Quartz glass processing and positioning method based on machine vision

Abstract

The invention belongs to the technical field of positioning processing, and particularly relates to a quartz glass processing positioning method based on machine vision, which comprises the following steps: image acquisition, image processing, positioning execution control, hole processing and hole processing monitoring. High-precision positioning of hole machining operation is achieved through the machine vision technology, the hole machining efficiency and precision are improved, the phenomena of missed tapping and wrong tapping during manual operation can be avoided, the corresponding hole machining operation is monitored through the hole machining monitoring module so as to judge the stability condition of the corresponding hole machining operation, and the machining precision is improved. Operators can conveniently master the operation abnormal conditions in the hole machining operation process in detail, corresponding improvement measures can be taken in time, it is guaranteed that hole machining operation is conducted safely, stably and efficiently, and the intelligent level and the automation level are high.

Description

Technical Field

[0001] The invention relates to the technical field of positioning processing, and in particular to a quartz glass processing positioning method based on machine vision. Background Art

[0002] Quartz glass is a special industrial technical glass made by melting pure natural quartz (such as crystal, quartz sand). It has a series of excellent physical and chemical properties. Quartz glass can be divided into two categories according to transparency: transparent and opaque. According to purity, it can be divided into three categories: high-purity, ordinary and doped.

[0003] It is mainly used in laboratory equipment, refining equipment for special high-purity products, as well as semiconductors, photovoltaics, optical fibers, electric light sources and other fields. It is an important basic material in the modern information industry and national defense field.

[0004] In the application process of quartz glass, in order to realize the alignment, installation and fixation of quartz glass, it is usually necessary to perform hole processing on the quartz glass. During the positioning and hole opening process, hole processing equipment is required for processing; Traditional hole processing machines rely on manual positioning, with low operating efficiency, and it is difficult to avoid missed tapping and wrong tapping. In addition, it is impossible to monitor the hole processing operation to determine the stability of the corresponding hole processing operation and comprehensively and accurately evaluate the hole processing effect within the corresponding period of time, which is not conducive to operators to make corresponding improvement measures in time, and the level of intelligence and automation is low; In view of the above technical defects, a solution is now proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a quartz glass processing positioning method based on machine vision, which solves the problems of low efficiency of quartz glass processing positioning operation in the prior art, difficulty in avoiding missed tapping and wrong tapping, inability to monitor the quartz glass hole processing operation to judge the stability of the corresponding hole processing operation and comprehensively and accurately evaluate the hole processing effect within the corresponding time period, and low intelligence and automation levels.

[0006] To achieve the above object, the present invention provides the following technical solutions: A quartz glass processing positioning method based on machine vision comprises the following steps: Step 1: The industrial imaging module takes a picture of the workpiece on the machine tool, and transmits the captured image to the image processing module via the processor; Step 2: The image processing module performs preprocessing, feature extraction and edge detection operations on the received image, calculates the position and posture information of the workpiece in the machine tool coordinate system, and sends the image processing results to the positioning control module through the processor; Step 3: The positioning control module calculates the distance and angle that the displacement actuator needs to move according to the image processing results, and controls the displacement actuator to drive the hole processing mechanism to move accordingly; Step 4: monitor the position of the hole processing mechanism in real time. After the hole processing mechanism reaches the specified position, the processor enables the hole processing mechanism to perform the hole processing operation of the workpiece according to the preset program; Step 5: The hole processing monitoring module monitors the corresponding hole processing operation, determines the stability status of the corresponding hole processing operation through analysis, and sends the analysis and judgment information to the display warning terminal through the processor.

