Thermal management integration module, thermal management integration system and vehicle

Abstract

The invention provides a thermal management integration module, a thermal management integration system and a vehicle, and relates to the technical field of thermal management systems. The flow channel plate is located on the base plate, the base plate and the flow channel plate are provided with at least one of a high-pressure connector and a low-pressure connector, and the flow channel plate is provided with a high-pressure refrigerant flow channel for circulating a high-pressure refrigerant; the heat exchange assembly communicates with the runner plate through the high-pressure connector; the heat exchange assembly communicates with the jump pipe through the low-pressure connector, the jump pipe is provided with a low-pressure refrigerant flow channel for circulating a low-pressure refrigerant, and the low-pressure refrigerant flow channel communicates with the high-pressure refrigerant flow channel to form a heat exchange loop so as to conduct heat exchange operation on the heat exchange assembly; the problem that in the prior art, due to the fact that refrigerant flow channels are all arranged on a flow channel plate, heat loss is serious during working is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal management systems, and in particular to a thermal management integrated module, a thermal management integrated system and a vehicle. Background Art

[0002] With the application of air-conditioning heat pump systems in new energy vehicles, the thermal management system has many components and their layout is scattered, resulting in complex layout, difficult assembly and low assembly efficiency. The emergence of thermal management integrated modules has solved the current problem of scattered parts, but the refrigerant flow channels of the current thermal management integrated modules are all arranged on the flow channel plates, and the temperature difference between the high and low pressure sides can reach 80°C. The heat loss is serious during operation, affecting the heat exchange effect, and the current thermal management integrated module flow channel plates are all made of aluminum alloy and are heavy. Summary of the invention

[0003] The main purpose of the present invention is to provide a thermal management integrated module, a thermal management integrated system and a vehicle to solve the problem in the prior art that the refrigerant flow channels are arranged on the flow channel plate, resulting in serious heat loss during operation.

[0004] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, a thermal management integrated module is provided. The thermal management integrated module comprises: a substrate; a flow channel plate, the flow channel plate is located on the substrate, at least one of a high-pressure interface and a low-pressure interface is provided on the substrate and the flow channel plate, and the flow channel plate has a high-pressure refrigerant flow channel for circulating high-pressure refrigerant; a heat exchange component, the heat exchange component is connected to the flow channel plate through the high-pressure interface; a jump pipe, the heat exchange component is connected to the jump pipe through the low-pressure interface, the jump pipe has a low-pressure refrigerant flow channel for circulating low-pressure refrigerant, and the low-pressure refrigerant flow channel is connected to the high-pressure refrigerant flow channel to form a heat exchange circuit to perform heat exchange operations on the heat exchange component.

[0005] Furthermore, the high-pressure interface includes a first interface, which is arranged on the substrate and is used to connect to the exhaust port of the compressor, and the compressor is used to compress high-temperature and high-pressure gaseous refrigerant.

[0006] Furthermore, the heat exchange component includes: a heat exchanger component, the heat exchanger component is connected to at least one of the high-pressure interface and the low-pressure interface, and the heat exchanger component is located downstream of the compressor; a sensor component, the sensor component is arranged on the flow channel plate and the jump pipe, the sensor component is used to collect the temperature and pressure in the high-pressure refrigerant flow channel, and the sensor component is used to collect the temperature and pressure in the low-pressure refrigerant flow channel; a valve assembly, the valve assembly is connected to the high-pressure interface, at least part of the valve assembly is arranged at the boundary between the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel, and the valve assembly is used to throttle the high-pressure refrigerant to low-pressure refrigerant.

[0007] Furthermore, the high-pressure interface also includes a second interface and a third interface that are adjacently arranged, and the heat exchanger assembly includes: a first condenser, which is arranged downstream of the compressor and is connected to the exhaust port of the compressor; a second condenser, which is arranged downstream of the first condenser, the inlet of the second condenser is connected to the second interface, and the outlet of the second condenser is connected to the third interface. The first condenser and the second condenser are used to condense high-temperature and high-pressure gaseous refrigerant into medium-low-temperature and high-pressure liquid refrigerant.

[0008] Furthermore, the valve assembly includes: a first electronic expansion valve, the first electronic expansion valve is arranged on the flow channel plate, and the first electronic expansion valve is located between the first condenser and the second condenser.

