Service life evaluation system of silicon-based passive device

Abstract

The invention provides a service life evaluation system for silicon-based passive devices, which relates to the technical field of electric appliance performance evaluation and comprises an upper computer, a main control signal module, a power supply module, a constant temperature box, a multi-terminal test interface module and a plurality of silicon-based passive devices. The plurality of silicon-based passive devices are inserted into the multi-terminal test interface module; the power supply module comprises a working power supply and a high-voltage direct-current power supply; the working power supply and the high-voltage direct-current power supply are both electrically connected with the main control signal module, the main control signal module is electrically connected with the multi-terminal test interface module, and the multi-terminal test interface module is placed in the constant-temperature box; performing an accelerated stress test on the silicon-based passive device inserted into the multi-terminal test interface module to obtain an accelerated stress test result; and evaluating the service life of the silicon-based passive device based on an accelerated stress test result. According to the invention, the test efficiency is improved, and the accuracy and practicability of life prediction are enhanced.

Description

Technical Field

[0001] The invention relates to the technical field of electrical performance evaluation, and in particular to a life evaluation system for silicon-based passive devices. Background Art

[0002] In high-tech fields such as optical communications, LiDAR, and GPU system design, silicon-based passive devices (especially silicon capacitors) are widely used due to their unique performance. These application scenarios place high demands on the life of silicon capacitors, accompanied by a large demand for shipments. Therefore, quickly and accurately testing the reliability life of silicon capacitors is crucial to promoting the marketization of products.

[0003] At present, the life of silicon capacitors is mainly affected by the three characteristic quantities of dielectric film thickness, operating temperature and operating voltage. Under rated voltage and room temperature conditions, the life of silicon capacitors may be as long as decades or even hundreds of years. In order to predict the life, the industry usually adopts accelerated stress experiments and makes predictions based on the statistical analysis results of experimental data. Traditional accelerated stress test methods can usually only perform single-terminal tests, that is, only one sample can be tested in one experiment, which limits the test efficiency and increases the test cost. At the same time, the existing test methods (such as those mentioned in patent CN106501645A) are mainly aimed at general metallized film capacitors, and are not targeted at silicon capacitors, and the test system is complex, the detection efficiency is low, and the accuracy of life prediction is difficult to effectively evaluate. More importantly, these methods are mainly aimed at reliability evaluation during product use, and it is impossible to achieve reliability life prediction before product shipment.

[0004] Therefore, a lifetime assessment system for silicon-based passive devices is proposed. Summary of the invention

[0005] The present specification provides a life assessment system for silicon-based passive devices, which not only improves test efficiency but also enhances the accuracy and practicality of life prediction.

[0006] This specification provides a life assessment system for silicon-based passive devices, including:

[0007] A host computer, a master control signal module, a power module, a thermostat, a multi-terminal test interface module, and a plurality of silicon-based passive devices; the plurality of silicon-based passive devices are plugged into the multi-terminal test interface module, the power module includes a working power supply and a high-voltage DC power supply; the working power supply and the high-voltage DC power supply are both electrically connected to the master control signal module, the master control signal module is electrically connected to the multi-terminal test interface module, and the multi-terminal test interface module is placed in the thermostat;

[0008] Performing an accelerated stress test on the silicon-based passive device plugged into the multi-terminal test interface module to obtain an accelerated stress test result;

[0009] The life of the silicon-based passive device is evaluated based on the accelerated stress test result.

[0010] Optionally, performing an accelerated stress test on the silicon-based passive device plugged into the multi-terminal test interface module to obtain an accelerated stress test result includes:

[0011] Turn on the working power supply, and when the constant temperature box stabilizes to a preset stress parameter, turn on the high-voltage DC power supply; the main control signal template monitors the signal information of the silicon-based passive device and uploads the signal information to the host computer; the host computer determines the breakdown time of the silicon-based passive device based on the signal information.

[0012] Optionally, the main control signal template monitors the signal information of the silicon-based passive device, including:

[0013] The silicon-based passive device is provided with an initial voltage interface, a termination voltage interface, a time interval interface, and a voltage stepping interface;

[0014] When the main control signal template detects that the initial voltage interface and the termination voltage interface are equal in voltage, the time interval interface and the voltage step interface are not called, and the silicon-based passive device outputs the signal information at a fixed point;

[0015] When the main control signal template detects that the initial voltage interface and the termination voltage interface are unequal voltages, the parameters of the time interval interface and the voltage step interface are scanned, and the silicon-based passive device outputs the signal information through a ramp voltage.

[0016] Optionally, the main control signal module includes a control unit, a voltage stabilizing unit, an analog-to-digital conversion unit, a switching unit, a conversion unit, and an LED lamp array unit;

[0017] The control unit is electrically connected to the voltage stabilizing unit, the analog-to-digital conversion unit, the LED lamp array unit, and the adapter unit, respectively; the voltage stabilizing unit is electrically connected to the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the conversion unit, respectively; the analog-to-digital conversion unit is electrically connected to the LED lamp array unit, the adapter unit, and the conversion unit, respectively; and the LED lamp array unit is electrically connected to the adapter unit.

