Selective laser heat-assisted cutting system

Abstract

The invention relates to the technical field of part cutting machining, in particular to a selective laser heat-assisted cutting system. The selective laser heat-assisted cutting system comprises a supporting base body, a light guide cutter and a laser device, a laser emitting module of the laser device is installed on the supporting base body through an adjusting device, and the light guide cutter is provided with an incidence face for incidence of a laser beam so that the laser beam can be transmitted through the light guide cutter to irradiate a workpiece. The adjusting device comprises an angle adjusting mechanism used for adjusting the pitching angle of the laser emitting module, so that the laser beam can be incident to the incident plane at different angles and can be emitted out from different positions of the light guide cutter to irradiate different position cutting areas of the workpiece along the cutting path of the light guide cutter. Cutting areas at different positions of a workpiece can be selected for heating, adjustment of the heating areas of the workpiece can be achieved through angle adjustment of the adjusting device, tools of different specifications do not need to be replaced, and operation is convenient.

Description

Technical Field

[0001] The invention relates to the technical field of parts cutting and processing, and in particular to a laser selective thermal assisted cutting system. Background Art

[0002] With the rapid progress of precision cutting technology, especially the deep integration of ultra-precision cutting methods and special processing technology, the innovation of ultra-precision processing technology of difficult-to-process materials has been significantly promoted. Special processing technologies currently include ultrasonic elliptical vibration assisted cutting technology, laser assisted cutting technology, etc.

[0003] Ultrasonic elliptical vibration assisted cutting technology applies two-dimensional ultrasonic vibration to the tool to make its cutting path present an elliptical trajectory. Compared with traditional cutting and one-dimensional ultrasonic vibration cutting, this technology exhibits characteristics such as "friction reversal", "variable angle cutting" and more thorough "tool-workpiece separation". These characteristics make ultrasonic elliptical vibration cutting technology show significant advantages in extending tool life, improving cutting surface finish and cutting stability, and suppressing burrs and regenerative chatter.

[0004] Laser-assisted cutting technology focuses a high-energy laser beam on the workpiece material in front of the tool, so that the cutting area reaches the optimal softening temperature of the workpiece material before removal, and enhances the plastic flow of the material. This technology effectively reduces cutting force, cutting specific energy and surface roughness, and reduces tool wear, thereby improving processing quality and efficiency. Its processing mechanism not only involves the reduction of workpiece material strength and hardness at high temperatures, but also includes the changes in the stress field of the plastic deformation zone caused by local instantaneous high temperature inside the workpiece material, as well as the complex physical and chemical reactions between the workpiece material and the laser or medium at high temperature, all of which have an important impact on the cutting performance of the workpiece material.

[0005] In order to integrate the advantages of ultrasonic elliptical vibration cutting and laser-assisted cutting, the prior art has a cutting system that uses the above two auxiliary cutting technologies at the same time, such as a laser-ultrasonic synchronous assisted cutting system disclosed in the Chinese invention patent application with application publication number CN114178676A, which includes an ultrasonic elliptical vibration cutting system, a laser-assisted cutting system and a light-guiding diamond tool. The ultrasonic elliptical vibration cutting system includes an ultrasonic power supply, a transducer, a special-shaped amplitude change rod, a light-guiding tool holder, a flange base and a tool height adjustment mechanism. The light-guiding tool holder is installed at the output end of the special-shaped amplitude change rod by fastening bolts, and the light-guiding diamond tool is brazed on the front of the light-guiding tool holder to drive the light-guiding diamond tool to complete ultrasonic elliptical vibration cutting. The tool height adjustment mechanism is used to realize the tool setting operation of the light-guiding diamond tool. The laser-assisted cutting system is composed of a laser device, which includes a laser generator, a laser head, a laser power calibrator and a three-dimensional displacement fine-tuning mechanism. The three-dimensional displacement fine-tuning mechanism is an adjustment device for calibrating the position and is installed on the corresponding support base. After the tool position is adjusted, the position of the laser generator relative to the tool is calibrated by the calibration mechanism so that the laser beam can be irradiated onto the set incident surface of the light-guiding diamond tool. The laser generator constitutes a laser emission module. The laser emitted by the laser generator is transmitted to the laser head via a flexible optical fiber. The high-energy laser beam output by the laser head is incident on the rear end face of the light-guiding diamond tool through the groove opened on the light-guiding tool holder. The tool head of the light-guiding diamond tool is a diamond blade with light-guiding characteristics. The rear end face of the tool head is the set laser incident surface. The laser beam is refracted by the tool head of the light-guiding diamond tool and then emitted from the front blade face of the tool head of the light-guiding diamond tool, and is focused on the cutting area before the workpiece material is cut off to soften it.

