Protection device for integrated circuit chip transportation
By designing a protective device for integrated circuit chip transportation, using a combined structure of the transport frame and clamping mechanism, the chip buffering, shock absorption, ventilation and heat dissipation are achieved, which solves the problem of chip damage caused by simple structure of the existing transport box and improves the transportation quality of the chip.
Patent Information
- Application Number
- CN202510041199.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-03-18
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing integrated circuit chip transportation box has a simple structure and poor buffering and shock absorption effect. It is easy to cause damage to the integrated circuit chip during transportation and reduce its quality.
A protective device for transporting integrated circuit chips is designed, including a transport frame and a clamping mechanism. A multiple groove is provided on the transport frame, a placement frame, a fixing rod, a bevel block, a slider and a buffering spring. Through the synergy of these components, buffering, shock absorption, ventilation and heat dissipation of the integrated circuit chips can be achieved.
It effectively avoids damage to the integrated circuit chip caused by bumps during transportation, ensures the quality of the chip, and prevents excessive temperature from affecting the chip through ventilation and heat dissipation mechanism.
Smart Images
Figure CN119637247A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of integrated circuit chip transportation protection, and in particular to a protection device for integrated circuit chip transportation. Background Art
[0002] An integrated circuit is a miniature electronic device or component that uses a specific process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is manufactured on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function. Integrated circuit chips generally include a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring. Integrated circuit chips are currently widely used and need to be transported during the production and sales process.
[0003] During transportation, integrated circuit chips are generally placed in transport boxes. However, the existing transport boxes have a relatively simple structure and poor shock absorption effect. Bumps during transportation can easily damage the integrated circuit chips and reduce the quality of the integrated circuit chips.
[0004] In response to the above problems, we propose a protection device for transporting integrated circuit chips. Summary of the Invention
[0005] The purpose of the present invention is to solve the defect in the prior art that "existing integrated circuit chips are generally placed in transport boxes during transportation. However, the existing transport boxes have a relatively simple structure and poor cushioning and shock absorption effect. Bumps generated during transportation can easily cause damage to the integrated circuit chips, thereby reducing the quality of the integrated circuit chips." Therefore, a protective device for integrated circuit chip transportation is proposed.
[0006] In order to achieve the above object, the present invention adopts the following technical solutions:
[0007] A protective device for transporting integrated circuit chips, comprising a transport frame and a clamping mechanism, wherein the upper end of the transport frame is provided with a plurality of grooves at equal intervals, each of the grooves is slidably connected to a placement frame, the lower end of each placement frame is symmetrically fixedly connected to two fixing rods, the lower end of each fixing rod is fixedly connected to a first inclined block, each of the grooves is symmetrically slidably connected to two second inclined blocks, each of the second inclined blocks is provided with a first cavity, the inner wall of each first cavity is slidably connected to a slide, the opposite side of each slide is symmetrically fixedly connected to two first buffer springs, the opposite side of each slide is fixedly connected to a cross bar, and each The lower end of the placement frame is symmetrically fixedly connected to two telescopic rods, each of which is sleeved with a second buffer spring, and the lower end of each placement frame is fixedly connected to a connecting pipe. A plurality of second cavities are equally spaced in the transport rack, and the lower end of each connecting pipe passes through a groove and is fixedly connected to a fixed cylinder. A vertical rod is fixedly connected to the inner wall of each second cavity, and the upper end of each vertical rod passes through the lower end of the fixed cylinder and is fixedly connected to a piston. An air intake pipe is fixedly connected to the side wall of each fixed cylinder, and an air intake one-way valve is fixedly connected to the inner wall of each air intake pipe, and an air outlet one-way valve is fixedly connected to the inner wall of each connecting pipe.
[0008] The cam is fixedly mounted on a track, and the track is connected to the track by a plurality of fixed blocks, each of which is fixedly connected to the inner wall of the placement frame, and each of the fixed blocks has a third cavity formed in the inner wall of each of the third cavities, a worm being rotatably connected to the inner wall of each of the worm gears, and each of the worm gears being meshed with a worm wheel, and the center of each of the worm gears is horizontally fixedly inserted with a threaded rod, and each of the threaded rods is meshed with a threaded sleeve, and each of the side walls of the threaded sleeves is symmetrically fixedly connected to two push plates, and each push plate is fixedly connected to a push rod on the opposite side of each push plate, and the other end of each two push rods passes through the third cavity and is fixedly connected to the clamping plate together, and the plurality of grooves are symmetrically provided with two slides, and the side walls of each fixed block are symmetrically fixedly connected to two sliders, and each slider is slidably connected to the inner wall of the slide groove, and the lower end surface of each slider is fixedly connected to a damper, and the lower end of each damper is fixedly connected to the inner wall of the slide groove.
