Silicon wafer new material cutting processing device

Abstract

The invention relates to the technical field of building material cutting, in particular to a silicon wafer new material cutting machining device. The cutting device comprises a base, a mounting frame and a machining table, a cutting mechanism is mounted on the mounting frame, a pushing mechanism is arranged at the top of the machining table and at least comprises a plurality of guide rods, a clamping mechanism is slidably connected to the guide rods, the clamping mechanism comprises a plurality of fixing parts, and the fixing parts are arranged on the base. A second spring is arranged between every two fixing pieces located on the same horizontal line. According to the silicon wafer new material cutting machining device, in the process that the pushing mechanism pushes the silicon wafer to be close to the cutting mechanism, the fixing pieces on the two sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line, the two fixing pieces close to each other are used for clamping the two sides of the cutting line of the silicon wafer, the clamping mechanism can reduce stress generated in the silicon wafer, and the cutting efficiency of the silicon wafer is improved. And the cutting mechanism is used for cutting the silicon wafers with fixed upper and lower parts and two sides of the cutting line into fixed lengths.

Description

Technical Field

[0001] The invention relates to the technical field of building material cutting, in particular to a silicon wafer new material cutting and processing device. Background Art

[0002] Solar photovoltaic tiles are a type of building material that combines the functions of solar power generation with those of traditional tiles. Its structure is usually based on traditional tiles, with integrated solar cells made of silicon wafers. This type of tile not only has the traditional building functions of shielding from wind and rain and protecting the roof, but also can generate electricity using solar energy.

[0003] In the production process of solar photovoltaic tiles, the cutting of silicon wafers is a key link. In order to adapt to the design and installation requirements of different buildings, silicon wafers need to be cut into various sizes. However, in the actual cutting operation, there are many difficulties. On the one hand, there is a dilemma in the fixing process of silicon wafers. If they are fixed too tightly, residual stress will remain inside the silicon wafer, causing serious quality problems such as cracking and warping of the silicon wafer, greatly shortening the service life of the silicon wafer and increasing production costs. Because the residual stress inside the silicon wafer will gradually accumulate and release under the influence of subsequent use and environmental factors, it may eventually cause the silicon wafer to lose its original performance and structural integrity. On the other hand, if the silicon wafer is fixed too loosely, it will cause the silicon wafer to be skewed during the cutting process, which will seriously affect the yield rate. Each skewed silicon wafer may become a defective product and fail to meet the quality standards of solar photovoltaic tiles, resulting in a large amount of waste, reducing production efficiency and economic benefits.

[0004] When fixing silicon wafers, the existing silicon wafer cutting devices usually place the silicon wafer to be cut in the fixing mechanism first, and then clamp the upper and lower surfaces of the silicon wafer and the two sides perpendicular to the cutting line. However, when clamping the silicon wafer, the existing clamping mechanism generally fixes the two sides of the silicon wafer by two fixing devices close to each other. This fixing method will cause stress concentration at the contact point between the silicon wafer and the fixing device at the moment the fixing device contacts the silicon wafer. For brittle materials such as silicon wafers, the stress-concentrated parts are prone to breakage, which seriously affects the production progress and quality control of solar photovoltaic tiles, and has become one of the technical bottlenecks that need to be solved in the development of the solar photovoltaic tile industry.

[0005] In view of this, we propose a new material cutting and processing device for silicon wafers to improve the deficiencies in the prior art. Summary of the invention

[0006] The purpose of the present invention is to provide a silicon wafer new material cutting and processing device to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides a new material cutting and processing device for silicon wafers, comprising a base, a mounting frame and a processing table, wherein a cutting mechanism is mounted on the mounting frame, a pushing mechanism is arranged on the top of the processing table, the pushing mechanism comprises at least a plurality of guide rods, a plurality of guide rods are slidably connected with a clamping mechanism, the clamping mechanism comprises a plurality of fixing members, and a second spring is arranged between two fixing members located on the same horizontal line;

[0008] Among them, the clamping mechanism is used to fix the upper and lower surfaces of the silicon wafer to be cut, and a cutting channel is provided between the two fixing members located on the same height plane. The pushing mechanism is used to push the silicon wafer whose upper and lower surfaces are fixed by the clamping mechanism toward the cutting mechanism. In the process of the pushing mechanism pushing the silicon wafer toward the cutting mechanism, the fixing members on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line. The two fixing members approaching each other are used to clamp both sides of the cutting line of the silicon wafer. The clamping mechanism can reduce the stress generated inside the silicon wafer. The cutting mechanism is used to cut the silicon wafer fixed at the top and bottom and on both sides of the cutting line into a fixed length.

