Manufacturing method of liquid cooling plate with separation strips

Abstract

The invention provides a manufacturing method of a liquid cooling plate with separation strips, and the manufacturing method of the liquid cooling plate with the separation strips comprises the steps: S1, obtaining a bottom plate, and carrying out the cold forging process treatment of the bottom plate, so as to form columnar pin fins which are distributed in multiple rows and multiple columns on the first surface of the bottom plate; s2, a strip-shaped separation strip is obtained, the separation strip is inserted into a gap between every two adjacent pin fins and abuts against the pin fins, and the separation strip extends in the row or column direction and is located in the middle of the bottom plate; s3, a cover plate is obtained, the cover plate is connected with the bottom plate, the bottom plate and the cover plate can be mutually enclosed to form a cavity, the cavity accommodates all the pin fins and the separation strips, preset gaps are formed between the two ends, in the length direction, of the separation strips and the inner wall of the cavity, and a liquid inlet hole and a liquid outlet hole are formed in the cover plate; the liquid inlet hole and the liquid outlet hole correspond to the two sides of the dividing strip in the width direction respectively. According to the manufacturing method of the liquid cooling plate with the separation strips, the heat dissipation uniformity can be improved, and the heat dissipation efficiency can be improved.

Description

Technical Field

[0001] The invention relates to the field of chip radiators, and in particular to a method for manufacturing a liquid cooling plate with partition strips. Background Art

[0002] The chip is cooled by a liquid cooling plate, thus ensuring better operation of the chip.

[0003] Existing liquid cooling plates usually have a cavity, a liquid inlet hole and a liquid outlet hole. The flow path of the coolant is short, the cooling efficiency is low, and the heat dissipation is uneven. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a method for manufacturing a liquid cooling plate with partition bars, which can increase the uniformity of heat dissipation and improve the heat dissipation efficiency.

[0005] In order to solve the above problems, the present invention provides a method for manufacturing a liquid cooling plate with a partition bar, and the method for manufacturing a liquid cooling plate with a partition bar comprises:

[0006] Step S1, obtaining a base plate, and performing a cold forging process on the base plate to form columnar pin fins distributed in multiple rows and columns on a first surface of the base plate, and a second surface of the base plate is used for mounting a chip;

[0007] Step S2, obtaining a separator bar, which is in a strip shape, inserting the separator bar into the gap between two adjacent pin wings and abutting against the pin wings, wherein the separator bar extends along the row or column direction and is located in the middle of the bottom plate;

[0008] Step S3, obtain a cover plate, connect the cover plate to the base plate, the base plate and the cover plate can be mutually enclosed to form a chamber, the chamber accommodates all the pin fins and the dividing strips, both ends of the dividing strips in the length direction have a predetermined gap with the inner wall of the chamber, and a liquid inlet hole and a liquid outlet hole are formed on the cover plate, and the liquid inlet hole and the liquid outlet hole respectively correspond to the two sides in the width direction of the dividing strip.

[0009] Furthermore, the pin wings in two adjacent rows and two adjacent columns are staggered, and the dividing strips are distributed in a serpentine shape.

[0010] Furthermore, the dividing strip has a first notch and a second notch which are distributed sequentially and alternately, the first notch and the second notch are oriented in opposite directions and each accommodates one pin wing, the first notch abuts against the first side wall of a row or column of pin wing in the middle, and correspondingly, the second notch abuts against the second side wall of the row or column of pin wing in the middle, and the first side wall and the second side wall are arranged opposite to each other.

[0011] Furthermore, between step S2 and step S3, the following steps are further included:

[0012] Step S4, cutting off the tops of the pin fins at two local positions on both sides of the width direction of the partition strip to form first pin fins, and the remaining pin fins are second pin fins;

[0013] In the step S3, the first pin fins are the pin fins directly below the liquid inlet and the liquid outlet.

[0014] Furthermore, the step S3 further includes:

[0015] Step S31, obtaining a flat plate, and punching the middle portion of the flat plate to form a convex cover in the middle portion of the flat plate and a flange at the edge of the flat plate, thereby forming the cover plate;

[0016] Step S32, connecting the flange to the bottom plate so that the cover plate is connected to the bottom plate.

[0017] Furthermore, the step S32 includes:

[0018] Obtain a first solder plate, and place the first solder plate between the flange and the bottom plate;

[0019] Obtain a second solder plate, and place the second solder plate between the second pin fin and the top wall of the convex cover;

[0020] The base plate, the cover plate and the partition strip are placed in a brazing furnace so that the flange is brazed to the base plate through the first brazing plate, and the second pin fin is brazed to the convex cover through the second brazing plate.

