Electronic device

Abstract

Disclosed is an electronic device including: a display panel; a pad member disposed below the display panel; an electronic module inserted into a hole defined by the display panel and the pad member; and a light blocking pattern disposed on the electronic module, with the display panel interposed between the light blocking pattern and the electronic module. In a first state in which the display panel and the pad member are folded and a second state in which the display panel and the pad member are unfolded, the electronic module is spaced apart from a sidewall configured to define the aperture.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0018620, filed on February 14, 2020, and Korean Patent Application No. 10-2020-0050006, filed on April 24, 2020, which are hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to a foldable electronic device. Background Art

[0004] An electronic device generally includes an active area activated according to an electrical signal. The electronic device detects input applied from the outside through the active area and simultaneously displays various images to provide information to the user. In recent years, with the development of electronic devices having various shapes, active areas having various shapes have been used.

[0005] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the invention

[0006] The device constructed according to the exemplary embodiment of the present invention can provide an electronic device in which the area of ​​the effective region is expanded.

[0007] Devices constructed in accordance with exemplary embodiments of the present invention can also provide electronic devices with improved product reliability.

[0008] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0009] One or more embodiments of the present invention provide an electronic device comprising: a display panel; a pad member disposed below the display panel; an electronic module inserted into a hole defined by the display panel and the pad member; and a light blocking pattern disposed on the electronic module, wherein the display panel is interposed between the light blocking pattern and the electronic module, wherein in a first state in which the display panel and the pad member are folded and in a second state in which the display panel and the pad member are unfolded, the electronic module is spaced apart from a side wall configured to define the hole.

[0010] In an implementation, the light blocking pattern may be spaced apart from a viewing angle area of ​​the electronic module in the first state and the second state.

[0011] In an embodiment, the hole may include a first hole portion defined in the display panel and a second hole portion defined in the pad member, and a width of the second hole portion is greater than a width of the first hole portion.

[0012] In an implementation, the light blocking pattern may overlap a sidewall of the display panel defining the first hole portion when viewed on a plane.

[0013] In an implementation, a sidewall of the pad member defining the second hole portion may surround the light blocking pattern when viewed on a plane.

[0014] In an implementation, a sidewall of the pad member defining the second hole portion may not overlap the light blocking pattern.

[0015] In an embodiment, a plate may be disposed below the pad member, wherein a third hole portion may be defined in the plate, a width of the third hole portion being greater than a width of the first hole portion and less than a width of the second hole portion, and the first hole portion, the second hole portion, and the third hole portion may overlap with each other to define a hole.

[0016] In an embodiment, the light blocking pattern may have a ring shape having an inner diameter and an outer diameter surrounding the inner diameter, and the inner diameter may be smaller than the first hole portion, and the outer diameter may be larger than the first hole portion.

[0017] In an embodiment, a first distance between the inner diameter and an edge of the display panel defining the first hole portion may be different from a second distance between the outer diameter and an edge of the display panel defining the first hole portion.

[0018] In an embodiment, the first distance may be greater than the second distance.

[0019] In an embodiment, each of the first distance and the second distance may be determined based on component tolerance, equipment tolerance, and folding tolerance.

[0020] In an embodiment, the electronic device may include: an impact absorbing layer disposed on a display panel; and a hard coating layer disposed between the impact absorbing layer and the display panel, wherein a portion of the hard coating layer may be exposed through the hole.

[0021] In an embodiment, the impact absorbing layer may include a stretched film whose optical axis is controlled.

[0022] In an embodiment, an electronic device may include: a window disposed on the light blocking pattern; and a protection layer disposed on the window, wherein a sidewall of the protection layer further protrudes from a sidewall of the window.

[0023] In an embodiment, the distance between the window and the electronic module may be about 60% or more of the sum of the thicknesses of the components in which the respective moduli of the components defining the hole are equal to or less than the reference modulus.

[0024] In embodiments, the reference modulus may be about 50 MPa or less.

[0025] One or more exemplary embodiments of the present invention provide an electronic device comprising: a display panel; an electronic module configured to overlap a hole defined in the display panel; and a light blocking pattern having a ring shape and disposed on the electronic module, wherein the display panel is interposed between the electronic module and the light blocking pattern, and the light blocking pattern has an inner diameter and an outer diameter surrounding the inner diameter, wherein a first distance between the inner diameter and an edge of the hole defined in the display panel is different from a second distance between the outer diameter and the edge of the hole defined in the display panel.

[0026] In an embodiment, the first distance may be greater than the second distance.

[0027] In an embodiment, each of the first distance and the second distance may be determined based on component tolerance, equipment tolerance, and folding tolerance.

[0028] In an embodiment, in a first state in which the display panel is folded and a second state in which the display panel is unfolded, the electronic module may be spaced apart from an edge of the display panel defining the hole.

[0029] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept.

[0031] Figure 1A is a perspective view of an electronic device according to an embodiment of the inventive concept.

[0032] Figure 1B is a perspective view of an electronic device according to an embodiment of the inventive concept.

[0033] Figure 2 According to the embodiment of the present invention, Figure 1A A cross-sectional view of the electronic device taken along line II'.

[0034] Figure 3A is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0035] Figure 3B is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0036] Figure 4 is an exploded perspective view illustrating a portion of a configuration of an electronic device according to an embodiment of the inventive concept.

[0037] Figure 5 is a rear view showing a portion of the configuration of an electronic device according to an embodiment of the inventive concept.

[0038] Figure 6 According to the embodiment of the present invention, Figure 1A A cross-sectional view taken along line II-II'.

[0039] Figure 7 is a plan view of an electronic device according to an embodiment of the inventive concept.

[0040] Figure 8 According to the embodiment of the present invention, Figure 1A A cross-sectional view taken along line III-III'.

[0041] Fig.9A is a perspective view illustrating an operation of an electronic device according to an embodiment of the inventive concept.

[0042] Fig. 9B It is along Fig.9A A cross-sectional view taken along line IV-IV'.

[0043] Fig. 10A is a perspective view illustrating an operation of an electronic device according to an embodiment of the inventive concept.

[0044] Fig. 10B It is along Fig. 10A A cross-sectional view taken along line V-V'.

[0045] Fig.11 is a cross-sectional view for explaining a design dimension of an electronic device according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0046] In the following description, for the purpose of illustration, many specific details are elaborated, so as to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. As used herein, "implementation" and "implementation" are interchangeable words, which are non-limiting examples of one or more devices or methods in the inventive concept disclosed herein. However, it is obvious that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, in order to avoid unnecessarily blurring various exemplary embodiments, known structures and equipment are shown in block diagram form. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, construction and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0047] Unless otherwise specified, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of various embodiments may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0048] In the accompanying drawings, the use of hatching and / or shading is generally provided to clarify the boundaries between adjacent elements. Therefore, whether or not hatching or shading is present does not convey or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements, unless otherwise specified. In addition, in the accompanying drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the exemplary embodiments can be implemented differently, a specific processing sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0049] When an element, such as a layer, is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, directly connected to, or coupled to, another element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without intervening elements. In addition, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to the three axes of a rectangular coordinate system (such as, the x-axis, the y-axis, and the z-axis), and may be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0050] Although the terms "first", "second", etc. can be used in this article to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below can be referred to as the second element.

[0051] Spatially relative terms such as "below", "below", "under", "down", "above", "up", "above", "high", "side" (e.g., as in "sidewall"), etc. may be used herein for descriptive purposes and are thereby used to describe the relationship of one element to another element(s) as shown in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is turned over, the elements or features described as being "below" or "below" other elements or features will then be oriented to be "above" other elements or features. Therefore, the exemplary term "below" can cover both above and below orientations. In addition, the device can be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore the spatially relative descriptors used herein should be interpreted accordingly. As used herein, "viewed in a plane" refers to a plan view according to a direction perpendicular to the layer and / or substrate.

[0052] The terms used herein are for the purpose of describing a particular embodiment, rather than being intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular "one", "an" and "the" are intended to also include plural forms. In addition, when used in this specification, the terms "include", "include", "include" and / or "include" represent the existence of stated features, integers, steps, operations, elements, parts and / or its groups, but do not exclude the existence or addition of one or more other features, integers, steps, operations, elements, parts and / or its sets. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as degree terms, and are therefore used to explain the inherent deviations in measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0053] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be understood as being limited to the specific illustrated regional shapes, but will include deviations in shape caused by, for example, manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0054] According to the convention in the art, for functional blocks, units and / or modules, some exemplary embodiments are described and shown in the accompanying drawings. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits (such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc.) that can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, software (e.g., microcode) can be used to program and control the blocks, units and / or modules to perform the various functions discussed herein, and optionally, they can be driven by firmware and / or software. It is also considered that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and related circuits) that perform other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module of some exemplary embodiments can be physically divided into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0056] Hereinafter, example (ie, “exemplary”) embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0057] Figure 1A is a perspective view of an electronic device according to an embodiment of the inventive concept. Figure 1B is a perspective view of an electronic device according to an embodiment of the inventive concept. Figure 1A The electronic device 1000 is shown in an unfolded state. Figure 1B The electronic device 1000 is shown in a folded state.