[0009] As a further improvement of the present technical solution, the cutting mechanism includes a turntable rotatably connected to the same side of the mounting frame, and the outer peripheries of the two turntables are provided with a wire saw. The turntable is driven by a motor, and the motor is located on the side of the mounting frame away from the turntable, and one of the turntables is coaxially connected to the output shaft of the motor.

[0010] As a further improvement of the technical solution, a cutting groove is provided on the top of the processing table, and the wire saw passes through the cutting groove, and the direction in which the wire saw passes through the wire saw is perpendicular to the processing table and upward.

[0011] As a further improvement of the present technical solution, the pushing mechanism also includes a first bracket and a second bracket fixedly connected to the top of the processing table, the four corners of the first bracket and the second bracket are slidably connected to a guide rod, a plurality of hydraulic rods are provided on the first bracket, and the fixed part of each hydraulic rod is fixedly connected to the first bracket, a driving plate is provided between the first bracket and the second bracket, the driving plate is slidably connected to each guide rod, and the driving plate is fixedly connected to the movable part of each hydraulic rod.

[0012] As a further improvement of the present technical solution, the fixing member includes two limit plates slidably connected on the same vertical line, a plurality of limit rods are fixedly connected between the two limit plates, a pair of vertically distributed clamping arms are slidably connected to the plurality of limit rods, a plurality of first springs are arranged between each of the clamping arms and the adjacent limit plates, each first spring is sleeved on the periphery of the limit rod, and an adjusting rod is slidably connected between the two limit plates slidably connected to the same guide rod.

[0013] As a further improvement of the technical solution, each of the second springs is sleeved on the outer periphery of the guide rod, the second spring is located between two adjacent limit plates on the same horizontal line, and the two ends of the second spring are respectively fixedly connected to the two limit plates.

[0014] As a further improvement of the technical solution, the friction coefficient of the limit plate close to the driving plate is greater than the friction coefficient of the limit plate far from the driving plate, and the friction between the driving plate and the guide rod is greater than the friction between the silicon wafer and the clamping arm.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the silicon wafer new material cutting and processing device, a clamping mechanism is provided to fix the upper and lower surfaces of the silicon wafer to be cut, a cutting channel is provided between two fixing parts located on the same height plane, and a pushing mechanism is used to push the silicon wafer fixed by the clamping mechanism on the upper and lower surfaces toward the cutting mechanism.

[0017] 2. In the silicon wafer new material cutting and processing device, when the pushing mechanism pushes the silicon wafer close to the cutting mechanism, the fixing parts on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line. The two fixing parts close to each other are used to clamp the two sides of the cutting line of the silicon wafer. The clamping mechanism can reduce the stress generated inside the silicon wafer. The cutting mechanism is used to cut the silicon wafer fixed at the top and bottom and on both sides of the cutting line into a fixed length. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 A three-dimensional diagram of the cutting mechanism of the present invention;

[0020] Figure 3 It is a front view showing the positional relationship between the pushing mechanism and the clamping mechanism of the present invention;

[0021] Figure 4 It is a front view of the pushing mechanism of the present invention;

[0022] Figure 5 It is a front view of the clamping mechanism of the present invention;

[0023] Figure 6 It is a cutaway stereoscopic view of the pushing mechanism and the clamping mechanism of the present invention;

[0024] Figure 7 It is a front view showing the positional relationship between the clamping mechanism and the second spring of the present invention.

