Stamping equipment and stamping method

Abstract

The invention provides stamping equipment and a stamping method. The invention provides stamping equipment. The stamping equipment comprises a stamping die, a punch and an air supply system. The punch is arranged above the stamping die; a through hole matched with the punch is formed in the stamping die; a gas channel and a gas containing cavity communicated with the gas channel are formed in the punch, and the punching face, facing the die, of the gas containing cavity is a plane with a micropore array. The punch is used for punching a to-be-punched plate when the to-be-punched plate is placed on the punching die, so that the to-be-punched plate enters the through hole, and a punching part matched with the through hole is formed; the gas supply system communicates with the gas channel and is used for providing gas for the punch after stamping is finished, so that the gas enters the gas containing cavity through the gas channel and evenly overflows through the micropore array on the stamping face, and the stamping part is separated from the stamping face through the overflowed gas. According to the stamping equipment and the stamping method provided by the invention, the stamping part formed by stamping can be prevented from being adhered to the stamping surface.

Description

Technical Field

[0001] The present application relates to the field of stamping manufacturing technology, and in particular to a stamping device and a stamping method. Background Art

[0002] Solder preforms and thermal interface material preforms have a wide range of applications in advanced electronic packaging, where they provide reliable electrical connections and efficient thermal management for electronic devices. For example, solder preforms ensure consistent and high-quality electrical connections, playing a significant role in ensuring the long-term performance of key components such as central processing units (CPUs) and graphics processing units (GPUs). At the same time, thermal interface material preforms facilitate effective heat transfer between components, for example, from semiconductor chips to heat sinks, which can effectively prevent overheating and ensure reliable device performance. Both types of preforms contribute significantly to the efficiency and stability of advanced electronic systems and have great production demand.

[0003] However, a common problem during preform production is that the preform may stick to the punch, causing it to be punched again together with the next preform, resulting in overlapping parts, resulting in the production of double-thick preforms, causing equipment failure during use and other problems. Summary of the invention

[0004] In view of this, the present application provides a stamping device and a stamping method to solve the problem that stamping parts and punches are prone to adhesion.

[0005] Specifically, the present application is implemented through the following technical solutions:

[0006] In a first aspect, the present application provides a stamping device, comprising a punch, a stamping die and an air supply system; the punch is arranged above the stamping die; the stamping die is provided with a through hole matching the punch;

[0007] The punch has a gas channel and a gas containing cavity connected to the gas channel, and the stamping surface of the gas containing cavity facing the die is a plane with a micropore array; the punch is used to punch the sheet to be punched when a sheet to be punched is placed on the stamping die, so that the sheet to be punched enters the through hole to form a stamped part matching the through hole;

[0008] The gas supply system is connected to the gas channel and is used to provide gas to the punch after the stamping is completed, so that the gas enters the gas containing cavity through the gas channel and then overflows evenly through the micropore array on the stamping surface, so that the stamping part is separated from the stamping surface by the overflowing gas.

[0009] A second aspect of the present application provides a stamping method, which is implemented based on any stamping device provided in the first aspect of the present application, and the stamping method includes:

[0010] Place the sheet to be stamped on the stamping die;

[0011] Using a punch to punch the sheet to be punched, so that the sheet to be punched enters the through hole on the punching die to form a stamped part matching the through hole;

[0012] After the punching is completed, gas is provided to the punch so that the gas overflows through the micropore array on the punching surface of the punch, so that the punched part is separated from the punching surface by the overflowing gas.