[0006] In the above-mentioned cutting system, when the laser emission module and the cutting tool are aligned, the laser beam is refracted by the tool and irradiated on the cutting area of ​​the workpiece, which is fixed, that is, it is irradiated on the cutting area before the workpiece material is cut off. The same tool will cause the laser beam to be emitted from the same position and irradiate on the same position of the workpiece. The workpieces are made of different materials, and workpieces of different materials have different cutting requirements. Accordingly, the positions of the cutting areas that need to be laser heated will also be different. Some need to heat the cutting area before the workpiece material is cut off, and some need to heat the core cutting area of ​​the material being cut off. In order to achieve laser heating of cutting areas at different positions of the workpiece, it is necessary to replace tools with tool heads with different geometric shapes to utilize the different refraction angles of different tools to change the exit position of the laser beam. In this way, there are many tool specifications, high use costs, and tool replacement is required, which affects the convenience of operation. Summary of the invention

[0007] The object of the present invention is to provide a laser selective thermal assisted cutting system to solve the problem that the current cutting system needs to use tools of different specifications to heat cutting areas at different positions, which is inconvenient to operate.

[0008] The technical solution of the laser selective thermal assisted cutting system of the present invention is: A laser selective thermal assisted cutting system comprises a supporting base, a light guide tool and a laser device, wherein the laser device comprises a laser emitting module for outputting a laser beam, the laser emitting module is mounted on the supporting base through an adjusting device, the light guide tool is provided with an incident surface for incident laser beam so as to transmit the laser beam through the light guide tool and irradiate the workpiece, the adjusting device comprises an angle adjusting mechanism for adjusting the pitch angle of the laser emitting module, the pitch angle of the laser emitting module is adjustable so that the laser beam can be incident on the incident surface at different angles and the laser beam can be emitted from different positions of the light guide tool to irradiate cutting areas of the workpiece at different positions along the cutting path of the light guide tool.

[0009] Beneficial effect: The present invention is improved on the basis of the cutting system using laser-assisted cutting technology in the prior art. By setting an angle adjustment mechanism of an adjustment device, the angle adjustment mechanism can be used to adjust the pitch angle of the laser emitting module, thereby changing the angle of the laser beam output by the laser emitting module, so that the laser beam can be incident on the incident surface of the light-guiding tool at different angles. By adjusting the angle at which the laser beam is incident on the light-guiding tool, the refraction and reflection path of the laser beam transmitted in the light-guiding tool can be changed. By regulating the reflection and refraction path of the laser beam inside the light-guiding tool, the laser beam is emitted from different positions of the light-guiding tool, and the same incident position and different exit positions can be achieved. The laser beam can maintain alignment with the incident surface of the light-guiding tool while achieving different exit positions. It can irradiate cutting areas at different positions of the workpiece along the cutting path of the light-guiding tool, thereby achieving regulation of the temperature field at different positions of the cutting area of ​​the workpiece, and selectively heating cutting areas at different positions of the workpiece. The angle adjustment of the adjustment device can be used to adjust the heating area of ​​the workpiece without the need to replace tools of different specifications, and the operation is convenient.

[0010] Furthermore, the pitch angle adjustment range of the laser emitting module includes a working position in which the laser beam is emitted from the front cutting edge to irradiate the cutting zone of the workpiece before the material is removed, and a working position in which the laser beam is emitted from the back cutting edge to irradiate the cutting zone of the workpiece while the material is being removed.

[0011] Furthermore, the adjusting device includes a height adjusting mechanism for adjusting the height of the laser emitting module in the up and down directions.

[0012] Furthermore, the adjustment device also includes a horizontal displacement adjustment mechanism for adjusting the front-to-back position and the left-to-right position of the laser emitting module.

[0013] Furthermore, the height adjustment mechanism and the horizontal displacement adjustment mechanism are located on the upper side of the angle adjustment mechanism, and the angle adjustment mechanism is installed on the supporting base.

[0014] Furthermore, the cutting system also includes an ultrasonic vibration device, which includes an ultrasonic vibration generating module. The light-guiding tool is installed at the output end of the ultrasonic vibration generating module to output ultrasonic vibration to the light-guiding tool.

[0015] Furthermore, the laser emission module is arranged on a side of the ultrasonic vibration generating module away from the light guiding tool, and a through light passage is arranged in the ultrasonic vibration generating module, and the laser beam emitted by the laser emission module is incident on the light guiding tool through the light passage.

[0016] Furthermore, the ultrasonic vibration generating module includes a horn having a hollow inner cavity, the light passage includes the hollow inner cavity of the horn, and the light guide tool is installed in the hollow inner cavity of the horn.