[0007] Furthermore, the specific analysis process of the hole processing monitoring module is as follows: A number of detection time points are set during the corresponding hole machining operation process, and the hole machining abnormal time points are determined through analysis, and the ratio of the number of hole machining abnormal time points during the corresponding hole machining operation to the total number of detection time points is calculated to obtain a hole machining abnormal detection value, and the hole machining speed detection values ​​of all detection time points during the corresponding hole machining operation are averaged to obtain a hole machining speed condition value, and the hole machining vibration detection values ​​of all detection time points during the corresponding hole machining operation are averaged to obtain a hole machining vibration condition value; The hole machining monitoring value is obtained by numerically calculating the hole machining abnormality value, the hole machining speed value and the hole machining vibration value, and the hole machining monitoring value is numerically compared with the preset hole machining monitoring threshold. If the hole machining monitoring value exceeds the preset hole machining monitoring threshold, it is judged that the corresponding hole machining operation has poor stability and a hole machining operation abnormality signal is generated; if the hole machining monitoring value does not exceed the preset hole machining monitoring threshold, it is judged that the corresponding hole machining operation has good stability and a hole machining operation optimization signal is generated.

[0008] Furthermore, the specific analysis process to determine the abnormal point in hole processing is as follows: The feed speed of the hole processing mechanism at the corresponding detection time point is collected and the deviation value compared with the set standard feed speed is marked as the hole processing speed detection value, and the vibration data generated by the hole processing mechanism at the corresponding detection time point is collected and marked as the hole processing vibration detection value, and the hole processing speed detection value and the hole processing vibration detection value are numerically compared with the preset hole processing speed detection threshold and the preset hole processing vibration detection threshold, respectively. If the hole processing speed detection value or the hole processing vibration detection value exceeds the corresponding preset threshold, the corresponding detection time point is marked as the hole processing abnormal time point.

[0009] Furthermore, the processor is communicated with the hole processing evaluation module, which is used to set a detection period and analyze the hole processing performance of the workpiece within the detection period, and generate a hole processing evaluation qualified signal or a hole processing evaluation abnormal signal through the analysis, and the hole processing evaluation qualified signal or the hole processing evaluation abnormal signal is sent to the display warning terminal via the processor, and the display warning terminal issues a warning when receiving the hole processing abnormal signal.

[0010] Furthermore, the specific operation process of the hole processing evaluation module is as follows: The recheck inspection value within the detection period is obtained, and the recheck inspection value is numerically compared with a preset recheck inspection threshold value. If the recheck inspection value exceeds the preset recheck inspection threshold value, a hole processing evaluation abnormality signal is generated; If the recheck inspection value does not exceed the preset recheck inspection threshold, the number of times the hole machining operation abnormality signal is generated within the detection period is collected, and the number of times the hole machining operation abnormality signal is generated is calculated by ratio with the total number of hole machining operations within the detection period to obtain the hole machining operation abnormality detection frequency value, and the hole machining evaluation value is obtained by numerically calculating the recheck inspection value and the hole machining operation abnormality detection frequency value; The hole processing evaluation value is numerically compared with the preset hole processing evaluation threshold. If the hole processing evaluation value exceeds the preset hole processing evaluation threshold, a hole processing evaluation abnormal signal is generated; if the hole processing evaluation value does not exceed the preset hole processing evaluation threshold, a hole processing evaluation qualified signal is generated.

[0011] Furthermore, the hole machining assessment module is communicatively connected to the review and inspection module, and after completing the hole machining operation on the corresponding workpiece, the workpiece is quality inspected to identify the existing hole machining defects; the review and inspection module obtains all workpieces that have undergone the hole machining operation within the inspection period, analyzes the quality inspection information of all workpieces to obtain the hole machining review and inspection value, and sends the hole machining review and inspection value to the hole machining assessment module.

