Lithography annealing and wafer detection environment integrated air conditioner purification equipment

Abstract

The invention provides photoetching annealing and wafer detection environment integrated air conditioner purification equipment, and relates to the technical field of purification equipment, the photoetching annealing and wafer detection environment integrated air conditioner purification equipment comprises a purification machine body and a backflow cover, and the inner side of the purification machine body is provided with two positioning plates; a guide groove is formed in the inner side of the positioning plate; fixed support plates are mounted on the top and the inner side of the purifier body; a positioning cylinder is mounted on the fixed support plate; the side end of the backflow cover is of a conical structure, a backflow assembly is installed on the inner side of the backflow cover, and a backflow pipe is installed at the bottom of the backflow cover. The rotating part is used for driving a catalyst in the purifying part to turn over and move, harmful substances in air are fully reacted, it is guaranteed that the air further makes contact with the catalyst for reaction, the air purifying effect is guaranteed, and the problem that the position of the catalyst is fixed when the catalyst is used for treating the harmful substances in the air is solved. Due to limitation of an air flowing path, the reaction treatment effect is relatively poor.

Description

Technical Field

[0001] The present invention relates to the technical field of purification equipment, and in particular to an integrated air-conditioning purification equipment for photolithography annealing and wafer detection environment. Background Art

[0002] Photolithography annealing and wafer inspection are two important links in the semiconductor manufacturing process. They have strict requirements on the environment. The photolithography return process needs to be carried out in a very clean environment to avoid dust, particles and other pollutants from damaging the wafer. Wafer inspection also needs to be carried out in a clean environment to avoid the influence of pollutants on the inspection results. Therefore, integrated air-conditioning purification equipment is required during photolithography annealing and wafer inspection to ensure the cleanliness of the air, so that the semiconductor processing is in a dust-free environment and the quality of semiconductor processing is improved. In the prior art, when the integrated air-conditioning purification equipment purifies the air and injects it into the semiconductor photolithography annealing and wafer inspection environment, a catalyst is usually used to treat harmful substances in the air. However, the position of the catalyst is relatively fixed, and the limitations of the air flow path result in poor reaction and treatment effects of some catalysts on harmful substances in the air, resulting in some harmful substances remaining in the air, which will affect the processing quality of the semiconductor. Summary of the invention

[0003] The disclosed embodiments relate to an integrated air conditioning and purification device for a photolithography annealing and wafer inspection environment, so as to solve the problem in the prior art that when the integrated air conditioning and purification device purifies the air and then injects it into the semiconductor photolithography annealing and wafer inspection environment, a catalyst is usually used to treat harmful substances in the air. However, the position of the catalyst is relatively fixed, and the limitations of the air flow path result in that some catalysts have poor reaction effects on harmful substances in the air, resulting in some harmful substances remaining in the air, which affects the quality of semiconductor processing.

[0004] According to a first aspect of the present disclosure, there is provided an integrated air-conditioning purification device for photolithography annealing and wafer inspection environment, specifically comprising: a purification body and a reflow hood, wherein the purification body is a rectangular structure, and a replacement window is provided on the side of the purification body, wherein a cover plate is installed inside the replacement window, and two positioning plates are installed on the inner side of the purification body; a guide groove is provided on the inner side of the positioning plate; a fixed support plate is installed on the top and inner side of the purification body; a positioning cylinder is installed on the fixed support plate; a servo motor is installed at one end of the positioning cylinder, a plurality of evenly arranged slots are provided at the edge position of the other end of the positioning cylinder, and a rotating member is rotatably installed on the inner side of the positioning cylinder; one end of the rotating member is connected to the output end of the servo motor at one end of the positioning cylinder, and an opening is provided at the edge position of one end of the rotating member, a slot is provided at the edge position of the other end of the rotating member, and the slot at the edge position of the other end of the rotating member is connected to the slot at the edge position of the other end of the positioning cylinder; the side end of the reflow hood is a conical structure, a countercurrent component is installed on the inner side of the reflow hood, and a reflow pipe is installed at the bottom of the reflow hood.

