PCB routing processing method

Abstract

The invention discloses a PCB (Printed Circuit Board) routing processing method, which comprises the following steps of: selecting a cutter, namely selecting a routing cutter with a tooth space of 1-4mm and the number of teeth of the routing cutter is greater than or equal to 9; stacking the PCBs, namely pasting 3M adhesive paper on the lower end surfaces of the PCBs, and stacking the PCBs from top to bottom to form a stack of PCBs; the depth is set, the board milling depth is set, and the length of a milling cutter is adjusted to ensure that only 1 / 2 of the PCB on the bottom layer is milled; routing: routing the stacked PCBs according to a preset route until the thickness of the PCB at the bottom layer is 1 / 2 of the thickness of the PCB at the bottom layer, and not breaking the PCB at the bottom layer; after the first stack of PCBs is adjusted and milled, the bottom-layer PCBs of the first stack serve as the first-layer PCBs of the second stack, then the stacked PCBs are placed at the lower end of the first-layer PCBs, board milling operation is carried out, separation of the two adjacent PCBs can be guaranteed through 3M adhesive paper, the PCBs can be separated conveniently after board milling, and the buffer protection effect on the two adjacent PCBs can also be achieved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a PCB gong plate processing method. Background Art

[0002] In the process of producing or processing PCB, it is often necessary to perform routing operation on the PCB. The so-called routing is the milling of the PCB.

[0003] In the past, when gonging, the PCB was gonged individually, which was inefficient. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a PCB gong plate processing method, which can improve the PCB gong plate processing efficiency.

[0005] A PCB gong plate processing method according to an embodiment of the first aspect of the present invention includes:

[0006] Choose a gong knife with a tooth spacing between 1-4mm and a number of teeth greater than or equal to 9;

[0007] Stacking: stick 3M tape on the lower end surfaces of several PCBs, and then stack the PCBs from top to bottom to form a stack of PCBs;

[0008] Gauge depth, set the gong plate depth, and adjust the length of the gong cutter to ensure that only 1 / 2 of the bottom PCB is gonged in;

[0009] Gong board: Gong the stacked PCB along the predetermined route, gong to 1 / 2 of the thickness of the bottom PCB without breaking the bottom PCB;

[0010] Adjustment: After the first stack of PCBs is gonged, the bottom layer PCB of the first stack is used as the first layer PCB of the second stack, and then the stacked PCBs are placed at the lower end of the first layer PCBs, and then the gong operation is performed.

[0011] A PCB gong plate processing method according to an embodiment of the present invention has at least the following beneficial effects: the PCB gong plate processing method is subjected to a tool selection step, so that the gong knife is selected as a coarse-toothed gong knife, which can avoid generating a large amount of dust during the milling process; during the stacking process, the lower end surface of the PCB is coated with adhesive, and then the adhesive is covered with 3M tape to protect the adhesive; in addition, the use of 3M tape can also ensure that the two adjacent PCBs are separated, which is convenient for separating the PCBs after gonging, and can also play a role in buffering and protecting the two adjacent PCBs; in the depth gauging step, when gonging the PCB, the bottom layer of the PCB is prevented from being gonged off, because the lower end surface of the PCB is covered with 3M tape, so the bottom layer of the PCB cannot be gonged off. If it is gonged off, the 3M tape will be pulled out, resulting in a bad side of the product, which is not conducive to production; using this principle, the last PCB of each stack can be used as the first circuit board of the next stack of PCBs, so that the gonging is carried out in turn, the efficiency is improved, and it is convenient to carry out continuously.

[0012] According to some embodiments of the present invention, a chip cleaning step is also included, in which a hair dryer or a negative pressure suction fan is used to clean the chips after the inner grooves of a stack of PCBs are gonged. After the chips are cleaned, the stack of PCBs is subjected to the gong operation to clean the chips, thereby facilitating subsequent gong processing of the PCBs.

[0013] According to some embodiments of the present invention, in the chip cleaning step, after the inner groove is grouted, the PCB is taken out and the chips are cleaned and the inner edge of the board is repaired. After the cleaning is completed, the PCB is grouted again.

[0014] According to some embodiments of the present invention, the number of stacked boards is determined based on the thickness of the PCB and the diameter of the gong cutter. The thickness of the PCB is the same as the diameter of the gong cutter. The upper limit of the thickness of each stack of PCBs is 6.50 mm. The thickness of the PCB is related to the diameter of the gong cutter, so that the gong cutter can better perform gong board operations.