[0018] Optionally, the control unit includes an MCU component IC4, the MCU component IC4 is electrically connected to a capacitor C17, the capacitor C17 is electrically connected to a capacitor C18, and the capacitor C17 and the capacitor C18 are both grounded; the MCU component IC4 is also electrically connected to a capacitor C26 and a resistor R28, the capacitor C26 is electrically connected to the resistor R28, the capacitor C26 is grounded, and the resistor R28 is electrically connected to the voltage stabilizing unit, the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the The conversion unit is electrically connected; the MCU device IC4 is also electrically connected to the capacitor C29, the capacitor C29 is electrically connected to the analog-to-digital conversion unit and the voltage stabilizing unit, and the capacitor C29 is grounded; the MCU device IC4 is also electrically connected to the base of the transistor Q1, the collector of the transistor Q1 is electrically connected to the resistor R23 and the resistor R31, the resistor R31 is electrically connected to the capacitor C24 and the resistor R32 respectively, the emitter of the transistor Q1 is grounded, and the resistor R32 is electrically connected to the capacitor C25.

[0019] Optionally, the voltage stabilizing unit includes a voltage stabilizing component IC3, and the voltage stabilizing component IC3 is electrically connected to capacitor C11 and capacitor C12 respectively, and the capacitor C11 is electrically connected to the capacitor C12, and the capacitor C11 and the capacitor C12 are both electrically connected to the analog-to-digital conversion unit and the conversion unit. The voltage stabilizing component IC3 is also electrically connected to capacitor C15, parallel capacitor C13 and capacitor C14 respectively, and the parallel capacitor C13 and capacitor C14 are both electrically connected to the control unit, the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the conversion unit, and the capacitor C15, the capacitor C13, and the capacitor C14 are all grounded.

[0020] Optionally, the analog-to-digital conversion unit includes an analog-to-digital conversion component IC5, and the analog-to-digital conversion component IC5 is electrically connected to the chip crystal oscillator Y1, the capacitor C19, the capacitor C20, the capacitor C21, the capacitor C22, the capacitor C30, and the capacitor C31 respectively, the resistor R1 is electrically connected to the capacitor C22, the capacitor C19 is electrically connected to the capacitor C20, the capacitor C19, the capacitor C20, the capacitor C21, and the capacitor C22 are all electrically connected to the control unit, the voltage stabilizing unit, the LED lamp array unit, and the adapter unit, and the capacitor C19, the capacitor C20, the capacitor C21, and the capacitor C22 are all grounded, the chip crystal oscillator Y1 is electrically connected to the capacitor C23 and the capacitor C27 respectively, the capacitor C23 and the capacitor C27 are both grounded, the capacitor C30 is electrically connected to the capacitor C31, the capacitor C30 and the capacitor C31 are both grounded, the capacitor C31 is electrically connected to the shunt IC6 and the resistor R48 respectively, the resistor R48 is electrically connected to the control unit, the voltage stabilizing unit, the LED lamp array unit, the adapter unit, and the conversion unit respectively.

[0021] Optionally, the adapter unit includes a connector CN3 and a USB to UART component IC2, the connector CN3 is electrically connected to capacitor C8, resistor R5, and resistor R6, respectively, the connector CN3 is also electrically connected to the control unit, the voltage stabilizing unit, the analog-to-digital conversion unit, and the LED lamp array unit, the resistor R5 and the resistor R6 are both electrically connected to the USB to UART component IC2, the USB to UART component IC2 is electrically connected to capacitor C9 and capacitor C10, respectively, and the capacitor C9 and the capacitor C10 are both grounded.

[0022] Optionally, the conversion unit includes a DC-DC conversion component IC1, the DC-DC conversion component IC1 is electrically connected to capacitor C1, resistor R2, capacitor C6, resistor R1, and resistor R4, respectively, the capacitor C1 is electrically connected to inductor L1, the inductor L1 is electrically connected to capacitor C7 and resistor R1, respectively, the resistor R1 is electrically connected to resistor R4, the resistor R4 is grounded, the capacitor C7 is electrically connected to capacitor C5, the capacitor C5 is electrically connected to capacitor C4, the capacitor C5 is also electrically connected to the analog-to-digital conversion unit and the voltage stabilizing unit, the capacitor C4 is electrically connected to resistor R3, the diode LED0 is electrically connected, the capacitor C7, the capacitor C5, the capacitor C4, and the diode LED0 are all grounded, and the resistor R2 is electrically connected to capacitor C6, polarized capacitor C2, and limit capacitor C3, respectively.