[0025] The meaning of each number in the figure is:

[0026] 100, base; 110, mounting frame; 120, processing table;

[0027] 200, cutting mechanism; 210, turntable; 220, wire saw; 230, motor;

[0028] 300, pushing mechanism; 310, first bracket; 320, second bracket; 330, guide rod; 340, hydraulic rod; 350, driving plate;

[0029] 400, clamping mechanism; 410, limiting plate; 420, limiting rod; 430, clamping arm; 440, first spring;

[0030] 500. Second spring. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0034] In order to ensure that both sides of the silicon wafer can automatically cling to the fixing mechanism (the clamping mechanism 400 described below, specifically the fixing members arranged at both ends of the cutting line of the silicon wafer to be cut) during the process of cutting the silicon wafer, the clamping mechanism 400 in the present invention is arranged as fixing members respectively fixed on both sides of the silicon wafer to be cut. Figure 1As shown, the purpose of this embodiment is to provide a silicon wafer new material cutting and processing device, including a base 100, a mounting frame 110 and a processing table 120, a cutting mechanism 200 is installed on the mounting frame 110, a pushing mechanism 300 is provided on the top of the processing table 120, the pushing mechanism 300 includes at least a plurality of guide rods 330, a plurality of guide rods 330 are slidably connected with a clamping mechanism 400, the clamping mechanism 400 includes a plurality of fixing members, and a second spring 500 is provided between two fixing members located on the same horizontal line;

[0035] Among them, the clamping mechanism 400 is used to fix the upper and lower sides of the silicon wafer to be cut, and a cutting channel is provided between the two fixing parts located on the same height plane. The pushing mechanism 300 is used to push the silicon wafer whose upper and lower sides are fixed by the clamping mechanism 400 to approach the cutting mechanism 200. In the process that the pushing mechanism 300 pushes the silicon wafer to approach the cutting mechanism 200, the fixing parts on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line. The two fixing parts close to each other are used to clamp both sides of the cutting line of the silicon wafer. The clamping mechanism 400 can reduce the stress generated inside the silicon wafer. The cutting mechanism 200 is used to cut the silicon wafer fixed at the top and bottom and on both sides of the cutting line into a fixed length.

[0036] Working principle: insert the silicon wafer (long thin slice) to be cut between two pairs of spaced fixings. At this time, there is still a gap between the two sides of the silicon wafer to be cut and the fixings. Then start the pushing mechanism 300 to drive the silicon wafer to approach the cutting mechanism 200. During this process, due to the difference between the friction between the limit plate 410 and the guide rod 330 and the friction between the silicon wafer and the clamping arm 430, the clamping arms 430 on both sides of the silicon wafer cutting line are pushed by the driving plate 350, first, until the fixings on both sides of the silicon wafer are tightly attached to both sides of the silicon wafer.

[0037] In the process of the two fixing parts approaching each other, since there is a difference in friction between the limit plate 410 and the guide rod 330 close to and away from the driving plate 350, and the friction between the limit plate 410 and the guide rod 330 away from the driving plate 350 is greater, in the initial stage of the two fixing parts approaching each other, the limit plate 410 away from the driving plate 350 remains stationary on the guide rod 330, and the limit plate 410 close to the driving plate 350 gradually approaches the limit plate 410 away from the driving plate 350. When the second spring 500 between the two limit plates 410 is compressed, a rebound force will be generated, thereby slowing down the speed at which the two limit plates 410 on the same guide rod 330 approach each other, until the silicon wafer is completely close to the fixing parts on both sides to form a clamping mechanism 400 as a whole. At this time, the pushing mechanism 300 continues to push the silicon wafer fixed on the top and bottom and both sides to approach the cutting mechanism 200, and the cutting mechanism 200 gradually cuts off the silicon wafer close to itself. After a section of the silicon wafer is cut, the pushing mechanism 300 drives the clamping mechanism 400 to reset, and then pushes the silicon wafer forward in a direction perpendicular to the cutting line. Then the above operation is repeated to continue cutting.

[0038] In order to cut the silicon wafer into the required length, such as Figure 2 As shown, the cutting mechanism 200 includes a turntable 210 rotatably connected to the same side of the mounting frame 110, and a wire saw 220 is provided on the outer periphery of the two turntables 210. The turntable 210 is driven by a motor 230, and the motor 230 is located on the side of the mounting frame 110 away from the turntable 210, and one of the turntables 210 is coaxially connected to the output shaft of the motor 230.

[0039] The improvement lies in that a cutting groove is provided on the top of the processing table 120, and the wire saw 220 passes through the cutting groove, and the direction of the wire saw 220 passing through the wire saw 220 is perpendicular to the processing table 120 and upward; after the power of the motor 230 is turned on, the motor 230 drives the turntable 210 coaxially connected to its own output shaft to rotate, and the turntable 210 drives the wire saw 220 on its periphery to rotate, and the wire saw 220 is driven by the two turntables 210 to continuously pass through the inside of the cutting groove, and under the push of the pushing mechanism 300, the silicon wafer passes through the wire saw 220, thereby cutting off the silicon wafer.

