Semiconductor laser processing machine tool and use method thereof

Abstract

The invention discloses a semiconductor laser processing machine tool and a using method thereof, and the semiconductor laser processing machine tool comprises a bottom frame which is of a hollow structure with a groove in the top; the control cabinet is fixedly connected to one side of the bottom frame; the transmission material guiding structure is arranged on one side of the bottom frame, the transmission material guiding structure comprises a sliding round rod, the bottom end of the sliding round rod is slidably connected with a sliding cylinder, and the bottom of the sliding cylinder is fixedly connected with a hemispherical frame. A rolling ball can be driven to move downwards under the action of a sliding round rod and a sliding cylinder, then a cut object can be ejected out downwards to be separated from a cutting main plate, meanwhile, the cut object can be guided to the horizontal position under the action of an inclined plate in a material pushing heat dissipation structure, the situation that the cut object is stacked below the main plate is avoided, and the cutting efficiency is improved. At the moment, auxiliary heat dissipation can be carried out under the action of components such as the driving fan blade body and the driven fan blade body.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser machine tools, in particular to a semiconductor laser processing machine tool and a use method thereof. Background Art

[0002] Semiconductor laser processing machine tools are a type of cutting machine tool equipment based on semiconductor pumped lasers. Semiconductor laser processing machine tools are increasingly used in industrial production and can meet most processing needs. Compared with tool processing methods, semiconductor laser equipment is safer and more efficient.

[0003] Generally, in the actual use of traditional semiconductor laser processing machines, after laser cutting is completed, due to the small gap in the cross section and the burrs on the plate, there will still be friction between the cut object and the main board for limiting connection. At this time, external force needs to be applied to separate the object from the main board. This process often requires manual intervention, which is easy to cause accidental injury and is very inconvenient. When the cut object falls into the bottom frame, it will accumulate under the main board. When the accumulation is high, it will affect the cutting efficiency. After cutting, the main board or the cutting part of the cutting piece will generate high temperature. At this time, the high temperature can easily cause edge deformation of the cut-off part of the main board or the cutting part, thereby affecting the quality of the object and the main board, which is very inconvenient.

[0004] In summary, it is necessary to propose a semiconductor laser processing machine tool and a method of using the same to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor laser processing machine tool and a method of using the same to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor laser processing machine tool and a method of using the same, comprising:

[0008] A bottom frame, wherein the bottom frame is a hollow structure with a slotted top;

[0009] A control cabinet, wherein the control cabinet is fixedly connected to one side of the bottom frame;

[0010] A transmission material guide structure, which is arranged on one side of the bottom frame, and comprises a sliding round rod, the bottom end of which is slidably connected to a sliding cylinder, the bottom of which is fixedly connected to a hemispherical frame, the bottom of the outer surface of which is fixedly connected to an annular block, the inner wall of which is fixedly connected to a limiting protrusion, and a rolling ball is arranged inside the hemispherical frame;

[0011] A pusher heat dissipation structure, the pusher heat dissipation structure is arranged on one side of the bottom frame, the pusher heat dissipation structure includes a pusher frame and an active rod, a pusher groove is opened on one side of the pusher frame, the pusher groove is composed of two sections of inclined grooves with different slopes, the top of the pusher frame is rotatably connected to a plurality of driven rods, the outer surface of the driven rod is fixedly connected to a driven gear, the top of the driven rod is fixedly connected to a driven blade body, the top of the active rod is fixedly connected to an active blade body, and the outer surface of the active rod is fixedly connected to an active blade body;

[0012] A mobile clamping structure, the mobile clamping structure comprising a U-shaped clamping frame, the bottom of the U-shaped clamping frame is fixedly connected to a support plate;

[0013] The discharge port is opened on one side of the bottom frame.

[0014] Preferably, the transmission material guiding structure also includes a U-shaped plate, an outer surface of the U-shaped plate is fixedly connected to the outer surface of the bottom frame, a first electric telescopic rod is fixedly installed on one side of the outer surface of the U-shaped plate, an output end of the first electric telescopic rod is fixedly connected to a first connecting block, a first L-shaped plate is fixedly connected to one side of the outer surface of the first connecting block, a second electric telescopic rod is fixedly installed on the bottom of the first L-shaped plate, an output end of the second electric telescopic rod is fixedly connected to a second L-shaped plate, a third electric telescopic rod is fixedly installed on one side of the outer surface of the second L-shaped plate, and the output end of the third electric telescopic rod is fixedly connected to the second connecting block.

[0015] Preferably, a semiconductor laser is fixedly mounted on the bottom of the outer surface of the second connecting block, a laser head is arranged at the bottom of the semiconductor laser, a mounting block is fixedly connected to the outer surface of the semiconductor laser, the bottom of the outer surface of the mounting block is fixedly connected to the top end of the sliding round rod, a return spring is sleeved on the outer surface of the sliding round rod, and both ends of the return spring are fixedly connected to the outer surfaces of the mounting block and the sliding cylinder respectively.