[0012] Furthermore, the specific analysis process of the review and inspection module is as follows: The number of workpieces with hole processing defects among the workpieces that have been hole-processed during the detection period is obtained and marked as the workpiece abnormality number inspection value, and the workpiece abnormality number inspection value is calculated by ratio with the total number of workpieces that have been hole-processed during the detection period to obtain the workpiece abnormality number value; The types of all hole processing defects existing in the workpieces that have undergone hole processing operations during the detection period are obtained, and high-frequency defects are determined by analysis, and the number of high-frequency defects during the detection period is obtained and marked as a high-frequency type detection value; The hole machining defect detection value is calculated by ratio with the preset hole machining defect detection threshold of the corresponding type of hole machining defect to obtain the hole machining defect detection value, and the hole machining defect detection values ​​of all types of hole machining defects in the detection period are averaged to obtain the hole machining defect comprehensive evaluation value, and the hole machining defect detection value with the largest value is marked as the hole machining defect detection amplitude value; The hole machining review inspection value is obtained by numerically calculating the workpiece abnormality value, high-frequency type detection value, hole machining defect comprehensive evaluation value and hole machining defect detection amplitude value.

[0013] Further, the specific analysis process to determine the high-frequency defects is as follows: The number of occurrences of the corresponding type of hole machining defects in all workpieces during the detection period is collected and marked as the hole machining defect type detection value, and the hole machining defect type detection value is calculated by ratio of the hole machining defect type detection value to the total number of hole machining operations during the detection period to obtain the hole machining defect detection value; The hole machining defect detection value is numerically compared with a preset hole machining defect detection threshold of a corresponding type of hole machining defect. If the hole machining defect detection value exceeds the corresponding preset hole machining defect detection threshold, the corresponding type of hole machining defect is marked as a high-frequency defect.

[0014] Furthermore, in step one, before the industrial imaging module photographs the workpiece on the machine tool, the imaging impact analysis module determines the degree of influence of the corresponding influencing factors on the imaging quality through analysis, and generates a high-impact signal or a low-impact signal. When a low-impact signal is generated, the industrial imaging module is enabled to take the image, and when a high-impact signal is generated, the display warning module is enabled to issue a corresponding warning.

[0015] Furthermore, the specific analysis process of the image acquisition impact analysis module is as follows: The jitter amplitude of the industrial imaging module is obtained and marked as the imaging jitter detection value, the dust concentration of the shooting environment where the industrial imaging module is located is obtained and marked as the imaging gray detection value, and the deviation value of the light brightness of the environment where the industrial imaging module is located compared to the preset standard brightness is obtained and marked as the imaging illumination detection value; The startup impact value is obtained by numerically calculating the image jitter detection value, the image gray detection value and the image illumination detection value, and the startup impact value is numerically compared with the preset startup impact threshold. If the startup impact value exceeds the preset startup impact threshold, a high impact signal is generated; if the startup impact value does not exceed the preset startup impact threshold, a low impact signal is generated.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, high-precision positioning of hole processing operation is achieved through machine vision technology, which improves the efficiency and accuracy of hole processing, and is conducive to avoiding the occurrence of missed tapping and wrong tapping during manual operation. The corresponding hole processing operation is monitored by the hole processing monitoring module to determine the stability of the corresponding hole processing operation, which is convenient for operators to grasp the abnormal operation conditions of each hole processing operation process in detail, which is conducive to timely making corresponding improvement measures, ensuring the safe, stable and efficient hole processing operation, and having a high level of intelligence and automation; 2. In the present invention, the review and inspection module analyzes the quality inspection information of all workpieces in the detection period to obtain the hole processing review and inspection value, and sends the hole processing review and inspection value to the hole processing evaluation module to provide data support for the analysis process of the hole processing evaluation module to ensure the accuracy of its analysis results. The hole processing evaluation module analyzes the hole processing performance of the workpiece in the detection period, and reminds the operator to inspect and repair the hole processing equipment when an abnormal hole processing evaluation signal is generated, thereby ensuring the subsequent hole processing effect and hole processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings; Figure 1 is a flow chart of the method of the present invention; Figure 2 This is a system block diagram of Embodiment 1 of the present invention; Figure 3 This is a system block diagram of Embodiment 2 of the present invention; Figure 4 This is a system block diagram of Embodiment 3 of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Embodiment 1: Figure 1-2 As shown, a quartz glass processing positioning method based on machine vision proposed by the present invention comprises the following steps: Step 1: The industrial imaging module takes a picture of the workpiece (quartz glass) on the machine tool, and transmits the acquired image to the image processing module through the processor.

