AiP packaging assembly

Abstract

The invention discloses an Ai P packaging assembly, relates to the technical field of packaging, and is used for solving the problem that an existing Ai P packaging assembly is easy to cause signal crosstalk. The A P packaging assembly comprises a shell, an antenna radiation structure, a shielding structure, a first chip and a second chip, an accommodating cavity is formed in the shell, the shell comprises a first surface and a second surface arranged oppositely, the antenna radiation structure is arranged close to the first surface, the first chip and the second chip are arranged close to the second surface, and the first chip and the second chip are arranged at an interval; and the shielding structure is arranged in the accommodating cavity and is at least used for shielding electromagnetic interference among the first chip, the second chip and the antenna radiation structure.

Description

Technical Field

[0001] The present application belongs to the field of packaging technology, and in particular, relates to an AiP packaging component. Background Art

[0002] The requirements for array antennas in packaged antenna technology (antenna-in-package, AiP) are: high gain, low profile, high efficiency, broadband (covering the 5G millimeter wave frequency band), easy integration with chips, high consistency of antenna units, and small size.

[0003] At present, there are generally three types of AiP packaging processes: low temperature co-fired ceramic (LTCC), high density interconnector (HDI) and fan outwafer level package (FOWLP). Compared with HDI and FOWLP, LTCC is relatively mature in development. It is the main substrate material in high-performance RF microwave components. It has stable performance, mature manufacturing process, low electromagnetic wave signal loss, and a wide working stability range. LTCC's thermal stability and good thermal conductor help solve the industry's existing AiP products' low thermal stability and insufficient radiation power value.

[0004] The LTCC packaging process can integrate different types of chips and other components into the same package to achieve certain functions of the system, thus becoming an important means to achieve system miniaturization, integration, multi-function and high reliability. However, when the antenna and multiple chips are integrated into one package, the signal is prone to crosstalk, thus affecting communication. Summary of the invention

[0005] The present application provides an AiP packaging component, which is used to solve the problem that existing AiP packaging components are prone to signal crosstalk.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical scheme. The present application provides an AiP packaging component including a shell, an antenna radiation structure, a shielding structure, a first chip and a second chip; a accommodating cavity is formed in the shell, and the shell includes a first surface and an oppositely arranged second surface, the antenna radiation structure is arranged close to the first surface, the first chip and the second chip are arranged close to the second surface, and the first chip and the second chip are arranged at intervals; the shielding structure is arranged in the accommodating cavity, at least for shielding electromagnetic interference between the first chip, the second chip and the antenna radiation structure.

[0007] In the embodiment of the present application, the antenna radiation structure is arranged close to the first surface a, the first chip and the second chip are arranged close to the second surface b, and the first chip and the second chip are arranged at intervals. In this way, it can be ensured that the spacing between the first chip and the antenna radiation structure, the spacing between the second chip and the antenna radiation structure, and the spacing between the first chip and the second chip are all kept relatively far, thereby reducing the occurrence of signal crosstalk. In addition, a shielding structure is arranged in the accommodating cavity, and the shielding structure is at least used to shield the electromagnetic interference between the first chip, the second chip and the antenna radiation structure. In this way, the electromagnetic interference between the first chip and the second chip, the first chip and the antenna radiation structure, the second chip and the antenna radiation structure, and the first chip and the second chip and the antenna radiation structure can all be shielded by the shielding structure, thereby greatly reducing the signal crosstalk in the shell, thereby reducing the occurrence of signal damage, and ensuring that the system performance and system reliability are both better.

[0008] In a possible structural design, the shell includes a multi-layer substrate, and the multi-layer substrate is arranged in the accommodating cavity at intervals along a first direction, and the first direction is a direction from the first surface to the second surface.

[0009] In a possible structural design, the number of layers of the substrate is N, where N is an integer greater than or equal to 12.

[0010] In a possible structural design, the shell also includes multiple layers of metal floors, which are arranged at intervals along a first direction, and any layer of the metal floor is arranged on the substrate. The metal floor is used for signal conduction or heat transfer, and the first direction is the arrangement direction from the first surface to the second surface.

[0011] In a possible structural design, a first groove and a second groove are arranged on the second surface, and the first groove and the second groove are arranged at intervals along a second direction, and the second direction is perpendicular to the first direction; the first chip is arranged in the first groove, and the second chip is arranged in the second groove.

[0012] In a possible structural design, one of the first chip and the second chip is used to transmit and amplify the power of a signal and / or to receive and amplify a signal, and the other is used to adjust the phase and amplitude of the radio frequency signal.

[0013] In a possible structural design, the AiP packaging component also includes a conductive member, which is arranged between the multi-layer substrates and connected to the antenna radiation structure and / or the metal floor for heat conduction, grounding and / or communication.

[0014] In a possible structural design, the conductive element includes a first conductive element, which is connected between the antenna radiation structure and the first chip and is used for signal conduction between the first chip and the antenna radiation structure.

[0015] In a possible structural design, the AiP packaging component also includes a first antenna feed line electrically connected to the first chip, and the first conductive member is connected to the first chip through the first antenna feed line.

[0016] In a possible structural design, the conductive member further includes a second conductive member, the metal floor includes a first metal floor, and the second conductive member is connected between the first metal floor and the second surface for transferring heat of the metal floor to the second surface.