[0016] Preferably, the pusher heat dissipation structure also includes an inclined plate fixedly connected to the inside of the bottom frame, a first rectangular frame is fixedly connected to one side of the outer surface of the bottom frame, a first motor is fixedly installed on the output end of the first rectangular frame, a first screw is fixedly connected to the output end of the first motor, a first screw hole block is threadedly connected to the outer surface of the first screw, a sliding groove is provided on the inner wall of one side of the bottom frame, the sliding groove consists of an inclined groove and a straight groove, a first wheel groove is provided on the bottom of the inner wall of the bottom frame at the connection between the inclined groove and the straight groove of the sliding groove, a first guide wheel is rotatably connected to the inner wall of the first wheel groove, a second wheel groove is provided on the top of the inner wall of the bottom frame at the connection between the inclined groove and the straight groove of the sliding groove, and a second guide wheel is rotatably connected to the inner wall of the second wheel groove.

[0017] Preferably, a third L-shaped plate is fixedly connected to one side of the outer surface of the first screw hole block, a sliding rod is fixedly connected to the top of the third L-shaped plate, a sliding cylinder is slidably connected to the outer surface of the sliding rod, and a third connecting block is fixedly connected to the top of the outer surface of the sliding cylinder.

[0018] Preferably, a fixing rod is fixedly connected to one side of the outer surface of the third connecting block, one end of the fixing rod is rotatably connected to a rotating slider, and one side of the rotating slider is fixedly connected to one side of the pushing frame.

[0019] Preferably, a mounting groove is provided on one side of the outer surface of the pushing frame, a second motor is fixedly installed on the top of the inner wall of the mounting groove, the output end of the second motor is fixedly connected to the bottom end of the active rod, the active gear is meshingly connected to the adjacent driven gears on both sides, the two adjacent driven gears are meshingly connected, a protective frame is fixedly connected to the top of the outer surface of the pushing frame, and a heat dissipation hole is provided on the top of the protective frame.

[0020] Preferably, the movable clamping structure also includes a second rectangular frame fixedly connected to one side of the outer surface of the bottom frame, a third motor is fixedly installed on one side of the outer surface of the second rectangular frame, a second screw is fixedly connected to the output end of the third motor, a second screw is threadedly connected to the outer surface of the second screw, a second screw hole block is threadedly connected, a first rectangular through hole is opened on the top of the outer surface of the second rectangular frame, a first sliding rod is slidably connected to the inner wall of the first rectangular through hole, and the top of the first sliding rod is fixedly connected to the third rectangular frame.

[0021] Preferably, a fourth motor is fixedly mounted on one side of the outer surface of the third rectangular frame, a third screw is fixedly connected to the output end of the fourth motor, the threads at both ends of the third screw have opposite rotation directions, the outer surface of the third screw is symmetrically threadedly connected with two third screw hole blocks, a second rectangular through hole is opened on one side of the third rectangular frame, a second sliding rod is fixedly connected to one side of the outer surface of the third screw hole block, the second sliding rod is slidably arranged on the inner wall of the second rectangular through hole, one end of the second sliding rod is fixedly connected to the U-shaped clamp frame, a fourth screw is threadedly connected to the inner wall of one side of the U-shaped clamp frame, and a rubber round block is fixedly connected to one end of the fourth screw.

[0022] Preferably, a method for using a semiconductor laser processing machine tool is also included, comprising the following steps:

[0023] S1. When in use, the processing plate is placed between the two U-shaped clamp frames, and the fourth motor is started at this time, so that the fourth motor can drive the third screw to rotate, and then the third screw hole block can be driven to move, and then the second slide bar can be driven to slide on the inner wall of the second rectangular through hole, and then the U-shaped clamp frame can be driven to move, and the support plate can provide auxiliary support for the processing plate. At this time, the fourth screw is rotated so that the rubber round block can assist in clamping and fixing the processing plate, and the third motor is started at this time, so that the third motor can drive the second screw to rotate, and then the second screw hole block can be driven to move, so that the first slide bar can slide on the inner wall of the first rectangular through hole, and then the U-shaped clamp frame and the processing plate can be driven to move;

[0024] S2, at this time, starting the first electric telescopic rod can drive the first L-shaped plate and other components to transmit, and then can drive the semiconductor laser to move. At this time, starting the second electric telescopic rod can make the second electric telescopic rod drive the second L-shaped plate to move, and then can drive the semiconductor laser to move up and down, and then start the third electric telescopic rod, and then can drive the semiconductor laser to move left and right, and then can drive the semiconductor laser to move left and right. When the semiconductor laser is cutting, at this time, it can be guided under the action of the rolling ball, and at the same time, it can drive the sliding cylinder to slide on the inner wall of the sliding rod, so that the reset spring is deformed. When the cutting is separated, the rolling ball can be pushed downward under the action of the reset spring, so that the cutting object is separated from the main board;