[0040] In order to provide a stable pushing amount for the silicon wafer during the cutting process, a pushing mechanism 300 is provided to push the silicon wafer toward the wire saw 220. Figure 3 and Figure 4In the figure, the pushing mechanism 300 also includes a first bracket 310 and a second bracket 320 fixedly connected to the top of the processing table 120, the four corners of the first bracket 310 and the second bracket 320 are slidably connected to a guide rod 330, a plurality of hydraulic rods 340 are provided on the first bracket 310, and the fixed part of each hydraulic rod 340 is fixedly connected to the first bracket 310, a driving plate 350 is provided between the first bracket 310 and the second bracket 320, the driving plate 350 is slidably connected to each guide rod 330, and the driving plate 350 is fixedly connected to the movable part of each hydraulic rod 340.

[0041] The improvement is that after the silicon wafer to be cut is placed inside the clamping mechanism 400, the hydraulic rod 340 is started. The hydraulic rod 340 pushes the driving plate 350 to slide along the guide rod 330 through its movable part. The driving plate 350 drives the silicon wafer in the clamping mechanism 400 to approach the wire saw 220, thereby cutting the silicon wafer.

[0042] There is a dilemma in the process of fixing the silicon wafer: if it is fixed too tightly, residual stress will remain inside the silicon wafer, causing serious quality problems such as cracking and warping of the silicon wafer, greatly shortening the service life of the silicon wafer and increasing production costs. Because the residual stress inside the silicon wafer will gradually accumulate and release under the influence of subsequent use and environmental factors, it may eventually cause the silicon wafer to lose its original performance and structural integrity. On the other hand, if the silicon wafer is fixed too loosely, the silicon wafer will be skewed during the cutting process, which will seriously affect the yield rate. At present, when fixing the silicon wafer, the existing silicon wafer cutting device usually places the silicon wafer to be cut in the clamping mechanism 400 first, and then clamps the upper and lower surfaces of the silicon wafer and the two sides perpendicular to the cutting line. However, the existing clamping mechanism 400 generally fixes the two sides of the silicon wafer by two mutually close fixing devices (fixing parts described below). Such a fixing method will cause the contact part of the silicon wafer and the fixing part to generate stress concentration at the moment when the fixing part contacts the silicon wafer. For brittle materials such as silicon wafers, the stress concentrated part is easy to break. Therefore, the clamping mechanism 400 is configured as a fixing piece respectively fixed on both sides of the silicon wafer to be cut, and the difference in friction between the fixing piece and the guide rod 330 and between the silicon wafer and the clamping arm 430 is utilized to make the clamping process of the fixing piece on the silicon wafer more "smooth".

[0043] like Figure 5-Figure 7As shown, the specific structure of the fixing member is disclosed below. The fixing member includes two limit plates 410 slidably connected on the same vertical line, a plurality of limit rods 420 are fixedly connected between the two limit plates 410, a pair of vertically distributed clamping arms 430 are slidably connected to the plurality of limit rods 420, a plurality of first springs 440 are arranged between each clamping arm 430 and the adjacent limit plates 410, each first spring 440 is sleeved on the periphery of the limit rod 420, and an adjusting rod is slidably connected between the two limit plates 410 slidably connected to the same guide rod 330;

[0044] That is to say, when placing the silicon wafer, the clamping arms 430 on the same limiting rod 420 are pushed to slide along the limiting rod 420, and the two clamping arms 430 are separated. The two clamping arms 430 compress the first spring 440 connected thereto. After the silicon wafer is placed, the thrust applied to the two clamping arms 430 is removed, and the two clamping arms 430 are reset under the action of the restoring force of the first spring 440, thereby clamping the upper and lower sides of the silicon wafer between the two clamping arms 430. At this time, there is still a gap between the two sides of the silicon wafer and the limiting rod 420. Since there is a difference between the friction force between the limiting plate 410 and the guide rod 330 and the friction force between the silicon wafer and the clamping arms 430, under the push of the driving plate 350, the clamping arms 430 on both sides of the silicon wafer cutting line are first close to each other, until the fixing parts on both sides of the silicon wafer are in close contact with both sides of the silicon wafer, and the silicon wafer fixed by the limiting rod 420 on both sides of the cutting line will follow the clamping mechanism 400 as a whole and move closer to the wire saw 220. This clamping method uses friction difference, and the clamping force on the silicon wafer gradually increases. This allows the stress inside the silicon wafer to be more evenly distributed and reduces stress concentration.

