Heat dissipation structure and electronic equipment

Abstract

The invention discloses a heat dissipation structure and electronic equipment, and belongs to the technical field of heat dissipation. The electronic equipment comprises a first electronic component, a heat dissipation structure and a second electronic component, the heat dissipation structure is located between the first electronic element and the second electronic element; the heat dissipation structure comprises a first heat conduction structure, a first shell part and a second heat conduction structure, the first electronic component is located on the side, back to the first shell part, of the first heat conduction structure, and the second electronic component is located on the side, back to the first shell part, of the second heat conduction structure. The orthographic projection area of the first heat conduction structure in the first plane is larger than or equal to the orthographic projection area of the second heat conduction structure in the first plane, the orthographic projection area of the second heat conduction structure in the first plane is larger than or equal to the orthographic projection area of the second electronic element in the first plane, and the first plane is perpendicular to the thickness direction of the electronic equipment. The phenomenon that the local area of the display screen is overheated can be relieved to a certain degree, and therefore a user has good use experience.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and an electronic device. Background Art

[0002] With the continuous improvement of the performance of electronic devices such as electronic devices and tablet computers, users can use electronic devices for more purposes, such as mobile office, audio and video entertainment, design and drawing, gaming and e-sports, etc., so the use time of electronic devices is also showing an increasing trend. The improvement of electronic device performance and the increase in use time are accompanied by the heating problem of electronic devices. Usually, the SOC (System on Chip) area of ​​electronic devices is the hottest position of electronic devices, and its main heat transfer path is: SOC is the main heat source, and the vapor chamber (VC) is between the middle frame and the display screen. The heat source is close to the display screen. The heat will be quickly transferred to the display screen, causing a local area of ​​the display screen to become a hot spot, and then triggering measures such as frequency limiting of the electronic device to control heat dissipation, but this affects the user experience. Summary of the invention

[0003] The present application provides a heat dissipation structure and an electronic device, which can solve the problem that the heat of the chip is quickly transferred to the display screen, causing a local area of ​​the display screen to become a hot spot, thereby affecting the user experience.

[0004] The technical solution is as follows:

[0005] According to a first aspect of the present application, an electronic device is provided, comprising: a first electronic component, a heat dissipation structure, and a second electronic component; the heat dissipation structure is located between the first electronic component and the second electronic component; the heat dissipation structure comprises a first heat-conducting structure, a first shell portion, and a second heat-conducting structure, the first shell portion is located between the first heat-conducting structure and the second heat-conducting structure, the first electronic component is located on a side of the first heat-conducting structure facing away from the first shell portion, the second electronic component is located on a side of the second heat-conducting structure facing away from the first shell portion, an orthographic projection area of ​​the first heat-conducting structure in a first plane is greater than or equal to an orthographic projection area of ​​the second heat-conducting structure in the first plane, an orthographic projection area of ​​the second heat-conducting structure in the first plane is greater than or equal to an orthographic projection area of ​​the second electronic component in the first plane, and the first plane is perpendicular to a thickness direction of the electronic device.

[0006] By adopting the above scheme, after the first heat-conducting structure and the second heat-conducting structure are respectively provided on both sides of the first shell, the heat generated by the second electronic component is firstly dispersed by heat conduction through the second heat-conducting structure, thereby increasing the heat transfer area and making the heat evenly dispersed. After the heat is then conducted to the first shell and the first heat-conducting structure, the temperature has been significantly reduced, so that the heat generated by the second electronic component has less influence on the first heat-conducting structure. Similarly, the heat generated by the first electronic component has less influence on the second electronic component. In particular, when the first electronic component is a display screen and the second sub-electronic component is a chip, the overheating phenomenon of the local area of ​​the display screen can be alleviated to a certain extent by providing a heat dissipation structure, thereby providing users with a better user experience.

[0007] In some implementations, a first through hole is formed in the first shell portion, and at least a portion of an orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the first through hole in the first plane.

[0008] By adopting the above scheme, after the heat generated by the second electronic component is conducted to the second heat-conducting structure, since the orthographic projection of the first shell portion and the orthographic projection of the first through hole have an overlapping part, in the thickness direction of the electronic device, the part of the first electronic component corresponding to the second electronic component is separated by the first through hole, so that the heat will not be directly conducted to the part of the second electronic component in the thickness direction of the electronic device, thereby avoiding overheating of the part, which is further beneficial to ensure the user experience.

[0009] In some implementations, the orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the second heat conductive structure in the first plane.

[0010] By adopting the above solution, the heat generated by the second electronic component can be better conducted through the second heat-conducting structure, thereby preventing the heat generated by the second electronic component from being directly transferred to the first shell.

[0011] In some implementations, the second heat-conducting structure includes a first cover plate and a second cover plate, and the first cover plate and the second cover plate are sealed and connected to form a sealed cavity;

[0012] The sealed cavity is provided with a capillary structure and a cooling medium;

[0013] A support structure extending in the direction where the second cover plate is located is disposed on a side of the first cover plate facing the sealed cavity, or / and a support structure extending in the direction where the first cover plate is located is disposed on a side of the second cover plate facing the sealed cavity.

[0014] By adopting the above solution, the support structure can ensure the stability of the overall structure of the sealed cavity, avoiding the sealing cavity from being flattened during use; and the capillary structure and the cooling medium can achieve heat dissipation more effectively.

[0015] In some implementations, a side of the second cover plate facing away from the sealed cavity faces the second electronic component; a side of the second cover plate facing away from the sealed cavity has a first protruding structure, and the first protruding structure protrudes in the direction where the second electronic component is located;

[0016] An orthographic projection of the first protruding structure in the first plane and an orthographic projection of the second electronic component in the first plane have an overlapping portion.

[0017] By adopting the above solution, the distance between the second heat-conducting structure and the second electronic component can be reduced by the first protruding structure, so that heat can be quickly transferred to the second heat-conducting structure, thereby facilitating the functional stability of the second electronic component.

[0018] In some implementations, the electronic device further includes a shielding frame, the second cover is fixedly connected to the shielding frame, the shielding frame is formed with a receiving cavity, and the receiving cavity is used to receive the second electronic component;

[0019] The shielding frame is provided with a second through hole, the orthographic projection of the second electronic component in the first plane overlaps with the orthographic projection of the second through hole in the first plane, and the first protruding structure extends into the accommodating cavity through the second through hole.