[0058] Reference Figure 1A and Figure 1B , the electronic device 1000 may be a device activated according to an electrical signal. For example, the electronic device 1000 may be a mobile phone, a tablet PC, a car navigation system, a game console, or a wearable device, but is not limited thereto. Figure 1AAn example is shown in which the electronic device 1000 is in the form of a mobile phone.

[0059] The electronic device 1000 may display an image through the active area 1000A. In a state where the electronic device 1000 is unfolded, the active area 1000A may include a plane defined by a first direction DR1 and a second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, the front surface (or top surface) and the rear surface (or bottom surface) of each of the components constituting the electronic device 1000 may be defined based on the third direction DR3.

[0060] The active area 1000A may include a first area 1000A1, a second area 1000A2, and a third area 1000A3. The second area 1000A2 may be bent relative to a folding axis FX extending along a second direction DR2. Therefore, the first area 1000A1 and the third area 1000A3 may be referred to as non-folding areas, and the second area 1000A2 may be referred to as a folding area.

[0061] When the electronic device 1000 is folded, the first area 1000A1 and the third area 1000A3 may face each other. Therefore, in the fully folded state, the active area 1000A may not be exposed to the outside, which may be referred to as an inner fold. However, this is merely an example, and the operation of the electronic device 1000 is not limited thereto.

[0062] For example, in an embodiment of the present inventive concept, when the electronic device 1000 is folded, the first area 1000A1 and the third area 1000A3 may be opposite to each other. Therefore, in the folded state, the active area 1000A may be exposed to the outside, which may be called an external fold.

[0063] The electronic device 1000 may perform only one of the operations of the inner folding and the outer folding. Alternatively, the electronic device 1000 may perform all operations of the inner folding and the outer folding. In this case, the same area (e.g., the second area 1000A2) of the electronic device 1000 may be folded inner and outer. Alternatively, one area of ​​the electronic device 1000 may be folded inner, while another area may be folded outer.

[0064] exist Figure 1A and Figure 1B In the embodiment, one folding region and two non-folding regions are shown as examples, but the number of folding regions and non-folding regions is not limited thereto. For example, the electronic device 1000 may include more than two folding regions, that is, a plurality of non-folding regions and a plurality of folding regions disposed between adjacent non-folding regions.

[0065] Figure 1A and Figure 1B The folding axis FX is shown to be parallel to the short axis of the electronic device 1000 in the second direction DR2, but the embodiments of the present inventive concept are not limited thereto. For example, the folding axis FX may extend along the long axis of the electronic device 1000, for example, in a direction parallel to the first direction DR1. In this case, the first area 1000A1, the second area 1000A2, and the third area 1000A3 may be sequentially arranged along the second direction DR2.

[0066] A plurality of sensing areas 100SA1, 100SA2, and 100SA3 may be defined on the electronic device 1000. Figure 1A , three sensing areas 100SA1 , 100SA2 , and 100SA3 are exemplarily shown, but the number of the plurality of sensing areas 100SA1 , 100SA2 , and 100SA3 is not limited thereto.

[0067] The plurality of sensing areas 100SA1, 100SA2 and 100SA3 may include a first sensing area 100SA1, a second sensing area 100SA2 and a third sensing area 100SA3. For example, the first sensing area 100SA1 may overlap with the camera module, and the second sensing area 100SA2 and the third sensing area 100SA3 may overlap with the proximity illumination sensor, but are not limited thereto.

[0068] Multiple electronic modules 2000 (see Figure 4 ) can receive an external input transmitted through the first sensing area 100SA1, the second sensing area 100SA2 or the third sensing area 100SA3, or can provide an output through the first sensing area 100SA1, the second sensing area 100SA2 or the third sensing area 100SA3.

[0069] The first sensing area 100SA1 may be surrounded by the active area 1000A, and the second sensing area 100SA2 and the third sensing area 100SA3 may be included in the active area 1000A. That is, the second sensing area 100SA2 and the third sensing area 100SA3 may display an image. The transmittance of each of the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3 may be greater than the transmittance of the active area 1000A. In addition, the transmittance of the first sensing area 100SA1 may be greater than the transmittance of each of the second sensing area 100SA2 and the third sensing area 100SA3.

[0070] According to an embodiment of the inventive concept, a portion of the plurality of electronic modules 2000 (see Figure 4 ) may overlap with the active area 1000A, and another portion of the plurality of electronic modules 2000 (see Figure 4 ) can be surrounded by the active area 1000A. Therefore, for the peripheral area 1000NA around the active area 1000A, it is not necessary to provide a plurality of electronic modules 2000 disposed thereon (see Figure 4 As a result, the area ratio of the effective area 1000A to the front surface of the electronic device 1000 can be increased.

[0071] Figure 2 According to the embodiment of the present invention, Figure 1A A cross-sectional view of the electronic device taken along line II'. Figure 3A is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0072] Reference Figure 2 , the electronic device 1000 may include a display panel 100 , an upper functional layer and a lower functional layer.

[0073] Reference Figure 3A , the display panel 100 may be configured to generate an image and sense an input applied from the outside. For example, the display panel 100 may include a display layer 110 and a sensor layer 120. The display panel 100 may have a thickness of about 25 micrometers to about 35 micrometers (e.g., about 30 micrometers), and the thickness of the display panel 100 is not limited thereto.

[0074] The display layer 110 may be configured to substantially generate an image. The display layer 110 may be an emissive display layer, for example, the display layer 110 may be an organic light emitting display layer, a quantum dot display layer, or a micro LED display layer.

[0075] The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting element layer 113 , and an encapsulation layer 114 .

[0076] The base layer 111 may include a synthetic resin film (layer). The synthetic resin layer may include a thermosetting resin. The base layer 111 may have a multilayer structure. For example, the base layer 111 may have a three-layer structure consisting of a synthetic resin layer, an adhesive layer and a synthetic resin layer. Specifically, the synthetic resin layer may be a polyimide resin layer, and its material is not particularly limited. The synthetic resin layer may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a carbamate resin, a cellulose resin, a siloxane resin, a polyamide resin and a perylene resin. In addition, the base layer 111 may include a glass substrate or an organic / inorganic composite substrate.

[0077] The circuit layer 112 may be disposed on the base layer 111. The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 111 in a manner such as coating or vapor deposition, and then, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 112 may be formed.

[0078] The light emitting element layer 113 may be disposed on the circuit layer 112. The light emitting element layer 113 may include a light emitting element. For example, the light emitting element layer 113 may include an organic light emitting material, a quantum dot, a quantum rod, or a micro LED.

[0079] The encapsulation layer 114 may be disposed on the light emitting element layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked, but the layers constituting the encapsulation layer 114 are not limited thereto.

[0080] The inorganic layer can protect the light emitting element layer 113 from moisture and oxygen, and the organic layer can protect the light emitting element layer 113 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but embodiments of the inventive concept are not limited thereto.

[0081] The sensor layer 120 may be disposed on the display layer 110. The sensor layer 120 may sense an external input applied from the outside. The external input may be a user's input. The user's input may include various types of external inputs such as a part of the user's body, light, heat, a pen, pressure, etc.

[0082] The sensor layer 120 may be disposed on the display layer 110 through a continuous process. In this case, the sensor layer 120 may be expressed as being directly disposed on the display layer 110. Directly disposed may mean that no third component is disposed between the sensor layer 120 and the display layer 110. That is, a separate adhesive member may not be disposed between the sensor layer 120 and the display layer 110.

[0083] Alternatively, the sensor layer 120 may be bonded to the display layer 110 by an adhesive member. The adhesive member may include a general adhesive or an adhesive medium.

[0084] Refer again Figure 2 , an upper functional layer may be disposed on the display panel 100. For example, the upper functional layer may include an anti-reflection member 200 and an upper member 300.

[0085] The anti-reflection member 200 may be referred to as an anti-reflection layer. The anti-reflection member 200 may reduce the reflectivity of external light incident from the outside. The anti-reflection member 200 may include a stretched synthetic resin film. For example, the anti-reflection member 200 may be provided by printing an iodine compound on a polyvinyl alcohol film (PVA film). However, this is merely an example, and the material constituting the anti-reflection member 200 is not limited thereto. The anti-reflection member 200 may have a thickness of about 25 microns to about 35 microns (e.g., about 31 microns), and the thickness of the anti-reflection member 200 is not limited thereto.

[0086] The anti-reflection member 200 may be bonded to the display panel 100 by a first adhesive layer 1010. The first adhesive layer 1010 may be a transparent adhesive layer such as a pressure-sensitive adhesive film (PSA), an optically transparent adhesive film (OCA), or an optically transparent resin (OCR). Hereinafter, the adhesive member may include a common adhesive or an adhesive medium. The first adhesive layer 1010 may have a thickness of about 20 microns to about 30 microns (e.g., about 25 microns), and the thickness of the first adhesive layer 1010 is not limited thereto.