[0005] Furthermore, an outer protective cover and an inner protective cover are installed between the two positioning plates; the inner protective cover is located on the inner side of the outer protective cover, wherein one side of the inner protective cover is provided with a slot, and both sides of the outer protective cover are provided with slots, the slot on one side of the outer protective cover is located on the inner side of the replacement window, and a flexible fixed bracket is slidably installed between the inner protective cover and the outer protective cover.

[0006] Furthermore, guide blocks are provided at the top and bottom of the flexible fixed bracket, and the guide blocks are slidably installed inside the guide groove, and a multi-layer filter net is installed on the inner side of the flexible fixed bracket through a snap buckle, wherein the interior of the multi-layer filter net includes filter cotton, activated carbon, electrostatic cotton and HEPA filter net.

[0007] Furthermore, a guide cover is installed on the outer side of the positioning plate; the inner end of the guide cover is a conical structure, and a guide pipe is installed on the outer end of the guide cover; the guide pipe passes through the outside of the purification body and a guide pipe is installed; the side end of the guide pipe is connected to the input end of the fan; an external unit is installed at the bottom of the fan; the interior of the external unit includes a compressor, a condenser and an exhaust fan.

[0008] Furthermore, a purification member is installed on the side of the rotating member; the purification member is a hollow arc-shaped structure, and micropores are provided on the side of the purification member, and the inner side of the purification member is connected to the openings and grooves at both ends of the rotating member; a spoiler is installed on the inner side of the rotating member, wherein the spoiler is located between multiple purification members.

[0009] Furthermore, a positioning cover is installed on the outer side of the other end of the positioning cylinder; a collecting box is slidably installed on the bottom of the positioning cover; a discharging guide is also installed on the outer side of the other end of the positioning cylinder; the outer side of the discharging guide is an inclined structure, and the discharging guide is located inside the positioning cover, and a plurality of grooves are formed on the discharging guide, which are connected to the grooves at the edge of the other end of the positioning cylinder, and a driving rod is installed on the outer side of the positioning cover for rotation during stretching.

[0010] Furthermore, a sealing plate is installed at the inner end of the driving rod; the inner side of the sealing plate is installed on the outer side of the discharge guide; a feed pipe is installed at the edge position of one end of the positioning cylinder; the inner side of the feed pipe is connected with the opening at one end of the rotating member, and a feed cover is installed at the outer end of the feed pipe; a sealing cover is installed on the top of the feed cover; an air pump is installed on one side of the fixed support plate, and an air intake pipe is installed on the output end of the air pump.

[0011] Furthermore, the bottom of the air inlet pipe is connected to the feed pipe; a connecting cover and an air outlet cover are respectively installed on the outside of the positioning cylinder; the side end of the connecting cover is connected to the outer protective cover, and the side end of the connecting cover is connected to the outer side of the groove on the other side of the outer protective cover.

[0012] Furthermore, a heating wire module and an evaporator are respectively installed on the inner side of the air outlet hood; a copper tube 1 is installed at the bottom of the evaporator, and a copper tube 2 is installed at the side end of the evaporator; the copper tube 1 penetrates the bottom of the purification body and is connected to the condenser inside the external unit; the copper tube 2 penetrates the bottom of the purification body and is connected to the compressor inside the external unit.

[0013] Furthermore, the side end of the return pipe is connected to the exhaust fan input end inside the external unit, and a bypass pipe is connected to the outside of the return pipe; a protective pipe one is installed on the outside of the flow guide main pipe; a protective pipe two is installed on the outside of the flow guide pipe; the side end of the protective pipe one is connected to the protective pipe two, the side end of the protective pipe one is provided with an opening, and the bottom of the protective pipe one is connected to the side end of the bypass pipe.

[0014] The present invention provides an integrated air conditioning purification device for photolithography annealing and wafer inspection environment, which has the following beneficial effects: When the present invention is in use, the catalyst in the purification component is driven to flip and move by using a rotating part, so as to fully react and treat harmful substances in the air. When purifying the air injected into the photolithography annealing and wafer detection environment, the catalyst is stored inside the purification component. Since the purification component is in an arc-shaped structure, the distribution area of ​​the catalyst is large. When the air enters the purification component, the rotating part drives the purification component to rotate to flip the catalyst inside, so that the catalyst fully contacts the harmful substances in the air and thoroughly treats the harmful substances to ensure the cleanliness of the air. The rotating part rotates continuously and changes the direction of air flow to ensure that the air further contacts and reacts with the catalyst, thereby ensuring the air purification effect and the processing quality of the semiconductor.

