Multi-chip positioning and packaging device of integrated circuit

Abstract

The invention relates to the technical field of chip packaging, in particular to a multi-chip positioning and packaging device of an integrated circuit. Comprising a machining platform, and a transfer mechanism is arranged at the top of the machining platform; the output end of the transfer mechanism is in transmission connection with a multi-chip stacking mechanism; a base plate fixing mechanism is arranged in the center of the top of the machining platform. According to the invention, the multi-chip stacking mechanism is controlled to adsorb a plurality of groups of chips at one time, then the multi-chip stacking mechanism and the chip bonding mechanism are controlled to work alternately to complete stacking of the plurality of groups of chips, and then the gold wire bonding mechanism is controlled to carry out line connection on all the chips and the substrate to complete stacking and packaging work of the chips. Compared with the prior art, the multi-chip stacking mechanism has the advantages that repeated vacuum adsorption, placement and stacking of the chips are avoided, the efficiency of packaging work is improved, the multi-chip stacking mechanism can guarantee that the chips are placed at the same position each time, and the precision of packaging work is improved.

Description

[0001] This application is a divisional application of the application filed on October 11, 2024, with application number 202411414632.2 and invention name “A multi-chip positioning packaging device for an integrated circuit and its packaging method”. Technical Field

[0002] The invention belongs to the technical field of chip packaging, and in particular relates to a multi-chip positioning packaging device for integrated circuits. Background Art

[0003] When performing the chip stacking packaging process, the chip needs to be placed on the substrate, and then the remaining chips are stacked on it in sequence to form a vertical multi-chip stack, and then the multi-chip is connected to the substrate using a gold wire bonding process.

[0004] After searching, in the prior art, Chinese patent announcement number: CN117577545B, announcement date: 2024.07.26, discloses a packaging device for chip processing, including a base frame, etc.; the upper side of the base frame is fixedly connected to a lower mold, the lower mold is provided with a pusher groove, and the base frame is fixedly connected to an electric push rod. In this invention, the downward movement of the guide block will drive the push plate to move in the direction close to the rubber block, so that the pressure rod and the push plate clamp the rubber plate, and the pressure plate limits the upper mold, thereby reducing the gap between the rubber block and the chip pins, thereby reducing the impact on the chip pins during packaging.

[0005] However, the packaging device still has the following defects:

[0006] When performing the stacking and packaging of chips, the existing chip packaging device needs to repeatedly vacuum adsorb and stack the chips, which makes the chip stacking work lack of continuity, thereby reducing the efficiency of the packaging work. Summary of the invention

[0007] In view of the above problems, the present invention provides a multi-chip positioning and packaging device for integrated circuits, comprising a processing platform, a transfer mechanism is provided on the top of the processing platform; a multi-chip stacking mechanism is transmission-connected to the output end of the transfer mechanism; a substrate fixing mechanism is provided at the center of the top of the processing platform;

[0008] A glue recovery box is provided at one edge of the top of the processing platform; a chip bonding mechanism is provided on one side wall of the transfer mechanism; a gold wire bonding mechanism is provided on one side wall of the transfer mechanism away from the chip bonding mechanism;

[0009] The multi-chip stacking mechanism comprises a first electric turntable; the bottom of the first electric turntable is connected to a mounting frame in a transmission manner; a scanning camera is provided at the bottom of the mounting frame; a vacuum adsorption component is provided in the mounting frame;

[0010] The vacuum adsorption component is controlled to adsorb multiple groups of chips at one time, and then the multi-chip stacking mechanism and the chip bonding mechanism are controlled to work alternately to complete the stacking of multiple groups of chips.

[0011] Furthermore, the mounting frame is U-shaped; a first motor is provided on one side wall of the mounting frame; the output end of the first motor is transmission-connected to the vacuum adsorption assembly; a vacuum pump is provided on one side wall of the mounting frame; the output end of the vacuum pump is connected to the vacuum adsorption assembly.