[0015] According to some embodiments of the present invention, the thickness of the PCB is 1.6 mm, each stack of PCBs is formed by stacking 4 PCBs, and the thickness of a stack of PCBs is 1.6 mm×4=6.4 mm.

[0016] According to some embodiments of the present invention, the thickness of each stack of PCBs is less than or equal to 5 mm, so that the feeding amount of the gong cutter during the gong process is not too large and does not break.

[0017] According to some embodiments of the present invention, in the board stacking step, after the 3M tape is affixed, the PCB is pressed by a press machine so that the 3M tape is tightly attached to the PCB.

[0018] According to some embodiments of the present invention, in the gong plate step, the gong cutter is fed reciprocatingly along a predetermined route.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 is a schematic diagram of PCB stacking according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 The schematic diagram of removing the first PCB on the upper layer when the PCBs are stacked is shown;

[0023] Figure 3 Schematic diagram of not breaking the bottom PCB during the gong process;

[0024] Figure 4 A schematic diagram of the gong path on the PCB surface from a top-down perspective.

[0025] PCB 100, 3M tape 200. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] In the description of the present invention, "several" means one or more, "more" means two or more, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0030] Reference Figures 1 to 4 , a PCB gong plate processing method, comprising:

[0031] Choose a gong knife with a tooth spacing between 1-4mm and a number of teeth greater than or equal to 9;

[0032] Stacking the boards: affixing 3M adhesive tape 200 to the lower end surfaces of a plurality of PCBs 100, and then stacking the PCBs 100 from top to bottom to form a stack of PCBs 100;

[0033] Gauge depth, set the gong plate depth, and adjust the length of the gong cutter to ensure that only 1 / 2 of the bottom PCB 100 is gonged in;

[0034] Gong board: Gong the stacked PCB100 along the predetermined route, gong to 1 / 2 of the thickness of the bottom PCB100, without breaking the bottom PCB100;

[0035] After adjusting, the first stack of PCB100 is gonged, the bottom layer PCB100 of the first stack is used as the first layer PCB100 of the second stack, and then the stacked PCB100 is placed at the lower end of the first layer PCB100, and then the gong operation is performed.

[0036] The PCB gong plate processing method is processed through the tool selection step, so that the gong knife is selected as a coarse-toothed gong knife, which can avoid generating a large amount of dust during the milling process. In the process of stacking the plates, the lower end surface of the PCB100 is coated with adhesive, and then the adhesive is covered with 3M tape to protect the adhesive. In addition, the use of 3M tape can also ensure that the two adjacent PCB100s are released, which is convenient for separating the PCB100 after gong plate, and can also play a role in buffering and protecting the two adjacent PCB100s. In the depth gauge step, when gonging the PCB100, the bottom layer of the PCB100 is prevented from being gonged off, because the lower end surface of the PCB100 is covered with 3M tape, so the bottom layer of the PCB100 cannot be gonged off. If it is gonged off, the 3M tape will be pulled out of the front, resulting in a bad side of the product, which is not conducive to production. Using this principle, the last PCB100 of each stack can be used as the first circuit board of the next stack of PCBs, so that the gong plates are rotated to improve efficiency and facilitate continuous processing.

[0037] It should be noted that the so-called coarse-toothed gong cutter is a gong cutter with a tooth spacing of 1-4mm and the number of teeth of the gong cutter is greater than or equal to 9. The coarse-toothed gong cutter gongs out less dust at the edge of the board. The fine-toothed gong cutter is a gong cutter with a tooth spacing of less than 1mm and a number of teeth greater than 9. The fine-toothed gong cutter gongs out more dust at the edge of the board. In order to prevent dust from squeezing into the middle of the layer of 3M tape 200 and PCB 100, a coarse-toothed gong cutter is selected and the gong board speed is the same as that of the normal gong board.

[0038] In some embodiments, a chip cleaning step is also included. After the inner grooves of a stack of PCB100 are grooved, the chips are cleaned by a hair dryer or a negative pressure suction fan. After the chips are cleaned, the stack of PCB100 is grooved again to clean the chips, which facilitates the subsequent grooving of PCB100.

