Cleaning method and cleaning device for SMT suction nozzle

Abstract

The invention discloses an SMT suction nozzle cleaning method and device, and the method comprises the following steps: placing a to-be-cleaned suction nozzle on a cleaning table, enabling the front end of the suction nozzle to face downwards, and placing the cleaning table into a cleaning tank filled with cleaning liquid; the cleaning table firstly reaches a first water level, the cleaning liquid submerges the cleaning table and the reflector at the first water level, the cleaning table then reaches a second water level, and the cleaning liquid submerges the front end of the suction nozzle and does not make contact with the reflector at the second water level; or the cleaning table firstly reaches the second water level and then reaches the first water level; a first cleaning process is executed at the first water level, cleaning is performed at a first cleaning frequency for a first duration in the first cleaning process, a second cleaning process is executed at the second water level, cleaning is performed at a second cleaning frequency for a second duration in the second cleaning process, the first cleaning frequency is smaller than the second cleaning frequency, and the first duration is smaller than the second duration. A brush cleaning mechanism does not need to be arranged for cleaning the reflecting plate, the structure is simpler, the cost is lower, the cleaning efficiency is higher, and the cleaning effect is better.

Description

Technical Field

[0001] The invention belongs to the technical field of SMT, and in particular relates to a cleaning method and a cleaning device for an SMT suction nozzle. Background Art

[0002] SMT is surface mount technology, which is the most popular technology and process in the current electronic assembly industry. It is a method of mounting pinless or short-lead surface mount components on the surface of printed PCB boards. The nozzle of the placement machine is a key component used to accurately mount electronic components on PCB boards. The nozzle of the production placement machine usually has an automatic replacement function, which can quickly and accurately replace the nozzle to meet different production needs. Through the precise adsorption and placement of the nozzle, the placement machine can efficiently complete the placement of a large number of components and improve production efficiency and placement quality.

[0003] The nozzle structure of the placement machine generally includes a nozzle body and a photosensitive plate or reflector made of acrylic material. The photosensitive plate or reflector is usually glued to the nozzle body, and the two are in a cross shape, that is, the nozzle body is divided into the lower end or front end of the nozzle and the upper end or rear end of the nozzle by the photosensitive plate or reflector. The nozzle is the lifeline of the placement quality. Since the nozzle works by vacuum, some external objects will be sucked into the nozzle during use, causing the nozzle to be blocked. When the nozzle is blocked, the PCBA (Printed Circuit Board Assembly) produced by SMT will be defective. If foreign matter is not cleaned up in time, it will lead to poor suction. Therefore, the prior art adopts a cleaning method to ensure the normal use of the nozzle.

[0004] At present, the common cleaning method for the suction nozzle is to clean the suction nozzle body and the photosensitive plate or reflector separately, specifically, using ultrasonic cleaning of the suction nozzle body (mainly the front end or lower end of the suction nozzle), and then using a cleaning brush to clean the photosensitive plate or reflector, and the ultrasonic cleaning and the photosensitive plate or reflector cleaning brush are two independent parts. This cleaning method will increase the cost and the cleaning efficiency is relatively low. In order to solve the above technical problems, the present invention is thus provided. Summary of the invention

[0005] In view of at least one of the above-mentioned technical problems, an object of the present invention is to provide a cleaning method and a cleaning device for an SMT nozzle.

[0006] The technical solution of the present invention is: One of the objects of the present invention is to provide a method for cleaning a nozzle, comprising the following steps: Place the nozzle to be cleaned on a cleaning table with multiple fixing holes and with the front end of the nozzle facing downward, and place the cleaning table into a cleaning tank filled with cleaning liquid; The cleaning table reaches the first water level first, when the cleaning liquid covers the cleaning table and the reflector, and then the cleaning table reaches the second water level, when the cleaning liquid covers the front end of the suction nozzle and does not contact the reflector; or the cleaning table reaches the second water level first, when the cleaning liquid covers the front end of the suction nozzle and does not contact the reflector, and then the cleaning table reaches the first water level, the first water level is higher than the second water level, when the cleaning liquid covers the cleaning table and the reflector; A first cleaning process is performed at a first water level, and cleaning is performed at a first cleaning frequency for a first time. A second cleaning process is performed at a second water level, and cleaning is performed at a second cleaning frequency for a second time. The first cleaning frequency is less than the second cleaning frequency, and the first time is less than the second time.

