Substrate processing apparatus mounted with heating portion

By designing a chuck base structure that can be separated up and down and positioning the heating part, the maintenance difficulties caused by the complex wiring of the heating part during the maintenance process of the existing substrate processing device is solved, and simpler and more convenient maintenance and management are achieved.

CN119650504APending Publication Date: 2025-03-18DEVICEENG CO LTD
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Patent Information

Application Number
CN202311673177.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-15
Filing Date
2023-12-07
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

When the existing substrate processing device is undergoing maintenance and repair, especially during the replacement and reinstallation of the chuck pin, maintenance work becomes difficult and inconvenient due to the complex wiring of the heating part.

Method used

A substrate processing device with a heating portion is designed. The rotating chuck of the chuck base and the chuck support portion can be separated up and down. The heating portion is located between the glass cover sheet and the chuck support portion. It is fixed by means of a fastener to avoid separation of the heating portion and complex wiring.

Benefits of technology

It enables easy replacement and maintenance of rotary chuck and chuck pin without separation of the heating part, simplifying the management and maintenance process of the chuck base.

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Abstract

The present invention relates to a substrate processing apparatus equipped with a heat generating unit, comprising: a chuck base including a rotary chuck having a ring shape and having a chuck pin for supporting a substrate provided at the upper part thereof, and a chuck support part provided at the lower part of the inner side of the rotary chuck; a rear nozzle assembly provided through a hollow portion formed in the center of the chuck base and configured to spray a processing liquid to the lower surface of the substrate; a cover glass disposed between the upper surface of the rotary chuck and the rear nozzle assembly; and a heat generating part located between the cover glass and the chuck support part and provided on the inside of the inner peripheral surface of the rotary chuck, in which the rotary chuck and the chuck support part are coupled to each other so as to be vertically separable, so that various maintenance and repair such as replacement of a chuck pin can be performed on the rotary chuck without separating the heat generating part, and thus, the heat generating part can be used for heating the rotary chuck. And the chuck base can be managed more simply and conveniently.
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Description

Technical Field

[0001] The present invention relates to a substrate processing device equipped with a heating portion, and more particularly, to a substrate processing device equipped with a heating portion, which is provided with a simple coupling structure, so that maintenance work can be easily performed on a rotating chuck constituting a chuck base. Background Art

[0002] The substrate processing apparatus refers to an apparatus that uses a processing liquid to perform vapor deposition, development, etching or cleaning on substrates such as semiconductor wafers, display substrates, optical disk substrates, magnetic disk substrates, photomask substrates, ceramic substrates, and solar cell substrates.

[0003] The cleaning process is used to remove foreign matter or particles present on the substrate, and typically refers to a process of supplying a processing liquid to the surface or back side of the substrate while rotating the substrate at high speed while being supported by a chuck base (spinning head).

[0004] In this case, if a heating portion is installed under the substrate and the substrate is rotated in a heated state to process the substrate, the amount of processing liquid used can be reduced due to the rapid reaction. This not only minimizes environmental pollution, but also shortens the processing time. Therefore, there is an advantage of improving productivity and significantly reducing power consumption.

[0005] For this reason, various technologies related to a substrate processing apparatus for rotating a substrate in a heated state are being studied.

[0006] On the other hand, the chuck base is provided with a chuck pin for fixing the substrate. When the service life is exhausted or damaged, maintenance work requiring appropriate replacement is required. Therefore, in order to replace the above-mentioned chuck pin, it is necessary to separate the chuck pin from the mechanism part that moves the chuck pin.

[0007] However, in the existing case including the heating part, the above-mentioned heating part is arranged above the chuck base. When the chuck base is separated from the substrate processing device for maintenance and repair work, it is necessary to separate the heating part with a complex wiring structure. Therefore, there is a disadvantage that maintenance and repair work such as separation, replacement and reinstallation of the chuck pin becomes very difficult and inconvenient.

[0008] Prior art literature

[0009] Patent Literature

[0010] Patent Document 1: Korean Patent Gazette No. 10-2186337 (November 27, 2020) Summary of the invention

[0011] In order to solve the above-mentioned problems of the prior art, the purpose of the present invention is to provide a substrate processing device equipped with a heating part, that is, even if the heating part is not separated, the work such as replacement of the chuck pin can be performed, thereby making the management of the chuck base simpler and more convenient.