[0023] In the present invention, the efficiency and accuracy of life test of silicon-based passive devices (especially silicon capacitors) are significantly improved. The system can test multiple silicon-based passive devices at the same time by integrating a multi-terminal test interface module, which greatly reduces the test cost and shortens the test cycle compared to the traditional single-terminal test method. In addition, the system adopts an accelerated stress test method, combined with a constant temperature box and a precise power supply module, which can simulate the aging process of the device under different working environments, thereby more accurately predicting its life in practical applications. The design of the main control signal module ensures the stability and reliability of the test signal, and the introduction of the host computer makes the collection, analysis and processing of test data more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic diagram of the principle of a life assessment system for silicon-based passive devices provided in an embodiment of this specification;

[0026] Figure 2 It is a schematic diagram of the external structure of a multi-terminal test interface module;

[0027] Figure 3 This is a schematic diagram of the external structure of the main control signal module;

[0028] Figure 4 It is a schematic diagram of the circuit principle of the LED lamp array unit;

[0029] Figure 5 It is a schematic diagram of the circuit principle of the control unit;

[0030] Figure 6 It is the circuit principle schematic diagram of the voltage stabilizing unit;

[0031] Figure 7 It is a schematic diagram of the circuit principle of the analog-to-digital conversion unit;

[0032] Figure 8 It is a schematic diagram of the circuit principle of the switching unit;

[0033] Fig. 9 Schematic diagram of the circuit principle of the conversion unit. DETAILED DESCRIPTION

[0034] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0035] The following is combined with Figure 1-9 The exemplary embodiments of the present invention are described more fully. However, the exemplary embodiments can be implemented in various forms, and it should not be understood that the present invention is limited to the embodiments set forth herein. On the contrary, providing these exemplary embodiments can make the present invention more comprehensive and complete, and it is more convenient to fully convey the inventive concept to those skilled in the art. The same reference numerals in the figures represent the same or similar elements, components or parts, and thus their repeated description will be omitted.

[0036] Under the premise of being consistent with the technical concept of the present invention, the features, structures, characteristics or other details described in a specific embodiment do not exclude that they can be combined in one or more other embodiments in a suitable manner.

[0037] In the description of specific embodiments, the features, structures, characteristics or other details described in the present invention are intended to enable those skilled in the art to fully understand the embodiments. However, it does not exclude that those skilled in the art can practice the technical solutions of the present invention without one or more of the specific features, structures, characteristics or other details.

[0038] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0039] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0040] The term "and / or" or "and / or" includes all combinations of any one or more of the associated listed items.

[0041] Figure 1 A schematic diagram of a life assessment system for a silicon-based passive device provided in an embodiment of this specification, the system may include:

[0042] S110: a host computer, a master control signal module, a power module, a thermostat, a multi-terminal test interface module, and a plurality of silicon-based passive devices; the plurality of silicon-based passive devices are plugged into the multi-terminal test interface module, the power module includes a working power supply and a high-voltage DC power supply; the working power supply and the high-voltage DC power supply are both electrically connected to the master control signal module, the master control signal module is electrically connected to the multi-terminal test interface module, and the multi-terminal test interface module is placed in the thermostat;

[0043] In the specific implementation of this specification, the host computer is the control center of the entire system, responsible for receiving, processing and storing data from the main control signal module. The host computer runs special software for setting test parameters (such as operating voltage, temperature, test time, etc.), monitoring the test process, displaying test results in real time, and performing data analysis. The host computer transmits data with the main control signal module through a communication interface (such as USB, RS-232, Ethernet, etc.).

[0044] The master control signal module is responsible for receiving instructions from the host computer and controlling the power module and the multi-terminal test interface module according to the instructions. It has high-precision and high-stability signal processing capabilities, which can ensure the accuracy and stability of the signal during the test. The master control signal module is also responsible for collecting test data from the multi-terminal test interface module and transmitting it to the host computer for analysis.

[0045] The power module consists of two parts: a working power supply and a high-voltage DC power supply. The working power supply is used to provide the voltage and current required for normal operation of silicon-based passive devices. The high-voltage DC power supply is used for accelerated stress testing, which accelerates the aging process of silicon-based passive devices by increasing the voltage, thereby shortening the test time. The power module has overcurrent, overvoltage, short circuit and other protection functions to ensure safety during the test process.

[0046] The thermostat is used to control the temperature of the test environment to ensure that silicon-based passive devices are tested at a constant temperature. It has a high-precision temperature control system that can accurately control the temperature inside the box and monitor temperature changes in real time. The thermostat also has good thermal insulation and sealing properties to prevent the external environment from affecting the test results.

[0047] like Figure 2 As shown, the multi-terminal test interface module is a bridge connecting silicon-based passive devices and the main control signal module. It has multiple test terminals and can connect multiple silicon-based passive devices for testing at the same time. The multi-terminal test interface module also has safety protection measures such as short circuit prevention and leakage prevention. The interface of the multi-terminal test interface module is set as a left interface and a right interface. The left interface can be set to be adapted to the TO5 package, and the right interface can be adapted to the TO46 package.

[0048] Silicon-based passive devices are the objects of the test, including but not limited to silicon capacitors, silicon inductors, etc. These devices are plugged into the multi-terminal test interface module and tested through the main control signal module and the power module. During the test, the performance parameters of the silicon-based passive devices (such as capacitance, inductance, loss, etc.) will be monitored and recorded in real time.

[0049] Through the coordinated work of the host computer, the main control signal module, the power module, the constant temperature box, the multi-terminal test interface module and several silicon-based passive components, the life of the silicon-based passive components can be evaluated quickly and accurately.