[0009] Furthermore, the valve assembly also includes: a second electronic expansion valve, which is arranged on the flow channel plate and located downstream of the second condenser; a third electronic expansion valve, which is arranged on the flow channel plate and located downstream of the second condenser. The liquid refrigerant of medium-low temperature and high pressure condensed by the second condenser is throttled into a low-temperature and low-pressure gas-liquid mixed refrigerant through the second electronic expansion valve and the third electronic expansion valve.

[0010] Furthermore, the low-pressure interface includes a fourth interface and a fifth interface, and the fourth interface and the fifth interface are arranged on the flow channel plate, and the fourth interface is arranged close to the second electronic expansion valve. The heat exchanger assembly also includes: an evaporator, and the evaporator is arranged downstream of the second electronic expansion valve. The inlet of the evaporator is connected to the fourth interface, and the outlet of the evaporator is connected to the fifth interface. The low-temperature and low-pressure gas-liquid mixed refrigerant after throttling by the second electronic expansion valve evaporates into a low-temperature and low-pressure gaseous refrigerant through the evaporator.

[0011] Furthermore, the low-pressure interface also includes a sixth interface and a seventh interface, which are arranged on the substrate, and the heat exchanger assembly also includes: a refrigeration device, which is arranged downstream of the third electronic expansion valve, the inlet of the refrigeration device is connected to the sixth interface, and the outlet of the refrigeration device is connected to the seventh interface. The jump pipe includes a first jump pipe, the first end of the first jump pipe is arranged to be connected to the third electronic expansion valve, and the second end of the first jump pipe is connected to the sixth interface; wherein, the low-temperature and low-pressure gas-liquid mixed refrigerant after throttling by the third electronic expansion valve flows into the refrigeration device through the first jump pipe, and evaporates into a low-temperature and low-pressure gaseous refrigerant.

[0012] Further, the jumper includes: a second jumper, a first end of the second jumper is connected to the seventh interface; a third jumper, a first end of the third jumper is connected to the outlet of the evaporator, and a second end of the third jumper is connected to the second end of the second jumper; a fourth jumper, a first end of the fourth jumper is connected to the second end of the third jumper and the second end of the second jumper, a second end of the fourth jumper is connected to the inlet of the gas-liquid separator, and the outlet of the gas-liquid separator is connected to the compressor inlet 8 of the compressor.

[0013] Furthermore, the sensing assembly includes: at least two temperature sensors, one temperature sensor is arranged between the compressor and the first condenser, and the other temperature sensor is arranged at the outlet of the evaporator; at least two high-pressure sensors, one high-pressure sensor is arranged downstream of the first condenser, and the other high-pressure sensor is arranged downstream of the second condenser; a low-pressure sensor, and the low-pressure sensor is arranged downstream of the refrigeration equipment.

[0014] According to another aspect of the present invention, a thermal management integrated system is provided, including a thermal management integrated module, and the thermal management integrated module is the thermal management integrated module of the above embodiment.

[0015] According to another aspect of the present invention, a vehicle is provided, comprising a thermal management integrated system, wherein the thermal management integrated system is the thermal management integrated system of the above embodiment.

[0016] By applying the technical solution of the present invention, a flow channel plate and a jump pipe are arranged on the substrate, the flow channel plate has a high-pressure refrigerant flow channel, the jump pipe 40 has a low-pressure refrigerant flow channel, and a heat exchange component is arranged to throttle the high-pressure refrigerant to a low-pressure refrigerant, so that the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel are separated, thereby reducing heat loss during the operation of the refrigerant and improving the heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 It shows a schematic structural diagram of a first embodiment of a thermal management integrated module according to the present invention;

[0019] Figure 2 It shows a schematic structural diagram of a second embodiment of a thermal management integrated module according to the present invention;

[0020] Figure 3 A schematic structural diagram of a third embodiment of a thermal management integrated module according to the present invention is shown;

[0021] Figure 4 A schematic structural diagram of a fourth embodiment of a thermal management integrated module according to the present invention is shown;

[0022] Figure 5 A schematic structural diagram of a fifth embodiment of a thermal management integrated module according to the present invention is shown.

