Laser repairing equipment for Micro LED driving circuit

Abstract

The invention relates to laser repairing equipment for a Micro LED drive circuit. The laser repairing equipment comprises a portal frame, a working platform assembly, a light box assembly and a spraying assembly. The portal frame is installed on the side, close to the Y-axis negative direction, of the working platform, the light box assembly is installed on the side, in the Y-axis positive direction, of the top of the portal frame, and the spraying assembly is installed on the side, in the Y-axis positive direction and the Y-axis negative direction, of the top of the portal frame. A mechanical arm assembly is installed on the side, in the positive direction of the Y axis, of the working platform, and a rotary material receiving platform assembly is installed on the side, in the positive direction of the X axis, of the mechanical arm assembly. According to the invention, short circuit and open circuit defects of the front and back surfaces and the side wires of the Micro LED driving circuit can be efficiently and accurately repaired.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic information, and in particular to a laser repair device for a Micro LED drive circuit. Background Art

[0003] In the new display field, Micro LED display has the characteristics of self-luminescence, high efficiency, low power consumption, and high stability. It is an important choice for the next generation of mainstream display technology and has the potential to replace existing technologies in many fields. Micro LED arrays can achieve ultra-high density pixels and have the characteristics of self-luminescence. Compared with OLED and LCD, Micro LED has higher luminous efficiency, longer life and higher brightness. At the same time, it has the advantages of being thin, light, and charge-saving for all-weather use. It will be widely used in the display field.

[0004] Micro LED display technology currently has many challenges. For example, the number of micro LED arrays is huge, and traditional SMT methods cannot be used to manufacture them due to efficiency issues. In addition, to control a large number of micro LED lamp beads, CMOS integrated circuit technology is needed to make display drive circuits. The current mainstream approach is to use glass as a substrate, and make drive circuits on the front and back sides by multiple exposures. Then, a layer of metal conductive film is made on the glass sidewall by evaporation. The film layer extends from the glass sidewall to the drive circuits on the front and back surfaces of the glass. Then, laser dry etching technology is used to etch the metal film on the glass sidewall, front, and back, so that the drive circuit on the front is connected to the drive circuit on the back through the wires on the sidewall. In mass production, short circuits and open circuits of individual circuits will definitely occur, and micro circuit repair equipment is needed for repair processing.

[0005] In summary, the problems existing in the prior art are:

[0006] Traditional repair equipment has a single function, especially for short circuit repair, which is relatively complicated and requires several devices to complete, resulting in a waste of time and cost. The equipment of the present invention integrates laser repair, silver paste injection, plastic sealing glue spraying and other processes into one device. The carrier can rotate, and the robot can automatically load and unload materials, which can realize multi-faceted processing, and the processing accuracy reaches the processing requirement of plus or minus 1 micron.

[0007] In view of the above-mentioned defects, the designers actively carried out research and innovation in order to create a laser repair device for Micro LED drive circuits to make it more valuable for industrial use. Summary of the invention

[0008] In order to solve any of the above technical problems, an object of the present invention is to provide a laser repair device for a Micro LED driving circuit.

[0009] To achieve the above object, the present invention adopts the following technical solution:

[0010] Laser repair equipment for Micro LED drive circuits, including gantry, work platform assembly, light box assembly and spray assembly;

[0011] The working platform assembly includes a working platform, a gantry is installed on the side of the working platform close to the negative direction of the Y axis, a light box assembly is installed on the top of the gantry along the side of the positive direction of the Y axis, and a spraying assembly is installed on the top of the gantry along the side of the positive and negative directions of the Y axis;

[0012] A Y-axis module and an X-axis module are installed on the working platform from bottom to top, and a slide plate is installed on the X-axis module;

[0013] A manipulator assembly is installed on one side of the working platform along the positive direction of the Y-axis, and a rotating material receiving platform assembly is installed on one side of the manipulator assembly along the positive direction of the X-axis. The rotating material receiving platform assembly includes a platform bracket, a hollow rotating motor is installed at the bottom of the platform bracket, and an alignment rotating platform is installed on the top of the platform bracket. The driving end at the top of the hollow rotating motor is connected to the alignment rotating platform above through the hollow rotating platform.

[0014] As a further improvement of the present invention, a flip platform assembly is arranged on the skateboard, and the flip platform assembly includes a platform base installed on the skateboard, a first platform is installed above the platform base through a platform bracket, a platform base is arranged on one side of the platform bracket along the positive direction of the Y-axis, and a second platform is installed on the outer side of the platform base. The flip motor installed on the platform base drives the platform base to flip through a screw module and a connecting rod mechanism.

