Aluminum-based copper-clad plate double-coating heat-conducting glue processing technology and preparation method of heat-conducting bonding sheet of aluminum-based copper-clad plate

Abstract

The invention discloses an aluminum-based copper-clad plate double-coated heat-conducting glue processing technology and a heat-conducting bonding sheet preparation method thereof, and the aluminum-based copper-clad plate double-coated heat-conducting glue processing technology comprises the following raw materials by weight: 20-30 parts of epoxy resin, 5-10 parts of a curing agent, 60-80 parts of a solvent, 10-20 parts of a heat-conducting material, and 50-60 parts of silica powder; comprising the following steps: step A, adding epoxy resin, a heat-conducting material and a solvent into a reaction kettle and fully stirring; step B, adding a curing agent into the reaction kettle, curing the raw materials in the reaction kettle for several hours, and enabling the raw materials in the reaction kettle to form a glue solution; step C, coating the electrolytic copper foil material with the prepared glue solution to be used; and step D, baking in an oven to obtain a finished product. The formula and the process are simple, the processing efficiency and the processing quality can be improved, the heat conduction performance can be improved, the heat dissipation performance and the connection stability of the aluminum-based copper-clad plate can be improved, the production cost can be reduced, and the overall quality of the product can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of aluminum-based copper-clad laminates, and specifically relates to a processing technology for double-coating thermal conductive adhesive on an aluminum-based copper-clad laminate and a method for preparing a thermal conductive adhesive sheet thereof. Background Art

[0002] Aluminum-based copper-clad laminate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board is composed of a three-layer structure, namely a circuit layer, an insulating layer and a metal base layer. However, the thermal conductivity of the insulating layer in the prior art is relatively limited, and its formability and adhesion are also limited, so its applicability and practicality are limited. Summary of the invention

[0003] The purpose of the present invention is to provide a double-coated thermal conductive adhesive processing technology for aluminum-based copper-clad laminates and a method for preparing a thermal conductive adhesive sheet thereof, which is simple in process and conducive to improving processing efficiency.

[0004] One of the technical solutions to achieve the purpose of the present invention is: a double-coated thermal conductive adhesive processing technology for aluminum-based copper-clad laminates, comprising the following raw materials by weight: 20-30 parts of epoxy resin, 5-10 parts of curing agent, 60-80 parts of solvent, 10-20 parts of thermal conductive material, and 50-60 parts of silicon micropowder;

[0005] The process comprises the following steps: step A, adding epoxy resin, thermal conductive material and solvent into a reaction kettle and stirring them fully;

[0006] Step B, adding a curing agent to the reactor to ripen the raw materials in the reactor for several hours so that the raw materials in the reactor form a glue liquid;

[0007] Step C, coating the prepared adhesive solution on the electrolytic copper foil material;

[0008] Step D, placing in an oven for baking and cutting to obtain thermally conductive double-coated copper foil adhesive.

[0009] It is further preferred that the thermal conductive material comprises at least two of rare earth oxide graphene, nano carbon powder, purple sand, boron nitride and silicon carbide mixed and formed.

[0010] More preferably, in step B, the aging time of the raw materials in the reactor is 24-30 hours.

[0011] More preferably, the raw materials include the following components by weight: 25 parts of epoxy resin, 8 parts of curing agent, 70 parts of solvent, 15 parts of thermal conductive material, and 55 parts of silicon powder.

[0012] One of the technical solutions to achieve the purpose of the present invention is: a method for preparing a double-coated thermal conductive adhesive sheet for an aluminum-based copper-clad laminate, comprising the above-mentioned thermal conductive double-coated copper foil adhesive; and adding inorganic nano glue liquid into the thermal conductive double-coated copper foil adhesive; and then immersing it with glass fiber cloth and semi-curing it to obtain a high thermal conductive adhesive sheet.

[0013] When in use, a coupling agent is added to the glue formula to treat the surface of the aluminum oxide, so that the aluminum oxide and the resin can be more densely combined to form a better heat transfer channel. A large amount of aluminum oxide can be added to the glue emulsified with an emulsifying device, which can provide a more stable thermal conductivity coefficient of the bonding sheet.

