Drying device for manufactured semiconductor material piece

Abstract

The invention discloses a drying device for manufactured semiconductor material pieces, and belongs to the technical field of semiconductor drying equipment. A third horizontal track moving in the vertical direction is arranged in a vacuum box, a semiconductor finished product assembly is arranged on the third horizontal track, and a limiting clamping mechanism is arranged on the third horizontal track; a laser heating module is arranged at the top in the vacuum box, two bottom plates are arranged at an opening in the bottom of the vacuum box, a driving mechanism is arranged on the support, a feeding mechanism is arranged on the first horizontal track, and a discharging mechanism is arranged on the second horizontal track. A semiconductor finished product assembly is automatically fed to the third horizontal track and enters the vacuum box, the laser heating module dries a plurality of semiconductor finished product parts of the semiconductor finished product assembly, the semiconductor finished product parts on the rotating plate are turned over, the multiple faces of the semiconductor finished product parts can be evenly dried, and after drying is finished, the semiconductor finished product parts can be evenly dried. The semi-conductor finished product assembly drying device has the advantages of being high in drying efficiency and high in automation degree.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor drying equipment, and in particular relates to a device for drying semiconductor material parts after they are manufactured. Background Art

[0002] After semiconductor finished products are manufactured, various liquids often remain on their surface. The residual liquids can cause oxidation and corrosion on the surface of semiconductor materials, thus affecting their electrical properties and reliability. If the residual chemical reagents cannot be thoroughly dried, they will react chemically with the semiconductor materials, change the physical and chemical properties of the materials, and destroy the structural integrity of the semiconductor devices.

[0003] Existing drying equipment uses a simple hot air circulation method, which is difficult to ensure uniform drying and easily leads to local overheating or insufficient drying of semiconductor material parts, thus affecting product quality. In order to improve the quality and production efficiency of semiconductor material parts, it is necessary to develop a semiconductor material post-drying device that can achieve uniform drying. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a semiconductor material post-production drying device which can automatically feed and discharge materials, evenly dry multiple surfaces of semiconductor finished products, and has high drying efficiency for semiconductor finished products.

[0005] The technical solution adopted to solve the above technical problems is: a vacuum box is arranged on the support, a vacuum generator is arranged on the vacuum box, a third horizontal track moving in the vertical direction is arranged inside the vacuum box, a semiconductor finished product component is arranged on the third horizontal track, a limit clamping mechanism for clamping and positioning the semiconductor finished product component is arranged on the third horizontal track, a laser heating module for drying the semiconductor finished product component on the third horizontal track is arranged on the top of the vacuum box, two bottom plates are arranged at the bottom opening of the vacuum box, a driving mechanism for driving the two bottom plates to move horizontally at the bottom of the vacuum box is arranged on the support, and the horizontal movement directions of the two bottom plates are opposite, a third fixed plate located at the bottom of the vacuum box is arranged on the support, a first horizontal track located on one side of the bottom of the vacuum box is arranged on one side of the third fixed plate, a feeding mechanism for driving the semiconductor finished product component to move horizontally on the first horizontal track for feeding is arranged on the first horizontal track, and a feeding mechanism for feeding the semiconductor finished product component on the third fixed plate is arranged on the third fixed plate. A second horizontal track is provided at the other side of the bottom of the vacuum box, and a discharge structure is provided on the second horizontal track to drive the semiconductor finished product assembly to discharge in the horizontal direction on the second horizontal track; the semiconductor finished product assembly is: a rotating plate is rotatably installed on the second fixed plate, outer rings are respectively provided at both ends of the second fixed plate, and inner ring disks are respectively provided at both ends of the rotating plate, each inner ring disk is respectively located inside each outer ring, and a first contact plate is respectively provided on each inner ring disk, and a clamping rod is respectively slidably connected to each inner ring disk, and each clamping rod is respectively provided with a first spring, one end of the first spring is fixedly connected to the first contact plate, and the other end of the first spring is fixedly connected to one end of the clamping rod, and two clamping holes that are clamped to the clamping rod are symmetrically processed in the circumferential direction of the outer ring, and a plurality of partitions are arranged at intervals in the horizontal direction on the upper side of the rotating plate, each partition is respectively connected to the clamping plate through the second spring, and each clamping plate is respectively processed with a clamping groove that is clamped to one end of the semiconductor finished product.

[0006] Furthermore, a second electric cylinder is arranged on the support, an output end of the second electric cylinder is fixedly connected to the second support frame, a guide rod moving in a vertical direction with the support is arranged at the bottom of the second support frame, and the second support frame is fixedly installed at the bottom of the third horizontal track.

[0007] Furthermore, a first support frame is provided on the inner side wall of the vacuum box, a third motor is provided on the first support frame, an output shaft of the third motor is fixedly connected to the push plate, and the push plate is located above the first contact plate and contacts the first contact plate.

[0008] Furthermore, the driving mechanism is as follows: two first fixed plates located on both sides of the vacuum box are respectively provided on the support, a first sliding plate slidably connected in a vertical direction between the two first fixed plates on the same side, each first fixed plate is respectively processed with a first sliding groove slidably connected to the first sliding plate in a vertical direction, each first sliding plate is respectively rotatably connected to one end of the second connecting rod, the other end of each second connecting rod is respectively rotatably connected to one end of the first connecting rod, the other end of each first connecting rod is respectively fixedly connected to one end of the transmission shaft, a first motor is provided on the top of the vacuum box, the output shaft of the first motor is fixedly connected to the first transmission wheel, and the first transmission wheel is transmission-connected to the transmission shaft through a first conveyor belt; each two sides of the bottom plate are respectively fixedly connected to one end of the third connecting rod, and a first sliding block is respectively provided at the other end of each third connecting rod, and each first sliding plate is respectively processed with a first horizontal sliding hole slidably connected with two first sliding blocks.

[0009] Furthermore, each of the first horizontal sliding holes includes a first vertical sliding hole, an inclined sliding hole and a second vertical sliding hole, the top end of the inclined sliding hole is processed with a first vertical sliding hole interconnected therewith, and the bottom end of the inclined sliding hole is processed with a second vertical sliding hole interconnected therewith.

