Substrate clamp and substrate processing equipment

Abstract

The invention discloses a substrate clamp and substrate processing equipment, and the substrate clamp comprises a plurality of supporting members which are arranged on a fixing ring and are sequentially arranged in the circumferential direction of an opening, each supporting member comprises a connecting part and a contact which are in conductive connection, the surface of each connecting part is provided with an insulating layer, and each contact is used for being in electric contact with a substrate; wherein the contact is connected with the fixing ring at a preset distance through the connecting part, so that the fixing ring is positioned above the liquid level of the treatment liquid and the contact and the substrate carried by the contact are positioned below the liquid level during the treatment of the substrate. The present invention achieves an effect of reducing electrical contact between a substrate jig and a processing liquid during substrate processing.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and further to a substrate clamp and substrate processing equipment. Background Art

[0002] The wet etching process is a type of etching process. In the wet etching process, due to equipment reasons (the control accuracy of etching time or etching solution temperature) or the life of the etching solution itself, the etching amount of the etching solution will change, resulting in an unstable etching rate, which makes the etching thickness uniformity of the product poor, and the appearance has defects such as color difference and pitting. In addition, the lateral etching amount (Undercut) is too large, which seriously affects the quality of the product.

[0003] In the prior art, a technical solution that uses a stripping process to replace the wet etching process has been disclosed. For example, the Chinese patent with application number 202111140314.8 provides a method for preparing a patterned electrode using a stripping process and a patterned electrode thereof. The method omits the wet etching step, thereby avoiding the various problems caused by wet etching. The principle of the above-mentioned stripping process is: stripping is the reverse process of electroplating. When a substrate with a metal film is electroplated as a working electrode (anode), the metal part without photoresist protection will lose electrons and become metal ions that dissolve into the electroplating solution. After the surface metal dissolves, the metal in the conductive seed layer will also lose electrons and be dissolved, while the metal in the part protected by the photoresist is retained, thereby achieving the purpose of electrode patterning.

[0004] The structure of the substrate stripping equipment is similar to that of the substrate electroplating equipment. However, in some existing electroplating equipment, the substrate fixture used for electroplating has a seal, and the substrate fixture is isolated from the plating solution by the seal. This can prevent the current in the plating solution from being directly conducted to the substrate fixture without passing through the substrate surface, resulting in the current conducted from the plating solution to the substrate surface being less than the theoretical value, thereby affecting the actual coating thickness. In the substrate electroplating process, the seal will prevent the plating solution from contacting the substrate edge while blocking the direct contact between the plating solution and the substrate fixture. However, since only one side of the substrate needs to be electroplated in the substrate electroplating process, and the edge of the substrate does not need to be electroplated, the seal will not affect the substrate electroplating. In the substrate stripping process, the entire surface of the substrate needs to be stripped. If the above-mentioned seal is used, the edge area of ​​the substrate cannot be stripped. Therefore, the above-mentioned seal is not suitable for stripping. However, in the substrate stripping, if the substrate fixture is in direct contact with the plating solution, part of the current in the plating solution will still be directly conducted to the substrate fixture, resulting in the current conducted from the plating solution to the substrate surface being less than the theoretical value, and the stripping amount on the substrate surface is reduced, affecting the stripping effect.

[0005] Therefore, the present application aims to provide a substrate clamp for reducing electrical contact between the substrate clamp and a processing liquid during liquid processing of the substrate. Summary of the invention

[0006] In view of the above technical problems, an object of the present invention is to provide a substrate clamp and a substrate processing device, so as to reduce the electrical contact between the substrate clamp and the processing liquid during substrate processing.

[0007] In some embodiments, the above-mentioned substrate clamp is used to fix the substrate in a process chamber, and the process chamber is used to contain a processing liquid. The substrate clamp includes: a plurality of supporting members, which are provided on the fixing ring and arranged in sequence along the circumference of the opening, the supporting members include a connecting portion and a contact with a conductive connection, an insulating layer is provided on the surface of the connecting portion, and the contact is used to electrically contact the substrate; wherein the contact is connected to the fixing ring at a predetermined distance through the connecting portion, so that during the processing of the substrate, the fixing ring is located above the liquid level of the processing liquid, and the contact and the substrate carried by it are located below the liquid level.

[0008] In some embodiments, the substrate processing device includes a substrate holder, a process chamber, an electrode, and a power supply.

