Picosecond machining method for binding disc at bottom of blind groove

Abstract

The invention discloses a picosecond processing method for a binding disc at the bottom of a blind slot, which comprises the following steps of: removing a tin layer: putting a circuit board to be subjected to tin removal into tin removal liquid to ensure that the tin layer is completely immersed; according to the characteristics of the tin stripping liquid and the specific condition of the circuit board, proper tin stripping time and temperature are set, the surface of the circuit board is lightly brushed with a brush, and a tin layer is helped to be removed; the dry film is cut into a proper size, it is ensured that the dry film can completely cover the circuit board, through the design that a binding disc is arranged at the bottom of a depth groove, conduction connection of an inner layer product and an outer layer product is facilitated, a component can be embedded into the depth groove, the product space is saved, the product size is reduced, and the depth groove is formed in a hard board through an inner layer adhesive tape and an outer layer uncovering cover; a pattern cannot be manufactured on a tray at the bottom of the tank by using a conventional etching mode, and the problem is solved by applying a tin plating mode and forming the pattern by laser ablation; and the inner layer pattern is protected by using the second tinning-alkaline etching, and pattern formation of other areas is completed.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB processing, and particularly relates to a picosecond processing method for a blind groove bottom binding disk. Background Art

[0002] A blind slot of a printed circuit board refers to a cavity area that does not penetrate the circuit board, which can effectively utilize the space inside the printed circuit board. On the one hand, the blind slot can realize the input and output ports of electrical signals in each layer of the printed circuit board; on the other hand, it also serves as a cavity and carrier for pasting and mounting components such as chips, capacitors, and resistors. With the advancement of components and assembly technology, blind slot printed circuit boards are also developing towards diversification and complex structures. However, the existing deep slot bottom plate cannot be patterned using conventional etching methods. The bottom space of the deep slot is limited, and conventional etching methods often cannot achieve the required processing accuracy. When patterning at the bottom of the deep slot, the etching liquid is difficult to evenly penetrate the bottom of the slot, which may result in unclear edges of the pattern, large dimensional deviations, and even failure to form a complete pattern.

[0003] After searching, in the prior art, Chinese patent application number: CN201810652725.7 discloses a method for processing a bottom graphic blind groove of a printed circuit board, which belongs to the technical field of printed circuit boards. It includes 1) making a pressed structure including a sub-board I, a prepreg and a sub-board II according to the structural design drawing, a preset blind groove penetrating the prepreg is reserved on the front of the sub-board I, and a graphic circuit is arranged in the bottom area of ​​the preset blind groove; 2) at the preset blind groove position of the sub-board I, a single-sided window is opened on the surface copper layer; 3) removing the medium and prepreg at the preset blind groove to expose the graphic circuit at the bottom of the blind groove; 4) decontaminating the blind groove; 5) surface coating the graphic circuit and other circuit patterns in the blind groove to form a bottom graphic blind groove structure.

[0004] In the above patents, the bottom space of the deep groove is limited, and conventional etching methods often cannot achieve the required processing accuracy. When making patterns at the bottom of the deep groove, it is difficult for the etching liquid to evenly penetrate into the bottom of the groove, which may cause unclear edges of the patterns, large dimensional deviations, and even failure to form complete patterns. Therefore, we need to provide a picosecond processing method for binding disks at the bottom of blind grooves. Summary of the invention

[0005] The purpose of the present invention is to provide a picosecond processing method for a binding disk at the bottom of a blind groove. The design of a binding disk at the bottom of a deep groove facilitates the conduction and connection of inner and outer layer products. Components can be embedded in the deep groove, saving product space and reducing product volume. An inner layer of tape is used and an outer layer is uncovered to form a deep groove on a hard board. The disk at the bottom of the groove cannot be patterned using conventional etching methods. The present invention uses tin plating and laser ablation to form patterns to solve this problem. A second tin plating-alkaline etching is used to protect the inner layer pattern while completing the pattern formation in other areas to solve the problems in the prior art raised in the above background technology.