[0012] Furthermore, the vacuum adsorption assembly includes several groups of sealing plates hinged end to end in sequence; a sealing structure is provided on the hinge shaft between two adjacent groups of sealing plates; the two side walls of each group of sealing plates are movably fitted on the corresponding two side inner walls of the mounting frame; and several groups of connecting transmission grooves are opened on the inner walls of each group of sealing plates.

[0013] Furthermore, a group of vacuum suction holes is provided at the center of the inner wall of each group of sealing plates; a group of solenoid valves is provided at the center of the outer wall of each group of sealing plates; each group of solenoid valves is connected to a corresponding group of vacuum suction holes; and one end of each group of solenoid valves away from the sealing plate is connected to a group of vacuum suction cups.

[0014] Furthermore, two groups of rotating shafts are provided in several groups of sealing plates; both ends of each group of rotating shafts are respectively rotatably connected to the inner wall of one side of the mounting frame; several groups of connecting transmission rods are distributed in a circular array on the outer wall of each group of rotating shafts; one end of each group of connecting transmission rods away from the corresponding group of rotating shafts is movable and passes through the corresponding group of connecting transmission grooves.

[0015] Furthermore, the substrate fixing mechanism includes a shell; a substrate support plate is provided at the top center of the shell; four groups of first slide grooves are opened in the vertical direction on the top of the shell; a group of movable support plates are provided in each group of the first slide grooves; a group of chip clamps are provided on the side of each group of movable support plates close to the substrate support plate; and several groups of buffer springs are provided between each group of chip clamps and the corresponding group of movable support plates.

[0016] Furthermore, the chip bonding mechanism includes a second electric slide; the second electric slide is provided with a glue storage box; the output end of the second electric slide is transmission-connected to a second electric turntable; the bottom of the second electric turntable is transmission-connected to a second electric push rod; the output end of the second electric push rod is transmission-connected to a third electric slide; the output end of the third electric slide is transmission-connected to a glue coating component.

[0017] Furthermore, the glue coating assembly includes a mounting block; the mounting block is transmission-connected to the output end of the third electric slide; an adjustment groove is provided at the bottom of the mounting block; two groups of fixed plates are provided in the adjustment groove; a group of retractable scrapers are movably penetrated through the bottom of each group of fixed plates.

[0018] Furthermore, an elastic metal scraper is provided at the bottom of the two groups of fixed plates; the elastic metal scraper is located between the two groups of telescopic scrapers, and each group of telescopic scrapers is provided with a group of scraper grooves at the upper edge of a side wall away from the elastic metal scraper; a plurality of groups of glue spray heads are provided at equal intervals at the bottom of the mounting block; the output end of the glue storage box is connected to the input end of the plurality of glue spray heads.

[0019] A packaging method for a multi-chip positioning packaging device of an integrated circuit, the packaging method comprising:

[0020] Fixing the substrate on the top of the substrate fixing mechanism;

[0021] Control the vacuum adsorption component to adsorb multiple groups of chips at one time;

[0022] Controlling the chip bonding mechanism to apply the chip bonding glue to the corresponding position of the substrate;

[0023] Control the vacuum adsorption assembly to place a group of chips;

[0024] Controlling the chip bonding mechanism to apply the chip bonding glue on the top of the chip;

[0025] Control the vacuum adsorption assembly to place the next group of chips;

[0026] After repeated several times, multiple groups of chips are stacked;

[0027] Controlling the gold wire bonding mechanism to connect multiple groups of chips to the substrate;

[0028] Complete the positioning and packaging of multiple chips.

[0029] The beneficial effects of the present invention are:

[0030] 1. Control the multi-chip stacking mechanism to absorb several groups of chips at one time, then control the chip bonding mechanism to spray chip bonding glue on the substrate, then control the multi-chip stacking mechanism to bond one group of chips to the substrate, and then control the chip bonding mechanism to spray chip bonding glue on the chip again, and repeat several times until all the chips are stacked and packaged on the substrate, and then control the gold wire bonding mechanism to connect all the chips to the substrate to complete the chip stacking and packaging work, avoiding the need for repeated vacuum adsorption and placement and stacking of chips, improving the efficiency of packaging work, and the multi-chip stacking mechanism can ensure that the chips are placed in the same position each time, improving the accuracy of packaging work.