[0017] In a possible structural design, the metal floor includes a second metal floor, and the conductive element further includes a third conductive element. The third conductive element is connected between the second metal floor and the second chip and is used for communication of the second chip.

[0018] In a possible structural design, the metal floor includes a third metal floor electrically connected to the second chip, and the third conductive member is connected to the second chip through the third metal floor.

[0019] In a possible structural design, the shielding structure includes a first shielding structure disposed in the accommodating cavity, and the first shielding structure is disposed between the first chip and the second chip.

[0020] In a possible structural design, the shielding structure includes a second shielding structure, which is disposed between the first chip and the antenna radiation structure and is located on a substrate close to the first chip.

[0021] In a possible structural design, the shielding structure includes a third shielding structure, which is disposed between the second chip and the antenna radiation structure and is located on a substrate close to the second chip.

[0022] In a possible structural design, the shielding structure includes a cylindrical structure or a cubic structure surrounded by a plurality of metal columns, and the plurality of metal columns are connected by feeder lines.

[0023] In a possible structural design, the antenna radiation structure includes a parasitic antenna and a radiating antenna. The parasitic antenna is arranged on the first surface and outside the accommodating cavity, and the radiating antenna is arranged in the accommodating cavity and on the substrate close to the first surface.

[0024] In a possible structural design, one side wall surface of the first chip is electrically connected to the substrate through a lead, and the other side wall surface of the first chip is bonded to another substrate through eutectic welding.

[0025] In a possible structural design, the active surface of the second chip is bonded to the substrate via a first planting ball.

[0026] In a possible structural design, the substrate is a LTCC substrate, an epoxy resin substrate, or a glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1 One of the schematic diagrams of an AiP packaging component provided in an embodiment of the present application;

[0030] Figure 2 A second schematic diagram of an AiP packaging component provided in an embodiment of the present application;

[0031] Figure 3 A third schematic diagram of an AiP packaging component provided in an embodiment of the present application;

[0032] Figure 4 A fourth schematic diagram of an AiP packaging component provided in an embodiment of the present application;

[0033] Figure 5 A fifth schematic diagram of an AiP packaging component provided in an embodiment of the present application;

[0034] Figure 6 One of the schematic diagrams of a top view of a shielding structure provided in an embodiment of the present application;

[0035] Figure 7 A second schematic diagram of a top view structure of a shielding structure provided in an embodiment of the present application;

[0036] Figure 8 One of the top view schematic diagrams of an antenna radiation structure provided in an embodiment of the present application;

[0037] Fig. 9 A second schematic top view of an antenna radiation structure provided in an embodiment of the present application;

[0038] Fig.10 A three-dimensional structural schematic diagram of an antenna radiation structure provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0040] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0042] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] AiP packaging is a packaging technology that integrates antennas with circuits. AiP packaging can integrate antennas and RF components such as transceivers in the same package, and antennas are no longer required as independent components in wireless devices. This integration method significantly improves the integration and space utilization of the device. In addition, AiP packaging can optimize antenna performance, such as increasing antenna gain and reducing antenna noise. At the same time, AiP packaging also helps reduce signal attenuation and improve signal integrity and power integrity. In addition, AiP packaging enables antennas and RF components to be tightly integrated together, thereby greatly reducing the size of wireless devices.

[0044] However, due to the high packaging density of components (e.g., antenna radiation structure, and chip) in the AiP package, the pin spacing is reduced, which increases the possibility of capacitive and inductive coupling, thereby exacerbating the crosstalk problem. The aggravation of the crosstalk problem will bring many adverse effects.

[0045] First, crosstalk can cause signal quality to be impaired. Crosstalk can cause signal distortion during transmission, thus affecting signal quality. Specifically, crosstalk can cause changes in signal parameters such as amplitude, phase, and frequency, making it impossible for the signal to be accurately and completely transmitted to the receiving end. This degradation in signal quality may cause data transmission errors and even cause the system to malfunction.

[0046] Second, crosstalk can cause system performance degradation. In high-speed data transmission and signal processing applications, crosstalk can limit the system's bandwidth and transmission rate. When crosstalk is severe, system performance may be significantly degraded and fail to meet design requirements and application needs.

[0047] Third, crosstalk will lead to increased power consumption. When a signal is interfered with during transmission, additional energy may be required to overcome this interference and maintain stable signal transmission. This will not only increase the energy consumption of the system, but may also have an adverse effect on the heat dissipation and stability of the system.

[0048] Fourth, crosstalk can lead to reduced system reliability. When the signal is interfered with, the stability of the system may be affected, increasing the risk of system failure. This may reduce the reliability and availability of the system and have a negative impact on the user experience.

[0049] Based on this, an embodiment of the present application provides an AiP packaging component, which can reduce the occurrence of signal crosstalk within the packaging component, thereby avoiding damage to signal quality and ensuring better system performance and system reliability.

[0050] Figure 1 An AiP package component provided by an embodiment of the present application is shown, and the AiP package component includes a housing 100, an antenna radiation structure 200, a shielding structure 300, a first chip 400, and a second chip 500. The antenna radiation structure 200 can be used for transmitting or receiving signals.