[0014] The present invention has positive effects: the formula and process of the present invention are simple, which is conducive to improving processing efficiency and processing quality, and is conducive to improving thermal conductivity, improving the heat dissipation and connection stability of the aluminum-based copper clad laminate, and is also conducive to reducing production costs and improving the overall quality of the product. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] Example

[0017] The present embodiment improves a processing technology for double-coating thermal conductive adhesive for aluminum-based copper-clad laminates, including the following raw materials by weight: 20-30 parts of epoxy resin, 5-10 parts of curing agent, 60-80 parts of solvent, 10-20 parts of thermal conductive material, and 50-60 parts of silicon micropowder; in actual application, the thermal conductive material includes at least two of rare earth oxide graphene, nano-carbon powder, purple sand, boron nitride, and silicon carbide mixed and molded.

[0018] The process comprises the following steps: step A, adding epoxy resin, thermal conductive material and solvent into a reaction kettle and stirring them fully;

[0019] Step B, adding a curing agent to the reactor to ripen the raw materials in the reactor for several hours so that the raw materials in the reactor form a glue liquid;

[0020] Step C, coating the prepared adhesive solution on the electrolytic copper foil material;

[0021] Step D, placing in an oven for baking and cutting to obtain thermally conductive double-coated copper foil adhesive.

[0022] In step B, the aging time of the raw materials in the reactor is 24-30 hours.

[0023] The weight components of the raw materials are as follows: 25 parts of epoxy resin, 8 parts of curing agent, 70 parts of solvent, 15 parts of thermal conductive material, and 55 parts of silicon powder.

[0024] In addition, this embodiment also provides a method for preparing a double-coated thermally conductive adhesive sheet for an aluminum-based copper-clad laminate, comprising the above-mentioned thermally conductive double-coated copper foil adhesive; adding inorganic nano-adhesive liquid to the thermally conductive double-coated copper foil adhesive; and then immersing it with glass fiber cloth and semi-curing it to obtain a high thermal conductive adhesive sheet.

[0025] When in use, a coupling agent is added to the glue formula to treat the surface of the aluminum oxide, so that the aluminum oxide and the resin can be more densely combined to form a better heat transfer channel. A large amount of aluminum oxide can be added to the glue emulsified with an emulsifying device, which can provide a more stable thermal conductivity coefficient of the bonding sheet.

[0026] The present invention has positive effects: the formula and process of the present invention are simple, which is conducive to improving processing efficiency and processing quality, and is conducive to improving thermal conductivity, improving the heat dissipation and connection stability of the aluminum-based copper clad laminate, and is also conducive to reducing production costs and improving the overall quality of the product.

[0027] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification can also be directly processed according to existing technical common sense. At the same time, the connection method of each component adopts the mature conventional means in the prior art, and the machinery, parts and equipment all adopt the conventional models in the prior art, so no specific description will be given here.

[0028] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A process for double-coating thermal conductive adhesive on aluminum-based copper-clad laminates, characterized in that: The raw materials include the following components by weight: 20-30 parts of epoxy resin, 5-10 parts of curing agent, 60-80 parts of solvent, 10-20 parts of thermal conductive material, and 50-60 parts of silicon micropowder; The process comprises the following steps: step A, adding epoxy resin, thermal conductive material and solvent into a reaction kettle and stirring them fully; Step B, adding a curing agent to the reactor to ripen the raw materials in the reactor for several hours so that the raw materials in the reactor form a glue liquid; Step C, coating the prepared adhesive solution on the electrolytic copper foil material; Step D, placing in an oven for baking and cutting to obtain thermally conductive double-coated copper foil adhesive.

2. A process for processing aluminum-based copper-clad laminates with double-coated thermal conductive adhesive according to claim 1, characterized in that: The thermal conductive material comprises at least two of rare earth oxide graphene, nano carbon powder, purple sand, boron nitride and silicon carbide, which are mixed and formed.

3. The process for processing aluminum-based copper-clad laminates with double-coated thermal conductive adhesive according to claim 1, characterized in that: In step B, the aging time of the raw materials in the reactor is 24-30 hours.

4. The process for processing aluminum-based copper-clad laminates with double-coated thermal conductive adhesive according to claim 1, characterized in that: The raw materials include the following components by weight: 25 parts of epoxy resin, 8 parts of curing agent, 70 parts of solvent, 15 parts of thermal conductive material, and 55 parts of silicon powder.

5. A method for preparing a double-coated thermal conductive adhesive sheet for an aluminum-based copper-clad laminate, characterized in that: The thermally conductive double-coated copper foil adhesive comprises the thermally conductive double-coated copper foil adhesive as claimed in any one of claims 1 to 4; and adding inorganic nano glue into the thermally conductive double-coated copper foil glue; Then, glass fiber cloth is impregnated and semi-cured to obtain a high thermal conductive adhesive sheet.