[0012] In order to achieve the above-mentioned purpose, the substrate processing device equipped with a heating part of the present invention includes: a chuck base, including a rotating chuck and a chuck support part, the rotating chuck is annular, and a chuck pin for supporting the substrate is arranged on the upper part, and the chuck support part is arranged at the inner lower part of the rotating chuck; a rear nozzle assembly is arranged through a hollow part, and is used to spray a processing liquid onto the lower surface of the substrate, and the hollow part is formed at the center of the chuck base; a glass cover is arranged between the upper surface of the rotating chuck and the rear nozzle assembly; and a heating part is located between the glass cover and the chuck support part, and is arranged on the inner side of the inner circumference of the rotating chuck, and the rotating chuck is combined with the chuck support part in a manner that it can be separated up and down.

[0013] A plurality of locking groove shoulders are formed on the outer peripheral surface of the chuck support portion, and a plurality of locking protrusions are formed on the inner peripheral surface of the rotating chuck. The locking protrusions are inserted and locked in the locking groove shoulders along the up and down directions. The locking protrusions and the locking groove shoulders are connected to each other by fasteners in a detachable manner.

[0014] The locking shoulder is a structure in which a groove formed from the outer peripheral surface of the upper end of the chuck support portion toward the inner side extends along the thickness direction to form a shoulder portion on the bottom surface, and the locking protrusion has a side shape complementary to the locking shoulder.

[0015] When the locking protrusion is engaged with the locking groove shoulder, the upper surface of the locking protrusion and the upper surface of the chuck support portion are located on the same plane, and the fastener does not protrude from the upper surface of the locking protrusion.

[0016] The outer peripheral surface of the heat generating portion has the same shape as the inner peripheral surface of the spin chuck, and a first groove through which the locking protrusion passes is formed on the outer peripheral surface of the heat generating portion.

[0017] A heat sink is disposed in contact with the bottom surface of the heat generating portion. The outer peripheral surface of the heat sink has the same shape as that of the outer peripheral surface of the heat generating portion. A second groove is formed on the outer peripheral surface of the heat sink for the locking protrusion to pass through.

[0018] The fastener is a fixing bolt which passes through the locking protrusion in the up-down direction and is fastened to the bottom surface of the locking groove shoulder.

[0019] The present invention of the above structure has the following effects, namely, since the present invention includes: a chuck base, including a rotating chuck and a chuck supporting portion, the rotating chuck is annular, and a chuck pin for supporting the substrate is arranged on the upper portion, and the chuck supporting portion is arranged on the inner lower portion of the rotating chuck; a rear nozzle assembly is arranged through a hollow portion, and is used to spray a processing liquid onto the lower surface of the substrate, and the hollow portion is formed in the center of the chuck base; a glass cover is arranged between the upper surface of the rotating chuck and the rear nozzle assembly; and a heating portion is located between the glass cover and the chuck supporting portion, and is arranged on the inner side of the inner circumferential surface of the rotating chuck, and the rotating chuck is combined with the chuck supporting portion in a manner that it can be separated up and down. Therefore, even if the heating portion is not separated, various maintenance and repairs such as replacing the chuck pin can be performed on the rotating chuck, thereby making the management of the chuck base simpler and more convenient.

[0020] Furthermore, in the present invention, in order to combine the above-mentioned rotating chuck and the chuck supporting portion in a manner that they can be separated up and down, a plurality of locking groove shoulders are formed on the outer peripheral surface of the above-mentioned chuck supporting portion as placement portions, and a plurality of locking protrusions are formed on the inner peripheral surface of the above-mentioned rotating chuck. The above-mentioned locking protrusions are inserted and locked in the above-mentioned locking groove shoulders along the up and down directions. The above-mentioned locking protrusions and the locking groove shoulders are separably combined by fasteners, thereby preventing the above-mentioned rotating chuck from shaking significantly in the rotational direction or the up and down direction relative to the chuck supporting portion.

[0021] Furthermore, in the present invention, since the above-mentioned locking groove shoulder is a structure in which the groove formed from the upper end outer peripheral surface of the chuck support portion toward the inner side extends along the thickness direction to form a shoulder portion on the bottom surface, the above-mentioned locking protrusion has a side shape complementary to the above-mentioned locking groove shoulder. Therefore, when one end is combined, if the locking protrusion is placed on the above-mentioned shoulder portion, an integrated rotation can be achieved, thereby preventing the above-mentioned rotating chuck from shaking relative to the chuck support portion along the rotation direction of the chuck base.

