming the base electrode layer 232, and then firing the laminate 12. In this case, Ni is preferably used as the conductive material.

[0298] Thereafter, a Cu plating layer is formed as necessary.

[0299] The Cu plating layer is formed through the steps of Cu plating, vacuum heat treatment, and Cu plating heat treatment.

[0300] First, Cu plating is performed on the first external electrode 230 a and the second external electrode 230 b to form a Cu plating layer.

[0301] Thereafter, as required, Ni / Sn plating is performed on the first external electrode 230a and the second external electrode 230b on which the Cu plating layer is formed, thereby forming the Ni / Sn plating layer of the first external electrode 230a and the second external electrode 230b. Alternatively, Ni / Sn plating may be performed on the first external electrode 230a and the second external electrode 230b without forming the Cu plating layer, thereby forming the Ni / Sn plating layer.

[0302] Next, when forming the external electrode 230 , inclined portions to be the first main surface inclined portion 235 ma and the second main surface inclined portion 237 ma are formed.

[0303] As a method for forming the inclined portion, it is preferable to use the forming method using laser processing or sandblasting described in the method for manufacturing the multilayer ceramic capacitor in the first embodiment.

[0304] D. Experimental Examples

[0305] A multilayer ceramic capacitor was produced using the method for producing a multilayer ceramic capacitor according to the first embodiment.

[0306] (a) Specifications of samples of the examples

[0307] As samples, multilayer ceramic capacitors having the following specifications were prepared.

[0308] ・Dimensions of multilayer ceramic capacitors (design values): listed in (Table 1)

[0309] Main component material of ceramic layer: BaTiO 3

[0310] Capacitance: 220μF

[0311] Rated voltage: 4V

[0312] Electrode material of internal electrode layer: Ni

[0313] ·Construction of external electrodes:

[0314] Base electrode layer: an electrode containing conductive metal (Cu) and glass components

[0315] Thickness of the underlying electrode layer: Thickness at the center of the underlying electrode layer in the longitudinal direction on the first and second principal surfaces: 3 μm

[0316] ·Plating layer: Two-layer structure of Ni plating layer and Sn plating layer

[0317] Ni plating layer thickness: Thickness at the center of the Ni plating layer in the longitudinal direction on the first main surface and the second main surface: 3 μm

[0318] Sn plating layer thickness: Thickness of the Sn plating layer located on the first main surface and the second main surface at the center in the longitudinal direction: 3 μm

[0319] (b) Evaluation of mechanical strength by temperature cycling

[0320] The samples of the multilayer ceramic capacitors of sample numbers 1 to 6 after Sn plating were reflow-mounted on a given evaluation base using solder, and the temperature in the test tank was changed between -55°C and 125°C at intervals of 30 minutes. The temperature change between -55°C and 125°C was set as one cycle, and it was implemented for 200 cycles, and then the small pieces were polished along the width direction y for each base, and the LT cross-section exposed by polishing was observed with a microscope. The number of samples for each sample number was set to 10.

[0321] For each sample, if no cracks were generated in the external electrode and the crack generation rate was 0%, it was set as ◎. Although cracks were generated in the external electrode of the sample, if the length of the crack was less than 1 / 2 of the thickness of the external electrode for all the samples where cracks were generated, it was set as ○. Although cracks were generated in the external electrode of the sample, if the length of the crack was greater than 1 / 2 of the thickness of the external electrode and less than the thickness of the external electrode for all the samples where cracks were generated, it was set as △. For the following samples, it was set as ×, that is, the sample in which cracks were generated in the external electrode of the sample and the cracks reached the stacked body, or the cracks were generated in more than one sample whose length was greater than the thickness of the external electrode.

[0322] (d) Results

[0323] Table 1 shows the evaluation results of cracks of the samples of sample numbers 1 to 6.

[0324] [Table 1]

[0325]

[0326] According to Table 1, the evaluation of cracks in the multilayer ceramic capacitors according to Sample Nos. 3 to 5 in which the angle β of the first main surface inclined portion 35ma was in the range of 120° to 170° was “○” or “◎”, indicating good quality.

