Vertical interconnection circuit board assembly based on tenon-and-mortise structure

Abstract

The invention discloses a vertical interconnection circuit board assembly based on a tenon-and-mortise structure, relates to a microcircuit structure, and provides the scheme for solving the problem of large loss in the prior art. Comprising a first circuit board and a second circuit board, the edge of the first circuit board close to the second circuit board is provided with an insertion block; one side of the first circuit board is provided with a first insertion metal layer, and the other side is provided with a second insertion metal layer. The first insertion metal layer extends to the free end of the insertion block, and the second insertion metal layer extends to the fixed end of the insertion block; the second circuit board is provided with matched jacks at positions corresponding to the insertion blocks; one side of the second circuit board is provided with a first connection metal layer, and the other side is provided with a second connection metal layer; after the insertion block is inserted into the insertion hole, the first insertion metal layer is electrically connected with the first connection metal layer, and the second insertion metal layer is electrically connected with the second connection metal layer. And the antenna has the characteristics of simple processing, low cost, small insertion loss, large working bandwidth and the like.

Description

Technical Field

[0001] The invention relates to a microcircuit structure, in particular to a vertical interconnection circuit board assembly based on a mortise and tenon structure. Background Art

[0002] In RF circuits, microwave circuits and antenna systems, two circuit boards that are perpendicular to each other or in complementary contact often need to form a reliable electrical connection through flexible circuit boards, RF connectors, connecting circuit boards or connecting wires. The use of flexible circuit boards may cause performance degradation or even damage system functions due to deformation and other reasons. The use of RF connectors and RF cables for interconnection will increase both system cost and system volume. The use of transfer circuit boards usually requires the use of connectors or flexible circuit boards to assist in achieving reliable electrical connections, which further increases costs and may cause greater losses. In order to reduce system costs and achieve reliable electrical connections, new interconnect structures need to be proposed to solve the above problems. Summary of the invention

[0003] The purpose of the present invention is to provide a vertical interconnected circuit board assembly based on a mortise and tenon structure to solve the problems existing in the above-mentioned prior art.

[0004] A vertically interconnected circuit board assembly based on a mortise and tenon structure described in the present invention comprises a first circuit board and a second circuit board arranged perpendicularly to each other; an insert block is provided at an edge of the first circuit board close to the second circuit board; a first insertion metal layer is provided on one side of the first circuit board, and a second insertion metal layer is provided on the other side; the first insertion metal layer extends to the free end of the insert block, and the second insertion metal layer extends to the fixed end of the insert block; the second circuit board is provided with a matching socket at a position corresponding to the insert block; a first connecting metal layer is provided on one side of the second circuit board, and a second connecting metal layer is provided on the other side; after the insert block is inserted into the socket, the first insertion metal layer forms an electrical connection with the first connecting metal layer, and the second insertion metal layer forms an electrical connection with the second connecting metal layer.

[0005] The first insertion metal layer is fixed to the first connection metal layer by welding. The second insertion metal layer is fixed to the second connection metal layer by welding.

[0006] It also includes a third circuit board arranged in parallel with the second circuit board; the first circuit board is located between the second circuit board and the third circuit board, and the first circuit board and the third circuit board are fixedly connected by a mortise and tenon structure.

[0007] After the plug is inserted into the jack, the first circuit board and the second circuit board form a microstrip line transmission unit, and / or a coplanar waveguide transmission unit, and / or a strip-ground coplanar waveguide transmission unit, and / or a stripline transmission unit, and / or a slotline transmission unit.

[0008] The vertical interconnection circuit board assembly based on the mortise and tenon structure described in the present invention has the advantage that a stable and reliable interconnection can be formed between mutually perpendicular circuit boards without the need for flexible circuit boards, radio frequency connectors, etc., and is a new type of vertical interconnection method. The jacks and plugs on the PCB substrate are nested with each other to form a structural support, which ensures the strength and stability of the system structure. The circuit routing can be welded according to the design requirements to achieve electrical connection, thereby ensuring the reliable maintenance of system performance and functions. This technology can be flexibly adjusted according to the structure of the circuit signal line to meet various transmission structures such as microstrip lines, coplanar waveguides, coplanar waveguides with ground, strip lines, and slot transmission lines. Various technical processing can also be performed to form transformations and interconnections between different circuit layers and different signal interfaces. It has the characteristics of simple processing, low cost, low insertion loss and large working bandwidth. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a structural schematic diagram of the first circuit board in the present invention.