[0051] Among them, a receiving cavity 1001 is formed in the shell 100, and the shell 100 includes a first surface 100a and a second surface 100b, the first surface 100a and the second surface 100b are arranged opposite to each other, the antenna radiation structure 200 is arranged close to the first surface 100a, the first chip 400 and the second chip 500 are arranged close to the second surface 100b, and the first chip 400 and the second chip 500 are arranged at intervals. A plurality of second planting balls 600 can be arranged on the second surface 100b, and the second planting balls 600 can be used to connect to a heat sink. Exemplarily, the second planting balls 600 can be solder paste printing planting balls, ball placement planting balls, laser planting balls, etc., which is not limited in this application.

[0052] Specifically, the housing 100 may include a first direction (ie Figure 1The first surface 100a and the second surface 100b are spaced apart from each other (in the X-axis direction), and a receiving cavity 1001 is formed between the first surface 100a and the second surface 100b. The antenna radiation structure 200 is disposed close to the first surface 100a, and the first chip 400 and the second chip 500 are both disposed close to the second surface 100b. In addition, the first chip 400 and the second chip 500 can be disposed along the second direction (i.e. Figure 1 The second direction may be a direction perpendicular to the first direction, or a direction nearly perpendicular to the first direction. For example, the angle between the first direction and the second direction may be 70-110 degrees, which is not limited in the present application.

[0053] In this way, the first chip 400, the second chip 500 and the antenna radiation structure 200 are arranged in a triangle on the shell 100, so that the distance between the first chip 400 and the antenna radiation structure 200, the distance between the second chip 500 and the antenna radiation structure 200, and the distance between the first chip 400 and the second chip 500 can be kept relatively far, thereby reducing signal crosstalk.

[0054] In addition, the shielding structure 300 is disposed in the accommodating cavity 1001, and the shielding structure 300 is at least used to shield the electromagnetic interference between the first chip 400, the second chip 500 and the antenna radiation structure 200. Specifically, the shielding structure 300 is at least used to shield the electromagnetic interference between the first chip 400 and the second chip 500, the first chip 400 and the antenna radiation structure 200, the second chip 500 and the antenna radiation structure 200, and the first chip 400, the second chip 500 and the antenna radiation structure 200.

[0055] In this way, the embodiment of the present application arranges the antenna radiation structure 200 close to the first surface 100a, the first chip 400 and the second chip 500 are arranged close to the second surface 100b, and the first chip 400 and the second chip 500 are arranged at intervals, so that the spacing between the first chip 400 and the antenna radiation structure 200, the second chip 500 and the antenna radiation structure 200, and the first chip 400 and the second chip 500 are kept relatively far apart, thereby reducing the occurrence of signal crosstalk. In addition, the shielding structure 300 is arranged in the accommodating cavity 1001, and the shielding structure 300 is at least used to shield the electromagnetic interference between the first chip 400, the second chip 500 and the antenna radiation structure 200. In this way, the electromagnetic interference between the first chip 400 and the second chip 500, the first chip 400 and the antenna radiation structure 200, the second chip 500 and the antenna radiation structure 200, and the first chip 400 and the second chip 500 and the antenna radiation structure 200 can all be shielded by the shielding structure 300, thereby greatly reducing the signal crosstalk in the shell 100, thereby reducing the occurrence of signal damage and ensuring that the system performance and system reliability are better.

[0056] In some embodiments of the present application, the housing 100 includes a multi-layer substrate 101, which can be arranged in a first direction in an accommodating cavity 1001 at intervals, and the first direction is the arrangement direction of the first surface 100a and the second surface 100b. A feed line can be arranged on the substrate 101, the antenna radiation structure 200 can be arranged on the substrate 101 close to the first surface 100a, and the antenna radiation structure 200 and the first chip 400 can be connected through the feed lines on each layer of the substrate 101.

[0057] In addition, the multilayer substrate 101 can divide the accommodating cavity 1001 into a plurality of chambers, and a plurality of components can be respectively disposed in the plurality of chambers and connected to the substrate 101. Exemplarily, the plurality of components can include inductors, capacitors, power amplifiers, oscillators, signal sources, etc., which are not limited in the present application.

[0058] In a possible structural design, the number of layers of the multilayer substrate 101 described above is N, where N is an integer greater than or equal to 12. Exemplarily, the value of N can be 12, 13, 14, 15, 16, etc., which is not limited in this application.

[0059] Since the number of layers of the substrate 101 is related to the distribution of feeder lines on each layer of the substrate 101, if the number of layers of the substrate 101 is too small, wiring will be difficult. The embodiment of the present application limits the number of layers of the substrate 101 to be greater than or equal to 12, thereby facilitating the layout of lines in the housing 100.

[0060] Since the number of layers of the substrate 101 is related to the distribution of feeder lines on each layer of the substrate 101, if the number of layers of the substrate 101 is too small, it will make wiring difficult; if the number of layers of the substrate 101 is too large, it will waste materials and be unfavorable for packaging miniaturization. Therefore, in a possible structural design, the housing 100 may include 20 layers of substrates 101.

[0061] In some embodiments of the present application, the housing 100 further includes a multi-layer metal floor 102, which is arranged at intervals along a first direction, and any layer of the metal floor 102 is disposed on the substrate 101, and the first direction is the arrangement direction from the first surface 100a to the second surface 100b. The metal floor 102 is used for signal conduction or heat transfer, and specifically, the metal floor 102 can transfer the heat emitted by components (i.e., including the chips, inductors, capacitors, power amplifiers, oscillators, signal sources, etc. described above), or the metal floor 102 can transfer signals, that is, the metal floor 102 is used to connect multiple components for communication.