[0327] In addition, the evaluation of cracks in the multilayer ceramic capacitor involved in sample number 2, in which the angle β of the first main surface inclined portion 35ma was 110°, was evaluated as "△". Similarly, the evaluation of cracks in the multilayer ceramic capacitor involved in sample number 6, in which the angle β of the first main surface inclined portion 35ma was greater than 170°, was evaluated as "△".

[0328] On the other hand, the evaluation of cracks in the multilayer ceramic capacitor of sample number 1 in which the angle β of the first main surface inclined portion 35ma was 90°, that is, in which no inclined portion was formed, was evaluated as “×”.

[0329] In view of the above, this experiment has shown that by providing the first main surface inclined portion and the second main surface inclined portion on the external electrode, the occurrence of cracks such as those applied to the stacked body can be at least suppressed.

[0330] In addition, according to this experiment, it is shown that: by providing the first main surface inclined portion and the second main surface inclined portion with an angle β of the inclined portion in the range of greater than 120° and less than 170°, there is no need to provide a stress absorption structure such as a conductive resin layer in the external electrode, which can suppress the expansion of the size of the component and reduce the influence of thermal stress caused by solder shrinkage.

[0331] In addition, although the embodiment of the present invention has been disclosed through the above description, the present invention is not limited thereto.

[0332] In the above-described embodiment, the two-terminal multilayer ceramic capacitor 10 is taken as an example, but the multilayer ceramic capacitor of the present invention may be a three-terminal multilayer ceramic capacitor, a thermistor element, or an inductor element.

[0333] In summary, the multilayer ceramic electronic component of the present invention only needs to have a multilayer body having a plurality of internal electrode layers opposed to and spaced apart from each other and a ceramic layer containing a ceramic material arranged between the plurality of internal electrode layers. Apart from this, it is not limited by the specific purpose, function, and structure of the component, for example, the number and shape of the multilayer body, the external electrode, and the internal electrode layers connected to the external electrode.

[0334] Including the above description, the present invention can add various changes to the above-described embodiments with respect to structure, shape, material, number, position or arrangement without departing from the scope of the technical idea and purpose of the present invention, and these are all included in the present invention.

[0335] <1>

[0336] A laminated ceramic electronic component comprising:

[0337] A laminated body comprising a plurality of stacked ceramic layers, and comprising a first main surface and a second main surface opposite to each other in a height direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the stacking direction of the plurality of ceramic layers, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the stacking direction and the width direction, and comprising a first internal electrode layer alternately stacked with the plurality of ceramic layers and exposed at the first end surface, and a second internal electrode layer alternately stacked with the plurality of ceramic layers and exposed at the second end surface;

[0338] a first external electrode provided so as to extend from the first end surface of the stacked body to the first main surface and the second main surface; and

[0339] The second external electrode is provided so as to extend from the second end surface of the stacked body to the first main surface and the second main surface,

[0340] The first external electrode has a first main surface inclined portion formed to extend from the first main surface side to the first end surface side of the stacked body.

[0341] The second external electrode has a second main surface inclined portion formed to extend from the first main surface side to the second end surface side of the stacked body.

[0342] <2>

[0343] The multilayer ceramic electronic component according to <1>,

[0344] The first external electrode includes a first base electrode layer and a third base electrode layer as sputtering electrodes and a first end surface plating layer.

[0345] The second external electrode includes a second base electrode layer and a fourth base electrode layer as a sputtering electrode and a second end surface plating layer.

[0346] The first base electrode layer is formed so as to cover a portion of the first main surface on the first end surface side of the stacked body.

[0347] The second base electrode layer is formed so as to cover a portion of the first main surface on the second end surface side of the stacked body.

[0348] The third base electrode layer is formed so as to cover a portion of the second main surface on the first end surface side of the stacked body.

[0349] The fourth base electrode layer is formed so as to cover a portion of the second main surface on the second end surface side of the stacked body.

[0350] The end surface plating layer comprises a first end surface plating layer and a second end surface plating layer,

[0351] The first end surface plating layer is arranged on the first end surface so as to cover a region including the first internal electrode layer exposed on the first end surface, the first base electrode layer, and the third base electrode layer.

