Crater spraying and etching processing device and etching liquid

Abstract

The invention discloses a crater spraying and etching processing device which comprises an etching box, a spraying mechanism, an etching liquid circulating system and a clamping box for vertically clamping a glass cover plate in the etching box, the clamping box can be driven by a motor to drive the glass cover plate to rotate, the motor is connected with a rotating speed controller, the spraying mechanism comprises a plurality of spraying pipes which are evenly distributed at intervals, and the spraying mechanism is connected with the etching liquid circulating system. The spraying direction of a plurality of nozzles evenly distributed on the spraying pipe can be adjusted in the range from being parallel to the surface of the glass cover plate to being perpendicular to the glass cover plate, an anti-etching protective film is attached to the position, at the crater, of the glass cover plate, and a filtering mechanism and a temperature and pressure adjusting mechanism are arranged in the etching liquid circulating system. The invention further discloses an etching solution suitable for the device, and compared with a CNC crater machining mode, the machining efficiency and the surface quality of the machined crater can be greatly improved through the etching machining device and the mode for machining the crater through the etching solution, and the yield is increased.

Description

Technical Field

[0001] The invention relates to the technical field of etching processing, and in particular to a crater spray etching processing device and etching liquid. Background Art

[0002] The crater of the glass cover is a boss of the camera and other parts. In the prior art, the crater is generally processed by rough grinding and fine grinding of the glass cover surface by a CNC grinding wheel. However, the processing time is long, the equipment investment is large, and the damage to the screw guide rail of the CNC machine is large, resulting in poor machine accuracy. In addition, the slope of the crater boss after processing is heavy. In order to achieve the required surface quality, the crater needs to be swept for a long time afterwards. Summary of the invention

[0003] In order to solve the technical problems existing in the background technology, the present invention provides a crater spray etching processing device and etching liquid.

[0004] The crater spray etching processing device comprises: an etching box, a spray mechanism, an etching liquid circulation system, and a cassette. The spray mechanism is connected with the etching liquid circulation system and installed on the top of the etching box. The spray mechanism comprises a plurality of spray pipes evenly spaced in the horizontal direction and a plurality of nozzles evenly spaced and installed on the spray pipes in a regular rectangular array with a downward spray direction. The etching box below the spray mechanism can accommodate and rotatably connect a plurality of cassettes for vertically clamping and fixing glass cover plates. The spray direction of the nozzle is substantially parallel to the surface of the glass cover plate. The cassette is connected to the output shaft of the motor through a rotating shaft extending out of the etching box at one end. The rotating shaft is perpendicular to the surface of the glass cover plate. The motor is connected with a speed controller. The glass cover plate is affixed with an anti-etching protective film at the position of the crater, but other parts to be thinned should be completely exposed within the spray range of the nozzle. A liquid discharge port is provided at the bottom of the etching box.

[0005] Preferably, guide rails fixed on the inner wall of the etching box are arranged on both sides of the etching box in a direction parallel to the surface of the glass cover plate, and the spray mechanism is mounted on the guide rails through a guide wheel connected to the bottom of the spray pipe. The spray mechanism is connected to one end of a connecting shaft parallel to the guide rail direction, and the other end of the connecting shaft passes through the etching box and is connected to the cylinder output shaft.

[0006] Preferably, the nozzle is an adjustable spherical fan nozzle, and the spray direction of the nozzle can be adjusted within the range of parallel to the surface of the glass cover plate to perpendicular to the surface of the glass cover plate.

[0007] Preferably, the anti-etching protective film should completely cover the crater boss and the slopes around the crater of the glass cover.

[0008] Preferably, the spray mechanism further comprises a plurality of evenly arranged spray pipes located on both sides of the rotating shaft and nozzles evenly distributed on the spray pipes, and the spray direction of the nozzles is parallel to the surface of the glass cover plate.

[0009] Preferably, the etching liquid circulation system includes a filtering mechanism and a purified etching liquid storage box connected by pipelines, the filtering mechanism includes a filter press and a multi-stage sedimentation tank, the filtering mechanism is connected to the drain port through a pipeline, and the purified etching liquid storage box is connected to the spray pipe through a pipeline and an etching pump.