[0062] For example, Figure 1As shown, when the number of layers of the substrate 101 is 12, a metal floor 102 may be provided between every three layers of the substrate 101 in the housing 100 , and a stripline feeding structure may be provided on the metal floor 102 .

[0063] Optionally, the material of the metal floor 102 may be an alloy. Optionally, the material of the metal floor 102 may also be pure metal, which is not limited in the present application.

[0064] In this way, multiple components can achieve signal transmission through the metal floor 102, thereby ensuring better internal transmission performance of the AiP package assembly. In addition, when a component in the accommodating cavity 1001 is seriously heated, the heating element can transfer the heat to other locations through the metal floor 102 to avoid heat concentration in the component's surroundings, which will reduce the component's service life or even damage it due to high temperature.

[0065] In some embodiments of the present application, a first groove and a second groove are provided on the second surface 100b, and the first groove and the second groove are spaced apart along a second direction, and the second direction is perpendicular to the first direction. The first chip 400 is provided in the first groove, and the second chip 500 is provided in the second groove. In this way, by providing the first chip 400 and the second chip 500 in two spaced apart grooves, the electromagnetic interference between the first chip 400 and the second chip 500 can be reduced.

[0066] In a possible structural design, one of the first chip 400 and the second chip 500 is used to transmit and amplify the power of the signal and / or to receive and amplify the signal, and the other is used to adjust the phase and amplitude of the radio frequency signal. Specifically, one of the first chip 400 and the second chip 500 is used to transmit and amplify the power of the signal and / or to receive and amplify the signal while minimizing the introduction of noise, and the other is used to adjust the phase and amplitude of the radio frequency signal.

[0067] Optionally, the first chip 400 is used to transmit and amplify the power of a signal and / or to receive and amplify a signal, and to reduce the introduction of noise, and the second chip 500 is used to adjust the phase and amplitude of the radio frequency signal.

[0068] Optionally, the second chip 500 is used to transmit and amplify the power of the signal and / or to receive and amplify the signal, and reduce the introduction of noise, and the first chip 400 is used to adjust the phase and amplitude of the radio frequency signal. This application does not limit this.

[0069] For the convenience of description, the embodiment of the present application is described by taking the example that the first chip 400 is used to transmit and amplify the power of the signal and / or to receive and amplify the signal, and reduce the introduction of noise, and the second chip 500 is used to adjust the phase and amplitude of the RF signal.

[0070] In a possible structural design, a substrate 101 may be provided on the bottom surface of the first groove, a first chip 400 is provided in the first groove, a first side surface 400a of the first chip 400 is bonded to the substrate 101 by eutectic welding, and a second side surface 400b of the first chip 400 is electrically connected to another substrate 101 by a lead 401, the second side surface is the surface of the first chip 400 facing away from the bottom surface of the first groove, and the first side surface is the surface of the first chip 400 close to (facing) the bottom surface of the first groove.

[0071] Specifically, one end of the lead 401 is connected to the second side surface of the first chip 400, and the other end of the lead 401 is connected to the antenna feeder of another substrate 101. Preferably, the lead 401 is a gold wire, so that the lead 401 has good conductivity and stable chemical stability.

[0072] In a possible structural design, the bottom surface of the second groove may also be provided with a substrate 101. The substrate 101 at the bottom surface of the second groove and the substrate 101 at the bottom surface of the first groove may be the same substrate 101 or different substrates 101, and the present application does not limit this.

[0073] The second chip 500 is disposed in the second groove, and the active surface of the second chip 500 can be bonded to the substrate 101 through the first planting ball 501. The first planting ball 501 can also be solder paste printing planting ball, ball placement planting ball and laser planting ball, etc., which is not limited in this application.

[0074] Specifically, the active surface of the second chip 500 is welded to the substrate 101 through the first planting balls 501 arranged in an array to achieve the connection between the second chip 500 and the substrate 101. The side of the second chip 500 facing away from the active surface can be connected to a heat sink. In this way, the heat of the second chip 500 can be dissipated through the heat sink, thereby improving the heat dissipation performance of the second chip 500.

[0075] The second chip 500 can be mounted on the substrate 101 by flip-chip welding technology, and the second chip 500 can lead out input and output pins from the silicon wafer to the surroundings, and is electrically connected to the substrate 101 through the input and output pins. In this way, the AiP package component has the advantages of small size, strong performance, good heat dissipation, etc. At the same time, because the connection length between the second chip 500 and the substrate 101 is greatly shortened, the signal delay between components is reduced, and the transmission performance is effectively improved.

[0076] In a possible structural design, the first chip 400 is a compound chip, and the substrate 101 material of the compound-based process is generally an insulating material, and the radio frequency signal loss is small. The production process of the first chip 400 may include GaN HEMT process, GaAs pHEMT process and InP DHBT process.