[0013] The stamping equipment and stamping method provided in the present application are provided with a gas supply system, and a gas channel, a gas containing cavity connected to the gas channel, and a micropore array on the stamping surface of the mold facing the gas containing cavity. In this way, the gas channel and the gas containing cavity inside the punch enable the gas supply system to quickly provide gas after the stamping is completed, and the gas overflows evenly through the micropore array, thereby quickly separating the stamped parts from the stamping surface, avoiding adhesion, and improving production efficiency; in addition, through the micropore array, the gas can be released evenly, which can not only achieve the purpose of separating the stamped parts and the punch, but also reduce the mechanical pulling or friction on the stamped parts, reduce the possibility of surface damage to the stamped parts, and ensure the integrity and precision of the stamped parts; further, through the above-mentioned settings, the stamped parts and the punch can be automatically separated, which can reduce the need for manual operation and manual intervention, thereby achieving a higher degree of automation and saving labor costs; in addition, the micropore array can adjust the gas flow and distribution, so that the stamping equipment can be suitable for stamping plates of different thicknesses and materials, thereby increasing the versatility and flexibility of the stamping equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of a first embodiment of a stamping device provided in the present application;

[0015] Figure 2 It is a schematic diagram of the implementation principle of the continuous stamping process in which the adhesion phenomenon occurs in the prior art;

[0016] Figure 3 This is a schematic diagram showing a continuous stamping operation under ideal conditions according to an exemplary embodiment of the present application;

[0017] Figure 4 A schematic diagram of a second embodiment of the stamping equipment provided in this application;

[0018] Figure 5 A schematic diagram of a third embodiment of the stamping equipment provided in this application;

[0019] Figure 6 A schematic diagram of a fourth embodiment of the stamping equipment provided in this application;

[0020] Figure 7 This is a flow chart of Example 1 of the stamping method provided in this application.

[0021] Description of reference numerals:

[0022] 1: Punch;

[0023] 11: Gas channel;

[0024] 12: gas containing chamber;

[0025] 13: Microwell Array

[0026] 2: Stamping die;

[0027] 21: Through hole

[0028] 3: Gas supply system;

[0029] 31: Airbag;

[0030] 32: U-shaped trachea;

[0031] 33: Extruded plate;

[0032] 4: Sheet to be stamped;

[0033] 5: Stamping parts;

[0034] 6: Receiver board;

[0035] 61: Flexible surface. DETAILED DESCRIPTION

[0036] Here, exemplary embodiments are described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application.

[0037] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in this article refers to and includes any or all possible combinations of one or more associated listed items.

[0038] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0039] In a complex industrial production environment, stamping equipment usually needs to process multiple types of sheets to be stamped to obtain multiple types of stamped parts. Due to the large-scale demand for products, it is necessary to ensure continuous and rapid stamping production without adhesion between the stamping equipment and the sheets to be stamped.

[0040] In particular, in the production process of stamping parts such as solder preforms and interface heat dissipation material preforms, the sheet to be stamped is formed by the high-pressure stamping of the punch into the through hole on the mold. At this time, since the material of the solder sheet is relatively soft, the surface oxide layer on the sheet to be stamped is easily destroyed under the high-intensity pressure generated by the punch, thereby exposing the internal active metal surface, causing the produced preform to adhere to the punch, affecting the subsequent normal demolding operation, and thus causing problems in the production process. For example, in one possible case, when the preform adheres to the punch, in the next stamping process, the punch and the preform are stamped together, causing the preform adhered to the punch to adhere to the preform produced in the next stamping process. In this way, the thickness of the final preform produced may be twice that of the original planned production. The double-thick preform caused by the adhesion problem is difficult to detect. If the double-thick preform product is used in electronic assembly, major problems are likely to occur. Therefore, how to prevent the stamping parts from sticking to the punch has become an urgent problem to be solved in the production of preforms.

[0041] The present application provides a stamping device and method for solving the problem that stamping parts and punches are prone to adhesion.

[0042] Specific embodiments are given below to introduce the technical solution of the present application in detail.