[0025] S3, when the processing is completed, the object will fall onto the inclined plate and then slide into the inside of the bottom frame, at this time, the first motor is started, so that the first motor can drive the first screw to move, and then drive the first screw hole block to move, so that the rotating slider can slide on the inner wall of the sliding groove, when sliding to the connection between the inclined groove and the straight groove, the rotating slider can be guided under the action of the first guide wheel and the second guide wheel, and the rotating slider will rotate at this time, when the rotating slider moves on the inner wall of the inclined groove, at this time, it can drive the sliding rod to slide on the inner wall of the sliding cylinder;

[0026] S4. Rotating the slider can drive the push frame to move, and then the object on the inclined plate can be pushed auxiliaryly. At the same time, the second motor can be started, and then the active rod can be driven to rotate, and then the active gear can be driven to rotate, and then the driven gear can be driven to rotate, and at the same time, the driven rod can be driven to rotate, and then the active fan blade body and the driven fan blade body can be driven to rotate, and then heat can be dissipated. At the same time, when the active fan blade body and the driven fan blade body move on the inclined plate, the wind direction of the active fan blade body and the driven fan blade body is an oblique wind direction, and then the semiconductor laser and the processing plate can be assisted in heat dissipation.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention can drive the rolling ball to move downward under the action of the transmission material guiding structure, the sliding round rod and the sliding cylinder, and then the cut object can be pushed downward and separated from the cutting main board. At the same time, under the action of the inclined plate inside the material pushing and heat dissipation structure, the cut object can be guided to a horizontal position to avoid accumulation under the main board. At this time, auxiliary heat dissipation can be performed under the action of the active fan blade body and the driven fan blade body and other components. At the same time, under the action of the rotating slider and the sliding groove, the material pushing frame can be driven to move, and then the cut object on the inclined plate can be pushed to the horizontal plane, and then pushed out in conjunction with the material outlet, so that the material will not accumulate at the bottom of the main board. At the same time, timely heat dissipation can be performed during cutting. After cutting, in the process of pushing out the material, the main board can be assisted in heat dissipation. At this time, the main board has a high temperature due to multiple cutting operations, and auxiliary heat dissipation can improve production efficiency. Under the action of the mobile clamping structure, the main board can be assisted in fixing and moving, which is convenient for processing with a semiconductor laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram showing the overall structure of a semiconductor laser processing machine tool and a method of using the same;

[0029] Figure 2 A schematic diagram of a rear view structure of a semiconductor laser processing machine tool and a method of using the same;

[0030] Figure 3 A schematic diagram of the structure of a U-shaped plate for a semiconductor laser processing machine tool and a method of using the same;

[0031] Figure 4 A schematic diagram of the structure of a sliding cylinder for a semiconductor laser processing machine tool and a method of using the same;

[0032] Figure 5 A schematic diagram of the structure of the inclined plate for a semiconductor laser processing machine tool and a method of using the same;

[0033] Figure 6 A schematic diagram showing the structure of a pusher frame for a semiconductor laser processing machine tool and a method of using the same;

[0034] Figure 7 A schematic diagram showing the structure of a protective frame for a semiconductor laser processing machine tool and a method of using the same;

[0035] Figure 8 To illustrate a semiconductor laser processing machine tool and its use method Figure 5 Enlarged view of point A in the middle;

[0036] Fig. 9A schematic diagram showing the structure of a bottom frame of a semiconductor laser processing machine tool and a method of using the same when viewed from above;

[0037] Fig.10 To illustrate a semiconductor laser processing machine tool and its use method Fig. 9 Enlarged view of point B in the middle;

[0038] Fig.11 A second rectangular frame structure schematic diagram showing a semiconductor laser processing machine tool and a method of using the same;

[0039] Fig.12 The third rectangular frame is a schematic diagram showing the structure of a semiconductor laser processing machine tool and a method of using the same.

[0040] In the figure:

[0041] 1. Base frame; 2. Control cabinet;

[0042] 3. Transmission guide structure; 31. U-shaped plate; 32. First electric telescopic rod; 33. First connecting block; 34. First L-shaped plate; 35. Second electric telescopic rod; 36. Second L-shaped plate; 37. Third electric telescopic rod; 38. Second connecting block; 39. Semiconductor laser; 310. Mounting block; 311. Sliding round rod; 312. Sliding cylinder; 313. Return spring; 314. Hemispherical frame; 315. Ring block; 316. Limiting convex block; 317. Rolling ball;

[0043] 4. Push material heat dissipation structure; 41. Inclined plate; 42. First rectangular frame; 43. First motor; 44. First screw rod; 45. First screw hole block; 46. Sliding groove; 47. Third L-shaped plate; 48. Sliding rod; 49. Sliding cylinder; 410. Third connecting block; 411. Fixed rod; 412. Rotating slider; 413. Push material frame; 414. Push material groove; 415. Protective frame; 416. Heat dissipation hole; 417. Mounting groove; 418. Second motor; 419. Active rod; 420. Active gear; 421. Active fan blade body; 422. Driven rod; 423. Driven gear; 424. Driven fan blade body; 425. First wheel groove; 426. First guide wheel; 427. Second wheel groove; 428. Second guide wheel;