[0050] Optionally, the main control signal module includes a control unit, a voltage stabilizing unit, an analog-to-digital conversion unit, a switching unit, a conversion unit, and an LED lamp array unit;

[0051] The control unit is electrically connected to the voltage stabilizing unit, the analog-to-digital conversion unit, the LED lamp array unit, and the adapter unit, respectively; the voltage stabilizing unit is electrically connected to the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the conversion unit, respectively; the analog-to-digital conversion unit is electrically connected to the LED lamp array unit, the adapter unit, and the conversion unit, respectively; and the LED lamp array unit is electrically connected to the adapter unit.

[0052] Optionally, the control unit includes an MCU component IC4, the MCU component IC4 is electrically connected to a capacitor C17, the capacitor C17 is electrically connected to a capacitor C18, and the capacitor C17 and the capacitor C18 are both grounded; the MCU component IC4 is also electrically connected to a capacitor C26 and a resistor R28, the capacitor C26 is electrically connected to the resistor R28, the capacitor C26 is grounded, and the resistor R28 is electrically connected to the voltage stabilizing unit, the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the The conversion unit is electrically connected; the MCU device IC4 is also electrically connected to the capacitor C29, the capacitor C29 is electrically connected to the analog-to-digital conversion unit and the voltage stabilizing unit, and the capacitor C29 is grounded; the MCU device IC4 is also electrically connected to the base of the transistor Q1, the collector of the transistor Q1 is electrically connected to the resistor R23 and the resistor R31, the resistor R31 is electrically connected to the capacitor C24 and the resistor R32 respectively, the emitter of the transistor Q1 is grounded, and the resistor R32 is electrically connected to the capacitor C25.

[0053] In the specific implementation of this specification, Figure 3-Figure 5As shown, the MCU device IC4 includes an AT32F421C8T7 MCU device. Capacitors C17 and C18 are filter capacitors used to smooth the power input of the MCU device IC4 and reduce the impact of power supply fluctuations on the working stability of the MCU device IC4. They are electrically connected to the power pins of the MCU device IC4 and are grounded together to form a filter circuit. Capacitor C26 and resistor R28 form a decoupling circuit to reduce signal interference between the MCU device IC4 and other circuit elements. Capacitor C26 is grounded to release accumulated charges and maintain the stability of the circuit. Capacitor C29 is another filter capacitor used to smooth the signal transmission between the MCU device IC4 and the analog-to-digital conversion unit and the voltage stabilization unit to reduce noise interference. Transistor Q1 is used as an electronic switch to control the on and off of certain components in the circuit. Its base is electrically connected to the output pin of the MCU device IC4 to receive the control signal, the collector is electrically connected to the resistors R23 and R31 to provide a driving current, and the emitter is grounded to form a current loop. Resistors R23, R31 and R32 form a voltage divider circuit or a current limiting circuit, which is used to adjust the output voltage or current of the collector of transistor Q1. Capacitors C24 and C25 are filter capacitors, which are used to smooth the signal at the output end of transistor Q1 and reduce ripple and noise. Resistor R32 is connected in series with capacitor C25 to form an RC filter circuit to further filter out high-frequency noise.

[0054] Optionally, the voltage stabilizing unit includes a voltage stabilizing component IC3, and the voltage stabilizing component IC3 is electrically connected to capacitor C11 and capacitor C12 respectively, and the capacitor C11 is electrically connected to the capacitor C12, and the capacitor C11 and the capacitor C12 are both electrically connected to the analog-to-digital conversion unit and the conversion unit. The voltage stabilizing component IC3 is also electrically connected to capacitor C15, parallel capacitor C13 and capacitor C14 respectively, and the parallel capacitor C13 and capacitor C14 are both electrically connected to the control unit, the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the conversion unit, and the capacitor C15, the capacitor C13, and the capacitor C14 are all grounded.

[0055] In the specific implementation of this specification, Figure 6 As shown, the voltage stabilizer IC3 includes the SGM2019-3.3YN5G / TR RF linear regulator, which has the advantages of stable output, high linearity, fast response, low noise, high precision and low power consumption. It has been widely used in fields such as wireless communication, ensuring the stability and reliability of the wireless communication system and improving the overall performance of the system.

[0056] Capacitors C11 and C12 are input filter capacitors used to smooth the input power supply voltage of the voltage stabilizer IC3 and reduce the impact of power supply fluctuations on the voltage stabilization performance. They are electrically connected to the input pins of the voltage stabilizer IC3 and are grounded together to form a filter circuit. Capacitor C15 is an output filter capacitor used to smooth the output voltage of the voltage stabilizer IC3 and reduce voltage fluctuations and noise at the output end. Capacitors C13 and C14 are parallel bypass capacitors used to further reduce noise and ripple at the output end of the voltage stabilizer IC3. They are electrically connected to the output pins of the voltage stabilizer IC3 and are jointly electrically connected to circuit elements such as the control unit, analog-to-digital conversion unit, LED light array unit, transfer unit, and conversion unit to provide a stable power supply. There may be a direct connection or an indirect connection (through other circuit elements) between capacitors C11 and C12 to form a more complex filter network. Capacitors C11, C12, C15, C13, and C14 are all grounded to release the accumulated charge and maintain the stability of the circuit.