[0006] To achieve the above object, the present invention adopts the following technical solution: a picosecond processing method for a blind groove bottom binding disk, comprising the following steps:

[0007] Prepare the inner layer board for cutting, apply protective film to the whole inner layer board, and perform laser cutting on the protective film on the inner layer board to obtain the reserved area and the non-reserved area;

[0008] The adhesive tape in the non-reserved area is removed, and the outer layer and the sub-outer layer are laminated to obtain a laminated board;

[0009] The outer layer of the obtained laminate is deep milled by a deep groove machine, and the outer layer is mechanically drilled, and the outer layer deep groove area is mechanically uncovered to remove the waste area to obtain the deep groove;

[0010] The obtained deep groove is metallized, and the whole board is electroplated with tin at the same time, the bottom of the deep groove is tinned, and the area of ​​the finished product at the bottom of the deep groove as the substrate is ablated to expose the copper surface;

[0011] The copper exposed area at the bottom of the deep groove is etched away by alkaline etching, and a "disk" is formed at the bottom of the deep groove;

[0012] The tin layer is removed, and a dry film is attached to the entire board, and the dry film is exposed and developed, and the exposed and reserved area is the non-conductive area of ​​the outer finished product;

[0013] The exposed copper area is electroplated with tin layer, and the secondary dry film stripping, secondary alkaline etching and secondary tin layer stripping are performed. Finally, the solder mask and surface treatment layer are made according to the needs to obtain the molded product.

[0014] Preferably, the preparation of cutting the inner layer board, applying a protective film to the whole inner layer board, and laser cutting the protective film on the inner layer board to obtain a reserved area and a non-reserved area includes:

[0015] The protective film is a high-temperature resistant and high-viscosity protective film, and a picosecond pulse laser cutting machine is used to cut the protective film to cut off the reserved area and the non-reserved area.

[0016] Preferably, the adhesive tape in the non-reserved area is removed, and the outer layer and the sub-outer layer are laminated to obtain a laminated board, comprising:

[0017] The tape in the non-reserved area is removed, and the outer layer and the sub-outer layer are laminated. The inner layer, outer layer and sub-outer layer are laminated according to the design requirements, and the laminating equipment is used to make the layers fit tightly together without delamination or blistering.

[0018] Preferably, the outer layer of the obtained laminate is deep milled using a deep groove machine, and the outer layer is mechanically drilled, the outer layer deep groove area is mechanically uncovered, and the waste area is removed to obtain the deep groove, including:

[0019] According to the width and depth of the groove, select the appropriate tool size, set the appropriate cutting speed, feed rate and spindle speed to ensure an efficient and stable cutting process.

[0020] Preferably, the waste in the waste area is cleaned thoroughly with a vacuum cleaner, and the cleaned workpieces are quality checked and subsequently processed.

[0021] Preferably, the obtained deep groove is metallized, and the whole board is electroplated with tin, the bottom of the deep groove is tinned, and the area of ​​the finished product at the bottom of the deep groove as the substrate is ablated to expose the copper surface, including:

[0022] A layer of metal is deposited on the sidewalls and bottom of the groove using electroplating or chemical plating, and the metal layer is formed into the desired circuit pattern.

[0023] Preferably, uniform deposition of the metal layer is achieved by adjusting the formulation of the electroplating solution, the current density and the deposition time parameters.

[0024] Preferably, the step of removing the copper from the copper exposed area at the bottom of the deep groove by alkaline etching to form a "disk" at the bottom of the deep groove comprises:

[0025] According to the process requirements, adjust the pH value, temperature, spray pressure and solution specific gravity parameters of the etching solution. Before etching, the surface of the substrate is thoroughly stripped to ensure that there is no residual film.

[0026] Preferably, the tin layer is removed, a dry film is attached to the entire board, and the dry film is exposed and developed, and the exposed reserved area is the outer finished product non-conductor area, including:

[0027] The tin layer is removed and the whole board is attached with a dry film.

[0028] Preferably, the electroplated tin layer in the copper exposed area is subjected to secondary dry film stripping, secondary alkaline etching and secondary tin layer stripping, and finally a solder mask and a surface treatment layer are prepared according to requirements to obtain a molded product, including:

[0029] Create solder mask, surface treatment layers and processing.