[0031] 2. By adjusting the spacing between the two sets of fixed plates, the spacing between the two sets of telescopic scrapers is adjusted to the corresponding distance, and the elastic metal scraper is compressed and deformed into a fan ring. When applying the chip bonding glue, the glue storage box sprays the chip bonding glue through several sets of glue spray heads, and the mounting block drives several sets of glue spray heads to move to one side to spray glue. At the same time, the bottom of the elastic metal scraper flattens the glue and the convex surface pushes the excess glue to both sides. The excess glue is scraped off by the two sets of telescopic scrapers, so that the packaging device can not only freely adjust the glue thickness and uniformity between multiple groups of chips, thereby improving the quality of packaging work, but also recycle the excess glue to avoid glue waste.

[0032] 3. By placing the substrate on top of the substrate support plate, and then controlling four groups of chip clamps to clamp the substrate, and then controlling four groups of movable support plates to drive the four groups of chip clamps to apply corresponding forces to the substrate through several groups of buffer springs, it not only avoids the problem of easy damage to the substrate when the packaging device is rigidly clamped, but also enables the packaging device to complete the fixing work when dealing with rigid substrates or flexible substrates, thereby improving the compatibility of the packaging device.

[0033] 4. The moving mechanism includes a rotating support ring, which is movably sleeved on the top side wall of the processing platform. Two groups of first electric push rods are symmetrically arranged on the outer wall of the rotating support ring. A first electric slide is arranged on the top of the two groups of first electric push rods. The output end of the first electric slide is transmission-connected to the multi-chip stacking mechanism. The chip bonding mechanism and the gold wire bonding mechanism are respectively arranged on one side wall of the first electric slide. When the chip is packaged, the rotation of the rotating support ring and the horizontal movement of the multi-chip stacking mechanism by the first electric slide are controlled, so that the chips can be stacked at any angle at any position of the substrate, and the chip bonding mechanism and the gold wire bonding mechanism always remain perpendicular to the multi-chip stacking mechanism, thereby improving the use effect of the packaging device.

[0034] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1A schematic structural diagram of a packaging device according to an embodiment of the present invention is shown;

[0037] Figure 2 A schematic cross-sectional view of a packaging device according to an embodiment of the present invention is shown;

[0038] Figure 3 A schematic structural diagram of a chip stacking mechanism according to an embodiment of the present invention is shown;

[0039] Figure 4 A partial cross-sectional schematic diagram of a chip stacking mechanism according to an embodiment of the present invention is shown;

[0040] Figure 5 A schematic structural diagram of a substrate fixing mechanism according to an embodiment of the present invention is shown;

[0041] Figure 6 A partial cross-sectional schematic diagram of a substrate fixing mechanism according to an embodiment of the present invention is shown;

[0042] Figure 7 A schematic structural diagram of a chip bonding mechanism according to an embodiment of the present invention is shown;

[0043] Figure 8 The embodiment of the present invention is shown Figure 7 An enlarged schematic diagram of point A;

[0044] Fig. 9 A bottom view structural schematic diagram of a glue spraying assembly according to an embodiment of the present invention is shown.

