Lead bonding chip clamping tool

Abstract

The invention relates to the technical field of chip tools, in particular to a lead bonding chip clamping tool which comprises a chip clamp table top, a movable fastening piece, a clamping assembly, a fixed fastening piece, a feeding component and a discharging component, through arrangement of a button, a clamp can be opened as long as the button is pressed by fingers, and a chip tube shell can be clamped by the clamp when the button is loosened; the production efficiency is improved, and compared with a traditional heating table, the clamping efficiency can be doubled; two layers of heat insulation are adopted at the beginning of the tool design, and the heat insulation effect is good; the fixing piece is additionally arranged at the tail part of the tool, so that the tool can be better fixed on a heating stage or other support plates with screw holes; the tool is high in expansibility, can be used in a chip gold wire bonding process and can also be used in other processes; through the arrangement of the feeding component and the discharging component, a user can complete feeding and discharging work at the same time only through one-time button pressing and releasing action, and convenience and rapidness are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of chip tooling, in particular to a wire bonding chip clamping tooling. Background Art

[0002] Chip packaging is divided into manual and fully automatic packaging. Manual chip packaging, as the name implies, requires manual operation for chip bonding and wire bonding. Fully automatic chip packaging requires the use of fully automatic chip mounters and fully automatic wire bonding machines, which have high equipment costs, require programming and debugging for each chip, and also require manual loading and unloading. For microwave / RF products, many packaged products have very small orders of dozens or hundreds each time, and there are no particularly high requirements for the product chip bonding position and the arc length and arc height of the wire bonding. Manual assembly is more flexible and has high switching efficiency.

[0003] However, manual chip packaging, such as the wire bonding process, uses the heating table that comes with the manual bonding machine to fix the chip shell, which has big problems: 1. The hot table that comes with the bonding machine itself has a poor fixing effect on small shells. The chip shakes during the wire bonding process and part of the chip is suspended in the air, causing uneven heating of the chip shell and the chip shell to be skewed. The consistency of the solder joints during bonding deteriorates and the bonding reliability is also reduced to a certain extent.

[0004] In this case, there is an urgent need for a reliable and convenient chip shell clamping tool to clamp and fix the chip, and at the same time have heat conduction and convenient loading and unloading. At the same time, the tooling also needs to have a certain heat insulation function to avoid high temperature burns to the human body caused by the heat conduction part of the tooling during manual loading and unloading. Summary of the invention

[0005] The purpose of the present invention is to provide a wire bonding chip clamping tool to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: Wire bonding chip clamping tooling, including: A chip clamp table, wherein a clamping groove and a moving groove connected to the clamping groove are formed on the chip clamp table; A movable fastening sheet, the movable fastening sheet passes through the movable slot and is connected to a clamping assembly disposed in the clamping slot; A fixed fastening plate, wherein the fixed fastening plate is arranged on the chip clamp table, and chip fastening plates are arranged on the movable fastening plate and the fixed fastening plate. When the clamping assembly is pushed, the movable fastening plate moves away from the fixed fastening plate along the movable groove, and the clamping assembly is released, so that the clamping assembly drives the movable fastening plate along the movable groove to approach the fixed fastening plate, so that the two chip fastening plates clamp the material placed on the chip clamp table.

[0007] Preferably, a heat insulation frame 1 is arranged on the chip clamp table, the heat insulation frame 1 wraps the side wall of the chip clamp table, and a heat insulation frame 2 is arranged on the heat insulation frame 1.

[0008] Preferably, the first heat insulation frame is provided with a fixing plate, and the second heat insulation frame is provided with a fixing hole aligned with the fixing plate.

[0009] Preferably, a pressing groove is provided on the second insulation frame, and the clamping assembly includes a button arranged at the pressing groove and inserted into the clamping groove after passing through the first insulation frame and the chip clamp table in sequence, a push rod arranged on the button and located in the clamping groove, a guide rod arranged on the push rod, a spring fastening plate arranged on the guide rod, a clamping spring sleeved on the guide rod, and a thermal insulation head arranged on the button.