[0030] Technical effects and advantages of the present invention: Compared with the prior art, the picosecond processing method of the blind groove bottom binding disk proposed by the present invention has the following advantages:

[0031] The present invention is designed with a binding disk at the bottom of the deep groove, which is convenient for the conductive connection between the inner and outer layer products. Components can be embedded in the deep groove, which saves product space and reduces product volume. The inner layer is taped and the outer layer is uncovered to form a deep groove on a hard board. The disk at the bottom of the groove cannot be patterned using a conventional etching method. The present invention uses a tin plating method and laser ablation to form a pattern to solve this problem. The second tin plating-alkaline etching is used to protect the inner layer pattern while completing the pattern formation in other areas.

[0032] Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or be understood by implementing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural system flow chart of the present invention. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] The present invention provides Figure 1 The blind groove bottom binding disk picosecond processing method shown includes the following steps:

[0036] Prepare the inner layer board for cutting, apply protective film to the whole inner layer board, and perform laser cutting on the protective film on the inner layer board to obtain the reserved area and the non-reserved area;

[0037] The adhesive tape in the non-reserved area is removed, and the outer layer and the sub-outer layer are laminated to obtain a laminated board;

[0038] The outer layer of the obtained laminate is deep milled by a deep groove machine, and the outer layer is mechanically drilled, and the outer layer deep groove area is mechanically uncovered to remove the waste area to obtain the deep groove;

[0039] The obtained deep groove is metallized, and the whole board is electroplated with tin at the same time, the bottom of the deep groove is tinned, and the area of ​​the finished product at the bottom of the deep groove as the substrate is ablated to expose the copper surface;

[0040] The copper exposed area at the bottom of the deep groove is etched away by alkaline etching, and a "disk" is formed at the bottom of the deep groove;

[0041] The tin layer is removed, and a dry film is attached to the entire board, and the dry film is exposed and developed, and the exposed and reserved area is the non-conductive area of ​​the outer finished product;

[0042] The exposed copper area is electroplated with tin layer, and the secondary dry film stripping, secondary alkaline etching and secondary tin layer stripping are performed. Finally, the solder mask and surface treatment layer are made according to the needs to obtain the molded product.

[0043] The preparation of cutting the inner layer board, applying a protective film to the whole inner layer board, and laser cutting the protective film on the inner layer board to obtain a reserved area and a non-reserved area include:

[0044] The protective film is a high-temperature resistant and high-viscosity protective film, and a picosecond pulse laser cutting machine is used to cut the protective film to cut off the reserved area and the non-reserved area.

[0045] The adhesive tape in the non-retained area is removed, and the outer layer and the sub-outer layer are laminated to obtain a laminated board, comprising:

[0046] The tape in the non-reserved area is removed, and the outer layer and the sub-outer layer are laminated. The inner layer, outer layer and sub-outer layer are laminated according to the design requirements, and the laminating equipment is used to make the layers fit tightly without delamination or blistering;

[0047] Specifically, the designed circuit pattern is transferred to the copper clad laminate, the copper foil of the non-pattern part is corroded by chemical or physical methods to form the inner layer circuit, a window is opened at the position of the inner layer corresponding to the bottom area of ​​the blind slot for subsequent gold plating, and the bottom area of ​​the blind slot with the window is gold-plated to ensure good conductivity and connectivity, and the blind slot board is assembled with other components to form a complete electronic device or system, and necessary debugging and testing are carried out to ensure the normal operation and stable performance of the equipment or system.

[0048] The outer layer of the obtained laminate is deep milled by a deep groove machine, and the outer layer is mechanically drilled, and the outer layer deep groove area is mechanically uncovered, and the waste area is removed to obtain the deep groove, including:

[0049] According to the width and depth of the groove, select the appropriate tool size, set the appropriate cutting speed, feed rate and spindle speed to ensure an efficient and stable cutting process;

[0050] Specifically, select a tool with high strength that can withstand high cutting forces, set appropriate cutting speeds, feed rates and spindle speeds to ensure an efficient and stable cutting process. Considering the difficulty of cutting deep grooves, it may be necessary to use a multi-step feed method to avoid cutting too deep at one time and causing tool damage. During the milling process, it must be ensured that the chips can be discharged smoothly to avoid chips accumulating in the groove and causing tool damage or affecting the processing quality. Jet chip removal, purge chip removal or suction chip removal can be used for chip removal. According to the depth and diameter of the drilling hole, select the appropriate drill type, such as high-speed steel drill bit, carbide drill bit, etc., to ensure that the cutting edge of the drill bit is sharp and wear-free to ensure the accuracy and surface quality of the drilling. During the cover removal process, it must be ensured that the contact surface between the tool and the workpiece is flat and free of impurities to ensure the accuracy and surface quality of the cover removal. Use appropriate feed speeds and cutting depths to avoid tool damage or workpiece deformation.