[0010] Furthermore, the structure of the feeding mechanism is the same as that of the discharging structure, and the feeding mechanism is: second slide grooves which are slidably connected to the semiconductor finished components in the horizontal direction are respectively processed on the two side plates of the first horizontal track, a second motor is arranged at the bottom of the first horizontal track, the output shaft of the second motor is fixedly connected to the first gear, a fourth transmission wheel is fixedly installed on the top of the first gear, a second gear which is meshed and transmitted with the first gear is arranged at the bottom of the first horizontal track, a fifth transmission wheel is arranged on the top of the second gear, a plurality of first transport wheels are arranged at intervals in the horizontal direction on one side of the first horizontal track, an eighth transmission wheel and a ninth transmission wheel which are fixedly connected are respectively arranged on the top of each first transport wheel, the eighth transmission wheel is transmission-connected to the eighth transmission wheel on the top of the first transport wheel on the adjacent side through a sixth conveyor belt, and the ninth transmission wheel The transmission wheel is transmission-connected to the ninth transmission wheel on the top of the first transport wheel on the other adjacent side through the third conveyor belt, a seventh transmission wheel is respectively arranged at the bottom of each first transport wheel, a plurality of second transport wheels are arranged at intervals in the horizontal direction on the other side of the first horizontal track, a fixedly connected second transmission wheel and a third transmission wheel are respectively arranged at the top of each second transport wheel, the second transmission wheel is transmission-connected to the second transmission wheel on the top of the second transport wheel on the adjacent side through the seventh conveyor belt, the third transmission wheel is transmission-connected to the third transmission wheel on the top of the second transport wheel on the other adjacent side through the fourth conveyor belt, a sixth transmission wheel is respectively arranged at the bottom of each second transport wheel, the fourth transmission wheel is transmission-connected to one of the sixth transmission wheels through the second conveyor belt, and the fifth transmission wheel is transmission-connected to one of the seventh transmission wheels through the fifth conveyor belt.

[0011] Furthermore, a first fixing rod is fixedly installed on one side of the third fixing plate, the first fixing rod is slidably connected to a second sliding plate in a vertical direction, the second sliding plate is located on the discharge port side of the first horizontal track, the second sliding plate is in conflict with the third horizontal track, a fourth spring is provided on the first fixing rod, one end of the fourth spring is fixedly connected to the second sliding plate, and the other end of the fourth spring is fixedly connected to the third fixing plate. A second fixing rod is fixedly installed on the other side of the third fixing plate, the second fixing rod is slidably connected to a third sliding plate in a vertical direction, the third sliding plate is located on the feed port side of the second horizontal track, the third sliding plate is in conflict with the third horizontal track, a fifth spring is provided on the second fixing rod, one end of the fifth spring is fixedly connected to the third sliding plate, and the other end of the fifth spring is fixedly connected to the third fixing plate.

[0012] Furthermore, the limit clamping mechanism is as follows: first electric cylinders are respectively arranged on both sides of the second support frame, the output end of each first electric cylinder is respectively fixedly connected to the push plate, the two push plates are fixedly connected through a second connecting plate, both ends of each push plate are respectively rotatably connected to one end of a fourth connecting rod, the other end of each fourth connecting rod is respectively rotatably connected to one end of a fifth connecting rod, the other end of each fifth connecting rod is respectively fixedly connected to the second contact plate, fourth sliding grooves are respectively machined on both sides of the third horizontal track and are slidably connected to the two second contact plates in a horizontal direction, a second sliding block is respectively arranged on the other end of each fourth connecting rod, and grooves are respectively machined on both sides of the second support frame and are slidably connected to the second sliding block in a horizontal direction The two second sliding blocks on both sides are connected by a sixth connecting rod; fourth fixing plates are provided at both ends on both sides of the third horizontal track, and each fourth fixing plate is slidably connected to a sliding rod in a horizontal direction, and each sliding rod is fixedly connected to the first connecting plate through a positioning plate, and each positioning plate is located at an end surface of the second fixing plate, contacts with the second fixing plate and limits the second fixing plate. Each sliding rod is provided with a third spring, and one end of each third spring is fixedly connected to the positioning plate, and each fourth fixing plate is machined with a third horizontal sliding hole slidably connected to the first connecting plate in a horizontal direction, and each first connecting plate is rotatably installed with a contact wheel that contacts with the second contact plate.

[0013] Furthermore, one side of the second contact plate is processed with an inclined surface and an arc surface that contacts the contact wheel.

[0014] Furthermore, third slide grooves are respectively processed on both side plates of the third horizontal track to move along the horizontal direction with the semiconductor finished product assembly.

[0015] The beneficial effects of the present invention are as follows: (1) The semiconductor finished component of the present invention is automatically fed to the third horizontal track and enters the interior of the vacuum box, the laser heating module dries multiple semiconductor finished parts of the semiconductor finished component, and the semiconductor finished parts on the rotating plate are turned over, so that multiple sides of the semiconductor finished parts can be evenly dried. After the drying is completed, the semiconductor finished component is automatically unloaded. The present invention has the advantages of high drying efficiency and high degree of automation.

[0016] (2) The two ends of each push plate of the present invention respectively drive the second contact plate to move horizontally on the fourth slide groove through the fourth connecting rod and the fifth connecting rod in turn. When the inclined surface of the second contact plate contacts the contact wheel on the first connecting plate, the first connecting plate slides horizontally in the third horizontal sliding hole of the fourth fixed plate. The first connecting plate drives the positioning plate and the sliding rod to move. The positioning plate moves until it contacts the end surface of the second fixed plate. The four positioning plates respectively limit and clamp the two ends of the second fixed plate, which has the advantage of stable clamping.

[0017] (3) The two ends of the transmission shaft of the present invention respectively drive the first sliding plate to move in the two first sliding grooves on the same side along the vertical direction through the first connecting rod and the second connecting rod in turn, and the first sliding blocks at one end of the two third connecting rods at both ends of the bottom plate slide on the first horizontal sliding holes of the first sliding plate respectively, which can automatically drive the two bottom plates to close or open. When the two bottom plates are closed, the laser heating module dries the multiple semiconductor finished parts of the semiconductor finished assembly. When the two bottom plates are opened, the horizontal plane of the third horizontal track moves to the same horizontal plane as the horizontal plane of the first horizontal track and the horizontal plane of the second horizontal track. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of an embodiment of a device for drying semiconductor material parts after they are manufactured according to the present invention.