[0057] Optionally, the analog-to-digital conversion unit includes an analog-to-digital conversion component IC5, and the analog-to-digital conversion component IC5 is electrically connected to the chip crystal oscillator Y1, the capacitor C19, the capacitor C20, the capacitor C21, the capacitor C22, the capacitor C30, and the capacitor C31 respectively, the resistor R1 is electrically connected to the capacitor C22, the capacitor C19 is electrically connected to the capacitor C20, the capacitor C19, the capacitor C20, the capacitor C21, and the capacitor C22 are all electrically connected to the control unit, the voltage stabilizing unit, the LED lamp array unit, and the adapter unit, and the capacitor C19, the capacitor C20, the capacitor C21, and the capacitor C22 are all grounded, the chip crystal oscillator Y1 is electrically connected to the capacitor C23 and the capacitor C27 respectively, the capacitor C23 and the capacitor C27 are both grounded, the capacitor C30 is electrically connected to the capacitor C31, the capacitor C30 and the capacitor C31 are both grounded, the capacitor C31 is electrically connected to the shunt IC6 and the resistor R48 respectively, the resistor R48 is electrically connected to the control unit, the voltage stabilizing unit, the LED lamp array unit, the adapter unit, and the conversion unit respectively.

[0058] In the specific implementation of this specification, Figure 7As shown, the analog-to-digital converter IC5 includes an ADS1258IRTCR analog-to-digital converter (ADC, Analog-to-Digital Converter), which is used to convert analog signals with continuous time and continuous amplitude into digital signals with discrete time and discrete amplitude so that the digital system can process, store or transmit them. The chip crystal oscillator Y1 provides a stable clock signal for the analog-to-digital conversion unit to ensure the accuracy and synchronization of the conversion. Capacitors C23 and C27 are used to stabilize the output frequency of the crystal oscillator and reduce electromagnetic interference. At the same time, the connection between the crystal oscillator Y1 and the analog-to-digital converter IC5 ensures the transmission of the clock signal. Capacitors C19, C20, C21, and C22 are used for filtering, decoupling, and stabilizing the power supply voltage to reduce the impact of noise and interference on the analog-to-digital conversion process. Capacitors C30 and C31 constitute another filtering or decoupling circuit for further reducing noise. Capacitor C31 is also connected to the shunt IC6 and resistor R48 for regulating or distributing signals. Resistor R1 is connected in parallel with capacitor C22 to form an RC filter circuit to further filter out high frequency noise. Resistor R48 is connected with capacitor C31 and shunt IC6 to adjust the signal level or provide current limitation.

[0059] Optionally, the adapter unit includes a connector CN3 and a USB to UART component IC2, the connector CN3 is electrically connected to capacitor C8, resistor R5, and resistor R6, respectively, the connector CN3 is also electrically connected to the control unit, the voltage stabilizing unit, the analog-to-digital conversion unit, and the LED lamp array unit, the resistor R5 and the resistor R6 are both electrically connected to the USB to UART component IC2, the USB to UART component IC2 is electrically connected to capacitor C9 and capacitor C10, respectively, and the capacitor C9 and the capacitor C10 are both grounded.

[0060] In the specific implementation of this specification, Figure 8As shown, the connector CN3 is used as an interface between the external device and the internal circuit to transmit data, power and other signals. The connector CN3 is directly connected to the capacitor C8, the resistor R5, and the resistor R6, and is connected to the control unit, the voltage stabilizing unit, the analog-to-digital conversion unit, the LED light array unit, etc., to achieve signal transmission and interaction. The USB to UART IC2 converts the USB signal into a UART (universal asynchronous receiver-transmitter) signal, which is convenient for communicating with devices such as microcontrollers. The USB to UART IC2 is connected to the resistors R5 and R6, receives the signal from the connector CN3, and outputs the UART signal after internal processing. At the same time, it is connected to the capacitors C9 and C10, and these two capacitors are used for filtering and decoupling to reduce noise interference on the power line and the signal line. The capacitor C8 is used for filtering or decoupling to reduce noise interference on the connector CN3, is directly connected to the connector CN3, and may be indirectly connected to other components (such as the control unit, the voltage stabilizing unit, etc.). The resistors R5 and R6 are connected to the connector CN3 and the USB to UART IC2 to form a part of the signal transmission path. Capacitors C9 and C10 are used for filtering and decoupling to reduce noise interference on the power line and signal line of the USB-to-UART IC2. They are connected to the USB-to-UART IC2 and grounded together to form a stable power supply and signal environment.

[0061] Optionally, the conversion unit includes a DC-DC conversion component IC1, the DC-DC conversion component IC1 is electrically connected to capacitor C1, resistor R2, capacitor C6, resistor R1, and resistor R4, respectively, the capacitor C1 is electrically connected to inductor L1, the inductor L1 is electrically connected to capacitor C7 and resistor R1, respectively, the resistor R1 is electrically connected to resistor R4, the resistor R4 is grounded, the capacitor C7 is electrically connected to capacitor C5, the capacitor C5 is electrically connected to capacitor C4, the capacitor C5 is also electrically connected to the analog-to-digital conversion unit and the voltage stabilizing unit, the capacitor C4 is electrically connected to resistor R3, the diode LED0 is electrically connected, the capacitor C7, the capacitor C5, the capacitor C4, and the diode LED0 are all grounded, and the resistor R2 is electrically connected to capacitor C6, polarized capacitor C2, and limit capacitor C3, respectively.