[0020] By adopting the above scheme, by setting up a combination of the shielding frame and the second heat-conducting structure, it is possible to achieve both heat conduction for the second electronic component and isolation from internal and external power supply noise, signal interference, electromagnetic radiation and other interferences, thereby maintaining the stability and reliability of the circuit in the second electronic component.

[0021] In some implementations, the shield frame includes a frame portion;

[0022] The second cover plate includes a main body portion and a folded edge portion, wherein the folded edge portion is located at an edge of the main body portion;

[0023] The frame portion is connected to the folded edge portion.

[0024] By adopting the above solution, the folded edge portion is connected to the frame portion, so as to realize reliable connection between the second heat conducting structure and the shielding frame portion.

[0025] In some implementations, the folded edge portion includes a first sub-portion and a second sub-portion; the first sub-portion and the second sub-portion are arranged at an angle to form a second protruding structure protruding toward the accommodating cavity; the second protruding structure abuts against the border portion to achieve an interference fit between the second cover plate and the shielding frame.

[0026] By adopting the above solution and the interference fit method, it is easy to assemble on the one hand, and easy to achieve reliable connection between the second heat conducting structure and the shielding frame on the other hand.

[0027] In some implementations, the folded edge portion has a third protruding structure protruding toward the accommodating cavity, the frame portion has a first groove structure, and at least a portion of the third protruding structure extends into the first groove structure, so that the second cover plate is engaged and connected with the shielding frame;

[0028] Or / and, the border portion has a fourth protrusion structure protruding away from the accommodating cavity, the folded edge portion has a second groove structure, and at least part of the fourth protrusion structure extends into the second groove structure, so that the second cover plate is snap-fitted and connected to the shielding frame.

[0029] By adopting the above solution and the snap-fit ​​connection method, it is easy to assemble on the one hand, and easy to achieve reliable connection between the second heat-conducting structure and the shielding frame on the other hand.

[0030] In some implementations, the shielding frame further includes a panel portion, the frame portion surrounds an edge of the panel portion, and the second through hole is opened on the panel portion.

[0031] By adopting the above solution, the panel portion can provide a certain support to the second heat-conducting structure, and on the other hand, some heat can also be conducted to the panel portion, thereby improving the heat dissipation performance of the second electronic component.

[0032] In some implementations, the first cover plate includes a connecting portion and a middle portion; the connecting portion is arranged around a circumferential edge of the middle portion, and the connecting portion is sealed and connected to the second cover plate;

[0033] In the thickness direction of the electronic device, there is a height difference between the connecting portion and the middle portion, so that the sealed cavity is formed after the first cover plate and the second cover plate are sealed and connected.

[0034] By adopting the above solution, it is beneficial to form a sealed cavity.

[0035] In some implementations, the first heat-conducting structure is a vapor chamber;

[0036] Alternatively, the first heat-conducting structure is made of graphite.

[0037] By adopting the above solution, better heat conduction can be achieved by using a heat spreader or graphite.

[0038] In some implementations, the first electronic component is a display screen, and the second electronic component is a chip;

[0039] The electronic device further includes a middle frame, and the first shell portion is a partial structure of the middle frame.

[0040] By adopting the above solution, the heat dissipation structure can better dissipate heat for the chip and reduce the impact of the heat generated by the chip on the display screen.

[0041] In some implementations, the cooling medium is water, methanol or acetone; and the capillary structure is a capillary mesh.

[0042] By adopting the above solution, heat dissipation can be better achieved.

[0043] A second aspect of the present application provides a heat dissipation structure, comprising: a first heat-conducting structure, a first shell portion, and a second heat-conducting structure;

[0044] The first shell portion is located between the first heat-conducting structure and the second heat-conducting structure, a side of the first heat-conducting structure facing away from the first shell portion is used to mount a first electronic component of the electronic device, and a side of the second heat-conducting structure facing away from the first shell portion is used to mount a second electronic component of the electronic device;

[0045] The orthographic projection area of ​​the first heat-conducting structure in the first plane is greater than or equal to the orthographic projection area of ​​the second heat-conducting structure in the first plane, the orthographic projection area of ​​the second heat-conducting structure in the first plane is greater than or equal to the orthographic projection area of ​​the second electronic component in the first plane, and the first plane is perpendicular to the thickness direction of the electronic device.

[0046] By adopting the above scheme, after the first heat-conducting structure and the second heat-conducting structure are respectively provided on both sides of the first shell, the heat generated by the second electronic component is firstly dispersed by heat conduction through the second heat-conducting structure, thereby increasing the heat transfer area and making the heat evenly dispersed. After the heat is then conducted to the first shell and the first heat-conducting structure, the temperature has been significantly reduced, so that the heat generated by the second electronic component has less influence on the first heat-conducting structure. Similarly, the heat generated by the first electronic component has less influence on the second electronic component. In particular, when the first electronic component is a display screen and the second sub-electronic component is a chip, the overheating phenomenon of the local area of ​​the display screen can be alleviated to a certain extent by providing a heat dissipation structure, thereby providing users with a better user experience.

[0047] In some implementations, a first through hole is formed in the first shell portion, and at least a portion of an orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the first through hole in the first plane.

[0048] By adopting the above scheme, after the heat generated by the second electronic component is conducted to the second heat-conducting structure, since the orthographic projection of the first shell portion and the orthographic projection of the first through hole have an overlapping part, in the thickness direction of the electronic device, the part of the first electronic component corresponding to the second electronic component is separated by the first through hole, so that the heat will not be directly conducted to the part of the second electronic component in the thickness direction of the electronic device, thereby avoiding overheating of the part, which is further beneficial to ensure the user experience.

[0049] In some implementations, the orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the second heat conductive structure in the first plane.

[0050] By adopting the above solution, the heat generated by the second electronic component can be better conducted through the second heat-conducting structure, thereby preventing the heat generated by the second electronic component from being directly transferred to the first shell.

[0051] In some implementations, the second heat-conducting structure includes a first cover plate and a second cover plate, and the first cover plate and the second cover plate are sealed and connected to form a sealed cavity;

[0052] The sealed cavity is provided with a capillary structure and a cooling medium;

[0053] A support structure extending in the direction where the second cover plate is located is disposed on a side of the first cover plate facing the sealed cavity, or / and a support structure extending in the direction where the first cover plate is located is disposed on a side of the second cover plate facing the sealed cavity.