[0352] The second end surface plating layer is arranged on the second end surface so as to cover a region including the second internal electrode layer exposed at the second end surface, the second foundation electrode layer, and the fourth foundation electrode layer.

[0353] <3>

[0354] The multilayer ceramic electronic component according to <1>,

[0355] The first external electrode includes a first base electrode layer and a third base electrode layer and a first end surface electrode which are screen-printed.

[0356] The second external electrode includes a second base electrode layer and a fourth base electrode layer and a second end surface electrode which are screen-printed.

[0357] The first base electrode layer is formed so as to cover a portion of the first main surface on the first end surface side of the stacked body.

[0358] The second base electrode layer is formed so as to cover a portion of the first main surface on the second end surface side of the stacked body.

[0359] The third base electrode layer is formed so as to cover a portion of the second main surface on the first end surface side of the stacked body.

[0360] The fourth base electrode layer is formed so as to cover a portion of the second main surface on the second end surface side of the stacked body.

[0361] The end surface electrode comprises a first end surface electrode and a second end surface electrode,

[0362] The first end surface electrode is located on the surface of the first end surface and is arranged to cover a portion of the first foundation electrode layer and a portion of the third foundation electrode layer.

[0363] The second end surface electrode is located on the surface of the second end surface and is arranged to cover a portion of the second foundation electrode layer and a portion of the fourth foundation electrode layer.

[0364] <4>

[0365] The multilayer ceramic electronic component according to any one of <1> to <3>,

[0366] The first main surface inclined portion of the first external electrode covers a ridge formed by the first main surface and the first end surface of the stacked body.

[0367] The second main surface inclined portion of the second external electrode covers a ridge portion formed by the first main surface and the second end surface of the stacked body.

[0368] <5>

[0369] The multilayer ceramic electronic component according to any one of <1> to <3>,

[0370] The first external electrode has a third main surface inclined portion formed to extend from the second main surface side to the first end surface side of the stacked body.

[0371] The second external electrode has a fourth main surface inclined portion formed to extend from the second main surface side to the second end surface side of the stacked body.

[0372] <6>

[0373] The multilayer ceramic electronic component according to <5>,

[0374] The third main surface inclined portion of the first external electrode covers a ridge formed by the second main surface and the first end surface of the stacked body.

[0375] The fourth main surface inclined portion of the second external electrode covers a ridge portion formed by the second main surface and the second end surface of the stacked body.

[0376] <7>

[0377] The multilayer ceramic electronic component according to any one of <1> to <6>,

[0378] The first external electrode has:

[0379] a first side surface inclined portion formed to extend from the first main surface side of the stacked body to the first side surface side;

[0380] a second side surface inclined portion formed to extend from the first main surface side of the stacked body to the second side surface side;

[0381] a third side surface inclined portion formed to extend from the second main surface side of the stacked body to the first side surface side; and

[0382] a fourth side surface inclined portion formed so as to extend from the second main surface side to the second side surface side of the stacked body,

[0383] The second external electrode has:

[0384] a fifth side surface inclined portion formed to extend from the first main surface side of the stacked body to the first side surface side;

[0385] a sixth side surface inclined portion formed to extend from the first main surface side of the stacked body to the second side surface side;

[0386] a seventh side surface inclined portion formed to extend from the second main surface side of the stacked body to the first side surface side; and

[0387] The eighth side surface inclined portion is formed so as to extend from the second main surface side to the second side surface side of the stacked body.

[0388] <8>

[0389] The multilayer ceramic electronic component according to <7>,

[0390] In the first external electrode,

[0391] The first side surface inclined portion covers a ridge formed by the first main surface and the first side surface of the stacked body.

[0392] The second side surface inclined portion covers a ridge formed by the first main surface and the second side surface of the stacked body.

[0393] The third side inclined portion covers a ridge formed by the second main surface and the first side surface of the stacked body.

[0394] The fourth side inclined portion covers a ridge formed by the second main surface and the second side surface of the stacked body.

[0395] In the second external electrode,

[0396] The fifth side inclined portion covers a ridge formed by the first main surface and the first side surface of the stacked body.