[0023] The above drawings include the following reference numerals:

[0024] 10. Substrate;

[0025] 20. Runner plate;

[0026] 211, first interface; 212, second interface; 213, third interface; 214, fourth interface; 215, fifth interface; 216, sixth interface; 217, seventh interface; 218, compressor inlet;

[0027] 30. Heat exchange components;

[0028] 31. heat exchanger assembly; 311. first condenser; 312. second condenser; 313. evaporator; 314. refrigeration equipment;

[0029] 32. Sensing component; 321. Temperature sensor; 322. High pressure sensor; 323. Low pressure sensor;

[0030] 33. Valve assembly; 331. First electronic expansion valve; 332. Second electronic expansion valve; 333. Third electronic expansion valve;

[0031] 40, jump pipe; 41, first jump pipe; 42, second jump pipe; 43, third jump pipe; 44, fourth jump pipe;

[0032] 50. Compressor;

[0033] 60. Gas-liquid separator. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0037] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for the sake of clarity, the thickness of the layers and regions may be enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0038] Combination Figures 1 to 5 As shown, according to a specific embodiment of the present invention, a thermal management integrated module is provided.

[0039] Specifically, Figure 1 As shown, the thermal management integrated module includes: a substrate 10; a flow channel plate 20, the flow channel plate 20 is located on the substrate 10, and at least one of a high-pressure interface and a low-pressure interface is provided on the substrate 10 and the flow channel plate 20, and the flow channel plate 20 has a high-pressure refrigerant flow channel for circulating high-pressure refrigerant; a heat exchange component 30, the heat exchange component 30 is connected with the flow channel plate 20 through the high-pressure interface; a jump pipe 40, the heat exchange component 30 is connected with the jump pipe 40 through the low-pressure interface, the jump pipe 40 has a low-pressure refrigerant flow channel for circulating low-pressure refrigerant, and the low-pressure refrigerant flow channel is connected with the high-pressure refrigerant flow channel to form a heat exchange circuit to perform heat exchange operations on the heat exchange component 30.

[0040] In this embodiment, a flow channel plate 20 and a jump pipe 40 are arranged on the substrate, the flow channel plate 20 has a high-pressure refrigerant flow channel, the jump pipe 40 has a low-pressure refrigerant flow channel, and a heat exchange component 30 is arranged to throttle the high-pressure refrigerant to a low-pressure refrigerant, so that the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel are separated, thereby reducing heat loss during the operation of the refrigerant and improving the heat exchange efficiency.

[0041] Furthermore, the high-pressure interface includes a first interface 211, which is disposed on the substrate 10 and is used to connect to the exhaust port of the compressor 50, and the compressor 50 is used to compress a high-temperature and high-pressure gaseous refrigerant. The compressor 50 is an electric compressor.

[0042] Furthermore, the heat exchange assembly 30 includes: a heat exchanger assembly 31, the heat exchanger assembly 31 is connected to at least one of the high-pressure interface and the low-pressure interface, and the heat exchanger assembly 31 is located downstream of the compressor 50; a sensor assembly 32, the sensor assembly 32 is arranged on the flow channel plate 20 and the jump pipe 40, the sensor assembly 32 is used to collect the temperature and pressure in the high-pressure refrigerant flow channel, and the sensor assembly 32 is used to collect the temperature and pressure in the low-pressure refrigerant flow channel; a valve assembly 33, the valve assembly 33 is connected to the high-pressure interface, at least part of the valve assembly 33 is arranged at the boundary between the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel, and the valve assembly 33 is used to throttle the high-pressure refrigerant to a low-pressure refrigerant.

[0043] Specifically, the heat exchanger assembly 31 is located downstream of the compressor 50, which helps to utilize the high-pressure heat energy generated by the compressor and improve the energy efficiency of the entire heat exchange system. The sensor assembly 32 is arranged on the flow channel plate 20 and the jump pipe 40, and can accurately monitor the temperature and pressure in the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel. This real-time monitoring helps to control the operation of the system and ensure that the refrigerant works in the best state. The valve assembly 33 is connected to the high-pressure interface and is arranged at the boundary between the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel, and is used to throttle the high-pressure refrigerant to a low-pressure refrigerant. This precise throttling control helps to maintain the refrigerant flow balance in the system and improve the refrigeration efficiency. Through the coordinated work of the sensor assembly 32 and the valve assembly 33, the pressure and temperature in the system can be adjusted in real time, thereby improving the stability and reliability of the system.

[0044] Furthermore, the high-pressure interface also includes a second interface 212 and a third interface 213 that are adjacently arranged, and the heat exchanger assembly 31 includes: a first condenser 311, which is arranged downstream of the compressor 50, and the first condenser 311 is connected to the exhaust port of the compressor 50; a second condenser 312, which is arranged downstream of the first condenser 311, the inlet of the second condenser 312 is connected to the second interface 212, and the outlet of the second condenser 312 is connected to the third interface 213, and the first condenser 311 and the second condenser 312 are used to condense high-temperature and high-pressure gaseous refrigerant into medium-low-temperature and high-pressure liquid refrigerant.