[0020] Step 2: The image processing module performs preprocessing, feature extraction, edge detection and other operations on the received image, calculates the position and posture information of the workpiece in the machine tool coordinate system, and sends the image processing results to the positioning control module through the processor.

[0021] Step 3: The positioning control module calculates the distance and angle that the displacement actuator needs to move according to the image processing results, and controls the displacement actuator to drive the hole processing mechanism to move accordingly.

[0022] Step 4: monitor the position of the hole processing mechanism in real time. After the hole processing mechanism reaches the specified position, the processor enables the hole processing mechanism to perform the hole processing operation of the workpiece according to the preset program; The hole processing mechanism is a drilling machine (punching machine) for processing holes in quartz glass; Step 5: The hole processing monitoring module monitors the corresponding hole processing operation, determines the stability of the corresponding hole processing operation through analysis, and sends the analysis and judgment information to the display warning terminal through the processor, so as to grasp the operation abnormalities of each hole processing operation process in detail, which is conducive to timely making corresponding improvement measures to ensure the safety, stability and efficiency of the hole processing operation; the specific analysis process of the hole processing monitoring module is as follows: Several detection time points are set during the corresponding hole processing operation, and the abnormal hole processing time points are determined through analysis, specifically: the feed speed of the hole processing mechanism at the corresponding detection time point is collected and the deviation value compared with the set standard feed speed is marked as the hole processing speed detection value, and the vibration data generated by the hole processing mechanism at the corresponding detection time point is collected and marked as the hole processing vibration detection value; The hole processing speed detection value and the hole processing vibration detection value are numerically compared with the preset hole processing speed detection threshold and the preset hole processing vibration detection threshold, respectively. If the hole processing speed detection value or the hole processing vibration detection value exceeds the corresponding preset threshold, the corresponding detection time point is marked as the hole processing abnormal time point; The hole machining abnormality detection value is obtained by calculating the ratio of the number of hole machining abnormality time points and the total number of detection time points during the corresponding hole machining operation, and the hole machining speed detection values ​​of all detection time points during the corresponding hole machining operation are averaged to obtain the hole machining speed condition value, and the hole machining vibration detection values ​​of all detection time points during the corresponding hole machining operation are averaged to obtain the hole machining vibration condition value; The hole machining abnormality detection value LM, the hole machining speed value LS and the hole machining vibration value LZ are numerically calculated by the formula LP=a1*LM+(a2*LS+a3*LZ) / a1 to obtain the hole machining monitoring value LP, wherein a1, a2 and a3 are preset proportional coefficients with values ​​greater than zero, and the larger the value of the hole machining monitoring value LP is, the worse the operation performance of the corresponding hole machining operation is; The hole processing monitoring value LP is numerically compared with the preset hole processing monitoring threshold. If the hole processing monitoring value LP exceeds the preset hole processing monitoring threshold, it indicates that the operation performance of the corresponding hole processing operation is poor, then the corresponding hole processing operation is judged to have poor stability and a hole processing operation abnormality signal is generated; if the hole processing monitoring value LP does not exceed the preset hole processing monitoring threshold, it indicates that the operation performance of the corresponding hole processing operation is good, then the corresponding hole processing operation is judged to have good stability and a hole processing operation excellent signal is generated.