[0010] Preferably, a heating rod and a cooling pipe are provided in the purification etching liquid storage box, and a temperature sensor is provided on the pipe connecting the purification etching liquid storage box and the spray pipe.

[0011] Preferably, a pressure controller is also connected to the pipeline between the etching pump and the spray pipe.

[0012] The etching liquid can be used in the crater spray etching processing device of any of the above schemes. The components of the etching liquid are as follows by weight: 20% hydrofluoric acid, 5% hydrochloric acid, 7% nitric acid, 7% sulfuric acid, 5% ammonium bifluoride, and 56% pure water.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The etching liquid is used to thin the glass cover plate except for the crater on a large scale, and a rotating cassette, a reciprocating spray mechanism, a direction-adjustable nozzle, and an etching liquid circulation system with controllable temperature and pressure can be used to greatly improve the processing efficiency of the crater, enhance the processing effect and precision, and achieve a high yield rate. The crater and the thinned surface of the glass cover plate after etching are smooth and transparent surfaces, and there is no need to perform polishing on the glass cover plate, which saves processing steps and time, thereby reducing product processing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The present invention is a schematic diagram of the structure of a crater spray etching processing device excluding an etching liquid circulation system.

[0016] Figure 2 for Figure 1 Schematic diagram of the structure after the etching box is hidden.

[0017] Figure 3 It is a schematic diagram of the structure of the cassette, motor and glass cover.

[0018] Figure 4 It is a structural schematic diagram of the spray structure.

[0019] Figure 5 Schematic diagram of the structure of a glass cover plate with an anti-etching protective film when etching the slope of a crater.

[0020] Figure 6 This is a schematic diagram of the overall structure of the crater spray etching processing device. DETAILED DESCRIPTION

[0021] The specific implementation of the present invention will be described in detail below with reference to the accompanying drawings.

[0022] Reference Figures 1 to 6 The crater spray etching processing device comprises: an etching box 1, a spray mechanism 2, an etching liquid circulation system 3, and a cassette 4. The spray mechanism 2 is connected to the etching liquid circulation system 3 and is installed on the top of the etching box 1. The spray mechanism 2 comprises a plurality of spray pipes 21 evenly spaced in the horizontal direction and a plurality of nozzles 22 evenly spaced and installed on the spray pipes 21 in a regular rectangular array (in practical applications, the front and rear left and right distances of the nozzles 22 can be set to 10 mm) with a spray direction downward. The etching box 1 below the spray mechanism 2 can accommodate and rotatably connect the cassettes 4 that vertically clamp and fix a plurality of glass cover plates 5. The spray direction of the nozzles 23 is substantially parallel to the surface of the glass cover plate 5. The cassette 4 is connected to the output shaft of the motor 6 through a rotating shaft 41 extending out of the etching box 1 at one end. The rotating shaft 41 is perpendicular to the surface of the glass cover plate 5. The motor 6 is connected to a speed controller. The glass cover plate 5 is affixed with an anti-etching protective film 7 at the position of the crater, but other parts to be thinned should be completely exposed within the spray range of the nozzle 22. A drain port 11 is provided at the bottom of the etching box 1.

[0023] The working principle of the crater spray etching processing device is: spray a suitable etching liquid onto the surface of the glass cover plate outside the crater through a nozzle to achieve the effect of thinning the glass cover plate over a large area. In practical applications, the etching liquid is generally an acidic liquid whose main component is hydrofluoric acid, and the rotating cassette 4 drives the glass cover plate 5 clamped therein to rotate (refer to Figure 3 ) so that the etching liquid can fully and evenly contact and react with the surface to be thinned. The speed controller adjusts the etching time and thinning amount of the cassette and the glass cover plate 5 in all directions by controlling the speed of the motor 6 and the switch (in actual application, the speed of the cassette 4 can be 6r / min), ensuring the consistency of the slope 52 around the crater, thereby processing an ideal crater shape. In addition, the rotating glass cover plate 5 can also prevent the precipitate generated by the solid reaction of the etching liquid with calcium impurities in the glass cover plate 5 from accumulating around the crater boss 51 to form sawtooth, further improving the etching effect.

