Integrated packaging chip structure

Abstract

The invention discloses an integrated packaging chip structure, and relates to the technical field of integrated photoelectronics. The integrated packaging chip structure comprises an optical signal transmitting layer, a substrate, an optical signal receiving layer and a printed circuit board which are stacked, wherein a first matching circuit chip is arranged on the surface, far away from the substrate, of the optical signal receiving layer and is used for amplifying a signal received and detected by the optical signal receiving layer; the printed circuit board is provided with a groove, and the first matching circuit chip is embedded into the groove to be connected with the printed circuit board.

Description

Technical Field

[0001] The present disclosure relates to the technical field of integrated optoelectronics, and more specifically, to an integrated package chip structure. Background Art

[0002] Optical fiber communication networks have the characteristics of large bandwidth, low loss and anti-electromagnetic interference, which meet the society's demand for large-capacity and high-speed communications. Optical communication networks have also developed well with the growth of communication needs, and optical modules, as part of optical fiber communication networks, also play a vital role.

[0003] With the rapid development of artificial intelligence, IoT big data, cloud computing and other fields, the traffic of information transmission and processing has also shown explosive growth, which has also led to the rapid expansion of the scale of data centers as information storage and exchange media. Therefore, the future optical information communication network has an increasingly urgent demand for 1.6T and higher rate communication conversion interfaces, and at the same time, the communication energy consumption of the optoelectronic conversion interface is also increasing. The demand for optical modules with higher communication density and lower loss is imminent, and how to achieve larger-scale integration of optoelectronic devices will also be the key to the problem. Summary of the invention

[0004] In view of this, the present disclosure provides an integrated packaged chip structure, including a stacked optical signal transmitting layer, a substrate, an optical signal receiving layer and a printed circuit board; wherein a first matching circuit chip is provided on the surface of the optical signal receiving layer away from the substrate, for amplifying and processing the signal detected by the optical signal receiving layer; and the printed circuit board is provided with a groove, for embedding the first matching circuit chip into the groove and connecting it to the printed circuit board.

[0005] According to an embodiment of the present disclosure, the integrated packaged chip structure also includes: a laser chip, which is arranged on a surface of the optical signal emitting layer away from the substrate, and is used to emit a first optical signal; and a second matching circuit chip, which is arranged on a surface of the optical signal emitting layer away from the substrate, and is used to drive the first optical signal for modulation.

[0006] According to an embodiment of the present disclosure, the laser chip and the second matching circuit chip are packaged on the optical signal transmitting layer through a ball grid array; the first matching circuit chip is packaged on the optical signal receiving layer through a ball grid array; and the area on the optical signal receiving layer that does not contain the first matching circuit chip is packaged on a printed circuit board through a ball grid array.

[0007] According to an embodiment of the present disclosure, the optical signal transmitting layer includes: a first input coupling structure, a first wavelength division multiplexer, an electro-optical modulator, a first waveguide and a first output coupling structure arranged in the optical signal transmitting layer; the first optical signal is input into the first input coupling structure and the first wavelength division multiplexer, and after being modulated by the electro-optical modulator, the modulated first optical signal is input into the output optical fiber through the first waveguide and the first output coupling structure; the optical signal receiving layer includes: a photodetector, a second waveguide, a second wavelength division multiplexer and a second input coupling structure arranged in the optical signal receiving layer; the optical signal input through the input optical fiber is input into the photodetector after passing through the second input coupling structure, the second wavelength division multiplexer and the second waveguide for photoelectric conversion to obtain the signal carried by the second optical signal.

[0008] According to an embodiment of the present disclosure, the integrated package chip structure further includes: a through hole, which passes through the optical signal transmitting layer, the substrate and the optical signal receiving layer.

[0009] According to an embodiment of the present disclosure, the first input coupling structure, the first output coupling structure, and the second input coupling structure include grating coupling structures.

[0010] According to an embodiment of the present disclosure, a printed circuit board includes: a plurality of holes disposed in a groove.

[0011] According to an embodiment of the present disclosure, the printed circuit board further comprises: an optical fiber port having an optical fiber input end and an optical fiber output end; wherein the optical fiber input end is connected to the input optical fiber, and the optical fiber output end is connected to the optical fiber output end.

[0012] According to an embodiment of the present disclosure, the soldering material of the ball grid array includes tin-lead alloy or copper.

[0013] According to an embodiment of the present disclosure, the depth of the groove is the same as the height of the first matching circuit chip.