[0007] Preferably, the cleaning tank may not be pre-injected with cleaning liquid, the cleaning table is first horizontally fixed in the tank of the cleaning tank, and then the cleaning liquid is injected into the tank of the cleaning tank; The cleaning liquid first reaches the first water level and then drops to the second water level; or the cleaning liquid first reaches the second water level and then rises to the first water level.

[0008] Preferably, both the first cleaning process and the second cleaning process adopt ultrasonic cleaning.

[0009] Preferably, an ultrasonic generating device is provided at the bottom of the cleaning tank.

[0010] Preferably, a cleanliness inspection process is included after the first cleaning process and after the second cleaning process.

[0011] Preferably, a wear inspection step of the nozzle front end is further included before or after the first cleaning step.

[0012] Preferably, in the wear inspection process of the front end of the suction nozzle, the length or area of ​​the nozzle projection produced by the initial suction nozzle and the suction nozzle after use on the object is compared; Among them, a camera device and a light source are used during the inspection process. The camera device is arranged directly above the object, and the light source is located on the side of the camera device and arranged diagonally above the object. During the inspection process, the initial suction nozzle and the suction nozzle after use are respectively located on the side of the object and on the light path of the light source.

[0013] Another object of the present invention is to provide a nozzle cleaning device, comprising at least one cleaning tank having a liquid cavity therein, at least one cleaning table having a plurality of fixing holes therein, and at least one ultrasonic generator, wherein one ultrasonic generator is correspondingly provided at the bottom of any of the cleaning tanks, the cleaning table is used for fixing and placing the nozzle to be cleaned, the cleaning table is fixed in the liquid cavity of the cleaning tank or the cleaning table can be lifted and lowered in the liquid cavity of the cleaning tank, the ultrasonic generator is used for performing a first cleaning process when the cleaning liquid in the cleaning tank is at a first water level and performing a second cleaning process when the cleaning liquid is at a second water level, the first water level is higher than the second water level, the cleaning liquid submerges the cleaning table and the reflector at the first water level, the cleaning liquid submerges the front end of the nozzle and does not contact the reflector at the second water level, the first cleaning process is cleaned at a first cleaning frequency for a first duration, the second cleaning process is cleaned at a second cleaning frequency for a second duration, the first cleaning frequency is less than the second cleaning frequency, and the first duration is less than the second duration.

[0014] Preferably, the fixing holes on any of the cleaning tables include a plurality of fixing holes with different apertures.

[0015] Preferably, the cleaning device further comprises a support platform for supporting the cleaning platform, which is fixed horizontally in the cleaning tank or can be moved up and down along the liquid cavity of the cleaning tank, and the support platform is provided with a plurality of hollow portions distributed at intervals; and / or A cover plate that can be slidably opened and closed is provided on the top opening of the cleaning tank, a driving member that can be extended and retracted along the sliding direction of the cover plate is provided on the side of the cleaning tank, a driving end of the driving member is connected to the cover plate, and a sliding part for sliding cooperation with the cover plate is provided on the top opening of the cleaning tank.

[0016] Compared with the prior art, the advantages of the present invention are: The cleaning method and cleaning device of the SMT nozzle of the present invention ultrasonically cleans the entire nozzle including the nozzle body of the reflector in a first cleaning process of a first frequency and a first duration, and ultrasonically cleans the front end of the nozzle of the nozzle body in a second cleaning process of a second frequency and a second duration. It is not necessary to set a brush cleaning mechanism to clean the reflector, and the structure is simpler and the cost is lower. The problem of easy falling off of the reflector caused by ultrasonic cleaning is solved by adjusting the water level, frequency and duration, and the cleaning efficiency is higher and the cleaning effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments: Figure 1 A schematic diagram of a cleaning method for an SMT nozzle cleaning device according to an embodiment of the present invention; Figure 2A schematic diagram of the top view of the cleaning tank, cleaning table and nozzles to be cleaned of the SMT nozzle cleaning device according to an embodiment of the present invention; Figure 3 for Figure 2 The schematic diagram of the top view of the cleaning table and the cleaning tank for the suction nozzle to be cleaned is omitted; Figure 4 A schematic diagram of the structure of a cleaning station of an SMT nozzle cleaning device according to an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a wear inspection process in the SMT nozzle cleaning method according to an embodiment of the present invention; Figure 6 for Figure 5 The partial enlarged view of part A in the middle is also the schematic diagram of the wear inspection process in the SMT nozzle cleaning method; Figure 7 Schematic diagram of the structure of a nozzle cleaning device according to an embodiment of the present invention.