[0051] The waste in the waste area is cleaned up thoroughly with a vacuum cleaner, and the cleaned workpieces are quality checked and subsequently processed.

[0052] The obtained deep groove is metallized, and the whole board is electroplated with tin, the bottom of the deep groove is tinned, and the area of ​​the finished product at the bottom of the deep groove as the substrate is ablated to expose the copper surface, including:

[0053] A layer of metal is deposited on the sidewalls and bottom of the groove using electroplating or chemical plating, and the metal layer is formed into the desired circuit pattern.

[0054] The uniform deposition of the metal layer is achieved by adjusting the formula of the electroplating solution, the current density and the deposition time parameters.

[0055] The method of using alkaline etching to remove the copper in the copper exposed area at the bottom of the deep groove to form a "disk" at the bottom of the deep groove includes:

[0056] According to the process requirements, adjust the pH value, temperature, spray pressure and solution specific gravity parameters of the etching solution. Before etching, perform a thorough film stripping treatment on the substrate surface to ensure that there is no residual film.

[0057] The tin layer is removed, and a dry film is attached to the entire board, and the dry film is exposed and developed, and the exposed reserved area is the non-conductive area of ​​the outer finished product, including:

[0058] The tin layer is removed and the whole board is attached with dry film. ;

[0059] Specifically, tin layer removal:

[0060] Ensure that the working area is clean and tidy to avoid the influence of dust and impurities on the tin stripping process. Prepare the tin stripping liquid and necessary tools, such as brushes, spray bottles, etc., put the circuit board to be stripped into the tin stripping liquid, and ensure that the tin layer is completely immersed. According to the characteristics of the tin stripping liquid and the specific situation of the circuit board, set the appropriate tin stripping time and temperature, and use a brush to gently scrub the surface of the circuit board to help remove the tin layer. After the tin stripping is completed, rinse the circuit board with clean water to remove the residual tin stripping liquid, and check whether the tin layer on the surface of the circuit board is completely stripped without residue, and ensure that there are no scratches, damage and other defects on the surface of the circuit board.

[0061] Attach dry film to the whole board:

[0062] Prepare dry film, laminator, scraper and other tools, clean the surface of the circuit board, remove impurities such as grease and dust, cut the dry film into appropriate size to ensure that it can completely cover the circuit board, use the laminator to attach the dry film evenly to the surface of the circuit board, use the scraper to gently scrape and press the dry film to remove bubbles and wrinkles, ensure that the dry film fits tightly to the circuit board, check whether the dry film is flat, free of bubbles and wrinkles, and ensure that the dry film completely covers the non-conductor area on the circuit board.

[0063] Exposure and development process:

[0064] Put the circuit board with dry film into the exposure machine, set the appropriate exposure time and intensity according to the characteristics of the exposure machine and the specific requirements of the circuit board, use the exposure film (usually film) to align with the circuit board, and then expose it. After the exposure is completed, put the circuit board into the developer, set the appropriate development time and temperature according to the characteristics of the developer and the specific situation of the circuit board, use a brush to gently scrub the surface of the circuit board to help remove the unexposed dry film part. After the development is completed, rinse the circuit board with clean water to remove the residual developer, check whether the non-conductor area on the circuit board retains the dry film completely, ensure that there is no dry film residue in the conductor area on the circuit board (that is, the part that needs to be copper plated or retained copper), and check whether the surface of the circuit board is flat and has no scratches, damage and other defects.