[0054] By adopting the above solution, the support structure can ensure the stability of the overall structure of the sealed cavity, avoiding the sealing cavity from being flattened during use; and the capillary structure and the cooling medium can achieve heat dissipation more effectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0056] Figure 2 A simplified diagram of a partial structure inside an electronic device in the related art;

[0057] Figure 3 A simplified diagram of a partial structure inside an electronic device in an embodiment of the present application;

[0058] Figure 4It is another simplified diagram of a partial structure inside the electronic device in the embodiment of the present application;

[0059] Figure 5 is a schematic structural diagram of the second heat-conducting structure and the shielding frame installed together in the embodiment of the present application;

[0060] Figure 6 yes Figure 5 Exploded diagram of

[0061] Figure 7 yes Figure 5 A top view of

[0062] Figure 8 is along Figure 7 Sectional view of the mid-GG line;

[0063] Fig. 9 yes Figure 8 A partial enlarged schematic diagram of the H in the middle;

[0064] Fig.10 This is a schematic diagram of the structure of the first cover plate in the embodiment of the present application;

[0065] Fig.11 This is a schematic structural diagram of the first cover plate from another perspective in the embodiment of the present application;

[0066] Fig.12 This is a schematic diagram of the structure of the second cover plate in the embodiment of the present application;

[0067] Fig.13 This is a schematic structural diagram of the second cover plate from another perspective in the embodiment of the present application;

[0068] Fig.14 This is a schematic diagram of the structure of the shielding frame in the embodiment of the present application;

[0069] Fig.15 This is a schematic diagram of a structure in which a second heat-conducting structure, a shielding frame and a circuit board are installed together in an embodiment of the present application;

[0070] Fig.16 for Fig.15 A top view of

[0071] Fig.17 For along Fig.16 Sectional view along line AA;

[0072] Fig.18 for Fig.17 Schematic diagram of the local structure at C in the middle;

[0073] Fig.19 for Fig.17 A partial enlarged schematic diagram of point D in the middle;

[0074] Fig. 20 For along Fig.16 Sectional view along the midline BB;

[0075] Fig.21 for Fig. 20 Schematic diagram of the local structure at E in the middle.

[0076] The meanings of the figures are as follows:

[0077] 10. Display screen; 11. Middle frame; 12. Heat sink; 13. Back cover; 14. Battery cavity; 15. Circuit board cavity; 16. SOC; 17. First shielding cover; 18. Second shielding cover; 19. Circuit board; 20. Battery;

[0078] 101, display screen; 102, middle frame; 103, first electronic component; 104, second electronic component; 105, battery cavity; 106, circuit board cavity; 107, battery; 108, circuit board; 109, shielding frame; 110, accommodating cavity; 111, heat dissipation structure; 112, first heat-conducting structure; 113, first shell; 114, second heat-conducting structure; 115, first through hole; 116, first cover plate; 117, second cover plate; 118, capillary structure; 119, connecting part; 120, middle part; 121, support structure; 122, first inner surface; 123, first outer surface; 124, first protruding structure; 125, second inner surface; 126, second outer surface; 127, main body; 128, folded edge; 129, connection area; 130, cavity wall area; 131, main area; 132, recessed area; 133, second through hole; 134, sealed cavity; 135, frame part; 136, panel part; 138, first sub-part; 139, second sub-part; 140, second protruding structure; 141, third protruding structure; 142, first groove structure. DETAILED DESCRIPTION

[0079] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0080] It should be understood that the "multiple" mentioned in this application refers to two or more. In the description of this application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of this application, the words "first" and "second" are used to distinguish between the same items or similar items with basically the same functions and effects. Those skilled in the art can understand that the words "first" and "second" do not limit the quantity and execution order, and the words "first" and "second" do not limit them to be different.

[0081] See also Figure 1 As shown, Figure 1 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device may be a mobile phone, a tablet computer, a laptop computer, a camera, a video recorder, a smart watch, or other electronic device. The mobile phone may be a straight phone or a foldable phone. The embodiment of the present application does not impose any special restrictions on the specific form of the above-mentioned electronic device. For example, for the convenience of description and understanding, the electronic device is taken as an example of a mobile phone.

[0082] The electronic device also includes a display screen and a middle frame, and the display screen is connected to the middle frame; the display screen can be a liquid crystal display screen, an organic light emitting diode display screen, etc.

[0083] See also Figure 2 As shown, Figure 2It is a schematic diagram of the local structure inside the electronic device in the related technology; a vapor chamber 12 (Vapor Chamber, VC) is arranged between the display screen 10 and the middle frame 11. The vapor chamber 12 utilizes the working medium (cooling medium) in the sealed cavity to absorb heat from the liquid phase during boiling and condense into the liquid phase to release heat, and uses capillary force, gravity, etc. as the motive force for the liquid phase working medium to complete the phase change cycle of the gas-liquid phase in the cold and hot areas of the vapor chamber 12, thereby utilizing the phase change latent heat, heat conduction, convection, etc. to achieve efficient heat exchange. The electronic device also includes a back cover 13, and a battery cavity 14 and a circuit board cavity 15 are formed between the back cover 13 and the middle frame 11; the battery cavity 14 is used to install a battery 20, and the circuit board 19 of the electronic device is installed in the circuit board cavity 15, and different types of electronic components are integrated on the circuit board 19, and the electronic components may be SOC16 (System on Chip); SOC16 is located on the side of the circuit board 19 facing the display screen 10, and a first shielding cover 17 is also installed on the side of the circuit board 19 facing the display screen 10, and the first shielding cover 17 covers the SOC16, and a second shielding cover 18 is installed on the side of the circuit board 19 facing the back cover, and the first shielding cover 17 and the second shielding cover 18 are correspondingly arranged in the thickness direction of the electronic device; heat conduction is achieved between the SOC16 and the first shielding cover 17 made of metal through a heat conducting material (not shown), and the heat conducting material may be silicone grease. The SOC16 area of ​​the electronic device is the hottest position of the electronic device, and SOC16 is the main heat source. The main heat transfer path of SOC16 is as follows Figure 2 As shown by the arrow in the figure; after SOC16 transfers the heat to the first shielding cover 17, it is transferred to the middle frame 11 through the first shielding cover 17, and the middle frame 11 transfers the heat to the heat spreader 12 between the middle frame 11 and the display screen 10. Since the heat source is close to the display screen 10, the heat will be quickly transferred to the display screen 10, causing a local area of ​​the display screen 10 to become a hot spot, and then triggering measures such as frequency limiting of the electronic device to control the heat dissipation, but this affects the user experience; in addition, as electronic devices become thinner and thinner, SOC16 is closer and closer to the display screen 10, and the heat dissipation of the chip has become a problem in the design of ultra-thin electronic devices.