[0018] Among them: 10, suction nozzle; 101, initial suction nozzle; 102, suction nozzle after use; 11, suction nozzle body; 110, suction nozzle front end; 12, reflector; 20, cleaning tank; 21, support table; 211, hollow part; 22, cover plate; 23, driving part; 30, ultrasonic generator; 40, cleaning table; 41, fixing hole; 50, camera device; 60, light source; 70, object; 80, feeding mechanism. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0020] See also Figures 1 to 7 The SMT nozzle cleaning method provided by the embodiment of the present invention comprises the following steps: The suction nozzle 10 to be cleaned is placed on a cleaning table 40 with a plurality of fixing holes 41 and the front end 110 of the suction nozzle is facing downward, and the cleaning table 40 is placed in a cleaning tank 20 filled with cleaning liquid; The cleaning station 40 reaches the first water level h1 first. When the cleaning liquid reaches the first water level h1, it covers the cleaning station 40 and the reflector 12 (such as Figure 1 As shown, Figure 1 The cleaning station 40 is not shown. Figure 2 As shown, in fact, the table surface of the cleaning table 40 and the upper surface of the light-emitting plate 12 are almost flat. Figure 1It can be seen that the liquid level of the cleaning liquid is slightly higher than the upper surface of the reflector 12), and then the cleaning station 40 reaches the second water level h2 ( Figure 1 It can be seen that the liquid level of the cleaning liquid is located slightly below the middle of the reflector 12). When the second water level is h2, the cleaning liquid covers the front end 110 of the suction nozzle and does not contact the reflector 12. The first cleaning process is performed at the first water level h1, and the first cleaning process is cleaned for a first time at a first cleaning frequency. The second cleaning process is performed at the second water level h2, and the second cleaning process is cleaned for a second time at a second cleaning frequency. The first cleaning frequency is less than the second cleaning frequency, and the first time is less than the second time.

[0021] As an alternative embodiment, the SMT nozzle cleaning method provided in the embodiment of the present invention includes the following steps: The suction nozzle 10 to be cleaned is placed on a cleaning table 40 with a plurality of fixing holes 41 and the front end 110 of the suction nozzle is facing downward, and the cleaning table 40 is placed in a cleaning tank 20 filled with cleaning liquid; The cleaning station 40 first reaches the second water level h2, at which the cleaning liquid covers the front end 110 of the suction nozzle and does not contact the reflector 12, and then the cleaning station 40 reaches the first water level h1, which is higher than the second water level h2 and at which the cleaning liquid covers the cleaning station 40 and the reflector 12; The first cleaning process is performed at the first water level h1, and the first cleaning process is cleaned for a first time at a first cleaning frequency. The second cleaning process is performed at the second water level h2, and the second cleaning process is cleaned for a second time at a second cleaning frequency. The first cleaning frequency is less than the second cleaning frequency, and the first time is less than the second time.

[0022] As another alternative embodiment, the cleaning liquid may not be pre-injected into the cleaning tank 20. The suction nozzle 10 to be cleaned is first placed on the cleaning table 40, and then the cleaning table 40 is horizontally fixed in the tank of the cleaning tank 20. Specifically, the SMT suction nozzle cleaning method provided by the embodiment of the present invention includes the following steps: The suction nozzle 10 to be cleaned is placed on a cleaning table 40 with a plurality of fixing holes 41 and the front end 110 of the suction nozzle is facing downward, the cleaning table 40 is fixed in the groove of the cleaning tank 20, and the cleaning liquid is injected into the groove of the cleaning tank 20; The cleaning liquid first reaches the first water level h1 and then drops to the second water level h2; or the cleaning liquid first reaches the second water level h2 and then rises to the first water level h1; as in the above embodiment, at the first water level h1, the cleaning liquid covers the cleaning table 40 and the reflector 12, and at the second water level h2, the cleaning liquid covers the front end 110 of the suction nozzle and does not contact the reflector 12, and the first water level h1 is higher than the second water level h2; The first cleaning process is performed at the first water level h1, and the first cleaning process is cleaned for a first time at a first cleaning frequency. The second cleaning process is performed at the second water level h2, and the second cleaning process is cleaned for a second time at a second cleaning frequency. The first cleaning frequency is less than the second cleaning frequency, and the first time is less than the second time.