[0087] In an embodiment of the present inventive concept, the first adhesive layer 1010 may be omitted. In this case, the anti-reflection member 200 may be directly disposed on the display panel 100. In this case, a separate adhesive layer may not be disposed between the anti-reflection member 200 and the display panel 100.

[0088] The upper member 300 may be disposed on the anti-reflection member 200. The upper member 300 includes a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a light blocking layer 360, an impact absorbing layer 370, and a second hard coating layer 380. The components included in the upper member 300 are not limited to the above components. At least a portion of the above components may be omitted, and other components may be added.

[0089] The first hard coating layer 310 may be a layer disposed on the outermost surface of the electronic device 1000. The first hard coating layer 310 may be a functional layer for improving the use characteristics of the electronic device 1000, and may be applied on the protective layer 320. For example, the first hard coating layer 310 may improve anti-fingerprint performance, anti-fouling performance, and anti-scratch performance.

[0090] The protective layer 320 may be disposed below the first hard coating layer 310. The protective layer 320 may protect the composition disposed below the protective layer 320. The first hard coating layer 310, the anti-fingerprint layer, etc. may be additionally disposed on the protective layer 320 to improve properties such as chemical resistance and wear resistance. The protective layer 320 may include a film having an elastic modulus of about 15 GPa or less at room temperature. The protective layer 320 may have a thickness of about 50 microns to about 60 microns (e.g., about 55 microns), but the thickness of the protective layer 320 is not limited thereto. In an embodiment, the protective layer 320 may be omitted.

[0091] The first upper adhesive layer 330 may be disposed under the protective layer 320. The protective layer 320 and the window 340 may be bonded to each other by the first upper adhesive layer 330. The first upper adhesive layer 330 may have a thickness of about 20 micrometers to about 30 micrometers (e.g., about 25 micrometers), but the thickness of the first upper adhesive layer 330 is not limited thereto.

[0092] The window 340 may be disposed below the first upper adhesive layer 330. The window 340 may include an optically transparent insulating material. For example, the window 340 may include a glass substrate or a synthetic resin film. When the window 340 is a glass substrate, the window 340 may have a thickness of about 80 microns or less, and may have a thickness of, for example, about 30 microns, but the thickness of the window 340 is not limited thereto.

[0093] When the window 340 is a synthetic resin film, the window 340 may include a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0094] The window 340 may have a single-layer structure or a multi-layer structure. For example, the window 340 may include a plurality of plastic films bonded to each other using an adhesive, or include a glass substrate and a plastic film bonded to each other using an adhesive.

[0095] The second upper adhesive layer 350 may be disposed under the window 340. The window 340 and the impact absorbing layer 370 may be bonded to each other by the second upper adhesive layer 350. The second upper adhesive layer 350 may have a thickness of about 30 micrometers to about 40 micrometers (e.g., about 35 micrometers), but the thickness of the second upper adhesive layer 350 is not limited thereto.

[0096] In an embodiment of the inventive concept, the sidewall 340S of the window 340 and the sidewall 350S of the second upper adhesive layer 350 may be disposed inside the sidewalls of other layers (e.g., the sidewall 1000S of the display panel 100 and the sidewall 320S of the protective layer 320). “Disposed inside” may mean disposed closer to the active area 1000A than other comparison objects.

[0097] The positional relationship between the layers can be changed by the folding operation of the electronic device 1000. According to an embodiment of the inventive concept, since the sidewall 340S of the window 340 is disposed inside the sidewall 1000S of the display panel 100 and the sidewall 320S of the protective layer 320, even if the positional relationship between the layers is changed, the possibility of the sidewall 340S of the window 340 protruding from the sidewall 320S of the protective layer 320 can be reduced. Therefore, the possibility of transmitting an external impact through the sidewall 340S of the window 340 can be reduced. As a result, the possibility of cracks occurring in the window 340 can be reduced.

[0098] The first distance 340W between the sidewall 340S of the window 340 and the sidewall 320S of the protective layer 320 may be equal to or greater than a predetermined distance. Here, the first distance 340W may refer to a distance in a direction parallel to the first direction DR1. In addition, when viewed on a plane, the first distance 340W may correspond to the distance between the sidewall 340S and the sidewall 320S.

[0099] The first distance 340W may be about 180 microns to about 205 microns, for example, about 196 microns, but is not limited thereto. For example, the first distance 340W may be about 50 microns or more, and may be about 300 microns. As the first distance 340W increases, the protective layer 320 may further protrude from the window 340, and a portion of the protective layer 320 may be bent and attached to other components such as the housing. In addition, as the area of ​​the protective layer 320 increases, the possibility of foreign matter introduced from the upper side of the protective layer 320 being introduced into the lower side of the protective layer 320 may be reduced.

[0100] In addition, the window 340 and the second upper adhesive layer 350 may be bonded to the impact absorbing layer 370 by a lamination process. Considering the lamination process tolerance, the area of ​​each of the window 340 and the second upper adhesive layer 350 may be smaller than the area of ​​the impact absorbing layer 370. In addition, the area of ​​the second upper adhesive layer 350 may be smaller than the area of ​​the window 340. For example, in the process of attaching the window 340, pressure may be applied to the second upper adhesive layer 350. The second upper adhesive layer 350 may receive pressure and then be stretched in a direction parallel to the first direction DR1 and the second direction DR2. Here, the area of ​​the second upper adhesive layer 350 may be smaller than the area of ​​the window 340 so that the second upper adhesive layer 350 does not protrude from the window 340.

[0101] When the first upper adhesive layer 330 and the second upper adhesive layer 350 are attached to each other, the window 340 may not slip to prevent a warping phenomenon from occurring when the electronic device 1000 is folded. However, according to an embodiment of the inventive concept, the area of ​​the second upper adhesive layer 350 may be smaller than that of the window 340. Therefore, the first upper adhesive layer 330 may not be attached to the second upper adhesive layer 350, and the possibility of foreign matter being attached to the second upper adhesive layer 350 may be reduced.

[0102] The second distance 350W between the sidewall 350S of the second upper adhesive layer 350 and the sidewall 320S of the protective layer 320 may be equal to or greater than a predetermined distance. Here, the second distance 350W may refer to a distance in a direction parallel to the first direction DR1. In addition, when viewed on a plane, the second distance 350W may correspond to a distance between the sidewall 350S and the sidewall 320S.

[0103] The second distance 350W may be about 392 microns, but is not limited thereto. For example, the second distance 350W may be selected from a range between about 292 microns and about 492 microns, but is not limited thereto. The light blocking layer 360 may be disposed between the impact absorbing layer 370 and the second upper adhesive layer 350. The light blocking layer 360 may be disposed by printing on the top surface of the impact absorbing layer 370. The light blocking layer 360 may overlap with the peripheral area 1000NA. The light blocking layer 360 may be a colored layer and may be formed in a coating manner. The light blocking layer 360 may include a colored organic material or an opaque metal, and the material constituting the light blocking layer 360 is not limited thereto.

[0104] exist Figure 2 , the light blocking layer 360 is exemplarily shown as being disposed on the top surface of the impact absorbing layer 370, but the position of the light blocking layer 360 is not limited thereto. For example, the light blocking layer 360 may be disposed on the top surface of the protective layer 320, on the bottom surface of the protective layer 320, on the top surface of the window 340, or on the bottom surface of the window 340. In addition, the light blocking layer 360 may be provided as a multilayer. In this case, a portion of the light blocking layer 360 may be disposed on the top surface of the impact absorbing layer 370, and another portion may be disposed on the top surface of the protective layer 320, on the bottom surface of the protective layer 320, on the top surface of the window 340, or on the bottom surface of the window 340.

[0105] The impact absorbing layer 370 may be a functional layer for protecting the display panel 100 from external impacts. The impact absorbing layer 370 may be selected from a film having an elastic modulus of about 1 GPa or more at room temperature. The impact absorbing layer 370 may be a stretch film including an optical function. For example, the impact absorbing layer 370 may be an optical axis control film. The impact absorbing layer 370 may have a thickness of about 35 microns to about 45 microns (e.g., about 41 microns), but the thickness of the impact absorbing layer 370 is not limited thereto. In an embodiment of the inventive concept, the impact absorbing layer 370 may be omitted.

[0106] The second hard coating layer 380 may be disposed on the bottom surface of the impact absorbing layer 370. The impact absorbing layer 370 may include a curved surface. The top surface of the impact absorbing layer 370 may contact the second upper adhesive layer 350. Therefore, the curved portion of the top surface of the impact absorbing layer 370 may be filled by the second upper adhesive layer 350. Therefore, optical problems may not occur on the top surface of the impact absorbing layer 370. The bottom surface of the impact absorbing layer 370 may be flattened by the second hard coating layer 380. That is, when the first hole 101H (see Figure 4 ) is arranged to directly contact the second adhesive layer 1020, by the first hole 101H (see Figure 4 ) The exposed surface may be smooth. Therefore, when the second hard coating layer 380 covers the uneven surface of the impact absorbing layer 370, fogging that may occur on the uneven surface of the impact absorbing layer 370 may be prevented.