[0043] Figure 1 This is a schematic diagram of the first embodiment of the stamping equipment provided in this application. Please refer to Figure 1 The stamping equipment provided in this embodiment may include a punch 1, a stamping die 2 and an air supply system 3; the punch 1 is arranged above the stamping die 2; the stamping die 2 is provided with a through hole matching the punch 1;

[0044] The punch 1 has a gas channel 11 inside and a gas containing cavity 12 connected to the gas channel 11, and the stamping surface of the gas containing cavity 12 facing the die is a plane with a micropore array 13; the punch 1 is used to punch the sheet 4 to be punched when a sheet 4 to be punched is placed on the punching die 2, so that the sheet 4 to be punched enters the through hole to form a stamping part 5 matching the through hole;

[0045] The gas supply system 3 is connected to the gas channel 11, and is used to provide gas to the punch 1 after the stamping is completed, so that the gas enters the gas containing chamber 12 through the gas channel 11, and then overflows evenly through the micropore array 13 on the stamping surface, so that the stamping part 5 is separated from the stamping surface by the overflowing gas.

[0046] It should be noted that the stamping equipment provided in this embodiment can be used to prepare solder preforms or interface heat dissipation material preforms through a stamping process.

[0047] Specifically, the stamping equipment can be used to stamp different sheets to be stamped to obtain different stamped parts, which is not limited in this application. For example, in one embodiment, the sheet to be stamped is tin-based solder or lead-based solder, and the stamping equipment can be used to stamp out a solder preform; for another example, in another embodiment, the sheet to be stamped is an indium sheet, and the stamping equipment can be used to stamp out an interface heat dissipation material preform.

[0048] It should be noted that Figure 2 The following is a schematic diagram of the implementation principle of the continuous stamping process in the prior art in which adhesion occurs. Figure 3 This is a schematic diagram showing the implementation principle of a continuous stamping operation under ideal conditions according to an exemplary embodiment of the present application.

[0049] Specifically, in Figure 2 In the figure (A), the sheet 4 to be punched is placed on the punching die 2, and the punch 1 is ready to perform a punching operation on the sheet 4 to be punched; however, in the figure (B), when the punch 1 punches the sheet 4 to be punched, the formed stamped part 5 does not separate from the punch 1 and does not fall off, but adheres to the punch 1; further, in Figure 2 In the figure (C) shown in FIG, the stamping part 5 is adhered to the punch 1 and is lifted together with the punch 1, and the sheet material 4 to be stamped below then moves to the right; Figure 2As shown in Figure (D), after the sheet 4 to be stamped is moved to the specified position, the punch 1 performs the stamping operation together with the adhered stamping part 5. The stamping part 5 adhered to the punch 1 will further adhere to the newly stamped stamping part 5. In this way, the thickness of the stamping part 5 finally produced is twice the preset required thickness of the stamping part. If the stamping part 5 with twice the thickness is used in the equipment, it is easy to cause damage to the equipment.

[0050] Referring to the previous description, if the stamped parts obtained can be smoothly separated from the punch after each stamping operation of the stamping equipment, the occurrence of adhesion can be effectively avoided. Therefore, the present application provides a stamping equipment to solve the above problem.

[0051] For further information, please refer to Figure 3 ,exist Figure 3 In the example (A) shown, the sheet 4 to be stamped is placed on the stamping die 2, and the punch 1 is ready to perform a stamping operation on the sheet 4 to be stamped; in (B), the punch 1 stamps the sheet 4 to be stamped, and the formed stamped part 5 is separated from the punch 1; in (C), the punch 1 is lifted, and the sheet 4 to be stamped moves to the right; in (D), the punch 1 is lifted to a specified position, ready for the next stamping operation. In this case, in the continuous stamping operation process, each time the punch 1 punches the sheet 4 to be stamped, the stamped part 5 obtained can be smoothly separated from the punch 1, and then the punch 1 is lifted, and the sheet 4 to be stamped moves to a specified position, and the next stamping operation can be performed. By continuously performing the above operations, the stamping equipment can be used to stamp the required stamped parts 5 in a stable and efficient manner.

