Multi-pixel integrated LED module manufacturing method and module

Abstract

The invention provides a multi-pixel integrated LED module manufacturing method and a module, and the manufacturing method comprises the steps: enabling an LED circuit board and a PCBA circuit board to be embedded into a PCB, and enabling a substrate of the LED circuit board to be exposed to the bottom of the PCB; carrying out the procedures of die bonding, fluorescent sheet bonding, dam enclosing and adhesive dispensing on the LED circuit board; performing SMT (Surface Mount Technology) processing on the PCB to obtain a PCBA module; and the exposed LED circuit board base material and the radiator are fixedly installed, and the multi-pixel integrated LED module is obtained. According to the invention, the LED substrate circuit board and the module circuit board are subjected to inlaying and pressing treatment, so that the LED substrate is in direct contact with the radiator, the heat-conducting property is greatly improved, and meanwhile, the cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of LED modules, and in particular to a method for manufacturing a multi-pixel integrated LED module and a module. Background Art

[0002] The existing multi-pixel integrated LED module structure, due to the heat concentration of multi-pixel LED, its substrate usually adopts a substrate with excellent heat dissipation performance, the chip is fixed and soldered on the substrate, and then the LED is packaged, and then assembled and installed on the PCB through welding, wire bonding, and sealing processes. In this way, the LED heat dissipation performance is low, and its heat dissipation is first conducted through the stacked structure of each layer of the PCB and then to the heat sink. The module structure has poor heat dissipation performance. In order to improve the module heat dissipation performance, the PCBA module circuit board usually uses a metal plate with high thermal conductivity. The cost of the multi-layer board is high, and currently a maximum of 2 layers of boards are used. Alternatively, if the LED adopts the CSP packaging process, multiple LEDs can be arranged with small intervals, increasing the light source density to improve the brightness. At the same time, the thermal management performance is good, and the LED can be directly mounted on the PCB, but the CSP process requirements are high, the equipment requirements are high, and the implementation cost is high. Summary of the invention

[0003] In order to overcome the above technical defects, the present invention provides a method for manufacturing a multi-pixel integrated LED module and a module, which can improve heat dissipation performance and reduce costs.

[0004] In order to solve the above problems, the present invention is implemented according to the following technical solutions:

[0005] A method for manufacturing a multi-pixel integrated LED module comprises the following steps:

[0006] Inlay the LED circuit board and the PCBA circuit board into a PCB board, so that the substrate of the LED circuit board is exposed to the bottom of the PCB board;

[0007] Carry out the processes of crystal bonding, phosphor sheet bonding, dam bonding and glue dispensing on LED circuit boards;

[0008] Perform SMT patch processing on the PCB board to obtain a PCBA module;

[0009] The exposed LED circuit board substrate and the heat sink are fixedly installed to obtain a multi-pixel integrated LED module.

[0010] As a further improvement of the present invention, during layout design, pads are arranged on the PCBA circuit board that correspond one-to-one to the electrical polarity pads on the LED circuit board.

[0011] As a further improvement of the present invention, the step of performing SMT patch processing on the PCB board includes: pasting the control circuit and 0R connecting resistor on the PCB board.

[0012] As a further improvement of the present invention, one end of the 0R connecting resistor is arranged on the LED circuit board, and the other end is arranged on the PCBA circuit board.

[0013] As a further improvement of the present invention, the thickness of the LED circuit board is equal to that of the PCBA circuit board.

[0014] As a further improvement of the present invention, the control circuit adopts a FR4 multilayer board.

[0015] The present invention also provides a multi-pixel integrated LED module, which is manufactured by the multi-pixel integrated LED module manufacturing method described above, and includes: a PCB board, a heat sink, a control circuit, an integrated LED, and an 0R connection resistor;

[0016] The heat sink is arranged on one side of the PCB board, and the control circuit, the integrated LED, and the 0R connection resistor are arranged on the other side of the PCB board.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: by embedding and pressing the LED substrate circuit board and the module circuit board, the LED substrate is directly in contact with the heat sink, the thermal conductivity is greatly improved, and at the same time, the cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a flow chart of the method for manufacturing a multi-pixel integrated LED module according to Example 1;

[0019] Figure 2 This is a schematic diagram of the structure of the multi-pixel integrated LED module described in Example 2;

[0020] Figure 3 Another structural schematic diagram of the multi-pixel integrated LED module described in Example 2;

[0021] Figure 4 Schematic diagram of the connection of the 0R connection resistor.

[0022] Explanation of the reference numerals: 1. PCB board; 11. LED circuit board; 12. PCBA circuit board; 2. control circuit; 3. heat sink; 4. 0R connection resistor. DETAILED DESCRIPTION

[0023] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0024] Example 1

[0025] This embodiment provides a method for manufacturing a multi-pixel integrated LED module. Figure 1 As shown, the steps include:

[0026] S1. Inlaying the LED circuit board 11 and the PCBA circuit board 12 into a PCB board 1, so that the substrate of the LED circuit board 11 is exposed to the bottom of the PCB board 1, wherein the thickness of the LED circuit board 11 and the PCBA circuit board 12 are equal.