[0107] The upper member 300 may be bonded to the anti-reflective member 200 by the second adhesive layer 1020. The second adhesive layer 1020 may include a common adhesive or an adhesive medium. The second adhesive layer 1020 may have a thickness of about 20 microns to about 30 microns (e.g., about 25 microns), and the thickness of the second adhesive layer 1020 is not limited thereto.

[0108] The lower functional layer may be disposed below the display panel 100. For example, the lower functional layer may include a lower protective film 400, a pad member 500, a first lower member 600, a second lower member 700, and a step compensation member 800. The components included in the lower functional layer are not limited to the above components. At least a portion of the above components may be omitted, and other components may be added.

[0109] The lower protective film 400 may be bonded to the rear surface of the display panel 100 through the third adhesive layer 1030. The lower protective film 400 may prevent scratches from being generated in the rear surface of the display panel 100 in the process of manufacturing the display panel 100. The lower protective film 400 may be a colored polyimide film. For example, the lower protective film 400 may be an opaque yellow film, but is not limited thereto.

[0110] The lower protective film 400 may have a thickness of about 30 micrometers to about 50 micrometers (e.g., about 40 micrometers). The third adhesive layer 1030 may have a thickness of about 13 micrometers to about 25 micrometers (e.g., about 18 micrometers). However, the thickness of the lower protective film 400 and the thickness of the third adhesive layer 1030 are not limited thereto.

[0111] The pad member 500 may be disposed under the lower protective film 400. The pad member 500 may protect the display panel 100 from impact transmitted from the lower portion. The anti-impact property of the electronic device 1000 may be improved by the pad member 500.

[0112] The pad member 500 may include a first pad adhesive layer 510, a barrier film 520, a pad layer 530, and a second pad adhesive layer 540. The components included in the pad member 500 are not limited to the above components. At least a portion of the above components may be omitted, and other components may be added.

[0113] The first pad adhesive layer 510 and the second pad adhesive layer 540 may include a common adhesive or adhesive medium. The first pad adhesive layer 510 may be attached to the lower protective film 400, and the second pad adhesive layer 540 may be attached to the first lower member 600. The first pad adhesive layer 510 may have a thickness of about 20 microns to about 30 microns (e.g., about 25 microns). The second pad adhesive layer 540 may have a thickness of about 4 microns to about 15 microns (e.g., about 8 microns). However, the thickness of each of the first pad adhesive layer 510 and the second pad adhesive layer 540 is not limited thereto.

[0114] The barrier film 520 may be provided to improve the impact resistance. The barrier film 520 may be used to prevent the display panel 100 from being deformed. The barrier film 520 may be a synthetic resin film, for example, a polyimide film, but is not limited thereto. The barrier film 520 may have a thickness of about 30 micrometers to about 40 micrometers (for example, about 35 micrometers), but the thickness of the barrier film 520 is not limited thereto.

[0115] The cushion layer 530 may include, for example, foamed foam or sponge. The foamed foam may include polyurethane foam or thermoplastic polyurethane foam. When the cushion layer 530 includes foamed foam, the cushion layer 530 may be formed by using the barrier film 520 as a base layer. For example, a foaming agent may be foamed on the barrier film 520 to form the cushion layer 530.

[0116] The pad layer 530 may have a thickness of about 80 micrometers to about 120 micrometers (eg, about 100 micrometers), but the thickness of the pad layer 530 is not limited thereto.

[0117] At least one of the blocking film 520 and the cushion layer 530 may have a color that absorbs light. For example, at least one of the blocking film 520 and the cushion layer 530 may have a black color. In this case, components disposed under the cushion member 500 may be prevented from being seen from the outside.

[0118] The first lower member 600 may be disposed below the pad member 500. The first lower member 600 may include a plate 610, a lower adhesive layer 620, and a cover layer 630. The components included in the first lower member 600 are not limited to the above components. At least a portion of the above components may be omitted, and other components may be added.

[0119] The board 610 may include a material having an elastic modulus of about 60 GPa or more at room temperature. For example, the board 610 may be SUS304, but is not limited thereto. The board 610 may support components disposed on the upper side. In addition, the heat dissipation performance of the electronic device 1000 may be improved by the board 610.

[0120] The opening 611 may be defined in a portion of the plate 610. The opening 611 may be defined in a region overlapping with the second region 1000A2. For example, when viewed in the third direction DR3, the opening 611 may overlap with the second region 1000A2 on a plane. A portion of the plate 610 may be more easily deformed through the opening 611.

[0121] The cover layer 630 may be attached to the board 610 through the lower adhesive layer 620. The lower adhesive layer 620 may include a general adhesive or an adhesive medium. The cover layer 630 may cover the opening 611 of the board 610. Therefore, foreign substances may be additionally prevented from entering the opening 611.

[0122] The cover layer 630 may include a material having an elastic modulus smaller than that of the plate 610. For example, the cover layer 630 may include thermoplastic polyurethane, but is not limited thereto.

[0123] The plate 610 may have a thickness of about 120 microns to about 180 microns (e.g., about 150 microns). The lower adhesive layer 620 may have a thickness of about 4 microns to about 15 microns (e.g., about 8 microns). The cover layer 630 may have a thickness of about 4 microns to about 15 microns (e.g., about 8 microns). However, the thickness of the plate 610, the thickness of the lower adhesive layer 620, and the thickness of the cover layer 630 are not limited to the above values.

[0124] The second lower member 700 may be disposed below the first lower member 600. The second lower members 700 may be spaced apart from each other. For example, one second lower member 700 may be disposed on the first area 1000A1, and another second lower member 700 may be disposed on the third area 1000A3.

[0125] Each second lower member 700 may be attached to the first lower member 600 by a fourth adhesive layer 1040. For example, one fourth adhesive layer 1040 may be attached to the bottom surface of the first lower member 600 overlapping the first region 1000A1, and another fourth adhesive layer 1040 may be attached to the bottom surface of the first lower member 600 overlapping the third region 1000A3. That is, the fourth adhesive layer 1040 may not overlap the second region 1000A2. Each of the fourth adhesive layers 1040 may have a thickness of about 8 microns to about 15 microns (e.g., about 8 microns), but the thickness of each of the fourth adhesive layers 1040 is not limited thereto.

[0126] Although not shown, a step compensation film may be further provided between each of the second lower members 700 and the first lower member 600. For example, the step compensation film may be provided on an area overlapping the second region 1000A2. The adhesive force of one surface of the step compensation film may be less than the adhesive force of the other surface. For example, the one surface may not have adhesive force. The one surface may be a surface facing the first lower member 600.

[0127] Each of the second lower members 700 may include a lower plate 710, a heat sink 720, and an insulating film 730. The components included in the second lower member 700 are not limited to the above components. At least a part of the above components may be omitted, and other components may be added.

[0128] The lower plate 710 is provided in plural. One of the lower plates 710 may be provided to overlap a portion of the second area 1000A2 and the first area 1000A1, and another portion of the lower plate 710 may be provided to overlap another portion of the second area 1000A2 and the third area 1000A3.

[0129] The lower plates 710 may be disposed to be spaced apart from each other on the second area 1000A2. However, the lower plates 710 may be disposed as close as possible to support the area in which the opening 611 of the plate 610 is defined. For example, the lower plates 710 may prevent the shape of the area in which the opening 611 of the plate 610 is defined from being deformed due to pressure applied from above.

[0130] In addition, the lower plate 710 may serve to prevent components disposed above the second lower member 700 from being deformed due to components disposed below the second lower member 700 .

[0131] Each of the lower plates 710 may include a metal alloy. For example, each of the lower plates 710 may include a copper alloy. However, the material forming the lower plates 710 is not limited thereto. Each of the lower plates 710 may have a thickness of about 60 micrometers to about 100 micrometers (e.g., about 80 micrometers), and the thickness of the lower plates 710 is not limited thereto.

[0132] The heat sink 720 may be attached below the lower plate 710. The heat sink 720 may be a heat conductive sheet having high thermal conductivity. For example, the heat sink 720 may include a heat dissipation layer 721, a first heat dissipation adhesive layer 722, a second heat dissipation adhesive layer 723, and a gap tape 724.

[0133] The gap tape 724 may be attached to the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 spaced apart from each other with the heat dissipation layer 721 therebetween. The gap tape 724 may be provided in multiple layers. For example, the gap tape 724 may include a base layer, an upper adhesive layer provided on the top surface of the base layer, and a lower adhesive layer provided on the bottom surface of the base layer.