[0015] In addition, by using protective tube 1 and protective tube 2 to guide the return air and reduce the temperature difference when the air enters, when purifying the air injected into the photolithography annealing and wafer inspection environment, protective tube 1 and protective tube 2 are located on the outside of the air intake guide pipe and the air intake pipe. The return air carries a certain temperature and flows through the return pipe and the diversion pipe to the inside of protective tube 1 and protective tube 2. The air temperature in protective tube 1 and protective tube 2 is pre-cooled or preheated with the air in the guide pipe and the guide pipe, thereby reducing the temperature difference of the air flow, reducing the power consumption of temperature treatment of the air, and reducing the consumption of electric power resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0017] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0018] In the attached picture: Figure 1 A schematic diagram showing the overall structure of the present application; Figure 2 The schematic diagram of the cross-sectional structure of the purification body of the present application is shown; Figure 3 A schematic diagram of the cross-sectional structure of the positioning plate of the present application is shown; Figure 4 A schematic diagram of the three-dimensional structure of the inner protective cover of the present application is shown; Figure 5 A schematic diagram of the three-dimensional structure of the positioning cover of the present application is shown; Figure 6 A schematic diagram of the cross-sectional structure of the positioning tube of the present application is shown; Figure 7 A schematic diagram of the exploded structure of the rotating member, the purification member and the spoiler of the present application is shown; Figure 8A schematic diagram of the three-dimensional structure of the return hood of the present application is shown; Fig. 9 A schematic cross-sectional structure diagram of a protection tube of the present application is shown; Reference numerals list 1. Purification machine body; 101. Replacement window; 102. Positioning plate; 103. Guide groove; 104. Outer protective cover; 105. Inner protective cover; 106. Flexible fixing bracket; 107. Multi-layer filter screen; 108. Flow guide cover; 109. Flow guide pipe; 1010. Flow guide main pipe; 1011. Fan; 1012. External unit; 2. Fixed support plate; 201. Positioning cylinder; 202. Rotating member; 203. Purifying member; 204. Spoiler; 205. Positioning cover; 206. Collecting box; 207. Discharging guide; 208. Driving rod; 209. Sealing plate; 2010. Feed pipe; 2011. Feed cover; 2012. Inlet pipe; 2013. Connecting cover; 2014. Outlet cover; 2015. Heating wire module; 2016. Evaporator; 2017. Copper tube 1; 2018. Copper tube 2; 3. Backflow cover; 301. Backflow pipe; 302. Diversion pipe; 303. Protection pipe 1; 304. Protection pipe 2. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Please refer to Figures 1 to 9 : Embodiment 1: The present invention proposes an integrated air conditioning purification device for photolithography annealing and wafer detection environment, comprising: a purification body 1 and a reflux hood 3, the purification body 1 is a rectangular structure, and a replacement window 101 is provided on the side of the purification body 1, wherein a cover plate is installed inside the replacement window 101, and two positioning plates 102 are installed on the inner side of the purification body 1; a guide groove 103 is provided on the inner side of the positioning plate 102; an outer protective cover 104 and an inner protective cover 105 are installed between the two positioning plates 102; the inner protective cover 105 is located on the inner side of the outer protective cover 104, wherein a groove is provided on one side of the inner protective cover 105, and grooves are provided on both sides of the outer protective cover 104, and the groove on one side of the outer protective cover 104 is located on the inner side of the replacement window 101, and a flexible sliding member is installed between the inner protective cover 105 and the outer protective cover 104. A fixed bracket 106; guide blocks are provided at the top and bottom of the flexible fixed bracket 106, and the guide blocks are slidably installed inside the guide groove 103, and a multi-layer filter screen 107 is installed on the inner side of the flexible fixed bracket 106 through a buckle, wherein the interior of the multi-layer filter screen 107 includes filter cotton, activated carbon, electrostatic cotton and HEPA filter screen; a guide cover 108 is installed on the outer side of the positioning plate 102; the inner end of the guide cover 108 is a conical structure, and a guide pipe 109 is installed on the outer end of the guide cover 108; the guide pipe 109 passes through the outside of the purification body 1 and is installed with a guide main pipe 1010; the side end of the guide main pipe 1010 is connected to the input end of the fan 1011; an external unit 1012 is installed at the bottom of the fan 1011; the interior of the external unit 1012 includes a compressor, a condenser and an exhaust fan.