[0015] As a further improvement of the present invention, a rotating motor installed on the inner side of the carrier base drives the second carrier located on the outer side of the carrier base to rotate through a reducer.

[0016] As a further improvement of the present invention, the connecting rod mechanism includes a connecting rod, the top of the connecting rod is hinged to the inner side of the carrier base, the bottom of the connecting rod is hinged to the guide rail movable plate, and the bottom of the guide rail movable plate is connected to the guide rail assembly installed on the carrier base along the Y-axis direction.

[0017] As a further improvement of the present invention, the light box assembly includes an upper light box and a lower light box, and the first laser and the second laser are respectively installed on both sides of the upper light box.

[0018] As a further improvement of the present invention, an objective lens assembly is installed at the bottom of the lower light box.

[0019] As a further improvement of the present invention, at least one alignment camera is installed on the platform bracket on one side below the alignment rotation platform, and the alignment camera moves freely in the Y-axis direction under the action of the camera linear motor.

[0020] As a further improvement of the present invention, the spraying assembly includes a spraying substrate installed on a gantry, a spraying Z-axis module is installed on the spraying substrate, the spraying Z-axis module drives the spraying slide to move in the Z-axis direction, and a glue valve and a silver paste valve are installed on the spraying slide.

[0021] As a further improvement of the present invention, a spraying camera and a height meter are also installed on the spraying slide.

[0022] By means of the above scheme, the present invention has at least the following advantages:

[0023] The present invention can efficiently and accurately repair short circuits and open circuits on the front and back sides of the Micro LED driving circuit and the side wires, mainly because:

[0024] 1. The coaxial laser processing system can accurately locate and remove excess line materials, repair the short-circuited part, and remove excess lines when repairing the broken lines, ensuring the consistency of the repair line width;

[0025] 2. Silver paste injection head, spraying the volume and quantity of silver paste beads controlled to the specified position;

[0026] 3. The curing laser also passes through the coaxial imaging system to achieve the curing of the liquid silver paste;

[0027] 4. The reversible processing platform can be compatible with 8 surfaces including the front, back, side and 45-degree surface for repair processing.

[0028] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 It is a structural schematic diagram of a laser repair device for a Micro LED driving circuit of the present invention;

[0031] Figure 2 yes Figure 1 A schematic diagram of the structure of the working platform component;

[0032] Figure 3 yes Figure 1 A schematic diagram of the structure of the middle light box assembly;

[0033] Figure 4 yes Figure 1 A schematic diagram of the structure of the middle flip stage assembly;

[0034] Figure 5 yes Figure 1 A schematic diagram of the structure of the rotating material receiving platform assembly;

[0035] Figure 6 yes Figure 1 Schematic diagram of the structure of the spraying assembly;

[0036] Figure 7 is a schematic diagram before short circuit repair of the present invention;

[0037] Figure 8 is a schematic diagram of the present invention after short circuit repair;

[0038] Fig. 9 is a schematic diagram of a circuit breaker to be repaired according to the present invention;

[0039] Fig.10 This is a schematic diagram of the present invention during spray repair;

[0040] Fig.11 This is a schematic diagram of the present invention when removing the redundant part by laser;

[0041] Fig.12 It is a product schematic diagram of the present invention.

[0042] The meanings of the various reference numerals in the figures are as follows.

[0043] Gantry 1, working platform assembly 2, light box assembly 3, flip stage assembly 4, manipulator assembly 5, rotating material receiving platform assembly 6, spraying assembly 7;

[0044] Working platform 21, Y-axis module 22, X-axis module 23, slide plate 24;

[0045] A first laser 31, a second laser 32, an upper light box 33, a lower light box 34, and an objective lens assembly 35;

[0046] The carrier base 41, the flip motor 42, the first carrier 43, the second carrier 44, the rotating motor 45, the reducer 46, the screw module 47, and the guide rail assembly 48;

[0047] Platform bracket 61, hollow rotating motor 62, hollow rotating platform 63, alignment rotating platform 64, alignment camera 65;

[0048] Spraying substrate 71, spraying Z-axis module 72, spraying camera 73, altimeter 74, glue valve 75, silver paste valve 76. DETAILED DESCRIPTION

[0049] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0050] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0051] like Figures 1 to 12 As shown, a laser repair device for a Micro LED driving circuit includes a gantry 1, a working platform assembly 2, a light box assembly 3, a flip stage assembly 4, a manipulator assembly 5, a rotating material receiving platform assembly 6 and a spray assembly 7. The working platform assembly 2 includes a working platform 21, the gantry 1 is installed on the side of the working platform 21 close to the negative direction of the Y axis, the light box assembly 3 is installed on the top of the gantry 1 along the positive direction of the Y axis, and the spray assembly 7 is installed on the top of the gantry 1 along the positive and negative directions of the Y axis.