[0062] In the specific implementation of this specification, Fig. 9As shown, the DC-DC converter IC1 includes a SY8121B DC-DC converter, also known as a DC-DC converter or a DC-DC converter, which is an electronic circuit or device that converts a DC voltage or current level into another DC voltage or current level. This conversion can be boost (converting a low voltage into a high voltage), buck (converting a high voltage into a low voltage) or voltage regulation (keeping the output voltage stable within a certain range). By adjusting the control parameters of the converter, the size and stability of the output voltage can be accurately controlled to meet the voltage requirements of different loads. As the core of the conversion unit, the DC-DC converter IC1 is responsible for converting the input DC voltage into the required DC output voltage to meet the voltage requirements of different circuits or loads. Capacitor C1 is used for input filtering to reduce the fluctuation and noise of the input voltage and ensure the stability of the voltage received by the DC-DC converter IC1. Capacitor C1 is connected in series with inductor L1 to form an LC filter circuit and is connected to the input end of the DC-DC converter IC1. The capacitor is used for input or output filtering of IC1 to reduce ripple, and capacitor C7 is usually used for output filtering to ensure the stability and smoothness of the output voltage.

[0063] S120: performing an accelerated stress test on the silicon-based passive device plugged into the multi-terminal test interface module to obtain an accelerated stress test result;

[0064] Optionally, the S120 includes:

[0065] Turn on the working power supply, and when the constant temperature box stabilizes to a preset stress parameter, turn on the high-voltage DC power supply; the main control signal template monitors the signal information of the silicon-based passive device and uploads the signal information to the host computer; the host computer determines the breakdown time of the silicon-based passive device based on the signal information.

[0066] In the specific implementation of this specification, the working power supply is turned on to provide the necessary power for the entire test system. At this point, all related equipment will start preheating and enter standby mode. Subsequently, the temperature of the thermostat is set to a preset stress parameter, such as a specific temperature value, and wait for the temperature inside the thermostat to stabilize at the preset value. This step is to ensure that the silicon-based passive device is in a constant temperature environment during the test process to simulate its working environment in actual applications, so as to more accurately evaluate its performance. After the temperature of the thermostat is stable, the high-voltage DC power supply is turned on next. The high-voltage DC power supply will provide high-voltage test conditions for the silicon-based passive device to simulate its working state under extreme voltage. At this point, it is necessary to ensure that the output voltage of the high-voltage DC power supply is stable and meets the test requirements. At the same time, the main control signal template begins to monitor the signal information of the silicon-based passive device. These signal information include but are not limited to key parameters such as voltage, current, and frequency, which can reflect the working state and performance of the silicon-based passive device. The main control signal template uploads the captured signal information to the host computer via a data line or wirelessly. The host computer is a high-performance computer or dedicated test equipment that can analyze and process the received signal information in real time. Through professional testing software or algorithms, the host computer can accurately identify and extract key test data such as the breakdown time of silicon-based passive devices. Based on the received signal information, the host computer determines the breakdown time of silicon-based passive devices through a series of complex calculations and analysis processes. The breakdown time refers to the time it takes for a silicon-based passive device to go from a normal working state to a breakdown failure under the action of a high-voltage DC power supply. This data is of great significance for evaluating the reliability and durability of silicon-based passive devices, and can provide a strong basis for subsequent product design and improvement.

[0067] Optionally, the main control signal template monitors the signal information of the silicon-based passive device, including:

[0068] The silicon-based passive device is provided with an initial voltage interface, a termination voltage interface, a time interval interface, and a voltage stepping interface;

[0069] When the main control signal template detects that the initial voltage interface and the termination voltage interface are equal in voltage, the time interval interface and the voltage step interface are not called, and the silicon-based passive device outputs the signal information at a fixed point;

[0070] When the main control signal template detects that the initial voltage interface and the termination voltage interface are unequal voltages, the parameters of the time interval interface and the voltage step interface are scanned, and the silicon-based passive device outputs the signal information through a ramp voltage.

[0071] In the specific implementation of this specification, the design of silicon-based passive devices includes multiple key interfaces during the test process to facilitate accurate control and monitoring of their performance. Specifically, it is equipped with an initial voltage interface, a termination voltage interface, a time interval interface, and a voltage stepping interface. The setting of these interfaces enables the test process to flexibly adapt to different test requirements. At the beginning of the test, the main control signal template first monitors the voltage values ​​on the initial voltage interface and the termination voltage interface. If the voltage values ​​on these two interfaces are equal, it means that the test needs to be performed at a fixed voltage point. In this case, the main control signal template will not call the functions of the time interval interface and the voltage stepping interface. The silicon-based passive device will directly output its signal information at a fixed point on the fixed voltage point for subsequent analysis and processing.