[0010] Preferably, a connecting block is provided on the movable fastening plate, and the connecting block is sleeved on the guide rod.

[0011] Preferably, a tightening screw is provided on the chip clamp table, and the tightening screw is in contact with the spring fastening plate. Turning the tightening screw drives the spring fastening plate to move, thereby squeezing or loosening the clamping spring.

[0012] Preferably, the thermal insulation head is pressed to cause the guide rod to move, so that the movable fastening plate moves away from the fixed fastening plate along the movable groove, and the thermal insulation head is loosened to release the compressed spring, pushing the two chip fastening plates to clamp the material placed on the chip clamp table.

[0013] Preferably, a feeding component is provided on the second heat insulation frame, and a unloading component is provided on the chip fixture table.

[0014] Preferably, the feeding component includes a support leg arranged on the second insulation frame, a hopper arranged on the support leg, a guide pipe arranged at the bottom of the hopper, a feeding door arranged at the opening of the guide pipe, a switch plate inserted on the guide pipe, a feeding port opened on the switch plate, a push plate arranged on the switch plate, a return spring 1 arranged between the hopper and the switch plate, a push rod and a door opening rod arranged on the chip fastening plate, and the unloading component includes a unloading trough opened on the chip fixture table, a guide arranged on the chip fixture table and connected to the unloading trough A trough, a material unloading plate arranged on the material unloading trough, a material unloading outer rod arranged on the wall of the material unloading trough, a material unloading pull rod inserted on the material unloading outer rod and connected to the material unloading plate, a supporting spring arranged in the material unloading outer rod, a pull rope with one end connected to the push rod and the other end passing through the chip clamp table and the material unloading outer rod and connected to the material unloading pull rod, a material guide plate arranged on the wall of the material guide trough, a lower rotating rod arranged on the material guide plate and inserted in the chip clamp table, two reset springs sleeved on the lower rotating rod, and a slide plate arranged on the push rod and in contact with the lower rotating rod.

[0015] Preferably, when the insulation head is pressed, the push rod pushes the feed port into the feed pipe, so that the material in the hopper enters the feed pipe, and at the same time the push rod pulls the pull rope, so that the pull rope drives the unloading pull rod to move downward, driving the unloading plate to turn into the unloading trough, and the slide plate moves under the drive of the push rod, so that the lower rotating rod moves downward along the inclined surface on the slide plate, and the guide plate rotates, so that the material on the guide plate and the unloading plate falls into the unloading trough, and when the insulation head is released, the slide plate returns to its original position under the drive of the push rod, and the lower rotating rod moves up along the inclined surface of the slide plate, so that the guide plate returns to its original position, and the door opening rod pushes the feed door to open, so that the material in the feed pipe falls on the guide plate, and the pull rope is released at the same time, and the support spring pushes the unloading plate back to its original position.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention sets a button so that the clamp can be opened by pressing the button with a finger, and the clamp will tighten the chip shell when the button is released; the production efficiency is improved, and the clamping efficiency can be increased by 1 times compared with the traditional hot stage; two layers of heat insulation are adopted at the beginning of the tooling design, and the heat insulation effect is very good; a fixing plate is added to the tail of the tooling, so that the tooling can be better fixed to the hot stage or other carriers with screw holes.

[0017] The tooling has strong expandability, and can be used not only for the chip gold wire bonding process, but also for other processes. Through the arrangement of the feeding component and the unloading component, the user only needs to press and release the button once to complete the feeding and unloading tasks at the same time, which is convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention; Figure 2 It is a bottom view structural schematic diagram of the first embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of Embodiment 2 of the present invention; Figure 4 It is a right view structural schematic diagram of the second embodiment of the present invention; Figure 5 It is a bottom view structural schematic diagram of the second embodiment of the present invention; Figure 6 This is a positional relationship diagram of a blanking plate and a chip fixture table in the second embodiment of the present invention; Figure 7 This is a schematic structural diagram of a feeding mechanism according to a second embodiment of the present invention; Figure 8 It is a structural schematic diagram of a chip fixture table according to the second embodiment of the present invention; Fig. 9 It is a structural schematic diagram of a blanking component according to the second embodiment of the present invention; Fig.10 It is a bottom view structural schematic diagram of a blanking component according to the second embodiment of the present invention; Fig.11 It is a schematic cross-sectional structure diagram of the blanking outer sleeve rod according to the second embodiment of the present invention.