[0023] The SMT nozzle cleaning method of the embodiment of the present invention first performs the first cleaning process at the first water level h1, and then performs the second cleaning process at the second water level h2. That is, the reflector 12 and the front end 110 of the nozzle are cleaned first, and then the front end 110 of the nozzle is cleaned separately.

[0024] That is to say, the cleaning method of the SMT suction nozzle in the embodiment of the present invention adopts a two-step cleaning method in the same cleaning tank 20. In the two steps, one step cleans the reflector 12 and the suction nozzle body 11, that is, the entire suction nozzle 10, and the other step only cleans the front end 110 of the suction nozzle. It is only necessary to adjust the water level of the cleaning liquid in the cleaning tank 20 and the cleaning frequency and cleaning time at different water levels. The cleaning steps are simple and there is no need to add a cleaning brush device to clean the reflector 12. The cleaning structure is simpler, the cleaning efficiency is higher, and the cleaning effect is better.

[0025] In the cleaning method of the SMT nozzle in the embodiment of the present invention, both cleaning steps adopt ultrasonic cleaning. In order to achieve ultrasonic cleaning, an ultrasonic generator 30 is provided at the bottom of the cleaning tank 20. The ultrasonic generator 30 generates ultrasonic vibrations so that the ultrasonic waves in the cleaning liquid in the cleaning tank 20 directly and indirectly act on the liquid and dirt through cavitation, acceleration and straight flow, so that the dirt layer is dispersed, emulsified and peeled off to achieve the cleaning purpose.

[0026] More specifically, the first cleaning process realizes simultaneous cleaning of the entire suction nozzle 10, that is, the suction nozzle body 11 and the reflector 12, and the second cleaning process realizes separate cleaning of the suction nozzle front end 110 of the suction nozzle body 11. In the two steps, in the first cleaning process, the ultrasonic generator 30 performs ultrasonic cleaning on the reflector 12 at the first cleaning frequency. At the same time, since the suction nozzle front end 110 is downward and is also placed in the cleaning liquid, that is, in the first cleaning process, the suction nozzle front end 110 of the suction nozzle body 11 is also ultrasonically cleaned. In this step, the suction nozzle front end 110 is ultrasonically cleaned once, that is, the suction nozzle front end 110 of the suction nozzle body 11 is completed in the first cleaning process. In the second cleaning process, only the suction nozzle front end 110 is placed in the cleaning liquid for ultrasonic cleaning, that is, the second cleaning of the suction nozzle front end 110 is completed in the second cleaning process. Since the nozzle 10 is blocked mainly in the nozzle body 11, especially the front end 110 of the nozzle, the nozzle body 11 is cleaned in both steps of cleaning in the embodiment of the present invention, so the cleaning effect is better than that in the prior art. However, since the reflector 12 and the nozzle body 11 are bonded by glue, if the reflector 12 is cleaned at the ultrasonic cleaning frequency of the conventional ultrasonic cleaning method, it will cause the reflector 12 to separate from the nozzle body 11. The prior art does not use ultrasonic cleaning to clean the reflector 12. However, the applicant of the present invention innovatively uses ultrasonic cleaning of the nozzle body 11 and the reflector 12. Therefore, in order to overcome the technical difficulties in the prior art, in the nozzle 10 cleaning method of the embodiment of the present invention, the problem of the reflector 12 falling off caused by ultrasonic cleaning is solved by adjusting the water level, cleaning frequency and cleaning time in the two-step cleaning process. More specifically, in the embodiment of the present invention, the first cleaning frequency in the first cleaning process is less than the second cleaning frequency in the second cleaning process, and the first time in the first cleaning process is also less than the second time in the second cleaning process. As for the second cleaning frequency and the second duration, no specific description or limitation is given. For example, it can be selected to be consistent with or slightly less than the ultrasonic frequency and duration in the existing ultrasonic cleaning process of the nozzle body 11. As for the first cleaning frequency and the first duration, the applicant has found that the first cleaning frequency should not be greater than eight-elevenths of the second cleaning frequency, and the first duration should not be greater than one-thirty-sixth of the second duration. Such a design can ensure that the reflector 12 and the nozzle body are well cleaned. If the first cleaning frequency is too high or the first duration is too long, the reflector 12 and the nozzle body 11 will fall off. If the first cleaning frequency is too low or the first duration is too short, the cleaning effect of the reflector 12 will be poor, and the cleaning effect of the nozzle body 11 will also be affected. If the cleaning effect of the nozzle body 11 is to be improved, the second duration needs to be extended, which will inevitably lead to a decrease in cleaning efficiency. For example, in an embodiment of the present invention, the first cleaning frequency in the first cleaning process is 28Hz and the first duration is 5s.The second cleaning frequency in the second cleaning process is 38.5 Hz, and the second duration is 180 seconds. The overall cleaning time is similar to the cleaning time of the nozzle body 11 in the prior art, but compared with the cleaning methods of ultrasonic cleaning of the nozzle body 11 and brush cleaning of the reflector 12 in the prior art, the cleaning time is reduced, and the cleaning effects of both the nozzle body 11 and the reflector 12 are better than the cleaning methods of ultrasonic cleaning of the nozzle body 11 and brush cleaning of the reflector 12 in the prior art.