[0017] Furthermore, the ultrasonic vibration generating module includes an ultrasonic module mounting base which is height-adjustably mounted on a supporting base, one of the ultrasonic module mounting base and the supporting base is provided with a slide groove, and the other is provided with a slide rail that cooperates with the slide groove, and the ultrasonic module mounting base and the supporting base are connected to an adjusting member for driving the ultrasonic module mounting base to slide relative to the supporting base, and a locking member for fixing the ultrasonic module mounting base after the ultrasonic module mounting base slides to a set position.

[0018] Furthermore, the ultrasonic module mounting base is a flange structure, the slide groove is arranged on the end surface of the flange structure, the slide rail is arranged on the supporting base, and the locking member is a locking bolt that passes through the end surface of the flange structure and is connected to the slide rail. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of an embodiment of the laser selective thermal assisted cutting system of the present invention; Figure 2 for Figure 1 A side view of the laser selective heat-assisted cutting system without the protective cover; Figure 3 for Figure 1 A schematic diagram of the front side view of the ultrasonic vibration generating module; Figure 4 for Figure 1 A schematic diagram of the ultrasonic vibration generating module from a rear side perspective; Figure 5 for Figure 1 Schematic diagram of the laser emission module installation structure; Figure 6 A schematic diagram of a laser beam emitted from a back face of an embodiment of a laser selective thermal assisted cutting system of the present invention; Figure 7 It is a schematic diagram of a laser beam emitted from the front cutting surface of an embodiment of the laser selective heat-assisted cutting system of the present invention.

[0020] In the figure: 10. Support base; 11. Slide rail; 12. Protective cover; 13. Differential bolt; 14. Locking bolt; 15. Three-way displacement adjustment mechanism; 16. Angle adjustment mechanism; 20. light guide tool; 21. tool head; 22. tool holder; 211. front tool face; 212. back tool face; 30. Dual-channel ultrasonic power supply; 31. Ultrasonic power cable; 32. Amplitude transformer; 33. Circular piezoelectric ceramic sheet; 34. Semicircular piezoelectric ceramic sheet; 35. Electrode sheet; 36. Back cover; 37. Ultrasonic module mounting seat; 38. Fastening bolts; 40. Laser controller; 41. Flexible optical fiber; 42. Laser emission module; 43. Laser beam; 50. Workpiece. DETAILED DESCRIPTION

[0021] The laser selective thermal assisted cutting system of the present invention realizes different emission positions by adjusting the angle at which the laser beam is incident on the light-guiding tool, thereby being able to select cutting areas at different positions of the workpiece for heating.

[0022] Embodiments of the laser selective thermal assisted cutting system of the present invention: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, the laser selective thermal assisted cutting system includes a supporting base 10, a light guide tool 20 and a laser device. The laser device includes a laser emitting module 42 for outputting a laser beam 43. The laser emitting module 42 is installed on the supporting base 10 through an adjusting device. The light guide tool 20 is provided with an incident surface for the laser beam 43 to be incident so that the laser beam 43 is transmitted through the light guide tool 20 and irradiated onto the workpiece 50. The adjusting device between the laser emitting module 42 and the supporting base 10 includes an angle adjustment mechanism 16 for adjusting the pitch angle of the laser emitting module 42. The pitch angle of the laser emitting module 42 is adjustable so that the laser beam 43 can be incident on the incident surface of the light guide tool 20 at different angles and the laser beam 43 can be emitted from different positions of the light guide tool 20 to irradiate cutting areas of the workpiece 50 at different positions along the cutting path of the light guide tool 20, so that different cutting areas on the tool cutting path can be heated.

[0023] The angle adjustment mechanism 16 can be used to adjust the pitch angle of the laser emitting module 42. The laser emitting module 42 can be tilted forward or backward, thereby changing the angle of the laser beam 43 output by the laser emitting module 42. The laser beam can be horizontally forward relative to the horizontal plane, or can be tilted upward or tilted downward, so that the laser beam 43 can be incident on the incident surface of the light guide tool 20 at different angles. By adjusting the angle at which the laser beam 43 is incident on the light guide tool 20, the refraction and reflection path of the laser beam 43 transmitted in the light guide tool 20 can be changed. By adjusting the reflection and refraction path of the laser beam 43 inside the light guide tool 20, The laser beam 43 is emitted from different positions of the light-guiding tool 20, so that the incident position is the same but the exit positions are different. The laser beam 43 can be kept aligned with the incident surface of the light-guiding tool 20 while achieving different exit positions. It can irradiate the cutting areas at different positions of the workpiece 50 along the cutting path of the light-guiding tool 20, so as to realize the regulation of the temperature field at different positions of the cutting area of ​​the workpiece 50. The cutting areas at different positions of the workpiece 50 can be selected for heating, and the heating area of ​​the workpiece 50 can be adjusted by adjusting the angle of the adjusting device. There is no need to replace tools of different specifications. The operation is convenient, cost-saving and adaptable.