[0009] Compared with the prior art, the beneficial effects of the present application are as follows: the substrate clamp disclosed in the present application includes a fixing ring and a plurality of supporting members mounted on the fixing ring, and the supporting members can play the role of supporting the substrate and also play the role of conducting electricity to the substrate. In addition, the supporting structure further includes a connecting portion and a contact connected in sequence, and the contact maintains a predetermined distance with the fixing ring through the connecting portion, so that during the substrate processing, the fixing ring can be located above the liquid level of the processing liquid, and the contact and the substrate carried by it are located below the liquid level, thereby avoiding the fixing ring from contacting the processing liquid and making the substrate completely immersed in the processing liquid, thereby reducing the electrical contact between the substrate clamp and the processing liquid during the substrate processing, and improving the accuracy of the substrate processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0011] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the substrate clamp of the present invention;

[0012] Figure 2 It is a schematic diagram of the three-dimensional structure of a fixing ring of an embodiment of a substrate clamp of the present invention;

[0013] Figure 3 yes Figure 2 A top view of

[0014] Figure 4 It is a schematic diagram of the supporting member structure of an embodiment of the substrate clamp of the present invention;

[0015] Figure 5a is a schematic structural diagram of a supporting member of another embodiment of a substrate clamp of the present invention;

[0016] Figure 5b yes Figure 5a A schematic diagram of another embodiment of the present invention;

[0017] Figure 6 It is a schematic diagram of the guide structure of an embodiment of the substrate clamp of the present invention;

[0018] Figure 7 It is a schematic diagram of a pressing plate structure of an embodiment of a substrate clamp of the present invention;

[0019] Figure 8 yes Figure 7 Bottom view of

[0020] Fig. 9 is a bottom view of an embodiment of the substrate clamp of the present invention in a substrate loading state;

[0021] Fig.10 yes Fig. 9 A partial enlarged view of area a;

[0022] Fig.11 It is a schematic diagram of the three-dimensional structure of the second pressure column of an embodiment of the substrate clamp of the present invention;

[0023] Fig.12 is a schematic diagram of an embodiment of a substrate clamp of the present invention during loading of a substrate;

[0024] Fig.13 is a schematic diagram of an embodiment of a substrate clamp of the present invention during loading of a substrate;

[0025] Fig.14 is a schematic diagram of an embodiment of a substrate clamp of the present invention during loading of a substrate;

[0026] Fig.15 It is a schematic diagram of an embodiment of a substrate clamp of the present invention after loading a substrate. DETAILED DESCRIPTION

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0028] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0029] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0031] like Figures 1 to 3 As shown, the present invention discloses a substrate clamp 200 for fixing a substrate 300 in a process chamber 100 of a substrate processing device. The process chamber 100 is used to contain a processing liquid. The substrate clamp 200 includes a fixing ring 210 and a plurality of supporting members 220 .

[0032] Specifically, the fixing ring 210 is configured to have an opening 214 for receiving the substrate 300, and the shape of the opening 214 is substantially consistent with the shape of the substrate 300. The support members 220 are disposed on the fixing ring 210 and are sequentially arranged along the circumference of the opening 214 of the fixing ring 210. The support members 220 further include a connection portion 226 and a contact 223 for conductive connection.

[0033] The contact 223 is used to make electrical contact with the substrate 300. The contact 223 is connected to the fixing ring 210 at a predetermined distance through the connection portion 226, so that during the processing of the substrate 300, the fixing ring 210 is located above the liquid level 110 of the processing liquid, and the contact 223 and the substrate 300 carried by it are located below the liquid level 110. Since only the supporting member 220 is in contact with the processing liquid, the fixing ring 210 is prevented from contacting with the processing liquid, and the current in the processing liquid is prevented from being directly conducted to the fixing ring 210 without passing through the surface of the substrate 300. In addition, an insulating layer 224 is provided on the surface of the connection portion 226, which can further reduce the electrical contact between the substrate clamp 200 and the processing liquid.

[0034] In addition, the insulating layer 224 may be a plastic sleeve or a plastic coating, and its material includes but is not limited to PTFE (polytetrafluoroethylene). The connecting portion 226 and the contact 223 are made of conductive materials, such as titanium.

