Power supply short circuit positioning method, system, device and equipment and storage medium

Abstract

The invention provides a power supply short circuit positioning method, system, device and equipment and a storage medium, and relates to the technical field of electronic detection, the power supply short circuit positioning system comprises a printed circuit board, a power supply excitation module and a thermal imager, and the printed circuit board comprises an inductor, a capacitor and at least one load; the power supply excitation module is used for removing the inductor and applying power supply excitation at the power supply network under the condition of determining that the printed circuit board has the power supply short circuit, so that a loop is formed between a power supply short circuit point and the power supply excitation module; the power supply short circuit condition comprises power supply short circuit after a decoupling capacitor of any load is broken down or power supply short circuit after a power supply pin and a ground pin in the BGA packaged load are welded; the thermal imager is used for detecting the temperature value of each position in the loop; determining the position of a power supply short circuit point according to the temperature value of each position; the resistance of the power supply short-circuit point is larger than that of the power supply plane, and the higher the resistance is, the higher the temperature value is. The positioning efficiency of the power supply short circuit point is improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic detection technology, and in particular to a method, system, device, equipment and storage medium for locating a power supply short circuit. Background Art

[0002] With the development of technology, more and more power planes and ground planes are used in the design of power supplies on circuit boards. Circuit boards designed in this way have many advantages. However, if a power plane and a ground plane on the circuit board are short-circuited due to a certain fault on the circuit board, it is difficult to locate the short-circuit point and find the cause of the fault.

[0003] In the prior art, when any decoupling capacitor breaks down and short-circuits, causing a power short circuit, the power short-circuit point is determined by removing the decoupling capacitors one by one for investigation. However, some power networks on the circuit board include more than a dozen loads, and the power networks of some loads include hundreds of decoupling capacitors. The efficiency of locating the power short-circuit point based on this method is low.

[0004] Therefore, how to quickly locate the short-circuit point of the circuit board power supply has become a technical problem that urgently needs to be solved in the industry. Summary of the invention

[0005] The present invention provides a power short circuit positioning method, system, device, equipment and storage medium, which are used to solve the defect of low power short circuit point positioning efficiency in the prior art, realize rapid positioning of circuit board power short circuit points, and improve the positioning efficiency of power short circuit points.

[0006] In a first aspect, the present invention provides a power short circuit positioning system, characterized in that the power short circuit positioning system comprises a printed circuit board, a power excitation module and a thermal imager, wherein the printed circuit board comprises an inductor, a capacitor and at least one load; wherein,

[0007] The power excitation module is used to remove the inductor and apply power excitation at the power network when it is determined that there is a power short circuit on the printed circuit board, so as to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: power short circuit after the decoupling capacitor of any of the loads is broken down, and power short circuit after the power pin and the ground pin of the BGA packaged load are welded; The thermal imager is used to detect the temperature value of each position in the loop; the position of the power short-circuit point is determined according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0008] According to a power short circuit positioning system provided by the present invention, the power excitation module is a controllable constant current source; the power excitation is applied at the power network, including: Applying milliampere-level power excitation at the power network through the controllable constant current source; The milliampere-level power excitation is a milliampere-level current that increases successively from a starting value according to a preset increment.

[0009] According to a power supply short circuit positioning system provided by the present invention, the printed circuit board further includes a DC-DC voltage regulated power supply; The DC-DC regulated power supply is used to output power to the load through the inductor and the capacitor when there is no power short circuit on the printed circuit board; The inductor and the capacitor are used to perform low-pass filtering on the output power of the DC-DC regulated power supply to obtain a DC voltage; the DC voltage is used to supply power to each of the loads.

[0010] According to a power short circuit positioning system provided by the present invention, the power short circuit positioning system further includes a fault repair module; wherein,

[0011] The fault repair module is used to repair the short circuit of the printed circuit board according to the position of the power short circuit point.

[0012] According to a power short circuit positioning system provided by the present invention, the fault repair module is specifically used for: Determine whether the decoupling capacitor at the position of the power short-circuit point is faulty; In the case where the decoupling capacitor at the location of the power short-circuit point is determined to be faulty, replacing the decoupling capacitor; Determine whether the load at the position of the power short-circuit point is the load of the BGA package; When it is determined that the load where the power short-circuit point is located is the load of the BGA package, the welding points of the power pins and the ground pins in the load of the BGA package are re-welded.