[0024] The cutting system includes an ultrasonic vibration device, which includes an ultrasonic vibration generating module, and the light guide tool 20 is installed at the output end of the ultrasonic vibration generating module to output ultrasonic vibration to the light guide tool 20. In other embodiments, the ultrasonic vibration device may not be provided, and the light guide tool 20 may be directly installed on the supporting base with adjustable height.

[0025] The supporting base 10 includes a base and a tool holder vertically arranged upward based on the base, the ultrasonic vibration generating module includes an ultrasonic module mounting seat 37 which is height-adjustably mounted on the supporting base 10, and the ultrasonic vibration generating module of the ultrasonic vibration device is mounted on the tool holder. A slide groove is provided on the ultrasonic module mounting seat 37, and a slide rail 11 which cooperates with the slide groove is provided on the tool holder of the supporting base 10. The ultrasonic module mounting seat 37 and the supporting base 10 are connected with an adjusting member for driving the ultrasonic module mounting seat 37 to slide relative to the supporting base 10 and a locking member for fixing the ultrasonic module mounting seat 37 after the ultrasonic module mounting seat 37 slides to a set position. The slide rail 11 cooperates with the upper and lower guides of the slide groove of the ultrasonic module mounting seat 37, so as to facilitate the adjustment of the upper and lower positions of the ultrasonic module mounting seat 37, and the structure is simple. In other embodiments, a plurality of adjustment holes can also be provided on the supporting base, and a fixing hole can be provided on the ultrasonic module mounting seat, and the position adjustment can be realized by inserting bolts through the fixing holes in cooperation with different adjustment holes. In other embodiments, the slide groove can also be provided on the supporting base, and the slide rail can be provided on the ultrasonic module mounting seat.

[0026] The slide rail 11 is arranged on the front side of the tool holder of the supporting base 10, and the slide rail 11 extends in the up-down direction. The ultrasonic module mounting seat 37 is a flange structure, and the ultrasonic module mounting seat 37 has front and rear end faces, and the slide groove is arranged on the rear end face of the ultrasonic module mounting seat 37, and the slide groove is a through groove that passes through from top to bottom. The ultrasonic module mounting seat 37 is provided with an adjustment long hole, and the length direction of the adjustment long hole is the up-down direction, and the groove bottom of the slide groove that passes through the front and back of the adjustment long hole and the front end face of the ultrasonic module mounting seat 37 are adjusted. The long hole is a countersunk hole, and the slide rail 11 is provided with a threaded hole corresponding to the adjustment long hole. The locking bolt 14 passes through the adjustment long hole and is threadedly connected to the threaded hole. The adjustment long hole can avoid the locking bolt 14 when adjusting the upper and lower positions of the ultrasonic module mounting seat 37. After being adjusted in place, the locking bolt 14 is used to lock and fix. When the height of the ultrasonic module mounting seat 37 needs to be adjusted, the locking bolt 14 is loosened, and the locking bolt 14 constitutes a locking member that passes through the end face of the flange structure. In other embodiments, the locking bolts can also be connected to the left and right sides of the flange structure.

[0027] The ultrasonic vibration device includes an ultrasonic vibration generating module, a dual-channel ultrasonic power supply 30, and an ultrasonic power supply cable 31. The ultrasonic vibration generating module includes an ultrasonic module mounting seat 37 and an horn 32, a circular piezoelectric ceramic sheet 33, a semicircular piezoelectric ceramic sheet 34, an electrode sheet 35, a back cover 36, and a fastening bolt 38. The light guide tool 20 is installed at the front end of the horn 32, the ultrasonic module mounting seat 37 is integrally connected with a part of the rear end of the horn 32, and the ultrasonic vibration generating module is installed on the tool holder of the supporting substrate 10 through the ultrasonic module mounting seat 37. The tool holder of the supporting substrate 10 is provided with a front-to-back through-hole, the through-hole is a long hole extending up and down, and the through-hole passes through the slide rail 11. The ultrasonic vibration generating module passes through the through-hole and can be adjusted up and down. The upper end of the tool holder of the supporting base 10 is provided with a convex edge protruding forward, and a differential bolt 13 is connected to the convex edge and the differential bolt 13 is connected to the ultrasonic module mounting seat 37. The upper side of the ultrasonic module mounting seat 37 is provided with a threaded hole for the differential bolt 13 to connect. The height of the ultrasonic vibration generating module can be adjusted by the differential bolt 13, and the height of the light guide tool 20 can be accurately adjusted with an adjustment accuracy of 0.1 μm, thereby achieving accurate tool alignment. The differential bolt 13 constitutes an adjustment member. In other embodiments, the ultrasonic vibration generating module can also be driven to move by an electric push rod when the height of the cutting tool needs to be adjusted. The electric push rod constitutes an adjustment member.