[0134] The heat dissipation layer 721 may be attached to the lower plate 710 by a first heat dissipation adhesive layer 722. The heat dissipation layer 721 may be sealed by a first heat dissipation adhesive layer 722, a second heat dissipation adhesive layer 723, and a gap band 724. The heat dissipation layer 721 may be a graphitized polymer film. The polymer film may be, for example, a polyimide film. Each of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 may have a thickness of about 3 microns to about 8 microns (e.g., about 5 microns), and each of the heat dissipation layer 721 and the gap band 724 may have a thickness of about 10 microns to about 25 microns (e.g., about 17 microns). However, the thickness of each of the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723, the heat dissipation layer 721, and the gap band 724 is not limited to the above values.

[0135] The insulating film 730 may be attached below the heat sink 720. For example, the insulating film 730 may be attached to the second heat dissipation adhesive layer 723. The electronic device 1000 may be prevented from flickering by the insulating film 730. The insulating film 730 may have a thickness of about 15 micrometers, but is not limited thereto.

[0136] The step compensating member 800 may be attached under the board 610. For example, the lower adhesive layer 620 may be attached under a portion of the board 610, and the step compensating member 800 may be attached under another portion of the board 610.

[0137] The step compensation member 800 may include a first compensation adhesive layer 810, a step compensation film 820, and a second compensation adhesive layer 830. The first compensation adhesive layer 810 may be attached to the bottom surface of the board 610. The step compensation film 820 may be a synthetic resin film. The second compensation adhesive layer 830 may be attached to the bottom surface of the step compensation film 820 and a folding assembly (not shown) including a main body and a hinge.

[0138] Figure 3B is a cross-sectional view of a display panel according to an embodiment of the inventive concept.

[0139] Reference Figure 3B, when Figure 3A When compared with the display panel 100 described in the embodiment, the display panel 100aa may further include an anti-reflection layer 130. In this case, the electronic device 1000 (see FIG. 1 ) including the display panel 100aa may be Figure 2 ) Remove the anti-reflection member 200 (see Figure 2 ) and the first adhesive layer 1010 (see Figure 2 ).

[0140] The display panel 100 aa may include a display layer 110 , a sensor layer 120 , and an anti-reflection layer 130 .

[0141] The anti-reflection layer 130 according to an embodiment of the inventive concept may include a color filter. The color filter may have a predetermined arrangement. The arrangement of the color filter may be determined in consideration of the luminous color of the pixels included in the display layer 110. In addition, the anti-reflection layer 130 may further include a black matrix adjacent to the color filter.

[0142] The anti-reflection layer 130 according to an embodiment of the inventive concept may include a destructive interference structure. For example, the destructive interference structure includes a first reflective layer and a second reflective layer disposed on different layers from each other. The first reflected light and the second reflected light respectively reflected from the first reflective layer and the second reflective layer may interfere destructively, and thus, the reflectivity of the external light may be reduced.

[0143] Figure 4 is an exploded perspective view illustrating a portion of a configuration of an electronic device according to an embodiment of the inventive concept.

[0144] Reference Figure 4 , exemplarily showing the components of the electronic device 1000 (see Figure 2 ), a light blocking layer 360 in the display panel 100, and a plurality of electronic modules 2000. The plurality of electronic modules 2000 may include a camera module 2100 and a proximity illumination sensor 2200.

[0145] The proximity illumination sensor 2200 may include a light emitting module 2210 and a light receiving module 2220. The light emitting module 2210 and the light receiving module 2220 may be mounted on one substrate. The light emitting module 2210 may generate and output light. For example, the light emitting module 2210 may output infrared rays. In addition, the light emitting module 2210 may include a light emitting diode. The light receiving module 2220 may sense infrared rays. When infrared rays having a predetermined level or higher are sensed, the light receiving module 2220 may be activated. The light receiving module 2220 may include a CMOS sensor. The infrared rays generated in the light emitting module 2210 may be output and then reflected by an external object (e.g., a finger or face of a user), and the reflected infrared rays may be incident into the light receiving module 2220.

[0146] An active area 100A and a peripheral area 100NA may be defined on the display panel 100. The active area 100A may correspond to Figure 1A The active area 1000A shown in FIG. 1 and the peripheral area 100NA may correspond to Figure 1A The peripheral area 1000NA is shown in FIG.

[0147] The first sensing area 100SA1 overlapping the camera module 2100 may be surrounded by the active area 100A, and the second sensing area 100SA2 overlapping the light emitting module 2210 and the third sensing area 100SA3 overlapping the light receiving module 2220 may be parts of the active area 100A.

[0148] The first hole 101H may be defined in a portion of the display panel 100. The first hole 101H may be disposed to correspond to the first sensing area 100SA1. Therefore, the camera module 2100 may receive an external input transmitted through the first hole 101H.

[0149] The light blocking layer 360 may include a first light blocking pattern 361 and a second light blocking pattern 362. The first light blocking pattern 361 may be a pattern covering the peripheral area 100NA. The second light blocking pattern 362 may surround the camera module 2100 when viewed on a plane.

[0150] Figure 5 is a rear view showing a portion of the configuration of an electronic device according to an embodiment of the inventive concept.

[0151] Reference Figure 4 and Figure 5 , exemplarily showing a display panel 100 , a step compensation member 800 , a heat dissipation layer 721 , and a gap strip 724 .

[0152] The first hole 101H, the second hole 102H, and the third hole 103H may be provided to correspond to the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3, respectively.

[0153] The first hole 101H, the second hole 102H and the third hole 103H can be formed by removing the electronic device 1000 (see Figure 1A ) are set up, and therefore, they will be described in detail later.

[0154] The first hole 101H may be disposed to overlap the step compensating member 800, and each of the second hole 102H and the third hole 103H may be disposed to overlap the gap band 724. Therefore, when viewed on a plane, the first hole 101H may be surrounded by the step compensating member 800, and each of the second hole 102H and the third hole 103H may be surrounded by the gap band 724.

[0155] Figure 6 According to the embodiment of the present invention, Figure 1A A cross-sectional view taken along line II-II'.

[0156] Reference Figure 6 , shows a first hole 101H into which the camera module 2100 is inserted. The first hole 101H may include a first hole portion 101H1, a second hole portion 101H2, and a third hole portion 101H3.

[0157] The first hole portion 101H1 may be defined by the first sidewall SW1 , the second hole portion 101H2 may be defined by the second sidewall SW2 , and the third hole portion 101H3 may be defined by the third sidewall SW3 .

[0158] The first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3 may have different sizes from each other. For example, the first hole portion 101H1 may have a minimum size, the second hole portion 101H2 may have a maximum size, and the third hole portion 101H3 may have a size corresponding to between the size of the first hole portion 101H1 and the size of the second hole portion 101H2.

[0159] The first hole portion 101H1 may be formed by a laser cutting process. For example, the first hole portion 101H1 may be formed by cutting a portion from the lower protective film 400 to the second adhesive layer 1020 using a laser. The second hole portion 101H2 may be a portion provided in the pad member 500, and the pad member 500 may be punched to define the second hole portion 101H2. The pad member 500 in which the second hole portion 101H2 is defined may be attached to the lower protective film 400. The plate 610 and the step compensation member 800 may be punched to define the third hole portion 101H3. The third hole portion 101H3 may be formed on the plate 610 and the step compensation member 800 by a shearing process.

[0160] According to an embodiment of the present disclosure, the pad member 500 having the second hole portion 101H2 defined therein may be attached to the plate 610 having the third hole portion 101H3 defined therein. Thereafter, the pad member 500 may be attached to the lower protective film 400. Therefore, the sizes of the first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3 may be different from each other in consideration of component tolerance, equipment tolerance, and folding tolerance.

[0161] The folding tolerance may be a tolerance generated by the folding operation of the electronic device 1000. For example, when the electronic device 1000 is completely folded, the folding tolerance may be a tolerance that takes into account the amount of movement (or slippage) of each of the components, or when the electronic device 1000 is unfolded after being folded, the folding tolerance may be a tolerance that takes into account the amount of unrecovered movement of each of the components.

[0162] According to an embodiment of the present inventive concept, since the sizes of the first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3 are determined in consideration of the folding tolerance, interference between the inner side wall of the first hole 101H and the electronic module (e.g., the camera module 2100) inserted into the first hole 101H may not occur. In addition, the second light blocking pattern 362 disposed corresponding to the position of the first hole 101H may also be disposed in consideration of the folding tolerance. Therefore, even when the electronic device 1000 is folded and unfolded, the second light blocking pattern 362 may be reduced in covering the active area 100A of the display panel 100 (see Figure 4 ) or the possibility that the second light blocking pattern 362 covers the viewing angle area 2100AV of the camera module 2100.

[0163] The camera module 2100 may be inserted and disposed in the first hole 101H. The second upper adhesive layer 350, the light blocking layer 360, the impact absorbing layer 370, and the second hard coating layer 380 may be disposed between the camera module 2100 and the window 340. Therefore, since at least one or more layers are disposed between the camera module 2100 and the window 340, the possibility of the window 340 being damaged by the camera module 2100 may be reduced. Therefore, the reliability of the product may be improved.