[0024] The above etching method can greatly improve the processing efficiency of the crater (the processing time is about 4 hours, which is about 160 times higher than the existing CNC grinding wheel grinding method), improve the processing effect, and have a high yield rate. The crater and the thinned surface of the glass cover plate processed by etching are smooth and transparent surfaces, and there is no need to perform polishing on the glass cover plate (it takes 60 to 90 minutes), which saves processing procedures and time, thereby reducing product processing costs.

[0025] Reference Figure 1 , Figure 2 Guide rails 8 fixed on the inner wall of the etching box 1 are arranged on both sides of the etching box 1 in a direction parallel to the surface of the glass cover plate 5. The spray mechanism 2 is mounted on the guide rails 8 through a guide wheel 23 connected to the bottom of the spray pipe 21. The spray mechanism 2 is connected to one end of a connecting shaft 24 parallel to the guide rail 23. The other end of the connecting shaft 24 passes through the etching box 1 and is connected to the output shaft of the cylinder 25, so that the spray mechanism 2 can reciprocate continuously during the process of spraying the etching liquid (in actual application, the reciprocating speed can be maintained at 5 cm / s), ensuring the uniformity and comprehensiveness of the etching liquid sprayed on the surface of the glass cover plate, avoiding the formation of a pool effect, and improving the etching thinning effect.

[0026] Reference Figure 4 The nozzle 22 is an adjustable spherical fan nozzle (in practical applications, the nozzle can be a slotted fan with a diameter of 1 mm). The spray direction of the nozzle 22 can be adjusted from parallel to the surface of the glass cover plate 5 to perpendicular to the surface of the glass cover plate 5. This design method can fine-tune the spray range and direction to achieve more precise etching control.

[0027] Reference Figure 5 The anti-etching protective film 7 should completely cover the crater boss 51 and the slope 52 around the crater of the glass cover plate 5. This covering method can use the space between the anti-etching protective film 7 and the glass cover plate to store etching liquid during the processing, and then cooperate with the adjustable ball-fan nozzle to better process the slope 52 around the crater located in this space.

[0028] The spray mechanism 2 also includes a plurality of evenly arranged spray pipes 21 located on both sides of the rotating shaft 41 and nozzles 22 evenly distributed on the spray pipes. The spray direction of the nozzles 22 is parallel to the surface of the glass cover plate 5 (not shown in the figure). The top spraying plus this two-sided side spraying method can further improve the etching efficiency.

[0029] Reference Figure 6After etching, the etching liquid with impurities is discharged through the drain port 11, and flows into the filter mechanism 31 through the pipeline. After being filtered and purified by the filter press 311 and the multi-stage sedimentation tank 312, it flows into the purified etching liquid storage box 32 through the pipeline, and finally is transported to the spray mechanism 2 again through the etching pump 33 to form a cycle. The etching liquid circulation system 3 can save etching liquid and ensure the purity of the etching liquid, thereby ensuring the etching quality. In addition, it prevents the impurities of the etching liquid from clogging the pipeline, the spray pipe 21, and the nozzle 22, thereby improving the working reliability of the device.

[0030] Reference Figure 6 A heating rod 321 and a cooling pipe 322 are arranged in the purified etching liquid storage box 32. A temperature sensor 34 is arranged on the pipe connecting the purified etching liquid storage box 32 and the spray pipe 21. The etching liquid with a stable temperature (in practical applications, the temperature of the etching liquid can be maintained at 35°C) can ensure the flow speed, etching rate and good chemical properties of the etching liquid, thereby ensuring the etching effect and efficiency.

[0031] Reference Figure 6 A pressure controller 35 is also connected to the pipeline between the etching pump and the spray pipe 21 to control the injection pressure of the nozzle 22 (in practical applications, the pressure value can be 4.9N) to ensure the uniformity of the spray and improve the etching processing accuracy.