[0028] The axial direction of the ultrasonic vibration generating module is the front-to-back direction, and the horn 32, two groups of piezoelectric ceramic stacks, electrode sheets 35 and the back cover 36 are fastened and assembled axially by fastening bolts 38. The dual-channel ultrasonic power supply 30 is connected to the electrode sheets 35 of the ultrasonic vibration generating module through the ultrasonic power supply cable 31 to excite the two groups of piezoelectric ceramic stacks. One group of piezoelectric ceramic stacks is composed of two annular piezoelectric ceramic sheets 33 and two corresponding electrode sheets 35, and the other group of piezoelectric ceramic stacks is composed of four semi-annular piezoelectric ceramic sheets 34 and two corresponding electrode sheets 35. The two semi-annular piezoelectric ceramic sheets 34 are butt-jointed into an annular sheet. The piezoelectric ceramic sheet model is PZT-8, and the axial polarization method is adopted. Based on the d33 working mode with higher working efficiency of piezoelectric ceramics, the first group of piezoelectric ceramic stacks excites the longitudinal vibration mode of the ultrasonic vibration generating module, and the second group of piezoelectric ceramic stacks excites the bending vibration mode of the ultrasonic vibration generating module, so that it presents a longitudinal-bending composite vibration mode to achieve ultrasonic elliptical vibration. Ultrasonic elliptical vibration cutting is used to achieve tool-work separation cutting, which significantly reduces the cutting force. In this embodiment, the frequency of ultrasonic elliptical vibration cutting is 45kHz, the longitudinal ultrasonic amplitude is 2μm, and the bending ultrasonic amplitude is 3μm. By adjusting the voltage value and phase difference of the two-phase excitation signal output by the dual-channel ultrasonic power supply 30, changing the longitudinal ultrasonic amplitude and the bending ultrasonic amplitude, and then accurately controlling the ultrasonic elliptical vibration trajectory output by the light guide tool 20, different processing scenarios and requirements can be met.

[0029] Before assembling the ultrasonic vibration generating module, the light guide tool 20, the horn 32 body, the ultrasonic module mounting seat 37, the annular piezoelectric ceramic sheet 33, the semi-annular piezoelectric ceramic sheet 34, the electrode sheet 35, the back cover 36, the fastening bolts 38, etc. should all be cleaned with anhydrous ethanol and dried using a blast drying oven. The fastening bolts 38 are located at the axis of the ultrasonic vibration generating module. The parts where the fastening bolts 38 contact the back cover 36, the annular piezoelectric ceramic sheet 33, and the electrode sheet 35 should be wrapped with insulating tape. Epoxy resin glue should be applied between the contact surfaces between the back cover 36 and the semi-annular piezoelectric ceramic sheet 34 and the electrode sheet 35. The back cover 36, the annular piezoelectric ceramic sheet 33, the electrode sheet 35, the semi-annular piezoelectric ceramic sheet 34 and the back cover 36 are fastened in sequence along the axial direction using the fastening bolts 38. In this embodiment, a pre-tightening force of 110N is applied to perform thermal insulation aging treatment to improve the stability of the overall structure.

[0030] The length of the ultrasonic vibration generating module is half the wavelength of the longitudinal vibration and two wavelengths of the bending vibration. Among them, the light guide tool 20 is installed at the common wave crest position of the longitudinal vibration and the bending vibration, synthesizing and outputting the elliptical vibration. The ultrasonic module mounting seat 37 at the rear end of the horn 32 is at the common wave node position of the longitudinal vibration and the bending vibration, which can effectively reduce the transmission loss of the ultrasonic vibration.

[0031] The light guide tool 20 includes a cutter head 21 and a cutter seat 22. The cutter head 21 has a cutting edge. The cutter head 21 is a diamond composite sheet. The cutter head 21 is brazed on the cutter seat 22. The cutter seat 22 is installed on the output end of the ultrasonic vibration generating module through high-strength bolts. The output end corresponds to the peak position of the ultrasonic vibration. The cutter seat 22 is fixed on the horn 32. Ultrasonic coupling agent should be applied between the contact surfaces of the two to improve the transmission efficiency of the ultrasonic vibration.