[0009] Preferably, the upper ends of the multiple worms pass through the third cavity and are fixedly connected to a knob, each of the worms is rotatably connected to the inner wall of the fixed block, both ends of each threaded rod are rotatably connected to the inner wall of the third cavity, and the multiple push rods are slidably connected to the inner wall of the fixed block.
[0010] Preferably, two limiting grooves are symmetrically opened in each of the plurality of grooves, the opposite ends of the plurality of cross bars pass through the first cavity and are fixedly connected to the inner wall of the limiting groove, each of the cross bars is slidably connected to the inner wall of the second inclined block, and the opposite ends of the plurality of the first buffer springs are fixedly connected to the inner wall of the first cavity.
[0011] Preferably, the lower ends of the plurality of air inlet pipes all pass through the second cavity and are slidably connected to the inner wall of the transport rack, and the plurality of connecting pipes all are slidably connected to the inner wall of the transport rack.
[0012] Preferably, both ends of the plurality of second buffer springs are fixedly connected to the lower end surface of the placement frame and the inner wall of the groove, respectively.
[0013] Preferably, the plurality of vertical rods are all slidably connected to the inner wall of the fixed cylinder, and the plurality of pistons are all slidably connected to the inner wall of the fixed cylinder.
[0014] Preferably, four supporting legs are symmetrically fixedly connected to the lower end of the transport frame, and the lower end surface of each supporting leg is provided with anti-slip grooves.
[0015] Compared with the prior art, the present invention has the following beneficial effects:
[0016] 1. The second oblique block is driven to move by the fixed block, the placement frame, the fixed rod, and the first oblique block. The first buffer spring is squeezed by the cross bar and the slide plate. The telescopic rod and the second buffer spring are compressed downward by the placement frame. The damper is squeezed by the placement frame and the slide plate. The damper can absorb the energy generated by vibration to prevent resonance of the device. The damper, the first buffer spring, and the second buffer spring can buffer and reduce shock for the integrated circuit chip, preventing damage to the integrated circuit chip caused by bumps during transportation, thereby ensuring the quality of the integrated circuit chip.
[0017] 2. The placement frame and the connecting pipe will drive the fixed cylinder to move downward, and the fixed cylinder will drive the piston to move up and down through the vertical rod. The negative pressure can inhale air through the intake pipe and blow it onto the integrated circuit chip through the connecting pipe, thereby ventilating and cooling the integrated circuit chip to avoid the impact of excessive temperature on the integrated circuit chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the front three-dimensional structure of a protective device for transporting integrated circuit chips proposed by the present invention;
[0019] Figure 2 This is a front cross-sectional structural diagram of a protective device for transporting integrated circuit chips proposed by the present invention;
[0020] Figure 3 The present invention proposes Figure 2 Schematic diagram of the enlarged structure at A in the middle;
[0021] Figure 4 The present invention proposes Figure 2 Schematic diagram of the enlarged structure at B in the middle;
[0022] Figure 5 This is an enlarged structural schematic diagram of a fixing cylinder in a protective device for transporting integrated circuit chips proposed by the present invention.
[0023] In the figure: 1 transport rack, 2 placement frame, 3 fixed block, 4 slider, 5 damper, 6 fixed rod, 7 first oblique block, 8 second oblique block, 9 cross bar, 10 slide plate, 11 first buffer spring, 12 telescopic rod, 13 second buffer spring, 14 connecting pipe, 15 fixed cylinder, 16 air intake pipe, 17 limit groove, 18 worm, 19 worm gear, 20 threaded rod, 21 threaded sleeve, 22 push plate, 23 push rod, 24 splint, 25 vertical rod, 26 piston, 27 exhaust check valve, 28 intake check valve, 29 support leg, 30 knob. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0025] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.