[0019] In the figure: 1. chip fixture table; 2. clamping groove; 3. moving groove; 4. moving fastening plate; 5. fixed fastening plate; 6. chip fastening plate; 7. insulation frame 1; 8. insulation frame 2; 9. fixed plate; 10. fixing hole; 11. pressing groove; 12. button; 13. push rod; 14. guide rod; 15. spring fastening plate; 16. slide plate; 17. clamping spring; 18. insulation head; 19. connecting block; 20. loosening screw ; 21. Support leg; 22. Material hopper; 23. Material guide pipe; 24. Material feeding door; 25. Switch plate; 26. Material feeding port; 27. Push plate; 28. Reset spring 1; 29. ​​Push rod; 30. Door opening rod; 31. Material discharge chute; 32. Material guide chute; 33. Material discharge plate; 34. Material discharge outer sleeve rod; 35. Material discharge pull rod; 36. Support spring; 37. Pull rope; 38. Material guide plate; 39. Lower rotating rod; 40. Reset spring 2. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figures 1 to 11 , the present invention provides a technical solution: Embodiment 1: A wire bonding chip clamping tool, comprising: The chip clamp table 1 has a clamping groove 2 and a moving groove 3 connected to the clamping groove 2. The clamping groove 2 is located on the bottom surface of the chip clamp table 1, and the moving groove 3 connects the clamping groove 2 with the top surface of the chip.

[0022] An insulation frame 7 is provided on the chip clamp table 1, and the insulation frame 7 wraps the side wall of the chip clamp table 1. The insulation frame 17 is fixedly connected to the chip clamp table 1 by setting screws or the like. An insulation frame 2 8 is provided on the insulation frame 1 7, and the insulation frame 2 8 wraps the insulation frame 1 7. The insulation frame 2 8 is fixedly connected to the insulation frame 1 7 by setting screws or the like. A pressing groove 11 is opened on the insulation frame 2 8.

[0023] A movable fastening plate 4 passes through the movable groove 3 and is connected to a clamping assembly arranged in the clamping groove 2. The clamping assembly includes a button 12, a push rod 13, a spring fastening plate 15, a guide rod 14, a clamping spring 17 and a heat insulation head 18. The button 12 is arranged at the pressing groove 11 and passes through the heat insulation frame 7 and the chip clamp table 1 in sequence and then is inserted into the clamping groove 2. The button 12 is movably connected to the heat insulation frame 7 and the chip clamp table 1 respectively. The push rod 13 is arranged on the button 12 and is located in the clamping groove 2. The push rod 13 is fixedly connected to the button 12 by setting screws, etc. The guide rod 14 is arranged on the push rod 13. The guide rod 14 is fixedly connected to the push rod 13 by setting screws, etc. The spring fastening plate 15 is arranged on the guide rod 14. The spring fastening plate 15 is arranged on the guide rod 14, the spring fastening sheet 15 is movably connected to the guide rod 14, a connecting block 19 is provided on the movable fastening sheet 4, the connecting block 19 is fixedly connected to the movable fastening sheet 4 by means of integral molding or the like, the connecting block 19 passes through the movable groove 3 and is sleeved on the guide rod 14, the connecting block 19 is in contact with the push rod 13, the clamping spring 17 is sleeved on the guide rod 14, one end of the clamping spring 17 is connected to the spring fastening sheet 15, and the other end of the clamping spring 17 is connected to the connecting block 19, the heat insulation head 18 is provided on the button 12, the heat insulation head 18 is fixedly connected to the button 12 by means of screws or the like, a loosening screw 20 is provided on the chip clamp table 1, the loosening screw 20 is in contact with the spring fastening sheet 15, and turning the loosening screw 20 drives the spring fastening sheet 15 to move, thereby squeezing or loosening the clamping spring 17.