[0032] The laser device includes a laser emitting module 42 for outputting a laser beam 43 to irradiate a workpiece 50 with the laser beam 43 for auxiliary cutting, and laser-assisted cutting technology is used to improve cutting performance. The light-guiding tool 20 is a cutting tool, and the light-guiding tool 20 is a light-guiding diamond tool. The light-guiding tool 20 is provided with an incident surface for the laser beam 43 to be incident on so that the laser beam 43 passes through the light-guiding tool 20 and irradiates the workpiece 50. The light-guiding tool 20 is used to form an optical path, so that the laser is irradiated to the cutting area of ​​the corresponding workpiece 50.

[0033] The laser emitting module 42 is arranged on a side of the ultrasonic vibration generating module away from the light-guiding tool 20. The laser emitting module 42 is arranged on the rear side of the tool holder supporting the base 10 and is located on the rear side of the ultrasonic vibration generating module. A light passage that passes through the front and back is provided in the ultrasonic vibration generating module. The laser beam 43 emitted by the laser emitting module 42 is incident on the light-guiding tool 20 through the light passage in the ultrasonic vibration generating module. The laser beam 43 is avoided by using the light passage in the ultrasonic vibration generating module, which facilitates the arrangement of the laser emitting module 42 and saves space. In other embodiments, the relative position of the cutting tool and the laser emitting module can also be adjusted so that the laser beam of the laser emitting module is directly irradiated on the tool.

[0034] The horn 32 of the ultrasonic vibration generating module has a hollow inner cavity, and the light-guiding tool 20 is installed in the hollow inner cavity of the horn 32 for easy fixed installation. The part of the horn 32 where the tool holder 22 of the light-guiding tool 20 is fixed is the output end of the ultrasonic vibration generating module for outputting ultrasonic vibration to the tool. The piezoelectric ceramic stack is clamped between the ultrasonic module mounting seat 37 and the back cover 36, and the piezoelectric ceramic stack, the electrode sheet 35, the back cover 36 and the fastening bolt 38 are all provided with a center hole. The light passage of the ultrasonic vibration generating module includes the hollow inner cavity of the horn 32 and the center holes of the aforementioned components, so that the laser beam 43 can be incident on the rear end face of the light-guiding diamond tool through the ultrasonic vibration generating module. The axial direction of the ultrasonic vibration generating module is the front-to-back direction, and the laser emission module 42 corresponds to the front-to-back direction of the ultrasonic vibration generating module, saving space. In other embodiments, the light-guiding tool can also be fixed to the front end face of the horn and located outside the hollow inner cavity.

[0035] The laser emitting module 42 is installed on the base of the supporting base 10 through an adjustment device so that the position of the laser emitting module 42 can be adjusted. The adjustment device includes an angle adjustment mechanism 16 and a three-way displacement adjustment mechanism 15. The three-way displacement adjustment mechanism 15 includes a height adjustment mechanism for adjusting the height of the laser emitting module 42 in the up and down direction and a horizontal displacement adjustment mechanism for adjusting the front and rear position and the left and right position of the laser emitting module 42. The angle adjustment mechanism 16 makes the swing axis direction of the laser emitting module 42 in the left and right direction when it is pitched. The height adjustment mechanism is used in conjunction with the angle adjustment mechanism 16 to facilitate the laser beam 43 to align with the incident surface of the light guide tool 20, maintain the laser beam 43 at a set incident position on the light guide tool 20, and enable the laser beam 43 to be incident on the light guide tool 20 from the same set position at different angles. The relative position of the laser emitting module 42 and the ultrasonic vibration generating module is calibrated by the three-way displacement adjustment mechanism to adapt to the installation position deviation of the laser emitting module 42. In other embodiments, the height adjustment mechanism may not be provided as needed, and the laser emitting module may be made to pitch and swing by the angle adjustment mechanism so that the laser beam is aligned with the incident surface of the light guide tool, and the height of the tool is adjusted to correspond to the laser beam. In other embodiments, the horizontal displacement adjustment mechanism may not be provided as needed.

[0036] The three-way displacement adjustment mechanism 15 is located on the upper side of the angle adjustment mechanism 16. The angle adjustment mechanism 16 is installed on the support base 10, so that the angle adjustment mechanism 16 is located at the bottom, which is convenient for adjustment operation and allows the laser emitting module 42 to have a larger swing amplitude. In other embodiments, the angle adjustment mechanism can also be arranged on the upper side of the three-way displacement adjustment mechanism.