[0014] According to the embodiments of the present disclosure, on the basis of a common substrate, optoelectronic functional elements for light modulation and detection are grown and sealed at both ends of the substrate respectively, thereby improving the integration of optoelectronic functional elements per unit horizontal area. At the same time, the use of flip-chip packaging greatly shortens the length of optoelectronic interconnection, reduces parasitic effects, improves the signal transmission rate of the photonic chip and also reduces energy consumption.

[0015] According to the embodiments of the present disclosure, the optical function unit for receiving and detecting optical signals is embedded in a groove of a printed circuit board, thereby effectively reducing the size of the entire chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0017] Figure 1 A schematic diagram showing the structure of an integrated packaged chip structure according to an embodiment of the present disclosure;

[0018] Figure 2 A schematic diagram of a ball grid array package is shown schematically;

[0019] Description of reference numerals:

[0020] 1. Optical signal transmitting layer; 2. Optical signal receiving layer; 3. Substrate; 4. Second matching circuit chip; 5. First matching circuit chip; 6. Laser chip; 7. Printed circuit board; 8. Through hole; 9. Output optical fiber; 10. Input optical fiber; 11. Optical fiber port; 12. Ball grid array; 13. Hole. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known systems and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0022] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise", "include", etc. used herein indicate the existence of features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0023] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0024] When using expressions such as "at least one of A, B, and C, etc.", they should generally be interpreted according to the meaning of the expression commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0025] Figure 1 The structure diagram of the integrated packaged chip structure of the embodiment of the present disclosure is schematically shown.

[0026] like Figure 1As shown, the present disclosure provides an integrated packaged chip structure, including a stacked optical signal transmitting layer 1, a substrate 3, an optical signal receiving layer 2 and a printed circuit board 7; wherein a first matching circuit chip 5 is provided on the surface of the optical signal receiving layer away from the substrate, for amplifying and processing the signal detected by the optical signal receiving layer; and the printed circuit board is provided with a groove, for embedding the first matching circuit chip into the groove and connecting it to the printed circuit board.

[0027] In the embodiment of the present disclosure, the two ends of the substrate are processed by homogeneous or heterogeneous integration process to grow chips on a CMOS compatible platform. Specifically, by designing the optical signal transmitting layer and the optical signal receiving layer to share the same substrate, an optical transceiver module is formed, and a groove is provided on the printed circuit board, and the optical transceiver module is semi-embedded on the printed circuit board, which effectively reduces the overall volume of the optical transceiver module. And by designing a vertical distribution structure, more optical functional devices can be integrated per unit horizontal area, with high integration, while effectively limiting the problem of photoelectric thermal crosstalk, meeting the construction requirements of photoelectric conversion nodes in future 1.6T and higher rate optical communication networks.

[0028] According to an embodiment of the present disclosure, the integrated packaged chip structure also includes: a laser chip 6, which is arranged on a surface of the optical signal emitting layer away from the substrate, and is used to emit a first optical signal; a second matching circuit chip 4, which is arranged on a surface of the optical signal emitting layer away from the substrate, and is used to drive the first optical signal for modulation.

[0029] In the embodiment of the present disclosure, the laser chip and the second matching circuit chip are arranged on the optical signal transmission layer, and the integration density is higher when the unit horizontal area remains unchanged.

[0030] Figure 2 A schematic diagram of a ball grid array package is shown schematically.

[0031] like Figure 1 and Figure 2 As shown, according to an embodiment of the present disclosure, the laser chip and the second matching circuit chip are packaged on the optical signal transmitting layer through the ball grid array 12; the first matching circuit chip is packaged on the optical signal receiving layer through the ball grid array 12; and the area on the optical signal receiving layer that does not contain the first matching circuit chip is packaged on the printed circuit board through the ball grid array 12.

[0032] In the embodiments of the present disclosure, by adopting ball grid array packaging technology to flip-chip the optical signal transmitting layer and the optical signal receiving layer, ultra-compact electrical interconnection is achieved, the length of the optoelectronic interconnection is effectively shortened, and the parasitic effect is reduced. While achieving high signal transmission efficiency in the chip, energy consumption is reduced; the traditional packaging method of wire bonding is avoided, which results in a longer optoelectronic interconnection length and increased losses.

[0033] According to an embodiment of the present disclosure, the optical signal transmission layer includes: a first input coupling structure, a first wavelength division multiplexer, an electro-optical modulator, a first waveguide and a first output coupling structure arranged in the optical signal transmission layer.