[0024] A fixed fastening plate 5 is arranged on the chip fixture table 1, and the fixed fastening plate 5 is fixedly connected to the chip fixture table 1 by setting screws or the like. A chip fastening plate 6 is arranged on the movable fastening plate 4 and the fixed fastening plate 5, and one chip fastening plate 6 is fixedly connected to the movable fastening plate 4 by setting screws, and the other chip fastening plate 6 is fixedly connected to the fixed fastening plate 5 by setting screws. The heat insulation head 18 is pressed to drive the guide rod 14 to move the guide rod 14, so that the movable fastening plate 4 moves away from the fixed fastening plate 5 along the movable groove 3, and the heat insulation head 18 is loosened to release the compressed spring, pushing the two chip fastening plates 6 to clamp the material placed on the chip fixture table 1.

[0025] The insulation frame 1 7 is provided with a fixing plate 9, and the insulation frame 2 8 is provided with a fixing hole 10 aligned with the fixing plate 9. Screws are set on the fixing plate 9 through the fixing hole 10 to fix the tooling on a working platform such as a hot table.

[0026] Embodiment 2: The difference between Embodiment 2 and Embodiment 1 is that a feeding component is provided on the second heat insulation frame 8, and a unloading component is provided on the chip fixture table 1.

[0027] The feeding component includes a support leg 21, a hopper 22, a guide pipe 23, a feeding door 24, a switch plate 25, a feeding port 26, a push plate 27, a return spring 28 and a door opening rod 30. The unloading component includes a unloading trough 31, a guide trough 32, a unloading plate 33, an unloading outer rod 34, a unloading pull rod 35, a support spring 36, a pull rope 37, a guide plate 38, a lower rotating rod 39, a return spring 40 and a slide plate 16. The support leg 21 is arranged on the insulation frame 8, and the support leg 21 is fixedly connected to the insulation frame 8 by setting screws or the like. The hopper 22 is arranged on the support leg 21, and the hopper 22 is fixedly connected to the support leg 21 by setting screws or the like. The guide pipe 23 is arranged at the bottom of the hopper 22, and the guide pipe 23 is fixedly connected to the hopper 22 by gluing or the like. The feeding door 24 is arranged at the opening of the guide pipe 23, and the feeding door 24 is connected to the hopper 22 by setting a rotating shaft or a hinge or the like. The material guide tube 23 is rotatably connected, and one side of the feed door 24 protrudes from the material guide tube 23. At the joint of the material guide tube 23 and the feed door 24, magnets that attract each other can be set so that the feed door 24 can fit the material guide tube 23. The switch plate 25 is inserted on the material guide tube 23, and the switch plate 25 is movably connected to the material guide tube 23. The feed port 26 is opened on the switch plate 25, and the push plate 27 is set on the switch plate 25. The push plate 27 is fixedly connected to the switch plate 25 by means of one-piece molding, etc., a return spring 28 is set between the hopper 22 and the switch plate 25, one end of the return spring 28 is fixedly connected to the outer wall of the hopper 22, and the other end of the return spring 28 is fixedly connected to the switch plate 25, a push rod 29 and a door opening rod 30 are set on the chip fastening plate 6 located on the movable fastening plate 4, and the push rod 29 and the door opening rod 30 are fixedly connected to the chip fastening plate 6 by means of setting screws, etc.