[0027] According to some preferred embodiments of the present invention, a wear inspection process of the front end of the nozzle is also included before the first cleaning process. As an alternative embodiment, it can also be after the first cleaning process. As for the wear inspection process, the embodiment of the present invention abandons the prior art method of using an ordinary camera to collect 2D information and binarize and denoise the image, or using a 3D camera to collect 2D information and depth information for three-dimensional wear judgment, because although the former method is low in cost, the wear judgment accuracy is low, and the latter method is high in cost and the equipment occupies a large area. In an embodiment of the present invention, the wear is judged by comparing the length or area of ​​the projection of the nozzle 10 generated by the initial nozzle 101 and the nozzle 102 after use on the object 70 (optionally, for example, a measuring table with a scale). Specifically, in order to achieve the above purpose, as Figure 5 and Figure 6 As shown, a camera device 50 (which can be 2D or 3D, preferably 2D), a light source 60 and an object 70 are used to judge wear, wherein the camera device 50 is placed directly above the object 70, the light source 60 is arranged on the side of the camera device 50 and is located obliquely above the object 70, and the initial suction nozzle 101 and the suction nozzle 102 after use to be judged for wear are respectively placed on the side of the object 70 and are in the light path of the light source 60. The light source 60 irradiates the initial suction nozzle 101 and the suction nozzle 102 after use to be judged for wear, and a corresponding projection is formed on the surface of the object 70, and the three-dimensional information, that is, the height of the suction nozzle 10 ( Figure 6 H1 and H2, H1 represents the initial height of the nozzle 101, H2 represents the height of the nozzle 102 after use) information is converted into the length of the projection ( Figure 6In L1 and L2, L1 represents the horizontal length of the projection of the initial suction nozzle 101 on the surface of the object 70, and L2 represents the horizontal length of the projection of the suction nozzle 102 on the surface of the object 70 after use). It is only necessary to compare whether the horizontal lengths L1 and L2 of the projections of the initial suction nozzle 101 and the suction nozzle 102 after use are equal. If they are not equal, it can be determined that the suction nozzle 10 is worn. If the wear amount is to be quantified, that is, the wear amount is to be qualitatively judged, it can be further calculated and determined by the area difference (the inclination angle of the light source 60 can be adjusted so that the projection of the suction nozzle 10 on the surface of the object 70 is roughly a circle, and then the projection area is calculated by measuring the lengths L1 and L2) or the projection length difference is converted into a wear height difference and then the wear amount is calculated. A specific description is not given here. The use of a camera device 50 (preferably 2D) has a lower cost than the 3D camera in the prior art. By changing the position of the light source 60 (generally at the bottom of the object 70 in the prior art), the wear inspection method is simpler and the accuracy judgment is more accurate. The tilt angle of the light source 60 is not specifically described or limited, and can be selected to be 60° or 45° with the horizontal plane, and can be selected and adjusted according to the actual situation. The camera device 50 can be an existing conventional ordinary 2D camera, and the height of the camera device 50 from the surface of the object 70 is not described or limited, and can be selected according to the actual situation, with the projection contour captured being clear.