[0044] 5. Mobile clamping structure; 51. Second rectangular frame; 52. Third motor; 53. Second screw; 54. Second screw hole block; 55. First rectangular through hole; 56. First slide bar; 57. Third rectangular frame; 58. Fourth motor; 59. Third screw; 510. Third screw hole block; 511. Second rectangular through hole; 512. Second slide bar; 513. U-shaped clamping frame; 514. Support plate; 515. Fourth screw; 516. Rubber round block;

[0045] 6. Discharge port. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] See also Figures 1 to 12 , the present invention provides a technical solution:

[0048] A semiconductor laser processing machine tool and a method of using the same, comprising:

[0049] Bottom frame 1, bottom frame 1 is a hollow structure with a slot on the top;

[0050] A control cabinet 2, which is fixedly connected to one side of the bottom frame 1;

[0051] The transmission material guide structure 3 is arranged on one side of the bottom frame 1. The transmission material guide structure 3 includes a sliding rod 311. The bottom end of the sliding rod 311 is slidably connected to a sliding cylinder 312. The bottom of the sliding cylinder 312 is fixedly connected to a hemispherical frame 314. The bottom of the outer surface of the hemispherical frame 314 is fixedly connected to an annular block 315. The inner wall of the annular block 315 is fixedly connected to a limiting protrusion 316. A rolling ball 317 is arranged inside the hemispherical frame 314.

[0052] The pusher heat dissipation structure 4 is arranged on one side of the bottom frame 1, and the pusher heat dissipation structure 4 includes a pusher frame 413 and an active rod 419. A pusher slot 414 is provided on one side of the pusher frame 413, and the pusher slot 414 consists of two sections of inclined slots with different slopes. The top of the pusher frame 413 is rotatably connected to a plurality of driven rods 422, and the outer surface of the driven rod 422 is fixedly connected to a driven gear 423, and the top of the driven rod 422 is fixedly connected to a driven blade body 424, and the top of the active rod 419 is fixedly connected to an active blade body 421, and the outer surface of the active rod 419 is fixedly connected to an active blade body 421;

[0053] The mobile clamping structure 5 includes a U-shaped clamping frame 513, and a support plate 514 is fixedly connected to the bottom of the U-shaped clamping frame 513;

[0054] The discharge port 6 is opened at one side of the bottom frame 1 .

[0055] Under the action of the transmission guide structure 3, the rolling ball 317 can be driven to move downward under the action of the sliding round rod 311 and the sliding cylinder 312, so that the cut object can be pushed downward and separated from the cutting main board. At the same time, under the action of the inclined plate 41 inside the pusher heat dissipation structure 4, the cut object can be guided to a horizontal position to avoid accumulation under the main board. At this time, auxiliary heat dissipation can be performed under the action of the active fan blade body 421 and the driven fan blade body 424. At the same time, the pusher frame 413 can be driven under the action of the rotating slider 412 and the sliding groove 46. Movement can push the cutting object on the inclined plate 41 to the horizontal plane, and then push it out in conjunction with the discharge port 6, so that the material will not accumulate at the bottom of the main board. At the same time, the heat can be dissipated in time during cutting. After cutting, the main board can be assisted in heat dissipation during the process of pushing the material out. At this time, the main board has a high temperature due to multiple cutting operations, and auxiliary heat dissipation can improve production efficiency. Under the action of the mobile clamping structure 5, the main board (mostly a rectangular raw material board made of metal, not shown in the figure) can be assisted in fixing and moving, so as to facilitate processing with the semiconductor laser 39.

[0056] refer to Figure 3 The transmission guide structure 3 also includes a U-shaped plate 31, the outer surface of the U-shaped plate 31 is fixedly connected to the outer surface of the bottom frame 1, a first electric telescopic rod 32 is fixedly installed on one side of the outer surface of the U-shaped plate 31, the output end of the first electric telescopic rod 32 is fixedly connected to a first connecting block 33, a first L-shaped plate 34 is fixedly connected to one side of the outer surface of the first connecting block 33, a second electric telescopic rod 35 is fixedly installed on the bottom of the first L-shaped plate 34, the output end of the second electric telescopic rod 35 is fixedly connected to a second L-shaped plate 36, a third electric telescopic rod 37 is fixedly installed on one side of the outer surface of the second L-shaped plate 36, and the output end of the third electric telescopic rod 37 is fixedly connected to a second connecting block 38;

[0057] By providing the first electric telescopic rod 32 , the second electric telescopic rod 35 and the third electric telescopic rod 37 , the position of the semiconductor laser 39 can be assisted in adjustment.