[0021] In the embodiment of the present disclosure, when purifying the air injected into the photolithography annealing and wafer inspection environment, the fan 1011 absorbs the outside air into the interior of the main air guide 1010, and the airflow is divided along the two air guide pipes 109 to the interior of the upper and lower air guide covers 108. The airflow ejected from the air guide cover 108 enters the two positioning plates 102 and the inner side of the inner protective cover 105. The airflow is filtered by the multi-layer filter 107 at the slot on one side of the inner protective cover 105 and flows outward to ensure the cleanliness of the air flow. The outer protective cover 104 and the inner protective cover 105 prevent the unused multi-layer filter 107 from being filtered. When the multi-layer filter 107 is contaminated and the filtering effect of the multi-layer filter 107 is reduced, the cover plate at the replacement window 101 on the side of the purification body 1 is opened, and the flexible fixed bracket 106 moves along the guide groove 103. The flexible fixed bracket 106 carries the filtered multi-layer filter 107 to the replacement window 101, and the unused multi-layer filter 107 moves to the slot on one side of the inner protective cover 105. The used multi-layer filter 107 can be replaced, so that the air-conditioning purification equipment does not need to stop working during the replacement process to complete the replacement, thereby ensuring the progress of semiconductor lithography returns and wafer inspections.

[0022] Embodiment 2, on the basis of embodiment 1, a fixed support plate 2 is installed on the top and inner side of the purification body 1; a positioning cylinder 201 is installed on the fixed support plate 2; a servo motor is installed at one end of the positioning cylinder 201, and a plurality of evenly arranged slots are provided at the edge position of the other end of the positioning cylinder 201, and a rotating member 202 is rotatably installed on the inner side of the positioning cylinder 201; one end of the rotating member 202 is connected to the output end of the servo motor at one end of the positioning cylinder 201, and an opening is provided at the edge position of one end of the rotating member 202, and a slot is provided at the edge position of the other end of the rotating member 202, and the slot at the edge position of the other end of the rotating member 202 is connected to the slot at the edge position of the other end of the positioning cylinder 201 ; A purifying member 203 is installed on the side of the rotating member 202; the purifying member 203 is a hollow arc-shaped structure, and micropores are provided on the side of the purifying member 203, and the inner side of the purifying member 203 is connected with the openings and slots at both ends of the rotating member 202; a spoiler 204 is installed on the inner side of the rotating member 202, wherein the spoiler 204 is located between multiple purifying members 203; a positioning cover 205 is installed on the outer side of the other end of the positioning cylinder 201; a collecting box 206 is slidably installed on the bottom of the positioning cover 205; a discharge guide 207 is also installed on the outer side of the other end of the positioning cylinder 201; the outer side of the discharge guide 207 is an inclined structure, and the discharge guide 207 is located between the positioning cover 2 05, a plurality of slots are provided on the discharge guide 207, which are connected with the slots at the edge of the other end of the positioning cylinder 201; a driving rod 208 is installed on the outer side of the positioning cover 205 during stretching; a sealing plate 209 is installed on the inner end of the driving rod 208; the inner side of the sealing plate 209 is installed on the outer side of the discharge guide 207; a feed pipe 2010 is installed at the edge of one end of the positioning cylinder 201; the inner side of the feed pipe 2010 is connected with the opening at one end of the rotating member 202, and a feed cover 2011 is installed on the outer end of the feed pipe 2010; a sealing cover is installed on the top of the feed cover 2011; an air pump is installed on one side of the fixed support plate 2, and the output end of the air pump An air inlet pipe 2012 is installed on the top; the bottom of the air inlet pipe 2012 is connected to the feed pipe 2010; the outer side of the positioning cylinder 201 is respectively installed with a connecting cover 2013 and an air outlet cover 2014; the side end of the connecting cover 2013 is connected to the outer protective cover 104, and the side end of the connecting cover 2013 is connected to the outer side of the slot on the other side of the outer protective cover 104; the inner side of the air outlet cover 2014 is respectively installed with a heating wire module 2015 and an evaporator 2016; a copper tube 1 2017 is installed at the bottom