LED radiator and LED lamp

Abstract

The invention belongs to the field of LED illumination, and particularly relates to an LED radiator and an LED lamp. Specifically, the LED radiator comprises an assembling part and a radiating part arranged on the assembling part in a sleeving mode, a cavity used for containing a control panel is formed in the assembling part, the radiating part is provided with a heat transfer area used for fixing an LED substrate, the radiating part and the assembling part are made of heat conduction plastic, the heat conduction coefficient of the radiating part is larger than that of the assembling part, and the assembling part is provided with a heat conduction area used for fixing the LED substrate. The assembling part is made of insulating heat-conducting plastic; and the heat dissipation part and the assembly part are integrally formed through a double-shot molding process or an insert process. According to the scheme, the radiator is simple in structure and small in size, and the requirement that the radiator is suitable for higher-power LED lamps is met.

Description

Technical Field

[0001] The invention belongs to the field of LED lighting, and in particular relates to an LED radiator and an LED lamp. Background Art

[0002] As a lighting device with a wide range of uses, the heat dissipation effect of LED lights seriously restricts their service life. Conventional LED lights need to control the voltage, which needs to be realized through electronic components and circuits installed on the control board. For some lighting effects that need to be set by programming: such as intelligent control of light switches, light color, brightness adjustment, light flashing speed, time, pattern, etc., a control board is more needed. From a safety perspective, the control board needs to be insulated from the outside world. On the one hand, it can effectively isolate the direct contact between the internal circuit and the external environment to prevent users from accidentally getting electric shock during use; on the other hand, it helps to maintain the working stability of the LED control board. Specifically, in some cases, if the shell is not reliably grounded (such as no ground wire, the ground rod environment is dry), the shell potential may be unstable or there may be static electricity problems. If the control board is directly connected to such a shell, sensitive components on the control board may be damaged.

[0003] In order to meet the requirements of insulation and heat dissipation, an insulating thermally conductive plastic shell is used as a heat sink for a bulb lamp. On the one hand, it can protect the control board, and on the other hand, it can have a certain heat dissipation effect, which can meet the heat dissipation requirements of low-power LED lamps to a certain extent. However, for high-power LED lamps, in order to meet the heat dissipation requirements, the size of the heat sink made of insulating thermally conductive plastic is enlarged, resulting in an overall oversized size.

[0004] In the prior art, there is also a method of improving the overall thermal conductivity of the LED lamp by embedding a metal cup into an insulating thermally conductive plastic shell, but the bonding between the metal and the insulating thermally conductive plastic material is poor, and the metal cup must be embedded in the insulating thermally conductive plastic through a metal insert process: the metal cup is inside and the insulating thermally conductive plastic is outside. By clamping the metal edge in the insulating thermally conductive plastic to form an edge structure, it is ensured that the metal insert does not fall off during use. In this case, the LED substrate has three ways to exert the heat dissipation effect of the metal cup: 1) The LED substrate is transferred to the metal cup through the air, and then transferred to the insulating thermally conductive plastic through the metal cup to dissipate heat (because the control board needs to be insulated, the conventional shell uses the same insulating thermally conductive plastic as the control board to reduce costs). However, the thermal conductivity of air is extremely low. Although the air temperature in the gap will rise after long-term use, it is difficult to quickly transfer heat to the metal cup, and the heat dissipation effect is limited; 2) The metal cup and the LED substrate with high heat generation are usually in edge contact (the control board and the LED substrate are basically installed in a vertical direction to each other, occupying a small volume), the contact area is small, and the heat dissipation effect is not significantly improved.