[0058] refer to Figure 3 and Figure 4 A semiconductor laser 39 is fixedly mounted on the bottom of the outer surface of the second connecting block 38, a laser head is arranged at the bottom of the semiconductor laser 39, a mounting block 310 is fixedly connected to the outer surface of the semiconductor laser 39, the bottom of the outer surface of the mounting block 310 is fixedly connected to the top of the sliding round rod 311, a return spring 313 is sleeved on the outer surface of the sliding round rod 311, and the two ends of the return spring 313 are fixedly connected to the outer surfaces of the mounting block 310 and the sliding cylinder 312 respectively;

[0059] Under the action of the sliding rod 311 and the sliding cylinder 312, the return spring 313 can indirectly drive the rolling ball 317 to move up and down, thereby facilitating the separation of the cut objects.

[0060] refer to Figure 5 , Figure 8 , Fig. 9 and Fig.10 The push material heat dissipation structure 4 also includes an inclined plate 41 fixedly connected to the inside of the bottom frame 1, a first rectangular frame 42 is fixedly connected to one side of the outer surface of the bottom frame 1, a first motor 43 is fixedly installed on the output end of the first rectangular frame 42, a first screw 44 is fixedly connected to the output end of the first motor 43, a first screw hole block 45 is threadedly connected to the outer surface of the first screw 44, a sliding groove 46 is opened on the inner wall of one side of the bottom frame 1, and the sliding groove 46 consists of an inclined groove and a straight groove, a first wheel groove 425 is opened at the bottom of the inner wall of the bottom frame 1 at the connection between the inclined groove and the straight groove of the sliding groove 46, and the inner wall of the first wheel groove 425 is rotatably connected to the first guide wheel 426, and a second wheel groove 427 is opened at the top of the inner wall of the bottom frame 1 at the connection between the inclined groove and the straight groove of the sliding groove 46, and the inner wall of the second wheel groove 427 is rotatably connected to the second guide wheel 428;

[0061] Under the action of the inclined plate 41, the cutting component can be guided to avoid accumulation at the bottom of the main board. At the same time, under the action of the first guide wheel 426 and the second guide wheel 428, the rotating slider 412 can slide more smoothly at the connection between the inclined groove and the straight groove on the inner wall of the sliding groove 46.

[0062] refer to Figure 5 and Figure 6 A third L-shaped plate 47 is fixedly connected to one side of the outer surface of the first screw hole block 45, a sliding rod 48 is fixedly connected to the top of the third L-shaped plate 47, a sliding cylinder 49 is slidably connected to the outer surface of the sliding rod 48, and a third connecting block 410 is fixedly connected to the top of the outer surface of the sliding cylinder 49;

[0063] Under the action of the sliding rod 48 and the sliding cylinder 49, the rotating slider 412 can be assisted in moving from the oblique groove of the sliding groove 46 to the straight groove.

[0064] refer to Figure 6 A fixed rod 411 is fixedly connected to one side of the outer surface of the third connecting block 410, one end of the fixed rod 411 is rotatably connected to a rotating slider 412, and one side of the rotating slider 412 is fixedly connected to one side of the pusher frame 413;

[0065] Under the action of the fixing rod 411 , the rotating slider 412 can slide on the inner wall of the sliding groove 46 , and can then move in coordination with the sliding rod 48 and the sliding cylinder 49 according to the actual movement situation.

[0066] refer to Figure 6 and Figure 7 A mounting groove 417 is provided on one side of the outer surface of the pusher frame 413, a second motor 418 is fixedly installed on the top of the inner wall of the mounting groove 417, an output end of the second motor 418 is fixedly connected to the bottom end of the active rod 419, a driving gear 420 is meshedly connected with adjacent driven gears 423 on both sides, two adjacent driven gears 423 are meshedly connected, a protective frame 415 is fixedly connected to the top of the outer surface of the pusher frame 413, and a heat dissipation hole 416 is provided on the top of the protective frame 415;

[0067] Under the action of the driving gear 420 and the driven gear 423, the driving rod 419 and the driven rod 422 can be driven to rotate, and then the driving blade body 421 and the driven blade body 424 can be driven to rotate, thereby assisting heat dissipation.

[0068] refer to Figure 1 and Fig.11 The mobile clamping structure 5 also includes a second rectangular frame 51 fixedly connected to one side of the outer surface of the bottom frame 1, a third motor 52 is fixedly installed on one side of the outer surface of the second rectangular frame 51, a second screw 53 is fixedly connected to the output end of the third motor 52, a second screw hole block 54 is threadedly connected to the outer surface of the second screw 53, a first rectangular through hole 55 is opened on the top of the outer surface of the second rectangular frame 51, a first sliding rod 56 is slidably connected to the inner wall of the first rectangular through hole 55, and a third rectangular frame 57 is fixedly connected to the top of the first sliding rod 56;

[0069] Under the action of the second screw rod 53 , the second screw hole block 54 can be driven to move, and further the third rectangular frame 57 can be driven to move.