of the evaporator 2016, and a copper tube 2 2018 is installed at the side end of the evaporator 2016; the copper tube 1 2017 passes through the bottom of the purification body 1 and is connected to the condenser inside the external machine 1012;The copper tube 2018 passes through the bottom of the purification body 1 and is connected to the compressor inside the external machine 1012. When purifying the air injected into the photolithography annealing and wafer inspection environment, the airflow filtered by the multi-layer filter 107 enters the interior of the positioning cylinder 201 through the connecting cover 2013. The servo motor at one end of the positioning cylinder 201 drives the rotating member 202 inside the positioning cylinder 201. The rotating member 202 drives the purification member 203 and the spoiler 204 to rotate synchronously. The airflow enters the interior through the micropores on the side of the purification member 203, and the purification member 203 rotates to disperse the catalyst stored inside, so that the catalyst and the air are mixed. The harmful substances contained in the air are reacted and processed, and the purified air flows outward through the air outlet hood 2014. When the rotating member 202 rotates, the catalyst in the purification member 203 is dispersed and fully reacted with the harmful substances to improve the processing efficiency. The spoiler 204 blocks the airflow, so that the airflow fully reacts with the catalyst to eliminate the harmful substances. The purified air passes through the air outlet hood 2014, and the refrigerant generated by the condenser in the external unit 1012 flows to the evaporator 2016 through the copper tube 1 2017 to cool the airflow. After the evaporator 2016 exchanges heat, the refrigerant passes through the copper tube 2017. 18 enters the compressor in the external unit 1012 for refrigeration treatment, or the airflow is heated by the heating wire module 2015, and the clean air flows to the environment where the semiconductor lithography annealing and wafer detection equipment are located to ensure the processing quality of the semiconductor. As the catalyst in the purification member 203 reaches the end of its service life, the replacement frequency of the catalyst is low, but it needs to be replaced. After the rotating member 202 rotates, the inner side of the purification member 203 is connected to the openings and grooves at both ends of the rotating member 202, and the driving rod 208 is rotated on the outer side of the positioning cover 205 to drive the sealing plate 209 to move outward to leave the obstruction of the discharge guide member 207. The airflow generated by the air pump on one side of the fixed support plate 2 enters the feed pipe 2010 through the air inlet pipe 2012, and the airflow in the feed pipe 2010 enters the interior of the purification member 203 to push the catalyst to move outward through the discharge guide 207 and fall into the collection box 206 for storage. The replaced catalyst is put into the feed pipe 2010 through the feed cover 2011 and then enters the interior of the purification member 203. After the replacement of the catalyst is completed, the sealing plate 209 seals the discharge guide 207 again. After the purification member 203 rotates and discharges a certain amount of gas, the purified airflow is injected into the equipment for semiconductor processing. ;

[0023] Embodiment 3, on the basis of embodiment 1, the side end of the return cover 3 is a conical structure, and a counterflow component is installed on the inner side of the return cover 3, and a return pipe 301 is installed on the bottom of the return cover 3; the side end of the return pipe 301 is connected to the exhaust fan input end inside the external unit 1012, and the outer side of the return pipe 301 is connected to the bypass pipe 302; a protective pipe 1 303 is installed on the outer side of the guide main pipe 1010; a protective pipe 2 304 is installed on the outer side of the guide pipe 109; the side end of the protective pipe 1 303 is connected to the protective pipe 2 304, the side end of the protective pipe 1 303 is provided with an opening, and the protective pipe 1 303 The bottom is connected to the side end of the shunt pipe 302. When the air injected into the photolithography annealing and wafer inspection environment is purified, the air in the photolithography annealing or wafer inspection environment moves outward after passing through the reflux hood 3 collection hood, so that the air flows along the reflux pipe 301 to the exhaust fan inside the external unit 1012, and part of the airflow passes through the shunt pipe 302 and enters the interior of the protective tube 1 303 and the protective tube 2 304. The airflow with a certain temperature can pre-cool or preheat the airflow flowing inside the guide pipe 1010 and the guide pipe 109, thereby reducing the power consumption of cooling or heating the external air.