[0035] Preferably, the connecting portion 226 is a bending piece with a certain elasticity. Figure 2 In this example, the connection portion 226 includes a first connection portion 221 and a second connection portion 222. One end of the first connection portion 221 is fixedly connected to the fixing ring 210. The other end of the first connection portion 221 extends from the fixing ring 210 to a preset length in a direction away from the fixing ring 210. The second connection portion 222 extends from the other end of the first connection portion 221 to the vertical projection range of the opening 214 and is connected to the contact 223. The angle between the first connection portion 221 and the second connection portion 222 is denoted as θ (hereinafter referred to as the bending angle θ of the connection portion 226). When the substrate fixture 200 is not loaded with the substrate 300, the bending angle θ of the connection portion 226 is 90 degrees or less than 90 degrees; when the substrate fixture 200 is loaded with the substrate 300, the bending angle θ of the contact 223 becomes larger under the pressure of the substrate 300, and the bottom surface of the substrate 300 presses the contact 223.

[0036] like Figure 4 As shown, in a preferred embodiment of the present application, the connecting portion 226 is a rod-shaped structure, the contact 223 is a spherical structure, and the diameter of the contact 223 is larger than the cross-sectional diameter of the connecting portion 226. The surface of the contact 223 is provided with an insulating layer 224 except for the area 2231 that is in electrical contact with the substrate 300 supported by it, so as to minimize the direct contact between the contact 223 and the processing liquid.

[0037] like Figure 5aAs shown, in a preferred embodiment of the present application, the connection portion 226 is a rod-shaped structure, and the contact 223 includes a contact housing 2232, a contact body 2233, a sealing ring 2234 and an elastic member 2236. Among them, the contact housing 2232 is provided with a receiving groove 2235 in the vertical direction, one end of the contact body 2233 extends out of the contact housing 2232, and the other end is installed in the receiving groove 2235 through the elastic member 2236, and the sealing ring 2234 surrounds the contact body 2233 and is provided on the contact housing 2232. The connection portion 226 and the contact body 2233 are electrically connected. When the substrate fixture 200 is not loaded with the substrate 300, under the elastic force of the elastic member 2236, the end of the contact body 2233 extending out of the contact housing 2232 is higher than the sealing ring 2234; when the substrate fixture 200 is loaded with the substrate 300, after the substrate 300 contacts the end of the contact body 2233 extending out of the contact housing 2232, the contact body 2233 moves into the receiving groove 2235 under the pressure of the substrate 300 until the substrate 300 is squeezed and contacted with the sealing ring 2234, so that the contact body 2233 is isolated from the treatment liquid. Preferably, an insulating layer 224 is provided on the surface of the contact housing 2232 to minimize the direct contact between the contact 223 and the treatment liquid. The elastic member 2236 includes but is not limited to a spring.

[0038] Preferably, if Figure 5b As shown, the connecting portion 226 includes a wire 225 and a wire housing 227. The wire housing 227 is a hollow rod-shaped structure and is in electrical communication with the receiving groove 2235. The wire 225 is disposed in the wire housing 227 and is electrically connected to the contact body 2233. The wire housing 227 serves as an insulating layer 224. It should be noted that in this embodiment, the wire housing 227 is made of an insulating material as a whole, and the wire housing 227 has the function of the insulating layer 224 (such as Figure 5b In other embodiments, the wire housing 227 may be made of a non-insulating material. To prevent the wire housing 227 from conducting electricity with the processing liquid, an insulating layer 224 is still required on the outside of the wire housing 227.

[0039] Preferably, the support member 220 can be configured such that the extension direction of the second connection portion 222 forms an acute angle with the clamp α of the radius r of the opening 214 (see Figure 3 ), preferably 45 degrees, so that without increasing the distance between the contact 223 and the edge of the substrate 300, the length of the second connecting portion 222 is increased, and then when the connecting portion 226 is elastically deformed under the action of an external force, the change in the angle θ between the first connecting portion 221 and the second connecting portion 222 is increased, so that when the substrate clamp 200 is carrying the substrate 300, the friction time between the bottom surface of the substrate 300 and the contact 223 is increased, so that the contact 223 is fully in contact with the bottom surface of the substrate 300, the conductive performance is increased, and poor contact between the contact 223 and the substrate 300 is prevented.