[0045] Specifically, by setting up two condensers, multi-stage condensation of high-temperature and high-pressure gaseous refrigerant can be achieved, the condensation efficiency can be improved, and the refrigerant can be more stably converted into a medium-low-temperature and high-pressure liquid. The first condenser and the second condenser can be controlled independently, and their respective working states can be adjusted according to actual needs to achieve more precise temperature control. During the condensation process, as the refrigerant temperature decreases, its pressure will also decrease accordingly, which helps to reduce the pressure loss in the system and improve the overall efficiency of the system.

[0046] Furthermore, the valve assembly 33 includes: a first electronic expansion valve 331, which is disposed on the flow channel plate 20 and is located between the first condenser 311 and the second condenser 312. The first electronic expansion valve 331 is used to further throttle the high-pressure refrigerant.

[0047] Furthermore, the valve assembly 33 also includes: a second electronic expansion valve 332, which is arranged on the flow channel plate 20 and is located downstream of the second condenser 312; a third electronic expansion valve 333, which is arranged on the flow channel plate 20 and is located downstream of the second condenser 312. The liquid refrigerant of medium-low temperature and high pressure condensed by the second condenser 312 is throttled into a low-temperature and low-pressure gas-liquid mixed refrigerant through the second electronic expansion valve 332 and the third electronic expansion valve 333.

[0048] Among them, the electronic expansion valve adjusts the flow of refrigerant through electronic control, thereby achieving precise control of system temperature and pressure. In the thermal management integrated module, the electronic expansion valve can accurately adjust the flow of refrigerant according to the actual needs of the system to achieve precise control of temperature and pressure. By accurately controlling the flow of refrigerant, the electronic expansion valve can reduce the amount of refrigerant circulating in the system, thereby reducing energy consumption and improving the overall energy efficiency of the system. The electronic expansion valve can quickly respond to external temperature and pressure changes and adjust the flow of refrigerant in time to keep the system running stably.

[0049] Furthermore, the low-pressure interface includes a fourth interface 214 and a fifth interface 215, and the fourth interface 214 and the fifth interface 215 are arranged on the flow channel plate 20, and the fourth interface 214 is arranged close to the second electronic expansion valve 332. The heat exchanger assembly 31 also includes: an evaporator 313, and the evaporator 313 is arranged downstream of the second electronic expansion valve 332. The inlet of the evaporator 313 is connected to the fourth interface 214, and the outlet of the evaporator 313 is connected to the fifth interface 215. The low-temperature and low-pressure gas-liquid mixed refrigerant after throttling by the second electronic expansion valve 332 evaporates into a low-temperature and low-pressure gaseous refrigerant through the evaporator 313.

[0050] Specifically, by arranging the evaporator 313 downstream of the second electronic expansion valve 332, it can be ensured that the gas-liquid mixed refrigerant is fully evaporated when flowing through the evaporator 313, thereby improving the heat exchange efficiency. The second electronic expansion valve 332 can accurately control the refrigerant flow rate passing through, and then control the evaporation rate and pressure in the evaporator 313, thereby achieving precise control of the refrigeration system. By connecting the inlet of the evaporator with the fourth interface and the outlet with the fifth interface, the flow path of the refrigerant can be optimized, the pressure loss can be reduced, and the overall performance of the system can be improved. By arranging the fourth interface and the fifth interface on the flow channel plate, space can be saved, making the entire system more compact and convenient for installation and maintenance.

[0051] In some optional embodiments, the size and shape of the evaporator can be adjusted according to different application requirements to adapt to different refrigeration requirements.

[0052] Furthermore, the low-pressure interface also includes a sixth interface 216 and a seventh interface 217, and the sixth interface 216 and the seventh interface 217 are arranged on the substrate 10. The heat exchanger assembly 31 also includes: a refrigeration device 314, and the refrigeration device 314 is arranged downstream of the third electronic expansion valve 333. The inlet of the refrigeration device 314 is connected to the sixth interface 216, and the outlet of the refrigeration device 314 is connected to the seventh interface 217. The jump pipe 40 includes a first jump pipe 41, and the first end of the first jump pipe 41 is arranged to be connected to the third electronic expansion valve 333, and the second end of the first jump pipe 41 is connected to the sixth interface 216; wherein, the low-temperature and low-pressure gas-liquid mixed refrigerant after throttling by the third electronic expansion valve 333 flows into the refrigeration device 314 through the first jump pipe 41, and evaporates into a low-temperature and low-pressure gaseous refrigerant.