[0028] The material discharge trough 31 is provided on the chip fixture table 1, and the material discharge trough 31 penetrates the chip fixture table 1. The material guide trough 32 is provided on the chip fixture table 1 and communicates with the material discharge trough 31. The material discharge plate 33 is provided at the opening of the material discharge trough 31, and the material discharge plate 33 is rotatably connected with the side wall of the material discharge trough 31 by means of setting a rotating shaft, etc., and the material discharge outer sleeve rod 34 is provided on the wall of the material discharge trough 31, and the material discharge outer sleeve rod 34 is connected with the side wall of the material discharge trough 31 by means of setting a rotating shaft, etc. The unloading rod 35 is rotatably connected, and the unloading rod 35 is inserted on the unloading outer rod 34 and connected to the unloading plate 33. The unloading rod 35 is rotatably connected to the bottom wall of the unloading plate 33 by setting a rotating shaft, etc. The unloading rod 35 is movably connected to the unloading outer rod 34. The support spring 36 is set in the unloading outer rod 34. One end of the pull rope 37 is connected to the push rod 13 and the other end passes through the chip fixture table 1 and the unloading outer rod 34 and is connected to the unloading rod 35. One end is fixedly connected to the push rod 13 by providing a metal ring or the like, the other end of the pull rope 37 is fixedly connected to the unloading pull rod 35 by providing a metal ring or the like, the guide plate 38 is arranged on the side wall of the guide groove 32, the guide plate 38 is rotatably connected to the side wall of the guide groove 32 by providing a rotating shaft or the like, the lower rotating rod 39 is arranged on the guide plate 38 and inserted in the chip fixture table 1, the lower rotating rod 39 is rotatably connected to the guide plate 38 by providing a rotating shaft or the like, the lower rotating rod 39 is movably connected to the chip fixture table 1, the reset spring 2 40 is sleeved on the lower rotating rod 39, one end of the reset spring 2 40 is fixedly connected to the protrusion on the lower rotating rod 39, the other end of the reset spring 2 40 is fixedly connected to the chip fixture table 1, the slide plate 16 is arranged on the push rod 13 and contacts the lower rotating rod 39, the slide plate 16 is fixedly connected to the push rod 13 by providing screws or the like, and the bottom surface of the lower rotating rod 39 is placed on the slide plate 16.

[0029] Working principle: When in use, screws are set on the fixing plate 9 through the fixing hole 10 to fix the tooling on a working platform such as a hot table, and the heat insulation head 18 is pressed to drive the guide rod 14 to move the guide rod 14, so that the movable fastening plate 4 moves away from the fixed fastening plate 5 along the movable groove 3, and the heat insulation head 18 is loosened to release the compressed spring, and the two chip fastening plates 6 are pushed to clamp the material placed on the chip fixture table 1. When the heat insulation head 18 is pressed, the push rod 29 pushes the feed port 26 into the feed pipe, so that the material in the hopper 22 enters the feed pipe, and at the same time, the push rod 13 pulls the pull rope 37, so that the pull rope 37 drives the unloading pull rod 35 to move downward , driving the unloading plate 33 to rotate into the unloading chute 31, and the slide plate 16 moves under the drive of the push rod 13, so that the lower rotating rod 39 moves down along the inclined surface of the slide plate 16, and the guide plate 38 rotates, so that the materials on the guide plate 38 and the unloading plate 33 fall into the unloading chute 31. When the insulation head 18 is released, the slide plate 16 returns to its original position under the drive of the push rod 13, and the lower rotating rod 39 moves up along the inclined surface of the slide plate 16, so that the guide plate 38 returns to its original position, and the door opening rod 30 pushes the feeding door 24 to open, so that the material in the feeding pipe falls on the guide plate 38, and the pull rope 37 is released at the same time, and the support spring 36 pushes the unloading plate 33 back to its original position.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wire bonding chip clamping tool, characterized in that: include: A chip clamp table, wherein a clamping groove and a moving groove connected to the clamping groove are formed on the chip clamp table; A movable fastening sheet, the movable fastening sheet passes through the movable slot and is connected to a clamping assembly disposed in the clamping slot; A fixed fastening plate, wherein the fixed fastening plate is arranged on the chip clamp table, and chip fastening plates are arranged on the movable fastening plate and the fixed fastening plate. When the clamping assembly is pushed, the movable fastening plate moves away from the fixed fastening plate along the movable groove, and the clamping assembly is released, so that the clamping assembly drives the movable fastening plate along the movable groove to approach the fixed fastening plate, so that the two chip fastening plates clamp the material placed on the chip clamp table.