[0052] The following is a detailed description of the stamping equipment provided in this embodiment. Figure 1 The stamping equipment provided in this embodiment includes a stamping die 2, a punch 1 and an air supply system 3, wherein the punch 1 is arranged above the stamping die 2, and a through hole matching the punch 1 is arranged on the stamping die 2, so that when the sheet 4 to be stamped is placed on the stamping die 2, the punch 1 stamps the sheet 4 to be stamped, and the sheet 4 to be stamped under the punch 1 can enter the through hole to obtain a stamping part 5 matching the through hole; at the same time, a gas accommodating chamber 12 and a gas channel 11 connected thereto are also arranged inside the punch 1, and the gas channel 11 is connected to the air supply system 3, and further, a micropore array 13 is provided on the stamping surface of the gas accommodating chamber 12 facing the stamping die 2, and after each stamping is completed, the gas supply system 3 provides gas to the punch 1, and the gas reaches the gas accommodating chamber 12 along the gas channel 11, and evenly overflows from the micropore array 13 on the stamping surface, and the overflowing gas causes the stamping part 5 to be separated from the punch 1.

[0053] Optionally, in a possible implementation, the punch 1 is processed by any one of the following methods: CNC machining, electric spark machining and laser drilling technology.

[0054] In specific implementation, different processing methods can be selected to make the punch according to the different materials of the sheet 4 to be punched, and this application does not limit it. For example, in one embodiment, when a punch with higher precision is required, CNC processing can be selected; in another embodiment, when a sheet 4 to be punched with high hardness needs to be punched, an electric spark process can be used to make the punch; in one embodiment, when a sheet 4 to be punched that is not suitable for traditional cutting needs to be punched, a laser drilling technology can be used to make the punch.

[0055] Specifically, the specific shape of the through hole on the stamping die 2 depends on the requirements of the stamping part 5. For example, when a rectangular stamping part 5 needs to be punched, the through hole is rectangular. In addition, it is necessary to ensure that the edge of the through hole is smooth to reduce friction and burr formation during stamping.

[0056] Furthermore, a gas channel 11 and a gas containing chamber 12 are provided inside the punch 1; wherein the gas channel 11 is used to connect the gas supply system 3 to transmit the gas to the gas containing chamber 12. The gas containing chamber 12 is located near the stamping surface of the punch 1. The gas containing chamber 12 is used as a gas distribution and buffer area to ensure that the gas overflows evenly when passing through the micropore array 13 on the stamping surface. Furthermore, the stamping surface of the punch 1 is a planar structure, on which a uniformly distributed micropore array 13 is arranged. The micropore array 13 is composed of a plurality of micropores, which allow the gas to overflow evenly after the stamping is completed, so as to separate the stamping part 5 from the stamping surface by gas pressure, and avoid adhesion or deformation of the workpiece. After the stamping is completed, the gas supply system 3 transports gas to the gas channel 11, and the gas is diffused through the gas containing chamber 12 and then released evenly through the micropore array 13, forming an air cushion effect, effectively separating the stamping part 5 and the stamping surface.

[0057] It should be noted that the arrangement of the plurality of micropores in the micropore array 13 is set according to actual needs and is not limited in this embodiment. For example, in one embodiment, the plurality of micropores are arranged in a grid form at a uniform spacing; in another embodiment, the plurality of micropores are distributed radially or concentrically with the center of the circle as the reference; in another embodiment, the plurality of micropores are arranged in a matrix form.

[0058] Further, the shape of each hole in the micro-hole array 13 on the stamping surface can be any of the following forms of holes: circular holes, slot holes, triangular holes, hexagonal holes and star holes. It should be noted that the shapes of the holes in the micro-hole array 13 on the stamping surface can be completely the same, or can be composed of holes of different shapes, which is not limited in the present application.

[0059] It can be understood that circular holes are the simplest and most common shape, which can provide uniform airflow, are easy to process, and provide consistent air distribution. Further, slotted holes can provide a wider coverage area and allow air to be directed more effectively to a larger portion of the stamping. Triangular holes are useful for directing airflow in a specific direction. For example, through triangular holes, airflow can be directed to the edge of the stamping to prevent sticking at the boundary. The honeycomb pattern of hexagonal holes helps to evenly distribute air while maintaining structural integrity. In addition, this pattern can also provide higher mechanical strength to the punch. Star-shaped holes can help distribute air radially, producing more effective removal forces, especially in areas that are more prone to cold welding.