[0021] Furthermore, after step S3, the method further includes:

[0022] Step S5, dispensing glue around the edge of the second surface of the bottom plate and curing the glue to form a silicone strip, wherein the silicone strip forms a closed pattern;

[0023] Step S6, laying thermal conductive silicone grease in the area surrounded by the silicone strip, and the base plate is connected to the chip through the thermal conductive silicone grease.

[0024] Furthermore, after step S6, the method further includes:

[0025] Step S7, obtaining a gusset plate, wherein the middle of the gusset plate is hollowed out and an installation hole is formed on the edge thereof, and the gusset plate is sleeved with the convex cover and connected to the flange;

[0026] Step S8, obtaining a fastener, and passing the fastener through the mounting hole to fasten the fastener to the periphery of the chip or the chip itself.

[0027] Furthermore, between step S2 and step S3, the following steps are further included:

[0028] Step S9, laser welding is performed on the connection between the top end of the separator bar and the pin fin by laser.

[0029] Furthermore, the manufacturing method further comprises:

[0030] Step S10, obtaining a liquid inlet joint and a liquid outlet joint, wherein the liquid inlet joint comprises a first connecting block and a first pagoda joint that are interconnected, and the first connecting block is connected to the liquid inlet hole, and the liquid outlet joint comprises a second connecting block and a second pagoda joint that are interconnected, and the second connecting block is connected to the liquid outlet hole.

[0031] Due to the above technical solution, the present invention has the following beneficial effects:

[0032] According to the manufacturing method of the liquid cooling plate with a partition strip of the present invention, multiple rows and columns of pin fins are formed on the bottom plate by a cold forging process, a strip-shaped partition strip is inserted into the gap between two adjacent pin fins and abuts the pin fins, the cover plate is connected to the bottom plate, the cover plate is connected to the bottom plate and mutually encloses a chamber, and a liquid inlet and liquid outlet are formed on the cover plate. The coolant can enter the chamber from the liquid inlet hole, flow in the area corresponding to the first direction of the width direction of the partition strip, flow into the area corresponding to the second direction of the width direction of the partition strip through a predetermined gap (the gap between the partition strip and the chamber), and then flow out of the chamber from the liquid outlet hole. The coolant can be separated by the partition strip (the coolant cannot directly cross the partition strip from the liquid inlet hole to the liquid outlet hole), which can increase the flow stroke of the coolant, improve the utilization rate of the coolant, improve the heat dissipation efficiency, and increase the uniformity of heat dissipation. The gap of the pin fin is narrow, that is, the width of the partition strip is low, and the number of pin fins is not reduced. This partition strip can increase the contact area with the coolant and improve the heat dissipation efficiency. The dividing strip abuts between two adjacent pin fins, which facilitates the production of the liquid cooling plate. After the pin fins are formed on the base plate, the dividing strip can be inserted into the gap between the adjacent pin fins. The production is simple and efficient, and can meet the needs of large-scale operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 is a flow chart of a liquid cooling plate with a separator bar according to an embodiment of the present invention;

[0035] Figure 2 is a structural diagram of a liquid cooling plate with a partition bar according to an embodiment of the present invention;

[0036] Figure 3 yes Figure 2 The structural diagram of the gusset plate in FIG.

[0037] Figure 4 yes Figure 2 A structural diagram of a liquid cooling plate with a separator bar without a buckle plate;

[0038] Figure 5 yes Figure 2 A back view of a liquid cooling plate with a separator bar;

[0039] Figure 6 is a structural diagram of a base plate and pin fins according to an embodiment of the present invention;

[0040] Figure 7 is a structural diagram of a cover plate according to an embodiment of the present invention.

[0041] Reference numerals:

[0042] 100, bottom plate; 110, first pin wing; 120, second pin wing; 200, cover plate; 210, convex cover; 220, flange; 231, liquid inlet hole; 232, liquid outlet hole; 311, first pagoda joint; 312, first connecting block; 321, second pagoda joint; 322, second connecting block; 400, buckle plate; 410, mounting hole; 420, hollowing out; 500, separator strip; 600, silicone strip. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0045] Next, a method for manufacturing a liquid cooling plate with partition bars according to an embodiment of the present invention is described.