[0022] Furthermore, in the present invention, when the locking protrusion is combined with the locking groove shoulder, since the upper surface of the locking protrusion and the upper surface of the chuck support portion are located on the same plane, the fastener does not protrude from the upper surface of the locking protrusion. Therefore, when the heat sink is combined with the bottom surface of the heat generating portion and faces the upper surface of the chuck support portion, a non-interference and more compact structure can be formed.

[0023] Furthermore, in the present invention, since the outer circumferential surface of the heating portion is the same shape as the inner circumferential surface of the rotating chuck, a first groove is formed on the outer circumferential surface of the heating portion for the locking protrusion to pass through. Therefore, when the rotating chuck is lowered toward the chuck support portion for engagement, the locking protrusion formed on the rotating chuck is not affected by the heating portion, thereby simplifying the engagement.

[0024] Furthermore, in the present invention, since a heat sink is arranged in contact with the bottom surface of the heat generating portion, the outer peripheral surface of the heat sink has the same shape as that of the outer peripheral surface of the heat generating portion, and a second groove is formed on the outer peripheral surface of the heat sink for the locking protrusion to pass through. Therefore, when the rotating chuck is lowered toward the chuck support portion to be coupled, the heat sink can be prevented from interfering with the locking protrusion formed on the rotating chuck. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a front cross-sectional view showing a substrate processing apparatus of the present invention.

[0026] Figure 2 It is a perspective view of the main parts of the substrate processing apparatus of the present invention.

[0027] Figure 3 for Figure 2 Top view of the .

[0028] Figure 4 To show Figure 2 An exploded perspective view of the main parts.

[0029] Figure 5 To show Figure 2 The main cross-sectional view of the main part.

[0030] Figure 6 To show Figure 4 An exploded perspective view of the structure of the heat generating unit and the heat sink. DETAILED DESCRIPTION

[0031] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0032] Reference Figures 1 to 5 The substrate processing device 1000 according to an embodiment of the present invention comprises: a chuck base 200, comprising a rotating chuck 210 and a chuck support part 220, wherein the rotating chuck 210 is annular and has a chuck pin 250 for supporting the substrate W at the upper part, wherein the chuck support part 220 is arranged at the inner lower part of the rotating chuck 210, connected to the driving shaft 800 of the motor M and rotated at a specified speed; a rear nozzle assembly 400, arranged through a hollow part 240, for spraying a processing liquid onto the lower surface of the substrate W, wherein the hollow part 240 is formed at the center of the chuck base 200; a glass cover 500, arranged between the upper surface of the rotating chuck 210 and the rear nozzle assembly 400; and a heating part 600, located between the glass cover 500 and the chuck support part 220, and arranged inside the inner peripheral surface of the rotating chuck 210, wherein the rotating chuck 210 and the chuck support part 220 are combined in a manner that they can be separated up and down.

[0033] Based on the above structure, even without separating the heating portion 600 , various maintenance and repairs such as replacing the chuck pin 250 can be performed on the rotating chuck 210 , thereby making the management of the chuck base 200 simpler and more convenient.

[0034] like Figure 3 As shown, when viewed from a top view, the spin chuck 210 is in a circular ring shape, and when a circular substrate W is placed and rotated, weight imbalance is prevented from occurring in the circumferential direction.

[0035] like Figures 4 to 6 As shown, the heating part 600 may be composed of a heater 610 such as a light emitting diode (LED) or an infrared (IR) lamp and a printed circuit board 620 provided with a plurality of the heaters 610. Various parameters such as turning on and off the light or light intensity may be adjusted through a control function on the printed circuit board 620.

[0036] Furthermore, the heating portion 600 may be fixedly coupled to the rear nozzle assembly 400 or relatively rotatably coupled to the rear nozzle assembly 400 or liftably coupled to the rear nozzle assembly 400 .

[0037] In this case, the printed circuit board 620 constituting the heat generating unit 600 has a circular outer shape facing the inner side of the spin chuck 210 , and thus the substrate W can be uniformly heated.

[0038] That is, the outer circumferential surface of the heat generating portion 600 and the inner circumferential surface of the spin chuck 210 have the same shape.

[0039] However, there is no particular limitation on the shape of the printed circuit board 620 , as long as the plurality of heaters 610 can be arranged in a predetermined structure and disposed inside the inner circumference of the spin chuck 210 .

[0040] Preferably, a heat sink 700 is disposed in contact with the bottom surface of the heating portion 600 to effectively release the heat generated by the heating portion 600 .