[0028] According to some preferred embodiments of the present invention, a cleanliness inspection process is further included after the first cleaning process and the second cleaning process, wherein the cleanliness inspection process adopts a conventional video detection method in the prior art, which will not be described or limited in detail.

[0029] See also Figures 1 to 7, the embodiment of the present invention also provides an SMT nozzle cleaning device, which can be selected as an existing SMT nozzle cleaning and inspection all-in-one machine. For the specific structure, please refer to the patents previously applied for and announced by the applicant with patent document numbers CN116495438A, CN220033165U, CN219771139U, and CN219273811U. The difference is that the reflector cleaning mechanism with a brush structure disclosed in the above patents is removed. Specifically, the SMT nozzle cleaning device of the embodiment of the present invention mainly includes at least one cleaning tank 20 with a liquid cavity, at least one cleaning table 40 with multiple fixing holes 41, and at least one ultrasonic generator 30. The number of cleaning tanks 20 in the embodiment of the present invention is exemplified as two, and the two cleaning tanks 20 are arranged side by side at the feeding end of the feeding mechanism 80 (see CN220033165U for the specific structure) in the existing device. An ultrasonic generator 30 (an existing multi-frequency ultrasonic generator 30 with a built-in controller for automatically adjusting the frequency) is correspondingly provided at the bottom of any cleaning tank 20. The cleaning table 40 is used to fix and place the suction nozzle 10 to be cleaned. The cleaning table 40 is fixed in the liquid cavity of the cleaning tank 20 or can be moved up and down in the liquid cavity of the cleaning tank 20. Figure 4 As shown, the cleaning table 40 is provided with a plurality of fixed holes 41 arranged in an array, and the apertures of each group of fixed holes 41 are inconsistent. The specific apertures of the fixed holes 41 are adaptively designed according to the structure of the existing specifications of the suction nozzle 10 (it should be noted that, in order to facilitate the distinction of suction nozzles 10 of different specifications, generally, there are marks such as QR codes, characters, etc. on the suction nozzle 10), so the specific aperture is not specifically described and limited here, and it can be applicable to the structure of suction nozzles 10 of various specifications, so that suction nozzles 10 of various specifications can be cleaned simultaneously, thereby improving the cleaning efficiency. A support table 21 is provided in the cleaning tank 20, which is horizontally fixed or can be lifted and lowered along the liquid cavity of the cleaning tank 20. The support table 21 is used to support the cleaning table 40 and the support table 21 is a flat plate with a plurality of hollow portions 211 in the middle. The hollow portions 211 are provided so that the cleaning liquid can immerse the upper surface of the cleaning table 40 on the support table 21 and the reflector 12 on the cleaning table 40 when the cleaning liquid is at the first water level. The support platform 21 can be directly fixed in the cleaning tank 20 or slidably connected to the inner wall of the cleaning tank 20. It should be noted that a pipeline connecting the liquid cavity of the cleaning tank 20 and the cleaning liquid source can be set at the bottom of the cleaning tank 20, and a switch valve is set at the connection between the pipeline and the cleaning tank 20. For the cleaning tank 20, in order to prevent foreign objects from falling into the cleaning tank 20 and causing the cleaning liquid to be contaminated, such as Figure 2As shown, a cover plate 22 is also provided at the top opening of the cleaning tank 20, and the cover plate 22 is slidably arranged on the top opening of the cleaning tank 20. In the embodiment of the present invention, the cover plate 22 is opened or closed by sliding along the width direction of the cleaning tank 20. In order to realize the sliding connection between the cover plate 22 and the cleaning tank 20, a driving member 23 (exemplarily a hydraulic cylinder or a cylinder) is provided on the side of the cleaning tank 20, which is telescopic along the sliding direction of the cover plate 22. The driving end of the driving member 23 is movable and connected to the cover plate 22. A sliding part (not shown, such as a slide groove or a slide rail) that slides with the top surface or side surface of the cover plate 22 is provided on the top opening surface of the cleaning tank 20. The cover plate 22 is automatically opened or closed.