[0019] Figure 2 yes Figure 1 Schematic diagram of the structure without the vacuum box.

[0020] Figure 3 It is a structural diagram of the driving mechanism.

[0021] Figure 4 It is a schematic diagram of the structure of two base plates.

[0022] Figure 5 Schematic diagram of the structure of the first sliding plate.

[0023] Figure 6 It is a schematic diagram of the structure of a finished semiconductor component.

[0024] Figure 7 It is a schematic diagram of the structure of the second fixed plate and the rotating plate.

[0025] Figure 8 It is a structural schematic diagram of a semiconductor finished product, a second spring and a clamping plate.

[0026] Fig. 9 It is a structural schematic diagram of the card board.

[0027] Fig.10 It is a structural diagram of the feeding mechanism, the limit clamping mechanism and the discharging structure.

[0028] Fig.11 It is a structural schematic diagram of a third fixed plate, a fourth spring, a first fixed rod and a second sliding plate.

[0029] Fig.12 It is a schematic diagram of the structure of the first horizontal track and the semiconductor finished product assembly.

[0030] Fig.13 It is a structural diagram of the feeding mechanism.

[0031] Fig.14 It is a structural schematic diagram of the limit clamping mechanism.

[0032] Fig.15 yes Fig.14 Schematic diagram of the structure from the first angle.

[0033] Fig.16 yes Fig.14 Structural schematic diagram from the second angle.

[0034] Fig.17 yes Fig.16 The schematic diagram of the structure without the third horizontal track and the second support frame.

[0035] Fig.18 yes Fig.17 The structural diagram of the fourth fixing plate is removed.

[0036] Fig.19 It is a schematic diagram of the parts structure on the fourth fixed plate.

[0037] Fig. 20 Schematic diagram of the structure of the second contact plate.

[0038] Fig.21 It is a schematic diagram of the structure of the third motor, the push plate and the semiconductor finished product assembly.

[0039] Figure numerals: 1, vacuum box; 2, vacuum generator; 3, driving mechanism; 301, transmission shaft; 302, first conveyor belt; 303, first motor; 304, first connecting rod; 305, second connecting rod; 306, first fixed plate; 307, first slide groove; 308, first sliding plate; 309, first horizontal sliding hole; 3091, first vertical sliding hole; 3092, inclined sliding hole; 3093, second vertical sliding hole; 310, third connecting rod; 311, first slider; 312, first transmission wheel; 4, semiconductor finished product assembly; 401, semiconductor finished product; 402, second fixed plate; 403, partition ; 404, outer ring; 405, snap-in hole; 406, inner ring disk; 407, first contact plate; 408, first spring; 409, snap-in rod; 410, second spring; 411, snap-in plate; 412, rotating plate; 413, snap-in groove; 5, feeding mechanism; 501, second motor; 502, first transport wheel; 503, second slide groove; 504, second transmission wheel; 505, third transmission wheel; 506, second transport wheel; 507, second conveyor belt; 508, third conveyor belt; 509, fourth conveyor belt; 510, fourth transmission wheel; 511, first gear; 512, second gear; 513, fifth transmission wheel; 514, fifth conveyor belt; 515, sixth transmission wheel; 516, seventh transmission wheel; 517, eighth transmission wheel; 518, ninth transmission wheel; 519, sixth conveyor belt; 520, seventh conveyor belt; 6, first horizontal track; 7, support; 8, limit clamping mechanism; 801, first electric cylinder; 802, third spring; 803, contact wheel; 804, fourth connecting rod; 805, fifth connecting rod; 806, second contact plate; 807, push plate; 808, positioning plate; 809, fourth slide groove; 810, first connecting plate; 811, second horizontal slide hole; 812, second slider; 813, third horizontal slide hole ;814, fourth fixed plate;815, sixth connecting rod;816, second connecting plate;817, sliding rod;818, first support frame;819, inclined surface;820, arc surface;9, discharge structure;10, second horizontal track;11, laser heating module;12, third horizontal track;13, bottom plate;14, second electric cylinder;15, guide rod;16, third fixed plate;17, fourth spring;18, first fixed rod;19, second sliding plate;20, third slide groove;21, third motor;22, push plate;23, second support frame;24, third sliding plate;25, fifth spring;26, second fixed rod. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0041] like Figure 1 to Figure 2 , Fig.10 , Fig.21 As shown, the semiconductor material post-drying device of this embodiment is composed of a vacuum box 1, a vacuum generator 2, a driving mechanism 3, a semiconductor finished product assembly 4, a feeding mechanism 5, a first horizontal rail 6, a support 7, a limit clamping mechanism 8, a discharging structure 9, a second horizontal rail 10, a laser heating module 11, a third horizontal rail 12, a base plate 13, a second electric cylinder 14, a guide rod 15, a third fixed plate 16, a fourth spring 17, a first fixed rod 18, a second sliding plate 19, a third slide 20, a third motor 21, a push plate 22, a second support frame 23, a third sliding plate 24, a fifth spring 25, and a second fixed rod 26.

[0042] A vacuum box 1 is arranged on the support 7, a vacuum generator 2 is arranged on the vacuum box 1, a third horizontal track 12 moving in the vertical direction is arranged inside the vacuum box 1, a second electric cylinder 14 is arranged on the support 7, an output end of the second electric cylinder 14 is fixedly connected to a second support frame 23, a guide rod 15 moving in the vertical direction with the support 7 is arranged at the bottom of the second support frame 23, the second support frame 23 is fixedly installed at the bottom of the third horizontal track 12, a semiconductor finished product assembly 4 is arranged on the third horizontal track 12, and third slide grooves 20 moving in the horizontal direction with the semiconductor finished product assembly 4 are respectively processed on both side plates of the third horizontal track 12, a limiting clamping mechanism 8 for clamping and positioning the semiconductor finished product assembly 4 is arranged on the third horizontal track 12, and a positioning mechanism 8 for clamping and positioning the semiconductor finished product assembly 4 is arranged on the top of the vacuum box 1. A laser heating module 11 is provided for drying the component 4, two bottom plates 13 are provided at the bottom opening of the vacuum box 1, a driving mechanism 3 is provided on the support 7 for driving the two bottom plates 13 to move horizontally at the bottom of the vacuum box 1, and the horizontal movement directions of the two bottom plates 13 are opposite, a third fixed plate 16 is provided on the support 7 and is located at the bottom of the vacuum box 1, a first horizontal track 6 is provided on one side of the bottom of the vacuum box 1, a feeding mechanism 5 is provided on the first horizontal track 6 and is used to drive the semiconductor finished component 4 to move horizontally on the first horizontal track 6 for feeding, a second horizontal track 10 is provided on the third fixed plate 16 and is located on the other side of the bottom of the vacuum box 1, and a discharging structure 9 is provided on the second horizontal track 10 and is used to drive the semiconductor finished component 4 to discharge materials horizontally on the second horizontal track 10.