[0070] refer to Fig.11 and Fig.12 A fourth motor 58 is fixedly mounted on one side of the outer surface of the third rectangular frame 57, and a third screw 59 is fixedly connected to the output end of the fourth motor 58. The threads of the two ends of the third screw 59 are in opposite directions. The outer surface of the third screw 59 is symmetrically threaded with two third screw hole blocks 510. A second rectangular through hole 511 is opened on one side of the third rectangular frame 57. A second slide bar 512 is fixedly connected to one side of the outer surface of the third screw hole block 510. The second slide bar 512 is slidably arranged on the inner wall of the second rectangular through hole 511. One end of the second slide bar 512 is fixedly connected to a U-shaped clamp frame 513. A fourth screw 515 is threadedly connected to the inner wall of one side of the U-shaped clamp frame 513. A rubber round block 516 is fixedly connected to one end of the fourth screw 515.

[0071] Under the action of the third screw rod 59, the third screw hole block 510 can be driven to move, and then the second slide rod 512 can be driven to move, so that the U-shaped clamp frame 513 can assist in clamping and limiting the mainboard.

[0072] The working principle of the above structure is:

[0073] When in use, the processing plate is placed between the two U-shaped clamp frames 513, and the fourth motor 58 is started at this time, so that the fourth motor 58 can drive the third screw rod 59 to rotate, and then the third screw hole block 510 can be driven to move, and then the second slide bar 512 can be driven to slide on the inner wall of the second rectangular through hole 511, and then the U-shaped clamp frame 513 can be driven to move, and the support plate 514 can provide auxiliary support for the processing plate. At this time, the fourth screw rod 515 is rotated so that the rubber round block 516 can assist in clamping and fixing the processing plate. At this time, the third motor 52 is started so that the third motor 52 can drive the second screw rod 53 to rotate, and then the second screw hole block 54 can be driven to move, so that the first slide bar 56 can slide on the inner wall of the first rectangular through hole 55, and then the U-shaped clamp frame 513 and the processing plate can be driven to move;

[0074] At this time, starting the first electric telescopic rod 32 can drive the first L-shaped plate 34 and other components to transmit, and then drive the semiconductor laser 39 to move. At this time, starting the second electric telescopic rod 35 can make the second electric telescopic rod 35 drive the second L-shaped plate 36 to move, and then drive the semiconductor laser 39 to move up and down, and then start the third electric telescopic rod 37, and then drive the semiconductor laser 39 to move left and right, and then drive the semiconductor laser 39 to move left and right. When the semiconductor laser 39 is cutting, it can be guided by the rolling ball 317, and at the same time, it can drive the sliding cylinder 312 to slide on the inner wall of the sliding rod 311, so that the reset spring 313 is deformed. When the object is separated from the cutting, the rolling ball 317 can be pushed downward under the action of the reset spring 313, so that the cutting object is separated from the main board;

[0075] When the processing is completed, the object will fall onto the inclined plate 41 and then slide into the interior of the bottom frame 1. At this time, the first motor 43 is started, so that the first motor 43 can drive the first screw rod 44 to move, and then drive the first screw hole block 45 to move, so that the rotating slider 412 can slide on the inner wall of the sliding groove 46. When sliding to the connection between the inclined groove and the straight groove, the rotating slider 412 can be guided by the first guide wheel 426 and the second guide wheel 428. At this time, the rotating slider 412 will rotate. When the rotating slider 412 moves on the inner wall of the inclined groove, it can drive the sliding rod 48 to slide on the inner wall of the sliding cylinder 49.

[0076] Rotating the slider 412 can drive the push frame 413 to move, and then can assist in pushing the object on the inclined plate 41. At the same time, the second motor 418 can be started, and then the active rod 419 can be driven to rotate. At this time, the active gear 420 can be driven to rotate, and then the driven gear 423 can be driven to rotate. At the same time, the driven rod 422 can be driven to rotate, and then the active fan blade body 421 and the driven fan blade body 424 can be driven to rotate, so as to dissipate heat. At the same time, when the active fan blade body 421 and the driven fan blade body 424 move on the inclined plate 41, the wind direction of the active fan blade body 421 and the driven fan blade body 424 is an oblique wind direction, so as to assist in cooling the semiconductor laser 39 and the processing plate.