[0052] The Y-axis module 22 and the X-axis module 23 are sequentially installed on the working platform 21 from bottom to top, and the slide plate 24 is installed on the X-axis module 23. The product is driven from the film placement station to the processing station through the XY axis, and the zero point coordinate is established through the reading head grating ruler to achieve precise control of the product position.

[0053] A manipulator assembly 5 is installed on one side of the working platform 21 along the positive direction of the Y axis, and a rotating material receiving platform assembly 6 is installed on one side of the manipulator assembly 5 along the positive direction of the X axis. The rotating material receiving platform assembly 6 includes a platform bracket 61, a hollow rotating motor 62 is installed at the bottom of the platform bracket 61, and an alignment rotating platform 64 is installed on the top of the platform bracket 61. The driving end at the top of the hollow rotating motor 62 is connected to the alignment rotating platform 64 above through the hollow rotating platform 63.

[0054] At least one alignment camera 65 is installed on the platform bracket 61 on one side below the alignment rotation platform 64, and the alignment camera 65 is freely movable in the Y-axis direction under the action of the camera linear motor.

[0055] A flip stage assembly 4 is arranged on the slide 24, and the flip stage assembly 4 includes a stage base 41 installed on the slide 24, a first stage 43 is installed above the stage base 41 through a stage bracket, a stage base is arranged on one side of the stage bracket along the positive direction of the Y axis, a second stage 44 is installed on the outside of the stage base, and a flip motor 42 installed on the stage base 41 drives the stage base to flip through a screw module 47 and a connecting rod mechanism. The rotary motor 45 installed on the inner side of the stage base drives the second stage 44 located on the outer side of the stage base to rotate through a reducer 46, and performs rotation fine adjustment to ensure that the product is parallel to the objective lens switching axis and the crossbeam of the spray assembly 7.

[0056] The connecting rod mechanism includes a connecting rod, the top of which is hinged to the inner side of the platform base, the bottom of which is hinged to the guide rail movable plate, and the bottom of the guide rail movable plate is connected to the guide rail assembly 48 installed on the platform base 41 along the Y-axis direction.

[0057] The optical box assembly 3 comprises an upper optical box 33 and a lower optical box 34. A first laser 31 and a second laser 32 are respectively mounted on both sides of the upper optical box 33. An objective lens assembly 35 is mounted at the bottom of the lower optical box 34.

[0058] The spraying assembly 7 includes a spraying substrate 71 mounted on the gantry 1, a spraying Z-axis module 72 is mounted on the spraying substrate 71, the spraying Z-axis module 72 drives the spraying slide to move in the Z-axis direction, and a glue valve 75 and a silver paste valve 76 are mounted on the spraying slide. A spraying camera 73 and a height meter 74 are also mounted on the spraying slide.

[0059] The working process of the present invention is briefly described as follows:

[0060] If the product is short-circuited, Figure 7 As shown, the loading mechanism places the product on the alignment rotating platform 64, vacuum absorbs the processed product, and the alignment camera 65 captures it. Then, the hollow rotating motor 62 drives the alignment rotating platform 64 to rotate an angle, and then the robot assembly 5 performs XY axis compensation, so that the input product can be aligned. The robot assembly 5 then transports the product to the first carrier 43, and the first laser 31 emits light through the upper light box 33 and the lower light box 34 to repair the front and back circuits of the product. The product is placed on the second carrier 44 for side and 45-degree side circuit repair. After repair, Figure 8 shown.

[0061] If the product is broken circuit faulty Fig. 9As shown, the product is driven by the flip stage assembly 4 to move under the spray assembly 7 under the Y-axis module 22 and the X-axis module 23, and the silver paste valve 76 sprays a certain amount of silver paste to the designated position, and the spray camera 73 can observe the processing in real time. Then the product is driven by the flip stage assembly 4 to move under the objective lens assembly 35 under the Y-axis module 22 and the X-axis module 23 to remove the excess silver paste, and then the product is driven by the flip stage assembly 4 to move under the spray assembly 7 under the Y-axis module 22 and the X-axis module 23 to be glued and sealed through the glue valve 75. After the plastic sealing is completed, the product is driven by the flip stage assembly 4 to move under the Y-axis module 22 and the X-axis module 23 to move under the objective lens assembly 35 to be dried under the action of the second laser 32.