[0043] A first fixed rod 18 is fixedly installed on one side of the third fixed plate 16, and the first fixed rod 18 is slidably connected to a second sliding plate 19 in a vertical direction. The second sliding plate 19 is located on the discharge port side of the first horizontal track 6, and the second sliding plate 19 is in conflict with the third horizontal track 12. A fourth spring 17 is provided on the first fixed rod 18, and one end of the fourth spring 17 is fixedly connected to the second sliding plate 19, and the other end of the fourth spring 17 is fixedly connected to the third fixed plate 16. A second fixed rod 26 is fixedly installed on the other side of the third fixed plate 16, and the second fixed rod 26 is slidably connected to a third sliding plate 24 in a vertical direction. The third sliding plate 24 is located on the feed port side of the second horizontal track 10, and the third sliding plate 24 is in conflict with the third horizontal track 12. A fifth spring 25 is provided on the second fixed rod 26, and one end of the fifth spring 25 is fixedly connected to the third sliding plate 24, and the other end of the fifth spring 25 is fixedly connected to the third fixed plate 16.

[0044] like Figures 3 to 5 As shown, the driving mechanism 3 is composed of a transmission shaft 301, a first conveyor belt 302, a first motor 303, a first connecting rod 304, a second connecting rod 305, a first fixed plate 306, a first slide groove 307, a first sliding plate 308, a first horizontal slide hole 309, a first vertical slide hole 3091, an inclined slide hole 3092, a second vertical slide hole 3093, a third connecting rod 310, a first slider 311, and a first transmission wheel 312.

[0045] The driving mechanism 3 is as follows: two first fixed plates 306 located on both sides of the vacuum box 1 are respectively arranged on the support 7, a first sliding plate 308 is slidably connected between the two first fixed plates 306 on the same side in a vertical direction, each first fixed plate 306 is respectively processed with a first sliding groove 307 slidably connected to the first sliding plate 308 in a vertical direction, each first sliding plate 308 is rotatably connected to one end of the second connecting rod 305, the other end of each second connecting rod 305 is rotatably connected to one end of the first connecting rod 304, the other end of each first connecting rod 304 is fixedly connected to one end of the transmission shaft 301, a first motor 303 is arranged on the top of the vacuum box 1, the output shaft of the first motor 303 is fixedly connected to the first transmission wheel 312, the first transmission wheel 312 is transmission-connected to the transmission shaft 301 through the first conveyor belt 302, and the transmission shaft 301 is rotatably connected to the top of the vacuum box 1.

[0046] Both sides of each bottom plate 13 are fixedly connected to one end of the third connecting rod 310, and the other end of each third connecting rod 310 is respectively provided with a first slider 311, and each first sliding plate 308 is respectively processed with two first horizontal sliding holes 309 slidably connected with the first slider 311. The first horizontal sliding hole 309 includes a first vertical sliding hole 3091, an inclined sliding hole 3092, and a second vertical sliding hole 3093, wherein the top end of the inclined sliding hole 3092 is processed with a first vertical sliding hole 3091 interconnected therewith, and the bottom end of the inclined sliding hole 3092 is processed with a second vertical sliding hole 3093 interconnected therewith.

[0047] like Figures 6 to 9 , Fig.21 As shown, the semiconductor finished product assembly 4 is composed of a semiconductor finished product part 401, a second fixed plate 402, a partition 403, an outer ring 404, a snap-in hole 405, an inner ring disk 406, a first contact plate 407, a first spring 408, a snap-in rod 409, a second spring 410, a snap-in plate 411, a rotating plate 412, and a snap-in groove 413.

[0048] The semiconductor finished product assembly 4 is as follows: a rotating plate 412 is rotatably mounted on the second fixed plate 402, outer rings 404 are respectively arranged at both ends of the second fixed plate 402, inner ring disks 406 are respectively arranged at both ends of the rotating plate 412, each inner ring disk 406 is respectively located inside each outer ring 404, each inner ring disk 406 is respectively provided with a first contact plate 407, each inner ring disk 406 is respectively slidably connected with a clamping rod 409, each clamping rod 409 is respectively provided with a first spring 408, and the first spring One end of the spring 408 is fixedly connected to the first contact plate 407, and the other end of the first spring 408 is fixedly connected to one end of the clamping rod 409. The outer ring 404 is symmetrically processed in the circumferential direction with two clamping holes 405 clamped with the clamping rod 409. A plurality of partitions 403 are arranged at intervals in the horizontal direction on the rotating plate 412. Each partition 403 is connected to the clamping plate 411 through the second spring 410. Each clamping plate 411 is processed with a clamping groove 413 clamped to one end of the semiconductor finished product 401.

[0049] The structure of the feeding mechanism 5 is the same as that of the discharging mechanism 9. Figures 10 to 13 As shown, the feeding mechanism 5 is composed of a second motor 501, a first transport wheel 502, a second slide 503, a second transmission wheel 504, a third transmission wheel 505, a second transport wheel 506, a second conveyor belt 507, a third conveyor belt 508, a fourth conveyor belt 509, a fourth transmission wheel 510, a first gear 511, a second gear 512, a fifth transmission wheel 513, a fifth conveyor belt 514, a sixth transmission wheel 515, a seventh transmission wheel 516, an eighth transmission wheel 517, a ninth transmission wheel 518, a sixth conveyor belt 519, and a seventh conveyor belt 520.