[0005] In the prior art, there are also metal plates designed for LED substrates that are easy to fit (the angle of the metal cup cannot meet the fitting requirements). However, the LED substrate is electrically connected to the control board only through the wire holes, which means that the control board needs to be flipped over to install it, and it needs to be installed separately from the other side, which reduces the efficiency of LED lamp assembly. Due to the thin thickness of the metal plate, it is impossible to provide a structure for fixing the LED substrate (such as a screw column). In view of this, it is a more preferred solution to provide a structure for fixing the LED substrate with an additional component. In the prior art, a shell is coated on the outside of the metal plate, and a screw column is set on the shell. The shell is usually an insulating thermally conductive plastic of the same material as the control board. Since the insulating thermally conductive filler itself has low thermal conductivity, it is coated on the outside of the metal plate, which limits the metal plate from diffusing heat outward, resulting in the heat dissipation effect not being able to meet expectations. In addition, the metal plate is located between two insulating thermally conductive plastics. Due to the difference in the thermal expansion coefficient of its material, it is very easy to crack under high and low temperature cold and hot shock conditions. Summary of the invention

[0006] In order to overcome one of the above problems existing in the prior art, the object of the present invention is to provide an LED heat sink and an LED lamp with a simple structure and a small size, which meet the requirements of the heat sink being suitable for higher power LED lamps, and is specifically achieved through the following technical solutions: An LED heat sink comprises an assembly part and a heat dissipation part sleeved on the assembly part, wherein the assembly part is provided with a cavity for accommodating a control board, the heat dissipation part is provided with a heat transfer area for fixing an LED substrate, the heat dissipation part and the assembly part are made of thermally conductive plastics, the thermal conductivity of the heat dissipation part is greater than the thermal conductivity of the assembly part, and the assembly part is made of insulating thermally conductive plastics; the heat dissipation part and the assembly part are integrally formed by a two-color injection molding process or an insert process.

[0007] Optionally, the assembly portion has a thermal conductivity λ 1 Satisfy 0.5≤λ 1 ≤3W / (m•K) of insulating thermally conductive plastic, the heat dissipation part has a thermal conductivity of λ 2 Satisfy λ 2 Thermally conductive plastics ≥3W / (m•K).

[0008] Among them, the thermal conductivity (λ) is the vertical thermal conductivity: tested according to the ASTM E-1461 standard method, the test condition is 80°C, and the sample thickness is 2mm.

[0009] Optionally, one or more ribs and / or undercut structures are provided on the assembly portion and / or the heat dissipation portion at the position where the assembly portion and the heat dissipation portion contact each other, so as to limit possible rotation and displacement of the heat dissipation portion and the assembly portion from contact.

[0010] Optionally, the convex ribs may also be other specific structures such as protrusions, which are equivalent features and fall within the protection scope of this application if they do not affect the functional realization. The convex ribs and undercut structures may be combined to form a structure to play a limiting role.

[0011] Optionally, a limiting ring is provided on the assembly portion, and the limiting ring is used to limit the end position of the heat dissipation structure during the injection molding process.

[0012] Optionally, a mounting structure for fixing the control panel is provided in the assembly portion.

[0013] Optionally, the mounting structure includes a slot for inserting the control board into the slot and fixing it.

[0014] Optionally, the mounting structure includes a bell-mouth structure to facilitate installation of the control panel and improve installation efficiency.

[0015] Optionally, the mounting structure further includes a limiting structure capable of limiting the mounting position of the control board. The limiting structure may be a side wall of the slot, or other structure on the assembly portion that prevents the control board from moving toward the side wall of the slot, or a protrusion may be provided separately. Those skilled in the art may easily think of similar structures based on the idea of ​​the present application, and all of them belong to the protection scope of the present application.

[0016] Optionally, the limiting structure includes a side wall of the slot.

[0017] Optionally, the mounting structure is located on a side away from the LED substrate, so that the control board, LED substrate and other components can be installed from the same side during the installation process, without the need to flip and install different components, thereby improving the installation efficiency.

[0018] Optionally, the heat dissipation part is adhered to the LED substrate in the heat transfer area through thermal conductive adhesive, and / or the heat dissipation part fixes the LED substrate in the heat transfer area through a fixing mechanism (the heat transfer area may be the location of the LED lamp beads, or may be larger than the location of the LED lamp beads, and technical personnel in this field may select according to actual needs).