[0045] In the figure: 1. Processing platform; 2. Storage door; 3. Rotating support ring; 4. First electric push rod; 5. First electric slide; 6. Multi-chip stacking mechanism; 7. Substrate fixing mechanism; 8. Chip bonding mechanism; 9. Gold wire bonding mechanism; 10. Glue recovery box; 11. Storage room; 12. Hot air gun; 601. First electric turntable; 602. Mounting frame; 603. Vacuum adsorption assembly; 604. First motor; 605. Vacuum pump; 6031. Sealing plate; 6032. Connecting transmission groove; 6033. Vacuum suction hole; 6034. Solenoid valve; 6035. Vacuum suction cup; 6036. Rotating shaft; 6037. Connecting transmission rod; 701. Shell ;702, first slide groove;703, movable support plate;704, buffer spring;705, chip fixture;706, second motor;707, substrate support plate;708, adjustment chamber;709, screw rod;710, sliding connection block;711, third slide groove;712, connecting column;801, second electric slide;802, glue storage box;803, second electric turntable;804, second electric push rod;805, third electric slide;806, glue coating assembly;8061, mounting block;8062, telescopic scraper;8063, scraper trough;8064, glue spray head;8065, elastic metal scraper;8066, adjustment groove;8067, fixed plate. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] The embodiment of the present invention provides a multi-chip positioning and packaging device for integrated circuits, including a processing platform 1. For example, Figure 1 and Figure 2As shown, the top cross-section of the processing platform 1 is circular; a rotating support ring 3 is provided on the top outer wall of the processing platform 1; two groups of first electric push rods 4 are symmetrically provided on the outer wall of the rotating support ring 3; the output ends of the two groups of the first electric push rods 4 are transmission-connected with the first electric slide 5; the rotating support ring 3, the two groups of first electric push rods 4 and the first electric slide 5 form a transfer mechanism; the output end of the first electric slide 5 is transmission-connected with a multi-chip stacking mechanism 6; a substrate fixing mechanism 7 is provided at the top center of the processing platform 1; a chip bonding mechanism 8 is provided on one side wall of the first electric slide 5; a gold wire bonding mechanism 9 is provided on one side wall of the first electric slide 5 away from the chip bonding mechanism 8; a glue recovery box 10 is provided at the edge of one side of the top of the processing platform 1; a storage room 11 is provided in the processing platform 1; an opening is opened on one side inner wall of the storage room 11; a storage door 2 is provided at the opening; a hot air gun 12 is provided on the top inner wall of the storage room 11; the output end of the hot air gun 12 is connected to the glue recovery box 10.

[0048] When the packaging device is working, the substrate is first fixed on the substrate fixing mechanism 7, and then the multi-chip stacking mechanism 6 is controlled to absorb several groups of chips at one time, and then the chip bonding mechanism 8 is controlled to spray chip bonding glue on the substrate, and then the multi-chip stacking mechanism 6 is controlled to bond one group of chips to the substrate, and then the chip bonding mechanism 8 is controlled again to spray chip bonding glue on the chip, and it is repeated several times alternately until all the chips are stacked and packaged on the substrate, and then the gold wire bonding mechanism 9 is controlled to connect all the chips to the substrate, and the chip packaging work is completed, avoiding the need for repeated vacuum adsorption and placement and stacking of the chips, thereby improving the efficiency of the packaging work, and the multi-chip stacking mechanism 6 can ensure that the chips are placed in the same position each time to avoid offset between chips.

[0049] For example, Figure 3 As shown, the multi-chip stacking mechanism 6 includes a first electric turntable 601; the top of the first electric turntable 601 is transmission-connected to the output end of the first electric slide 5; the bottom of the first electric turntable 601 is transmission-connected to a mounting frame 602; the mounting frame 602 is U-shaped; a scanning camera is provided at the bottom of the mounting frame 602; a vacuum adsorption component 603 is provided inside the mounting frame 602; a first motor 604 is provided on one side wall of the mounting frame 602; the output end of the first motor 604 is transmission-connected to the vacuum adsorption component 603; a vacuum pump 605 is provided on one side wall of the mounting frame 602; the output end of the vacuum pump 605 is connected to the vacuum adsorption component 603.

[0050] For example, Figure 4As shown, the vacuum adsorption assembly 603 includes a plurality of sealing plates 6031 hinged end to end in sequence; a sealing structure is provided on the hinge shaft between two adjacent sealing plates 6031; both side walls of each sealing plate 6031 are movably fitted on the corresponding inner walls of the mounting frame 602; a plurality of connecting transmission grooves 6032 are provided on the inner walls of each sealing plate 6031; a group of vacuum suction holes 6033 is provided at the center of the inner wall of each sealing plate 6031; a group of electromagnetic air valves 6034 is provided at the center of the outer wall of each sealing plate 6031; each group of electromagnetic air valves 6034 is connected to a corresponding group of vacuum suction holes 6033. The electromagnetic valves 6034 of each group are connected to a group of vacuum suction cups 6035 at one end away from the sealing plate 6031; two groups of rotating shafts 6036 are arranged in several groups of sealing plates 6031; both ends of each group of rotating shafts 6036 are respectively rotatably connected to the inner wall of one side of the mounting frame 602; the first motor 604 is transmission-connected to one group of rotating shafts 6036; several groups of connecting transmission rods 6037 are distributed in a circular array on the outer wall of each group of rotating shafts 6036; one end of each group of connecting transmission rods 6037 away from the corresponding group of rotating shafts 6036 is movable and passes through the corresponding group of connecting transmission grooves 6032.

