Machine room heat dissipation method based on airflow organization optimization

Abstract

The invention discloses a machine room heat dissipation method based on airflow organization optimization, and relates to the technical field of machine room heat dissipation, and the method comprises the steps that S1, an air return pipeline is arranged in a machine room, the side, away from a rack door plate, of an IT equipment rack communicates with one end of the air return pipeline, and the other end of the air return pipeline is connected with an air return opening of a precise air conditioner; s2, an air supply outlet of the precise air conditioner is located below an electrostatic bottom plate of the machine room, and an airflow guide unit is installed in the anti-electrostatic bottom plate; s3, an air inlet is formed in the bottom of each IT equipment rack, and a first fan is mounted at each air inlet; and S4, a second fan is installed on the IT equipment rack door plate, and hot air of the IT equipment rack is blown to the air return pipeline through the second fan. The problems that in an existing machine room, due to the fact that IT equipment is concentrated on a rack, the heat island effect occurs on the rack, the cooling effect of an air conditioner on the IT equipment is poor, and the fault rate of the IT equipment is increased are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation in a computer room, and in particular to a heat dissipation method for a computer room based on airflow organization optimization. Background Art

[0002] In existing computer rooms, in order to facilitate the management of IT equipment, IT equipment is integrated into a whole rack, and the temperature of the entire computer room is controlled by air conditioning to prevent heat accumulation and damage during the operation of IT equipment. However, since IT equipment is concentrated on the rack, a heat island effect will be generated, which makes it difficult for the heat inside the machine to be discharged with the air flow. Therefore, although there is air conditioning in the computer room, the overall cooling effect is still unsatisfactory.

[0003] Therefore, a computer room heat dissipation method based on airflow organization optimization is needed. Summary of the invention

[0004] In view of the above shortcomings, the present invention provides a computer room heat dissipation method based on airflow organization optimization, which can solve the problem that in the existing computer room, due to the concentration of IT equipment on the rack, a heat island effect occurs on the rack, resulting in poor cooling effect of the air conditioner on the IT equipment, thereby increasing the failure rate of the IT equipment. The specific technical solution is as follows:

[0005] A heat dissipation method for a computer room based on airflow organization optimization, comprising:

[0006] S1: A return air duct is opened in the computer room, and the side of the IT equipment rack away from the rack door panel is connected to one end of the return air duct, and the other end of the return air duct is connected to the return air outlet of the precision air conditioner, and the precision air conditioner is used to convert the air heated by the IT equipment into cold air;

[0007] S2: The air outlet of the precision air conditioner is located below the antistatic floor of the computer room, and an air flow guide unit is installed in the antistatic floor to deliver cold air to the IT equipment racks;

[0008] S3: An air inlet is provided at the bottom of each IT equipment rack, and a first fan is installed at the air inlet, and the first fan is used to blow cold air into the IT equipment rack;

[0009] S4: Install a second fan on the door panel of the IT equipment rack, and use the second fan to blow the hot air flow of the IT equipment rack toward the return air duct.

[0010] Preferably, the return air duct is of wind-enclosed type, and the outer side is covered with heat-insulating material.

[0011] Preferably, the airflow guiding unit includes a guide plate and a third fan, the guide plate is fixedly installed on the bottom of the anti-static floor, the side of the guide plate away from the anti-static floor is in contact with the bottom of the computer room, the guide plate, the anti-static floor and the bottom wall of the computer room form a guide channel, the third fan is installed between the guide plates to accelerate the flow of cold air in the guide channel, and the guide channel is connected to the bottom of the IT equipment rack.

[0012] Preferably, the antistatic floor is provided with an air outlet at a door panel close to the IT equipment rack, the air outlet is connected to the guide channel, and a fourth fan is installed in the air outlet to guide the cold air to flow near the second fan.

[0013] Preferably, it also includes a control terminal and a temperature sensor. The temperature sensor is installed in each IT equipment rack. The temperature sensor is electrically connected to the control terminal. The temperature of each IT equipment rack can be seen through the control terminal.

[0014] Preferably, the first fan is installed on the anti-static floor through an electrically controlled rotating mechanism, and the second fan is installed on the door panel of the IT equipment rack through an electrically controlled rotating mechanism. The electrically controlled rotating mechanism is electrically connected to the control terminal, and the temperature of each IT equipment rack is obtained according to the control terminal to adjust the angles of the first fan and the second fan.