[0010] Figure 2 It is a schematic structural diagram of the second circuit board in the present invention.

[0011] Figure 3 It is a schematic diagram of the cross-sectional structure of the first circuit board and the second circuit board after being plugged in the present invention.

[0012] Figure 4 It is a schematic diagram of the combined structure of the first embodiment of the present invention.

[0013] Figure 5 It is a schematic diagram of the explosion structure of the first embodiment of the present invention.

[0014] Figure 6 It is a schematic diagram of the simulation test structure of the microstrip line transmission unit of the first embodiment of the present invention.

[0015] Figure 7 yes Figure 6 Simulation curve diagram of the microstrip line transmission unit shown.

[0016] Figure 8 This is a schematic diagram of the microstrip line simulation test structure based on the SMP connector in Example 1.

[0017] Fig. 9 yes Figure 8 Simulation curve diagram of the microstrip line transmission structure shown.

[0018] Fig.10 It is a schematic diagram of the simulation test structure of the coplanar waveguide transmission unit of Example 1 in the present invention.

[0019] Fig.11 yes Fig.10 Simulation curve diagram of the coplanar waveguide transmission unit shown.

[0020] Fig.12 It is a schematic diagram of the coplanar waveguide simulation test structure based on the SMP connector in Example 2.

[0021] Fig.13 yes Fig.12 Simulation curve diagram of the coplanar waveguide transmission structure shown.

[0022] Fig.14 It is a schematic diagram of the simulation test structure of the slot line transmission unit in the first embodiment of the present invention.

[0023] Fig.15 yes Fig.14 Simulation curve diagram of the slot line transmission unit shown.

[0024] Fig.16 It is a schematic diagram of the combined structure of the second embodiment of the present invention.

[0025] Fig.17 It is a schematic diagram of the explosion structure of the second embodiment of the present invention.

[0026] Reference numerals:

[0027] 10-first circuit board, 11-insertion block, 12-first insertion metal layer, 13-second insertion metal layer;

[0028] 20-second circuit board, 21-jack, 22-first connecting metal layer, 23-second connecting metal layer;

[0029] 30- third circuit board;

[0030] 41-first simulation feeding port, 42-second simulation feeding port;

[0031] A-microstrip line transmission unit, B-coplanar waveguide transmission unit, C-strip coplanar waveguide transmission unit, D-stripline transmission unit, E-slotline transmission unit. DETAILED DESCRIPTION

[0032] Embodiment 1

[0033] like Figures 1 to 5As shown, a vertically interconnected circuit board assembly based on a mortise and tenon structure described in the present invention includes a first circuit board 10 and a second circuit board 20 arranged perpendicularly to each other. The first circuit board 10 is provided with an insert block 11 at an edge close to the second circuit board 20, and the insert block 11 is similar to a gold finger structure. A first insertion metal layer 12 is provided on one side of the first circuit board 10, and a second insertion metal layer 13 is provided on the other side. The first insertion metal layer 12 extends to the free end of the insert block 11, and the second insertion metal layer 13 extends to the fixed end of the insert block 11. The second circuit board 20 is provided with a matching socket 21 at a position corresponding to the insert block 11. A first connecting metal layer 22 is provided on one side of the second circuit board 20, and a second connecting metal layer 23 is provided on the other side. After the insert block 11 is inserted into the socket 21, the first insertion metal layer 12 is electrically connected to the first connecting metal layer 22, and the second insertion metal layer 13 is electrically connected to the second connecting metal layer 23.

[0034] Each circuit board is a PCB.

[0035] The number of the plug blocks 11 and the number of the plug holes 21 are adapted to each other, and the number can be flexibly adjusted to one, two or more according to the circuit design.

[0036] The first insertion metal layer 12 is fixed to the first connection metal layer 22 by welding. The second insertion metal layer 13 is fixed to the second connection metal layer 23 by welding.