[0039] In some embodiments, in the chip cleaning step, after the inner groove is grouted, the PCB 100 is taken out and the chips are cleaned and the inner edge of the board is repaired. After the cleaning is completed, the PCB 100 is grouted again. It should be noted that if the product itself does not have an inner groove, the PCB 100 can be directly grouted into small boards at one time without grooving the inner groove. If there is an inner groove, the inner groove needs to be grouted, and the board is grouted twice; because the 3M adhesive tape 200 is soft, if it is not supported by the bottom plate, the adhesive tape will be pulled off the bottom plate, and there will be a flash. There is no board that can resist the 3M adhesive tape 200 on the bottom layer of the PCB 100, so there is no need to grope the bottom layer of the PCB 100.

[0040] In some embodiments, the number of stacked boards is determined based on the thickness of PCB100 and the diameter of the gong cutter. The thickness of PCB100 is the same as the diameter of the gong cutter. The upper limit of the thickness of each stack of PCB100 is 6.50 mm. The thickness of PCB100 is related to the diameter of the gong cutter, so that the gong cutter can better perform gong board operations.

[0041] In some embodiments, the thickness of the PCB 100 is 1.6 mm, each stack of PCBs 100 is formed by stacking four PCBs 100 , and the thickness of a stack of PCBs 100 is 1.6 mm×4=6.4 mm.

[0042] In some embodiments, the thickness of each stack of PCBs 100 is less than or equal to 5 mm, so that the feeding amount of the gong cutter during the gong process is not too large and does not break.

[0043] In some embodiments, in the lamination step, after the 3M tape 200 is affixed, the PCB 100 is pressed by a press so that the 3M tape 200 is tightly attached to the PCB 100. It can be understood that the affixing and pressing of the 3M tape 200 prevents the PCB 100 from having a burr during milling.

[0044] In some embodiments, during the rouging step, the rouging cutter is fed back and forth along a predetermined route. It is understandable that the milling amount each time should not be too much, otherwise the cutter is prone to breakage. Therefore, the rouging plate is reciprocated during the rouging process until the PCB 100 is rouged to a suitable position.

[0045] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A PCB gong plate processing method, characterized in that: include: Choose a gong knife with a tooth spacing between 1-4mm and a number of teeth greater than or equal to 9; Stacking the boards, affixing 3M adhesive tape (200) to the lower end surfaces of a plurality of PCBs (100), and then stacking the PCBs (100) from top to bottom to form a stack of PCBs (100); Gauge depth, set the grooving plate depth, and adjust the length of the grooving cutter to ensure that the bottom PCB (100) is only grooved in 1 / 2; Gonging the stacked PCB (100) along a predetermined route, gong to 1 / 2 of the thickness of the bottom PCB (100), without breaking the bottom PCB (100); After the first stack of PCBs (100) is gonged, the bottom layer PCBs (100) of the first stack are used as the first layer PCBs (100) of the second stack, and then the stacked PCBs (100) are placed at the lower end of the first layer PCBs (100), and then the gong operation is performed.

2. A PCB gong plate processing method according to claim 1, characterized in that: The method further comprises a chip cleaning step, wherein after the inner groove of a stack of PCBs (100) is grouted, the chips are cleaned by a blower or a negative pressure suction fan, and after the chips are cleaned, the stack of PCBs (100) is subjected to the groping operation.

3. A PCB gong plate processing method according to claim 2, characterized in that: In the chip cleaning step, after the inner groove is grouted, the PCB (100) is taken out and the chips are cleaned and the inner edge of the board is repaired. After the cleaning is completed, the PCB (100) is grouted again.

4. A PCB gong plate processing method according to claim 1, characterized in that: The number of stacked boards is determined according to the thickness of the PCB (100) and the diameter of the gong cutter. The thickness of the PCB (100) is the same as the diameter of the gong cutter, and the upper limit of the thickness of each stack of PCBs (100) is 6.50 mm.

5. A PCB gong plate processing method according to claim 4, characterized in that: The thickness of the PCB (100) is 1.6 mm. Each stack of PCBs (100) is formed by stacking four PCBs (100). The thickness of a stack of PCBs (100) is 1.6 mm×4=6.4 mm.

6. A PCB gong plate processing method according to claim 1, characterized in that: The thickness of each stack of PCBs (100) is less than or equal to 5 mm.

7. A PCB gong plate processing method according to claim 1, characterized in that: In the lamination step, after the 3M tape (200) is affixed, the PCB (100) is pressed by a press machine, so that the 3M tape (200) is tightly attached to the PCB (100).

8. A PCB gong plate processing method according to claim 1, characterized in that: In the gong plate step, the gong cutter is fed back and forth along a predetermined route.

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