[0034] The first optical signal is input to the first input coupling structure and the first wavelength division multiplexer, and after being modulated by the electro-optical modulator, the modulated first optical signal is input to the output optical fiber 9 through the first waveguide and the first output coupling structure.

[0035] The optical signal receiving layer includes: a photodetector arranged in the optical signal receiving layer, a second waveguide, a second wavelength division multiplexer and a second input coupling structure.

[0036] The optical signal input through the input optical fiber 10 is input into the photodetector for photoelectric conversion after passing through the second input coupling structure, the second wavelength division multiplexer and the second waveguide to obtain the signal carried by the second optical signal. Among them, the first input coupling structure, the first output coupling structure and the second input coupling structure include grating coupling structures.

[0037] According to an embodiment of the present disclosure, the printed circuit board further includes: an optical fiber port 11, which is provided with an optical fiber input end and an optical fiber output end; wherein the optical fiber input end is connected to the input optical fiber, and the optical fiber output end is connected to the optical fiber output end.

[0038] In an embodiment of the present disclosure, a first optical signal emitted by a laser chip is input into a first input coupling structure and a first wavelength division multiplexer, and after being modulated by an electro-optical modulator, the modulated first optical signal is input into an output optical fiber through a first waveguide and a first output coupling structure, and the modulated signal is output through an optical fiber output end.

[0039] The externally input second optical signal is input into the input optical fiber through the optical fiber input end, and then input into the photodetector for photoelectric conversion after passing through the second input coupling structure, the second wavelength division multiplexer and the second waveguide. The radio frequency signal carried by the second optical signal is demodulated to obtain the converted electrical signal, and the electrical signal is effectively amplified through the first matching circuit chip. The printed circuit board provides power and supports the transmission of the electrical signal.

[0040] According to an embodiment of the present disclosure, the grating coupling structure is a vertical grating coupling structure.

[0041] In the embodiments of the present disclosure, a vertical grating coupling structure is adopted to facilitate detection on a wafer during the growth and preparation of a photonic chip, and the vertical grating coupling structure is easy to manufacture, which can shorten the manufacturing process of an optical transmitting module and an optical receiving module. At the same time, it has higher flexibility and a larger alignment tolerance, which is more conducive to the emission and reception efficiency of light in the optical module.

[0042] According to an embodiment of the present disclosure, the first matching circuit chip includes a transimpedance amplifier chip, which is connected to the photodetector; the second matching circuit chip is connected to the electro-optic modulator to drive the electro-optic modulator to modulate the first optical signal.

[0043] According to an embodiment of the present disclosure, the integrated package chip structure further includes: a through hole 8 that penetrates the optical signal transmitting layer, the substrate and the optical signal receiving layer.

[0044] In an embodiment of the present disclosure, the optical signal transmitting layer and the optical signal receiving layer are electrically interconnected through an edge through hole; and except for one end of the optical signal transmitting layer close to the optical fiber port and one end of the optical signal receiving layer close to the optical fiber port, the other three ends of the optical signal transmitting layer and the other three ends of the optical signal receiving layer are interconnected by metal routing through this through hole, and electrical connection with the printed circuit board is achieved through this through hole.

[0045] According to an embodiment of the present disclosure, the optical signal transmission layer includes a stacked buried oxide layer, a waveguide layer and a cladding layer, wherein the buried oxide layer is connected to the substrate and the cladding layer contains multiple layers of metal routing; the first input coupling structure, the first wavelength division multiplexer, the electro-optical modulator, the first waveguide and the first output coupling structure are all arranged in the waveguide layer.

[0046] The optical signal receiving layer includes a stacked buried oxide layer, a waveguide layer and a cladding layer, wherein the buried oxide layer is connected to the substrate, wherein the cladding layer includes multiple layers of metal wiring; the photodetector, the second waveguide, the second wavelength division multiplexer and the second input coupling structure are all arranged in the waveguide layer.

[0047] According to an embodiment of the present disclosure, the substrate includes a silicon substrate.

[0048] The thickness of the buried oxide layer is 2μm-4μm, the thickness of the waveguide layer is 200nm, the material of the waveguide layer can be silicon, and other materials can also be heterogeneously integrated to prepare active photonic devices and passive photonic devices.

[0049] According to an embodiment of the present disclosure, the printed circuit board includes: a plurality of holes 13 disposed in the groove.