[0023] Embodiment 2: Figure 3 As shown, the difference between this embodiment and the first embodiment is that the processor is connected to the hole processing evaluation module in communication, and the hole processing evaluation module is used to set the detection period, preferably, the detection period is six hours; and analyze the hole processing performance of the workpiece within the detection period, and generate a hole processing evaluation qualified signal or a hole processing evaluation abnormal signal through analysis; The hole processing evaluation qualified signal or hole processing evaluation abnormal signal is sent to the display warning terminal through the processor. When the display warning terminal receives the hole processing abnormal signal, it issues an early warning to remind the operator to inspect and repair the hole processing equipment in time, so as to ensure the subsequent hole processing effect and hole processing efficiency. The specific operation process of the hole processing evaluation module is as follows: The recheck value FK within the detection period is obtained, and the recheck value FK is numerically compared with the preset recheck threshold. If the recheck value FK exceeds the preset recheck threshold, it indicates that the quality effect of the hole machining operation within the detection period is poor, and a hole machining evaluation abnormality signal is generated; If the recheck value FK does not exceed the preset recheck threshold, the number of times the hole machining operation abnormality signal is generated within the detection period is collected, and the number of times the hole machining operation abnormality signal is generated and the total number of hole machining operations within the detection period are calculated by ratio to obtain the hole machining operation abnormality detection frequency value; The hole processing evaluation value GX is obtained by numerically calculating the verification value FK and the hole processing operation abnormality detection value GP through the formula GX=ep1*FK+ep2*GP; wherein ep1 and ep2 are preset weight coefficients, ep2>ep1>0; and the larger the value of the hole processing evaluation value GX, the more abnormal the hole processing operation performance during the detection period is, and the more timely the cause investigation and analysis and equipment inspection and maintenance are needed; The hole processing evaluation value GX is numerically compared with the preset hole processing evaluation threshold. If the hole processing evaluation value GX exceeds the preset hole processing evaluation threshold, it indicates that the hole processing operation effect during the detection period is poor, and timely cause investigation and analysis and equipment inspection and maintenance are required, then a hole processing evaluation abnormal signal is generated; if the hole processing evaluation value GX does not exceed the preset hole processing evaluation threshold, it indicates that the hole processing operation effect during the detection period is good, then a hole processing evaluation qualified signal is generated.

[0024] Further, the hole processing assessment module is connected to the review and inspection module in communication. After completing the hole processing operation on the corresponding workpiece, the workpiece is quality inspected to identify the existing hole processing defects; the review and inspection module obtains all workpieces that have undergone hole processing operations within the detection period, analyzes the quality inspection information of all workpieces to obtain the hole processing review and inspection value FK, and sends the hole processing review and inspection value FK to the hole processing assessment module, thereby providing data support for the analysis process of the hole processing assessment module and ensuring the accuracy of its analysis results; the specific analysis process of the review and inspection module is as follows: The number of workpieces with hole processing defects among the workpieces that have been hole-processed during the detection period is obtained and marked as the workpiece abnormality number inspection value, and the workpiece abnormality number inspection value is calculated by ratio with the total number of workpieces that have been hole-processed during the detection period to obtain the workpiece abnormality number value; The types of all hole processing defects (such as size defects, positioning defects, etc.) existing in the workpieces that have undergone hole processing operations during the detection period are obtained, the number of occurrences of the corresponding type of hole processing defects in all workpieces during the detection period is collected and marked as the hole processing defect type inspection value, and the hole processing defect type inspection value is calculated by ratio with the total number of hole processing operations during the detection period to obtain the hole processing defect detection value; The hole processing defect detection value is numerically compared with the preset hole processing defect detection threshold of the corresponding type of hole processing defect. If the hole processing defect detection value exceeds the corresponding preset hole processing defect detection threshold, the corresponding type of hole processing defect is marked as a high-frequency defect, and the number of high-frequency defects in the detection period is obtained and marked as a high-frequency type detection value; The hole machining defect detection value is calculated by ratio with the preset hole machining defect detection threshold of the corresponding type of hole machining defect to obtain the hole machining defect detection value, and the hole machining defect detection values ​​of all types of hole machining defects in the detection period are averaged to obtain the hole machining defect comprehensive evaluation value, and the hole machining defect detection value with the largest value is marked as the hole machining defect detection amplitude value; The workpiece abnormality value FN, high-frequency type detection value FB, hole processing defect comprehensive evaluation value FZ and hole processing defect detection amplitude value FW are numerically calculated by the formula FK=ry1*FN+ry2*FB+(ry3*FZ+ry4*FW) / 2 to obtain the hole processing review inspection value FK; among them, ry1, ry2, ry3, and ry4 are preset proportional coefficients, ry1>ry3>ry4>ry2>0; and, the larger the value of the hole processing review inspection value FK, the worse the quality effect of the hole processing operation within the detection period.