[0051] When the chip is being adsorbed, the transfer mechanism drives the multi-chip stacking mechanism 6 to move to the top of the chip. After scanning the chip, the scanning camera controls one of the vacuum suction cups 6035 to move to the top of the geometric center of the chip. The hinges of the several sets of sealing plates 6031 are all provided with sealing mechanisms, and the several sets of sealing plates 6031 are movably fitted on the inner walls on both sides of the mounting frame 602, so that the several sets of sealing plates 6031 become a closed space. Then the vacuum pump 605 sucks the air in the closed space, and then controls the transfer mechanism to drive the multi-chip stacking mechanism 6 to descend and open the corresponding electromagnetic valve 6034 at the same time, so that the corresponding vacuum suction cup 6035 can adsorb the chip. After completion After a group of chips are adsorbed, the first motor 604 is controlled to drive one of the groups of rotating shafts 6036 to rotate, so that several groups of connecting transmission rods 6037 drive several groups of sealing plates 6031 to rotate through several groups of connecting transmission grooves 6032, so that the corresponding vacuum suction cups 6035 are transferred to the bottom, and after the corresponding position adjustment, another group of chips are adsorbed. After repeating the operation to adsorb the corresponding number of chips, the transfer mechanism is controlled to drive the multi-chip stacking mechanism 6 to move to the top of the substrate to prepare for chip stacking. Several groups of vacuum suction cups 6035 can adsorb multiple groups of chips, and when stacking, each group of sealing plates 6031 can drive the chips to the same position, avoiding position displacement of the chips during stacking.

[0052] For example, Figure 5 and Figure 6As shown, the substrate fixing mechanism 7 includes a shell 701; a substrate support plate 707 is provided at the top center of the shell 701; four groups of first slide grooves 702 are opened in the vertical direction on the top of the shell 701; a group of movable support plates 703 are provided in each group of the first slide grooves 702; a group of chip clamps 705 are provided on the side close to the substrate support plate 707 of each group of the movable support plates 703; a number of buffer springs 704 are provided between each group of the chip clamps 705 and the corresponding group of movable support plates 703; an adjusting cavity 708 is provided in the shell 701; two groups of screw rods 709 are provided in the adjusting cavity 708; one end of the two groups of screw rods 709 is fixedly connected, and the other end is rotatably connected to On the inner walls on both sides of the adjusting chamber 708; the thread directions of the two groups of screw rods 709 are opposite, and the central axes are on the same straight line; two groups of sliding connection blocks 710 are slidably connected on the bottom inner wall of the adjusting chamber 708; the two groups of sliding connection blocks 710 are respectively threadedly connected with a group of screw rods 709; a group of third sliding grooves 711 are opened on the top of each group of sliding connection blocks 710; two groups of connecting columns 712 are slidably connected in each group of third sliding grooves 711; the top of each group of connecting columns 712 is rotatably connected to the bottom of a corresponding group of movable support plates 703; a second motor 706 is provided on one side wall of the shell 701; the output end of the second motor 706 is transmission-connected to one of the groups of screw rods 709.

[0053] When fixing the substrate, the substrate is placed on the top of the substrate support plate 707, and then the four groups of chip clamps 705 are controlled to clamp the substrate, and then the second motor 706 is controlled to drive the two groups of screw rods 709 to rotate. Under the threaded connection relationship between the two groups of screw rods 709 and the two groups of sliding connection blocks 710, the two groups of sliding connection blocks 710 move in relative or opposite directions, and the bottoms of the four groups of connecting columns 712 are slidingly connected to the corresponding third slide grooves 711, and the tops are rotatably connected to the bottoms of the corresponding movable support plates 703, so that the four groups of movable support plates 703 can drive the four groups of chip clamps 705 to apply corresponding forces to the substrate through several groups of buffer springs 704, which not only avoids the problem of easy damage to the substrate when the packaging device is rigidly clamped, but also enables the packaging device to complete the fixing work when dealing with rigid substrates or flexible substrates, thereby improving the compatibility of the packaging device.