[0084] To this end, the embodiment of the present application further provides a heat dissipation structure 111 to solve at least one problem in the related art; the heat dissipation structure 111 provided in the embodiment of the present application is explained in detail below.

[0085] See also Figure 3 As shown, Figure 3This is a simplified diagram of the local structure inside the electronic device in the embodiment of the present application, where the thickness direction of the electronic device is the FF direction; in some embodiments, a first electronic component 103 and a second electronic component 104 of the electronic device are respectively arranged on opposite sides of the heat dissipation structure 111, and the first electronic component 103 can be a display screen 101 of the electronic device, or other electronic components extending in a plane perpendicular to the thickness direction of the electronic device; the second electronic component can be a chip of the electronic device, and the chip is not limited to the SOC of the electronic device, but can also be other chips of the electronic device.

[0086] Continue to see Figure 3 The heat dissipation structure 111 includes a first heat-conducting structure 112, a first shell 113 and a second heat-conducting structure 114. The first shell 113 is located between the first heat-conducting structure 112 and the second heat-conducting structure 114. The first electronic component 103 is located on a side of the first heat-conducting structure 112 that is away from the first shell 113. The second electronic component 104 is located on a side of the second heat-conducting structure 114 that is away from the first shell 113. The first electronic component 103 and the second electronic component 104 are respectively located on two opposite sides of the first shell 113. The first heat-conducting structure 112 is located between the first electronic component 103 and the first shell 113. The first shell 113 is located between the first heat-conducting structure 112 and the second heat-conducting structure 114; the second heat-conducting structure 114 is located between the second electronic component 104 and the first shell 113. The orthographic projection area of ​​the first heat-conducting structure 112 in the first plane is greater than or equal to the orthographic projection area of ​​the second heat-conducting structure 114 in the first plane, the orthographic projection area of ​​the second heat-conducting structure 114 in the first plane is greater than or equal to the orthographic projection area of ​​the second electronic component 104 in the first plane, and the first plane is perpendicular to the thickness direction of the electronic device; the first plane is not the only plane, and it can be any plane perpendicular to the thickness direction of the electronic device.

[0087] In the heat dissipation structure 111 in at least one embodiment of the present application, after the first heat-conducting structure 112 and the second heat-conducting structure 114 are respectively provided on both sides of the first shell portion 113, the heat generated by the second electronic component 104 is firstly dispersed by heat conduction through the second heat-conducting structure 114, thereby increasing the heat transfer area and making the heat evenly dispersed. After the heat is then conducted to the first shell portion 113 and the first heat-conducting structure 112, the temperature has been significantly reduced, so that the heat generated by the second electronic component 104 has little effect on the first heat-conducting structure 112. Similarly, the heat generated by the first electronic component 103 has little effect on the second electronic component 104. In particular, when the first electronic component 103 is a display screen 101 and the second sub-electronic component is a chip, the heat dissipation structure 111 can be provided to alleviate the phenomenon of overheating of a local area of ​​the display screen 101 to a certain extent, thereby providing users with a better user experience.

[0088] In some embodiments, the first shell 113 is a partial structure of the middle frame 102, that is, the first shell 113 is a part of the middle frame 102, and a first heat-conducting structure 112 is arranged between the display screen 101 and the first shell 113, and the first heat-conducting structure 112 is a heat-spreading plate; or, the material of the first heat-conducting structure 112 is graphite, and the use of a heat-spreading plate or graphite can achieve better heat dissipation of the display screen 101, and the heat transferred by the second electronic component 104 can be transferred to a lower temperature area on the electronic device, for example, the area where the battery 107 is located. The middle frame 102 and the back cover of the electronic device ( Figure 3 A battery cavity 105 and a circuit board cavity 106 are formed between the second electronic component 104 and the second heat-conducting structure 114 (not shown); the battery cavity 105 is used to install a battery 107, and the circuit board 108 of the electronic device is installed in the circuit board cavity 106. Different types of electronic components are integrated on the circuit board 108, wherein the second electronic component 104 on the circuit board 108 can be a SOC (System on Chip), and the circuit board 108 can be a mainboard of the electronic device. The second electronic component 104 and the second heat-conducting structure 114 are heat-conducted by a heat-conducting material (not shown), and the heat-conducting material can be silicone grease.

[0089] In some embodiments, the electronic device further includes a shielding frame 109, which isolates interferences such as power supply noise, signal interference, and electromagnetic radiation from the inside and outside, and maintains the stability and reliability of the circuit in the second electronic component 104. The shielding frame 109 and the second heat-conducting structure 114 can be detachably fixedly connected, or other methods can be used to achieve a fixed connection between the two, or the shielding frame 109 and the second heat-conducting structure 114 can form an integral structure. The shielding frame 109 is fixedly connected to the circuit board 108, and the fixed connection method can be bonding, welding, or screw connection. The shielding frame 109 is located on the side of the circuit board 108 facing the display screen 101. After the shielding frame 109 and the second heat-conducting structure 114 are combined, heat conduction to the second electronic component 104 can be achieved. The shielding frame 109 is formed with a receiving cavity 110, and the receiving cavity 110 is used to receive the second electronic component 104. Since the shielding frame 109 is connected to the circuit board 108, the second electronic component 104 can form a relatively sealed space; the second electronic component 104 and the second heat-conducting structure 114 are connected by a heat-conducting material ( Figure 3 The shielding frame 109 may be made of metal, such as stainless steel and nickel silver; of course, the shielding frame 109 may also be made of other metal materials or non-metal materials.

[0090] See also Figure 4 As shown, Figure 4is another simplified diagram of a partial structure inside the electronic device in an embodiment of the present application, Figure 4 and Figure 3 The difference is, Figure 4 A first through hole 115 is provided on the first shell portion 113. At least part of the orthographic projection of the second electronic component 104 in the first plane is located within the orthographic projection of the first through hole 115 in the first plane; after the heat generated by the second electronic component 104 is conducted to the second heat-conducting structure 114, since the orthographic projection of the first shell portion 113 overlaps with the orthographic projection of the first through hole 115, in the thickness direction of the electronic device, the part of the first electronic component 103 corresponding to the second electronic component 104 is separated by the first through hole 115, so that the heat will not be directly conducted to the part of the second electronic component 104 in the thickness direction of the electronic device, thereby avoiding overheating of the part, improving the heat-balance effect, and further helping to ensure the user experience.