2. The wire bonding chip clamping tool according to claim 1, characterized in that: A heat insulation frame 1 is arranged on the chip fixture table, and the heat insulation frame 1 wraps the side wall of the chip fixture table, and a heat insulation frame 2 is arranged on the heat insulation frame 1.

3. The wire bonding chip clamping tool according to claim 2, characterized in that: The first heat insulation frame is provided with a fixing sheet, and the second heat insulation frame is provided with a fixing hole aligned with the fixing sheet.

4. The wire bonding chip clamping tool according to claim 3, characterized in that: A pressing groove is provided on the second insulation frame, and the clamping assembly includes a button arranged at the pressing groove and inserted into the clamping groove after passing through the first insulation frame and the chip clamp table in sequence, a push rod arranged on the button and located in the clamping groove, a guide rod arranged on the push rod, a spring fastening plate arranged on the guide rod, a clamping spring sleeved on the guide rod, and a thermal insulation head arranged on the button.

5. The wire bonding chip clamping tool according to claim 4, characterized in that: The movable fastening plate is provided with a connecting block, and the connecting block is sleeved on the guide rod.

6. The wire bonding chip clamping tool according to claim 5, characterized in that: The chip clamp table is provided with a tightening screw, which is in contact with the spring fastening sheet. Turning the tightening screw drives the spring fastening sheet to move, thereby squeezing or loosening the clamping spring.

7. The wire bonding chip clamping tool according to claim 6, characterized in that: Pressing the insulation head causes the guide rod to move, so that the movable fastening plate moves away from the fixed fastening plate along the movable groove; loosening the insulation head releases the compressed spring, and pushes the two chip fastening plates to clamp the material placed on the chip fixture table.

8. The wire bonding chip clamping tool according to claim 7, characterized in that: A feeding component is arranged on the second heat insulation frame, and a unloading component is arranged on the chip fixture table.

9. The wire bonding chip clamping tool according to claim 8, characterized in that: The feeding component includes a support leg arranged on the second insulation frame, a hopper arranged on the support leg, a guide pipe arranged at the bottom of the hopper, a feeding door arranged at the opening of the guide pipe, a switch plate inserted on the guide pipe, a feeding port opened on the switch plate, a push plate arranged on the switch plate, a return spring 1 arranged between the hopper and the switch plate, a push rod and a door opening rod arranged on the chip fastening plate, and the unloading component includes a unloading trough opened on the chip fixture table, a guide trough arranged on the chip fixture table and connected to the unloading trough, A material unloading plate is arranged on the material unloading trough, a material unloading outer sleeve rod is arranged on the wall of the material unloading trough, a material unloading pull rod is inserted on the material unloading outer sleeve rod and connected to the material unloading plate, a supporting spring is arranged in the material unloading outer sleeve rod, a pull rope with one end connected to the push rod and the other end connected to the material unloading pull rod after passing through the chip clamp table and the material unloading outer sleeve rod, a material guide plate is arranged on the wall of the material guide trough, a lower rotating rod is arranged on the material guide plate and inserted in the chip clamp table, two return springs are sleeved on the lower rotating rod, and a slide plate is arranged on the push rod and in contact with the lower rotating rod.

10. The wire bonding chip clamping tool according to claim 9, characterized in that: When the insulation head is pressed, the push rod pushes the feed port into the feed pipe, so that the material in the hopper enters the feed pipe, and at the same time, the push rod pulls the pull rope, so that the pull rope drives the unloading pull rod to move downward, and drives the unloading plate to turn into the unloading chute, and the slide plate moves under the drive of the push rod, so that the lower rotating rod moves downward along the inclined surface on the slide plate, and the guide plate rotates, so that the material on the guide plate and the unloading plate falls into the unloading chute. When the insulation head is released, the slide plate returns to its original position under the drive of the push rod, and the lower rotating rod moves up along the inclined surface of the slide plate, so that the guide plate returns to its original position, and the door opening rod pushes the feed door to open, so that the material in the feed pipe falls on the guide plate, and the pull rope is released at the same time, and the support spring pushes the unloading plate back to its original position.

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