[0050] In the embodiments of the present disclosure, a plurality of holes are designed in the groove to solve the heat generation problem of the first matching circuit chip embedded in the groove. At the same time, the heat concentration problem caused by high-density optoelectronic integration is also effectively solved. Effective heat dissipation ensures that the chip can work stably for a longer period of time.

[0051] According to an embodiment of the present disclosure, the soldering material of the ball grid array includes tin-lead alloy solder balls, copper pillars or other tiny bump metals.

[0052] According to an embodiment of the present disclosure, the depth of the groove is the same as the height of the first matching circuit chip.

[0053] In the embodiment of the present disclosure, by controlling the perfect match between the groove depth and the height of the first matching circuit chip, the first matching circuit is perfectly embedded in the printed circuit board, achieving vertical structure distribution and improving integration.

[0054] It will be appreciated by those skilled in the art that the features described in the various embodiments and / or claims of the present disclosure may be combined and / or combined in a variety of ways, even if such combinations and / or combinations are not explicitly described in the present disclosure. In particular, the features described in the various embodiments and / or claims of the present disclosure may be combined and / or combined in a variety of ways without departing from the spirit and teachings of the present disclosure. All of these combinations and / or combinations fall within the scope of the present disclosure.

[0055] The embodiments of the present disclosure are described above. However, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present disclosure. Although the embodiments are described above separately, this does not mean that the measures in the various embodiments cannot be used in combination to advantage. The scope of the present disclosure is defined by the attached claims and their equivalents. Without departing from the scope of the present disclosure, those skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present disclosure.

Claims

1. An integrated package chip structure, characterized in that: It includes a stacked optical signal transmitting layer, a substrate, an optical signal receiving layer and a printed circuit board; Wherein, a first matching circuit chip is provided on the surface of the optical signal receiving layer away from the substrate, and is used to amplify and process the signal received and detected by the optical signal receiving layer; The printed circuit board is provided with a groove for embedding the first matching circuit chip into the groove and connecting it to the printed circuit board.

2. The integrated package chip structure according to claim 1, characterized in that: Also includes: A laser chip, disposed on a surface of the optical signal emitting layer away from the substrate, for emitting a first optical signal; The second matching circuit chip is arranged on a surface of the optical signal emitting layer away from the substrate, and is used to drive the first optical signal to be modulated.

3. The integrated package chip structure according to claim 2, characterized in that: The laser chip and the second matching circuit chip are packaged on the optical signal emitting layer through a ball grid array; The first matching circuit chip is packaged on the optical signal receiving layer through a ball grid array; The area on the optical signal receiving layer that does not contain the first matching circuit chip is packaged on the printed circuit board through a ball grid array.

4. The integrated package chip structure according to claim 2, characterized in that: The optical signal transmission layer comprises: A first input coupling structure, a first wavelength division multiplexer, an electro-optical modulator, a first waveguide and a first output coupling structure arranged in the optical signal transmission layer; The first optical signal is input into the first input coupling structure and the first wavelength division multiplexer, and after being modulated by the electro-optical modulator, the modulated first optical signal is input into the output optical fiber through the first waveguide and the first output coupling structure; The optical signal receiving layer comprises: A photodetector, a second waveguide, a second wavelength division multiplexer and a second input coupling structure are arranged in the optical signal receiving layer; The optical signal input through the input optical fiber passes through the second input coupling structure, the second wavelength division multiplexer and the second waveguide and is input into the photodetector for photoelectric conversion to obtain the signal carried by the second optical signal.

5. The integrated package chip structure according to claim 1, characterized in that: Also includes: A through hole penetrates the optical signal emitting layer, the substrate and the optical signal receiving layer.

6. The integrated package chip structure according to claim 4, characterized in that: The first input coupling structure, the first output coupling structure and the second input coupling structure comprise grating coupling structures.

7. The integrated package chip structure according to claim 1, characterized in that: The printed circuit board includes: a plurality of holes arranged in the groove.

8. The integrated package chip structure according to claim 4, characterized in that: The printed circuit board also includes: an optical fiber port, which is provided with an optical fiber input end and an optical fiber output end; The optical fiber input end is connected to the input optical fiber, and the optical fiber output end is connected to the optical fiber output end.

9. The integrated package chip structure according to claim 3, characterized in that: The soldering material of the ball grid array includes tin-lead alloy or copper.

10. The integrated package chip structure according to claim 1, characterized in that: The depth of the groove is the same as the height of the first matching circuit chip.

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