[0091] In one embodiment, the orthographic projections of the second electronic component 104 in the first plane are all located within the orthographic projections of the first through hole 115 in the first plane, and the orthographic projection area of ​​the second electronic component 104 in the first plane is less than or equal to the orthographic projection area of ​​the first through hole 115 in the first plane. In this way, within the three-dimensional space range where the orthographic projections of the second electronic component 104 in the first plane are stretched along the thickness direction of the electronic device, the heat generated by the second electronic component 104 will not be vertically transmitted to the display screen 101 along the thickness direction of the electronic device, thereby reducing the overheating phenomenon of the display screen 101 area facing the second electronic component 104 in the thickness direction of the electronic device. After the heat generated by the second electronic component 104 is transferred to the second heat-conducting structure 114, the second heat-conducting structure 114 transfers the heat to the first shell 113. The area corresponding to the second electronic component 104 on the first shell 113 is the first through hole 115. Therefore, the heat is transferred here much slower than other areas of the first shell 113, which increases the resistance to heat transfer. After the heat is transferred on the first shell 113, it is transferred to the first heat-conducting structure 112, and then transferred from the first heat-conducting structure 112 to the low-temperature area on the electronic device, which is beneficial to reduce the occurrence of local overheating of the display screen 101. In addition, the portion of the first heat-conducting structure 112 is sandwiched between the first through hole 115 and the first electronic component 103, that is, the area on the first heat-conducting structure 112 corresponding to the first through hole 115 is still a solid part, so the heat generated by the first electronic component 103 can be transferred to the low-temperature area of ​​the electronic device, so that the heat generated by the second electronic component 104 will not be directly vertically conducted to the first electronic component 103 to affect the first electronic component 103, and the overall heat dissipation of the first electronic component 103 is also guaranteed. The shape of the first through hole 115 can be circular, elliptical or polygonal, and the polygon can be a quadrilateral or pentagon, etc. The shape of the first through hole 115 can also be similar to the outline of the orthographic projection of the second electronic component 104 in the first plane.

[0092] It should be noted that, in some other embodiments, the orthographic projection of the second electronic component 104 in the first plane and the orthographic projection of the first through hole 115 in the first plane may also be in an intersecting form, that is, have overlapping parts. In some other possible implementations, the first through hole 115 may be filled with a heat insulating material, such as aerogel, which may be a silica aerogel, so that the occurrence of local overheating of the display screen 101 can be further reduced.

[0093] See also Figure 3 and Figure 4As shown, in some embodiments, the orthographic projection of the second electronic component 104 in the first plane is located within the orthographic projection of the second heat-conducting structure 114 in the first plane, so that the heat generated by the second electronic component 104 can be better conducted through the second heat-conducting structure 114, avoiding the heat generated by the second electronic component 104 from being directly transferred to the first shell 113.

[0094] Combination Figure 5 and Figure 6 As shown, Figure 5 1 is a schematic diagram of the structure when the second heat conducting structure 114 and the shielding frame 109 are installed together in the embodiment of the present application. Figure 6 yes Figure 5 The heat dissipation structure 111 and the shielding frame 109 form a shielding heat dissipation assembly. In some embodiments, the second heat conducting structure 114 includes a first cover plate 116 and a second cover plate 117. Figure 7 , Figure 8 and Fig. 9 As shown, Figure 7 yes Figure 5 A top view of Figure 8 is along Figure 7 Sectional view of the GG line, Fig. 9 yes Figure 8 The enlarged partial schematic diagram of the H in the figure; the first cover plate 116 and the second cover plate 117 are sealed and connected to form a sealed cavity 134, and the sealed cavity 134 is formed into a vacuum cavity by evacuating the vacuum; the sealed cavity 134 is provided with a capillary structure 118 and a cooling medium (not shown); the first cover plate 116 is provided with a support structure 121 extending in the direction of the second cover plate 117 on the side facing the sealed cavity 134, or / and, the second cover plate 117 is provided with a support structure 121 extending in the direction of the first cover plate 116 on the side facing the sealed cavity 134. The support structure 121 can ensure the stability of the overall structure of the sealed cavity 134, and avoid the sealed cavity 134 from being flattened during use; and the capillary structure 118 and the cooling medium can achieve heat dissipation more effectively. The second cover plate 117 is fixedly connected to the shielding frame 109; a capillary structure 118 may be fixed on the first cover plate 116; or / and, a capillary structure 118 may be fixed on the second cover plate 117, and the capillary structure 118 is used to realize the transmission of the cooling medium. After the cooling medium absorbs heat, a phase change may occur, that is, it becomes a gas phase; the gas phase releases heat in the cooling area of ​​the sealed cavity 134, that is, the position with a lower temperature, and becomes a liquid phase, and then the liquid phase working medium is re-transmitted to the high temperature area of ​​the sealed cavity 134, that is, the heated area, through the capillary structure 118, thereby realizing the phase change cycle of the gas-liquid phase in the cold and hot areas of the heat dissipation structure 111, so that the heat dissipation structure 111 realizes efficient heat exchange by means of phase change latent heat, heat conduction, convection, etc.

[0095] In some embodiments, the cooling medium is water, methanol or acetone; the capillary structure 118 is a capillary mesh; this can achieve better heat dissipation. The material of the structure of the first cover plate 116 and the second cover plate 117 can be metal, and the material of the capillary structure 118 can be metal, and the metal can be 304 stainless steel, copper or aluminum alloy, etc. The thickness of the first cover plate 116 can be 0.05mm-0.1mm, and the thickness of the second cover plate 117 can be 0.1mm-0.15mm. The overall structure formed by combining the second heat-conducting structure 114 and the shielding frame 109 can be reduced by 0.1mm-0.2mm compared with adding a heat spreader on the shielding frame 109 alone, effectively improving the heat dissipation effect.