[0164] The top surface 2100U of the camera module 2100 may be disposed within the second hole portion 101H2 disposed in the pad member 500. The second hole portion 101H2 may be a hole portion having the largest diameter among the first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3. Therefore, even if the electronic device 1000 is folded and the positional relationship between the layers is deformed thereby, the possibility of collision with the second side wall SW2 of the camera module 2100 may be reduced. Therefore, the reliability of the product may be improved.

[0165] The position of the top surface 2100U of the camera module 2100 is not limited to Figure 6 For example, the top surface 2100U of the camera module 2100 may be disposed within the first hole portion 101H1. In this case, the width 362W of the area surrounded by the second light blocking pattern 362 may be designed to be smaller than the width when the top surface 2100U of the camera module 2100 is disposed in the second hole portion 101H2.

[0166] For example, the second light blocking pattern 362 may be designed not to overlap the viewing angle area 2100AV of the camera module 2100. When viewed on a plane, the second light blocking pattern 362 may be disposed to be spaced a predetermined distance from the viewing angle area 2100AV of the camera module 2100 in consideration of a process error. Since the camera module 2100 is closer to the second light blocking pattern 362, the second light blocking pattern 362 may not cover the viewing angle area 2100AV of the camera module 2100 even if the width 362W of the area surrounded by the second light blocking pattern 362 is reduced.

[0167] According to an embodiment of the inventive concept, it is possible to ensure that the distance DT between the camera module 2100 and the window 340 exceeds a predetermined distance. When it is ensured that the distance DT between the camera module 2100 and the window 340 exceeds a predetermined distance, the possibility that the window 340 is damaged by the camera module 2100 can be reduced. Therefore, the reliability of the product can be improved. When the window 340 is provided as a glass substrate, the damage may be a crack, or when the window 340 is provided as a synthetic resin film, the damage may be a step.

[0168] For example, the distance DT may be in the range of about 60% to about 200% of the sum of the thicknesses of the component, wherein the modulus of the first hole 101H is less than or equal to the reference modulus. The component defined with the first hole 101H in FIG. 3 may correspond to a component disposed below the second hard coating layer 380. The reference modulus may be about 100 MPa or less, for example, about 50 MPa or less and 0 MPa or more.

[0169] A component having a first hole 101H defined therethrough and having a modulus equal to or less than a reference modulus may include a first adhesive layer 1010, a second adhesive layer 1020, a third adhesive layer 1030, a first pad adhesive layer 510, a pad layer 530, a second pad adhesive layer 540, a first compensation adhesive layer 810, and a second compensation adhesive layer 830.

[0170] The first adhesive layer 1010 may have a thickness of about 25 microns, the second adhesive layer 1020 may have a thickness of about 25 microns, the third adhesive layer 1030 may have a thickness of about 18 microns, the first pad adhesive layer 510 may have a thickness of about 25 microns, the pad layer 530 may have a thickness of about 100 microns, the second pad adhesive layer 540 may have a thickness of about 8 microns, the first compensation adhesive layer 810 may have a thickness of about 17 microns, and the second compensation adhesive layer 830 may have a thickness of about 17 microns. Each of the above thicknesses may have a process error. Therefore, the sum of the thicknesses may be about 183 microns to about 300 microns, for example, about 235 microns. However, the sum of the thicknesses is not limited thereto.

[0171] The distance DT between the camera module 2100 and the window 340 may be determined in consideration of the maximum compression ratio of the layers each having a modulus equal to or less than the reference modulus. For example, the distance DT may be equal to or greater than the sum of the thicknesses multiplied by the maximum compression ratio. The distance DT may be about 110 micrometers or more, for example, about 141 micrometers or more.

[0172] According to an embodiment of the inventive concept, even if the components are compressed to the maximum extent by the pressure generated when the electronic device 1000 is used, the window 340 and the camera module 2100 can be spaced apart from each other by a predetermined distance. Therefore, the possibility that the window 340 is damaged by the camera module 2100 can be greatly reduced. Therefore, the reliability of the product can be improved.

[0173] Figure 7 is a plan view of an electronic device according to an embodiment of the inventive concept.

[0174] exist Figure 7 , the second light blocking pattern 362, the first side wall SW1, the second side wall SW2, and the third side wall SW3 are exemplarily shown.

[0175] When viewed on a plane, the first side wall SW1 may overlap the second light blocking pattern 362, and the second side wall SW2 and the third side wall SW3 may not overlap the second light blocking pattern 362. When viewed on a plane, the third side wall SW3 may surround the second light blocking pattern 362, and the second side wall SW2 may surround the third side wall SW3.

[0176] Reference Figure 6 and Figure 7 , the first width WT1 of the first hole portion 101H1, the second width WT2 of the second hole portion 101H2, and the third width WT3 of the third hole portion 101H3 may be different from each other. For example, the second width WT2 may be greater than each of the first width WT1 and the third width WT3, and the third width WT3 may be greater than the first width WT1.

[0177] Figure 8 According to the embodiment of the present invention, Figure 1A A cross-sectional view taken along line III-III'.

[0178] Reference Figure 8 , showing the third hole 103H in which the light receiving module 2220 is inserted. Since the light emitting module 2210 (see Figure 4 ) of the second hole 102H (see Figure 5 ) may have a substantially similar cross-sectional structure to the third hole 103H, and thus the second hole 102H (see Figure 5 )’s content.

[0179] The third hole 103H may include a first hole portion 103H1 and a second hole portion 103H2. The first hole portion 103H1 may be defined by the first sidewall SW13, and the second hole portion 103H2 may be defined by the second sidewall SW23.

[0180] The first hole portion 103H1 and the second hole portion 103H2 may have different sizes from each other. For example, the size of the first hole portion 103H1 may be greater than the size of the second hole portion 103H2.

[0181] The first hole portion 103H1 may be a portion provided in the pad member 500, and the pad member 500 may be punched to define the first hole portion 103H1. The first lower member 600 and the second lower member 700 may be punched to define the second hole portion 103H2.

[0182] The third hole 103H may not be provided in the display panel 100. For example, the third hole 103H may be provided only in at least a portion of a component provided under the display panel 100. Therefore, a portion of the display panel 100 overlapping the third hole 103H may display an image and sense an input applied from the outside.

[0183] The first hole 101H (see Figure 6 ) may pass through the display panel 100, but the third hole 103H may not pass through the display panel 100. That is, the first hole 101H (see Figure 6 ) depth DT1 (see Figure 6 ) may be greater than the depth DT2 of the third hole 103H.

[0184] Fig.9A is a perspective view illustrating an operation of an electronic device according to an embodiment of the inventive concept. Fig. 9B It is along Fig.9A A cross-sectional view taken along line IV-IV'. Fig. 10Ais a perspective view illustrating an operation of an electronic device according to an embodiment of the inventive concept. Fig. 10B It is along Fig. 10A A cross-sectional view taken along line V-V'.

[0185] Fig.9A The electronic device 1000 is shown in a completely folded state. This may be referred to as a first state. Fig. 9B A cross-sectional view is shown, which shows Fig.9A The first sensing area 100SA1 of the folded electronic device 1000 is cut. Fig. 10A The state in which the electronic device 1000 is folded and then unfolded again is shown. This may be referred to as the second state. Fig. 10B A cross-sectional view is shown, which shows Fig. 10A The first sensing area 100SA1 of the electronic device 1000 unfolded in the state is cut.

[0186] Fig.9A , Fig. 9B , Fig. 10A and Fig. 10B A view showing an electronic device 1000 disposed in a chamber in order to measure an amount of positional movement and an amount of unrecovered movement of each of components due to folding and unfolding.

[0187] exist Fig.9A and Fig. 10A In the embodiment, the electronic device 1000 is tested as an example, but is not limited thereto. For example, the test may be performed using only some components of the electronic device 1000, or the test may be performed using a product designed similarly to the electronic device 1000.

[0188] Because the adhesive layer and the tape have a large amount of slippage due to shearing in a high temperature environment, the test can be performed in a state where the adhesive layer and the tape are set in a chamber with a high temperature to measure the positional movement amount and the unrecovered movement amount of each of the components caused by folding and unfolding. The high temperature may be, for example, about 60 degrees Celsius, but is not limited thereto.

[0189] Reference Fig.9A and Fig. 9B , when the electronic device 1000 is folded, the shapes of the components each having a relatively low modulus may be deformed. For example, the shapes of the second adhesive layer 1020, the first adhesive layer 1010, the third adhesive layer 1030, the first pad adhesive layer 510, and the second pad adhesive layer 540 may be deformed. For example, the side surfaces of the deformed second adhesive layer 1020, the first adhesive layer 1010, the third adhesive layer 1030, the first pad adhesive layer 510, and the second pad adhesive layer 540 may be inclined in the third direction DR3.