[0013] In a second aspect, the present invention provides a method for locating a power short circuit, which is applied to a power excitation module in a power short circuit positioning system, wherein the power short circuit positioning system comprises a printed circuit board, the power excitation module and a thermal imager, wherein the printed circuit board comprises an inductor, a capacitor and at least one load; the method comprises the following steps: When it is determined that the printed circuit board has a power short circuit, the inductor is removed, and a power excitation is applied to the power network to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0014] In a third aspect, the present invention further provides a power short circuit positioning device, which is applied to a power excitation module in a power short circuit positioning system, wherein the power short circuit positioning system comprises a printed circuit board, the power excitation module and a thermal imager, wherein the printed circuit board comprises an inductor, a capacitor and at least one load; the device comprises the following modules: A positioning module is used to remove the inductor and apply power excitation at the power network to form a loop between the power short-circuit point and the power excitation module when it is determined that the printed circuit board has a power short circuit. The power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0015] In a fourth aspect, the present invention further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, a method for locating a power short circuit as described above is implemented.

[0016] In a fifth aspect, the present invention further provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements a method for locating a power short circuit as described in any one of the above.

[0017] In a sixth aspect, the present invention further provides a computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the method for locating a power short circuit as described above is implemented.

[0018] The present invention provides a method, system, device, equipment and storage medium for locating a power short circuit. The power short circuit locating system includes a printed circuit board, a power excitation module and a thermal imager. The printed circuit board includes an inductor, a capacitor and at least one load. The power excitation module is used to remove the inductor when it is determined that there is a power short circuit on the printed circuit board, and apply power excitation at the power network to form a loop between the power short circuit point and the power excitation module. The power short circuit situation includes at least one of the following: power short circuit after the decoupling capacitor of any load is broken down, and power short circuit after the power pin and the ground pin of the BGA packaged load are welded; the thermal imager is used to detect the temperature value of each position in the loop; the position of the power short circuit point is determined according to the temperature value of each position; the resistance of the power short circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short circuit point, the higher the temperature value of the position corresponding to the power short circuit point.

[0019] The present invention mainly applies power excitation to the short-circuited power supply through a power excitation module, and observes the hot spot distribution on the circuit board through a thermal imaging device thermal imager, which can quickly locate the power short circuit that cannot be checked by the naked eye and 3D X-ray, thereby improving the efficiency of locating the power short circuit point. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is one of the structural schematic diagrams of the power supply short circuit positioning system provided by the present invention.

[0022] Figure 2 This is the second structural schematic diagram of the power short circuit positioning system provided by the present invention.

[0023] Figure 3 It is a schematic flow chart of the method for locating a power supply short circuit provided by the present invention.

[0024] Figure 4 It is a structural schematic diagram of a power supply short-circuit positioning device provided by the present invention.

[0025] Figure 5 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first" and "second" are generally a class, and the number of objects is not limited. For example, the first node can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the front and back associated objects are in an "or" relationship.

[0028] Combine the following Figure 1-Figure 5 The invention describes a method, system, device, equipment and storage medium for locating a power supply short circuit.

[0029] Figure 1 FIG. 1 is one of the structural schematic diagrams of the power supply short circuit positioning system provided by the present invention, such as Figure 1 As shown, the power short circuit positioning system 100 includes a printed circuit board 130, a power excitation module 110 and a thermal imager 120, wherein the printed circuit board 130 includes an inductor, a capacitor and at least one load; wherein,

[0030] The power excitation module 110 is used to remove the inductor and apply power excitation at the power network when a power short circuit occurs on the printed circuit board 130, so as to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: power short circuit after the decoupling capacitor of any load is broken down, and power short circuit after the power pin and the ground pin of the BGA packaged load are welded; Specifically, it should be noted that the execution subject of this embodiment is a power short circuit positioning system 100, which is used to quickly locate the power short circuit point. Figure 1 As shown, the power short circuit positioning system 100 includes a printed circuit board 130, a power excitation module 110 and a thermal imager 120, wherein the printed circuit board 130 includes an inductor, a capacitor and at least one load.