[0040] like Figure 2 , Figure 3 and Figure 6 As shown, in a preferred embodiment of the present application, a plurality of guide members 211 are provided at the bottom of the fixing ring 210, and the guide members 211 are configured to have a guide sliding surface 212 facing the center of the opening 214, and are used to guide the substrate 300 to a preset position during the process of loading the substrate 300 on the substrate fixture 200. When the substrate 300 is located at the above-mentioned preset position, the center line of the substrate 300 and the opening 214 coincide.

[0041] Preferably, a limiting pin 213 is provided on the surface of the guide sliding surface 212, and the limiting pin 213 protrudes from the guide sliding surface 212 to the vertical projection range of the opening 214. When the substrate fixture 200 is loaded with the substrate 300, the limiting pin 213 is not higher than the contact 223 to prevent the substrate 300 from falling directly into the process tank when the supporting member 220 fails.

[0042] Reference again Figure 1 In a preferred embodiment of the present application, the substrate clamp 200 further includes a pressing plate 230 and a pressing plate driving device 240. The pressing plate 230 is used to abut against the back of the substrate 300 during the processing of the substrate 300 so that the substrate 300 is pressed and contacted with the contact 223. The pressing plate driving device 240 is used to drive the pressing plate 230 to abut against or away from the back of the substrate 300. In addition, when a problem occurs in the pressing plate driving device 240, such as a cylinder, and the pressing plate 230 over-presses the substrate 300, the above-mentioned limiting nails 213 can be used to prevent the support member 220 from being over-deformed, causing the substrate 300 to fall off and cause problems such as fragments.

[0043] Preferably, the pressure plate 230 has a lower surface 234 in contact with the fixing ring 210, and a buffer pad 235 is arranged on the lower surface 234 to reduce the impact of the pressure plate 230 on the fixing ring 210 during the descent of the pressure plate 230, and the above-mentioned buffer pad 235 is preferably an annular gasket arranged in the opening 214 between the pressure plate 230 and the fixing ring 210.

[0044] Preferably, if Figures 7 to 10 As shown, the above-mentioned pressing plate 230 includes a plurality of first pressing columns 231 and second pressing columns 232. The first pressing columns 231 are arranged at intervals on the edge of the pressing plate 230 against the substrate 300, and the first pressing columns 231 correspond to the contacts 223 one by one (see Fig.10) to abut against the edge area of ​​the substrate 300. Since the corresponding first pressure columns 231 and contacts 223 act on the substrate 300 at the same position on the front and back sides of the substrate 300, the forces on both sides of the substrate are evenly applied, thereby avoiding damage to the front and back sides of the substrate 300 due to uneven forces. The second pressure columns 232 are spaced apart in the middle of one side of the pressure plate 230 abutting against the substrate 300, and are used to abut against the middle area of ​​the substrate 300, so that the force on the surface of the substrate 300 is more even. In addition, in order to prevent residual effusion, the setting position of the second pressure column 232 should be staggered with the position of the suction cup 141 of the robot 140 (see Fig. 9 ).

[0045] Preferably, if Fig.10 and Fig.11 As shown, a plurality of guide grooves 233 are provided on the side of the first pressure column 231 and the second pressure column 232 that abut against the substrate 300. The guide grooves 233 extend along the radial direction of the pressure plate 230 so that after the substrate 300 is processed, the substrate 300 rises with the substrate fixture 200 to leave the processing liquid, and the processing liquid retained on the surface (upper surface) of the substrate 300 leaves the surface of the substrate 300. The guide grooves 233 are provided on the side of the first pressure column 231 and the second pressure column 232 that faces the bottom of the process chamber 100, which can reduce the contact area between the bottom of the first pressure column 231 and the second pressure column 232 and the surface of the substrate 300, and prevent the bottom of the first pressure column 231 and the second pressure column 232 from adsorbing the substrate 300 while the pressure plate 230 rises after the substrate 300 is processed, causing the substrate 300 to rise together with the pressure plate, causing the substrate 300 to fall and be damaged.

[0046] Preferably, again refer to Figure 1 and Figure 8 , a cavity structure 236 is constructed on one side of the pressing plate 230 against the substrate 300, a first pressing column 231 is located at the edge of the cavity structure 236, and a second pressing column 232 is located in the middle of the cavity structure 236. The cavity structure 236 has a side wall 2361 inclined outward and an arched top 2362. In addition, during the processing of the substrate 300, the substrate clamp 100 is configured so that the highest point of the top 2362 is located above the liquid level 110 of the processing liquid. The above-mentioned cavity structure 236 is conducive to reducing the contact area between the pressing plate 230 and the processing liquid during the substrate processing, preventing the pressing plate 230 from adsorbing the substrate 300 when it rises. In addition, the design of the side wall 2361 and the top 2362 of the cavity structure 236 is conducive to preventing the processing liquid from adhering to the inside of the cavity structure 236, reducing the corrosion of the pressing plate 230.