[0037] After the plug block 11 is inserted into the jack 21, the first circuit board 10 and the second circuit board 20 form a microstrip line transmission unit A, and / or a coplanar waveguide transmission unit B, and / or a stripline coplanar waveguide transmission unit C, and / or a stripline transmission unit D, and / or a slotline transmission unit E.

[0038] In terms of vertical interconnection, various external connection components in the prior art are completely avoided, and it is particularly suitable for high-frequency fields such as radio frequency circuits, microwave circuits and antenna technology. It can provide reliable low insertion loss electrical connection between two or more layers of circuit boards that were originally not in electrical contact with each other, and has the characteristics of simple processing, low cost, low insertion loss and large working bandwidth.

[0039] In this embodiment, the technical effect is demonstrated through the following simulation comparison:

[0040] like Figure 6 As shown, an independent simulation test is performed on the microstrip line transmission unit A, and a first simulation feeding port 41 and a second simulation feeding port 42 are respectively set at the input and output ends of the signal, and the characteristic impedance of the microstrip transmission line is set to 50 ohms. By inputting the test signal, the following is obtained: Figure 7From the simulation curve shown, we can see that S21 and S12 are both greater than -4dB between 1 and 10GHz. In this frequency range, the reflection coefficients S11 and S22 of the two ports are both less than -10dB, indicating that the signal reflection is small in this frequency range and has good port matching performance.

[0041] Comparative Example 1: Based on the fact that all test parameters remain unchanged, the mortise and tenon structure in the present invention is replaced with the SMP radio frequency connection structure in the prior art, such as Figure 8 By inputting the same test signal, we can get Fig. 9 From the simulation curve shown, we can see that S21 and S12 are both greater than -4dB from 1GHz to 7GHz, indicating that the transmission loss from one port to the other port is small in this frequency range; at the same time, S11 is less than -10dB, indicating that the signal reflection at this port is very small, but the reflection coefficient S22 at the other port is greater than -10dB between 2GHz and 3.6GHz, indicating that the reflection at this port is large. By comparison Figure 7 and Fig. 9 The data show that the mortise and tenon structure of the present invention has the advantages of a wider bandwidth and a smaller in-band reflection coefficient.

[0042] like Fig.10 As shown, an independent simulation test is performed on the coplanar waveguide transmission unit B, and the characteristic impedance is set to 50 ohms. By inputting the test signal, the following is obtained: Fig.11 From the simulation curves shown, we can see that S21 and S12 are both greater than -4dB from 1GHz to 30GHz, indicating that the transmission loss from one port to the other is small in this frequency range; on the other hand, S11 and S22 are both less than -10dB, indicating that the signal reflection at the two ports is very small.

[0043] Comparative Example 2: Based on the fact that all test parameters remain unchanged, the mortise and tenon structure in the present invention is replaced with the SMP radio frequency connection structure in the prior art, such as Fig.12 By inputting the same test signal, we can get Fig.13 From the simulation curve shown, we can see that it has relatively good performance between 1G and 16G. S21 and S12 are both greater than -4dB in this frequency range, indicating that the energy loss is small when transmitting from one port to another. In addition, in this frequency range, most of the reflection coefficients S11 and S22 are less than -10dB, indicating that the reflection coefficients on the two ports are small. However, it is worth noting that S11 and S22 are both greater than -10dB around 5GHz to 12.5GHz, indicating that the reflection coefficient is large in this frequency range and the port impedance matching is poor. By comparison Fig.11 and Fig.13It can be seen from the data that it is also proved that the mortise and tenon structure of the present invention can have a larger bandwidth and a smaller in-band reflection coefficient.