[0397] The sixth side inclined portion covers a ridge formed by the first main surface and the second side surface of the stacked body.

[0398] The seventh side inclined portion covers a ridge formed by the second main surface and the first side surface of the stacked body.

[0399] The eighth side surface inclined portion covers a ridge portion formed by the second main surface and the second side surface of the stacked body.

[0400] <9>

[0401] The multilayer ceramic electronic component according to any one of <1> to <8>,

[0402] An angle formed by a first main surface exposed portion formed on the first main surface of the stack and the first main surface inclined portion in the first external electrode, and an angle formed by a second main surface exposed portion formed on the first main surface of the stack and the second main surface inclined portion in the second external electrode are greater than 120° and less than 170°.

[0403] <10>

[0404] The multilayer ceramic electronic component according to <5> or <6>,

[0405] An angle formed by a third main surface exposed portion and a third main surface inclined portion of the first external electrode formed on the second main surface of the stack, and an angle formed by a fourth main surface exposed portion and a fourth main surface inclined portion of the second external electrode formed on the second main surface of the stack are greater than 120° and less than 170°.

[0406] <11>

[0407] The multilayer ceramic electronic component according to <7> or <8>,

[0408] The angle formed by the first main surface exposed portion formed on the first main surface of the stack and the first side inclined portion, the angle formed by the first main surface exposed portion and the second side inclined portion of the stack, the angle formed by the second main surface exposed portion formed on the second main surface of the stack and the third side inclined portion, and the angle formed by the second main surface exposed portion and the fourth side inclined portion of the stack in the first external electrode, and the angle formed by the first main surface exposed portion and the fifth side inclined portion of the stack in the second external electrode, the angle formed by the first main surface exposed portion and the sixth side inclined portion of the stack, the angle formed by the second main surface exposed portion and the seventh side inclined portion of the stack, and the angle formed by the second main surface exposed portion and the eighth side inclined portion of the stack are greater than 120° and less than 170°.

[0409] Industrial Applicability

[0410] The present invention as described above achieves the effect of being able to suppress the increase in the size of components and reduce the influence of thermal stress due to solder shrinkage, and is useful in application to, for example, multilayer ceramic electronic components.

[0411] Description of Reference Numerals

[0412] 10, 110, 210: multilayer ceramic capacitors;

[0413] 12: laminate;

[0414] 12a: 1st main side;

[0415] 12b: 2nd main side;

[0416] 12c: 1st side;

[0417] 12d: lateral side 2;

[0418] 12e: 1st end surface;

[0419] 12f: 2nd end surface;

[0420] 14: Ceramic layer;

[0421] 16: internal electrode layer;

[0422] 16a: first internal electrode layer;

[0423] 16b: second internal electrode layer;

[0424] 18: inner layer;

[0425] 20a: first main surface side outer layer portion;

[0426] 20b: outer layer portion on the second main surface side;

[0427] 22a: first side outer layer portion;

[0428] 22b: 2nd side outer layer portion;

[0429] 24a: first end surface side outer layer portion;

[0430] 24b: second end surface side outer layer portion;

[0431] 26a: first opposing electrode portion;

[0432] 26b: second opposing electrode portion;

[0433] 28a: first lead electrode portion;

[0434] 28b: second lead electrode portion;

[0435] 30, 130, 230: external electrodes;

[0436] 30a, 130a, 230a: first external electrode;

[0437] 30b, 130b, 230b: second external electrode;

[0438] 32, 132, 232: base electrode layer;

[0439] 32a, 132a1, 232a1: first base electrode layer;

[0440] 132a2, 232a2: third base electrode layer;

[0441] 32b, 132b1, 232b1: second base electrode layer;

[0442] 132b2, 232b2: fourth base electrode layer;

[0443] 34, 134, 234: plating layer;

[0444] 34a, 134a, 234a: first plating layer;

[0445] 34b, 134b, 234b: second plating layer;

[0446] 35a, 135a, 235a: first main surface exposed portion;

[0447] 35b, 135b, 235b: third main surface exposed portion;

[0448] 35e, 135e, 235e: first end surface exposed portion;