[0065] The electroplated tin layer of the copper exposed area is subjected to secondary dry film stripping, secondary alkaline etching and secondary tin layer stripping, and finally a solder mask and a surface treatment layer are prepared according to requirements to obtain a molded product, including:

[0066] Make solder mask, surface treatment layer and processing;

[0067] Specifically, the electroplated tin layer:

[0068] Clean the exposed copper area of ​​the circuit board to ensure that there are no impurities such as oil, oxides, etc., prepare electroplating equipment such as electroplating tin solution, electroplating tank, anode plate, etc., put the circuit board into the electroplating tank, ensure that the exposed copper area is completely immersed in the electroplating tin solution, connect the power supply, set the appropriate current density and electroplating time, and observe the temperature and pH value of the electroplating solution during the electroplating process to ensure that it is stable within the appropriate range. After the electroplating is completed, check whether the exposed copper area of ​​the circuit board is evenly plated with tin, and use a microscope or magnifying glass to observe the surface of the tin layer to ensure that there are no defects such as pores and cracks;

[0069] Make solder mask: prepare solder mask ink, screen printing equipment or spraying equipment, clean the surface of the circuit board to ensure that there are no impurities and residues, use screen printing or spraying equipment to evenly apply solder mask ink on the surface of the circuit board, set the appropriate coating thickness and drying time according to the characteristics of the solder mask ink and the specific requirements of the circuit board, use mask or laser direct imaging technology to pattern the solder mask, after the solder mask is completed, check whether the solder mask on the circuit board is uniform, free of bubbles, cracks and other defects, ensure that the solder mask pattern is consistent with the circuit board design, select the surface treatment process, and select the appropriate surface treatment process according to the specific requirements and application scenarios of the circuit board. Select appropriate surface treatment process, such as hot air solder leveling (HASL), electroless nickel palladium immersion gold (ENEPIC) or electroless nickel immersion gold (ENIG), etc., and perform surface treatment on the circuit board according to the requirements of the selected surface treatment process. During the treatment process, pay attention to controlling parameters such as temperature and time to ensure the quality of surface treatment. After the surface treatment is completed, check whether the surface of the circuit board is flat, free of scratches, oxidation and other defects. Use a microscope or magnifying glass to observe the surface of the circuit board after surface treatment to ensure that there is no abnormality. After the above steps, the circuit board will complete all necessary processing and treatment to obtain the final molded product.

[0070] In addition, the above-mentioned text creation unit, image generation unit, high-quality image training unit and model optimization processing unit are also used to realize other functions of the above-mentioned blind groove bottom binding disk picosecond processing method when executed, which will not be elaborated here one by one.

[0071] In addition, the present invention also provides a terminal device. The blind groove bottom binding disk picosecond processing method involved in this embodiment is mainly used in the terminal device, which can be a PC, a portable computer, a mobile terminal, and other devices with display and processing functions.

[0072] Specifically, the terminal device may include a processor (e.g., CPU), a communication bus, a user interface, a network interface, and a memory. The communication bus is used to realize the connection and communication between these components; the user interface may include a display screen (Display), an input unit such as a keyboard (Keyboard); the network interface may optionally include a standard wired interface, a wireless interface (such as a WI-FI interface); the memory may be a high-speed RAM memory, or a stable memory (non-volatile memory), such as a disk memory, and the memory may optionally be a storage device independent of the aforementioned processor.

[0073] Among them, the memory stores a readable storage medium, and the readable storage medium stores a picosecond processing program for the blind groove bottom binding disk. The processor can call the blind groove bottom binding disk picosecond processing program stored in the memory, and execute the blind groove bottom binding disk picosecond processing method provided by an embodiment of the present invention.

[0074] It is understood that a readable storage medium can be a tangible device that can hold and store instructions used by an instruction execution device. Computer-readable storage media can be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the above. More specific examples of computer-readable storage media (a non-exhaustive list) include: portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), static random access memories (SRAM), portable compact disk read-only memories (CD-ROM), digital versatile disks (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or raised structures in grooves on which instructions are stored, and any suitable combination of the above. The computer-readable storage medium used here is not to be interpreted as a transient signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0075] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0076] The computer program instructions for performing the operation of the present disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions may be executed completely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or completely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be customized by utilizing the state information of the computer-readable program instructions, and the electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present disclosure.