[0031] Among them, the printed circuit board (PCB) is an indispensable basic component in electronic devices. As a carrier and connector of electronic components, its main function is to provide electrical connection and mechanical support for electronic components, and realize signal transmission and function realization in electronic devices. The application field of PCB is very wide, covering almost all industries. In the field of consumer electronics, such as mobile phones, tablets, TVs and other devices, PCB is a key component that connects and supports chips, sensors, power supplies and other components. In the communication industry, PCB is used in mobile phone base stations, communication equipment, etc., and requires high-frequency characteristics, anti-interference ability and stability. In addition, PCB is also widely used in automotive electronics, industrial control, medical equipment and other fields. The power excitation module usually refers to the component used to provide energy in the electronic circuit, converting the input electrical energy into the form required by the circuit to drive other components in the circuit to work. The excitation source can be a DC power supply, such as a battery or a constant current source, or an AC power supply, such as a signal generator. In more complex electronic devices, the excitation module may include a pulse power excitation circuit to provide a pulse signal of a specific frequency and amplitude to meet the needs of testing and measurement. In addition, there are modular power systems, such as ReFlex Power modules, which provide programmable DC, AC and electronic loads for automated test equipment and production test environments, and can provide programmable excitation and bias power. A thermal imager is a device that uses an infrared detector and an optical imaging lens to receive the infrared radiation energy distribution pattern of the target under test and then convert it into a visible thermal image. This device can convert the invisible infrared energy emitted by the object into a visible thermal image, where different colors represent different temperatures, so that the overall temperature distribution of the target under test can be observed. An inductor is an electronic component that can convert electrical energy into magnetic energy and store it. It is made of a wire coil. Its working principle is that when current passes through the inductor, a magnetic field is generated around it. When the current changes, the magnetic field will also change, thereby generating a reverse electromotive force and hindering the change of current. This characteristic makes the inductor equivalent to a short circuit in a DC circuit, and an obstruction in an AC circuit, especially when the current frequency is high, this obstruction is more obvious. A load refers to an electronic component connected to both ends of the power supply in the circuit, which converts electrical energy into other forms of energy. Loads can be inductive, capacitive or resistive, and they behave differently in the circuit and affect the current and voltage. For example, a motor is a load that converts electrical energy into mechanical energy, while a light bulb is a load that converts electrical energy into heat and light.

[0032] The power short circuit positioning system provided by the present invention has the following working process for positioning the power short circuit point: It should be noted that a power short circuit is a serious circuit fault that may cause circuit damage, fire, or even personal injury. A short circuit is usually caused by direct contact between wires or connection through a conductor with very low resistance. A short circuit will generate a huge current, which may cause thermal, electrodynamic, and magnetic effects on electrical equipment, resulting in equipment damage, voltage sag, and power outages.

[0033] Exemplarily, the power supply short circuit situation includes: the power supply short circuit after the decoupling capacitor of any of the loads is broken down, wherein the decoupling capacitor can filter out high-frequency noise in the circuit, stabilize the power supply, and ensure the normal operation of the circuit. When the decoupling capacitor breaks down, that is, the dielectric material of the capacitor is damaged, resulting in a conductive channel between the two electrodes, a power supply short circuit may be caused. This is because the breakdown of the capacitor causes the voltage across it to drop sharply, which may cause the current in the circuit to increase sharply, forming a short circuit phenomenon. Another example of a power supply short circuit is that the power supply short circuit occurs after the power pin and the ground pin are welded in a load packaged in a ball grid array (BGA). BGA is a packaging technology widely used in electronic components, especially integrated circuits, which allows chips to be connected to I / O (input / output) at a higher density while providing better electrical performance and heat dissipation efficiency. The main features of BGA packaging include: high I / O density, better electrical performance, smaller package size, and easy automated assembly. The types of BGA packaging include, for example: PBGA (Plastic Ball Grid Array): using plastic material as a packaging substrate, which is low in cost and suitable for consumer electronic products. CBGA (Ceramic Ball Grid Array): uses ceramic materials as the package substrate, which has better thermal and electrical performance, but the cost is higher. TBGA (Tape Ball Grid Array): uses flexible tape instead of traditional plastic or ceramic substrates, which can provide better flexibility and thinner packages. However, once the BGA package is soldered to the circuit board, the chip of the BGA package is difficult to remove and replace, which increases the difficulty of repair.

[0034] In the present invention, when there is a power short circuit on the printed circuit board 130, the inductor in the positioning system of the power short circuit is removed, that is, the original voltage-stabilized power supply in the system is disconnected; further, the power excitation module 110 applies power excitation at the power network to form a loop between the power short circuit point and the power excitation module. Specifically, the loop goes from the power excitation module such as a controllable constant current source to the power short circuit point to the ground wire, and then returns to the controllable constant current source.