[0046] like Figures 1 to 7 As shown, the method for manufacturing a liquid cooling plate with a partition strip according to an embodiment of the present invention includes:

[0047] Step S1, obtaining a base plate 100, and performing a cold forging process on the base plate 100 to form columnar pin fins distributed in multiple rows and columns on a first surface of the base plate 100, and the second surface of the base plate 100 is used for mounting a chip.

[0048] like Figure 6 As shown, the base plate 100 is formed in one step by a cold forging process (at a certain temperature, the base plate 100 is extruded by a mold to form columnar pin fins on the base plate 100). The pin fins can increase the contact area with the coolant and improve the heat dissipation efficiency.

[0049] Step S2 , obtaining a separator bar 500 , which is in a strip shape, inserting the separator bar 500 into the gap between two adjacent pin wings and abutting against the pin wings, and extending along the row or column direction and located in the middle of the bottom plate 100 .

[0050] like Figure 6 As shown, the partition bar 500 extends along the row direction. The partition bar can separate the coolant (the coolant cannot directly pass through the partition bar 500 from the liquid inlet hole 231 to the liquid outlet hole 232), which can increase the flow path of the coolant, improve the utilization rate of the coolant, improve the heat dissipation efficiency, and increase the uniformity of heat dissipation.

[0051] The gap between the pin fins is narrow, that is, the width of the separator 500 is low, and the number of pin fins is not reduced (the separator 500 does not occupy the distribution space of the pin fins). This separator 500 can increase the contact area with the coolant and improve the heat dissipation efficiency. The distribution of the pin fins and the separator 500 can be as follows, or the separator 500 can be directly inserted between two adjacent rows or columns of pin fins.

[0052] Moreover, the partition bar 500 abuts between two adjacent pin fins, which is convenient for manufacturing the liquid cooling plate. After the pin fins are formed on the bottom plate 100, the partition bar 500 can be inserted into the gap between the adjacent pin fins. The manufacturing is simple and efficient, and it meets the needs of mass production. Moreover, for liquid cooling plates of different models and sizes, the corresponding partition bar 500 can be inserted, which can increase applicability.

[0053] Step S3, obtain the cover plate 200, connect the cover plate 200 to the base plate 100, the base plate 100 and the cover plate 200 can be enclosed with each other to form a chamber, the chamber accommodates all the pin fins and the dividing strip 500, both ends of the dividing strip 500 in the length direction have a predetermined gap with the inner wall of the chamber, and a liquid inlet hole 231 and a liquid outlet hole 232 are formed on the cover plate 200, and the liquid inlet hole 231 and the liquid outlet hole 232 correspond to the two sides of the width direction of the dividing strip 500 respectively.

[0054] like Figure 4 and Figure 7 As shown, the cover plate 200 is connected to the base plate 100 and they are mutually enclosed to form a chamber. A convex cover 210 capable of accommodating pin fins may be formed on the cover plate 200, and the base plate 100 covers the mouth of the convex cover 210; a groove body capable of accommodating pin fins may also be formed on the base plate 100, and the cover plate 200 covers the mouth of the groove body.

[0055] The coolant can enter the chamber from the liquid inlet hole 231, flow in the area corresponding to the first direction of the width direction of the dividing bar 500, flow into the area corresponding to the second direction of the width direction of the dividing bar 500 through a predetermined gap (the gap between the dividing bar 500 and the inner wall of the chamber), and then flow out of the chamber from the liquid outlet hole 232.

[0056] In the above method for manufacturing a liquid cooling plate with a partition bar, multiple rows and columns of pin fins are formed on the base plate 100 by a cold forging process, a strip-shaped partition bar 500 is inserted into the gap between two adjacent pin fins and abuts the pin fins, the cover plate 200 is connected to the base plate 100, the cover plate 200 is connected to the base plate 100 and mutually encloses a chamber, and a liquid inlet hole 231 and a liquid outlet hole 232 are formed on the cover plate 200. The coolant can enter the chamber from the liquid inlet hole 231, flow in the area corresponding to the first direction of the width direction of the partition bar 500, flow through a predetermined gap (the gap between the partition bar 500 and the chamber) into the area corresponding to the second direction of the width direction of the partition bar 500, and then flow out of the chamber from the liquid outlet hole 232. The coolant can be separated by the dividing strip 500 (the coolant cannot directly pass through the dividing strip 500 from the liquid inlet hole 231 to the liquid outlet hole 232), which can increase the flow path of the coolant, improve the utilization rate of the coolant, improve the heat dissipation efficiency, and increase the uniformity of heat dissipation. The gap between the pin fins is narrow, that is, the width of the dividing strip 500 is low, and the number of pin fins is not reduced. This dividing strip 500 can increase the contact area with the coolant and improve the heat dissipation efficiency. The dividing strip 500 abuts between two adjacent pin fins, which is convenient for the production of the liquid cooling plate. After the pin fins are formed on the base plate 100, the dividing strip 500 can be inserted into the gap between the adjacent pin fins. The production is simple and efficient, and meets the needs of large-scale operations.