[0190] exist Fig. 9BIn FIG. 6 , the position of the components before folding is shown by the dotted line, and the position of the components in the fully folded state is shown by the solid line. The position of the components disposed on the plate 610 relative to the plate 610 can be changed. The plate 610 can be SUS304 or a rigid material. Therefore, the position of the components disposed on the plate 610 relative to the plate 610 can be in a position that is aligned with the folding axis FX (see FIG. 6 ). Figure 1A ) is deformed in a direction intersecting with the first direction DR1.

[0191] According to an embodiment of the inventive concept, in a state where the electronic device 1000 is completely folded, the positions of the first hole 101H and the second light-blocking pattern 362 may be designed so that the camera module 2100 does not collide with the sidewall constituting the first hole 101H and the second light-blocking pattern 362 does not cover the viewing angle area 2100AV of the camera module 2100. A detailed description related to this configuration will be described later.

[0192] Reference Fig. 10A and Fig. 10B , even when the electronic device 1000 is unfolded again, the shapes of the components may not be partially restored. Fig. 10B , the position of the components before folding is shown by dotted lines, and the position of the components when unfolded again after being completely folded is shown by solid lines.

[0193] According to an embodiment of the inventive concept, when the electronic device 1000 is unfolded again, the positions of the first hole 101H and the second light blocking pattern 362 may be designed in consideration of the positions of the unrestored components. A detailed description related to this configuration will be described later.

[0194] Fig.11 is a cross-sectional view for explaining a design dimension of an electronic device according to an embodiment of the inventive concept.

[0195] Reference Fig.9A , Fig. 9B , Fig. 10A , Fig. 10B and Fig.11 , a first design object FD1, a second design object FD2, a third design object FD3, a fourth design object FD4, a fifth design object FD5, a sixth design object FD6, a seventh design object FD7, and an eighth design object FD8 are shown as examples.

[0196] The second light blocking pattern 362 may have a ring shape having an inner diameter 362I and an outer diameter 362O surrounding the inner diameter 362I. The first design object FD1 is a distance between an edge 100E of the display panel 100 and the inner diameter 362I of the second light blocking pattern 362. The second design object FD2 is a distance between the edge 100E of the display panel 100 and the outer diameter 362O of the second light blocking pattern 362.

[0197] The third design object FD3 is a distance between an outer diameter 362O of the second light blocking pattern 362 and an effective area 100A of the display panel 100. The fourth design object FD4 is a distance between an inner diameter 362I of the second light blocking pattern 362 and a viewing angle area 2100AV. The fifth design object FD5 is a distance between an edge 100E of the display panel 100 and the camera module 2100. The sixth design object FD6 is a distance between an edge 100E of the display panel 100 and the pad member 500. The seventh design object FD7 is a distance between an edge 100E of the display panel 100 and the board 610. The eighth design object FD8 is a distance between the board 610 and the step compensation member 800.

[0198] All of the above distances may be distances in a direction parallel to the first direction DR1. In addition, when the electronic device 1000 is viewed on a plane, the above distances may correspond to distances between two components.

[0199] The value of each of the first design object FD1, the second design object FD2, the third design object FD3, the fourth design object FD4, the fifth design object FD5, the sixth design object FD6, the seventh design object FD7, and the eighth design object FD8 may be designed in consideration of component tolerance, device tolerance, characteristic tolerance, and folding tolerance.

[0200] For example, component tolerances may include tolerances generated in the process of printing the second light blocking pattern 362, tolerances relative to the size of the second light blocking pattern 362, tolerances relative to the position of the second light blocking pattern 362, tolerances relative to the position of the alignment mark of the display panel 100, tolerances relative to the periphery of the pad member 500, tolerances relative to the size of the second hole portion 101H2 of the pad member 500, tolerances relative to the position of the second hole portion 101H2 of the pad member 500, tolerances relative to the periphery of the plate 610, tolerances relative to the size of the third hole portion 101H3 of the plate 610, and tolerances relative to the position of the third hole portion 101H3 of the plate 610.

[0201] For example, the equipment tolerance may include a tolerance generated in a process of cutting the first hole portion 101H1 using a laser, a tolerance generated in a process of laminating the upper member 300 to a configuration including the display panel 100, a tolerance generated in a process of laminating the pad member 500 to the configuration including the display panel 100, and a tolerance generated in a process of laminating the pad member 500 to the board 610. The configuration including the display panel 100 may refer to a component from the second adhesive layer 1020 to the lower protective film 400.

[0202] For example, the characteristic tolerance may be a tolerance due to high-temperature shrinkage of the anti-reflection member 200 and the second adhesive layer 1020 .

[0203] For example, the folding tolerance may be a tolerance generated due to the folding operation of the electronic device 1000, and may include a movement DS1 of the display panel 100 measured relative to the plate 610 in a folded state, an unrecovered movement DS2 of the second light blocking pattern 362, an unrecovered movement DS3 between the anti-reflective member 200 and the layer including the second light blocking pattern 362, and an unrecovered movement DS4 between the display panel 100 and the layer including the second light blocking pattern 362.

[0204] In Table 1 below, component tolerance data and device tolerance data for determining a size of each of a first design object FD1 , a second design object FD2 , a fourth design object FD4 , and a fifth design object FD5 are shown.

[0205] [Table 1]

[0206]

[0207] The first RSS (root mean square) value can be calculated by the following formula 1:

[0208] Formula 1:

[0209]

[0210] The size of the first design object FD1 may be determined based on the sum of the first RSS value and the first other tolerance. The first other tolerance may include a tolerance caused by the residual adhesive of the second adhesive layer 1020 and a tolerance caused when the components of the electronic device 1000 are not restored. Specifically, the tolerance caused by the non-recovery may be an unrecovered movement amount DS4 between the display panel 100 and the layer including the second light blocking pattern 362 (see Fig. 10B For example, the tolerance due to the non-recovery may be the non-recovery movement amount DS4 between the display panel 100 and the upper member 300 (see Fig. 10B ). The tolerance due to the residual adhesive of the adhesive layer may be about 0.05 mm, and the unrecovered movement amount DS4 (see Fig. 10B ) can be about 0.094mm.

[0211] When the first other tolerance is added to the first RSS value, the tolerance may be about 0.339 mm. Since the viewing angle area 2100AV and the second light blocking pattern 362 should not overlap each other, it may be advantageous to design the first design object FD1 smaller than the calculated value. Therefore, the first design object FD1 may be designed to have a value smaller than the calculated value. For example, the first design object FD1 may be designed to have a tolerance of about 0.287 mm.

[0212] The size of the second design object FD2 may be determined based on the sum of the first RSS value and the second other tolerance. The second other tolerance may include a tolerance caused by high temperature shrinkage of the anti-reflection member 200 and the second adhesive layer 1020 and a tolerance generated when the components of the electronic device 1000 are not restored. Specifically, the second other tolerance may include an unrecovered movement amount DS3 between the anti-reflection member 200 and the layer including the second light blocking pattern 362 (see Fig. 10B ). For example, the second other tolerance may include an unrecovered movement amount DS3 between the anti-reflection member 200 and the upper member 300. The tolerance due to high temperature shrinkage of the adhesive layer may be about 0.03 mm, and the unrecovered movement amount DS3 (see Fig. 10B ) can be about 0.014 mm.

[0213] If the second other tolerance is added to the first RSS value, the tolerance may be about 0.241 mm. The second design object FD2 may be designed with the calculated value. Therefore, the second design object FD2 may be designed to have a tolerance of about 0.241 mm.

[0214] The second light blocking pattern 362 may be provided to prevent light blur from occurring in the camera module 2100. Therefore, the size of the first design object FD1 may be designed to be larger than that of the second design object FD2.

[0215] The size of the fourth design object FD4 may be designed based on the sum of the first RSS value and the fourth other tolerance. The fourth other tolerance may be the unrecovered shift amount DS2 of the second light blocking pattern 362 (see Fig. 10B ). Unrecovered movement amount DS2 (see Fig. 10B ) can be about 0.051 mm.

[0216] When the fourth other tolerance is added to the first RSS value, the tolerance may be about 0.246 mm. A fourth design object FD4 may be selected within a predetermined range based on the calculated value. For example, the fourth design object FD4 may be designed to have a tolerance of about 0.245 mm.

[0217] The size of the fifth design object FD5 may be designed based on the sum of the first RSS value and the fifth other tolerance. The fifth other tolerance may be the movement amount DS1 of the display panel 100 measured relative to the board 610. For example, the movement amount DS1 of the display panel 100 may be measured by a distance DS1a between the board 610 and the edge 100E of the display panel 100 before folding and a distance DS1b between the board 610 and the edge 100E of the display panel 100 in a fully folded state.