[0026] Reference Figure 1-Figure 5A protective device for transporting integrated circuit chips includes a transport frame 1 and a clamping mechanism. The upper end of the transport frame 1 is provided with multiple grooves at equal intervals. A placement frame 2 is slidably connected in each groove. The lower end of each placement frame 2 is symmetrically fixedly connected to two fixing rods 6. The lower end of each fixing rod 6 is fixedly connected to a first inclined block 7. Two second inclined blocks 8 are symmetrically slidably connected in each groove. A first cavity is provided in each second inclined block 8. A slide 10 is slidably connected to the inner wall of each first cavity. Two first buffer springs 1 are symmetrically fixedly connected on the opposite side of each slide 10. 1, each slide 10 is fixedly connected to a cross bar 9 on the opposite side, and the lower end of each placement frame 2 is symmetrically fixedly connected to two telescopic rods 12, each telescopic rod 12 is sleeved with a second buffer spring 13, and the lower end of each placement frame 2 is fixedly connected to a connecting pipe 14. A plurality of second cavities are opened at equal intervals in the transport frame 1, and the lower end of each connecting pipe 14 passes through the groove and is fixedly connected to the fixed cylinder 15. The inner wall of each second cavity is fixedly connected to a vertical rod 25, and the upper end of each vertical rod 25 passes through the lower end of the fixed cylinder 15 and is fixedly connected to the piston 26. The side of each fixed cylinder 15 The wall is fixedly connected with an air intake pipe 16, the inner wall of each air intake pipe 16 is fixedly connected with an air intake one-way valve 28, and the inner wall of each connecting pipe 14 is fixedly connected with an air outlet one-way valve 27. The second oblique block 8 is driven to move by the fixed block, the placement frame 2, the fixed rod 6 and the first oblique block 7, and the first buffer spring 11 is squeezed by the cross bar 9 and the slide 10. The telescopic rod 12 and the second buffer spring 13 are compressed downward by the placement frame 2. The damper 5 is squeezed by the placement frame 2 and the slider 4. The energy generated by the vibration can be absorbed by the damper 5 to avoid resonance of the device. The first buffer spring 11 and the second buffer spring 13 can play a role in buffering and shock absorption for the integrated circuit chip, avoiding damage to the integrated circuit chip caused by bumps during transportation, thereby ensuring the quality of the integrated circuit chip; the placement frame 2 and the connecting pipe 14 will drive the fixed cylinder 15 to move downward, and the fixed cylinder 15 will drive the piston 26 to move up and down through the vertical rod 25. The negative pressure can inhale air through the air intake pipe 16 and blow it onto the integrated circuit chip through the connecting pipe 14, so that the integrated circuit chip can be ventilated and dissipated to avoid the impact of excessive temperature on the integrated circuit chip.
[0027] Among them, the clamping mechanism includes a plurality of fixed blocks 3, each fixed block 3 is fixedly connected to the inner wall of the placement frame 2, a third cavity is opened in each fixed block 3, a worm 18 is rotatably connected to the inner wall of each third cavity, each worm 18 is meshed with a worm wheel 19, a threaded rod 20 is horizontally fixed and inserted at the center of each worm wheel 19, each threaded rod 20 is meshed with a threaded sleeve 21, and two push plates 22 are symmetrically fixed to the side walls of each threaded sleeve 21, and a push rod 23 is fixedly connected to the opposite side of each push plate 22. The other ends of the rods 23 pass through the third cavity and are fixedly connected to the clamping plate 24. Two slide grooves are symmetrically opened in the multiple grooves. Two sliders 4 are symmetrically fixedly connected to the side walls of each fixed block 3. Each slider 4 is slidably connected to the inner wall of the slide groove. The lower end face of each slider 4 is fixedly connected to a damper 5. The lower end of each damper 5 is fixedly connected to the inner wall of the slide groove. The push plate 22 is driven to move by the worm 18, worm gear 19, threaded rod 20 and threaded sleeve 21. The push plate 22 can clamp the integrated circuit chip through the push rod 23 and the clamping plate 24.
[0028] Among them, the upper ends of multiple worm gears 18 pass through the third cavity and are fixedly connected to the knob 30. Each worm gear 18 is rotatably connected to the inner wall of the fixed block 3. Both ends of each threaded rod 20 are rotatably connected to the inner wall of the third cavity. Multiple push rods 23 are slidably connected to the inner wall of the fixed block 3. The worm gear 18 can drive the worm wheel 19 to rotate.