[0053] Specifically, this arrangement allows the low-pressure and low-temperature gas-liquid mixed refrigerant that has been throttled by the third electronic expansion valve 333 to flow into the refrigeration equipment 314 using the first jump pipe 41, thereby separating the low-pressure refrigerant flow channel and the high-pressure refrigerant flow channel from the third electronic expansion valve 333, reducing the heat loss of the refrigerant and improving the working effect.

[0054] Further, the jump pipe 40 includes: a second jump pipe 42, a first end of the second jump pipe 42 is connected to the seventh interface 217; a third jump pipe 43, a first end of the third jump pipe 43 is connected to the outlet of the evaporator 313, and a second end of the third jump pipe 43 is connected to the second end of the second jump pipe 42; a fourth jump pipe 44, a first end of the fourth jump pipe 44 is connected to the second end of the third jump pipe 43 and the second end of the second jump pipe 42, a second end of the fourth jump pipe 44 is connected to the inlet of the gas-liquid separator 60, and the outlet of the gas-liquid separator 60 is connected to the compressor inlet 218 of the compressor 50.

[0055] Specifically, at least one of the first jumper pipe 41 , the second jumper pipe 42 , the third jumper pipe 43 , and the fourth jumper pipe 44 includes a jumper pipe and a flange joint, and the jumpers are connected through the flange joint, so that the connection between the jumpers is flexible.

[0056] In this embodiment, four jumper tubes are provided. In other embodiments, the number of jumper tubes is not limited thereto, and may also be five, six, etc.

[0057] Furthermore, the sensor assembly 32 includes: at least two temperature sensors 321, one temperature sensor 321 is arranged between the compressor 50 and the first condenser 311, and the other temperature sensor 321 is arranged at the outlet of the evaporator 313; at least two high-pressure sensors 322, one high-pressure sensor 322 is arranged downstream of the first condenser 311, and the other high-pressure sensor 322 is arranged downstream of the second condenser 312; a low-pressure sensor 323, and the low-pressure sensor 323 is arranged downstream of the refrigeration equipment 314.

[0058] Specifically, the temperature sensor 321 located between the compressor 50 and the first condenser 311 is used to collect the temperature of the refrigerant in the high-pressure refrigerant flow channel, and the temperature sensor 321 at the outlet of the evaporator 313 is used to collect the temperature of the refrigerant in the low-pressure refrigerant flow channel. The high-pressure sensor 322 located downstream of the first condenser 311 is used to collect the pressure of the high-pressure refrigerant after condensation by the first condenser 311, and the high-pressure sensor 322 located downstream of the second condenser 312 is used to collect the pressure of the high-pressure refrigerant after condensation by the second condenser 312, with a pressure difference between the two, and the low-pressure sensor is used to collect the pressure of the low-pressure refrigerant.

[0059] In some optional embodiments, the thermal management integrated module has a cooling mode, a heat pump mode and a dehumidification mode.

[0060] like Figure 2 , Figure 3 As shown, when the thermal management integrated module is in the cooling mode, the compressor 50 compresses a high-temperature and high-pressure gaseous refrigerant, which is condensed into a medium-low-temperature and high-pressure liquid refrigerant through the first condenser 311 and the second condenser 312. One of the branches is throttled to a low-temperature and low-pressure gas-liquid mixed refrigerant through the second electronic expansion valve 332, evaporated into a low-temperature and low-pressure gaseous refrigerant through the evaporator 313, and finally returned to the compressor 50 through the gas-liquid separator 60. Another branch is throttled to a low-temperature and low-pressure gas-liquid mixed refrigerant through the third electronic expansion valve 333, evaporated into a low-temperature and low-pressure gaseous refrigerant through the refrigeration equipment 314, and finally returned to the compressor 50 through the gas-liquid separator 60.

[0061] Among them, the exhaust port of the compressor 50 is connected to the first interface 211, flows to the second interface 212 through the integrated module flow channel, flows through the second condenser to the third interface 213, passes through the high-pressure sensor 322, one of the branches passes through the third electronic expansion valve 333, flows through the sixth interface 216, the refrigeration equipment 314 and the seventh interface 217, flows through the second jump pipe 42 and the fourth jump pipe 44 through the gas-liquid separator 60, and finally returns to the compressor 50 through the compressor inlet 218, wherein another branch passes through the second electronic expansion valve 332, flows through the evaporator 313, the fifth interface 215 and the third jump pipe 43, flows through the gas-liquid separator 60 through the fourth jump pipe 44, and finally returns to the compressor 50 through the compressor inlet 218.