[0077] Specifically, the first chip 400 is a compound RF front-end chip. For example, the first chip 400 is a low noise amplifier (LNA), which is used to receive and amplify signals while minimizing the introduction of noise. For example, the first chip 400 is a power amplifier (PA), which is used to transmit and amplify the power of the signal; the LNA or PA is installed in the first groove on the LTCC substrate through back eutectic welding and front gold wire bonding, and is fed into the antenna radiation structure 200 through the first conductive member (refer to the description below) to ensure low insertion loss.

[0078] In a possible structural design, the second chip 500 can be a silicon-based chip, and the substrate 101 material of the silicon-based chip can be a semi-insulator, and the RF signal loss is relatively large. Optionally, the process of the second chip 500 can include CMOSRF process, GeSi BiCMOS process, SOI RFIC process and other processes.

[0079] For example, the second chip 500 is a silicon-based beamforming chip; if the first chip 400 is an LNA, the second chip 500 can be used to adjust the phase and amplitude of the signal in the circuit and for combining the signal channel; if the first chip 400 is a PA, the second chip 500 can be used to adjust the phase and amplitude of the signal in the circuit and for branching the signal channel.

[0080] The substrate 101 described above may be a LTCC substrate, an epoxy resin substrate, or a glass substrate, etc., and this application does not limit this. The substrate 101 of the embodiment of this application is described by taking a LTCC substrate as an example. The LTCC multilayer circuit substrate can integrate passive devices such as resistors, capacitors, inductors, and chips of various materials into the multilayer substrate 101. The LTCC substrate has the following characteristics:

[0081] (1) LTCC substrates are easy to integrate passive devices. There are two main ways to integrate passive devices on LTCC substrates: one is to directly build resistor, capacitor and inductor functional circuits based on the material properties of LTCC and the characteristics of multilayer boards; the other is to dig grooves in some layers of the multilayer dielectric layer to form a cavity, and implant capacitors, inductors, resistors, passive semiconductor devices, passive chips and other components in the cavity to achieve the integration of passive devices.

[0082] (2) LTCC substrates are suitable for high-density and high-quality wiring. LTCC substrates support wiring with a line width of about 50μm and multi-layer connection holes with a diameter of 75μm, which are suitable for high-density, high-quality, high-current value and other wiring designs. High-density and high-precision connection holes and metal plating processes are suitable for making ideal electromagnetic shielding layers or electromagnetic reference grounds, and have significant improvements in antenna design requirements such as the RF signal feeder of the antenna unit, the electromagnetic isolation between antenna units, and the isolation of dual-polarized antenna feeds. Precision wiring and excellent controllable electromagnetic shielding design help to increase the system's packaging density and reduce the size and volume of the system.

[0083] (3) Good electrical sealing. The hot pressing and sintering of the LTCC substrate is conducive to the formation of highly reliable airtightness, which is crucial for protecting the metal properties of the components and wiring inside the LTCC. The advanced LTCC multi-layer substrate 101 process supports the internal thermal microfluidic hole design, which is conducive to providing the upper limit of the power consumption density of the LTCC module, which is manifested in supporting higher radiation power density in the RF millimeter wave module.

[0084] (4) LTCC substrates have good high-frequency characteristics and support adjusting the dielectric constant of the dielectric material used in the package according to different application scenarios; the excellent dielectric constant of ceramic materials supports better antenna resonant cavities, which is conducive to expanding the antenna operating bandwidth or improving radiation efficiency.

[0085] (5) The thermal stability and thermal conductivity of the LTCC substrate are relatively good. Thermal stability is conducive to maintaining the loss stability of RF signal propagation in the LTCC substrate and avoiding the stress distortion characteristics of thermal expansion and contraction, which is crucial to the performance stability of the antenna; excellent thermal propagation characteristics are conducive to the heat dissipation of internal active devices. Active array antennas made based on LTCC substrates support higher power consumption density, which is conducive to using higher power amplifiers to achieve higher radiation power of the antenna.

[0086] In some embodiments of the present application, the AiP packaging component also includes a conductive member 700, which can be arranged between the multi-layer substrate 101, and the conductive member 700 is connected to the antenna radiation structure 200 and / or the metal floor 102 for heat conduction, grounding and / or communication.

[0087] Among them, the conductive part 700 may include a body, an insulating part and a conductive part. Among them, an opening may be provided inside the conductive part 700, a circle of insulating part may be provided along the inner surface of the opening, and the conductive part is provided inside the insulating part. In this way, the outer (body) part of the conductive part 700 can be used for heat conduction, and the inside of the conductive part 700 can be used for grounding and / or communication connection. In this way, the conductive part 700 can integrate the functions of heat conduction and electrical conduction, which is conducive to facilitating the internal layout design of the AiP packaging component.

[0088] Exemplarily, the material of the body may be silicon. As a semiconductor material, silicon does not have good electrical conductivity, but silicon has good thermal conductivity, thereby achieving heat conduction.

[0089] Exemplarily, the material of the insulating part can be ceramic, rubber, glass, plastic, etc., which is not limited in the present application. The material of the conductive part can be metal material, such as silver, copper, gold, aluminum, etc., and the material of the conductive part can also be alloy, graphite, carbon fiber, superconducting material, etc., which is not limited in the present application.