[0218] When the fifth other tolerance is added to the first RSS value, the tolerance may be about 0.320 mm. The fifth design object FD5 may be designed based on the calculated value. Considering the case where the top surface 2100U of the camera module 2100 is disposed until the first hole portion 101H1, the fifth design object FD5 may be designed to be more sufficient than the calculated value so that the display panel 100 and the camera module 2100 do not collide with each other. For example, the fifth design object FD5 may be designed to have a tolerance of about 0.483 mm.

[0219] Table 2 below shows component tolerance data and device tolerance data used to determine dimensions of the third design object FD3.

[0220] [Table 2]

[0221]

[0222] The second RSS value can be calculated by the following formula 2:

[0223] Formula 2:

[0224]

[0225] The size of the third design object FD3 may be determined based on the sum of the second RSS value and the third other tolerance. The third other tolerance may be an unrecovered shift amount DS4 between the display panel 100 and the layer including the second light blocking pattern 362 (see Fig. 10B For example, the tolerance due to the non-recovery may be the non-recovery movement amount DS4 between the display panel 100 and the upper member 300 (see Fig. 10B ). Unrecovered movement amount DS4 (see Fig. 10B ) can be about 0.094mm.

[0226] When the third other tolerance is added to the second RSS value, the tolerance may be about 0.267 mm. As the design value of the third design object FD3 decreases, the area outside the effective area 100A may decrease. Therefore, the design dimension of the third design object FD3 may be designed to have a value less than the calculated value. For example, the third design object FD3 may be designed to have a tolerance of about 0.230 mm.

[0227] Table 3 below shows component tolerance data and device tolerance data used to determine the dimensions of the sixth design object FD6.

[0228] [Table 3]

[0229]

[0230] The third RSS value can be calculated by the following formula 3:

[0231] Formula 3:

[0232]

[0233] The size of the sixth design object FD6 may be designed based on the third RSS value. For example, the sixth design object FD6 may be designed to have a tolerance of about 0.3 mm.

[0234] Table 4 below shows component tolerance data and device tolerance data used to determine the dimensions of the seventh design object FD7.

[0235] [Table 4]

[0236]

[0237] The fourth RSS value can be calculated by the following formula 4:

[0238] Formula 4:

[0239]

[0240] The size of the seventh design object FD7 may be designed based on the fourth RSS value. For example, the seventh design object FD7 may be designed to have a tolerance of about 0.22 mm. The eighth design object FD8 may be designed to have a tolerance of about 0.5 mm.

[0241] Reference Figure 6 , Figure 7 and Fig.11 , the first width WT1 of the first hole portion 101H1, the second width WT2 of the second hole portion 101H2, and the third width WT3 of the third hole portion 101H3 may be different from each other. For example, the second width WT2 may be greater than the first width WT1. For example, the second width WT2 may correspond to a value obtained by adding twice the size of the sixth design object FD6 to the first width WT1. Therefore, the difference between the first width WT1 and the second width WT2 may be about 0.6mm. The difference between the second width WT2 and the third width WT3 may correspond to a value obtained by adding twice the size of the seventh design object FD7. Therefore, the difference between the second width WT2 and the third width WT3 may be about 0.44mm.

[0242] The positional relationship between the second light-blocking pattern 362 and the first side wall SW1 may be determined in consideration of the size of the first design object FD1 and the size of the second design object FD2. For example, the second light-blocking pattern 362 may have a width of about 0.214 mm relative to the first side wall SW1 in a direction toward the active area 100A, and the second light-blocking pattern 362 may have a width of about 0.287 mm relative to the first side wall SW1 in a direction toward the viewing angle area 2100AV.

[0243] According to the inventive concept, the first hole 101H defined in the electronic device 1000 may include at least two or more hole portions 101H1, 101H2, and 101H3. Taking into account component tolerances, device tolerances, and folding tolerances, the hole portions 101H1, 101H2, and 101H3 may have sizes different from each other. Therefore, even if the first hole 101H is provided in the foldable electronic device 1000, interference between the inner sidewall of the first hole 101H and the camera module 2100 does not occur. In addition, taking into account the folding tolerance, a second light blocking pattern 362 may also be provided corresponding to the position of the first hole 101H. Therefore, the possibility that the second light blocking pattern 362 covers the active area 100A of the display panel 100, or the second light blocking pattern 362 covers the viewing angle area 2100AV of the camera module 2100, can be reduced.

[0244] According to the present invention, a portion of the plurality of electronic modules may overlap with the active area of ​​the electronic device, and another portion of the plurality of electronic modules may be surrounded by the active area. Therefore, for the peripheral area, it is not necessary to separately provide an area on which the plurality of electronic modules are arranged. As a result, the area ratio of the active area to the front surface of the electronic device can be increased.

[0245] According to the inventive concept, a hole defined in an electronic device may include at least two or more hole portions. Taking into account component tolerances, device tolerances, and folding tolerances, the sizes of the hole portions may be different from each other. Therefore, even if a hole is provided in a foldable electronic device, interference between the side wall in the hole and the electronic module inserted into the hole will not occur. In addition, a light blocking pattern arranged to correspond to the position of the hole may also be designed taking into account the folding tolerance. Therefore, the possibility of the light blocking pattern covering the effective area of ​​the display panel or covering the viewing angle area of ​​the electronic module can be reduced.

[0246] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. An electronic device, comprising: The display panel includes a first hole; a first lower member disposed below the display panel and comprising a second hole overlapping the first hole; as well as a second lower member disposed below the first lower member and comprising a third hole overlapping the second hole, Wherein, when viewed on a plane, a size of the second hole is larger than a size of the third hole, and the size of the third hole is larger than a size of the first hole.

2. The electronic device according to claim 1, wherein: When viewed on the plane, a side wall of the first lower member defining the second hole overlaps the display panel and the second lower member.

3. The electronic device according to claim 1, wherein: When viewed on the plane, a side wall of the second lower member defining the third hole overlaps the display panel and does not overlap the first lower member.

4. The electronic device according to claim 1, wherein: The first lower member has a color that absorbs light.

5. The electronic device according to claim 1, wherein: The thickness of the second lower member is greater than or equal to the thickness of the first lower member.

6. The electronic device according to claim 1, wherein: The first lower member is a pad member.

7. The electronic device according to claim 1, wherein: The first lower member is a plate including a material having an elastic modulus of 60 GPa or more.

8. The electronic device according to claim 1, further comprising a light blocking pattern disposed on the display panel, wherein: When viewed on the plane, a side wall of the display panel defining the first hole overlaps the light blocking pattern.

9. The electronic device according to claim 8, wherein: The light blocking pattern has a ring shape having a first edge and a second edge surrounding the first edge, and Wherein, when viewed on the plane, the first edge does not overlap with the display panel, and the second edge overlaps with the display panel.

10. The electronic device according to claim 9, wherein: When viewed on the plane, a first distance between the first edge and the side wall of the display panel is greater than a second distance between the second edge and the side wall of the display panel.

11. The electronic device according to claim 1, further comprising: An impact absorbing layer, disposed on the display panel; as well as a hard coating layer disposed between the impact absorbing layer and the display panel, Wherein, a portion of the hard coating layer is exposed through the first hole.

12. An electronic device comprising: A display panel having a first sidewall defining a first hole; a pad member disposed below the display panel and having a second sidewall defining a second hole; as well as an electronic module, arranged to overlap the first hole and the second hole, When viewed on a plane, a distance between a side wall of the electronic module and the first side wall is greater than a distance between the first side wall and the second side wall.

13. The electronic device according to claim 12, further comprising: A plate is disposed below the pad member and has a third sidewall defining a third hole.

14. The electronic device according to claim 13, wherein: When viewed on the plane, a distance between the first side wall and the second side wall is greater than a distance between the first side wall and the third side wall. 15 . The electronic device of claim 12 , further comprising a light blocking pattern disposed on the display panel and comprising a ring shape having a first edge and a second edge surrounding the first edge.

16. The electronic device according to claim 15, wherein: When viewed on the plane, the first sidewall overlaps the light blocking pattern.

17. The electronic device according to claim 15, wherein: When viewed on the plane, the second sidewall does not overlap the light blocking pattern.

18. The electronic device according to claim 12, further comprising: An impact absorbing layer, disposed on the display panel; as well as a hard coating layer disposed between the impact absorbing layer and the display panel, Wherein, a portion of the hard coating layer is exposed through the first hole.

19. An electronic device comprising: Display panel; A pad component, disposed below the display panel; as well as an electronic module inserted into a hole defined by the display panel and the pad member, in: the hole comprising a first hole portion defined in the display panel and a second hole portion defined in the pad member; as well as The second hole portion has a width greater than a width of the first hole portion.

20. An electronic device, comprising: Display panel; an electronic module overlapping the aperture defined in the display panel; as well as a light blocking pattern having a ring shape, disposed on the electronic module with the display panel between the electronic module and the light blocking pattern, and the light blocking pattern having a first edge overlapping the hole and a second edge surrounding the first edge and overlapping the display panel, A first distance between the first edge and an edge of the display panel defining the hole is greater than a second distance between the second edge and the edge of the display panel defining the hole.

Images