[0050] The feeding mechanism 5 is as follows: second slide grooves 503 which are slidably connected to the semiconductor finished component 4 in the horizontal direction are respectively processed on the two side plates of the first horizontal track 6, a second motor 501 is arranged at the bottom of the first horizontal track 6, the output shaft of the second motor 501 is fixedly connected to the first gear 511, a fourth transmission wheel 510 is fixedly installed on the top of the first gear 511, a second gear 512 which is meshed and driven with the first gear 511 is arranged at the bottom of the first horizontal track 6, a fifth transmission wheel 513 is arranged on the top of the second gear 512, a plurality of first transport wheels 502 are arranged at intervals in the horizontal direction on one side of the first horizontal track 6, an eighth transmission wheel 517 and a ninth transmission wheel 518 which are fixedly connected are respectively arranged on the top of each first transport wheel 502, the eighth transmission wheel 517 is transmission-connected to the eighth transmission wheel 517 on the top of the first transport wheel 502 on the adjacent side through the sixth conveyor belt 519, and the ninth transmission wheel 518 is transmission-connected to the ninth transmission wheel 518 on the adjacent side through the third conveyor belt 508. The ninth transmission wheel 518 at the top of a transport wheel 502 is transmission connected, a seventh transmission wheel 516 is respectively arranged at the bottom of each first transport wheel 502, a plurality of second transport wheels 506 are arranged at intervals in the horizontal direction on the other side of the first horizontal track 6, a fixedly connected second transmission wheel 504 and a third transmission wheel 505 are respectively arranged at the top of each second transport wheel 506, the second transmission wheel 504 is transmission connected to the second transmission wheel 504 at the top of the second transport wheel 506 on the adjacent side through the seventh conveyor belt 520, the third transmission wheel 505 is transmission connected to the third transmission wheel 505 at the top of the second transport wheel 506 on the other adjacent side through the fourth conveyor belt 509, a sixth transmission wheel 515 is respectively arranged at the bottom of each second transport wheel 506, the fourth transmission wheel 510 is transmission connected to one of the sixth transmission wheels 515 through the second conveyor belt 507, and the fifth transmission wheel 513 is transmission connected to one of the seventh transmission wheels 516 through the fifth conveyor belt 514.

[0051] like Figures 14 to 20 As shown, the limit clamping mechanism 8 is composed of a first electric cylinder 801, a third spring 802, a resistance wheel 803, a fourth connecting rod 804, a fifth connecting rod 805, a second resistance plate 806, a push plate 807, a positioning plate 808, a fourth slide groove 809, a first connecting plate 810, a second horizontal slide hole 811, a second slider 812, a third horizontal slide hole 813, a fourth fixed plate 814, a sixth connecting rod 815, a second connecting plate 816, a slide rod 817, a first support frame 818, an inclined surface 819, and an arc surface 820.

[0052] The limiting clamping mechanism 8 is as follows: first electric cylinders 801 are respectively arranged on both sides of the second support frame 23, the output ends of each first electric cylinder 801 are respectively fixedly connected to the push plates 807, the two push plates 807 are fixedly connected through a second connecting plate 816, both ends of each push plate 807 are respectively rotatably connected to one end of the fourth connecting rod 804, the other end of each fourth connecting rod 804 is respectively rotatably connected to one end of the fifth connecting rod 805, the other end of each fifth connecting rod 805 is respectively fixedly connected to the second contact plate 806, fourth sliding grooves 809 are respectively processed on both sides of the third horizontal rail 12 and are slidably connected to the two second contact plates 806 in the horizontal direction, and a second sliding block 812 is respectively arranged on the other end of each fourth connecting rod 804, and second horizontal sliding holes 811 are respectively processed on both sides of the second support frame 23 and are slidably connected to the second sliding block 812 in the horizontal direction, and the two second sliding blocks 812 on both sides are respectively connected by a sixth connecting rod 815.

[0053] Fourth fixed plates 814 are respectively provided at both ends of both sides of the third horizontal rail 12, and each fourth fixed plate 814 is respectively connected with a sliding rod 817 for sliding in the horizontal direction, and each sliding rod 817 is respectively fixedly connected to the first connecting plate 810 through a positioning plate 808, and each positioning plate 808 is respectively located at the end surface of the second fixed plate 402 to contact and limit the second fixed plate 402, and each sliding rod 817 is respectively provided with a third spring 802, and one end of each third spring 802 is respectively fixedly connected to the positioning plate 808, and each fourth fixed plate 814 is respectively processed with a third horizontal sliding hole 813 that is slidably connected to the first connecting plate 810 in the horizontal direction, and each first connecting plate 810 is respectively rotatably installed with a contact wheel 803 that contacts the second contact plate 806, and one side of the second contact plate 806 is processed with an inclined surface 819 and an arc surface 820 that contacts the contact wheel 803.

[0054] A first support frame 818 is provided on the inner side wall of the vacuum box 1 , and a third motor 21 is provided on the first support frame 818 . The output shaft of the third motor 21 is fixedly connected to the push plate 22 . The push plate 22 is located above the first contact plate 407 and contacts the first contact plate 407 .