[0015] Preferably, the air outlet, the first fan, the second fan, the third fan and the fourth fan are regularly maintained and cleaned.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention guides the hot air flow of the IT equipment rack into the return air duct through the second fan, and then guides the cold air generated by the precision air conditioner into the IT equipment rack through the first fan, thereby cooling the IT equipment in the IT equipment rack, avoiding the heat island effect of the IT equipment rack, and ensuring the stable operation of the IT equipment.

[0018] 2. The present invention guides the cold air coming out of the air supply port to each air inlet through the guide plate and the third fan, efficiently utilizes the cold air, reduces energy consumption and improves the cooling efficiency of the present invention.

[0019] 3. The present invention opens an air outlet on the antistatic floor in front of the IT equipment rack cabinet door, and a fourth fan is installed in the air outlet to guide the cold air in the guide channel to flow to the front of the IT equipment rack. The cold air will be guided into the IT equipment rack by the second fan, further improving the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0021] Figure 1 A method flow chart of the device of the present invention;

[0022] Figure 2 It is a schematic diagram of the overall structure of the present invention.

[0023] 1. Computer room; 2. IT equipment rack; 3. Return air duct; 4. Return air outlet; 6. Precision air conditioning; 7. Air supply outlet; 8. Anti-static floor; 9. Air inlet; 10. Air outlet; 11. First fan; 12. Second fan; 13. Third fan; 14. Fourth fan. DETAILED DESCRIPTION

[0024] The technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, not all of the embodiments. Based on the embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] A heat dissipation method for a computer room 1 based on airflow organization optimization, comprising:

[0026] S1: A return air duct 3 is provided in the computer room 1. The side of the IT equipment rack 2 away from the rack door panel is connected to one end of the return air duct 3. The other end of the return air duct 3 is connected to the return air port 4 of the precision air conditioner 6. The precision air conditioner 6 is used to convert the air heated by the IT equipment into cold air.

[0027] S2: The air outlet 7 of the precision air conditioner 6 is located below the antistatic floor of the computer room 1, and an air flow guide unit is installed in the antistatic floor 8 to deliver cold air to the IT equipment rack 2;

[0028] S3: An air inlet 9 is provided at the bottom of each IT equipment rack 2, and a first fan 11 is installed at the air inlet 9. The first fan 11 is used to blow cold air into the IT equipment rack 2 to cool the IT equipment through heat transfer;

[0029] S4: A second fan 12 is installed on the door panel of the IT equipment rack. The hot air flow of the IT equipment rack 2 is blown toward the return air duct 3 by the second fan 12 to avoid the heat island effect of the IT equipment rack 2, and the hot air inside the rack cannot flow out by itself.

[0030] The return air duct 3 is of an air-enclosed type, and the outer side is covered with a heat-insulating material, such as asbestos, rock wool and polyurethane, to prevent heat from being transferred into the computer room 1 and affecting the overall cooling effect of the computer room 1.

[0031] The airflow guide unit includes a guide plate and a third fan 13. The guide plate is fixedly installed at the bottom of the antistatic floor 8. The side of the guide plate away from the antistatic floor 8 contacts the bottom of the machine room 1. The guide plate, the antistatic floor 8 and the bottom wall of the machine room 1 form a guide channel. The third fan 13 is installed between the guide plates to accelerate the flow of cold air in the guide channel. The guide channel is connected to the bottom of the IT equipment rack 2. The guide channel efficiently guides the flow of cold air to prevent the cold air from freely diffusing under the antistatic floor 8, improve the utilization of cold control, and thus improve the cooling effect on the IT equipment rack 2.

[0032] An air outlet 10 is provided at the door panel of the anti-static floor 8 near the IT equipment rack 2, and the air outlet 10 is connected to the guide channel. A fourth fan 14 is installed in the air outlet 10 to guide the cold air to flow to the vicinity of the second fan 12, so that the second fan 12 can blow the hot air into the return air duct 3 while guiding the cold air into the IT equipment rack 2, thereby further improving the cooling effect on the IT equipment rack 2.

[0033] A temperature sensor is installed in each IT equipment rack 2, and the temperature sensor is electrically connected to the control terminal. The temperature of each IT equipment rack 2 can be seen through the control terminal, so that the IT equipment can be monitored at all times and the speed of each fan can be adjusted to achieve the most balanced state between energy consumption and cooling effect.