[0019] Optionally, the heat transfer area also includes a heat-conducting metal plate for quickly dissipating the heat of the LED substrate and improving the overall heat dissipation effect.

[0020] Optionally, the fixing mechanism includes a fixing column provided at an end of the assembly portion to fix the LED substrate in the heat transfer area.

[0021] Optionally, the fixing column has an inverted structure on a side where the assembly portion contacts the heat dissipation portion.

[0022] Optionally, a wire groove and a wire hole are provided in the assembly part. The wire groove is located on the side where the assembly part contacts the heat dissipation part and protrudes from the outer surface of the assembly part, and can be used to limit the relative rotational displacement that may occur between the assembly part and the heat dissipation part.

[0023] Optionally, the assembly portion further includes a threaded structure, which can be assembled in cooperation with a metal threaded cap of a counterpart through the threaded structure.

[0024] Optionally, it may also be a non-threaded structure, which only needs to be installed in conjunction with a corresponding metal cap. This is an equivalent technical feature of the threaded structure of the present application and is included in the protection scope of the present application.

[0025] Optionally, a positioning structure is provided at the end of the assembly portion located on one side of the LED substrate, for positioning the LED substrate to improve installation efficiency.

[0026] Optionally, the end position of the assembly portion is less than or equal to the end position of the heat dissipation portion.

[0027] Optionally, the position where the assembly portion contacts the heat dissipation portion is a cylindrical structure.

[0028] Optionally, the heat dissipation portion further includes a plurality of fins, and the height of the fins gradually decreases in a direction away from the LED substrate.

[0029] The present application also provides an LED lamp, a heat sink as described in any of the aforementioned solutions.

[0030] Optional, LED lights include high bay lights, bulb lights, mining lights, downlights, spotlights, A lights, T lights, etc., and there are lamps that require additional insulated control panel installation requirements.

[0031] Compared with the prior art, the present invention has the following beneficial effects: through the structural design of the heat dissipation part and the assembly part, and setting the heat dissipation part and the assembly part to be thermally conductive plastics, the thermal conductivity of the heat dissipation part is greater than the thermal conductivity of the assembly part, so that the control board is placed in the radiator, which can improve the heat dissipation effect and facilitate the heat dissipation of higher-power LED lamps, while reducing the volume of the radiator, and can be injection molded by a two-color injection molding process or an insert process, greatly improving production efficiency. It overcomes the problem in the prior art that the insulating thermally conductive plastic has low thermal conductivity efficiency and cannot be used for higher-power LED lamps or increase the size of the radiator to meet the heat dissipation requirements. It also solves the structural setting problem of the control board installation caused by the non-insulating characteristics of the high-thermal conductivity plastic radiator.

[0032] Compared with the prior art, the present invention abandons the use of metal cups or metal plates through the design of the process structure of metal cups or metal plates and insulating thermally conductive plastic inserts, avoiding the following problems caused by the metal cups or metal plates and insulating thermally conductive plastic insert structures: 1) The metal cup has no contact with the LED substrate or the contact area is small, and the heat dissipation effect is not significantly improved; 2) The metal cup or metal plate is embedded in the insulating thermally conductive plastic. Due to the large difference in material and thermal expansion coefficient between the two, it is very easy to crack under high and low temperature cold and hot shock conditions.

[0033] In addition, this application is more suitable for environments with high salt fog, humidity, acidity and alkalinity, such as offshore and production environments where chemical raw materials are exposed. It overcomes the technical problem that the LED lamps in such environments have high requirements for salt fog resistance and acid and alkali resistance, and cannot use metals (such as aluminum and copper) as structural materials.