[0096] structure Fig.10 and Fig.11 As shown, Fig.10 This is a schematic diagram of the structure of the first cover plate 116 in the embodiment of the present application. Fig.11 1 is another perspective structural diagram of the first cover plate 116 in the embodiment of the present application; in some embodiments, the first cover plate 116 includes a connecting portion 119 and a middle portion 120; the connecting portion 119 is arranged around the circumferential edge of the middle portion 120, and the connecting portion 119 is sealed and connected to the second cover plate 117 of the heat dissipation structure 111. In the thickness direction of the electronic device, there is a height difference between the connecting portion 119 and the middle portion 120, so that the first cover plate 116 and the second cover plate 117 are sealed and connected to form a sealed cavity 134. The first cover plate 116 has a first inner surface 122 and a first outer surface 123 opposite to each other; a support structure 121 is provided on the first cover plate 116, and the support structure 121 may be a recessed structure formed on the first outer surface 123 of the first cover plate 116 by a stamping process, and the number of the support structures 121 may be multiple, and the multiple support structures 121 may be arranged in an array; and the cavity wall of the sealed cavity 134 includes a partial area of ​​the first inner surface 122 of the first cover plate 116, and the recessed structure is a protruding structure when viewed from the first inner surface 122 of the first cover plate 116, and the support between the first cover plate 116 and the second cover plate 117 is achieved through the protruding structure, so as to maintain the structural stability of the sealed cavity 134. After the heat dissipation structure 111 is installed on the electronic device, the connecting portion 119 is close to the second electronic component 104, and the middle portion 120 is far away from the second electronic component 104; the support structure 121 may be a spherical crown structure.

[0097] Combination Fig.12 and Fig.13 As shown, Fig.12 This is a schematic diagram of the structure of the second cover plate 117 in the embodiment of the present application. Fig.131 is a schematic diagram of the structure of the second cover plate 117 from another perspective in the embodiment of the present application. The second cover plate 117 has a first protruding structure 124 on the side facing away from the sealed cavity 134; the second cover plate 117 has a second inner surface 125 and a second outer surface 126 opposite to each other; the side of the second cover plate 117 facing the first cover plate 116 is the side of the second cover plate 117 facing the sealed cavity 134, which is the second inner surface 125 of the second cover plate 117, and the cavity wall of the sealed cavity 134 includes a partial area of ​​the second inner surface 125 of the second cover plate 117; the first protruding structure 124 is observed from the second inner surface 125 of the second cover plate 117, and is a pit formed on the second inner surface 125 of the second cover plate 117, and the first protruding structure 124 can be formed by stamping the second cover plate 117. The second cover plate 117 includes a main body 127 and a folded edge 128. The folded edge 128 is located at the edge of the main body 127 and is connected to the shielding frame 109. The folded edge 128 extends to the side of the second cover plate 117 that is away from the sealed cavity 134. The connecting portion 119 of the first cover plate 116 is sealed and connected to the plane area on the second cover plate 117 by welding. The second cover plate 117 is provided with a first opening (not shown) connected to the outside. The first opening can be a liquid injection port or a vacuum port. The cooling medium is injected into the sealed cavity 134 through the first opening, and the sealed cavity 134 is vacuumed through the first opening. Then, the first opening is sealed, so that the sealed cavity 134 is in a vacuum negative pressure state. When the inside of the sealed cavity 134 is vacuumed, the injected cooling medium is in a negative pressure state. Once the cooling medium is heated in the evaporation zone, gasification will occur.

[0098] After the heat dissipation structure 111 is installed in the electronic device, the first protruding structure 124 protrudes in the direction where the second electronic component 104 is located, and the side of the second cover plate 117 facing away from the sealing cavity 134 faces the second electronic component 104; the orthographic projection of the first protruding structure 124 in the first plane and the orthographic projection of the second electronic component 104 in the first plane have overlapping parts, and the first protruding structure 124 can reduce the distance between the second heat-conducting structure 114 and the second electronic component 104, so that the heat can be quickly transferred to the second heat-conducting structure 114, thereby facilitating the functional stability of the second electronic component 104. The second outer surface 126 of the second cover plate 117 is used to contact the second electronic component 104 of the electronic device through a heat-conducting material, and the heat-conducting material can be silicone grease. In addition, the first protruding structure 124 can also reduce the thickness of the heat-conducting material used, thereby further realizing rapid heat conduction between the second electronic component 104 and the second cover plate 117. In one embodiment, the orthographic projections of the second electronic component 104 in the first plane are all located within the orthographic projections of the first protruding structure 124 in the first plane, and the orthographic projection area of ​​the second electronic component 104 in the first plane is not greater than the orthographic projection area of ​​the first protruding structure 124 in the first plane. The surface of the second cover plate 117 facing the first cover plate 116 includes a connection area 129 and a cavity wall area 130, and the surface of the second cover plate 117 facing the first cover plate 116 is the second inner surface 125; the connection area 129 is welded to the connection portion 119 of the first cover plate 116; the cavity wall area 130 includes a main area 131 and a recessed area 132, and the cavity wall area 130 is the cavity wall of the sealed cavity 134; the recessed area 132 is formed by the first protruding structure 124, and the recessed area 132 is also a pit formed on the second inner surface 125 of the second cover plate 117. The boundary line between the connection area 129 and the cavity wall area 130 is as shown in FIG. Fig.12 As shown by the dotted line I in FIG.

[0099] It should be noted that in some other possible implementations, from the boundary line between the connection area 129 and the main area 131 to the boundary line between the main area 131 and the recessed area 132, the main area 131 is inclined toward the recessed area 132, that is, the main area 131 is inclined relative to the first plane, so that the main area 131 is in a funnel-shaped structure, so that the liquid cooling medium can quickly flow back to the recessed area 132 under the action of gravity, thereby facilitating the improvement of the cooling performance of the second electronic component 104. Since the recessed area 132 corresponds to the first protruding structure 124, and the first protruding structure 124 is in contact with the second electronic component 104, after the heat generated by the second electronic component 104 is transferred to the first protruding structure 124, the liquid cooling medium in the recessed area 132 can be quickly vaporized to achieve cooling of the second electronic component 104.