[0045] In order to prevent the limiting rods 420 on both sides from approaching each other too quickly during the process of the fixing members on both sides of the silicon wafer approaching each other, so that the silicon wafer is clamped off and the fracture of the silicon wafer is uneven, such as Figure 6 and Figure 7 As shown, each second spring 500 is sleeved on the outer periphery of the guide rod 330, and the second spring 500 is located between two adjacent limit plates 410 on the same horizontal line. The two ends of the second spring 500 are respectively fixedly connected to the two limit plates 410, and the friction coefficient of the limit plate 410 close to the driving plate 350 is greater than the friction coefficient of the limit plate 410 far away from the driving plate 350. The friction force between the driving plate 350 and the guide rod 330 is greater than the friction force between the silicon wafer and the clamping arm 430.

[0046] It should be noted that the material of the limit plate 410 close to the driving plate 350 is polytetrafluoroethylene, and the material of the limit plate 410 far from the driving plate 350 is nylon. That is to say, the friction between the limit plate 410 close to the driving plate 350 and the guide rod 330 is less than the friction generated between the limit plate 410 far from the driving plate 350 and the guide rod 330. This makes: in the process of the two fixing parts approaching each other, in the initial stage, the limit plate 410 far from the driving plate 350 remains stationary on the guide rod 330, and the limit plate 410 close to the driving plate 350 gradually approaches the limit plate 410 far from the driving plate 350. When the second spring 500 between the two limit plates 410 is compressed, a rebound force will be generated, thereby slowing down the speed at which the two limit plates 410 on the same guide rod 330 approach each other, preventing the two fixing parts from approaching each other too quickly and thus breaking the silicon wafer. Until the silicon wafer and the fixing parts on both sides are completely close to form a clamping mechanism 400, the hydraulic rod 340 continues to push the silicon wafer fixed on the top and bottom and both sides to approach the wire saw 220 by pushing the driving plate 350, and the wire saw 220 gradually cuts off the silicon wafer close to itself. After a section of the silicon wafer is cut, the hydraulic rod 340 drives the fixing parts to reset through the driving plate 350. At this time, the silicon wafer is pushed forward in a direction perpendicular to the cutting line, and then the above operation is repeated to continue cutting.

[0047] In summary, the working principle of the present invention is as follows:

[0048] First, the silicon wafer to be cut (long thin slice) is inserted between the clamping arms 430 in the two pairs of spaced-apart fixing members. At this time, there is still a gap between the side surfaces of the silicon wafer to be cut and the limiting rods 420 on both sides.

[0049] Then start the hydraulic rod 340 to drive the silicon wafer toward the wire saw 220. During this process, due to the difference between the friction between the limit plate 410 and the guide rod 330 and the friction between the silicon wafer and the clamping arm 430, the clamping arms 430 on both sides of the silicon wafer cutting line will approach each other under the push of the driving plate 350, until the fixing parts on both sides of the silicon wafer are tightly attached to both sides of the silicon wafer. The silicon wafer fixed by the limit rod 420 on both sides of the cutting line will follow the clamping mechanism 400 as a whole and move toward the wire saw 220.

[0050] In the process of the two fixing parts approaching each other, since there is a difference in friction between the limit plate 410 and the guide rod 330 close to and far away from the driving plate 350, and the friction between the limit plate 410 and the guide rod 330 far away from the driving plate 350 is greater, in the initial stage of the two fixing parts approaching each other, the limit plate 410 far away from the driving plate 350 remains stationary on the guide rod 330, and the limit plate 410 close to the driving plate 350 gradually approaches the limit plate 410 far away from the driving plate 350, and the second spring 500 between the two limit plates 410 will generate a rebound force when being compressed, thereby delaying the speed at which the two limit plates 410 on the same guide rod 330 approach each other, until the silicon wafer is completely tightly attached to the fixing parts on both sides to form a clamping mechanism 400 as a whole, at this time, the hydraulic rod 340 continues to push the silicon wafer fixed on the top and bottom and both sides to approach the wire saw 220, and the rotating wire saw 220 gradually cuts off the silicon wafer close to itself. After a section of the silicon wafer is cut, the hydraulic rod 340 drives the clamping mechanism 400 to reset, and then pushes the silicon wafer forward in a direction perpendicular to the cutting line, and then repeats the above operation to continue cutting the next section.