[0060] In addition, the specific type of gas that the gas supply system 3 can provide is also set according to actual needs, and is not limited in this embodiment. For example, in a possible implementation, the gas that the gas supply system 3 can provide can be any of the following gases: air, nitrogen, oxygen, argon, carbon dioxide, helium, neon, krypton, etc.

[0061] Referring to the previous description, by arranging a gas channel 11 and a gas containing cavity 12 on the punch 1 and arranging a micropore array 13 on the stamping surface, during the stamping operation, at the end of the stamping stroke, a controlled airflow is blown out through the micropore array 13. This airflow burst effectively pushes out any stamping parts 5 that may be adhered to the surface of the punch 1, thereby preventing the possibility of two stamping parts 5 being stamped together.

[0062] The stamping equipment provided in this embodiment is provided with a gas supply system, and a gas channel, a gas containing cavity connected to the gas channel, and a micropore array on the stamping surface of the mold facing the gas containing cavity. In this way, the gas channel and the gas containing cavity inside the punch enable the gas supply system to quickly provide gas after the stamping is completed, and the gas overflows evenly through the micropore array, thereby quickly separating the stamped parts from the stamping surface, avoiding adhesion, and improving production efficiency; in addition, the micropore array can be used to release gas evenly, which can not only achieve the purpose of separating the stamped parts and the punch, but also reduce the mechanical pulling or friction on the stamped parts, reduce the possibility of surface damage to the stamped parts, and ensure the integrity and precision of the stamped parts; further, through the above-mentioned settings, the stamped parts and the punch can be automatically separated, which can reduce the need for manual operation and manual intervention, thereby achieving a higher degree of automation and saving labor costs; in addition, the micropore array can adjust the gas flow and distribution, so that the stamping equipment can be suitable for stamping plates of different thicknesses and materials, thereby increasing the versatility and flexibility of the stamping equipment.

[0063] Two more specific embodiments are given below to illustrate the technical solution of the present application in detail. Figure 4For a schematic diagram of the second embodiment of the stamping equipment provided in this application, please refer to Figure 4 , based on the above embodiment, the stamping equipment provided in this embodiment, the air supply system 3 includes a controller (not shown in the figure), an air supply device, a dehumidifier and a controlled valve;

[0064] Wherein, the air supply device is connected to the dehumidifier; the dehumidifier is connected to the gas channel 11; the controlled valve is arranged on the connecting passage between the dehumidifier and the gas channel 11;

[0065] The controller is electrically connected to the controlled valve; the controller is used to control the controlled valve to open at the end of stamping, and control the controlled valve to open for a specified period of time so that the air provided by the air supply device enters the gas channel 11; wherein the pressure of the air provided by the air supply device is controllable.

[0066] For details, please continue to refer to Figure 4 In this embodiment, the air supply system 3 is an air supply system that can actively control the air intensity and time. After the punch 1 completes the stamping operation, the controlled valve is controlled by the controller, and the air supply device in the air supply system 3 provides gas. The gas enters the gas containing chamber 12 along the gas channel 11, and then overflows evenly from the micropore array 13 on the stamping surface to promote the separation of the stamping part 5 and the punch 1.

[0067] Furthermore, the specific type of the air supply device is selected according to actual needs, and is not limited in the present application. For example, in one embodiment, the air supply device is an air compressor; in one embodiment, the air supply device is an air supply station; in one embodiment, the air supply device is an air storage tank. It should be noted that no matter whether the air supply device is an air compressor, an air supply station, or an air storage tank, the air pressure of the provided gas can be controlled, so that it can be ensured that the pressure generated can meet the requirements for separating the stamping part 5 from the punch 1. It can be understood that when releasing gas to stamping parts 5 of different materials and thicknesses to separate them from the punch 1, it is necessary to accurately control the pressure of the exhaust gas so that the stamping part 5 can be separated from the punch 1 without causing damage or deformation to the stamping part 5.