[0024] The working principle of this embodiment is as follows: the fan 1011 absorbs the external air, passes through the guide pipe 1010, and is divided into the upper and lower guide covers 108 along the two guide pipes 109, and then enters the two positioning plates 102 and the inner protective cover 105. The airflow is filtered by the multi-layer filter 107 and flows outward. The filtered airflow enters the positioning cylinder 201 through the connecting cover 2013. The servo motor drives the rotating part 202 to drive the purification part 203 and the spoiler 204 to rotate synchronously. The airflow enters the interior through the micropores on the side of the purification part 203 so that the catalyst reacts with the harmful substances contained in the air. The purified air flows outward through the air outlet cover 2014. When the rotating part 202 rotates, the catalyst in the purification part 203 is dispersed and fully reacts with the harmful substances, thereby improving the processing efficiency. The spoiler 204 blocks the airflow, so that the airflow is full. The purified air passes through the air outlet hood 2014, and the refrigerant generated by the condenser in the external unit 1012 flows to the evaporator 2016 through the copper tube 1 2017 for cooling the airflow. After the evaporator 2016 exchanges heat, the refrigerant enters the compressor in the external unit 1012 through the copper tube 2 2018 for circulating cooling, or heats the airflow through the heating wire module 2015. The clean air flows to the environment where the semiconductor photolithography annealing and wafer inspection equipment is located. The air in the photolithography annealing or wafer inspection environment flows through the return hood 3 along the return pipe 301 to the exhaust fan inside the external unit 1012, and part of the airflow enters the protective pipe 1 303 and the protective pipe 2 304 through the diversion pipe 302. The airflow with a certain temperature precools or preheats the airflow flowing in the guide pipe 1010 and the guide pipe 109. When the filtering effect of the multi-layer filter 107 is reduced, the cover plate at the replacement window 101 on the side of the purification body 1 is opened, and the flexible fixed bracket 106 moves along the guide groove 103 to carry the filtered multi-layer filter 107 to the replacement window 101, and the used multi-layer filter 107 is replaced. As the catalyst in the purification member 203 reaches the end of its service life, the rotating member 202 rotates to drive the inner side of the purification member 203 to communicate with the openings and slots at both ends of the rotating member 202, and the rotating drive rod 208 drives the sealing plate 209 to move outward to leave the obstruction of the discharge guide member 207. The airflow generated by the air pump enters the feed pipe 2010 through the intake pipe 2012 and then enters the purification member 203 to push the catalyst to move outward through the discharge guide member 207 and fall into the collection box 206 for storage. The replaced catalyst is put into the feed pipe 2010 through the feed cover 2011 and then enters the purification member 203.

[0025] In this article, there are a few points to note: 1. The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures may refer to general designs.

[0026] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0027] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An integrated air conditioning purification device for photolithography annealing and wafer inspection environment, comprising: A purification body (1) and a return hood (3), wherein a replacement window (101) is provided on the side of the purification body (1), wherein a cover plate is installed inside the replacement window (101), and two positioning plates (102) are installed on the inner side of the purification body (1); characterized in that a guide groove (103) is provided on the inner side of the positioning plate (102); a fixed support plate (2) is installed on the top and inner side of the purification body (1); a positioning cylinder (201) is installed on the fixed support plate (2); a servo motor is installed at one end of the positioning cylinder (201), and the edge of the other end of the positioning cylinder (201) is A plurality of evenly arranged slots are provided at the positions, and a rotating member (202) is rotatably mounted on the inner side of the positioning cylinder (201); one end of the rotating member (202) is connected to the output end of the servo motor at one end of the positioning cylinder (201), and an opening is provided at the edge of one end of the rotating member (202), and a slot is provided at the edge of the other end of the rotating member (202), and the slot at the edge of the other end of the rotating member (202) is connected to the slot at the edge of the other end of the positioning cylinder (201); a counterflow component is mounted on the inner side of the return hood (3), and a return pipe (301) is mounted at the bottom of the return hood (3).

2. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 1, characterized in that: An outer protective cover (104) and an inner protective cover (105) are installed between the two positioning plates (102); the inner protective cover (105) is located on the inner side of the outer protective cover (104), wherein one side of the inner protective cover (105) is provided with a slot, and both sides of the outer protective cover (104) are provided with slots, the slot on one side of the outer protective cover (104) is located on the inner side of the replacement window (101), and a flexible fixing bracket (106) is slidably installed between the inner protective cover (105) and the outer protective cover (104).

3. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 2, characterized in that: The top and bottom of the flexible fixed bracket (106) are provided with guide blocks, which are slidably mounted inside the guide groove (103), and a multi-layer filter screen (107) is mounted on the inner side of the flexible fixed bracket (106) by means of buckles.

4. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 3 is characterized in that: The outer side surface of the positioning plate (102) is installed with a flow guide cover (108); the outer end of the flow guide cover (108) is installed with a flow guide pipe (109); the flow guide pipe (109) passes through the outer side of the purification body (1) and is installed with a flow guide main pipe (1010); the side end of the flow guide main pipe (1010) is connected to the input end of the fan (1011); the bottom of the fan (1011) is installed with an external unit (1012); the interior of the external unit (1012) includes a compressor, a condenser and an exhaust fan.

5. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 4, characterized in that: A purification member (203) is installed on the side of the rotating member (202); micropores are provided on the side of the purification member (203), and the inner side of the purification member (203) is connected to the openings and slots at both ends of the rotating member (202); a spoiler (204) is installed on the inner side of the rotating member (202), wherein the spoiler (204) is located between multiple purification members (203).

6. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 5, characterized in that: A positioning cover (205) is installed on the outside of the other end of the positioning cylinder (201); a collecting box (206) is slidably installed on the bottom of the positioning cover (205); a discharge guide (207) is also installed on the outside of the other end of the positioning cylinder (201); the discharge guide (207) is located inside the positioning cover (205), and a plurality of slots are formed on the discharge guide (207), which are connected to the slots at the edge of the other end of the positioning cylinder (201); a driving rod (208) is installed on the outside of the positioning cover (205) so as to rotate when stretched.

7. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 6, characterized in that: A sealing plate (209) is installed at the inner end of the driving rod (208); the inner side of the sealing plate (209) is installed on the outer side of the discharge guide member (207); a feed pipe (2010) is installed at the edge of one end of the positioning cylinder (201); the inner side of the feed pipe (2010) is connected to an opening at one end of the rotating member (202), and a feed cover (211) is installed at the outer end of the feed pipe (2010); a sealing cover is installed on the top of the feed cover (211); an air pump is installed on one side of the fixed support plate (2), and an air intake pipe (212) is installed on the output end of the air pump.

8. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 7, characterized in that: The bottom of the air inlet pipe (2012) is connected to the feed pipe (2010); a connecting cover (2013) and an air outlet cover (2014) are respectively installed on the outside of the positioning cylinder (201); the side end of the connecting cover (2013) is connected to the outer protective cover (104), and the side end of the connecting cover (2013) is connected to the outer side of the groove on the other side of the outer protective cover (104).

9. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 8, characterized in that: A heating wire module (2015) and an evaporator (2016) are respectively installed on the inner side of the air outlet hood (2014); a copper tube 1 (2017) is installed at the bottom of the evaporator (2016), and a copper tube 2 (2018) is installed at the side end of the evaporator (2016); the copper tube 1 (2017) passes through the bottom of the purification body (1) and is connected to the condenser inside the external unit (1012); the copper tube 2 (2018) passes through the bottom of the purification body (1) and is connected to the compressor inside the external unit (1012).

10. The integrated air conditioning and purification equipment for photolithography annealing and wafer inspection environment according to claim 9, characterized in that: The side end of the return pipe (301) is connected to the exhaust fan input end inside the external unit (1012), and the outer side of the return pipe (301) is connected to a shunt pipe (302); a protective pipe 1 (303) is installed on the outer side of the flow guide main pipe (1010); a protective pipe 2 (304) is installed on the outer side of the flow guide pipe (109); the side end of the protective pipe 1 (303) is connected to the protective pipe 2 (304), the side end of the protective pipe 1 (303) is provided with an opening, and the bottom of the protective pipe 1 (303) is connected to the side end of the shunt pipe (302).

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