[0034] The present invention has a simple structure and a small size, and meets the requirement that the heat sink is suitable for higher power LED lamps. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A three-dimensional diagram of the LED heat sink described in Example 1; Figure 2 A top view of the LED heat sink described in Example 1; Figure 3 A bottom view of the LED heat sink described in Example 1; Figure 4 A three-dimensional diagram of the assembly portion of the LED heat sink described in Example 1; Figure 5 A three-dimensional diagram of the heat dissipation portion of the LED heat sink described in Example 1; In the figure, the reference numerals are: assembly part 1, rib 101, undercut structure 102, wire groove 103, wire hole 104, fixing column 105, limiting ring 106, threaded structure 107, slot 108, side wall 1081, retaining ring 109, end of assembly part 110, positioning structure 111, heat dissipation part 2, heat transfer area 201, end of heat dissipation part 202, fin 203. DETAILED DESCRIPTION

[0036] The specific implementation methods of the present application are described in detail below through examples, but the specific implementation of the present application does not serve as a limitation on the technical solution of the present application. Any non-substantial changes such as replacing common technical solutions in the field with the technical solutions described in the examples of the present application are within the scope of protection of the present application. Example 1

[0037] like Figures 1 to 5 An LED heat sink shown in the figure comprises an assembly part 1 and a heat dissipation part 2 sleeved on the assembly part 1, wherein the assembly part 1 is provided with a cavity for accommodating a control board, and the heat dissipation part 2 is provided with a heat transfer area 201 for fixing an LED substrate, the heat dissipation part 2 and the assembly part 1 are made of thermally conductive plastics, the thermal conductivity of the heat dissipation part 2 is greater than that of the assembly part 1, and the assembly part 1 is made of insulating thermally conductive plastics; the heat dissipation part 2 and the assembly part 1 are integrally formed by a two-color injection molding process or an insert process.

[0038] In this embodiment, the assembly portion 1 has a thermal conductivity λ 1 Satisfy 0.5≤λ 1≤3W / (m•K) of insulating thermally conductive plastic, the heat dissipation part 2 has a thermal conductivity of λ 2 Satisfy λ 2 Thermally conductive plastics ≥3W / (m•K).

[0039] In this embodiment, the thermal conductivity (λ) is a vertical thermal conductivity: it is tested according to the ASTM E-1461 standard method, the test condition is 80° C., and the sample thickness is 2 mm.

[0040] Preferably, the microscopic thermally conductive frame of the insulating thermally conductive plastic contains fibrous materials (such as glass fibers, carbon fibers, carbon nanotubes, etc.), which can be used in combination with thermally conductive fillers such as graphite and boron nitride. During the processing of the assembly part 1, orientation will be generated, so that the inter-surface thermal conductivity is much larger than the vertical thermal conductivity. The present application scheme makes full use of this characteristic. On the one hand, it reduces the high temperature of the external heat dissipation part 2 and dissipates heat in the opposite direction toward the cavity in the equipment part (the vertical thermal conductivity is relatively small). On the other hand, it makes full use of the high inter-surface thermal conductivity to quickly diffuse the heat on the assembly part 1 and transfer it to the outside, thereby protecting the control board inside the cavity and improving the problem of reduced service life of the control board caused by long-term high temperature.

[0041] In this embodiment, the side wall 1081 of the assembly part 1 is a thin-walled structure. On the one hand, the material consumption of the assembly part 1 is reduced, and the size of the heat sink is reduced. On the other hand, during the injection molding process of the thin-walled material, it is more conducive to forming the orientation of the fibrous material and improving its inter-plane thermal conductivity (a performance index for heat diffusion around the workpiece, which is different from the vertical thermal conductivity of heat penetrating the workpiece).

[0042] If conventional plastic is used for assembly part 1, the thermal conductivity is usually not higher than 0.5 W / (m•K). In the long-term use, the heat in the cavity of assembly part 1 will accumulate and cannot be dissipated. The high temperature of heat dissipation part 2 is reversely conducted to the cavity, and the control board itself heats up. The combined heat accumulation reduces the service life of the control board.