[0055] The working principle of this embodiment is as follows: a plurality of semiconductor finished products 401 are placed on the rotating plate 412, and the plurality of semiconductor finished products 401 are respectively connected to the corresponding connecting grooves 413 of the connecting plate 411, and the driving mechanism 3 drives the two bottom plates 13 to slide in the horizontal direction at the bottom of the vacuum box 1, and the driving mechanism 3 opens the two bottom plates 13 at the bottom of the vacuum box 1, and the output end of the second electric cylinder 14 drives the second support frame 23, the third horizontal rail 12, and the limit clamping mechanism 8 to move downward in the vertical direction, and at the same time, the guide rod 15 at the bottom of the second support frame 23 moves in the vertical direction on the third fixed plate 16 and the support 7, and one end of the bottom of the third horizontal rail 12 moves to the top of the second sliding plate 19 and contacts the top of the second sliding plate 19 , the second sliding plate 19 moves on the first fixed rod 18 in the vertical direction, the second sliding plate 19 moves to be separated from the discharge port of the first horizontal track 6, the other end of the bottom of the third horizontal track 12 moves to the top of the third sliding plate 24 and contacts the top of the third sliding plate 24, the third sliding plate 24 moves on the second fixed rod 26 in the vertical direction, the third sliding plate 24 moves to be separated from the feed port of the second horizontal track 10, the feed port of the third horizontal track 12 moves to be connected with the feed port of the first horizontal track 6, the discharge port of the third horizontal track 12 moves to be connected with the feed port of the second horizontal track 10, and the horizontal plane of the third horizontal track 12 is respectively connected with the horizontal plane of the first horizontal track 6 and the horizontal plane of the second horizontal track 10 The semiconductor finished component 4 is placed between the second slide grooves 503 on both side plates of the first horizontal track 6. The feeding mechanism 5 drives the semiconductor finished component 4 to move horizontally on the second slide grooves 503 on both sides of the first horizontal track 6. The semiconductor finished component 4 moves on the third slide grooves 20 on both sides of the third horizontal track 12. The semiconductor finished component 4 stops moving. The limit clamping mechanism 8 limits and clamps the semiconductor finished component 4 on the third horizontal track 12. The output end of the second electric cylinder 14 drives the second support frame 23, the third horizontal track 12, the semiconductor finished component 4 and the limit clamping mechanism 8 to move upward in the vertical direction. The semiconductor finished component 4 moves to below the laser heating module 11 inside the vacuum box 1. The first contact plates 407 at both ends of the rotating plate 412 move to the bottom of the pushing plate 22 and contact with the bottom of the pushing plate 22, the driving mechanism 3 closes the two bottom plates 13 at the bottom of the vacuum box 1, the vacuum generator 2 evacuates the vacuum box 1, the laser heating module 11 dries multiple semiconductor finished products 401 of the semiconductor finished product assembly 4, the output shaft of the third motor 21 drives the pushing plate 22 to rotate, the pushing plate 22 drives the first contact plate 407 to rotate, the first contact plate 407 drives the rotating plate 412 to rotate on the second fixed plate 402, the clamping rod 409 is clamped with the clamping hole 405 on the outer ring 404, and the semiconductor finished product 401 on the rotating plate 412 is flipped, so as to facilitate the drying of multiple sides of the semiconductor finished product 401.

[0056] After the drying of the semiconductor finished product 401 is completed, the driving mechanism 3 opens the two bottom plates 13 at the bottom of the vacuum box 1, and the output end of the second electric cylinder 14 drives the second support frame 23, the third horizontal rail 12, the semiconductor finished product assembly 4, and the limit clamping mechanism 8 to move downward in the vertical direction. At the same time, the guide rod 15 at the bottom of the second support frame 23 moves in the vertical direction on the third fixed plate 16 and the support 7, and the discharge port of the third horizontal rail 12 moves to be connected with the feed port of the second horizontal rail 10. The horizontal plane of the third horizontal rail 12 is respectively fed with the horizontal plane of the first horizontal rail 6 and the second horizontal rail 10 to push the dried semiconductor finished product assembly 4 onto the second horizontal rail 10. The discharge structure 9 discharges the semiconductor finished product assembly 4 on the second horizontal rail 10, and pushes the next semiconductor finished product assembly 4 onto the third horizontal rail 12 to dry the next semiconductor finished product assembly 4.

[0057] Among them, the driving mechanism 3 drives the two bottom plates 13 to slide in the horizontal direction at the bottom of the vacuum box 1 respectively. The working principle of the driving mechanism 3 to open the two bottom plates 13 at the bottom of the vacuum box 1 is: the output shaft of the first motor 303 drives the first transmission wheel 312 to rotate, and the first transmission wheel 312 drives the transmission shaft 301 to rotate through the first conveyor belt 302, and the two ends of the transmission shaft 301 respectively drive the first sliding plate 308 to move in the vertical direction in the two first sliding grooves 307 on the same side through the first connecting rod 304 and the second connecting rod 305 in turn, and the first sliders 311 at one end of the two third connecting rods 310 at both ends of the bottom plate 13 slide on the first horizontal sliding holes 309 of the first sliding plate 308 respectively, when the first slider 311 is located in the second vertical sliding hole 3093 of the first sliding plate 308, the two bottom plates 13 are closed, and when the first slider 311 is located in the first vertical sliding hole 3091 of the first sliding plate 308, the two bottom plates 13 are opened.

[0058] The working principle of the feeding mechanism 5 driving the finished semiconductor assembly 4 to move horizontally on the second slide slots 503 on both sides is as follows: the output shaft of the second motor 501 drives the first gear 511 to rotate, the first gear 511 drives the fourth transmission wheel 510 to rotate, the fourth transmission wheel 510 drives the sixth transmission wheel 515 to rotate through the second conveyor belt 507, the sixth transmission wheel 515 drives the second transport wheel 506 to rotate, the second transmission wheel 504 on the top of the second transport wheel 506 drives the second transport wheel 506 on the adjacent side to rotate through the seventh conveyor belt 520, the second transport wheel 506 drives the second transport wheel 506 on the other side to rotate through the fourth conveyor belt 509, and multiple The second transport wheel 506 rotates, the first gear 511 is meshed with the second gear 512 for transmission, the second gear 512 drives the fifth transmission wheel 513 to rotate, the fifth transmission wheel 513 drives the seventh transmission wheel 516 to rotate through the fifth conveyor belt 514, the seventh transmission wheel 516 drives the first transport wheel 502 to rotate, the eighth transmission wheel 517 on the top of the first transport wheel 502 drives the first transport wheel 502 on the adjacent side to rotate through the sixth conveyor belt 519, the ninth transmission wheel 518 drives the first transport wheel 502 on the other adjacent side to rotate through the third conveyor belt 508, multiple second transport wheels 506 and multiple first transport wheels 502 rotate to transport and feed the semiconductor finished components 4.