[0037] The position of the laser emitting module 42 is adjusted to adapt to the focal position of the laser beam 43 on the tool. The focal point of the laser beam 43 is on the incident surface of the light guide tool 20. The incident surface of the light guide tool 20 is the rear end surface of the cutter head 21. The cutter head 21 is very thin and small in size. The laser beam 43 is conducted inside the cutter head 21. A protective cover 12 is installed on the support base 10 to cover the laser emitting module 42.

[0038] The pitch angle adjustment range of the laser emitting module 42 includes a working position where the laser beam 43 is emitted from the front cutting surface 211 of the cutter head 21 to irradiate the cutting area of ​​the workpiece 50 before the material is removed, and a working position where the laser beam 43 is emitted from the back cutting surface 212 to irradiate the cutting area of ​​the workpiece 50 while the material is being removed. Figure 6 As shown, the laser beam 43 is incident on the rear end face of the cutter head 21 from bottom to top, and is refracted inside the cutter head 21 and then emitted from the back face 212 of the cutter head 21. Figure 7As shown, the laser beam 43 is horizontally incident from a set position on the rear end face of the cutter head 21 along the front-to-back direction. The rear end face of the cutter head 21 is an upper and lower vertical surface. After being refracted and reflected inside the cutter head 21, it is emitted from the front cutting surface 211 of the cutter head 21. The cutter head 21 is provided with a portion for reflecting the laser beam 43 inside it. Figure 6 , Figure 7 The incident position is the same, but the exit position is different, so as to irradiate the cutting area of ​​the workpiece 50 where the material is being removed or the cutting area before the material is removed. In other embodiments, the laser beam 43 may be emitted from the rake face 211 when it enters the cutter head 21 at different incident angles, but the exit position and angle are different, so as to heat different positions of the cutting area before the material is removed. Figure 6 and Figure 7 The workpiece 50 is a relatively flat cylinder, the axial direction of the cylinder is the front-to-back direction, and the tool processes the end face of the cylinder. After the workpiece is clamped on the machine tool, the workpiece is rotated and cut with the tool. The area of ​​the workpiece located above the front cutting face of the tool is the cutting area before cutting the material, that is, the area to be cut.

[0039] The laser device includes a laser emitting module 42, a laser controller 40, and a flexible optical fiber 41. The laser emitting module 42 is connected to the laser controller 40 through the flexible optical fiber 41 and is installed on the adjustment device through bolts. The three-way displacement adjustment mechanism 15 of the adjustment device is a three-way displacement fine-tuning device, that is, a displacement precision fine-tuning slide, which can adjust the up and down position, front and back position, and left and right position of the laser emitting module 42. The angle adjustment mechanism 16 is an angle precision fine-tuning slide. The angle and displacement of the laser emitting module 42 are adjusted by the adjustment device. The laser beam 43 output by the laser emitting module 42 can pass through the light-guiding diamond tool and be emitted from the front blade face 211 and the back blade face 212 of the tool, focusing on the workpiece 50 to be processed material, softening it, and improving the material processability. Among them, the front angle, back angle and geometric structure shape of the light-guiding diamond tool are specially designed to realize the control of the reflection and refraction transmission path of the laser beam 43 in the diamond tool. In this embodiment, the material of the light-guiding diamond tool is single crystal diamond, with a light transmittance of ≥95%, a tool rake angle of 0°, a back angle of 12°, and a cutting edge arc radius of 1mm. The laser emission module 42 can output a continuous laser beam with a power of 1~100W, a wavelength of 1080nm, and a spot diameter of 100μm, and the power of the laser beam 43 can be precisely controlled by the laser controller 40 to soften the material of the workpiece 50 while preventing the material from being burned. The focal length of the laser beam 43 output by the laser emission module 42 is equal to the distance from the output end of the laser emission module 42 to the output end of the ultrasonic vibration generating module. In this embodiment, the focal length of the laser beam 43 is 220mm.

[0040] By adjusting the angle precision fine-tuning slide, changing the position of the laser beam 43 incident on the tool, and then adjusting its reflection and refraction path in the light-guiding diamond tool, the laser beam 43 can be accurately emitted from different parts of the tool, and the temperature field at different positions of the cutting area of ​​the workpiece 50 can be accurately controlled, further improving the machinability of the material, reducing tool wear, and giving the composite auxiliary cutting system higher adaptability, so that it has a significant effect in a variety of processing scenarios. In this embodiment, the adjustment range of the angle precision fine-tuning slide is ±20°, and the adjustment accuracy is 25 seconds.