[0068] It should be noted that the gas provided by the air supply equipment may contain moisture. When the stamping part 5 and the punch 1 are separated, the moisture therein may cause corrosion to the stamping part 5, resulting in reduced performance of the stamping part 5. Therefore, a dehumidifier can be installed between the air compressor and the controlled valve. The dehumidifier is connected to the gas channel 11, and the controlled valve is connected to the connecting passage between the dehumidifier and the gas channel 11. In this way, after the gas in the gas supply equipment is discharged, the dehumidifier removes the moisture in the discharged gas to ensure that the gas entering the gas channel 11 is dry gas and will not cause corrosion to the stamping part 5. The controlled valve installed between the gas channel 11 and the dehumidifier can also ensure precise control of the gas discharge time, thereby forming a controllable and adjustable gas after dehumidification.

[0069] It should be noted that the pressure of the gas should be sufficient to release the bonded stamping part 5 without causing damage or deformation of the stamping part 5. The specific pressure of the gas is set according to the material and thickness of the stamping part 5, and is not limited in this embodiment. For example, in one embodiment, the pressure of the gas is 0.1Pa to 1.0Pa.

[0070] Referring to the previous description, the stamping equipment provided in this embodiment, by setting a controller, an air supply device, a dehumidifier and a controlled valve in the air supply system, the air supply device can control the pressure of the provided gas, and the controller can control the controlled valve to accurately control the time of exhausting the gas. In this way, the gas pressure and gas exhaust time can be controlled according to different stamping parts, and the punch and the stamping parts can be smoothly separated without damaging the stamping parts. Furthermore, by setting a dehumidifier, the air provided by the air supply device can be dehumidified to remove moisture in the provided gas and prevent corrosion to the stamping parts. In this way, not only can the precise control of the separation operation of the punch and the stamping parts be achieved, but also the product quality of the stamping parts can be guaranteed.

[0071] Furthermore, Figure 5 This is a schematic diagram of the third embodiment of the stamping equipment provided in this application, wherein: Figure 5 Figure (A) is a schematic diagram of the gas supply system 3 when the gas is not released; Figure 5 Figure (B) is a schematic diagram of the gas supply system 3 in the gas release state. Figure 5 On the basis of the above-mentioned embodiment, the stamping equipment provided in this embodiment, the air supply system 3 includes an air bag 31, a U-shaped air pipe 32 and an extrusion plate 33; the air bag 31 is connected with the gas channel 11 through the U-shaped air pipe 32, and the extrusion plate 33 is arranged at a specified distance below the air bag 31;

[0072] In which, during the stamping process, the airbag 31 moves with the punch 1, and when the punch 1 reaches the stamping end position, the airbag 31 contacts the extrusion plate 33 and is squeezed by the extrusion plate 33. The extrusion force applied by the extrusion plate 33 to the airbag 31 releases the gas in the airbag 31 and overflows through the punch 1.

[0073] Please continue to refer to Figure 5 The air supply system 3 includes an air bag 31 and a squeeze plate 33; the air bag 31 and the gas channel 11 on the punch 1 are connected through a U-shaped air pipe 32. Further, a squeeze plate 33 is provided below the air bag 31. When the punch 1 moves downward and reaches a certain point, the air bag 31 begins to compress. At the end of the stroke, the air bag 31 is completely squeezed to release the air. The air supply system 3 provides an air burst without the need for an external compressed air source, effectively removing the stamping part 5.

[0074] For details, see Figure 5 As shown in Figure (B), it can be understood that as the punch 1 continues to press down, the airbag 31 connected to the gas channel 11 also moves downward continuously, and contacts and squeezes the extrusion plate 33, causing the gas inside the airbag 31 to overflow from the punch 1 along the gas channel 11, so that the stamping part 5 adhered to the punch 1 is separated. Furthermore, as the next stamping operation proceeds, the punch 1 gradually rises, and the airbag 31 is refilled with gas, so that the stamping part 5 can be blown after the next stamping operation to separate it from the punch 1.