[0449] 35ma, 135ma, 235ma: inclined portion of the first main surface;

[0450] 35mb: inclined portion of the third main surface;

[0451] 35mac: 1st side inclined portion;

[0452] 35mad: 2nd lateral inclined part;

[0453] 35mbc: 3rd side inclined portion;

[0454] 35mbd: 4th side inclined portion;

[0455] 37a, 137a, 237a: second main surface exposed portion;

[0456] 37b, 137b, 237b: fourth main surface exposed portion;

[0457] 37f, 137f, 237f: second end surface exposed portion;

[0458] 37ma, 137ma, 237ma: second main surface inclined portion;

[0459] 37mb: inclined portion of the fourth main surface;

[0460] 37mac: 5th side slope;

[0461] 37mad: 6th lateral oblique part;

[0462] 37mbc: 7th side inclined portion;

[0463] 37mbd: 8th side inclined part;

[0464] 40: small piece loading platform;

[0465] 50: Laser processing machine;

[0466] 60: small piece support;

[0467] 70: mask;

[0468] 70x: slit;

[0469] 101: Small piece.

Claims

1. A laminated ceramic electronic component comprising: A laminated body comprising a plurality of stacked ceramic layers, and comprising a first main surface and a second main surface opposite to each other in a height direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the stacking direction of the plurality of ceramic layers, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the stacking direction and the width direction, and comprising a first internal electrode layer alternately stacked with the plurality of ceramic layers and exposed at the first end surface, and a second internal electrode layer alternately stacked with the plurality of ceramic layers and exposed at the second end surface; a first external electrode provided so as to extend from the first end surface of the stacked body to the first main surface and the second main surface; and The second external electrode is provided so as to extend from the second end surface of the stacked body to the first main surface and the second main surface, The first external electrode has a first main surface inclined portion formed to extend from the first main surface side to the first end surface side of the stacked body. The second external electrode has a second main surface inclined portion formed to extend from the first main surface side to the second end surface side of the stacked body.

2. The multilayer ceramic electronic component according to claim 1, wherein The first external electrode includes a first base electrode layer and a third base electrode layer as sputtering electrodes and a first end surface plating layer. The second external electrode includes a second base electrode layer and a fourth base electrode layer as a sputtering electrode and a second end surface plating layer. The first base electrode layer is formed so as to cover a portion of the first main surface on the first end surface side of the stacked body. The second base electrode layer is formed so as to cover a portion of the first main surface on the second end surface side of the stacked body. The third base electrode layer is formed so as to cover a portion of the second main surface on the first end surface side of the stacked body. The fourth base electrode layer is formed so as to cover a portion of the second main surface on the second end surface side of the stacked body. The end surface plating layer comprises a first end surface plating layer and a second end surface plating layer, The first end surface plating layer is arranged on the first end surface so as to cover a region including the first internal electrode layer exposed on the first end surface, the first base electrode layer, and the third base electrode layer. The second end surface plating layer is arranged on the second end surface so as to cover a region including the second internal electrode layer exposed at the second end surface, the second foundation electrode layer, and the fourth foundation electrode layer.

3. The multilayer ceramic electronic component according to claim 1, wherein The first external electrode includes a first base electrode layer and a third base electrode layer and a first end surface electrode which are screen-printed. The second external electrode includes a second base electrode layer and a fourth base electrode layer and a second end surface electrode which are screen-printed. The first base electrode layer is formed so as to cover a portion of the first main surface on the first end surface side of the stacked body. The second base electrode layer is formed so as to cover a portion of the first main surface on the second end surface side of the stacked body. The third base electrode layer is formed so as to cover a portion of the second main surface on the first end surface side of the stacked body. The fourth base electrode layer is formed so as to cover a portion of the second main surface on the second end surface side of the stacked body. The end surface electrode comprises a first end surface electrode and a second end surface electrode, The first end surface electrode is located on the surface of the first end surface and is arranged to cover a portion of the first foundation electrode layer and a portion of the third foundation electrode layer. The second end surface electrode is located on the surface of the second end surface and is arranged to cover a portion of the second foundation electrode layer and a portion of the fourth foundation electrode layer.