[0032] The etching liquid can be used in any of the above-mentioned embodiments of the crater spray etching processing device. The components of the etching liquid are as follows: 20% hydrofluoric acid, 5% hydrochloric acid, 7% nitric acid, 7% sulfuric acid, 5% ammonium bifluoride, and 56% pure water in a weight ratio. The etching liquid with hydrofluoric acid as the main component has strong corrosiveness and can quickly etch the surface of the thinned glass cover plate.

[0033] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A crater spray etching processing device, characterized in that: The invention comprises: an etching box (1), a spray mechanism (2), an etching liquid circulation system (3), and a cassette (4); the spray mechanism (2) is connected to the etching liquid circulation system (3) and is installed on the top of the etching box (1); the spray mechanism (2) comprises a plurality of spray pipes (21) evenly spaced in a horizontal direction and a plurality of nozzles (22) evenly spaced and installed on the spray pipes (21) in a regular rectangular array and with a spray direction pointing downward; the etching box (1) below the spray mechanism (2) can accommodate and rotatably connect a plurality of glass cover plates (5) to be vertically clamped and fixed The cassette (4) is fixed, the spray direction of the nozzle (23) is substantially parallel to the surface of the glass cover plate (5), the cassette (4) is connected to the output shaft of the motor (6) through a rotating shaft (41) extending out of the etching box (1) at one end, the rotating shaft (41) is perpendicular to the surface of the glass cover plate (5), the motor (6) is connected to a speed controller, the glass cover plate (5) is affixed with an anti-etching protective film (7) at the position of the crater, but other parts to be thinned should be completely exposed within the spray range of the nozzle (22), and a drain port (11) is provided at the bottom of the etching box (1).

2. The crater spray etching processing device according to claim 1, characterized in that: Guide rails (8) fixed on the inner wall of the etching box (1) are arranged on both sides of the etching box (1) in a direction parallel to the surface of the glass cover plate (5); a spray mechanism (2) is mounted on the guide rails (8) via a guide wheel (23) connected to the bottom of a spray pipe (21); the spray mechanism (2) is connected to one end of a connecting shaft (24) parallel to the direction of the guide rail (23); and the other end of the connecting shaft (24) passes through the etching box (1) and is connected to an output shaft of a cylinder (25).

3. The crater spray etching processing device according to claim 1, characterized in that: The nozzle (22) is an adjustable spherical fan-shaped nozzle, and the spray direction of the nozzle (22) can be adjusted within the range of being parallel to the surface of the glass cover plate (5) to being perpendicular to the surface of the glass cover plate (5).

4. The crater spray etching processing device according to claim 3, characterized in that: The anti-etching protective film (7) should completely cover the crater boss (51) and the slopes (52) around the crater of the glass cover plate (5).

5. The crater spray etching processing device according to claim 1, characterized in that: The spray mechanism (2) also includes a plurality of evenly arranged spray pipes (21) located on both sides of the rotating shaft (41) and nozzles (22) evenly distributed on the spray pipes, wherein the spray direction of the nozzles (22) is parallel to the surface of the glass cover plate (5).

6. The crater spray etching processing device according to claim 1, characterized in that: The etching liquid circulation system (3) comprises a filtering mechanism (31) and a purified etching liquid storage box (32) connected by pipelines, the filtering mechanism (31) comprises a filter press (311) and a multi-stage sedimentation tank (312), the filtering mechanism (31) is connected to a liquid discharge port (11) via a pipeline, and the purified etching liquid storage box (32) is connected to a spray pipe (21) via a pipeline and an etching pump (33).

7. The crater spray etching processing device according to claim 6, characterized in that: A heating rod (321) and a cooling pipe (322) are arranged in the purified etching liquid storage box (32), and a temperature sensor (34) is arranged on the pipe connecting the purified etching liquid storage box (32) and the spray pipe (21).

8. The crater spray etching processing device according to claim 6, characterized in that: A pressure controller (35) is connected to the pipeline between the etching pump and the spray pipe (21).

9. An etching solution that can be used in any one of the crater spray etching processing devices in claims 1-8, wherein the components of the etching solution are as follows by weight: 20% hydrofluoric acid, 5% hydrochloric acid, 7% nitric acid, 7% sulfuric acid, 5% ammonium bifluoride, and 56% pure water.

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