[0043] In this embodiment, a plurality of undercuts and convex ribs 101 are provided on the assembly portion 1. In other embodiments, one or more convex ribs 101 and / or undercut structures 102 are provided on the assembly portion 1 and / or the heat dissipation portion 2 at the position where the assembly portion 1 and the heat dissipation portion 2 contact, so as to limit the possible rotation and displacement of the heat dissipation portion 2 and the assembly portion 1 from being out of contact. Including only providing one or more convex ribs 101 and / or undercut structures 102 on the heat dissipation portion 2, and also including providing one or more convex ribs 101 and / or undercut structures 102 that cooperate with each other on both the assembly portion 1 and the heat dissipation portion 2, all of which belong to the protection scope of this application. Through structural design, this application can expand the realization of two-color injection molding of thermally conductive plastics with the same resin matrix. The reason is that the high thermal conductivity plastic and the insulating thermal conductive plastic in the same resin matrix are difficult to be realized using the conventional two-color injection molding process due to the difference in the type and amount of thermal conductive fillers. Usually, the two-color injection molding process requires that the melting points of the two plastic materials differ by more than 20°C, so that during the injection molding process of the second high-temperature material, the first material can be melted to a certain extent, making the combination of the two more stable.

[0044] In other embodiments, the rib 101 may also be other specific structures such as protrusions, which do not affect the functional realization and are equivalent to the features thereof and fall within the protection scope of the present application.

[0045] In this embodiment, part of the convex rib 101 and the undercut structure 102 are combined to form a structure to play a limiting role, and at the same time limit the rotation and contact-breaking displacement of the heat dissipation part 2 and the assembly part 1.

[0046] In this embodiment, a limiting ring 106 is provided on the assembly portion 1 , and the limiting ring 106 is used to limit the end position of the heat dissipation portion 2 during the injection molding process.

[0047] In this embodiment, a mounting structure for fixing the control panel is provided in the assembly portion 1 .

[0048] In this embodiment, the installation structure includes a slot 108 for inserting the control board into the slot 108 and fixing it.

[0049] In this embodiment, the installation structure includes a bell-mouth structure, which facilitates the installation of the control panel and improves the installation efficiency.

[0050] In this embodiment, the installation structure also includes a limiting structure that can limit the installation position of the control board. Specifically, the limiting structure includes the side wall 1081 of the slot 108, so that the limiting structure can simultaneously fix and limit the installation of the control board, with a simple structure and high installation efficiency. In other embodiments, other structures on the assembly part 1 that hinder the control board from running in the direction of the side wall 1081 of the slot 108, or protrusions can be set separately. Those skilled in the art can easily think of similar structures based on the ideas of this application, and they all belong to the protection scope of this application. In this embodiment, the side wall 1081 of the slot 108 and other structures on the assembly part 1 that hinder the control board from running in the direction of the side wall 1081 of the slot 108, such as the retaining ring 109, together serve as a limiting structure.

[0051] In this embodiment, the mounting structure is located on the side away from the LED substrate, so that the control board, LED substrate and other components can be installed from the same side during the installation process, without flipping and installing different components, thereby improving the installation efficiency.

[0052] In this embodiment, the mounting structure is located on the side away from the LED substrate, and the control board is installed from the side of the cavity close to the LED substrate. The control board is large in size and difficult to be installed from the threaded structure 107 of a bulb lamp. There is no need to expand the size of the other side of the cavity away from the LED substrate, and there is no need to flip the side of the cavity away from the LED substrate during installation, thereby improving installation efficiency. In other embodiments, the mounting structure can also be set on the side close to the LED substrate, and it is not excluded that the LED substrate is installed from the other side away from the LED substrate. When installing the control board from the side of the cavity away from the LED substrate, the cavity of the assembly part 1 can also be sealed at the end of the side close to the LED substrate, and only the wire hole 104 needs to flow out.

[0053] The control board limiter is arranged at the threaded end, and can also quickly introduce heat into the metal threaded cap, thereby reducing the heat transferred from the limiter to the control board.