[0075] It should be noted that, in contrast to the previous actively controlled air supply system, in this embodiment, the air supply system passively discharges gas as the punch is pressed downward to supply air to the stamping parts. This design simplifies the overall design of the air supply system, and its synchronization with the movement of the punch also makes it more adaptable. In addition, air blowing is performed after each stamping operation, which can effectively remove the stamping parts stuck to the punch, ensure the smooth progress of the stamping operation, and improve the production efficiency of the stamping parts.

[0076] Optionally, in a possible implementation, the stamping device further includes a camera or an optical sensor;

[0077] Wherein, the camera or the optical sensor is used to detect whether the stamping part is adhered to the stamping surface of the punch when the stamping is completed.

[0078] Specifically, the stamping equipment provided in this embodiment can also be equipped with a camera or an optical sensor. In this way, when the camera or optical sensor finds that there are stamped parts adhered to the stamping surface of the punch, an alarm or prompt message can be issued to ensure that the stamped parts and the punch are effectively separated.

[0079] It should be noted that the installation position of the camera or optical sensor can be set according to actual needs and is not limited in this application.

[0080] The stamping equipment provided in this embodiment can monitor the bonding condition between the stamping parts and the punch in real time by adding a camera or an optical sensor at a suitable position, providing further guarantee for ensuring the separation of the stamping parts and the punch, and greatly improving the quality of the stamping parts products produced by the stamping equipment.

[0081] Optional, Figure 6 This is a schematic diagram of the fourth embodiment of the stamping equipment provided in this application. Please refer to Figure 6 On the basis of the above embodiment, the stamping equipment provided in this embodiment further includes a receiving plate 6; the receiving plate 6 is arranged below the through hole and is used to receive the stamping part 5;

[0082] The side of the receiving plate 6 facing the through hole is a flexible surface 61 to reduce the impact on the stamping part 5 .

[0083] Specifically, the flexible surface 61 may be a rubber surface or a silicone surface, which is not limited in this embodiment.

[0084] It should be noted that when the punch completes the stroke of the stamping action, the flexible surface can cushion the impact, reduce surface damage to the stamped parts and maintain the appearance and functional quality of the stamped parts.

[0085] The stamping equipment provided in this embodiment arranges a receiving plate below the through hole. After the punch performs a stamping operation on the sheet material to be stamped, the produced stamped parts fall onto the receiving plate below the through hole. The side of the receiving plate facing the through hole is a flexible surface. In this way, the appearance defects of the stamped parts can be minimized.

[0086] Optionally, the stamping surface has a coating; wherein the coating is made of any one of the following materials: Teflon, ceramic, graphite and molybdenum disulfide.

[0087] Specifically, a coating may be provided on the stamping surface while using the air burst to further prevent sticking. In addition, the stamping surface may be surface treated so that the stamping surface has a smooth, polished surface, which helps reduce friction and further minimizes the possibility of sticking.

[0088] Figure 7 Please refer to the flowchart of the first embodiment of the stamping method provided in this application. Figure 7 The stamping method provided in the present application is implemented based on any one of the stamping devices provided in the first aspect of the present application, and the stamping method includes:

[0089] S701, placing the sheet to be stamped on the stamping die.

[0090] S702, punching the sheet to be punched using a punch, so that the sheet to be punched enters the through hole on the punching die, and forming a stamped part matching the through hole.

[0091] S703, after the stamping is completed, supplying gas to the punch so that the gas overflows through the micropore array on the stamping surface of the punch, so that the stamped part is separated from the stamping surface by the overflowing gas.

[0092] The stamping method provided in this embodiment is realized by any one of the stamping equipment provided above, by placing the sheet to be stamped on the stamping die, and using the punch to stamp the sheet to be stamped so that the sheet to be stamped enters the through hole on the stamping die to form a stamped part matching the through hole, and then, gas is provided to the punch through the air supply system so that the provided gas overflows through the micropore array on the stamping surface of the punch, so that the stamping surface is separated from the stamped part. In this way, while ensuring the quality of the stamped parts produced, the adhesion of the stamped parts and the punch can be avoided, thereby avoiding the production of stamped parts with multiple times the predetermined thickness, and the efficiency and accuracy of stamped parts production can be improved.