[0090] In some embodiments, the conductive member 700 includes a first conductive member 701, which is connected between the antenna radiation structure 200 and the first chip 400, and is used for signal conduction between the first chip 400 and the antenna radiation structure 200. Specifically, the first conductive member 701 can be vertically disposed between the antenna radiation structure 200 and the first antenna feeder connected to the first chip 400, and the first conductive member 701 can pass through the antenna radiation structure 200 and the substrate 101 between the first chip 400 to conduct the signal between the first chip 400 and the antenna radiation structure 200.

[0091] In this way, the signal output by the first chip 400 is transmitted to the antenna radiation structure 200 through the first conductive member 701 to be transmitted, or the signal received by the antenna radiation structure 200 can be transmitted to the first chip 400 through the first conductive member 701 .

[0092] Alternatively, if Figure 2 As shown, the first conductive member 701 can be an integrated structure, one end of the first conductive member 701 is connected to the first antenna feeder connected to the first chip 400, and the other end is connected to the antenna radiation structure 200, and the first conductive member 701 is not connected to the metal floor 102. In this way, since the first conductive member 701 is an integrated structure, when the first conductive member 701 is connected to the first chip 400 and the antenna radiation structure 200, fewer processing steps are required, thereby improving production efficiency.

[0093] Alternatively, if Figure 3 As shown, the first conductive member 701 may also include a plurality of conductive segments staggeredly distributed in the housing 100, and the plurality of conductive segments are not directly connected. Any conductive segment may include the body, insulating portion, and conductive portion described above. In this way, signal conduction between the antenna radiation structure 200 and the first chip 400 is achieved through a plurality of conductive segments.

[0094] Specifically, the plurality of conductive segments can be respectively arranged between the antenna radiation structure 200 and the metal floor 102, between the metal floor 102 and the metal floor 102, and between the metal floor 102 and the first antenna feeder from top to bottom. It should be noted that the metal floor 102 directly connected to any conductive segment in the first conductive member 701 is not connected to other metal floors 102 on the same layer, otherwise it will cause a short circuit in the housing 100. Similarly, the plurality of conductive segments included in the first conductive member 701 can be vertically arranged between the antenna radiation structure 200 and the metal floor 102, between the metal floor 102 and the metal floor 102, and between the metal floor 102 and the first antenna feeder.

[0095] In other embodiments, the conductive member 700 further includes a second conductive member 702, the metal floor 102 includes a first metal floor 1021, and the second conductive member 702 is connected between the first metal floor 1021 and the second surface 100b, and is used to transfer the heat of the first metal floor 1021 to the second surface 100b. Among them, the heating device can be thermally conductive with the first metal floor 1021, and the heating device can be a component with high heat generation, such as a capacitor, an inductor, an oscillator, a signal source, etc., which is not limited in this application. In this way, the heat of the heating device can be transferred to the first metal floor 1021, and the heat can be transferred to the second surface 100b through the second conductive member 702. Since the second surface 100b is in contact with the external air, the heat can be dissipated.

[0096] The second conductive member 702 may include the body, insulating portion and conductive portion described above. The opening on the body of the second conductive member 702 may be a blind hole. In this way, the second conductive member 702 may not only be used for heat dissipation in the housing 100, but also for interconnecting the outer surface of the housing 100 with the internal circuit.

[0097] In some other embodiments, the metal floor 102 further includes a second metal floor 1022 and a third metal floor 1023, and the third metal floor 1022 is electrically connected to the second chip 500. The conductive member 700 further includes a third conductive member 703, and the third conductive member 703 is connected between the second metal floor 1022 and the second chip 500, and the third conductive member 703 is used for communication of the second chip 500. A first end of the third conductive member 703 is connected to the second metal floor 1022, and a second end of the third conductive member 703 is connected to the third metal floor 1023 connected to the second chip 500, and is used for communication of the second chip 500. Specifically, the opening of the third conductive member 703 may be a buried hole, and the third conductive member 703 may also be vertically connected between the second metal floor 1022 and the third metal floor 1023.

[0098] Optionally, the through-hole structure in the AiP package assembly may include one, two, or three of the first conductive member 701 , the second conductive member 702 , and the third conductive member 703 .

[0099] In some embodiments of the present application, the shielding structure 300 includes a first shielding structure 301 disposed in the accommodating cavity 1001, the first shielding structure 301 is disposed between the first chip 400 and the second chip 500, at least one end of the first shielding structure 301 is connected to the first surface 100a of the housing 100, and the other end of the first shielding structure 301 can be connected to any metal floor 102. In this way, the first shielding structure 301 can shield the electromagnetic interference between the first chip 400 and the second chip 500.

[0100] Furthermore, if Figure 1-Figure 5 As shown, the shielding structure 300 in the housing 100 includes a second shielding structure 302 . The second shielding structure 302 is disposed between the first chip 400 and the antenna radiation structure 200 and is located on the substrate 101 close to the first chip 400 .

[0101] Specifically, the second shielding structure 302 may include a plurality of second shielding bodies that are spaced apart from each other. For example, the number of the second shielding bodies may be 3, 4, 5, 6, 7 or 8, which is not limited in the present application.

[0102] In addition, the widths between the multiple second shielding bodies can be equidistant or unequal, and this application does not limit this. It should be noted that the lateral width (i.e., the length in the second direction) of the second shielding structure 302 needs to fully cover the length of the first chip 400. In this way, the second shielding structure 302 can completely shield the electromagnetic interference between the first chip 400 and the antenna radiation structure 200.