[0054] For example, Figure 7As shown, the chip bonding mechanism 8 includes a second electric slide 801; the second electric slide 801 is provided with a glue storage box 802; the second electric slide 801 is installed on a side wall of the first electric slide 5; the output end of the second electric slide 801 is transmission-connected with a second electric turntable 803; the bottom of the second electric turntable 803 is transmission-connected with a second electric push rod 804; the output end of the second electric push rod 804 is transmission-connected with a third electric slide 805; the output end of the third electric slide 805 is transmission-connected with a glue coating component 806.

[0055] For example, Figure 8 and Fig. 9 As shown, the glue coating component 806 includes a mounting block 8061; the mounting block 8061 is transmission-connected to the output end of the third electric slide 805; an adjusting slot 8066 is provided at the bottom of the mounting block 8061; two groups of fixed plates 8067 are provided in the adjusting slot 8066; a group of telescopic scrapers 8062 are movably penetrated through the bottom of each group of the fixed plates 8067; elastic metal scrapers 8065 are provided at the bottom of the two groups of fixed plates 8067; the elastic metal scrapers 8065 are located between the two groups of telescopic scrapers 8062, and a group of scraping grooves 8063 are provided at the upper edge of a side wall of each group of the telescopic scrapers 8062 away from the elastic metal scrapers 8065; a plurality of groups of glue spray heads 8064 are equidistantly provided at the bottom of the mounting block 8061; the output end of the glue storage box 802 is connected to the input end of the plurality of groups of glue spray heads 8064.

[0056] When stacking chips, first adjust the distance between the two sets of fixed plates 8067 according to the chip size, so that the distance between the two sets of telescopic scrapers 8062 is adjusted to the corresponding distance, and the elastic metal scraper 8065 is compressed and deformed into a fan ring. When applying chip adhesive, the glue storage box 802 sprays the chip adhesive through a plurality of glue spray heads 8064, and the mounting block 8061 drives the plurality of glue spray heads 8064 to move to one side to spray glue. At the same time, the bottom of the elastic metal scraper 8065 is The glue is scraped flat and the convex surface pushes the excess glue to both sides, and the excess glue is scraped off by two sets of telescopic scrapers 8062. After the packaging work is completed, the glue coating component 806 is controlled to move into the glue recovery box 10, and the hot air gun 12 blows a high-temperature air flow into the glue recovery box 10 to melt the glue attached to the telescopic scraper 8062 and blow it off the mobile phone, so that the packaging device can not only freely adjust the glue thickness between multiple groups of chips, but also recycle excess glue to avoid glue waste, thereby improving the use effect of the packaging device.

[0057] By controlling the multi-chip stacking mechanism 6 to adsorb several groups of chips at one time, and then controlling the chip bonding mechanism 8 to spray chip bonding glue on the substrate, and then controlling the multi-chip stacking mechanism 6 to bond one group of chips to the substrate, and then controlling the chip bonding mechanism 8 to spray chip bonding glue on the chip again, repeating the process several times until all the chips are stacked and packaged on the substrate, and then controlling the gold wire bonding mechanism 9 to connect all the chips to the substrate to complete the chip stacking and packaging work, the need for repeated vacuum adsorption and stacking of the chips is avoided, thereby improving the efficiency of the packaging work, and the multi-chip stacking mechanism 6 can ensure that the chips are placed in the same position each time, thereby improving the accuracy of the packaging work.