[0057] In some embodiments of the present invention, two adjacent rows and two adjacent columns of pin-fins are staggered, and the dividing strips 500 are distributed in a serpentine shape.

[0058] The staggered pin fins can increase the uniformity of the coolant's heat dissipation.

[0059] like Figure 6 As shown, the separator 500 is formed into a serpentine shape (with two notches in symmetrical directions), which can increase the contact area with the coolant and improve the heat dissipation efficiency. Moreover, the serpentine separator 500 can increase the contact area with the pin fins, avoid relative movement with the pin fins, and increase the stability of the contact with the pin fins.

[0060] It should be noted that the above are only optional examples, and the partition bar 500 may also be formed in a serpentine shape (a notch in only one direction), which should be understood to be within the scope of the present invention.

[0061] Furthermore, the dividing strip 500 has a first notch and a second notch which are distributed sequentially and alternately, the first notch and the second notch are oriented in opposite directions and each accommodates a pin wing, the first notch abuts against the first side wall of a row or column of pin wing in the middle, and correspondingly, the second notch abuts against the second side wall of the row or column of pin wing in the middle, and the first side wall and the second side wall are arranged opposite to each other.

[0062] like Figure 6 As shown, the dividing strips 500 are distributed in a serpentine shape, and are sequentially and alternately formed with a rear notch (first notch), a front notch (second notch), a rear notch (first notch), a front notch (second notch) . . . . .

[0063] The rear notch abuts against the front side wall (first side wall) of a pin wing in a row in the middle, and the front notch abuts against the rear side wall (second side wall) of a pin wing in this row.

[0064] The serpentine distribution (the first notch and the second notch that are distributed sequentially and alternately) can make the coolant distribution on both sides of the width direction of the partition bar 500 more uniform. The first notch and the second notch are distributed alternately and sequentially, each accommodating a pin fin, increasing the contact area with the pin fin, further reducing the relative movement between the partition bar 500 and the pin fin, and making the position and structure of the partition bar 500 stable.

[0065] It should be noted that the above are only optional examples, and the dividing strip 500 can also form a left recess (first recess) and a right recess (second recess), the left recess abuts against the right side wall (first side wall) of the needle wing, and the right recess abuts against the left side wall (second side wall) of the needle wing. These should all be understood to be within the scope of the present invention.

[0066] In some embodiments of the present invention, between step S2 and step S3, the following is also included: step S4, cutting off the tops of the pin fins at two local positions on both sides of the width direction of the dividing strip 500 to form first pin fins 110, and the remaining pin fins are second pin fins 120; in step S3, the first pin fins 110 are the pin fins directly below the liquid inlet hole 231 and the liquid outlet hole 232.

[0067] like Figure 6 As shown, the top of the pin fin at the local position directly below the liquid inlet hole 231 and the liquid outlet hole 232 is cut off to form the first pin fin 110, and the remaining pin fins are the second pin fins 120, that is, the height of the first pin fin 110 is lower than the second pin fin 120. The lower height of the first pin fin 110 will reduce the obstruction to the coolant flowing in and out, increase the flow rate of the coolant flowing into and out of the chamber, and improve the heat dissipation efficiency. Moreover, the first pin fin 110 can still increase the contact area with the coolant to improve the heat dissipation efficiency.

[0068] In some embodiments of the present invention, step S3 also includes: step S31, obtaining a flat plate, and stamping the middle of the flat plate to form a convex cover 210 in the middle of the flat plate and a flange 220 at the edge of the flat plate, thereby forming a cover plate 200; step S32, connecting the flange 220 to the base plate 100, so that the cover plate 200 is connected to the base plate 100.

[0069] The convex cover 210 of the cover plate 200 forms a cavity with the bottom plate 100, so as to accommodate the pin fins and the coolant. The cover plate 200 is formed in one step by stamping a flat plate, which is low in cost and easy to manufacture.