[0034] The first fan 11 is installed on the antistatic floor 8 through an electrically controlled rotating mechanism, and the second fan 12 is installed on the door panel of the IT equipment rack 2 through an electrically controlled rotating mechanism. The electrically controlled rotating mechanism is electrically connected to the control terminal. The temperature of each IT equipment rack 2 is obtained according to the control terminal, and the angles of the first fan 11 and the second fan 12 are adjusted to ensure effective air convection.

[0035] Post-application monitoring and maintenance

[0036] (1) Establish a monitoring mechanism: Use the temperature and humidity monitoring system to monitor room 1 in real time, record data and analyze trends.

[0037] (2) Regular maintenance: Clean the cooling device and floor vents 10 regularly to prevent dust accumulation from affecting the cooling effect. Check whether the fan of the cooling device is operating normally and replace the damaged fan in time. Perform regular maintenance on the air conditioning system, including cleaning the filter and checking the refrigerant pressure.

[0038] (3) Continuous optimization: Based on monitoring data and actual results, the heat dissipation solution is continuously adjusted and optimized to ensure that Computer Room 1 is always in the best operating state.

[0039] (4) Training and communication: Provide training on the operation and maintenance of new equipment to the management personnel of Computer Room 1 and establish an effective communication mechanism to ensure that problems can be resolved in a timely manner.

[0040] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A heat dissipation method for a computer room (1) based on airflow organization optimization, characterized in that: include: S1: A return air duct (3) is provided in the computer room (1); the side of the IT equipment rack (2) away from the rack door panel is connected to one end of the return air duct (3); the other end of the return air duct (3) is connected to the return air outlet (4) of the precision air conditioner (6); the precision air conditioner (6) is used to convert the air heated by the IT equipment into cold air; S2: The air outlet (7) of the precision air conditioner (6) is located below the antistatic floor of the machine room (1), and an air flow guide unit is installed in the antistatic floor (8) for conveying cold air to the IT equipment rack (2); S3: An air inlet (9) is provided at the bottom of each IT equipment rack (2), and a first fan (11) is installed at the air inlet (9), wherein the first fan (11) is used to blow cold air into the IT equipment rack (2); S4: Installing a second fan (12) on the door panel of the IT equipment rack (2), and using the second fan (12) to blow the hot air flow of the IT equipment rack (2) toward the return air duct (3).

2. The heat dissipation method for a computer room (1) based on airflow organization optimization according to claim 1, characterized in that: The return air duct (3) is of wind-enclosed type, and the outer side is covered with heat-insulating material.

3. The heat dissipation method for a computer room (1) based on airflow organization optimization according to claim 1, characterized in that: The airflow guiding unit comprises a guide plate and a third fan (13); the guide plate is fixedly mounted on the bottom of the antistatic floor (8); a side of the guide plate away from the antistatic floor (8) contacts the bottom of the machine room (1); the guide plate, the antistatic floor (8) and the bottom wall of the machine room (1) form a guide channel; the third fan (13) is mounted between the guide plates to accelerate the flow of cold air in the guide channel; and the guide channel is connected to the bottom of the IT equipment rack (2).

4. The heat dissipation method for a computer room (1) based on airflow organization optimization according to claim 3, characterized in that: The antistatic floor (8) is provided with an air outlet (10) at a door panel close to the IT equipment rack (2); the air outlet (10) is connected to the guide channel; a fourth fan (14) is installed in the air outlet (10) for guiding cold air to flow near the second fan (12).

5. The heat dissipation method for a computer room (1) based on airflow organization optimization according to claim 1, characterized in that: It also includes a control terminal and a temperature sensor. The temperature sensor is installed in each IT equipment rack (2). The temperature sensor is electrically connected to the control terminal. The temperature of each IT equipment rack (2) can be seen through the control terminal.

6. The heat dissipation method for a computer room (1) based on airflow organization optimization according to claim 5, characterized in that: The first fan (11) is installed on the antistatic floor (8) through an electrically controlled rotating mechanism, and the second fan (12) is installed on the door panel of the IT equipment rack (2) through an electrically controlled rotating mechanism. The electrically controlled rotating mechanism is electrically connected to a control terminal, and the temperature of each IT equipment rack (2) is obtained by the control terminal to adjust the angles of the first fan (11) and the second fan (12).

7. The heat dissipation method for a computer room (1) based on airflow organization optimization according to claim 4, characterized in that: The air outlet (10), the first fan (11), the second fan (12), the third fan (13) and the fourth fan (14) are regularly maintained and cleaned.

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