[0100] See also Fig.14 As shown, Fig.141 is a schematic diagram of the structure of the shielding frame 109 in the embodiment of the present application; the shielding frame 109 is provided with a second through hole 133. The orthographic projection of the second electronic component 104 in the first plane overlaps with the orthographic projection of the second through hole 133 in the first plane, and the first protruding structure 124 on the second cover plate 117 extends into the accommodating cavity 110 through the second through hole 133. By setting the combination of the shielding frame 109 and the second heat-conducting structure 114, it is possible to achieve heat conduction of the second electronic component 104, and to isolate interferences such as power supply noise, signal interference and electromagnetic radiation from the inside and outside, so as to maintain the stability and reliability of the circuit in the second electronic component 104. The shielding frame 109 includes a frame portion 135, and the frame portion 135 is connected to the folded edge portion 128 of the second cover plate 117, so that the folded edge portion 128 is connected to the frame portion 135, so as to achieve a reliable connection between the second heat-conducting structure 114 and the shielding frame portion. The shielding frame 109 further includes a panel portion 136, a frame portion 135 surrounding the edge of the panel portion 136, and a second through hole 133 being provided on the panel portion 136. The panel portion 136 can be used to provide a certain support to the second heat-conducting structure 114, and on the other hand, some heat can also be conducted to the panel portion 136, thereby improving the heat dissipation performance of the second electronic component 104. The number of the second through holes 133 can be multiple, such as two, three or four, etc., which can be determined specifically according to the number of the second electronic components 104 on the main circuit board 108 that need to dissipate heat.

[0101] It should be noted that in some other possible implementations, the shielding frame 109 may also include only the frame portion 135 without the panel portion 136, and the frame portion 135 is fixedly connected to the circuit board 108 by screws, so that after the shielding frame 109 is combined with the second heat-conducting structure 114, it can have a heat-equalizing effect and a shielding effect, and because it only has the frame portion 135, the height of the frame portion 135 can be reduced, thereby reducing the total height of the shielding frame 109 after being combined with the second heat-conducting structure 114, and the height is parallel to the thickness direction of the electronic device. The height direction of the frame portion 135 is parallel to the thickness direction of the electronic device; the frame portion 135 can be a closed figure surrounded by a sheet structure.

[0102] See also Fig.15 As shown, Fig.15 This is a structural schematic diagram of the second heat-conducting structure 114 , the shielding frame 109 and the circuit board 108 installed together in an embodiment of the present application. The shielding frame 109 is fixedly connected to the circuit board 108 , and the second cover plate 117 of the heat dissipation structure 111 is fixedly connected to the shielding frame 109 .

[0103] Combination Fig.16 , Fig.17 and Fig.18 As shown, Fig.16for Fig.15 A top view of Fig.17 For along Fig.16 Sectional view along line AA; Fig.18 for Fig.17 Schematic diagram of the local structure at point C in the middle; the first cover plate 116 is located above the second cover plate 117, the capillary structure 118 is located in the sealed cavity 134, the capillary structure 118 is in contact with the second cover plate 117, the lowest point of the support structure 121 is in contact with the capillary structure 118, the first protruding structure 124 extends into the second through hole 133, and protrudes in the direction of the second electronic component 104, and the first protruding structure 124 is connected to the surface of the second electronic component 104 through a thermally conductive material to achieve heat conduction.

[0104] See also Fig.19 As shown, Fig.19 for Fig.17 In the locally enlarged schematic diagram at point D, the folded edge portion 128 of the second cover plate 117 has an interference fit with the border portion 135 of the shielding frame 109. Since the folded edge portion 128 of the second cover plate 117 is distributed circumferentially along the main body portion 127 of the second cover plate 117, the folded edge portion 128 can achieve an interference fit with the border portion 135. In some embodiments, the number of the folding parts 128 of the second cover plate 117 is multiple, and the multiple folding parts 128 are distributed along the edge contour of the main body 127; the folding parts 128 of a part of the number on the opposite sides of the main body 127 can include a first sub-part 138 and a second sub-part 139; the first sub-part 138 and the second sub-part 139 are arranged at an angle, and the connection between the first sub-part 138 and the second sub-part 138 forms a second protruding structure 140 protruding toward the accommodating cavity 110; the second protruding structure 140 abuts against the frame part 135, so that the second cover plate 117 and the shielding frame 109 are interference fit; the angle α formed between the first sub-part 138 and the second sub-part 139 can be an obtuse angle or a right angle. This is convenient for assembly on the one hand, and it is convenient to achieve reliable connection between the second heat-conducting structure 114 and the shielding frame part on the other hand. The first sub-part 138 is connected to the main body 127; the second sub-part 139 is connected to the first sub-part 138.

[0105] Combination Fig. 20 and Fig.21 As shown, Fig. 20 For along Fig.16 The cross-sectional view of the BB line. Fig.21 for Fig. 20Schematic diagram of the local structure at E in the middle; a portion of the folded edge portion 128 has a third protruding structure 141 protruding toward the accommodating cavity 110, and the frame portion 135 has a first groove structure 142, and at least part of the third protruding structure 141 extends into the first groove structure 142, so that the second cover plate 117 and the shielding frame 109 are snap-fitted and connected; in this way, by adopting the snap-fit ​​connection method, on the one hand, it is easy to assemble, and on the other hand, it is easy to achieve a reliable connection between the second heat-conducting structure 114 and the shielding frame. The third protruding structure 141 can be formed on the folded edge portion 128 by a stamping process, so that it is in the form of a pit when viewed from the outside of the folded edge portion.

[0106] It should be noted that, in some other possible implementations, the frame portion 135 has a fourth protrusion structure protruding away from the accommodating cavity 110, and the folding portion 128 has a second groove structure, and at least part of the fourth protrusion structure extends into the second groove structure, so that the second cover plate 117 is snap-fitted and connected with the shielding frame 109. In the embodiment of the present application, there are mainly three ways of snap-fitting connection between the folding portion 128 and the frame portion 135: the folding portion 128 may have only the third protrusion structure 141, and the frame portion 135 may have only the first groove structure 142; or, the folding portion 128 may have only the second groove structure, and the frame portion 135 may have only the fourth protrusion structure; or, the folding portion 128 has the third protrusion structure 141 and the second groove structure, and the frame portion 135 has the first groove structure 142 and the fourth protrusion structure. The first groove structure 142 can be a through hole or a blind hole; the second groove structure can be a through hole or a blind hole; the third protrusion structure 141 can be a spherical crown structure, and the fourth protrusion structure can be a spherical crown structure, which facilitates the assembly between the frame portion 135 and the folding portion 128. In some other possible implementations, after the second sub-portion 139 and the first sub-portion 138 are arranged at an angle, the third protrusion structure 141 can also be located at the connection between the second sub-portion 139 and the first sub-portion 138, so that an interference fit between the folding portion 128 and the frame portion 135 is achieved, and a snap-on connection can also be achieved, thereby achieving stability in the connection between the second cover plate 117 and the shielding frame 109.