[0027] When performing layout design, pads corresponding to the electrical polarity pads on the LED circuit board 11 are arranged on the PCBA circuit board 12 to prepare for subsequent processes.

[0028] S2. After the whole PCB board 1 is pressed and manufactured, the LED circuit board 11 is subjected to the processes of crystal bonding, phosphor sheet bonding, damming, and glue dispensing.

[0029] S3, performing SMT patch processing on the PCB board 1 to obtain a PCBA module; specifically, the control circuit 2 and the 0R connection resistor 4 are pasted on the PCB board 1.

[0030] like Figure 4 As shown, one end of the 0R connecting resistor 4 is set on the LED circuit board 11, and the other end is set on the PCBA circuit board 12.

[0031] Considering that in the prior art integrated LED, gold wire bonding is required to achieve electrical connection, and the gold wire needs to be fixed and protected by sealing glue, the process cost is high and the reliability is low. In this step, the connection between the multi-pixel integrated LED and the module control circuit is achieved through the 0R connection resistor 4, and the traditional bonding process is replaced by the 0R connection resistor 4 to achieve the electrical connection between the multi-pixel integrated LED and the module control circuit 2.

[0032] The control circuit 2 part can use FR4 multilayer board, which has better cost, better routing and better EMI effect.

[0033] S4, fixing and installing the exposed LED circuit board 11 substrate and the three rows of heat sinks to obtain a multi-pixel integrated LED module.

[0034] In summary, this embodiment embeds the integrated LED substrate circuit board in the PCBA module circuit board, so that the LED substrate can be in direct contact with the heat sink for heat conduction, and the heat dissipation performance is greatly improved. The PCBA module circuit board substrate can use FR4 multilayer board, which reduces the cost and optimizes the module routing. Since the integrated LED substrate circuit board and the PCBA module circuit board have been embedded into an integral circuit board, the electrical connection between the LED and the module can be achieved through a one-to-one corresponding pad design and a 0R resistor, eliminating the bonding and glue processes, optimizing the process cost and avoiding the reliability risk of gold wire breakage and short circuit in bonding.

[0035] Example 2

[0036] This embodiment is a multi-pixel integrated LED module, which is manufactured by the multi-pixel integrated LED module manufacturing method of embodiment 1. Figure 2 and Figure 3 As shown, it includes: a PCB board 1, a heat sink 3, a control circuit 2, and an 0R connection resistor 4; the heat sink 3 is arranged on one side of the PCB board 1, and the control circuit 2 and the 0R connection resistor 4 are arranged on the other side of the PCB board 1.

[0037] The PCB board 1 is obtained by inlaying an LED circuit board 11 and a PCBA circuit board 12 , and the thickness of the LED circuit board 11 and the PCBA circuit board 12 are equal.

[0038] The substrate of the LED circuit board 11 is exposed to the bottom of the PCB board 1 so as to be in thermal contact with the heat sink 3 .

[0039] One end of the 0R connecting resistor 4 is set on the LED circuit board 11, and the other end is set on the PCBA circuit board 12, thereby replacing the traditional bonding process to achieve the electrical connection between the multi-pixel integrated LED and the module control circuit 2.

[0040] The control circuit 2 part can use FR4 multilayer board, which has better cost, better routing and better EMI effect.

[0041] For other implementations of this embodiment, please refer to Example 1, which will not be described in detail here.

[0042] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for manufacturing a multi-pixel integrated LED module, characterized in that: Includes steps: Inlay the LED circuit board and the PCBA circuit board into a PCB board, so that the substrate of the LED circuit board is exposed to the bottom of the PCB board; Carry out the processes of crystal bonding, phosphor sheet bonding, dam bonding and glue dispensing on LED circuit boards; Perform SMT patch processing on the PCB board to obtain a PCBA module; The exposed LED circuit board substrate and the heat sink are fixedly installed to obtain a multi-pixel integrated LED module.

2. The method for manufacturing a multi-pixel integrated LED module according to claim 1, characterized in that: When performing layout design, pads corresponding to the electrical polarity pads on the LED circuit board are arranged on the PCBA circuit board.

3. The method for manufacturing a multi-pixel integrated LED module according to claim 1, characterized in that: The step of performing SMT patch processing on the PCB board includes: pasting the control circuit and the 0R connection resistor on the PCB board.

4. The method for manufacturing a multi-pixel integrated LED module according to claim 3, characterized in that: One end of the 0R connection resistor is arranged on the LED circuit board, and the other end is arranged on the PCBA circuit board.

5. The method for manufacturing a multi-pixel integrated LED module according to claim 1, characterized in that: The thickness of the LED circuit board is equal to that of the PCBA circuit board.

6. The method for manufacturing a multi-pixel integrated LED module according to claim 3, characterized in that: The control circuit adopts FR4 multilayer board.

7. A multi-pixel integrated LED module, characterized in that: The multi-pixel integrated LED module is manufactured by the manufacturing method of any one of claims 1 to 6, comprising: a PCB board, a heat sink, a control circuit, and an 0R connection resistor; The heat sink is arranged on one side of the PCB board, and the control circuit, the integrated LED, and the 0R connection resistor are arranged on the other side of the PCB board.

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