[0025] Embodiment 3: Figure 4As shown, the difference between this embodiment and the first and second embodiments is that before the industrial imaging module shoots the workpiece on the machine tool, the imaging impact analysis module determines the degree of influence of the corresponding influencing factors on the imaging quality through analysis, and generates a high-impact signal or a low-impact signal. When a low-impact signal is generated, the industrial imaging module is enabled to shoot and capture images, and when a high-impact signal is generated, the display warning module is enabled to issue a corresponding warning to remind the operator to perform environmental control to ensure the quality of the collected image, which is conducive to ensuring the positioning accuracy of the hole processing operation; the specific analysis process of the imaging impact analysis module is as follows: The jitter amplitude of the industrial imaging module is obtained and marked as the imaging jitter detection value, the dust concentration of the shooting environment where the industrial imaging module is located is obtained and marked as the imaging gray detection value, and the deviation value of the light brightness of the environment where the industrial imaging module is located compared to the preset standard brightness is obtained and marked as the imaging illumination detection value; The image jitter detection value QD, the image gray detection value QF and the image illumination detection value QZ are numerically calculated by the formula QY=(ny1*QD+ny2*QF+ny3*QZ) / 3 to obtain the start-up influence value QY, wherein ny1, ny2 and ny3 are preset proportional coefficients with values ​​greater than zero, and the larger the value of the start-up influence value QY is, the greater the influence of the corresponding influencing factor on the image quality is; The startup impact value QY is numerically compared with the preset startup impact threshold. If the startup impact value QY exceeds the preset startup impact threshold, it indicates that the corresponding influencing factor has a greater impact on the imaging quality, and a high impact signal is generated; if the startup impact value QY does not exceed the preset startup impact threshold, it indicates that the corresponding influencing factor has a smaller impact on the imaging quality, and a low impact signal is generated.

[0026] The working principle of the present invention is as follows: when in use, the workpiece on the machine tool is photographed through the industrial imaging module, the image processing module processes the collected image to obtain the position and posture information of the workpiece in the machine tool coordinate system, and the positioning control module makes the hole processing mechanism move accordingly according to the image processing result. After the hole processing mechanism reaches the specified position, the hole processing mechanism performs the hole processing operation of the workpiece according to the preset program. The high-precision positioning of the hole processing operation is achieved through machine vision technology, which improves the hole processing efficiency and accuracy, and is conducive to avoiding the occurrence of missed tapping and wrong tapping during manual operation. The corresponding hole processing operation is monitored by the hole processing monitoring module to determine the stability status of the corresponding hole processing operation, which is convenient for the operator to grasp the abnormal operation status of each hole processing operation process in detail, which is conducive to timely making corresponding improvement measures to ensure that the hole processing operation is safe, stable and efficient, with a high level of intelligence and automation.

[0027] The above formulas are all dimensionless and numerical calculations. The formula is a formula obtained by collecting a large amount of data and performing software simulation to obtain the most recent real situation. The preset parameters in the formula are set by technicians in this field according to actual conditions. The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that technicians in the relevant technical field can understand and use the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A quartz glass processing positioning method based on machine vision, characterized in that: The following steps are involved: Step 1: The industrial imaging module takes a picture of the workpiece on the machine tool, and transmits the captured image to the image processing module via the processor; Step 2: The image processing module performs preprocessing, feature extraction and edge detection operations on the received image, calculates the position and posture information of the workpiece in the machine tool coordinate system, and sends the image processing results to the positioning control module through the processor; Step 3: The positioning control module calculates the distance and angle that the displacement actuator needs to move according to the image processing results, and controls the displacement actuator to drive the hole processing mechanism to move accordingly; Step 4: monitor the position of the hole processing mechanism in real time. After the hole processing mechanism reaches the specified position, the processor enables the hole processing mechanism to perform the hole processing operation of the workpiece according to the preset program; Step 5: The hole processing monitoring module monitors the corresponding hole processing operation, determines the stability status of the corresponding hole processing operation through analysis, and sends the analysis and judgment information to the display warning terminal through the processor.