[0044] For slot transmission lines, due to the structural shape of commercial RF connectors such as SMP connectors, it is impossible to directly connect the slot transmission lines. The slot transmission lines need to be converted into coplanar waveguides or microstrip transmission lines and then welded to the RF connectors. In this case, the loss obtained by using RF connectors to achieve vertical interconnection will be greater than Fig. 9 and Fig.13 The loss shown in the figure, the port reflection coefficient will also be larger. The mortise and tenon structure in the present invention can directly realize the vertical interconnection of the slot transmission line. Fig.14 As shown, an independent simulation test is performed on the slot line transmission unit E, and the characteristic impedance is set to 100 ohms. By inputting the test signal, the following is obtained: Fig.15 From the simulation curves shown, it can be observed that in the frequency range of 4 GHz to 24 GHz, S21 and S12 are both greater than -4 dB, indicating that the transmission loss from one port to another is small; in this frequency range, S11 and S22 are both less than -10 dB, indicating that the reflection coefficients at the two ports are small, and good port matching can be achieved.

[0045] From the performance comparison of various simulation curves, it can be found that the mortise and tenon structure of the present invention has the advantages of larger bandwidth, smaller reflection coefficient, etc. Moreover, no additional connector is required for vertical interconnection, so the size is more compact and the cost is lower.

[0046] Embodiment 2

[0047] The T-shaped structure of the first embodiment is further improved, including a third circuit board 30 arranged in parallel with the second circuit board 20, to obtain an I-shaped structure. The first circuit board 10 is located between the second circuit board 20 and the third circuit board 30, and the first circuit board 10 and the third circuit board 30 are fixedly connected by a mortise and tenon structure. The electrical connection method of the first circuit board 10 and the third circuit board 30 is the same as the electrical connection method of the first circuit board 10 and the second circuit board 20 in the first embodiment. According to the actual design requirements of the circuit, the circuit structures of the third circuit board 30 and the second circuit board 20 can be the same or different, and the flexibility is high.

[0048] Under the same inventive concept of this embodiment, a fourth circuit board arranged in parallel with the first circuit board 10 can be further provided to obtain a square-shaped structure. The fourth circuit board is located between the second circuit board 20 and the third circuit board 30, and the first circuit board 10 and the third circuit board 30 are fixedly connected by a mortise and tenon structure.

[0049] For those skilled in the art, various other corresponding changes and deformations can be made according to the technical solutions and concepts described above, and all of these changes and deformations should fall within the protection scope of the claims of the present invention.

Claims

1. A vertical interconnection circuit board assembly based on a mortise and tenon structure, characterized in that: It comprises a first circuit board (10) and a second circuit board (20) which are arranged perpendicular to each other; An insert block (11) is provided at an edge of the first circuit board (10) close to the second circuit board (20); a first insert metal layer (12) is provided on one side of the first circuit board (10), and a second insert metal layer (13) is provided on the other side; the first insert metal layer (12) extends to a free end of the insert block (11), and the second insert metal layer (13) extends to a fixed end of the insert block (11); The second circuit board (20) is provided with a matching plug hole (21) at a position corresponding to the plug block (11); a first connecting metal layer (22) is provided on one side of the second circuit board (20), and a second connecting metal layer (23) is provided on the other side; After the plug (11) is inserted into the plug hole (21), the first insertion metal layer (12) forms an electrical connection with the first connection metal layer (22), and the second insertion metal layer (13) forms an electrical connection with the second connection metal layer (23).

2. According to claim 1, a vertical interconnection circuit board assembly based on a mortise and tenon structure is characterized in that: The first insertion metal layer (12) and the first connection metal layer (22) are fixed by welding.

3. According to claim 1, a vertical interconnection circuit board assembly based on a mortise and tenon structure is characterized in that: The second insertion metal layer (13) and the second connection metal layer (23) are fixed by welding.

4. A vertical interconnection circuit board assembly based on a mortise and tenon structure according to claim 1, characterized in that: It also includes a third circuit board (30) arranged in parallel with the second circuit board (20); the first circuit board (10) is located between the second circuit board (20) and the third circuit board (30), and the first circuit board (10) and the third circuit board (30) are fixedly connected via a mortise and tenon structure.

5. A vertical interconnection circuit board assembly based on a mortise and tenon structure according to any one of claims 1 to 4, characterized in that: After the plug (11) is inserted into the jack (21), the first circuit board (10) and the second circuit board (20) form a microstrip line transmission unit, and / or a coplanar waveguide transmission unit, and / or a strip-to-ground coplanar waveguide transmission unit, and / or a stripline transmission unit, and / or a slotline transmission unit.

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