[0059] The working principle of the position limiting clamping mechanism 8 for position limiting clamping the semiconductor finished component 4 on the third horizontal rail 12 is as follows: the output ends of the first electric cylinders 801 on both sides of the second support frame 23 respectively drive the push plates 807 to move in the vertical direction on the second support frame 23, and the two ends of each push plate 807 respectively drive the second contact plate 806 to move in the horizontal direction on the fourth slide groove 809 of the second support frame 23 through the fourth connecting rod 804 and the fifth connecting rod 805 in turn, and each fourth connecting rod 804 respectively drives the second slider 812 to move in the second horizontal slide hole When the inclined surface 819 of the second contact plate 806 contacts the contact wheel 803 on the first connecting plate 810, the first connecting plate 810 slides horizontally in the third horizontal sliding hole 813 of the fourth fixing plate 814, and the first connecting plate 810 drives the positioning plate 808 and the sliding rod 817 to move. The sliding rod 817 moves horizontally on the fourth fixing plate 814, and the positioning plate 808 moves to contact the end surface of the second fixing plate 402. The four positioning plates 808 respectively limit and clamp the two ends of the second fixing plate 402. When the arc surface 820 of the second contact plate 806 contacts the contact wheel 803 on the first connecting plate 810, the four positioning plates 808 separate the two ends of the second fixing plate 402 respectively.

[0060] The working principle of the driving mechanism 3 closing the two bottom plates 13 at the bottom of the vacuum box 1 is the same as the working principle of the driving mechanism 3 opening the two bottom plates 13 at the bottom of the vacuum box 1 .

[0061] The working principle of the discharge structure 9 for discharging the finished semiconductor components 4 on the second horizontal track 10 is the same as the working principle of the feeding mechanism 5 driving the finished semiconductor components 4 to move horizontally on the second slide slots 503 on both sides.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. A drying device for semiconductor material parts after they are manufactured, characterized in that: A vacuum box (1) is arranged on a support (7), a vacuum generator (2) is arranged on the vacuum box (1), a third horizontal track (12) is arranged inside the vacuum box (1) for moving in a vertical direction, a semiconductor finished product component (4) is arranged on the third horizontal track (12), a limit clamping mechanism (8) for clamping and positioning the semiconductor finished product component (4) is arranged on the third horizontal track (12), a laser heating module (11) is arranged at the top of the vacuum box (1) for drying the semiconductor finished product component (4) on the third horizontal track (12), two bottom plates (13) are arranged at the bottom opening of the vacuum box (1), and a mechanism for driving the two bottom plates (13) to move in a horizontal direction at the bottom of the vacuum box (1) is arranged on the support (7). A driving mechanism (3), wherein the horizontal movement directions of the two bottom plates (13) are opposite, a third fixed plate (16) located at the bottom of the vacuum box (1) is arranged on the support (7), a first horizontal track (6) located at one side of the bottom of the vacuum box (1) is arranged on one side of the third fixed plate (16), a feeding mechanism (5) is arranged on the first horizontal track (6) for driving the semiconductor finished component (4) to move in a horizontal direction on the first horizontal track (6) for feeding, a second horizontal track (10) is arranged on the third fixed plate (16) located at the other side of the bottom of the vacuum box (1), and a discharge structure (9) is arranged on the second horizontal track (10) for driving the semiconductor finished component (4) to discharge in a horizontal direction on the second horizontal track (10); The semiconductor finished product assembly (4) comprises: a rotating plate (412) is rotatably mounted on a second fixed plate (402); outer rings (404) are respectively arranged at both ends of the second fixed plate (402); inner ring disks (406) are respectively arranged at both ends of the rotating plate (412); each inner ring disk (406) is respectively located inside each outer ring (404); each inner ring disk (406) is respectively provided with a first contact plate (407); each inner ring disk (406) is respectively slidably connected to a clamping rod (409); each clamping rod (409) is respectively provided with a first spring (408); One end of a spring (408) is fixedly connected to the first contact plate (407), and the other end of the first spring (408) is fixedly connected to one end of a clamping rod (409). The outer ring (404) is symmetrically processed in the circumferential direction with two clamping holes (405) that are clamped to the clamping rod (409). A plurality of partitions (403) are arranged at intervals in the horizontal direction on the rotating plate (412). Each partition (403) is connected to the clamping plate (411) via a second spring (410). Each clamping plate (411) is processed with a clamping groove (413) that is clamped to one end of a semiconductor finished product (401).

2. The device for drying semiconductor material after manufacture according to claim 1, characterized in that: A second electric cylinder (14) is arranged on the support (7), an output end of the second electric cylinder (14) is fixedly connected to a second support frame (23), a guide rod (15) is arranged at the bottom of the second support frame (23) and moves in a vertical direction with respect to the support (7), and the second support frame (23) is fixedly mounted at the bottom of the third horizontal track (12).

3. The device for drying semiconductor material after manufacture according to claim 1, characterized in that: A first support frame (818) is provided on the inner side wall of the vacuum box (1), a third motor (21) is provided on the first support frame (818), an output shaft of the third motor (21) is fixedly connected to a push plate (22), and the push plate (22) is located above the first contact plate (407) and contacts the first contact plate (407).

4. The semiconductor material post-production drying device according to claim 1, characterized in that: The driving mechanism (3) comprises: two first fixed plates (306) located on both sides of the vacuum box (1) are respectively arranged on the support (7); a first sliding plate (308) is slidably connected between the two first fixed plates (306) on the same side in a vertical direction; each first fixed plate (306) is respectively processed with a first sliding groove (307) slidably connected to the first sliding plate (308) in a vertical direction; each first sliding plate (308) is rotatably connected to one end of the second connecting rod (305); the other end of each second connecting rod (305) is rotatably connected to one end of the first connecting rod (304); the other end of each first connecting rod (304) is respectively fixedly connected to one end of the transmission shaft (301); a first motor (303) is arranged on the top of the vacuum box (1); the output shaft of the first motor (303) is fixedly connected to the first transmission wheel (312); the first transmission wheel (312) is transmission-connected to the transmission shaft (301) through the first conveyor belt (302); Both sides of each bottom plate (13) are respectively fixedly connected to one end of a third connecting rod (310), the other end of each third connecting rod (310) is respectively provided with a first sliding block (311), and each first sliding plate (308) is respectively processed with two first horizontal sliding holes (309) for sliding connection with the first sliding blocks (311).

5. The device for drying semiconductor material after manufacture according to claim 4, characterized in that: Each of the first horizontal sliding holes (309) comprises a first vertical sliding hole (3091), an inclined sliding hole (3092) and a second vertical sliding hole (3093); a first vertical sliding hole (3091) is processed at a top end of the inclined sliding hole (3092) and is interconnected with the first vertical sliding hole (3091); a second vertical sliding hole (3093) is processed at a bottom end of the inclined sliding hole (3092) and is interconnected with the second vertical sliding hole (3093).