[0103] Furthermore, if Figure 1-Figure 5 As shown, the shielding structure 300 in the housing 100 may further include a third shielding structure 303 . The third shielding structure 303 is disposed between the second chip 500 and the antenna radiation structure 200 and is located on the substrate 101 close to the second chip 500 .

[0104] Specifically, the third shielding structure 303 can be disposed on any number of substrates 101 above the second chip 500. Specifically, the third shielding structure 303 is disposed on a three-layer substrate 101 above the second chip 500, or the third shielding structure 303 is disposed on a four-layer substrate 101 above the second chip 500. In this way, there is a gap between the third shielding structure 303 and the second chip 500, thereby facilitating the connection between the first planting ball and the components inside the housing 100.

[0105] Meanwhile, the third shielding structure 303 includes at least five third shielding bodies that may be arranged at intervals. The widths between the plurality of third shielding bodies may be equidistant or unequal, which is not limited in the present application.

[0106] Optionally, the shielding structure 300 in the AiP package assembly may include one, two or three of the first shielding structure 301, the second shielding structure 302 and the third shielding structure 303. It can be understood that in the embodiment where the shielding structure 300 in the AiP package assembly includes the first shielding structure 301, the second shielding structure 302 and the third shielding structure 303 at the same time, the electromagnetic interference between the first chip 400, the second chip 500 and the antenna radiation structure 200 is minimal.

[0107] Specifically, Figure 6 and Figure 7 As shown, the shielding structure 300 includes a cylindrical structure or a cubic structure surrounded by a plurality of metal pillars 3011, and each metal pillar 3011 is connected by a feeder line. Figure 6 As shown, the first shielding structure 301 includes a plurality of metal pillars 3011, which form a cylindrical structure, and each metal pillar 3011 is connected by a feeder line. Figure 7 As shown, the first shielding structure 301 includes a plurality of metal pillars 3011, which form a cubic structure, and each metal pillar 3011 is connected by a feeder. Similarly, the specific structures of the second shielding structure 302 and the third shielding structure 303 can be referred to. Figure 6 and Figure 7 , which will not be elaborated here.

[0108] Furthermore, the size of the shielding structure 300 directly affects the shielding performance. Preferably, the shielding structure 300 includes 6, 7 or 8 metal pillars 3011. Specifically, the first shielding structure 301 includes 6, 7 or 8 metal pillars 3011; the second shielding structure 302 includes at least three second shielding bodies arranged at intervals, each of which may include 6, 7 or 8 metal pillars 3011; the third shielding structure 303 includes at least five third shielding bodies arranged at intervals, each of which may include 6, 7 or 8 metal pillars 3011. The number of metal pillars 3011 may be set according to the diameter of the metal pillars 3011 and the spacing between the metal pillars 3011 and the metal pillars 3011, which is not limited in the present application.

[0109] like Figure 4As shown, the antenna radiation structure 200 includes a parasitic antenna 201 and a radiating antenna 202. The parasitic antenna 201 can be arranged on the first surface 100a of the housing 100 and outside the receiving cavity 1001. The radiating antenna 202 is arranged in the receiving cavity 1001 and on the substrate 101 close to the first surface 100a.

[0110] Specifically, the radiating antenna 202 may be disposed in an opening window of one or more metal floors 102 near the first surface 100a of the housing 100. For example, the parasitic antenna 201 is disposed on the first surface 100a of the housing 100, and the radiating antenna 202 is disposed in an opening window of a first metal floor 102A near the first surface 100a of the housing 100, wherein the first metal floor 102A has at least two substrates 101 in a direction near the first surface 100a of the housing 100; for example, the parasitic antenna 201 is disposed on the first surface 100a of the housing 100, and the radiating antenna 202 may be disposed in an opening window of a first metal floor 102A and a second metal floor 102B near the first surface 100a of the housing 100, wherein the first metal floor 102A has at least two substrates 101 in a direction near the first surface 100a of the housing 100, and there are at least two substrates 101 between the first metal floor 102A and the second metal floor 102B.

[0111] Specifically, the parasitic antenna 201 may be an antenna structure of different shapes, and the shape of the parasitic antenna 201 is a regularly arranged square, circle or rectangle. Figure 8 As shown, the parasitic antenna 201 includes a plurality of first radiation structures 2011, and the plurality of first radiation structures 2011 are regularly arranged squares and are disposed on the first surface 100a of the housing 100; for example, Fig. 9 As shown, the radiating antenna 202 includes a plurality of second radiating structures 2012 . The plurality of second radiating structures 2012 are regularly arranged in circles and are disposed on the first surface 100 a of the housing 100 .

[0112] In one embodiment, if Fig.10As shown, the radiating antenna 202 includes a microstrip patch antenna, which is relatively simple in form. Its basic construction method is to weld a metal patch and cover it on a substrate 101 with a metal floor 102; usually, the metal patch is printed with gold, silver or copper; specifically, multiple feeding terminals can be set on each metal patch for connecting to different components, so that the signal received or transmitted by the antenna has a phase difference; for example, for a dual-polarization multi-channel phased array architecture, each metal patch has two feeding terminals with a phase difference, and each feeding terminal is connected to a different signal link, so that the signal transmitted or received by the antenna has a phase difference; by simultaneously adjusting the phase of the transmitting and receiving signal links, the optimal radiation direction jump of the AiP antenna can be achieved, and the continuous optimal radiation direction jump can cover the target area, thereby achieving sector coverage.