[0041] The cover glass 500 not only prevents the processing liquid sprayed from the rear nozzle assembly 400 from flowing into the heating portion 600 , but also needs to perform the function of allowing the heat of the heating portion 600 to pass smoothly.

[0042] Preferably, the glass cover 500 has a circular outer shape to prevent weight imbalance in the surrounding direction, and a setting groove 510 may be formed at a portion where the chuck pin 250 is configured.

[0043] A plurality of locking groove shoulders 221 serving as placement portions are formed on the outer peripheral surface of the chuck support portion 220 so that the rotating chuck 210 and the chuck support portion 220 are connected in a manner that they can be separated up and down. A plurality of locking protrusions 211 are protrudingly formed on the inner peripheral surface of the rotating chuck 210. The locking protrusions 211 are inserted and locked in the locking groove shoulders 211 along the up and down directions. The locking protrusions 211 and the locking groove shoulders 221 can be separably connected via fasteners F.

[0044] Thus, the spin chuck 210 can be prevented from shaking in the rotation direction or in the up-and-down direction relative to the chuck support portion 220 .

[0045] The above-mentioned locking groove shoulder 221 is a structure in which a groove is formed by being recessed inward from the upper end outer peripheral surface of the chuck support part 220 and extending along the thickness direction to form a shoulder part 221a on the bottom surface. The above-mentioned locking protrusion 211 has a side shape complementary to the above-mentioned locking groove shoulder 221. Therefore, when one end is combined, if the locking protrusion 211 is placed on the above-mentioned shoulder part 221a, an integrated rotation can be achieved, thereby preventing the above-mentioned rotating chuck 210 from shaking relative to the chuck support part 220 along the rotation direction of the chuck base 200.

[0046] In this case, when observed from a top view, although the widths of the above-mentioned locking protrusion 211 and the above-mentioned locking groove shoulder 221 gradually narrow toward the center of the rotating chuck 210, there is no particular restriction on the shapes of the above-mentioned locking protrusion 211 and the above-mentioned locking groove shoulder 221, and preferably, they have an area sufficient to combine with the above-mentioned fastener F.

[0047] The above-mentioned locking protrusion 211 and the locking groove shoulder 221 are fixedly combined and become more secure through the above-mentioned fastener F. The above-mentioned fastener F can be a fixing bolt that penetrates the above-mentioned locking protrusion 211 along the up and down direction and is fastened to the shoulder portion 221a which is the bottom surface of the above-mentioned locking groove shoulder 221.

[0048] When the locking protrusion 211 is combined with the locking groove shoulder 221, that is, when the locking protrusion 211 is placed on the locking groove shoulder 211, the upper surface of the locking protrusion 211 and the upper surface of the chuck support part 220 are located on the same plane. Preferably, when the heat sink 700 is combined with the bottom surface of the heating part 600 and faces the upper surface of the chuck support part 220, a non-interference and more compact structure can be formed.

[0049] Furthermore, the head of the fastener F does not protrude from the upper surface of the locking protrusion 211 , and preferably, the hole for the fastener F is in the shape of a countersunk hole.

[0050] On the other hand, preferably, a first groove 630 is formed on the outer peripheral surface of the above-mentioned heating part 600 to allow the above-mentioned locking protrusion 211 to pass through, when the rotating chuck 210 is lowered toward the above-mentioned chuck support part 220 for engagement, the heating part 600 is prevented from interfering with the locking protrusion 211 formed on the rotating chuck 210.

[0051] Furthermore, preferably, the outer peripheral surface of the heat sink 700 has the same shape as the outer peripheral surface of the heating portion 600, and a second groove 710 is formed on the outer peripheral surface of the heat sink 700 for allowing the locking protrusion 211 to pass through, so as to prevent the heat sink 700 from interfering with the locking protrusion 211 formed on the rotating chuck 210 when the rotating chuck 210 is lowered toward the chuck support portion 220 for engagement.

[0052] Preferably, in order to release heat quickly, the heat sink 700 is made of a material with excellent thermal conductivity, such as aluminum.

[0053] Furthermore, a coolant flow path 770 for allowing coolant to flow is formed inside the radiator 700 , and the heat of the radiator 700 can be released to a relatively cool outside through the coolant flow path 770 .

[0054] The above-mentioned rear nozzle assembly 400 may include: a main body 410; a processing liquid supply passage 420, which is formed in the above-mentioned main body 410; a rear nozzle 430, which is connected to the above-mentioned processing liquid supply passage 420; and a nozzle guard 440, which is formed or combined with the above-mentioned rear nozzle 430 and is separately combined with the upper end of the above-mentioned main body 410 in a detachable manner.