[0041] In the composite assisted cutting process, ultrasonic elliptical vibration cutting and laser-assisted cutting are carried out simultaneously. Through the tip of the diamond tool, a continuous laser beam is accurately emitted and heats and softens the material, raising its local temperature to a higher level in a very short time before the material is removed, thereby reducing the yield stress and hardness of the material, and changing the cutting deformation from a brittle state to a plastic or quasi-plastic state. The introduction of ultrasonic elliptical vibration cutting transforms the cutting process into an intermittent mode, greatly shortening the friction contact time between the front and rear faces of the tool and the workpiece, effectively reducing tool wear. At the moment of cutting separation, the laser irradiates the processed surface and performs laser heating and tempering treatment to restore the material to its original structural state, significantly reducing sub-surface damage and further improving the quality of the processed surface.

[0042] The cutting system integrates the ultrasonic elliptical vibration cutting system and the laser-assisted cutting system to form a highly integrated composite assisted cutting system, which not only retains the excellent performance of the two cutting technologies, but also ensures the compactness and high integration of the overall structure, thus greatly improving the practicality and convenience in engineering applications. The cutting system can achieve precise control of the temperature field at different positions in the cutting area, providing strong technical support for the optimization of the composite assisted cutting process.

[0043] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments without creative work, or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A laser selective thermal assisted cutting system, comprising a supporting substrate, a light guide tool and a laser device, wherein the laser device comprises a laser emitting module for outputting a laser beam, the laser emitting module is mounted on the supporting substrate through an adjusting device, and the light guide tool is provided with an incident surface for incident laser beams so as to transmit the laser beams through the light guide tool and irradiate the workpiece, wherein the system is characterized in that: The adjustment device includes an angle adjustment mechanism for adjusting the pitch angle of the laser emitting module. The pitch angle of the laser emitting module can be adjusted so that the laser beam can be incident on the incident surface at different angles and the laser beam can be emitted from different positions of the light guide tool to irradiate cutting areas of the workpiece at different positions along the cutting path of the light guide tool.

2. The laser selective thermal assisted cutting system according to claim 1 is characterized in that: The pitch angle adjustment range of the laser emitting module includes a working position for emitting a laser beam from the front cutting edge to irradiate the cutting zone of the workpiece before material is removed, and a working position for emitting a laser beam from the back cutting edge to irradiate the cutting zone of the workpiece while material is being removed.

3. The laser selective thermal assisted cutting system according to claim 1 or 2, characterized in that: The adjusting device comprises a height adjusting mechanism for adjusting the height of the laser emitting module in the up and down directions.

4. The laser selective thermal assisted cutting system according to claim 3 is characterized in that: The adjusting device also includes a horizontal displacement adjusting mechanism for adjusting the front-rear position and the left-right position of the laser emitting module.

5. The laser selective thermal assisted cutting system according to claim 4 is characterized in that: The height adjustment mechanism and the horizontal displacement adjustment mechanism are located on the upper side of the angle adjustment mechanism, and the angle adjustment mechanism is installed on the supporting base.

6. The laser selective thermal assisted cutting system according to claim 1 or 2, characterized in that: The cutting system also includes an ultrasonic vibration device, which includes an ultrasonic vibration generating module. The light-guiding tool is installed at the output end of the ultrasonic vibration generating module to output ultrasonic vibration to the light-guiding tool.

7. The laser selective thermal assisted cutting system according to claim 6 is characterized in that: The laser emission module is arranged on a side of the ultrasonic vibration generating module away from the light guide tool. A through light passage is arranged in the ultrasonic vibration generating module. The laser beam emitted by the laser emission module is incident on the light guide tool through the light passage.

8. The laser selective thermal assisted cutting system according to claim 7, characterized in that: The ultrasonic vibration generating module comprises a horn having a hollow inner cavity, the light passage comprises the hollow inner cavity of the horn, and the light guide tool is installed in the hollow inner cavity of the horn.

9. The laser selective thermal assisted cutting system according to claim 6, characterized in that: The ultrasonic vibration generating module includes an ultrasonic module mounting base which is height-adjustably mounted on a supporting base, one of the ultrasonic module mounting base and the supporting base is provided with a slide groove, and the other is provided with a slide rail which cooperates with the slide groove, and the ultrasonic module mounting base and the supporting base are connected to an adjusting member for driving the ultrasonic module mounting base to slide relative to the supporting base, and a locking member for fixing the ultrasonic module mounting base after the ultrasonic module mounting base slides to a set position.

10. The laser selective thermal assisted cutting system according to claim 9, characterized in that: The ultrasonic module mounting seat is a flange structure, the slide groove is arranged on the end surface of the flange structure, the slide rail is arranged on the supporting base, and the locking member is a locking bolt that passes through the end surface of the flange structure and is connected to the slide rail.

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