[0035] The thermal imager 120 is used to detect the temperature value of each position in the loop; the position of the power short-circuit point is determined according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0036] Specifically, after forming a loop from the power excitation module to the power short-circuit point, since the resistance of the power short-circuit point is greater than the resistance of the power plane, according to the power calculation formula: P=I²R, the greater the resistance, the greater the power, and the more serious the heat will be. Using a thermal imager to check the hot spots of the circuit board, it is easy to find abnormally high temperature areas and then locate the power short-circuit point.

[0037] The system provided in this embodiment includes a printed circuit board, a power excitation module and a thermal imager, wherein the printed circuit board includes an inductor, a capacitor and at least one load; wherein the power excitation module is used to remove the inductor and apply power excitation at the power network when it is determined that there is a power short circuit on the printed circuit board, so as to form a loop between the power short circuit point and the power excitation module; wherein the power short circuit situation includes at least one of the following: power short circuit after the decoupling capacitor of any of the loads is broken down, and power short circuit after the power pin and the ground pin of the BGA packaged load are welded; the thermal imager is used to detect the temperature value of each position in the loop; determine the position of the power short circuit point according to the temperature value of each position; the resistance of the power short circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short circuit point, the higher the temperature value of the position corresponding to the power short circuit point.

[0038] The present invention mainly applies power excitation to the short-circuited power supply through a power excitation module, and observes the hot spot distribution on the circuit board through a thermal imaging device thermal imager, so as to quickly locate the power short circuit that cannot be detected by naked eyes and 3D X-ray, thereby improving the positioning efficiency of the power short circuit point, and then the power short circuit point can be repaired in a targeted manner.

[0039] According to a power short circuit positioning system 100 provided by the present invention, the power excitation module 110 is a controllable constant current source; applying power excitation at the power network includes: Applying milliampere-level power excitation at the power network through the controllable constant current source; The milliampere-level power excitation is a milliampere-level current that increases successively from a starting value according to a preset increment.

[0040] Specifically, in some embodiments, the power excitation module is, for example, a controllable constant current source. The controllable constant current source is an electronic circuit that can adjust the output current as needed. It is a very useful circuit that can provide a stable and adjustable current output and is suitable for a variety of electronic devices and systems. The working principle of the controllable constant current source is usually based on a feedback control mechanism. In some designs, an operational amplifier, a voltage comparator, and a field effect transistor (MOSFET) are used to construct a constant current source. By adjusting the feedback resistor of the operational amplifier, the desired constant current value can be set. When the load changes and the current changes, the voltage change on the sampling resistor will be compared and amplified by the operational amplifier, and then the conduction degree of the field effect transistor is adjusted to maintain the current constant.

[0041] Correspondingly, the specific implementation process of the power excitation module applying power excitation at the power network includes the following steps: The controllable constant current source is used to apply milliampere-level power excitation to the power network. The milliampere-level power excitation is a milliampere-level current that increases from a starting value in a preset increment. For example, starting from a starting value such as 10 milliamperes, an initial increase of 5 milliamperes is sufficient to ensure that the thermal imager can detect abnormally high temperature areas. It should be noted that a maximum excitation value is often preset to avoid excessive current from damaging the circuit board.

[0042] In the system provided in this embodiment, the power excitation module 110 is a controllable constant current source; the milliampere-level power excitation is applied to the power network through the controllable constant current source, wherein the milliampere-level power excitation is a milliampere-level current that increases successively from a starting value according to a preset increment, so that a loop is formed between the power short-circuit point and the power excitation module, and then the hot spot distribution on the circuit board is observed by a thermal imaging device thermal imager to quickly locate the power short-circuit point.

[0043] According to a power supply short-circuit positioning system 100 provided by the present invention, the printed circuit board 130 further includes a DC-DC voltage-stabilized power supply; The DC-DC regulated power supply is used to output power to the load through the inductor and the capacitor when there is no power short circuit on the printed circuit board; The inductor and the capacitor are used to perform low-pass filtering on the output power of the DC-DC regulated power supply to obtain a DC voltage; the DC voltage is used to supply power to each of the loads.