[0047] Preferably, in a preferred embodiment of the present application, the substrate fixture 200 further includes a fixing plate 250 and a support column 260. The fixing plate 250 is located above the fixing ring 210, and the two are connected by the support column 260. The pressing plate 230 is located between the fixing plate 250 and the fixing ring 210 and is movable, and a guide hole 237 is configured on the edge of the pressing plate 230 (see Figure 7 and Figure 8 ), the support column 260 passes through the guide hole 237 so that the pressure plate 230, the fixing plate 250 and the fixing ring 210 are located on the same center line.

[0048] like Figures 12 to 15 As shown, in actual application, the working steps of the substrate clamp 200 are as follows:

[0049] First, if Fig.12 As shown, the pressing plate 230 moves upward under the drive of the pressing plate driving device 240 and stops above the fixing ring 210, and there is a certain distance between the pressing plate 230 and the fixing ring 210. At this time, the substrate 300 can be moved from the side of the substrate fixture 200 to between the pressing plate 230 and the fixing ring 210 by the robot 140;

[0050] Secondly, if Fig.13 As shown, the manipulator 140 continues to drive the substrate 300 to move downward, and after the substrate 300 passes through the opening 214 of the fixing ring 210, the substrate 300 is finally placed on the supporting member 220. At this time, the contacts 223 of each supporting member 220 jointly support the substrate 300, and the manipulator 140 moves out from between the pressing plate 230 and the fixing ring 210. At this time, the pressure of the substrate 300 on the contacts 223 is equal to the gravity of the substrate 300.

[0051] Again, if Fig.14 As shown, the pressing plate 230 moves downward under the drive of the pressing plate driving device 240 and abuts against the back of the substrate 300 to make the substrate 300 and the contact 223 pressed and contacted. At this time, the pressure of the substrate 300 on the contact 223 is equal to the pressure of the gravity of the substrate 300 on the substrate 300, so that the support member 220 is elastically deformed, and the loading of the substrate 300 is completed;

[0052] Finally, if Fig.15 As shown, the substrate holder 200 loaded with the substrate 300 is moved downward as a whole into the process chamber 100 of the substrate processing equipment to process the substrate 300.

[0053] The present invention also discloses a substrate processing device, see Figure 1The substrate processing device comprises a process chamber 100, an electrode 120, a power supply 130 and a substrate fixture 200 in any of the above embodiments. The electrode 120 is disposed in the process chamber 100, and the power supply 130 is used to provide currents with opposite electrical properties to the substrate fixture 200 and the electrode 120. Preferably, the substrate processing device is a stripping device, and the power supply 130 is configured to provide a positive current to the substrate 300 and a negative current to the electrode 120.

[0054] This embodiment is based on the special structure of the substrate clamp 200, so that during the processing of the substrate 300, only the support member 220 is in contact with the electrical processing liquid, avoiding the contact between the fixing ring 210 and the processing liquid, and making the substrate 300 completely immersed in the processing liquid, thereby reducing the electrical contact between the substrate clamp 200 and the processing liquid during the processing of the substrate 300, thereby improving the accuracy of the processing of the substrate 300.

[0055] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A substrate fixture for fixing a substrate in a process chamber, wherein the process chamber is used to contain a processing liquid, characterized in that: The substrate fixture comprises: a fixing ring configured to have an opening for receiving the substrate; A plurality of supporting members are arranged on the fixing ring and arranged in sequence along the circumference of the opening, wherein the supporting members include a connecting portion and a contact for conductive connection, an insulating layer is provided on the surface of the connecting portion, and the contact is used for electrically contacting the substrate; wherein, The contact is connected to the fixing ring at a predetermined distance through the connecting portion, so that during the substrate processing, the fixing ring is located above the liquid level of the processing liquid, and the contact and the substrate carried by the contact are located below the liquid level.

2. The substrate fixture according to claim 1, characterized in that: The connecting portion is a rod-shaped structure; The contact has a spherical structure, and a diameter of the contact is larger than a cross-sectional diameter of the connecting portion.