[0107] In the description of the specification of the present application, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: a first electronic component; a second electronic component; a heat dissipation structure, wherein the heat dissipation structure is located between the first electronic component and the second electronic component; Wherein, the heat dissipation structure includes a first heat-conducting structure, a first shell portion and a second heat-conducting structure, the first shell portion is located between the first heat-conducting structure and the second heat-conducting structure, the first electronic component is located on a side of the first heat-conducting structure facing away from the first shell portion, the second electronic component is located on a side of the second heat-conducting structure facing away from the first shell portion, the orthographic projection area of ​​the first heat-conducting structure in the first plane is greater than or equal to the orthographic projection area of ​​the second heat-conducting structure in the first plane, the orthographic projection area of ​​the second heat-conducting structure in the first plane is greater than or equal to the orthographic projection area of ​​the second electronic component in the first plane, and the first plane is perpendicular to the thickness direction of the electronic device.

2. The electronic device according to claim 1, wherein: The first shell portion is provided with a first through hole, and at least a portion of the orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the first through hole in the first plane.

3. The electronic device according to claim 1, wherein: The orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the second heat conducting structure in the first plane.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The second heat-conducting structure comprises a first cover plate and a second cover plate, wherein the first cover plate and the second cover plate are sealed and connected to form a sealed cavity; The sealed cavity is provided with a capillary structure and a cooling medium; A support structure extending in the direction where the second cover plate is located is disposed on a side of the first cover plate facing the sealed cavity, or / and a support structure extending in the direction where the first cover plate is located is disposed on a side of the second cover plate facing the sealed cavity.

5. The electronic device according to claim 4, characterized in that: The side of the second cover plate facing away from the sealed cavity faces the second electronic component; the side of the second cover plate facing away from the sealed cavity has a first protruding structure, and the first protruding structure protrudes in the direction where the second electronic component is located; An orthographic projection of the first protruding structure in the first plane and an orthographic projection of the second electronic component in the first plane have an overlapping portion.

6. The electronic device according to claim 5, characterized in that: The electronic device further comprises a shielding frame, the second cover is fixedly connected to the shielding frame, the shielding frame is formed with a receiving cavity, and the receiving cavity is used to receive the second electronic component; The shielding frame is provided with a second through hole, the orthographic projection of the second electronic component in the first plane overlaps with the orthographic projection of the second through hole in the first plane, and the first protruding structure extends into the accommodating cavity through the second through hole.

7. The electronic device according to claim 6, characterized in that: The shielding frame includes a frame portion; The second cover plate includes a main body portion and a folded edge portion, wherein the folded edge portion is located at an edge of the main body portion; The frame portion is connected to the folded edge portion.

8. The electronic device according to claim 7, characterized in that: The folded edge portion includes a first sub-portion and a second sub-portion; the first sub-portion and the second sub-portion are arranged at an angle to form a second protruding structure protruding toward the accommodating cavity; the second protruding structure abuts against the frame portion to achieve an interference fit between the second cover plate and the shielding frame.

9. The electronic device according to claim 7, characterized in that: The folded edge portion has a third protruding structure protruding toward the accommodating cavity, the frame portion has a first groove structure, and at least a portion of the third protruding structure extends into the first groove structure, so that the second cover plate is engaged with the shielding frame; Or / and, the border portion has a fourth protrusion structure protruding away from the accommodating cavity, the folded edge portion has a second groove structure, and at least part of the fourth protrusion structure extends into the second groove structure, so that the second cover plate is snap-fitted and connected to the shielding frame.

10. The electronic device according to claim 7, characterized in that: The shielding frame further includes a panel portion, the frame portion surrounds an edge of the panel portion, and the second through hole is opened on the panel portion.

11. The electronic device according to claim 4, characterized in that: The first cover plate comprises a connecting portion and a middle portion; the connecting portion is arranged around the circumferential edge of the middle portion, and the connecting portion is sealed and connected to the second cover plate; In the thickness direction of the electronic device, there is a height difference between the connecting portion and the middle portion, so that the sealed cavity is formed after the first cover plate and the second cover plate are sealed and connected.

12. The electronic device according to any one of claims 1 to 3, characterized in that: The first heat-conducting structure is a vapor chamber; Alternatively, the first heat-conducting structure is made of graphite.

13. The electronic device according to any one of claims 1 to 3, characterized in that: The first electronic component is a display screen, and the second electronic component is a chip; The electronic device further includes a middle frame, and the first shell portion is a partial structure of the middle frame.

14. The electronic device according to claim 4, characterized in that: The cooling medium is water, methanol or acetone; the capillary structure is a capillary mesh.

15. A heat dissipation structure, characterized in that: include: a first heat-conducting structure, a first shell, and a second heat-conducting structure; The first shell portion is located between the first heat-conducting structure and the second heat-conducting structure, a side of the first heat-conducting structure facing away from the first shell portion is used to mount a first electronic component of the electronic device, and a side of the second heat-conducting structure facing away from the first shell portion is used to mount a second electronic component of the electronic device; The orthographic projection area of ​​the first heat-conducting structure in the first plane is greater than or equal to the orthographic projection area of ​​the second heat-conducting structure in the first plane, the orthographic projection area of ​​the second heat-conducting structure in the first plane is greater than or equal to the orthographic projection area of ​​the second electronic component in the first plane, and the first plane is perpendicular to the thickness direction of the electronic device.

16. The heat dissipation structure according to claim 15, characterized in that: The first shell portion is provided with a first through hole, and at least a portion of the orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the first through hole in the first plane.

17. The heat dissipation structure according to claim 15, characterized in that: The orthographic projection of the second electronic component in the first plane is located within the orthographic projection of the second heat conducting structure in the first plane.

18. The heat dissipation structure according to any one of claims 15 to 17, characterized in that: The second heat-conducting structure comprises a first cover plate and a second cover plate, wherein the first cover plate and the second cover plate are sealed and connected to form a sealed cavity; The sealed cavity is provided with a capillary structure and a cooling medium; A support structure extending in the direction where the second cover plate is located is disposed on a side of the first cover plate facing the sealed cavity, or / and a support structure extending in the direction where the first cover plate is located is disposed on a side of the second cover plate facing the sealed cavity.

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