[0070] Furthermore, step S32 includes: obtaining a first brazing plate, and placing the first brazing plate between the flange 220 and the base plate 100; obtaining a second brazing plate, and placing the second brazing plate between the second pin fin 120 and the top wall of the convex cover 210; placing the base plate 100, the cover plate 200 and the dividing strip 500 into a brazing furnace, so that the flange 220 is brazed to the base plate 100 through the first brazing plate, and the second pin fin 120 is brazed to the convex cover 210 through the second brazing plate.

[0071] The bottom plate 100 and the flange 220 are brazed together through the first brazing plate, which can increase the airtightness of the chamber and prevent leakage. The second pin fin 120 and the inner wall of the convex cover 210 are brazed together through the second brazing plate, which can reduce thermal resistance and improve heat dissipation efficiency.

[0072] In some embodiments of the present invention, after step S3, the following further includes: step S5, dispensing glue around the edge of the second surface of the base plate 100 and curing to form a silicone strip 600, wherein the silicone strip 600 forms a closed pattern; step S6, laying thermal grease in the area surrounded by the silicone strip 600, and the base plate 100 is connected to the chip through the thermal grease.

[0073] like Figure 5 As shown, a circle of glue is dispensed on the bottom plate 100 and solidified to form a rectangular frame-shaped silicone strip 600, and thermal grease is laid in the rectangular frame to form a certain thickness of the thermal grease (the silicone strip 600 forms a dam to prevent the thermal grease from overflowing outside the rectangular frame), ensuring that the thermal grease in the rectangular frame is relatively uniform and flat. The chip is buckled on the evenly distributed thermal grease, and there is no gap between the chip and the thermal grease, which can reduce thermal resistance and improve heat dissipation efficiency.

[0074] It should be noted that there is no limitation on the closed figure here, and it can also be a pentagon (forming a pentagonal frame), a circle (forming a circular frame), etc.

[0075] Furthermore, after step S6, it also includes: step S7, obtaining a buckle plate 400, the middle part of which has a hollow 420 and an installation hole 410 is formed on its edge, and the buckle plate 400 is covered with a convex cover 210 and connected to the flange 220; step S8, obtaining a fastener, and passing the fastener through the installation hole 410 to fasten the fastener to the periphery of the chip or the chip itself.

[0076] like Figure 2 and Figure 3 As shown, fasteners (such as bolts, rivets, etc.) pass through the mounting holes 410 of the buckle plate 400 and are connected to the periphery of the chip or the chip itself, so that the flange 220 and the base plate 100 press the chip, increase the tightness and stability of the connection with the chip, and reduce thermal resistance.

[0077] On the basis that the thermal conductive silicone grease is formed on the second surface of the base plate 100 , the buckle plate 400 can make the base plate 100 , the thermal conductive silicone grease and the chip fully contact each other, so that the thermal resistance is greatly reduced.

[0078] There are various laying methods, such as injecting thermal grease into the area surrounded by the silicone strip 600 or extruding thermal grease along a predetermined line in the area surrounded by the silicone strip 600 through a dispensing head to make the thermal grease level.

[0079] In some embodiments of the present invention, between step S2 and step S3, the following step is further included: step S9, laser welding the top of the separator bar 500 and the connection between the pin fins by laser.

[0080] That is, on the basis of the abutment between the pin fin and the partition bar 500, laser welding is added between the top of the pin fin and the partition bar 500, thereby further improving the stability of the connection between the pin fin and the partition bar 500. Moreover, this operation is simple and efficient.

[0081] In some embodiments of the present invention, the manufacturing method also includes: step S10, obtaining a liquid inlet joint and a liquid outlet joint, the liquid inlet joint includes a first connecting block 312 and a first pagoda joint 311 that are interconnected, and the first connecting block 312 is connected to the liquid inlet hole 231; the liquid outlet joint includes a second connecting block 322 and a second pagoda joint 321 that are interconnected, and the second connecting block 322 is connected to the liquid outlet hole 232.

[0082] like Figure 4 As shown, the coolant can enter the first pagoda joint 311 and the first connecting block 312 from the liquid inlet pipe and enter the chamber, and the coolant flows out from the chamber to the second connecting block 322 and the second pagoda joint 321 and then enters the liquid outlet pipe.

[0083] The first pagoda joint 311 is convenient for sealing connection with the liquid inlet pipe, and the second pagoda joint 321 is convenient for sealing connection with the liquid outlet pipe to avoid liquid leakage.