[0113] In some embodiments of the present application, Figure 5 As shown, the AiP package assembly further includes a PCB board 800 , and the PCB board 800 is interconnected with the PCB board 800 through a plurality of second implant balls 600 on the second surface 100 b of the housing 100 .

[0114] In this way, the AiP package component can also be interconnected with the PCB board 800 of the peripheral device through the multiple second planting balls 600 on the second surface 100b.

[0115] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An AiP packaging component, characterized in that: It includes a housing, an antenna radiation structure, a shielding structure, a first chip and a second chip; A receiving cavity is formed in the housing, and the housing includes a first surface and a second surface arranged opposite to the first surface, the antenna radiation structure is arranged close to the first surface, the first chip and the second chip are arranged close to the second surface, and the first chip and the second chip are arranged at intervals; The shielding structure is disposed in the accommodating cavity, and is at least used to shield electromagnetic interference between the first chip, the second chip and the antenna radiation structure.

2. The AiP package assembly according to claim 1, characterized in that: The housing includes a multi-layer substrate, which is arranged in the accommodating cavity at intervals along a first direction, and the first direction is an arrangement direction of the first surface and the second surface.

3. The AiP package assembly according to claim 2, characterized in that: The number of layers of the substrate is N, where N is an integer greater than or equal to 12.

4. The AiP packaging component according to claim 3, characterized in that: The shell also includes multiple layers of metal floors, which are arranged at intervals along a first direction, and any layer of the metal floors is set on the substrate. The metal floors are used for signal conduction or heat transfer, and the first direction is the arrangement direction from the first surface to the second surface.

5. The AiP packaging component according to any one of claims 2 to 4, characterized in that: The second surface is provided with a first groove and a second groove, the first groove and the second groove are arranged at intervals along a second direction, and the second direction is perpendicular to the first direction; the first chip is arranged in the first groove, and the second chip is arranged in the second groove.

6. The AiP package assembly according to any one of claims 1 to 4, characterized in that: One of the first chip and the second chip is used for transmitting and amplifying the power of a signal and / or for receiving and amplifying a signal, and the other is used for adjusting the phase and amplitude of a radio frequency signal.

7. The AiP package assembly according to claim 4, characterized in that: It also includes a conductive member, which is arranged between the multi-layer substrates and connected to the antenna radiation structure and / or the metal floor for heat conduction, grounding and / or communication.

8. The AiP package assembly according to claim 7, characterized in that: The conductive element includes a first conductive element, which is connected between the antenna radiation structure and the first chip and is used for signal conduction between the first chip and the antenna radiation structure.

9. The AiP package assembly according to claim 8, characterized in that: It also includes a first antenna feed line electrically connected to the first chip, and the first conductive element is connected to the first chip through the first antenna feed line.

10. The AiP package assembly according to claim 7, characterized in that: The conductive member further includes a second conductive member, the metal floor includes a first metal floor, and the second conductive member is connected between the first metal floor and the second surface and is used to transfer heat of the first metal floor to the second surface.

11. The AiP package assembly according to claim 7, characterized in that: The metal floor includes a second metal floor, and the conductive member further includes a third conductive member. The third conductive member is connected between the second metal floor and the second chip and is used for communication of the second chip.

12. The AiP package assembly according to claim 11, characterized in that: The metal floor includes a third metal floor electrically connected to the second chip, and the third conductive member is connected to the second chip through the third metal floor.

13. The AiP package assembly according to any one of claims 1 to 4, characterized in that: The shielding structure includes a first shielding structure disposed in the accommodating cavity, and the first shielding structure is disposed between the first chip and the second chip.

14. The AiP package assembly according to any one of claims 1 to 4, characterized in that: The shielding structure includes a second shielding structure, which is disposed between the first chip and the antenna radiation structure and is located on a substrate close to the first chip.

15. The AiP package assembly according to any one of claims 1 to 4, characterized in that: The shielding structure includes a third shielding structure, which is disposed between the second chip and the antenna radiation structure and is located on a substrate close to the second chip.

16. The AiP package assembly according to any one of claims 1 to 4, characterized in that: The shielding structure includes a cylindrical structure or a cubic structure surrounded by a plurality of metal columns, and the plurality of metal columns are connected by feeder lines.

17. The AiP package assembly according to any one of claims 2 to 4, characterized in that: The antenna radiation structure includes a parasitic antenna and a radiating antenna. The parasitic antenna is arranged on the first surface and outside the accommodating cavity. The radiating antenna is arranged in the accommodating cavity and on a substrate close to the first surface.

18. The AiP package assembly according to any one of claims 2 to 4, characterized in that: One side wall surface of the first chip is electrically connected to the substrate through a lead, and the other side wall surface of the first chip is bonded to another substrate through eutectic welding.

19. The AiP package assembly according to any one of claims 2 to 4, characterized in that: The active surface of the second chip is bonded to the substrate via a first planting ball.

20. The AiP package assembly according to any one of claims 2 to 4, characterized in that: The substrate is a LTCC substrate, an epoxy resin substrate or a glass substrate.

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