[0055] like Figure 1 As shown, a fluid supply unit 300 for supplying a processing liquid may be disposed on the upper surface of the substrate W.

[0056] Below, refer to Figures 4 to 6 The assembly steps of the substrate processing apparatus 1000 equipped with a heat generating unit according to the present invention will be described in order.

[0057] (1) The heat sink 700 and the heating portion 600 are sequentially arranged above the chuck support portion 220 constituting the chuck base 200. The heating portion 600 and the heat sink 700 may be fixedly coupled, rotatably coupled, or liftably coupled to the body portion 410 of the rear nozzle assembly 400 as a non-rotating member. In this case, the first groove 630 and the second groove 710 need to be aligned with each other in the up-down direction.

[0058] (2) The rotating chuck 210 constituting the chuck base 200 is lowered and coupled to the chuck support portion 220. In this case, after passing through the first groove 630 and the second groove 710, the locking protrusion 211 formed on the rotating chuck 210 is placed on the locking groove shoulder 221 formed on the chuck support portion 220.

[0059] (3) The glass cover 500 is fixed to the upper end of the spin chuck 210 by using a fastening means such as a bolt (B).

[0060] (4) The nozzle guard 440 constituting the rear nozzle assembly 400 is coupled to the main body 410 by means of screws S or the like, so that the outer peripheral surface of the nozzle guard 440 covers the periphery of the through hole 570 formed in the center of the cover glass 500 .

[0061] The disassembly process of the spin chuck 210 for maintenance such as replacement and refurbishment is opposite to the above-mentioned assembly process.

[0062] It should be understood that the embodiments of the present invention are merely examples, and a person skilled in the art can implement various modifications and other equivalent embodiments within the scope of protection claimed by the invention.

Claims

1. A substrate processing device equipped with a heating unit, characterized in that: include: A chuck base, comprising a rotating chuck and a chuck support portion, wherein the rotating chuck is annular and has a chuck pin for supporting the substrate disposed on the upper portion, and the chuck support portion is disposed on the inner lower portion of the rotating chuck; a rear nozzle assembly, arranged through a hollow portion, for spraying a processing liquid toward a lower surface of the substrate, the hollow portion being formed at a center of the chuck base; A glass cover sheet disposed between the upper surface of the rotating chuck and the rear nozzle assembly; and The heating part is located between the glass cover and the chuck support part and is arranged inside the inner peripheral surface of the rotating chuck. The rotating chuck is combined with the chuck support portion in a manner that the chuck can be separated up and down.

2. The substrate processing device equipped with a heat generating unit according to claim 1, wherein: A plurality of locking groove shoulders are formed on the outer peripheral surface of the chuck support portion, and a plurality of locking protrusions are formed on the inner peripheral surface of the rotating chuck. The locking protrusions are inserted and locked in the locking groove shoulders along the up and down directions. The locking protrusions and the locking groove shoulders are connected to each other by fasteners in a detachable manner.

3. The substrate processing device equipped with a heat generating unit according to claim 2, wherein: The locking shoulder is a structure in which a groove formed from the outer peripheral surface of the upper end of the chuck support portion toward the inner side extends along the thickness direction to form a shoulder portion on the bottom surface, and the locking protrusion has a side shape complementary to the locking shoulder.

4. The substrate processing device equipped with a heat generating unit according to claim 2, wherein: When the locking protrusion is engaged with the locking groove shoulder, the upper surface of the locking protrusion and the upper surface of the chuck support portion are located on the same plane, and the fastener does not protrude from the upper surface of the locking protrusion.

5. The substrate processing device equipped with a heat generating unit according to claim 2, wherein: The outer peripheral surface of the heat generating portion has the same shape as the inner peripheral surface of the spin chuck, and a first groove through which the locking protrusion passes is formed on the outer peripheral surface of the heat generating portion.

6. The substrate processing device equipped with a heat generating unit according to any one of claims 2 to 5, characterized in that: A heat sink is disposed in contact with the bottom surface of the heat generating portion. The outer peripheral surface of the heat sink has the same shape as that of the outer peripheral surface of the heat generating portion. A second groove is formed on the outer peripheral surface of the heat sink for the locking protrusion to pass through.

7. The substrate processing device equipped with a heat generating unit according to any one of claims 2 to 5, characterized in that: The fastener is a fixing bolt which passes through the locking protrusion in the up-down direction and is fastened to the bottom surface of the locking groove shoulder.