[0077] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor laser processing machine tool, characterized in that: include: A bottom frame (1), wherein the bottom frame (1) is a hollow structure with a groove on the top; A control cabinet (2), wherein the control cabinet (2) is fixedly connected to one side of the bottom frame (1); A transmission material guide structure (3), the transmission material guide structure (3) being arranged on one side of the bottom frame (1), the transmission material guide structure (3) comprising a sliding round rod (311), the bottom end of the sliding round rod (311) being slidably connected to a sliding cylinder (312), the bottom of the sliding cylinder (312) being fixedly connected to a hemispherical frame (314), the bottom of the outer surface of the hemispherical frame (314) being fixedly connected to an annular block (315), the inner wall of the annular block (315) being fixedly connected to a limiting protrusion (316), and a rolling ball (317) being arranged inside the hemispherical frame (314); A material pushing and heat dissipation structure (4), wherein the material pushing and heat dissipation structure (4) is arranged on one side of the bottom frame (1), and the material pushing and heat dissipation structure (4) comprises a material pushing frame (413) and an active rod (419), a material pushing groove (414) is provided on one side of the material pushing frame (413), and the material pushing groove (414) is composed of two sections of inclined grooves with different slopes, a plurality of driven rods (422) are rotatably connected to the top of the material pushing frame (413), a driven gear (423) is fixedly connected to the outer surface of the driven rod (422), a driven blade body (424) is fixedly connected to the top of the driven rod (422), an active blade body (421) is fixedly connected to the top of the active rod (419), and an active blade body (421) is fixedly connected to the outer surface of the active rod (419); A movable clamping structure (5), the movable clamping structure (5) comprising a U-shaped clamping frame (513), the bottom of the U-shaped clamping frame (513) being fixedly connected to a support plate (514); A discharge port (6), wherein the discharge port (6) is provided on one side of the bottom frame (1).

2. A semiconductor laser processing machine tool according to claim 1, characterized in that: The transmission material guiding structure (3) further comprises a U-shaped plate (31), the outer surface of the U-shaped plate (31) being fixedly connected to the outer surface of the bottom frame (1), a first electric telescopic rod (32) being fixedly mounted on one side of the outer surface of the U-shaped plate (31), an output end of the first electric telescopic rod (32) being fixedly connected to a first connecting block (33), a first L-shaped plate (34) being fixedly connected to one side of the outer surface of the first connecting block (33), a second electric telescopic rod (35) being fixedly mounted on the bottom of the first L-shaped plate (34), an output end of the second electric telescopic rod (35) being fixedly connected to a second L-shaped plate (36), a third electric telescopic rod (37) being fixedly mounted on one side of the outer surface of the second L-shaped plate (36), and an output end of the third electric telescopic rod (37) being fixedly connected to a second connecting block (38).

3. A semiconductor laser processing machine tool according to claim 2, characterized in that: A semiconductor laser (39) is fixedly mounted on the bottom of the outer surface of the second connecting block (38), a laser head is arranged at the bottom of the semiconductor laser (39), a mounting block (310) is fixedly connected to the outer surface of the semiconductor laser (39), the bottom of the outer surface of the mounting block (310) is fixedly connected to the top of the sliding round rod (311), a return spring (313) is sleeved on the outer surface of the sliding round rod (311), and two ends of the return spring (313) are respectively fixedly connected to the outer surfaces of the mounting block (310) and the sliding cylinder (312).

4. The semiconductor laser processing machine tool according to claim 1, characterized in that: The pusher heat dissipation structure (4) also includes an inclined plate (41) fixedly connected to the inside of the bottom frame (1); a first rectangular frame (42) is fixedly connected to one side of the outer surface of the bottom frame (1); a first motor (43) is fixedly installed at the output end of the first rectangular frame (42); a first screw rod (44) is fixedly connected to the output end of the first motor (43); a first screw hole block (45) is threadedly connected to the outer surface of the first screw rod (44); a sliding groove (45) is provided on the inner wall of one side of the bottom frame (1); 6), the sliding groove (46) is composed of an oblique groove and a straight groove, the inner wall of the bottom frame (1) is located at the bottom of the connection between the oblique groove and the straight groove of the sliding groove (46) and is provided with a first wheel groove (425), the inner wall of the first wheel groove (425) is rotatably connected to a first guide wheel (426), the inner wall of the bottom frame (1) is located at the top of the connection between the oblique groove and the straight groove of the sliding groove (46) and is provided with a second wheel groove (427), the inner wall of the second wheel groove (427) is rotatably connected to a second guide wheel (428).

5. A semiconductor laser processing machine tool according to claim 4, characterized in that: A third L-shaped plate (47) is fixedly connected to one side of the outer surface of the first screw hole block (45), a sliding rod (48) is fixedly connected to the top of the third L-shaped plate (47), a sliding cylinder (49) is slidably connected to the outer surface of the sliding rod (48), and a third connecting block (410) is fixedly connected to the top of the outer surface of the sliding cylinder (49).

6. A semiconductor laser processing machine tool according to claim 5, characterized in that: A fixed rod (411) is fixedly connected to one side of the outer surface of the third connecting block (410), one end of the fixed rod (411) is rotatably connected to a rotating slider (412), and one side of the rotating slider (412) is fixedly connected to one side of the pusher frame (413).

7. The semiconductor laser processing machine tool according to claim 1, characterized in that: A mounting groove (417) is provided on one side of the outer surface of the pusher frame (413); a second motor (418) is fixedly installed on the top of the inner wall of the mounting groove (417); an output end of the second motor (418) is fixedly connected to the bottom end of the active rod (419); the active gear (420) is meshedly connected to adjacent driven gears (423) on both sides; two adjacent driven gears (423) are meshedly connected to each other; a protective frame (415) is fixedly connected to the top of the outer surface of the pusher frame (413); a heat dissipation hole (416) is provided on the top of the protective frame (415).