6. The semiconductor material post-production drying device according to claim 1, characterized in that: The structure of the feeding mechanism (5) is the same as that of the discharging structure (9), and the feeding mechanism (5) comprises: second slide grooves (503) are respectively processed on the two side plates of the first horizontal track (6) and are slidably connected to the semiconductor finished component (4) in the horizontal direction; a second motor (501) is arranged at the bottom of the first horizontal track (6); the output shaft of the second motor (501) is fixedly connected to the first gear (511); a fourth transmission wheel (510) is fixedly installed on the top of the first gear (511); and a second transmission wheel (510) is arranged at the bottom of the first horizontal track (6) and is connected to the first gear (511). ) is meshed with a second gear (512) for transmission, a fifth transmission wheel (513) is arranged on the top of the second gear (512), a plurality of first transport wheels (502) are arranged at intervals in the horizontal direction on one side of the first horizontal track (6), an eighth transmission wheel (517) and a ninth transmission wheel (518) are respectively arranged on the top of each first transport wheel (502) for fixed connection, the eighth transmission wheel (517) is transmission-connected to the eighth transmission wheel (517) on the top of the first transport wheel (502) on the adjacent side via a sixth conveyor belt (519), and the ninth transmission wheel (518) is transmission-connected to the eighth transmission wheel (517) on the top of the first transport wheel (502) on the adjacent side via a third conveyor belt (519). The conveyor belt (508) is connected to the ninth transmission wheel (518) at the top of the first transport wheel (502) on the other side, and each first transport wheel (502) is provided with a seventh transmission wheel (516) at the bottom. A plurality of second transport wheels (506) are arranged at intervals in the horizontal direction on the other side of the first horizontal track (6). A second transmission wheel (504) and a third transmission wheel (505) are provided at the top of each second transport wheel (506) and are fixedly connected. The second transmission wheel (504) is connected to the second transport wheel (504) on the adjacent side through the seventh conveyor belt (520). 6) is connected to the second transmission wheel (504) at the top, the third transmission wheel (505) is connected to the third transmission wheel (505) at the top of the second transport wheel (506) on the other side through a fourth conveyor belt (509), a sixth transmission wheel (515) is provided at the bottom of each second transport wheel (506), the fourth transmission wheel (510) is connected to one of the sixth transmission wheels (515) through a second conveyor belt (507), and the fifth transmission wheel (513) is connected to one of the seventh transmission wheels (516) through a fifth conveyor belt (514).

7. The device for drying semiconductor material after manufacture according to claim 1, characterized in that: A first fixing rod (18) is fixedly mounted on one side of the third fixing plate (16), and the first fixing rod (18) is slidably connected to a second sliding plate (19) in a vertical direction, and the second sliding plate (19) is located on one side of the discharge port of the first horizontal track (6), and the second sliding plate (19) is in contact with the third horizontal track (12). A fourth spring (17) is arranged on the first fixing rod (18), and one end of the fourth spring (17) is fixedly connected to the second sliding plate (19), and the other end of the fourth spring (17) is fixedly connected to the third fixing plate (16). A second fixed rod (26) is fixedly installed on the other side of the third fixed plate (16), and the second fixed rod (26) is slidably connected to the third sliding plate (24) along the vertical direction. The third sliding plate (24) is located on the feeding port side of the second horizontal track (10). The third sliding plate (24) is in contact with the third horizontal track (12). A fifth spring (25) is arranged on the second fixed rod (26), and one end of the fifth spring (25) is fixedly connected to the third sliding plate (24), and the other end of the fifth spring (25) is fixedly connected to the third fixed plate (16).

8. The device for drying semiconductor material after manufacture according to claim 1, characterized in that: The position limiting clamping mechanism (8) comprises: first electric cylinders (801) are respectively arranged on both sides of the second support frame (23); the output end of each first electric cylinder (801) is respectively fixedly connected to a push plate (807); the two push plates (807) are fixedly connected via a second connecting plate (816); both ends of each push plate (807) are respectively rotatably connected to one end of a fourth connecting rod (804); the other end of each fourth connecting rod (804) is respectively rotatably connected to one end of a fifth connecting rod (805); the other end of each fifth connecting rod (805) is The third horizontal track (12) is respectively fixedly connected to the second contact plates (806), and fourth sliding grooves (809) are respectively processed on both sides of the third horizontal track (12) and are slidably connected to the two second contact plates (806) in the horizontal direction. The other end of each fourth connecting rod (804) is respectively provided with a second sliding block (812), and the second support frame (23) is respectively processed on both sides of the second horizontal sliding hole (811) and is slidably connected to the second sliding block (812) in the horizontal direction. The two second sliding blocks (812) on both sides are respectively connected by a sixth connecting rod (815); Fourth fixing plates (814) are respectively arranged at both ends of both sides of the third horizontal track (12); each fourth fixing plate (814) is respectively connected to a sliding rod (817) in a sliding manner in a horizontal direction; each sliding rod (817) is respectively fixedly connected to the first connecting plate (810) via a positioning plate (808); each positioning plate (808) is respectively located on an end surface of the second fixing plate (402) to abut against and limit the second fixing plate (402); each sliding rod (817) is respectively arranged to have a third spring (802); one end of each third spring (802) is respectively fixedly connected to the positioning plate (808); each fourth fixing plate (814) is respectively processed with a third horizontal sliding hole (813) connected to the first connecting plate (810) in a sliding manner in a horizontal direction; each first connecting plate (810) is respectively rotatably mounted with a contact wheel (803) that contacts the second contact plate (806).

9. The device for drying semiconductor material after manufacture according to claim 8, characterized in that: One side of the second contact plate (806) is processed with an inclined surface (819) and an arc surface (820) that contact the contact wheel (803).

10. The device for drying semiconductor material after manufacture according to claim 1, characterized in that: The third horizontal track (12) is provided with third slide grooves (20) on both side plates thereof, which are respectively configured to move in a horizontal direction with the semiconductor finished product assembly (4).

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