[0062] like Figure 4 As shown, when the thermal management integrated module is in the heat pump mode, the compressor 50 compresses a high-temperature and high-pressure gaseous refrigerant, which is condensed into a medium-low-temperature and high-pressure liquid refrigerant through the first condenser 311, throttled into a low-temperature and low-pressure gas-liquid mixed refrigerant through the first electronic expansion valve 331, evaporated into a low-temperature and low-pressure gaseous refrigerant through the second condenser 312, further evaporated into a low-temperature and low-pressure gaseous refrigerant through the refrigeration equipment 314, and finally returned to the compressor 50 through the gas-liquid separator 60.

[0063] Among them, the exhaust port of the compressor 50 is connected to the first interface 211, flows to the second interface 212 through the integrated module flow channel, flows through the second condenser to the third interface 213, passes through the high-pressure sensor 322, one of the branches passes through the third electronic expansion valve 333, flows through the sixth interface 216, the refrigeration equipment 314 and the seventh interface 217, flows through the second jump pipe 42 and the fourth jump pipe 44 through the gas-liquid separator 60, and finally returns to the compressor 50 through the compressor inlet 218.

[0064] like Figure 5 As shown, when the thermal management integrated module is in the dehumidification mode, the compressor 50 compresses a medium-low temperature and high-pressure gaseous refrigerant, which is condensed into a medium-low temperature and high-pressure liquid refrigerant through the first condenser 311, throttled into a low-temperature and low-pressure gas-liquid mixed refrigerant through the second electronic expansion valve 332, evaporated into a low-temperature and low-pressure gaseous refrigerant through the evaporator 313, and finally returned to the compressor 50 through the gas-liquid separator 60.

[0065] Among them, the exhaust port of the compressor 50 is connected to the first interface 211, flows to the second interface 212 through the integrated module flow channel, flows through the second condenser to the third interface 213, passes through the second electronic expansion valve 332, flows through the evaporator 313, the fifth interface 215 and the third jump pipe 43, flows through the fourth jump pipe 44 through the gas-liquid separator 60, and finally returns to the compressor 50 through the compressor inlet 218.

[0066] According to another aspect of the present invention, a thermal management integrated system is provided, including a thermal management integrated module, and the thermal management integrated module is the thermal management integrated module of the above embodiment. The thermal management integrated module includes: a substrate 10; a flow channel plate 20, the flow channel plate 20 is located on the substrate 10, and at least one of a high-pressure interface and a low-pressure interface is provided on the substrate 10 and the flow channel plate 20, and the flow channel plate 20 has a high-pressure refrigerant flow channel for circulating high-pressure refrigerant; a heat exchange component 30, the heat exchange component 30 is connected to the flow channel plate 20 through the high-pressure interface; a jump pipe 40, the heat exchange component 30 is connected to the jump pipe 40 through the low-pressure interface, and the jump pipe 40 has a low-pressure refrigerant flow channel for circulating low-pressure refrigerant, and the low-pressure refrigerant flow channel is connected to the high-pressure refrigerant flow channel to form a heat exchange circuit to perform heat exchange operations on the heat exchange component 30. By setting a flow channel plate 20 and a jump pipe 40 on the substrate, the flow channel plate 20 has a high-pressure refrigerant flow channel, the jump pipe 40 has a low-pressure refrigerant flow channel, and a heat exchange component 30 is set to throttle the high-pressure refrigerant to a low-pressure refrigerant, so that the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel are separated, thereby reducing heat loss during the operation of the refrigerant and improving the heat exchange efficiency.