[0054] In this embodiment, the heat dissipation part 2 is attached to the LED substrate in the heat transfer area 201 through heat-conducting glue (the indicated position in the figure is a rough schematic diagram. According to the structural requirements of the actual LED substrate, the technicians in this field can set the heat transfer area 201 of different shapes and sizes, which can be roughly in the indicated position in the figure. For example, the LED substrate can be annular and arranged around the assembly part 1, or it can be sheet-shaped and covered with the assembly part 1. The position is fixed), and / or the heat dissipation part 2 fixes the LED substrate in the heat transfer area 201 through a fixing mechanism. In this embodiment, the heat transfer area 201 is larger than the position of the LED lamp beads. In other embodiments, the heat transfer area 201 can also be the position of the LED lamp beads, or it can be larger than the size of the LED substrate, and it can accommodate the LED substrate. The technicians in this field can choose according to actual needs, which belongs to the protection scope of this application. In other embodiments, the heat transfer area 201 also includes a heat-conducting metal plate, which is used to quickly disperse the heat of the LED substrate and improve the overall heat dissipation effect.

[0055] In this embodiment, the fixing mechanism includes a fixing column 105 provided at the end of the assembly part 1, and the LED substrate is fixed in the heat transfer area 201. In other embodiments, the fixing mechanism may not be fixed in the form of fixing, such as the fixing mechanism is a thermal conductive glue, or the fixing mechanism is a snap-on structure, an insertion or embedding structure, etc., which can achieve the fixing of the LED substrate in the heat transfer area 201. The heat transfer area 201 can be provided in a groove, a protrusion, or a plane of the heat dissipation part 2, and the heat transfer area 201 can also include a metal heat conductive plate provided on the heat dissipation part 2. It is easy for those skilled in the art to understand that it belongs to the protection scope of this application. The preferred method of fixing the column 105 is to only use thermal conductive glue to paste the substrate. On the one hand, the risk of falling off is increased when used under alternating hot and cold conditions for a long time. On the other hand, if a thermal conductive glue with strong bonding force is used, it is inconvenient to repair and replace it later. In addition, the cost of thermal conductive glue with high thermal conductivity is extremely high, and the thermal conductivity of low-cost thermal conductive glue is very low, and it is difficult to balance the advantages of cost and heat dissipation performance.

[0056] In this embodiment, the fixing column 105 is located at the side where the assembly part 1 contacts the heat dissipation part 2 and is an undercut structure 102. On the one hand, the fixing column 105 is fully utilized to set a certain protrusion due to structural requirements to enhance the fixing effect of the fixing column 105. On the other hand, the undercut structure 102 can also prevent the assembly part 1 and the heat dissipation part 2 from separating, thereby improving the tightness and stability of the combination.

[0057] In this embodiment, a wire groove 103 and a wire hole 104 are provided in the assembly part 1. The wire groove 103 is located on the side where the assembly part 1 contacts the heat dissipation part 2 and protrudes from the outer surface of the assembly part 1. It can be used to limit the relative rotational displacement that may occur between the assembly part 1 and the heat dissipation part 2.

[0058] In this embodiment, the assembly part 1 further includes a threaded structure 107, which can be assembled with the metal threaded cap of the counterpart through the threaded structure 107. In other embodiments, it can also be a non-threaded structure 107, which only needs to be assembled with the corresponding metal cap, and is an equivalent technical feature of the threaded structure 107 of the present application, and is included in the protection scope of the present application.

[0059] In this embodiment, a positioning structure 111 is provided at the end of the assembly portion 1 located on one side of the LED substrate, which is used to position the LED substrate to improve installation efficiency.