[0029] Among them, two limit grooves 17 are symmetrically opened in multiple grooves, and the opposite ends of multiple cross bars 9 pass through the first cavity and are fixedly connected to the inner wall of the limit groove 17. Each cross bar 9 is slidably connected to the inner wall of the second inclined block 8, and the opposite ends of multiple first buffer springs 11 are fixedly connected to the inner wall of the first cavity. The cross bar 9 can drive the slide 10 to move.
[0030] Among them, the lower ends of multiple air intake pipes 16 all pass through the second cavity and are slidably connected to the inner wall of the transport rack 1 , and multiple connecting pipes 14 are slidably connected to the inner wall of the transport rack 1 , and air can be inhaled through the air intake pipes 16 .
[0031] The two ends of the plurality of second buffer springs 13 are respectively fixedly connected to the lower end surface of the placement frame 2 and the inner wall of the groove, and the second buffer springs 13 can play a buffering role for the integrated circuit chip.
[0032] The plurality of vertical rods 25 are all slidably connected to the inner wall of the fixed cylinder 15 , and the plurality of pistons 26 are all slidably connected to the inner wall of the fixed cylinder 15 . The vertical rods 25 can drive the pistons 26 to move.
[0033] Among them, four supporting legs 29 are symmetrically fixedly connected to the lower end of the transport frame 1, and the lower end surface of each supporting leg 29 is provided with anti-slip grooves, and the device can be supported by the supporting legs 29.
[0034] In the present invention, when the device is working, the integrated circuit chips are placed in the placement frame 2 respectively, and the knob 30 is turned. The knob 30 drives the worm 18 to rotate, and the worm 18 drives the worm wheel 19 to rotate. The worm 18 and the worm wheel 19 have a reverse self-locking function. The worm wheel 19 drives the threaded rod 20 to rotate, and the threaded rod 20 drives the threaded sleeve 21 to move relative to it. The threaded sleeve 21 drives the push plate 22 to move. The push plate 22 drives the clamping plate 24 to move relative to it through the push rod 23. The integrated circuit chip can be clamped by the clamping plate 24;
[0035] During transportation, the placement frame 2 will press the damper 5 downward through the slider 4. The damper 5 can absorb the energy generated by vibration and prevent the device from resonating. At the same time, the placement frame 2 will drive the first inclined block 7 to move downward through the fixing rod 6. The first inclined block 7 will push the second inclined block 8 to move. The second inclined block 8 will press the first buffer spring 11 through the cross bar 9 and the slide 10. The placement frame 2 will press the telescopic rod 12 and the second buffer spring 13 downward. The damper 5, the first buffer spring 11 and the second buffer spring 13 can buffer and reduce shock for the integrated circuit chip, avoiding damage to the integrated circuit chip caused by bumps during transportation, thereby ensuring the quality of the integrated circuit chip;
[0036] Furthermore, the placement frame 2 will drive the fixed cylinder 15 to move up and down through the connecting pipe 14, and the fixed cylinder 15 will drive the piston 26 to move up and down through the vertical rod 25. The negative pressure can inhale air through the air intake pipe 16 and blow it onto the integrated circuit chip through the connecting pipe 14, so that the integrated circuit chip can be ventilated and cooled to avoid the impact of excessive temperature on the integrated circuit chip. The content not described in detail in this description belongs to the existing technology known to professional and technical personnel in this field.