[0072] However, if the master signal template detects that the voltage values ​​on the initial voltage interface and the termination voltage interface are not equal, the test will need to be scanned within a certain voltage range. At this time, the master signal template will determine the interval time of each voltage change according to the parameters of the time interval interface, and determine the amplitude of each voltage change according to the parameters of the voltage step interface. In such a test mode, the silicon-based passive device will output its signal information in the form of a ramp voltage. The ramp voltage means that the voltage will gradually increase or decrease according to a certain step size and interval, so that the performance of the silicon-based passive device under different voltage conditions can be more comprehensively evaluated.

[0073] S130: Evaluate the life of the silicon-based passive component based on the accelerated stress test result.

[0074] In the specific implementation of this specification, accelerated stress testing is a testing method that accelerates the device aging process by applying stress higher than normal operating conditions (such as increasing voltage, temperature, etc.), thereby obtaining device life-related data in a shorter period of time.

[0075] During the test, the performance of silicon-based passive devices under different stress levels was recorded, including but not limited to their electrical parameters (such as changes in resistance and capacitance values), physical states (such as the presence or absence of cracks, deformation, etc.), and signal output characteristics. Next, these test data are analyzed using statistical methods and reliability theory. By fitting the performance degradation curve, the performance degradation rate of the device under normal working conditions can be calculated. Furthermore, combined with the failure criteria of the device (i.e. the state when the performance degrades to a certain critical value), the expected life of the device in a normal working environment can be predicted.

[0076] In the present invention, the efficiency and accuracy of life test of silicon-based passive devices (especially silicon capacitors) are significantly improved. The system can test multiple silicon-based passive devices at the same time by integrating a multi-terminal test interface module, which greatly reduces the test cost and shortens the test cycle compared to the traditional single-terminal test method. In addition, the system adopts an accelerated stress test method, combined with a constant temperature box and a precise power supply module, which can simulate the aging process of the device under different working environments, thereby more accurately predicting its life in practical applications. The design of the main control signal module ensures the stability and reliability of the test signal, and the introduction of the host computer makes the collection, analysis and processing of test data more convenient.

[0077] The present invention can be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It should be understood by those skilled in the art that general data processing devices such as microprocessors or digital signal processors (DSPs) can be used in practice to implement some or all of the functions of some or all of the components in the embodiments of the present invention. The present invention can also be implemented as a device or apparatus program (e.g., computer program and computer program product) for executing part or all of the system described herein. Such a program implementing the present invention can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0078] The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the present invention is not inherently related to any specific computer, virtual device or electronic device, and various general devices can also implement the present invention. The above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0079] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0080] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A life assessment system for silicon-based passive devices, characterized in that: include: A host computer, a master control signal module, a power module, a thermostat, a multi-terminal test interface module, and a plurality of silicon-based passive devices; the plurality of silicon-based passive devices are plugged into the multi-terminal test interface module, the power module includes a working power supply and a high-voltage DC power supply; the working power supply and the high-voltage DC power supply are both electrically connected to the master control signal module, the master control signal module is electrically connected to the multi-terminal test interface module, and the multi-terminal test interface module is placed in the thermostat; Performing an accelerated stress test on the silicon-based passive device plugged into the multi-terminal test interface module to obtain an accelerated stress test result; The life of the silicon-based passive device is evaluated based on the accelerated stress test result.

2. The life assessment system for silicon-based passive devices according to claim 1, characterized in that: The step of performing an accelerated stress test on the silicon-based passive device plugged into the multi-terminal test interface module to obtain an accelerated stress test result includes: Turn on the working power supply, and when the constant temperature box stabilizes to a preset stress parameter, turn on the high-voltage DC power supply; the main control signal template monitors the signal information of the silicon-based passive device and uploads the signal information to the host computer; the host computer determines the breakdown time of the silicon-based passive device based on the signal information.

3. The life assessment system for silicon-based passive devices according to claim 2, characterized in that: The main control signal template monitors the signal information of the silicon-based passive device, including: The silicon-based passive device is provided with an initial voltage interface, a termination voltage interface, a time interval interface, and a voltage stepping interface; When the main control signal template detects that the initial voltage interface and the termination voltage interface are equal in voltage, the time interval interface and the voltage step interface are not called, and the silicon-based passive device outputs the signal information at a fixed point; When the main control signal template detects that the initial voltage interface and the termination voltage interface are unequal voltages, the parameters of the time interval interface and the voltage step interface are scanned, and the silicon-based passive device outputs the signal information through a ramp voltage.

4. The life assessment system for silicon-based passive devices according to claim 3, characterized in that: The main control signal module includes a control unit, a voltage stabilization unit, an analog-to-digital conversion unit, a switching unit, a conversion unit, and an LED lamp array unit; The control unit is electrically connected to the voltage stabilizing unit, the analog-to-digital conversion unit, the LED lamp array unit, and the adapter unit, respectively; the voltage stabilizing unit is electrically connected to the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the conversion unit, respectively; the analog-to-digital conversion unit is electrically connected to the LED lamp array unit, the adapter unit, and the conversion unit, respectively; and the LED lamp array unit is electrically connected to the adapter unit.