[0060] Optionally, the position of the end 110 of the assembly part is less than or equal to the position of the end 202 of the heat dissipation part. In this embodiment, the end 110 of the assembly part is substantially level with (equal to) the end 202 of the heat dissipation part, and the depth of the assembly part 1 at the contact position with the heat dissipation part 2 is ≥ the length of the control board after installation, that is, the assembly part 1 protects the control board. The following problems existing in the prior art using high thermal conductivity plastics or metal cups are solved: the prior art uses a heat sink made of high thermal conductivity plastics, but because the insulation performance of the high thermal conductivity plastic material is poor, there are safety hazards when it is directly used to fix the control board. The control board needs to be fixed to other structures other than the heat sink, and cannot be directly in contact with the high thermal conductivity heat sink, resulting in a complex structure, high mold cost, and low assembly efficiency. In addition, when a heat sink with a structure such as a high thermal conductivity plastic or a metal cup is used, if the high thermal conductivity plastic or metal cup partially covers the area where the control board is located, the heat from the LED substrate will be transferred to the control board, and long-term use will reduce the service life of the electronic components on the control board. If the area where the control panel is located is separated from the high thermal conductivity plastic or metal cup and other structures, the height (or other dimensions) of the overall radiator or heat dissipation housing will be greatly increased, resulting in material waste and high cost. In addition, the present embodiment makes full use of the characteristics that the inter-plane thermal conductivity (or the thermal conductivity in the direction of the rubber flow) caused by the fiber orientation in the microscopic heat dissipation frame during the processing of the insulating thermal conductive plastic material of the assembly part 1 is higher than the vertical thermal conductivity (conventionally up to 3 to 6 times, and there are also thermal conductive materials that can reach a difference of 10 times). The end 110 of the assembly part is close to the LED substrate, and can use the advantage of the high inter-plane thermal conductivity to quickly transfer heat (from the LED substrate and the high temperature reverse transfer in the high thermal conductive plastic) to the other end of the assembly part 1 (also the cold end). The other end of the assembly part 1 is not covered with the high thermal conductive plastic, and the heat is directly dissipated to the air through air convection. It can also use heat conduction to transfer the heat to other accessories assembled with it for heat dissipation, such as the metal base of the bulb lamp, which is more conducive to rapid heat dissipation. On the one hand, it helps the LED substrate to dissipate heat, thereby increasing the service life of the LED substrate and reducing the life attenuation caused by heat. On the other hand, it also increases the service life of the control board and avoids the reduction of the life of the electronic components of the control board due to being in a high temperature environment for a long time.

[0061] In other embodiments, those skilled in the art can, according to the concept of the present application, set the length of the assembly portion end 110 to be shorter than the heat dissipation portion end 202, while still having the functions described in the present application, only with a slightly reduced effect. It can to a certain extent prevent the metal cup or high thermal conductivity plastic from directly transferring heat in reverse through the heated air, thereby affecting the service life of the control panel, improving the original effect or meeting the customer's heat dissipation needs, all of which are within the scope of protection of the present application.

[0062] In this embodiment, the position where the assembly portion 1 contacts the heat dissipation portion 2 is a cylindrical structure. In other embodiments, those skilled in the art may also design it into other structures according to requirements.

[0063] In this embodiment, the heat dissipation part 2 further includes a plurality of fins 203, and the height of the fins 203 gradually decreases in the direction away from the LED substrate, so as to minimize the size of the heat dissipation part 2 while ensuring the heat dissipation near the LED substrate.

[0064] It should be noted that in the present application, the location on the heat dissipation portion 2 that contacts the assembly portion 1 has a structure that matches the assembly portion 1, such as Figure 5 shown.

[0065] It should be noted that the volume resistivity of the insulating thermally conductive plastic is greater than 10 10 Ω•m. Those skilled in the art may also define it according to other parameters characterizing insulation characteristics, without limitation, as long as the control board is safe to use.

[0066] It should be noted that the LED substrate refers to the basic structure that supports the LED chip and helps it dissipate heat. Generally, a heat dissipation structure needs to be set to prevent performance degradation or shortened life due to overheating. Example 2

[0067] An LED lamp includes the LED heat sink in Example 1. Other structures such as a control board for a bulb lamp, an LED substrate, a lamp holder, and a bulb shell lamp structure are well known to those skilled in the art and are not shown in the figure. Those skilled in the art can implement the solution based on the ideas of the present application without creative labor.