[0067] According to another aspect of the present invention, a vehicle is provided, including a thermal management integrated system, which is the thermal management integrated system of the above-mentioned embodiment. The thermal management integrated module includes: a substrate 10; a flow channel plate 20, the flow channel plate 20 is located on the substrate 10, and at least one of a high-pressure interface and a low-pressure interface is provided on the substrate 10 and the flow channel plate 20, and the flow channel plate 20 has a high-pressure refrigerant flow channel for circulating high-pressure refrigerant; a heat exchange component 30, the heat exchange component 30 is connected to the flow channel plate 20 through the high-pressure interface; a jump pipe 40, the heat exchange component 30 is connected to the jump pipe 40 through the low-pressure interface, and the jump pipe 40 has a low-pressure refrigerant flow channel for circulating low-pressure refrigerant, and the low-pressure refrigerant flow channel is connected to the high-pressure refrigerant flow channel to form a heat exchange circuit to perform heat exchange operations on the heat exchange component 30. By setting a flow channel plate 20 and a jump pipe 40 on the substrate, the flow channel plate 20 has a high-pressure refrigerant flow channel, the jump pipe 40 has a low-pressure refrigerant flow channel, and a heat exchange component 30 is set to throttle the high-pressure refrigerant to a low-pressure refrigerant, so that the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel are separated, thereby reducing heat loss during the operation of the refrigerant and improving the heat exchange efficiency.

[0068] In some optional embodiments, the flow channel plate 20 in the thermal management integrated module is injection molded with pre-embedded fixing nuts, and the flow channel plate 20 is made of PPS material, thereby reducing the weight of the thermal management integrated module. At the same time, it is more heat-insulating than metal materials, reduces heat loss during operation, and improves heat exchange efficiency.

[0069] In some optional embodiments, the substrate 10 in the thermal management integrated module is made of PPS material to reduce the weight of the thermal management integrated module.

[0070] In some optional embodiments, the pipe of the jumper 40 is made of nylon material, which reduces the weight of the thermal management integrated module, reduces heat loss during operation, and improves heat exchange efficiency;

[0071] In some optional embodiments, the flange joint of the jump pipe 40 is made of PPS injection molding to reduce the weight of the thermal management integrated module, reduce heat loss during operation, and improve heat exchange efficiency. The pipeline of the jump pipe 40 and the flange joint of the jump pipe 40 are hot-melt welded.

[0072] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0073] In addition to the above, it should be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of the present invention.

[0074] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0075] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A thermal management integrated module, characterized in that: include: base(10); A flow channel plate (20), the flow channel plate (20) being located on the substrate (10), the substrate (10) and the flow channel plate (20) being provided with at least one of a high-pressure interface and a low-pressure interface, and the flow channel plate (20) having a high-pressure refrigerant flow channel for circulating a high-pressure refrigerant; A heat exchange component (30), the heat exchange component (30) being in communication with the flow channel plate (20) via the high-pressure interface; The jump pipe (40) is connected to the jump pipe (40) through the low-pressure interface. The jump pipe (40) has a low-pressure refrigerant flow channel for circulating low-pressure refrigerant. The low-pressure refrigerant flow channel is connected to the high-pressure refrigerant flow channel to form a heat exchange circuit to perform heat exchange operations on the heat exchange component (30).

2. The thermal management integrated module according to claim 1, characterized in that: The high-pressure interface comprises a first interface (211), the first interface (211) being arranged on the substrate (10), the first interface (211) being used to connect to an exhaust port of a compressor (50), the compressor (50) being used to compress a high-temperature and high-pressure gaseous refrigerant.

3. The thermal management integrated module according to claim 2, characterized in that: The heat exchange component (30) comprises: a heat exchanger assembly (31), the heat exchanger assembly (31) being in communication with at least one of the high-pressure interface and the low-pressure interface, the heat exchanger assembly (31) being located downstream of the compressor (50); A sensor component (32), the sensor component (32) being arranged on the flow channel plate (20) and the jumper pipe (40), the sensor component (32) being used to collect the temperature and pressure in the high-pressure refrigerant flow channel, and the sensor component (32) being used to collect the temperature and pressure in the low-pressure refrigerant flow channel; A valve assembly (33), wherein the valve assembly (33) is connected to the high-pressure interface, and at least a portion of the valve assembly (33) is arranged at the boundary between the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel, and the valve assembly (33) is used to throttle the high-pressure refrigerant to a low-pressure refrigerant.

4. The thermal management integrated module according to claim 3, characterized in that: The high-pressure interface further includes a second interface (212) and a third interface (213) disposed adjacent to each other, and the heat exchanger assembly (31) includes: a first condenser (311), the first condenser (311) being disposed downstream of the compressor (50), the first condenser (311) being disposed in communication with an exhaust port of the compressor (50); The second condenser (312) is arranged downstream of the first condenser (311), the inlet of the second condenser (312) is connected to the second interface (212), the outlet of the second condenser (312) is connected to the third interface (213), and the first condenser (311) and the second condenser (312) are used to condense high-temperature and high-pressure gaseous refrigerant into medium-temperature and low-pressure liquid refrigerant.