[0044] Specifically, in some embodiments, the printed circuit board 130 also includes a DC-DC regulated power supply and at least two capacitors. A DC-DC regulated power supply is an electronic device that converts a fixed DC voltage into another fixed DC voltage. It adjusts the input voltage by using switching elements (such as transistors or MOSFETs) to produce the required output voltage. In DC-DC regulated power supplies, capacitors play a vital role. They are usually used for filtering at the input and output ends to reduce power supply ripple and noise. Capacitors can also store energy to smooth the output voltage during the switching process of the switching element. In some DC-DC converter designs, capacitors may also be used to implement specific voltage conversion functions, such as boost or buck.

[0045] The DC-DC regulated power supply is used to output to the load through the inductor and the capacitor when there is no power short circuit on the printed circuit board; the inductor and the capacitor are used to low-pass filter the output power of the DC-DC regulated power supply to obtain a DC voltage; the DC voltage is used to power each of the loads.

[0046] In the system provided by this embodiment, the DC-DC regulated power supply is used to output power to the load through the inductor and the capacitor when there is no power short circuit on the printed circuit board; the inductor and the capacitor are used to perform low-pass filtering on the output power of the DC-DC regulated power supply to obtain a DC voltage; the DC voltage is used to power each of the loads to achieve normal power supply of the circuit.

[0047] According to a power short circuit positioning system 100 provided by the present invention, the power short circuit positioning system 100 further includes a fault repair module; wherein,

[0048] The fault repair module is used to repair the short circuit of the printed circuit board according to the position of the power short circuit point.

[0049] Specifically, in some embodiments, the power short circuit positioning system 100 further includes a fault repair module. After the power short circuit point is located using a thermal imager, the fault repair module can be further used to perform short circuit repair on the printed circuit board according to the position of the power short circuit point to ensure normal circuit recovery.

[0050] In the system provided in this embodiment, the fault repair module repairs the short circuit of the printed circuit board according to the position of the power short circuit point that is quickly located. The operation is simple, and this method will not cause any damage to the circuit board. It is convenient for troubleshooting and repairing power short circuit faults, and the repair efficiency is high.

[0051] According to a power short circuit positioning system 100 provided by the present invention, the fault repair module is specifically used for: Determine whether the decoupling capacitor at the position of the power short-circuit point is faulty; In the case where the decoupling capacitor at the location of the power short-circuit point is determined to be faulty, replacing the decoupling capacitor; Determine whether the load at the position of the power short-circuit point is the load of the BGA package; When it is determined that the load where the power short-circuit point is located is the load of the BGA package, the welding points of the power pins and the ground pins in the load of the BGA package are re-welded.

[0052] Specifically, the fault repair module is specifically used to: Determine whether the decoupling capacitor at the location of the power short-circuit point is faulty, and replace the decoupling capacitor if it is determined that the decoupling capacitor at the location of the power short-circuit point is faulty; Determine whether the load at the position of the power short-circuit point is the load of the BGA package. If it is determined that the load at the position of the power short-circuit point is the load of the BGA package, re-solder the welding points of the power pins and the ground pins in the load of the BGA package.

[0053] In the system provided by the present embodiment, the fault repair module performs short circuit repair on the printed circuit board according to the position of the power short-circuit point that is quickly located. The operation is simple. When it is determined that the decoupling capacitor at the position of the power short-circuit point is faulty, the decoupling capacitor is replaced. When it is determined that the load at the position of the power short-circuit point is the load of the BGA package, the welding points of the power pins and the ground pins in the load of the BGA package are re-soldered. This method will not cause any damage to the circuit board, is convenient for troubleshooting and repairing power short-circuit faults, and has a high repair efficiency.

[0054] For example, Figure 2 FIG. 2 is a second structural diagram of the power supply short circuit positioning system provided by the present invention, such as Figure 2 As shown, the system includes: a DC-DC regulated power supply with position number U1 on the PCB, an inductor L1, capacitors C1, C2~C m , load 1, load 2~load n, load 1 is a complex BGA package chip, with dozens of power pins of the same network and a corresponding number of decoupling capacitors C i ~C jThe DC-DC regulated power supply output of the upper position number U1 on the PCB is low-pass filtered through L1, C1, C2~Cm to supply power to load 1, load 2~load n. Assuming that the VCC power supply pin near Cj is short-circuited to the ground, it is difficult to check with the naked eye. If it is a capacitor breakdown short circuit, it cannot be detected by 3D X-ray. It is necessary to use the adjustable constant current source + thermal imaging method of the present invention to quickly locate the short circuit point and then repair the circuit board.