[0093] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A stamping equipment, characterized in that: The stamping equipment comprises a punch, a stamping die and an air supply system; the punch is arranged above the stamping die; the stamping die is provided with a through hole matching the punch; The punch has a gas channel and a gas containing cavity connected to the gas channel, and the stamping surface of the gas containing cavity facing the stamping die is a plane with a micropore array; the punch is used to stamp the sheet to be stamped when a sheet to be stamped is placed on the stamping die, so that the sheet to be stamped enters the through hole to form a stamped part matching the through hole; The gas supply system is connected to the gas channel and is used to provide gas to the punch after the stamping is completed, so that the gas enters the gas containing cavity through the gas channel and then overflows evenly through the micropore array on the stamping surface, so that the stamping part is separated from the stamping surface by the overflowing gas.

2. The punching equipment according to claim 1, characterized in that: The air supply system includes a controller, air supply equipment, a dehumidifier and a controlled valve; Wherein, the air supply device is connected to the dehumidifier; the dehumidifier is connected to the gas channel; the controlled valve is arranged on the connecting passage between the dehumidifier and the gas channel; The controller is electrically connected to the controlled valve; the controller is used to control the controlled valve to open at the end of stamping, and control the controlled valve to open for a specified period of time so that the air provided by the air supply device can enter the gas channel; wherein the pressure of the air provided by the air supply device is controllable.

3. The stamping equipment according to claim 1, characterized in that The air supply system includes an air bag, a U-shaped air pipe and an extrusion plate; the air bag is connected to the gas channel through the U-shaped air pipe, and the extrusion plate is arranged at a specified distance below the air bag; In which, during the stamping process, the airbag moves with the punch, and when the punch reaches the stamping end position, the airbag contacts the extrusion plate and is squeezed by the extrusion plate. The extrusion force applied by the extrusion plate to the airbag causes the gas in the airbag to be released and overflow through the punch.

4. The stamping equipment according to claim 1, characterized in that The stamping equipment also includes a camera or an optical sensor; Wherein, the camera or the optical sensor is used to detect whether the stamping part is adhered to the stamping surface of the punch when the stamping is completed.

5. The stamping equipment according to claim 2, characterized in that: The air supply equipment is any of the following equipment: an air compressor, an air storage tank, and an air supply station.

6. The punching equipment according to claim 1, characterized in that The stamping surface is provided with a coating, wherein the coating is made of any one of the following materials: Teflon, ceramic, graphite and molybdenum disulfide.

7. The punching equipment according to claim 1, characterized in that The stamping equipment further includes a receiving plate; the receiving plate is arranged below the through hole and is used to receive the stamping part; Wherein, a surface of the receiving plate facing the through hole is a flexible surface to reduce the impact on the stamping part.

8. The punching equipment according to claim 1, characterized in that Each hole in the micro-hole array is in any of the following forms: a circular hole, a slotted hole, a triangular hole, a hexagonal hole and a star-shaped hole.

9. The punching equipment according to claim 1, characterized in that: The punch is processed by any of the following methods: numerical control processing, electric spark processing and laser drilling technology.

10. The punching equipment according to claim 1, characterized in that The stamping equipment is used for preparing solder preforms or interface heat dissipation material preforms through a stamping process.

11. A stamping method, characterized in that: The stamping method is implemented based on the stamping equipment according to any one of claims 1 to 10, and the stamping method comprises: Place the sheet to be stamped on the stamping die; Using a punch to punch the sheet to be punched, so that the sheet to be punched enters the through hole on the punching die to form a stamped part matching the through hole; After the punching is completed, gas is provided to the punch so that the gas overflows through the micropore array on the punching surface of the punch, so that the punched part is separated from the punching surface by the overflowing gas.

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