[0051] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A new material cutting and processing device for silicon wafers, comprising a base (100), a mounting frame (110) and a processing table (120), characterized in that: A cutting mechanism (200) is installed on the mounting frame (110), a pushing mechanism (300) is provided on the top of the processing table (120), the pushing mechanism (300) comprises at least a plurality of guide rods (330), a plurality of guide rods (330) are slidably connected with a clamping mechanism (400), the clamping mechanism (400) comprises a plurality of fixing members, and a second spring (500) is provided between two fixing members located on the same horizontal line; The clamping mechanism (400) is used to fix the upper and lower surfaces of a silicon wafer to be cut, a cutting channel is provided between the two fixing members located on the same height plane, the pushing mechanism (300) is used to push the silicon wafer whose upper and lower surfaces are fixed by the clamping mechanism (400) toward the cutting mechanism (200), and in the process of the pushing mechanism (300) pushing the silicon wafer toward the cutting mechanism (200), the fixing members on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line, the two fixing members approaching each other are used to clamp both sides of the cutting line of the silicon wafer, the clamping mechanism (400) can reduce the stress generated inside the silicon wafer, and the cutting mechanism (200) is used to cut the silicon wafer fixed at the top and bottom and both sides of the cutting line into a fixed length.

2. The new material cutting and processing device for silicon wafers according to claim 1, characterized in that: The cutting mechanism (200) comprises a turntable (210) rotatably connected to the same side of the mounting frame (110), a wire saw (220) being sleeved on the periphery of the two turntables (210), the turntables (210) being driven by a motor (230), the motor (230) being located on a side of the mounting frame (110) away from the turntables (210), and one of the turntables (210) being coaxially connected to an output shaft of the motor (230).

3. The silicon wafer new material cutting and processing device according to claim 2, characterized in that: A cutting groove is provided on the top of the processing table (120), and the wire saw (220) passes through the cutting groove. The wire saw (220) passes through the cutting groove in a direction perpendicular to the processing table (120) and pointing upward.

4. The silicon wafer new material cutting and processing device according to claim 1, characterized in that: The pushing mechanism (300) further comprises a first bracket (310) and a second bracket (320) fixedly connected to the top of the processing table (120); the four corners of the first bracket (310) and the second bracket (320) are slidably connected to a guide rod (330); a plurality of hydraulic rods (340) are provided on the first bracket (310); the fixed portion of each hydraulic rod (340) is fixedly connected to the first bracket (310); a driving plate (350) is provided between the first bracket (310) and the second bracket (320); the driving plate (350) is slidably connected to each guide rod (330); and the driving plate (350) is fixedly connected to the movable portion of each hydraulic rod (340).

5. The silicon wafer new material cutting and processing device according to claim 4, characterized in that: The fixing member comprises two limit plates (410) slidably connected on the same vertical line, a plurality of limit rods (420) are fixedly connected between the two limit plates (410), a pair of vertically distributed clamping arms (430) are slidably connected to the plurality of limit rods (420), a plurality of first springs (440) are arranged between each clamping arm (430) and the adjacent limit plate (410), each first spring (440) is sleeved on the periphery of the limit rod (420), and an adjusting rod is slidably connected between the two limit plates (410) slidably connected to the same guide rod (330).

6. The silicon wafer new material cutting and processing device according to claim 5, characterized in that: Each of the second springs (500) is sleeved on the periphery of the guide rod (330), the second spring (500) is located between two adjacent limit plates (410) on the same horizontal line, and the two ends of the second spring (500) are respectively fixedly connected to the two limit plates (410).

7. The silicon wafer new material cutting and processing device according to claim 5, characterized in that: The friction coefficient of the limit plate (410) close to the driving plate (350) is greater than the friction coefficient of the limit plate (410) far from the driving plate (350), and the friction force between the driving plate (350) and the guide rod (330) is greater than the friction force between the silicon chip and the clamping arm (430).

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