[0055] Figure 3 The present invention is a flowchart of a method for locating a power short circuit provided by the present invention. The method is applied to a power excitation module in a power short circuit locating system. The power short circuit locating system includes a printed circuit board, a power excitation module and a thermal imager. The printed circuit board includes an inductor, a capacitor and at least one load. The method includes the following steps: Step 301: when it is determined that there is a power short circuit on the printed circuit board, the inductor is removed, and a power excitation is applied to the power network to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any load is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; Among them, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane. The greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0056] Specifically, it should be noted that the execution subject of this embodiment is a power excitation module in a power short circuit positioning system, which can achieve rapid positioning of a power short circuit on a circuit board and improve the positioning efficiency of the power short circuit.

[0057] Among them, Figure 1 As shown, the power short circuit positioning system includes a printed circuit board, a power excitation module and a thermal imager, and the printed circuit board includes an inductor, a capacitor and at least one load. Correspondingly, the specific implementation process of the power short circuit point method includes the following steps: It should be noted that a power short circuit is a serious circuit fault that may cause circuit damage, fire, or even personal injury. A short circuit is usually caused by direct contact between wires or connection through a conductor with very low resistance. A short circuit will generate a huge current, which may cause thermal, electrodynamic, and magnetic effects on electrical equipment, resulting in equipment damage, voltage sag, and power outages.

[0058] Exemplarily, the power supply short circuit situation includes: the power supply short circuit after the decoupling capacitor of any of the loads is broken down, wherein the decoupling capacitor can filter out high-frequency noise in the circuit, stabilize the power supply, and ensure the normal operation of the circuit. When the decoupling capacitor breaks down, that is, the dielectric material of the capacitor is damaged, resulting in a conductive channel between the two electrodes, a power supply short circuit may be caused. This is because the breakdown of the capacitor causes the voltage across it to drop sharply, which may cause the current in the circuit to increase sharply, forming a short circuit phenomenon. Another example of a power supply short circuit is that the power supply short circuit occurs after the power pin and the ground pin are welded in a load packaged in a ball grid array (BGA). BGA is a packaging technology widely used in electronic components, especially integrated circuits, which allows chips to be connected to I / O (input / output) at a higher density while providing better electrical performance and heat dissipation efficiency. The main features of BGA packaging include: high I / O density, better electrical performance, smaller package size, and easy automated assembly. The types of BGA packaging include, for example: PBGA (Plastic Ball Grid Array): using plastic material as a packaging substrate, which is low in cost and suitable for consumer electronic products. CBGA (Ceramic Ball Grid Array): uses ceramic materials as the package substrate, which has better thermal and electrical performance, but the cost is higher. TBGA (Tape Ball Grid Array): uses flexible tape instead of traditional plastic or ceramic substrates, which can provide better flexibility and thinner packages. However, once the BGA package is soldered to the circuit board, the chip of the BGA package is difficult to remove and replace, which increases the difficulty of repair.

[0059] When it is determined that there is a power short circuit on the printed circuit board, the inductor is removed and power excitation is applied to the power network to form a loop between the power short circuit point and the power excitation module, wherein the loop is used for the thermal imager to detect the temperature value of each position in the loop, and the position of the power short circuit point is determined according to the temperature value of each position; the resistance of the power short circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short circuit point, the higher the temperature value of the position corresponding to the power short circuit point.

[0060] After forming a loop from the power excitation module to the power short-circuit point, since the resistance of the power short-circuit point is greater than the resistance of the power plane, according to the power calculation formula: P=I²R, the greater the resistance, the greater the power, and the more serious the heat generation. Further, the present invention can use a thermal imager to check the hot spots of the circuit board, and it is easy to find abnormally high temperature areas, and then locate the power short-circuit point, so as to quickly locate the power short-circuit point.