5. The thermal management integrated module according to claim 4, characterized in that: The valve assembly (33) comprises: A first electronic expansion valve (331), wherein the first electronic expansion valve (331) is disposed on the flow channel plate (20), and the first electronic expansion valve (331) is located between the first condenser (311) and the second condenser (312).

6. The thermal management integrated module according to claim 5, characterized in that: The valve assembly (33) further comprises: a second electronic expansion valve (332), the second electronic expansion valve (332) being arranged on the flow channel plate (20), and the second electronic expansion valve (332) being located downstream of the second condenser (312); A third electronic expansion valve (333), the third electronic expansion valve (333) is arranged on the flow channel plate (20), and the third electronic expansion valve (333) is located downstream of the second condenser (312). The medium-low-temperature and high-pressure liquid refrigerant condensed by the second condenser (312) is throttled into a low-temperature and low-pressure gas-liquid mixed refrigerant through the second electronic expansion valve (332) and the third electronic expansion valve (333).

7. The thermal management integrated module according to claim 6, characterized in that: The low-pressure interface comprises a fourth interface (214) and a fifth interface (215), wherein the fourth interface (214) and the fifth interface (215) are arranged on the flow channel plate (20), and the fourth interface (214) is arranged close to the second electronic expansion valve (332). The heat exchanger assembly (31) further comprises: An evaporator (313), wherein the evaporator (313) is arranged downstream of the second electronic expansion valve (332), wherein the inlet of the evaporator (313) is connected to the fourth interface (214), and the outlet of the evaporator (313) is connected to the fifth interface (215), and the low-temperature and low-pressure gas-liquid mixed refrigerant after throttling by the second electronic expansion valve (332) evaporates into a low-temperature and low-pressure gaseous refrigerant through the evaporator (313).

8. The thermal management integrated module according to claim 7, characterized in that: The low-pressure interface further comprises a sixth interface (216) and a seventh interface (217), wherein the sixth interface (216) and the seventh interface (217) are arranged on the substrate (10), and the heat exchanger assembly (31) further comprises: A refrigeration device (314), wherein the refrigeration device (314) is arranged downstream of the third electronic expansion valve (333), the inlet of the refrigeration device (314) is communicated with the sixth interface (216), the outlet of the refrigeration device (314) is communicated with the seventh interface (217), the jumper (40) comprises a first jumper (41), the first end of the first jumper (41) is arranged to communicate with the third electronic expansion valve (333), and the second end of the first jumper (41) is communicated with the sixth interface (216); The low-temperature and low-pressure gas-liquid mixed refrigerant after throttling by the third electronic expansion valve (333) flows into the refrigeration equipment (314) through the first jump pipe (41) and evaporates into a low-temperature and low-pressure gaseous refrigerant.

9. The thermal management integrated module according to claim 8, characterized in that: The jump pipe (40) comprises: a second jumper tube (42), wherein a first end of the second jumper tube (42) is in communication with the seventh interface (217); a third jumper pipe (43), wherein a first end of the third jumper pipe (43) is in communication with an outlet of the evaporator (313), and a second end of the third jumper pipe (43) is in communication with a second end of the second jumper pipe (42); A fourth jumper pipe (44), wherein the first end of the fourth jumper pipe (44) is connected to the second end of the third jumper pipe (43) and the second end of the second jumper pipe (42), the second end of the fourth jumper pipe (44) is connected to the inlet of the gas-liquid separator (60), and the outlet of the gas-liquid separator (60) is connected to the compressor inlet (218) of the compressor (50).

10. The thermal management integrated module according to claim 9, characterized in that: The sensor assembly (32) comprises: at least two temperature sensors (321), one of the temperature sensors (321) being arranged between the compressor (50) and the first condenser (311), and the other of the temperature sensors (321) being arranged at the outlet of the evaporator (313); at least two high-pressure sensors (322), one of the high-pressure sensors (322) being disposed downstream of the first condenser (311), and the other of the high-pressure sensors (322) being disposed downstream of the second condenser (312); A low pressure sensor (323), wherein the low pressure sensor (323) is arranged downstream of the refrigeration equipment (314).

11. A thermal management integrated system, comprising a thermal management integrated module, characterized in that: The thermal management integrated module is the thermal management integrated module according to any one of claims 1 to 10.

12. A vehicle comprising a thermal management integrated system, characterized in that: The thermal management integrated system is the thermal management integrated system according to claim 11.

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