5. The life assessment system for silicon-based passive devices according to claim 4, characterized in that: The control unit includes an MCU component IC4, the MCU component IC4 is electrically connected to a capacitor C17, the capacitor C17 is electrically connected to a capacitor C18, and the capacitor C17 and the capacitor C18 are both grounded; the MCU component IC4 is also electrically connected to a capacitor C26 and a resistor R28, the capacitor C26 is electrically connected to the resistor R28, the capacitor C26 is grounded, and the resistor R28 is electrically connected to the voltage stabilizing unit, the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the conversion unit; the MCU component IC4 is also electrically connected to a capacitor C29, the capacitor C29 is electrically connected to the analog-to-digital conversion unit and the voltage stabilizing unit, and the capacitor C29 is grounded; the MCU component IC4 is also electrically connected to the base of the transistor Q1, the collector of the transistor Q1 is electrically connected to the resistor R23 and the resistor R31, the resistor R31 is electrically connected to the capacitor C24 and the resistor R32 respectively, the emitter of the transistor Q1 is grounded, and the resistor R32 is electrically connected to the capacitor C25.

6. The life assessment system for silicon-based passive devices according to claim 5, characterized in that: The voltage stabilizing unit includes a voltage stabilizing component IC3, and the voltage stabilizing component IC3 is electrically connected to capacitor C11 and capacitor C12 respectively. The capacitor C11 is electrically connected to the capacitor C12, and the capacitor C11 and the capacitor C12 are both electrically connected to the analog-to-digital conversion unit and the conversion unit. The voltage stabilizing component IC3 is also electrically connected to capacitor C15, parallel capacitor C13 and capacitor C14 respectively, and the parallel capacitor C13 and capacitor C14 are both electrically connected to the control unit, the analog-to-digital conversion unit, the LED lamp array unit, the adapter unit, and the conversion unit. The capacitor C15, the capacitor C13, and the capacitor C14 are all grounded.

7. The life assessment system for silicon-based passive devices according to claim 6, characterized in that: The analog-to-digital conversion unit includes an analog-to-digital conversion component IC5, which is electrically connected to the chip crystal oscillator Y1, capacitor C19, capacitor C20, capacitor C21, capacitor C22, capacitor C30, and capacitor C31 respectively. The resistor R1 is electrically connected to the capacitor C22, the capacitor C19 is electrically connected to the capacitor C20, and the capacitors C19, C20, C21, and C22 are all electrically connected to the control unit, the voltage stabilizing unit, the LED lamp array unit, and the switching unit. The capacitor C19 is electrically connected to the capacitor C20, and the capacitors C19, C20, C21, and C22 are all electrically connected to the control unit, the voltage stabilizing unit, the LED lamp array unit, and the switching unit.

9. The capacitor C20, the capacitor C21, and the capacitor C22 are all grounded, the chip crystal oscillator Y1 is electrically connected to the capacitor C23 and the capacitor C27 respectively, the capacitor C23 and the capacitor C27 are both grounded, the capacitor C30 is electrically connected to the capacitor C31, the capacitor C30 and the capacitor C31 are both grounded, the capacitor C31 is electrically connected to the shunt IC6 and the resistor R48 respectively, the resistor R48 is electrically connected to the control unit, the voltage stabilizing unit, the LED lamp array unit, the adapter unit, and the conversion unit respectively.

8. The life assessment system for silicon-based passive devices according to claim 7, characterized in that: The adapter unit includes a connector CN3 and a USB-to-UART component IC2. The connector CN3 is electrically connected to capacitor C8, resistor R5, and resistor R6, respectively. The connector CN3 is also electrically connected to the control unit, the voltage stabilizing unit, the analog-to-digital conversion unit, and the LED lamp array unit. The resistor R5 and the resistor R6 are both electrically connected to the USB-to-UART component IC2. The USB-to-UART component IC2 is electrically connected to capacitor C9 and capacitor C10, respectively. The capacitor C9 and the capacitor C10 are both grounded.

9. The life assessment system for silicon-based passive devices according to claim 8, characterized in that: The conversion unit includes a DC-DC conversion component IC1, and the DC-DC conversion component IC1 is electrically connected to the capacitor C1, the resistor R2, the capacitor C6, the resistor R1, and the resistor R4 respectively. The capacitor C1 is electrically connected to the inductor L1, and the inductor L1 is electrically connected to the capacitor C7 and the resistor R1 respectively. The resistor R1 is electrically connected to the resistor R4, and the resistor R4 is grounded. The capacitor C7 is electrically connected to the capacitor C5, and the capacitor C5 is electrically connected to the capacitor C4. The capacitor C5 is also electrically connected to the analog-to-digital conversion unit and the voltage stabilizing unit. The capacitor C4 is electrically connected to the resistor R3, and the diode LED0 is electrically connected. The capacitor C7, the capacitor C5, the capacitor C4, and the diode LED0 are all grounded. The resistor R2 is electrically connected to the capacitor C6, the polarized capacitor C2, and the limit capacitor C3 respectively.

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