4. The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein The first main surface inclined portion of the first external electrode covers a ridge formed by the first main surface and the first end surface of the stacked body. The second main surface inclined portion of the second external electrode covers a ridge portion formed by the first main surface and the second end surface of the stacked body.

5. The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein The first external electrode has a third main surface inclined portion formed to extend from the second main surface side to the first end surface side of the stacked body. The second external electrode has a fourth main surface inclined portion formed to extend from the second main surface side to the second end surface side of the stacked body.

6. The multilayer ceramic electronic component according to claim 5, wherein The third main surface inclined portion of the first external electrode covers a ridge formed by the second main surface and the first end surface of the stacked body. The fourth main surface inclined portion of the second external electrode covers a ridge portion formed by the second main surface and the second end surface of the stacked body.

7. The multilayer ceramic electronic component according to any one of claims 1 to 6, wherein The first external electrode has: a first side surface inclined portion formed to extend from the first main surface side of the stacked body to the first side surface side; a second side surface inclined portion formed to extend from the first main surface side of the stacked body to the second side surface side; a third side surface inclined portion formed to extend from the second main surface side of the stacked body to the first side surface side; and a fourth side surface inclined portion formed so as to extend from the second main surface side to the second side surface side of the stacked body, The second external electrode has: a fifth side surface inclined portion formed to extend from the first main surface side of the stacked body to the first side surface side; a sixth side surface inclined portion formed to extend from the first main surface side of the stacked body to the second side surface side; a seventh side surface inclined portion formed to extend from the second main surface side of the stacked body to the first side surface side; and The eighth side surface inclined portion is formed so as to extend from the second main surface side to the second side surface side of the stacked body.

8. The multilayer ceramic electronic component according to claim 7, wherein In the first external electrode, The first side surface inclined portion covers a ridge formed by the first main surface and the first side surface of the stacked body. The second side surface inclined portion covers a ridge formed by the first main surface and the second side surface of the stacked body. The third side inclined portion covers a ridge formed by the second main surface and the first side surface of the stacked body. The fourth side inclined portion covers a ridge formed by the second main surface and the second side surface of the stacked body. In the second external electrode, The fifth side inclined portion covers a ridge formed by the first main surface and the first side surface of the stacked body. The sixth side inclined portion covers a ridge formed by the first main surface and the second side surface of the stacked body. The seventh side inclined portion covers a ridge formed by the second main surface and the first side surface of the stacked body. The eighth side surface inclined portion covers a ridge portion formed by the second main surface and the second side surface of the stacked body.

9. The multilayer ceramic electronic component according to any one of claims 1 to 8, wherein An angle formed by a first main surface exposed portion formed on the first main surface of the stack and the first main surface inclined portion in the first external electrode, and an angle formed by a second main surface exposed portion formed on the first main surface of the stack and the second main surface inclined portion in the second external electrode are greater than 120° and less than 170°.

10. The multilayer ceramic electronic component according to claim 5 or claim 6, wherein: An angle formed by a third main surface exposed portion and a third main surface inclined portion of the first external electrode formed on the second main surface of the stack, and an angle formed by a fourth main surface exposed portion and a fourth main surface inclined portion of the second external electrode formed on the second main surface of the stack are greater than 120° and less than 170°.

11. The multilayer ceramic electronic component according to claim 7 or claim 8, wherein: The angle formed by the first main surface exposed portion formed on the first main surface of the stack and the first side inclined portion, the angle formed by the first main surface exposed portion and the second side inclined portion of the stack, the angle formed by the second main surface exposed portion formed on the second main surface of the stack and the third side inclined portion, and the angle formed by the second main surface exposed portion and the fourth side inclined portion of the stack in the first external electrode, and the angle formed by the first main surface exposed portion and the fifth side inclined portion of the stack in the second external electrode, the angle formed by the first main surface exposed portion and the sixth side inclined portion of the stack, the angle formed by the second main surface exposed portion and the seventh side inclined portion of the stack, and the angle formed by the second main surface exposed portion and the eighth side inclined portion of the stack are greater than 120° and less than 170°.

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