[0077] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A picosecond processing method for a blind groove bottom binding disk, characterized in that: The following steps are involved: Prepare the inner layer board for cutting, apply protective film to the whole inner layer board, and perform laser cutting on the protective film on the inner layer board to obtain the reserved area and the non-reserved area; The adhesive tape in the non-reserved area is removed, and the outer layer and the sub-outer layer are laminated to obtain a laminated board; The outer layer of the obtained laminate is deep milled by a deep groove machine, and the outer layer is mechanically drilled, and the outer layer deep groove area is mechanically uncovered to remove the waste area to obtain the deep groove; The obtained deep groove is metallized, and the whole board is electroplated with tin at the same time, the bottom of the deep groove is tinned, and the area of ​​the finished product at the bottom of the deep groove as the substrate is ablated to expose the copper surface; The copper exposed area at the bottom of the deep groove is etched away by alkaline etching, and a "disk" is formed at the bottom of the deep groove; The tin layer is removed, and a dry film is attached to the entire board, and the dry film is exposed and developed, and the exposed and reserved area is the non-conductive area of ​​the outer finished product; The exposed copper area is electroplated with tin layer, and the secondary dry film stripping, secondary alkaline etching and secondary tin layer stripping are performed. Finally, the solder mask and surface treatment layer are made according to the needs to obtain the molded product.

2. The picosecond processing method for blind groove bottom binding disk according to claim 1 is characterized in that: The preparation of cutting the inner layer board, applying a protective film to the whole inner layer board, and laser cutting the protective film on the inner layer board to obtain a reserved area and a non-reserved area include: The protective film is a high-temperature resistant and high-viscosity protective film, and a picosecond pulse laser cutting machine is used to cut the protective film to cut off the reserved area and the non-reserved area.

3. The picosecond processing method for blind groove bottom binding disk according to claim 1 is characterized in that: The adhesive tape in the non-retained area is removed, and the outer layer and the sub-outer layer are laminated to obtain a laminated board, comprising: The tape in the non-reserved area is removed, and the outer layer and the sub-outer layer are laminated. The inner layer, outer layer and sub-outer layer are laminated according to the design requirements, and the laminating equipment is used to make the layers fit tightly together without delamination or blistering.

4. The picosecond processing method for blind groove bottom binding disk according to claim 1 is characterized in that: The outer layer of the obtained laminate is deep milled by a deep groove machine, and the outer layer is mechanically drilled, and the outer layer deep groove area is mechanically uncovered, and the waste area is removed to obtain the deep groove, including: According to the width and depth of the groove, select the appropriate tool size, set the appropriate cutting speed, feed rate and spindle speed to ensure an efficient and stable cutting process.

5. The picosecond processing method for blind groove bottom binding disk according to claim 4 is characterized in that: The waste in the waste area is cleaned up thoroughly with a vacuum cleaner, and the cleaned workpieces are quality checked and subsequently processed.

6. The picosecond processing method for blind groove bottom binding disk according to claim 1, characterized in that: The obtained deep groove is metallized, and the whole board is electroplated with tin, the bottom of the deep groove is tinned, and the area of ​​the finished product at the bottom of the deep groove as the substrate is ablated to expose the copper surface, including: A layer of metal is deposited on the sidewalls and bottom of the groove using electroplating or chemical plating, and the metal layer is formed into the desired circuit pattern.

7. The picosecond processing method for blind groove bottom binding disk according to claim 6, characterized in that: The uniform deposition of the metal layer is achieved by adjusting the formula of the electroplating solution, the current density and the deposition time parameters.

8. The picosecond processing method for blind groove bottom binding disk according to claim 1, characterized in that: The method of removing the copper exposed in the copper area at the bottom of the deep groove by alkaline etching to form a "disk" at the bottom of the deep groove comprises: According to the process requirements, adjust the pH value, temperature, spray pressure and solution specific gravity parameters of the etching solution. Before etching, the surface of the substrate is thoroughly stripped to ensure that there is no residual film.

9. The picosecond processing method for blind groove bottom binding disk according to claim 1, characterized in that: The tin layer is removed, and a dry film is attached to the entire board, and the dry film is exposed and developed, and the exposed reserved area is the non-conductive area of ​​the outer finished product, including: The tin layer is removed and the whole board is attached with a dry film.

10. The picosecond processing method for blind groove bottom binding disk according to claim 1, characterized in that: The electroplated tin layer of the copper exposed area is subjected to secondary dry film stripping, secondary alkaline etching and secondary tin layer stripping, and finally a solder mask and a surface treatment layer are prepared according to requirements to obtain a molded product, including: Create solder mask, surface treatment layers and processing.

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