[0030] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A method for cleaning an SMT nozzle, characterized in that: The following steps are involved: Place the nozzle to be cleaned on a cleaning table with multiple fixing holes and with the front end of the nozzle facing downward, and place the cleaning table into a cleaning tank filled with cleaning liquid; The cleaning table reaches the first water level first, when the cleaning liquid covers the cleaning table and the reflector, and then the cleaning table reaches the second water level, when the cleaning liquid covers the front end of the suction nozzle and does not contact the reflector; or the cleaning table reaches the second water level first, when the cleaning liquid covers the front end of the suction nozzle and does not contact the reflector, and then the cleaning table reaches the first water level, the first water level is higher than the second water level, when the cleaning liquid covers the cleaning table and the reflector; A first cleaning process is performed at a first water level, and cleaning is performed at a first cleaning frequency for a first time. A second cleaning process is performed at a second water level, and cleaning is performed at a second cleaning frequency for a second time. The first cleaning frequency is less than the second cleaning frequency, and the first time is less than the second time.

2. The method according to claim 1, characterized in that The cleaning tank is not pre-filled with cleaning liquid. The cleaning table is first fixed horizontally in the tank of the cleaning tank, and then the cleaning liquid is injected into the tank of the cleaning tank; The cleaning liquid first reaches the first water level and then drops to the second water level; or the cleaning liquid first reaches the second water level and then rises to the first water level.

3. The method according to claim 1 or 2, characterized in that: The first cleaning process and the second cleaning process both use ultrasonic cleaning.

4. The method according to claim 3, characterized in that An ultrasonic generating device is arranged at the bottom of the cleaning tank.

5. The method according to claim 1 or 2, characterized in that: A wear inspection step of the nozzle tip is also included before or after the first cleaning step.

6. The method according to claim 5, characterized in that In the wear inspection process of the front end of the suction nozzle, the length or area of ​​the nozzle projection produced on the object by the initial suction nozzle and the suction nozzle after use is compared; Among them, a camera device and a light source are used during the inspection process. The camera device is arranged directly above the object, and the light source is located on the side of the camera device and arranged diagonally above the object. During the inspection process, the initial suction nozzle and the suction nozzle after use are respectively located on the side of the object and on the light path of the light source.

7. The method according to any one of claims 1 to 6, characterized in that: A cleanliness inspection process is included after the first cleaning process and after the second cleaning process.

8. An SMT nozzle cleaning device, characterized in that: The invention comprises at least one cleaning tank having a liquid cavity therein, at least one cleaning table having a plurality of fixing holes therein and at least one ultrasonic generator, wherein one ultrasonic generator is correspondingly provided at the bottom of any of the cleaning tanks, the cleaning table is used for fixing and placing a suction nozzle to be cleaned, the cleaning table is fixed in the liquid cavity of the cleaning tank or the cleaning table can be lifted and lowered in the liquid cavity of the cleaning tank, the ultrasonic generator is used for performing a first cleaning process when the cleaning liquid in the cleaning tank is at a first water level and performing a second cleaning process when the cleaning liquid is at a second water level, the first water level is higher than the second water level, the cleaning liquid submerges the cleaning table and the reflector at the first water level, the cleaning liquid submerges the front end of the suction nozzle and does not contact the reflector at the second water level, the first cleaning process is cleaned at a first cleaning frequency for a first time, the second cleaning process is cleaned at a second cleaning frequency for a second time, the first cleaning frequency is less than the second cleaning frequency, and the first time length is less than the second time length.

9. The device according to claim 8, characterized in that The fixing holes on any of the cleaning tables include a plurality of fixing holes with different apertures.

10. The device according to claim 8 or 9, characterized in that The cleaning device further comprises a support platform which is fixed horizontally in the cleaning tank or can be moved up and down along the liquid cavity of the cleaning tank for supporting the cleaning platform, and the support platform is provided with a plurality of hollow parts distributed at intervals; and / or A cover plate that can be slidably opened and closed is provided on the top opening of the cleaning tank, a driving member that can be extended and retracted along the sliding direction of the cover plate is provided on the side of the cleaning tank, a driving end of the driving member is connected to the cover plate, and a sliding part for sliding cooperation with the cover plate is provided on the top opening of the cleaning tank.

Images