[0061] The method provided in this embodiment is applied to a power excitation module in a power short circuit positioning system. The power short circuit positioning system includes a printed circuit board, a power excitation module and a thermal imager. The printed circuit board includes an inductor, a capacitor and at least one load. First, when it is determined that there is a power short circuit on the printed circuit board, the inductor is removed, and power excitation is applied at the power network to form a loop between the power short circuit point and the power excitation module. The power short circuit includes at least one of the following: power short circuit after the decoupling capacitor of any load is broken down, and power short circuit after the power pin and the ground pin of the BGA packaged load are welded. Furthermore, because the resistance of the power short circuit point is greater than the resistance of the power plane, the greater the resistance of the power short circuit point, the higher the temperature value of the position corresponding to the power short circuit point. The loop is used for the thermal imager to detect the temperature value of each position in the loop, and the position of the power short circuit point is determined according to the temperature value of each position.

[0062] The present invention mainly applies power excitation to the short-circuited power supply through a power excitation module, and observes the hot spot distribution on the circuit board through a thermal imaging device thermal imager, which can quickly locate the power short circuit that cannot be checked by the naked eye and 3D X-ray, thereby improving the efficiency of locating the power short circuit point.

[0063] The power short circuit positioning device provided by the present invention is described below. The power short circuit positioning device described below and the power short circuit positioning method described above can correspond to each other.

[0064] Figure 4 : is a schematic diagram of the structure of the power short circuit positioning device provided by the present invention, the device is applied to the power excitation module in the power short circuit positioning system, the power short circuit positioning system comprises a printed circuit board, the power excitation module and a thermal imager, the printed circuit board comprises an inductor, a capacitor and at least one load; Figure 4 As shown, the device includes the following modules: The positioning module 410 is used to remove the inductor and apply power excitation at the power network to form a loop between the power short-circuit point and the power excitation module when it is determined that the printed circuit board has a power short circuit. The power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0065] The device provided in this embodiment is applied to the power excitation module in the power short circuit positioning system 400, including the positioning module 410, the power short circuit positioning system includes a printed circuit board, a power excitation module and a thermal imager, the printed circuit board includes an inductor, a capacitor and at least one load; first, when determining that there is a power short circuit on the printed circuit board, the positioning module 410 removes the inductor and applies power excitation at the power network to form a loop between the power short circuit point and the power excitation module; wherein the power short circuit situation includes at least one of the following: power short circuit after the decoupling capacitor of any load is broken down, and power short circuit after the power pin and the ground pin in the BGA packaged load are welded; further, because the resistance of the power short circuit point is greater than the resistance of the power plane, the greater the resistance of the power short circuit point, the higher the temperature value of the position corresponding to the power short circuit point, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and the position of the power short circuit point is determined according to the temperature value of each position.

[0066] The present invention mainly applies power excitation to the short-circuited power supply through a power excitation module, and observes the hot spot distribution on the circuit board through a thermal imaging device thermal imager, which can quickly locate the power short circuit that cannot be checked by the naked eye and 3D X-ray, thereby improving the efficiency of locating the power short circuit point.

[0067] According to a power short circuit positioning device provided by the present invention, the power excitation module is a controllable constant current source; the positioning module 410 is specifically used for: Applying milliampere-level power excitation at the power network through the controllable constant current source; The milliampere-level power excitation is a milliampere-level current that increases successively from a starting value according to a preset increment.

[0068] Figure 5 An example of a physical structure diagram of an electronic device is shown in FIG. Figure 5 As shown, the electronic device may include: a processor 510, a communications interface 520, a memory 530 and a communication bus 540, wherein the processor 510, the communications interface 520 and the memory 530 communicate with each other through the communication bus 540. The processor 510 may call the logic instructions in the memory 530 to execute the power short circuit positioning method, which is applied to the power excitation module in the power short circuit positioning system, the power short circuit positioning system includes a printed circuit board, the power excitation module and a thermal imager, the printed circuit board includes an inductor, a capacitor and at least one load; the method includes: When it is determined that the printed circuit board has a power short circuit, the inductor is removed, and a power excitation is applied to the power network to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0069] In addition, the logic instructions in the above-mentioned memory 530 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0070] On the other hand, the present invention further provides a computer program product, the computer program product includes a computer program, the computer program can be stored on a non-transitory computer-readable storage medium, when the computer program is executed by a processor, the computer can execute the power short circuit positioning method provided by the above methods, applied to the power excitation module in the power short circuit positioning system, the power short circuit positioning system includes a printed circuit board, the power excitation module and a thermal imager, the printed circuit board includes an inductor, a capacitor and at least one load; the method includes: When it is determined that the printed circuit board has a power short circuit, the inductor is removed, and a power excitation is applied to the power network to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0071] On the other hand, the present invention further provides a non-transitory computer-readable storage medium having a computer program stored thereon, which is implemented when the computer program is executed by a processor to execute the power short circuit positioning method provided by the above methods, and is applied to a power excitation module in the power short circuit positioning system, the power short circuit positioning system comprising a printed circuit board, the power excitation module and a thermal imager, the printed circuit board comprising an inductor, a capacitor and at least one load; the method comprising: When it is determined that the printed circuit board has a power short circuit, the inductor is removed, and a power excitation is applied to the power network to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