[0084] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a liquid cooling plate with a partition bar, characterized in that: The production method comprises: Step S1, obtaining a base plate, and performing a cold forging process on the base plate to form columnar pin fins distributed in multiple rows and columns on a first surface of the base plate, and a second surface of the base plate is used for mounting a chip; Step S2, obtaining a separator bar, which is in a strip shape, inserting the separator bar into the gap between two adjacent pin wings and abutting against the pin wings, wherein the separator bar extends along the row or column direction and is located in the middle of the bottom plate; Step S3, obtain a cover plate, connect the cover plate to the base plate, the base plate and the cover plate can be mutually enclosed to form a chamber, the chamber accommodates all the pin fins and the dividing strips, both ends of the dividing strips in the length direction have a predetermined gap with the inner wall of the chamber, and a liquid inlet hole and a liquid outlet hole are formed on the cover plate, and the liquid inlet hole and the liquid outlet hole respectively correspond to the two sides in the width direction of the dividing strip.

2. The method for manufacturing a liquid cooling plate with a partition strip according to claim 1, characterized in that: The pin wings in two adjacent rows and two adjacent columns are staggered, and the separation strips are distributed in a serpentine shape.

3. The method for manufacturing a liquid cooling plate with a partition strip according to claim 2, characterized in that: The dividing strip has a first notch and a second notch that are distributed sequentially and alternately, the first notch and the second notch are oriented in opposite directions and each accommodates one pin wing, the first notch abuts against the first side wall of a row or column of the pin wing in the middle, and correspondingly, the second notch abuts against the second side wall of the row or column of the pin wing in the middle, and the first side wall and the second side wall are arranged opposite to each other.

4. The method for manufacturing a liquid cooling plate with a partition strip according to claim 1, characterized in that: Also included between step S2 and step S3: Step S4, cutting off the tops of the pin fins at two local positions on both sides of the width direction of the partition strip to form first pin fins, and the remaining pin fins are second pin fins; In the step S3, the first pin fins are the pin fins directly below the liquid inlet and the liquid outlet.

5. The method for manufacturing a liquid cooling plate with a partition strip according to claim 4, characterized in that: The step S3 also includes: Step S31, obtaining a flat plate, and punching the middle portion of the flat plate to form a convex cover in the middle portion of the flat plate and a flange at the edge of the flat plate, thereby forming the cover plate; Step S32, connecting the flange to the bottom plate so that the cover plate is connected to the bottom plate.

6. The method for manufacturing a liquid cooling plate with a partition strip according to claim 5, characterized in that: The step S32 includes: Obtain a first solder plate, and place the first solder plate between the flange and the bottom plate; Obtain a second solder plate, and place the second solder plate between the second pin fin and the top wall of the convex cover; The base plate, the cover plate and the partition strip are placed in a brazing furnace so that the flange is brazed to the base plate through the first brazing plate, and the second pin fin is brazed to the convex cover through the second brazing plate.

7. The method for manufacturing a liquid cooling plate with a partition strip according to claim 6, characterized in that: After step S3, the method further includes: Step S5, dispensing glue around the edge of the second surface of the bottom plate and curing the glue to form a silicone strip, wherein the silicone strip forms a closed pattern; Step S6, laying thermal conductive silicone grease in the area surrounded by the silicone strip, and the base plate is connected to the chip through the thermal conductive silicone grease.

8. The method for manufacturing a liquid cooling plate with a partition strip according to claim 7, characterized in that: After step S6, the method further includes: Step S7, obtaining a gusset plate, wherein the middle of the gusset plate is hollowed out and an installation hole is formed on the edge thereof, and the gusset plate is sleeved with the convex cover and connected to the flange; Step S8, obtaining a fastener, and passing the fastener through the mounting hole to fasten the fastener to the periphery of the chip or the chip itself.

9. The method for manufacturing a liquid cooling plate with a partition strip according to claim 1, characterized in that: Also included between step S2 and step S3: Step S9, laser welding is performed on the connection between the top end of the separator bar and the pin fin by laser.

10. The method for manufacturing a liquid cooling plate with a partition strip according to claim 1, characterized in that: The production method further comprises: Step S10, obtaining a liquid inlet joint and a liquid outlet joint, wherein the liquid inlet joint comprises a first connecting block and a first pagoda joint that are interconnected, and the first connecting block is connected to the liquid inlet hole, and the liquid outlet joint comprises a second connecting block and a second pagoda joint that are interconnected, and the second connecting block is connected to the liquid outlet hole.

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