[0058] By adjusting the spacing between the two groups of fixed plates 8067, the spacing between the two groups of telescopic scrapers 8062 is adjusted to a corresponding distance, and the elastic metal scraper 8065 is compressed and deformed into a fan ring. When applying the chip adhesive, the glue storage box 802 sprays the chip adhesive through several groups of glue spray heads 8064, and the mounting block 8061 drives several groups of glue spray heads 8064 to move to one side to spray glue. At the same time, the bottom of the elastic metal scraper 8065 scrapes the glue flat and the convex surface pushes the excess glue to both sides. The two groups of telescopic scrapers 8062 scrape off the excess glue, so that the packaging device can not only freely adjust the thickness and uniformity of the glue between multiple groups of chips, thereby improving the quality of the packaging work, but also recycle the excess glue to avoid glue waste.

[0059] By placing the substrate on top of the substrate support plate 707, then controlling four groups of chip clamps 705 to clamp the substrate, and then controlling four groups of movable support plates 703 to drive the four groups of chip clamps 705 to apply corresponding forces to the substrate through several groups of buffer springs 704, not only the problem of easy damage to the substrate when the packaging device is rigidly clamped is avoided, but also the packaging device can complete the fixing work when dealing with rigid substrates or flexible substrates, thereby improving the compatibility of the packaging device.

[0060] The moving mechanism includes a rotating support ring 3, which is movably sleeved on the top side wall of the processing platform 1. Two groups of first electric push rods 4 are symmetrically arranged on the outer wall of the rotating support ring 3. A first electric slide 5 is arranged on the top of the two groups of first electric push rods 4. The output end of the first electric slide 5 is transmission connected to the multi-chip stacking mechanism 6. The chip bonding mechanism 8 and the gold wire bonding mechanism 9 are respectively arranged on one side wall of the first electric slide 5. When the chip is packaged, by controlling the rotation of the rotating support ring 3 and the horizontal movement of the multi-chip stacking mechanism 6 by the first electric slide 5, the chip can be stacked at any position on the substrate at any angle, and the chip bonding mechanism 8 and the gold wire bonding mechanism 9 always remain vertical to the multi-chip stacking mechanism 6, thereby improving the use effect of the packaging device.

[0061] Based on the above-mentioned integrated circuit multi-chip positioning packaging device, an embodiment of the present invention further proposes a packaging method for the integrated circuit multi-chip positioning packaging device. Exemplarily, the packaging method includes:

[0062] Fixing the substrate on the top of the substrate fixing mechanism;

[0063] Control the vacuum adsorption component to adsorb multiple groups of chips at one time;

[0064] Controlling the chip bonding mechanism to apply the chip bonding glue to the corresponding position of the substrate;

[0065] Control the vacuum adsorption assembly to place a group of chips;

[0066] Controlling the chip bonding mechanism to apply the chip bonding glue on the top of the chip;

[0067] Control the vacuum adsorption assembly to place the next group of chips;

[0068] After repeated several times, multiple groups of chips are stacked;

[0069] Controlling the gold wire bonding mechanism to connect multiple groups of chips to the substrate;

[0070] Complete the positioning and packaging of multiple chips.

[0071] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-chip positioning and packaging device for integrated circuits, comprising a processing platform (1), characterized in that: A transfer mechanism is provided on the top of the processing platform (1); a multi-chip stacking mechanism (6) is transmission-connected to the output end of the transfer mechanism; a substrate fixing mechanism (7) is provided at the top center of the processing platform (1); A glue recovery box (10) is provided at one edge of the top side of the processing platform (1); a chip bonding mechanism (8) is provided on one side wall of the transfer mechanism; and a gold wire bonding mechanism (9) is provided on one side wall of the transfer mechanism away from the chip bonding mechanism (8); The multi-chip stacking mechanism (6) comprises a first electric turntable (601); the bottom of the first electric turntable (601) is drivingly connected to a mounting frame (602); a scanning camera is provided at the bottom of the mounting frame (602); a vacuum adsorption component (603) is provided inside the mounting frame (602); The vacuum adsorption assembly (603) comprises a plurality of sealing plates (6031) hinged end to end in sequence; a sealing structure is provided on the hinge shaft between two adjacent sealing plates (6031); the two side walls of each sealing plate (6031) are movably fitted on the corresponding two side inner walls of the mounting frame (602); a plurality of connecting transmission grooves (6032) are provided on the inner wall of each sealing plate (6031); a group of vacuum suction holes (6033) are provided at the center of the inner wall of each sealing plate (6031); a group of electromagnetic air valves (6034) are provided at the center of the outer wall of each sealing plate (6031); each group of electromagnetic air valves (6034) are connected to the corresponding A group of vacuum suction holes (6033) are connected; one end of each group of solenoid valves (6034) away from the sealing plate (6031) is connected to a group of vacuum suction cups (6035); two groups of rotating shafts (6036) are provided in a plurality of groups of sealing plates (6031); both ends of each group of rotating shafts (6036) are respectively rotatably connected to the inner wall of a corresponding side of the mounting frame (602); a plurality of groups of connecting transmission rods (6037) are distributed in a circular array on the outer wall of each group of rotating shafts (6036); one end of each group of connecting transmission rods (6037) away from the corresponding group of rotating shafts (6036) is movably penetrated into the corresponding group of connecting transmission grooves (6032).