[0068] In other embodiments, LED lamps may also include high bay lamps, bulb lamps, mining lamps, downlights, spotlights, A lamps, T lamps, etc., and lamps that have additional control panel installation requirements that require insulation. Those skilled in the art may use them in conjunction with other components of LED lamps such as reflectors and lampshades based on the ideas of this application, and no further details will be given.

[0069] It should be noted that the components used in the above embodiments can be selected or replaced by those skilled in the art according to their needs, without exceeding the protection scope of this application.

Claims

1. LED heat sink, characterized in that, It comprises an assembly part and a heat dissipation part sleeved on the assembly part, wherein the assembly part is provided with a cavity for accommodating a control board, the heat dissipation part is provided with a heat transfer area for fixing an LED substrate, the heat dissipation part and the assembly part are made of thermally conductive plastics, the thermal conductivity of the heat dissipation part is greater than the thermal conductivity of the assembly part, and the assembly part is made of insulating thermally conductive plastics; the heat dissipation part and the assembly part are integrally formed by a two-color injection molding process or an insert process.

2. The LED heat sink according to claim 1, characterized in that: The assembly part is made of insulating thermally conductive plastic with a thermal conductivity coefficient λ1 satisfying 0.5≤λ1≤3W / (m•K), and the heat dissipation part is made of thermally conductive plastic with a thermal conductivity coefficient λ2 satisfying λ2>3W / (m•K).

3. The LED heat sink according to claim 1, characterized in that: One or more convex ribs and / or undercut structures are provided on the assembly portion and / or the heat dissipation portion at the position where the assembly portion and the heat dissipation portion contact each other.

4. The LED heat sink according to claim 1, characterized in that: The assembly portion is provided with a limiting ring, which is used to limit the end position of the heat dissipation portion structure during the injection molding process.

5. The LED heat sink according to claim 1, characterized in that: The assembly portion is provided with a mounting structure for fixing the control board, and the mounting structure comprises a card slot for inserting the control board into the card slot for fixing, and the card slot is a bell-mouth structure.

6. The LED heat sink according to claim 5, characterized in that: The installation structure also includes a limiting structure capable of limiting the installation position of the control board. The limiting structure includes a side wall of the card slot.

7. The LED heat sink according to claim 5, characterized in that: The mounting structure is located on a side away from the LED substrate.

8. The LED heat sink according to claim 1, characterized in that: The heat transfer zone also includes a heat conductive metal plate.

9. The LED heat sink according to claim 1, characterized in that: The heat dissipation part is attached to the LED substrate in the heat transfer area through a heat conductive adhesive, and / or the heat dissipation part fixes the LED substrate in the heat transfer area through a fixing mechanism.

10. The LED heat sink according to claim 9, characterized in that: The fixing mechanism comprises a fixing column arranged at the end of the assembly part, which fixes the LED substrate in the heat transfer area.

11. The LED heat sink according to claim 10, characterized in that: The fixing column has an inverted structure on the side where the assembly portion contacts the heat dissipation portion.

12. The LED heat sink according to claim 1, characterized in that: A wire groove and a wire hole are arranged in the assembly part. The wire groove is located on the side where the assembly part contacts the heat dissipation part and protrudes from the outer surface of the assembly part, so as to limit the relative rotation displacement that may occur between the assembly part and the heat dissipation part.

13. The LED heat sink according to claim 1, characterized in that: The end position of the assembly portion is smaller than or equal to the end position of the heat dissipation portion.

14. The LED heat sink according to claim 1, characterized in that: The heat dissipation part is also provided with a plurality of fins, and the height of the fins gradually decreases in the direction away from the LED substrate.

15. An LED lamp, characterized in that: The LED heat sink comprises the LED heat sink as claimed in any one of claims 1 to 14.

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