2. The method for quartz glass processing and positioning based on machine vision according to claim 1, characterized in that: The specific analysis process of the hole processing monitoring module is as follows: A number of detection time points are set during the corresponding hole machining operation process, and the hole machining abnormal time points are determined through analysis, and the ratio of the number of hole machining abnormal time points during the corresponding hole machining operation to the total number of detection time points is calculated to obtain a hole machining abnormal detection value, and the hole machining speed detection values ​​of all detection time points during the corresponding hole machining operation are averaged to obtain a hole machining speed condition value, and the hole machining vibration detection values ​​of all detection time points during the corresponding hole machining operation are averaged to obtain a hole machining vibration condition value; The hole machining monitoring value is obtained by numerically calculating the hole machining abnormality value, the hole machining speed value and the hole machining vibration value, and the hole machining monitoring value is numerically compared with the preset hole machining monitoring threshold. If the hole machining monitoring value exceeds the preset hole machining monitoring threshold, it is judged that the corresponding hole machining operation has poor stability and a hole machining operation abnormality signal is generated; if the hole machining monitoring value does not exceed the preset hole machining monitoring threshold, it is judged that the corresponding hole machining operation has good stability and a hole machining operation optimization signal is generated.

3. The method for quartz glass processing and positioning based on machine vision according to claim 2, characterized in that: The specific analysis process to determine the abnormal point in hole processing is as follows: The feed speed of the hole processing mechanism at the corresponding detection time point is collected and the deviation value compared with the set standard feed speed is marked as the hole processing speed detection value, and the vibration data generated by the hole processing mechanism at the corresponding detection time point is collected and marked as the hole processing vibration detection value, and the hole processing speed detection value and the hole processing vibration detection value are numerically compared with the preset hole processing speed detection threshold and the preset hole processing vibration detection threshold, respectively. If the hole processing speed detection value or the hole processing vibration detection value exceeds the corresponding preset threshold, the corresponding detection time point is marked as the hole processing abnormal time point.

4. The method for quartz glass processing and positioning based on machine vision according to claim 1, characterized in that: The processor is communicated with the hole processing evaluation module, which is used to set a detection period and analyze the hole processing performance of the workpiece within the detection period. A hole processing evaluation qualified signal or a hole processing evaluation abnormal signal is generated through the analysis, and the hole processing evaluation qualified signal or the hole processing evaluation abnormal signal is sent to the display warning terminal via the processor. The display warning terminal issues a warning when receiving the hole processing abnormal signal.

5. The method for quartz glass processing and positioning based on machine vision according to claim 4, characterized in that: The specific operation process of the hole processing evaluation module is as follows: The recheck inspection value within the detection period is obtained, and the recheck inspection value is numerically compared with a preset recheck inspection threshold value. If the recheck inspection value exceeds the preset recheck inspection threshold value, a hole processing evaluation abnormality signal is generated; If the recheck inspection value does not exceed the preset recheck inspection threshold, the number of times the hole machining operation abnormality signal is generated within the detection period is collected, and the number of times the hole machining operation abnormality signal is generated is calculated by ratio with the total number of hole machining operations within the detection period to obtain the hole machining operation abnormality detection frequency value, and the hole machining evaluation value is obtained by numerically calculating the recheck inspection value and the hole machining operation abnormality detection frequency value; The hole processing evaluation value is numerically compared with the preset hole processing evaluation threshold. If the hole processing evaluation value exceeds the preset hole processing evaluation threshold, a hole processing evaluation abnormal signal is generated; if the hole processing evaluation value does not exceed the preset hole processing evaluation threshold, a hole processing evaluation qualified signal is generated.