2. The multi-chip positioning and packaging device for integrated circuits according to claim 1, characterized in that: The chip bonding mechanism (8) comprises a second electric slide (801); a second electric turntable (803) is transmission-connected to the output end of the second electric slide (801); a second electric push rod (804) is transmission-connected to the bottom of the second electric turntable (803); a third electric slide (805) is transmission-connected to the output end of the second electric push rod (804); and a glue coating component (806) is transmission-connected to the output end of the third electric slide (805).

3. The multi-chip positioning and packaging device for integrated circuits according to claim 2, characterized in that: The glue coating component (806) comprises a mounting block (8061); an adjustment slot (8066) is provided at the bottom of the mounting block (8061); two groups of fixed plates (8067) are provided in the adjustment slot (8066); a group of telescopic scrapers (8062) are movably penetrated through the bottom of each group of the fixed plates (8067); elastic metal scrapers (8065) ​​are provided at the bottom of the two groups of the fixed plates (8067); the elastic metal scrapers (8065) ​​are located between the two groups of telescopic scrapers (8062), and a group of scraping grooves (8063) are provided at the upper edge of a side wall of each group of the telescopic scrapers (8062) away from the elastic metal scrapers (8065); The vacuum adsorption component (603) is controlled to adsorb multiple groups of chips at one time, and then the multi-chip stacking mechanism (6) and the chip bonding mechanism (8) are controlled to work alternately to complete the stacking of the multiple groups of chips.

4. The multi-chip positioning and packaging device for integrated circuits according to claim 1, characterized in that: The mounting frame (602) is U-shaped; a first motor (604) is provided on one side wall of the mounting frame (602); an output end of the first motor (604) is transmission-connected to a vacuum adsorption component (603); a vacuum pump (605) is provided on one side wall of the mounting frame (602); an output end of the vacuum pump (605) is connected to the vacuum adsorption component (603).

5. The multi-chip positioning and packaging device for integrated circuits according to claim 1, characterized in that: The substrate fixing mechanism (7) comprises a shell (701); a substrate support plate (707) is provided at the center of the top of the shell (701); four groups of first slide grooves (702) are opened in the vertical direction on the top of the shell (701); a group of movable support plates (703) are provided in each group of the first slide grooves (702); a group of chip clamps (705) are provided on the side of each group of movable support plates (703) close to the substrate support plate (707); and a plurality of groups of buffer springs (704) are provided between each group of chip clamps (705) and the corresponding group of movable support plates (703).

6. The multi-chip positioning and packaging device for integrated circuits according to claim 3, characterized in that: A glue storage box (802) is provided on the top of the second electric slide (801).

7. The multi-chip positioning and packaging device for integrated circuits according to claim 6, characterized in that: The mounting block (8061) is transmission-connected to the output end of the third electric slide (805).

8. The multi-chip positioning and packaging device for integrated circuits according to claim 7, characterized in that: A plurality of groups of glue spray heads (8064) are arranged at equal intervals at the bottom of the mounting block (8061); the output end of the glue storage box (802) is connected to the input ends of the plurality of groups of glue spray heads (8064).

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