3. The substrate clamp according to claim 2, characterized in that: The contact surface is provided with an insulating layer except for the area which is in electrical contact with the substrate supported by the contact surface.

4. The substrate fixture according to claim 1, characterized in that: The contact comprises a contact housing, a contact body, an elastic member and a sealing ring, wherein a receiving groove is arranged in the contact housing, one end of the contact body extends out of the contact housing for electrical contact with the substrate, and the other end of the contact body is resiliently mounted in the receiving groove through the elastic member, and the sealing ring is arranged on the contact housing and surrounds the periphery of the end of the contact body extending out of the contact housing; The connecting portion is electrically connected to the contact body; wherein, When the substrate fixture is not loaded with a substrate, under the elastic force of the elastic member, one end of the contact body extending out of the contact housing is higher than the sealing ring; When the substrate fixture is loading the substrate, the contact body moves into the receiving groove under the pressure of the substrate until the substrate is pressed into contact with the sealing ring, so that the contact body is isolated from the processing liquid.

5. The substrate clamp according to claim 4, characterized in that: The connecting portion includes a wire and a wire housing, wherein the wire housing is a hollow rod-shaped structure and is in electrical communication with the accommodating groove, and the wire is disposed in the wire housing and is electrically connected to the contact body; wherein the wire housing serves as the insulating layer.

6. The substrate fixture according to claim 4, characterized in that: An insulating layer is provided on the surface of the contact housing.

7. The substrate fixture according to claim 1, characterized in that: The material of the contact is titanium.

8. The substrate fixture according to claim 1, characterized in that: The connecting portion includes a first connecting portion and a second connecting portion, one end of the first connecting portion is fixedly connected to the fixing ring, the other end of the first connecting portion extends from the fixing ring to a preset length in a direction away from the fixing ring, and the second connecting portion extends from the other end of the first connecting portion to within the vertical projection range of the opening and is connected to the contact; wherein, An extending direction of the second connection portion forms an acute angle with a radial direction of the opening.

9. The substrate fixture according to claim 1, characterized in that: A plurality of guide members are arranged at the bottom of the fixing ring. The guide members are configured to have a guide sliding surface facing the center of the opening and are used to guide the substrate to a preset position during the process of the substrate clamp loading the substrate.

10. The substrate fixture according to claim 9, characterized in that: The surface of the guide sliding surface is provided with a limit pin, and the limit pin protrudes from the guide sliding surface to within the vertical projection range of the opening, wherein: When the substrate fixture is loaded with the substrate, the limiting pin is not higher than the contact.

11. The substrate fixture according to claim 1, characterized in that: Also includes: A pressing plate, used for pressing against the back side of the substrate to make the substrate and the contact come into compression contact; The pressing plate driving device is used to drive the pressing plate to abut against or away from the back side of the substrate.

12. The substrate fixture according to claim 11, characterized in that: The pressing plate comprises: A plurality of first pressure columns are arranged at intervals on the edge of the side of the pressure plate abutting against the substrate, and the first pressure columns correspond to the contacts one by one and are used to abut against the edge area of ​​the substrate; A plurality of second pressing columns are arranged at intervals in the middle of one side of the pressing plate abutting against the substrate, and are used for abutting against the central area of ​​the substrate.

13. The substrate fixture according to claim 12, characterized in that: A plurality of guide grooves are provided on one side of the first pressure column and / or the second pressure column that abuts against the substrate.

14. The substrate fixture according to claim 12, characterized in that: A buffer pad is arranged between the pressing plate and the fixing ring.

15. The substrate fixture according to claim 12, characterized in that: A cavity structure is constructed on one side of the pressing plate that abuts against the substrate, the first pressing column is located at the edge of the cavity structure, and the second pressing column is located in the middle of the cavity structure; wherein, The cavity structure has an outwardly inclined side wall inside, and / or the cavity structure has an arched top inside.

16. The substrate fixture according to claim 15, characterized in that: During the substrate processing, the substrate holder is configured such that a highest point of the top portion is located above a liquid level of the processing liquid.

17. A substrate processing device, characterized in that: The substrate clamp according to any one of claims 1 to 16 further comprises: Process cavity; An electrode, disposed in the process chamber; A power source is used to provide currents with opposite electrical properties to the substrate and the electrodes.

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