8. The semiconductor laser processing machine tool according to claim 1, characterized in that: The movable clamping structure (5) further comprises a second rectangular frame (51) fixedly connected to one side of the outer surface of the bottom frame (1); a third motor (52) is fixedly mounted on one side of the outer surface of the second rectangular frame (51); a second screw rod (53) is fixedly connected to the output end of the third motor (52); a second screw hole block (54) is threadedly connected to the outer surface of the second screw rod (53); a first rectangular through hole (55) is provided at the top of the outer surface of the second rectangular frame (51); a first sliding rod (56) is slidably connected to the inner wall of the first rectangular through hole (55); and the top end of the first sliding rod (56) is fixedly connected to the third rectangular frame (57).

9. A semiconductor laser processing machine tool according to claim 8, characterized in that: A fourth motor (58) is fixedly mounted on one side of the outer surface of the third rectangular frame (57); a third screw rod (59) is fixedly connected to the output end of the fourth motor (58); the threads of the two ends of the third screw rod (59) are in opposite directions; two third screw hole blocks (510) are symmetrically threadedly connected to the outer surface of the third screw rod (59); a second rectangular through hole (511) is provided on one side of the third rectangular frame (57); a second sliding rod (512) is fixedly connected to one side of the outer surface of the third screw hole block (510); the second sliding rod (512) is slidably arranged on the inner wall of the second rectangular through hole (511); one end of the second sliding rod (512) is fixedly connected to a U-shaped clamp frame (513); a fourth screw rod (515) is threadedly connected to the inner wall of one side of the U-shaped clamp frame (513); one end of the fourth screw rod (515) is fixedly connected to a rubber round block (516).

10. A semiconductor laser processing machine tool according to any one of claims 1 to 9, characterized in that: Also included is a method for using a semiconductor laser processing machine tool, comprising the following steps: S1. When in use, the processing plate is placed between the two U-shaped clamping frames (513). At this time, the fourth motor (58) is started, so that the fourth motor (58) can drive the third screw rod (59) to rotate, and then drive the third screw hole block (510) to move, and then drive the second slide bar (512) to slide on the inner wall of the second rectangular through hole (511), and then drive the U-shaped clamping frame (513) to move, and the support plate (514) can provide auxiliary support for the processing plate. At this time, the fourth screw rod (515) is rotated, so that the rubber round block (516) can assist in clamping and fixing the processing plate. At this time, the third motor (52) is started, so that the third motor (52) can drive the second screw rod (53) to rotate, and then drive the second screw hole block (54) to move, so that the first slide bar (56) can slide on the inner wall of the first rectangular through hole (55), and then drive the U-shaped clamping frame (513) and the processing plate to move; S2, at this time, starting the first electric telescopic rod (32) can drive the first L-shaped plate (34) and other components to transmit, and then can drive the semiconductor laser (39) to move. At this time, starting the second electric telescopic rod (35) can make the second electric telescopic rod (35) drive the second L-shaped plate (36) to move, and then can drive the semiconductor laser (39) to move up and down, and then start the third electric telescopic rod (37) to drive the semiconductor laser (39) to move left and right, and then can drive the semiconductor laser (39) to move left and right. When the semiconductor laser (39) is cutting, at this time, it can be guided under the action of the rolling ball (317), and at the same time, it can drive the sliding cylinder (312) to slide on the inner wall of the sliding rod (311), and then the reset spring (313) is deformed. When the cutting is separated from the object, the rolling ball (317) can be pushed downward under the action of the reset spring 313, so that the cutting object is separated from the main board; S3, when the processing is completed, the object will fall onto the inclined plate (41) and then slide into the interior of the bottom frame (1). At this time, the first motor (43) is started so that the first motor (43) can drive the first screw rod (44) to move, and then drive the first screw hole block (45) to move, so that the rotating slider (412) can slide on the inner wall of the sliding groove (416). When sliding to the connection between the inclined groove and the straight groove, the rotating slider (412) can be guided under the action of the first guide wheel (426) and the second guide wheel (428). At this time, the rotating slider (412) will rotate. When the rotating slider (412) moves on the inner wall of the inclined groove, it can drive the sliding rod (48) to slide on the inner wall of the sliding cylinder (49); S4, the sliding block (412) is rotated to drive the pusher frame (413) to move, thereby assisting in pushing the object on the inclined plate (41), and at the same time, the second motor (418) is started, thereby driving the active rod (419) to rotate, thereby driving the active gear (420) to rotate, thereby driving the driven gear (423) to rotate, and at the same time, driving the driven rod (422) to rotate, thereby driving the active blade body (421) and the driven blade body (424) to rotate, thereby dissipating heat. At the same time, when the active blade body (421) and the driven blade body (424) move on the inclined plate (41), the wind direction of the active blade body (421) and the driven blade body (424) is an oblique wind direction, thereby assisting in dissipating heat for the semiconductor laser (39) and the processing plate.

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