6. The method for quartz glass processing and positioning based on machine vision according to claim 4, characterized in that: The hole processing assessment module is in communication connection with the review inspection module, and after completing the hole processing operation on the corresponding workpiece, the workpiece is quality inspected to identify the existing hole processing defects; The review and inspection module obtains all workpieces that have undergone hole machining operations within the inspection period, performs analysis based on the quality inspection information of all workpieces to obtain hole machining review and inspection values, and sends the hole machining review and inspection values ​​to the hole machining evaluation module.

7. The method for quartz glass processing and positioning based on machine vision according to claim 6, characterized in that: The specific analysis process of the review and inspection module is as follows: The number of workpieces with hole processing defects among the workpieces that have been hole-processed during the detection period is obtained and marked as the workpiece abnormality number inspection value, and the workpiece abnormality number inspection value is calculated by ratio with the total number of workpieces that have been hole-processed during the detection period to obtain the workpiece abnormality number value; The types of all hole processing defects existing in the workpieces that have undergone hole processing operations during the detection period are obtained, and high-frequency defects are determined by analysis, and the number of high-frequency defects during the detection period is obtained and marked as a high-frequency type detection value; The hole machining defect detection value is calculated by ratio with the preset hole machining defect detection threshold of the corresponding type of hole machining defect to obtain the hole machining defect detection value, and the hole machining defect detection values ​​of all types of hole machining defects in the detection period are averaged to obtain the hole machining defect comprehensive evaluation value, and the hole machining defect detection value with the largest value is marked as the hole machining defect detection amplitude value; The hole machining review inspection value is obtained by numerically calculating the workpiece abnormality value, high-frequency type detection value, hole machining defect comprehensive evaluation value and hole machining defect detection amplitude value.

8. The method for quartz glass processing and positioning based on machine vision according to claim 7, characterized in that: The specific analysis process to determine high-frequency defects is as follows: The number of occurrences of the corresponding type of hole machining defects in all workpieces during the detection period is collected and marked as the hole machining defect type detection value, and the hole machining defect type detection value is calculated by ratio of the hole machining defect type detection value to the total number of hole machining operations during the detection period to obtain the hole machining defect detection value; The hole machining defect detection value is numerically compared with a preset hole machining defect detection threshold of a corresponding type of hole machining defect. If the hole machining defect detection value exceeds the corresponding preset hole machining defect detection threshold, the corresponding type of hole machining defect is marked as a high-frequency defect.

9. The method for quartz glass processing and positioning based on machine vision according to claim 1, characterized in that: In step one, before the industrial imaging module photographs the workpiece on the machine tool, the imaging impact analysis module determines the degree of influence of the corresponding influencing factors on the imaging quality through analysis, and generates a high-impact signal or a low-impact signal. When a low-impact signal is generated, the industrial imaging module is enabled to take the image, and when a high-impact signal is generated, the display warning module is enabled to issue a corresponding warning.

10. The method for quartz glass processing and positioning based on machine vision according to claim 9, characterized in that: The specific analysis process of the image acquisition impact analysis module is as follows: The jitter amplitude of the industrial imaging module is obtained and marked as the imaging jitter detection value, the dust concentration of the shooting environment where the industrial imaging module is located is obtained and marked as the imaging gray detection value, and the deviation value of the light brightness of the environment where the industrial imaging module is located compared to the preset standard brightness is obtained and marked as the imaging illumination detection value; The startup impact value is obtained by numerically calculating the image jitter detection value, the image gray detection value and the image illumination detection value, and the startup impact value is numerically compared with the preset startup impact threshold. If the startup impact value exceeds the preset startup impact threshold, a high impact signal is generated; If the startup impact value does not exceed the preset startup impact threshold, a low impact signal is generated.

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