[0062] The present invention can efficiently and accurately repair the short circuit and open circuit defects of the front and back sides and side wires of the Micro LED driving circuit. The coaxial laser processing system can accurately locate and remove excess circuit material, realize the repair of the short-circuited part, and remove the excess circuit when repairing the broken circuit, to ensure the consistency of the repair line width; the silver paste injection head sprays the volume and number of controllable silver paste beads to the specified position; the curing laser also passes through the coaxial imaging system to realize the curing of the liquid silver paste; the flippable processing platform can be compatible with the repair processing of 8 surfaces such as the front and back sides and the 45-degree surface.

[0063] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0064] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. Laser repair equipment for Micro LED drive circuit, including a gantry (1), a working platform assembly (2), a light box assembly (3) and a spray assembly (7); Features: The working platform assembly (2) comprises a working platform (21), the gantry (1) is mounted on the working platform (21) on a side close to the negative direction of the Y-axis, a light box assembly (3) is mounted on the top of the gantry (1) on a side along the positive direction of the Y-axis, and a spraying assembly (7) is mounted on the top of the gantry (1) on a side along the positive and negative directions of the Y-axis; A Y-axis module (22) and an X-axis module (23) are sequentially installed on the working platform (21) from bottom to top, and a slide plate (24) is installed on the X-axis module (23); A manipulator assembly (5) is installed on one side of the working platform (21) along the positive direction of the Y axis, and a rotating material receiving platform assembly (6) is installed on one side of the manipulator assembly (5) along the positive direction of the X axis. The rotating material receiving platform assembly (6) includes a platform bracket (61), a hollow rotating motor (62) is installed at the bottom of the platform bracket (61), and a positioning rotating platform (64) is installed at the top of the platform bracket (61). The driving end at the top of the hollow rotating motor (62) is connected to the positioning rotating platform (64) above through a hollow rotating platform (63).

2. The laser repair device for Micro LED driving circuit according to claim 1, characterized in that: A flip platform assembly (4) is arranged on the slide plate (24), and the flip platform assembly (4) includes a platform base (41) installed on the slide plate (24), a first platform (43) is installed above the platform base (41) through a platform bracket, a platform base is arranged on one side of the platform bracket along the positive direction of the Y axis, and a second platform (44) is installed on the outer side of the platform base, and a flip motor (42) installed on the platform base (41) drives the platform base to flip through a screw module (47) and a connecting rod mechanism.

3. The laser repair device for Micro LED driving circuit according to claim 2, characterized in that: A rotating motor (45) installed inside the carrier base drives a second carrier (44) located outside the carrier base to rotate via a reducer (46).

4. The laser repair device for Micro LED driving circuit according to claim 2, characterized in that: The connecting rod mechanism comprises a connecting rod, the top of which is hinged on the inner side of the platform base, the bottom of which is hinged on the guide rail movable plate, and the bottom of which is connected to a guide rail assembly (48) installed on the platform base (41) along the Y-axis direction.

5. The laser repair device for Micro LED driving circuit according to claim 1, characterized in that: The light box assembly (3) comprises an upper light box (33) and a lower light box (34), and a first laser (31) and a second laser (32) are respectively installed on both sides of the upper light box (33).

6. The laser repair device for Micro LED driving circuit according to claim 5, characterized in that: An objective lens assembly (35) is installed at the bottom of the lower light box (34).

7. The laser repair device for Micro LED driving circuit according to claim 1, characterized in that: At least one alignment camera (65) is installed on a platform bracket (61) on one side below the alignment rotation platform (64), and the alignment camera (65) is freely movable in the Y-axis direction under the action of a camera linear motor.

8. The laser repair device for Micro LED driving circuit according to claim 1, characterized in that: The spraying assembly (7) comprises a spraying substrate (71) mounted on a gantry (1), a spraying Z-axis module (72) mounted on the spraying substrate (71), the spraying Z-axis module (72) driving a spraying slide plate to move in a Z-axis direction, and a glue valve (75) and a silver paste valve (76) mounted on the spraying slide plate.

9. The laser repair device for Micro LED driving circuit according to claim 8, characterized in that: A spraying camera (73) and a height meter (74) are also installed on the spraying slide.

Images