[0072] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0073] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A power short circuit positioning system, characterized in that: The power short circuit positioning system comprises a printed circuit board, a power excitation module and a thermal imager, wherein the printed circuit board comprises an inductor, a capacitor and at least one load; wherein, The power excitation module is used to remove the inductor and apply power excitation at the power network when it is determined that there is a power short circuit on the printed circuit board, so as to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: power short circuit after the decoupling capacitor of any of the loads is broken down, and power short circuit after the power pin and the ground pin of the BGA packaged load are welded; The thermal imager is used to detect the temperature value of each position in the loop; the position of the power short-circuit point is determined according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

2. The power short circuit positioning system according to claim 1, characterized in that: The power excitation module is a controllable constant current source; The applying power excitation at the power network comprises: Applying milliampere-level power excitation at the power network through the controllable constant current source; The milliampere-level power excitation is a milliampere-level current that increases successively from a starting value according to a preset increment.

3. The power short circuit positioning system according to claim 1, characterized in that: The printed circuit board also includes a DC-DC regulated power supply; The DC-DC regulated power supply is used to output power to the load through the inductor and the capacitor when there is no power short circuit on the printed circuit board; The inductor and the capacitor are used to perform low-pass filtering on the output power of the DC-DC regulated power supply to obtain a DC voltage; the DC voltage is used to supply power to each of the loads.

4. The power short circuit positioning system according to claim 1, characterized in that: The power short circuit positioning system also includes a fault repair module; wherein, The fault repair module is used to repair the short circuit of the printed circuit board according to the position of the power short circuit point.

5. The power short circuit positioning system according to claim 4, characterized in that: The fault repair module is specifically used for: Determine whether the decoupling capacitor at the position of the power short-circuit point is faulty; In the case where the decoupling capacitor at the location of the power short-circuit point is determined to be faulty, replacing the decoupling capacitor; Determine whether the load at the position of the power short-circuit point is the load of the BGA package; When it is determined that the load where the power short-circuit point is located is the load of the BGA package, the welding points of the power pins and the ground pins in the load of the BGA package are re-welded.

6. A method for locating a power short circuit, characterized in that: A power excitation module applied to a power short circuit positioning system as claimed in any one of claims 1 to 5, wherein the power short circuit positioning system comprises a printed circuit board, the power excitation module and a thermal imager, wherein the printed circuit board comprises an inductor, a capacitor and at least one load; and the method comprises: When it is determined that the printed circuit board has a power short circuit, the inductor is removed, and a power excitation is applied to the power network to form a loop between the power short circuit point and the power excitation module; the power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

7. A power short circuit positioning device, characterized in that: A power supply excitation module used in a power supply short circuit positioning system, the power supply short circuit positioning system comprising a printed circuit board, the power supply excitation module and a thermal imager, the printed circuit board comprising an inductor, a capacitor and at least one load; the device comprises: A positioning module is used to remove the inductor and apply power excitation at the power network to form a loop between the power short-circuit point and the power excitation module when it is determined that the printed circuit board has a power short circuit. The power short circuit includes at least one of the following: a power short circuit after the decoupling capacitor of any of the loads is broken down, and a power short circuit after the power pin and the ground pin of the BGA packaged load are welded; In which, the loop is used for the thermal imager to detect the temperature value of each position in the loop, and determine the position of the power short-circuit point according to the temperature value of each position; the resistance of the power short-circuit point is greater than the resistance of the power plane, and the greater the resistance of the power short-circuit point, the higher the temperature value of the position corresponding to the power short-circuit point.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the method for locating a power short circuit as claimed in claim 6 is implemented.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for locating a power short circuit as claimed in claim 6 is implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the method for locating a power short circuit as claimed in claim 6 is implemented.

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