[0037] Although the present invention has been described in detail with reference to the previous embodiments, those skilled in the art can still modify the technical solutions described in the previous embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A protective device for transporting integrated circuit chips, comprising a transport frame (1) and a clamping mechanism, characterized in that: The upper end of the transport frame (1) is provided with a plurality of grooves at equal intervals, each of the grooves is slidably connected to a placement frame (2), the lower end of each placement frame (2) is symmetrically fixedly connected to two fixing rods (6), the lower end of each fixing rod (6) is fixedly connected to a first inclined block (7), each of the grooves is symmetrically slidably connected to two second inclined blocks (8), a first cavity is provided in each second inclined block (8), a slide plate (10) is slidably connected to the inner wall of each first cavity, two first buffer springs (11) are symmetrically fixedly connected to the opposite side of each slide plate (10), a cross bar (9) is fixedly connected to the opposite side of each slide plate (10), the lower end of each placement frame (2) is symmetrically fixedly connected to two telescopic rods (12), each Each of the telescopic rods (12) is sleeved with a second buffer spring (13); the lower end of each of the placement frames (2) is fixedly connected to a connecting pipe (14); a plurality of second cavities are equally spaced in the transport frame (1); the lower end of each of the connecting pipes (14) passes through a groove and is fixedly connected to a fixing cylinder (15); the inner wall of each of the second cavities is fixedly connected to a vertical rod (25); the upper end of each of the vertical rods (25) passes through the lower end of the fixing cylinder (15) and is fixedly connected to a piston (26); the side wall of each of the fixing cylinders (15) is fixedly connected to an air intake pipe (16); the inner wall of each of the air intake pipes (16) is fixedly connected to an air intake check valve (28); and the inner wall of each of the connecting pipes (14) is fixedly connected to an air outlet check valve (27).
2. The integrated circuit chip transportation protection device according to claim 1, characterized in that: The clamping mechanism comprises a plurality of fixing blocks (3), each of the fixing blocks (3) being fixedly connected to the inner wall of the placement frame (2), each of the fixing blocks (3) being provided with a third cavity, a worm (18) being rotatably connected to the inner wall of each of the third cavities, each of the worms (18) being meshingly connected to a worm wheel (19), a threaded rod (20) being horizontally fixedly inserted through the center of each of the worm wheels (19), each of the threaded rods (20) being meshingly connected to a threaded sleeve (21), and two threaded sleeves (21) being symmetrically fixedly connected to the side walls of each of the threaded sleeves (21). A push plate (22), each of the push plates (22) is fixedly connected to a push rod (23) on one side opposite to the other, the other ends of each of the two push rods (23) pass through the third cavity and are fixedly connected to a clamping plate (24), two slide grooves are symmetrically provided in the plurality of grooves, two sliders (4) are symmetrically fixedly connected to the side wall of each fixed block (3), each slider (4) is slidably connected to the inner wall of the slide groove, the lower end surface of each slider (4) is fixedly connected to a damper (5), and the lower end of each damper (5) is fixedly connected to the inner wall of the slide groove.
3. The integrated circuit chip transportation protection device according to claim 2, characterized in that: The upper ends of the plurality of worm gears (18) pass through the third cavity and are fixedly connected to a knob (30); each of the worm gears (18) is rotatably connected to the inner wall of the fixed block (3); both ends of each of the threaded rods (20) are rotatably connected to the inner wall of the third cavity; and the plurality of push rods (23) are slidably connected to the inner wall of the fixed block (3).
4. The integrated circuit chip transportation protection device according to claim 1, characterized in that: Two limiting grooves (17) are symmetrically provided in the plurality of grooves, the opposite ends of the plurality of cross bars (9) pass through the first cavity and are fixedly connected to the inner wall of the limiting groove (17), each of the cross bars (9) is slidably connected to the inner wall of the second inclined block (8), and the opposite ends of the plurality of first buffer springs (11) are fixedly connected to the inner wall of the first cavity.
5. The integrated circuit chip transportation protection device according to claim 1, characterized in that: The lower ends of the plurality of air inlet pipes (16) all penetrate the second cavity and are slidably connected to the inner wall of the transport rack (1), and the plurality of connecting pipes (14) all are slidably connected to the inner wall of the transport rack (1).
6. The integrated circuit chip transportation protection device according to claim 1, characterized in that: Both ends of the plurality of second buffer springs (13) are respectively fixedly connected to the lower end surface of the placement frame (2) and the inner wall of the groove.
7. The integrated circuit chip transportation protection device according to claim 1, characterized in that: The plurality of vertical rods (25) are all slidably connected to the inner wall of the fixed cylinder (15), and the plurality of pistons (26) are all slidably connected to the inner wall of the fixed cylinder (15).
8. The integrated circuit chip transportation protection device according to claim 1, characterized in that: Four supporting legs (29) are symmetrically fixedly connected to the lower end of the transport frame (1), and the lower end surface of each supporting leg (29) is provided with anti-slip grooves.