Anti-static circuit board and method for manufacturing anti-static circuit board

Abstract

A manufacturing method of an anti-static circuit board comprises the following steps that an anti-static dielectric layer is pressed on at least one side of a circuit substrate to form a pressing structure, and the anti-static dielectric layer comprises an anti-static glass fiber layer and dielectric layers combined on the two opposite sides of the anti-static glass fiber layer; the circuit substrate is combined with the anti-static glass fiber layer through the inner dielectric layer; and at least adding a layer on one side, deviating from the circuit substrate, of the anti-static dielectric layer of the press-fit structure to form an outer circuit structure. The manufacturing method of the anti-static circuit board is beneficial to prolonging the service life of the circuit board. The invention further provides an anti-static circuit board.

Description

Technical Field

[0001] The present application relates to the field of circuit boards, and in particular to an antistatic circuit board and a method for manufacturing an antistatic circuit board. Background Art

[0002] Static electricity is a serious hazard to electronic devices. It can absorb dust and reduce the insulation resistance of components, thus shortening the life of components. Furthermore, static discharge can cause devices (such as crystals) to break down and cause permanent damage. At the same time, static discharge can generate electromagnetic pulses, causing circuit errors. Summary of the invention

[0003] In view of this, it is necessary to provide a method for manufacturing an antistatic circuit board that solves the above problems. In addition, an antistatic circuit board is also provided.

[0004] The first aspect of the present application provides a method for manufacturing an antistatic circuit board, which includes the following steps: laminating an antistatic dielectric layer on at least one side of a circuit substrate to form a laminated structure, the antistatic dielectric layer including an antistatic glass fiber layer and a dielectric layer combined with opposite sides of the antistatic glass fiber layer, the circuit substrate is combined with the antistatic glass fiber layer through the inner dielectric layer; and adding a layer on at least one side of the antistatic dielectric layer of the laminated structure away from the circuit substrate to form an outer circuit structure.

[0005] Based on the first aspect, in a possible implementation method, the formation of the antistatic dielectric layer includes: spraying or coating an antistatic substance on the glass fiber layer and drying and curing it to obtain an antistatic glass fiber layer; and arranging a dielectric material on opposite sides of the antistatic glass fiber layer and curing it to form an inner dielectric layer combined with the antistatic glass fiber layer.

[0006] Based on the first aspect, in a possible implementation method, the step of laminating the antistatic dielectric layer to at least one side of the circuit substrate to form the laminating structure specifically includes: setting a window penetrating the circuit substrate along the thickness direction of a circuit substrate, the circuit substrate including a first inner circuit layer, an inner dielectric layer and a second inner circuit layer stacked in sequence along the thickness direction; affixing a release film on a side of the second inner circuit layer away from the first inner circuit layer; placing electronic components on the window and supported by the release film; laminating an antistatic dielectric layer on a side of the circuit substrate away from the release film and then peeling off the release film; laminating another antistatic dielectric layer on the circuit substrate, so that the two antistatic dielectric layers are located on opposite sides of the circuit substrate.

[0007] Based on the first aspect, in a possible implementation, the formation of the outer circuit structure includes: laminating a first single-sided board on the side of the antistatic dielectric layer of the lamination structure away from the circuit substrate, the first single-sided board including a stacked first dielectric layer and a first metal foil, the first dielectric layer bonding the first metal foil and the antistatic dielectric layer; and performing circuit production on the first single-sided board so that the first metal foil forms a corresponding outer circuit layer.

[0008] Based on the first aspect, in a possible implementation, the formation of the outer circuit structure also includes: laminating an outer antistatic dielectric layer on the side of the outer circuit layer away from the laminating structure, the outer antistatic dielectric layer includes an outer antistatic glass fiber layer and a second dielectric layer combined with the outer antistatic glass fiber layer on opposite sides, the laminating structure is combined with the outer antistatic glass fiber layer through the second dielectric layer; laminating a second single-sided board on the side of the outer antistatic dielectric layer away from the laminating structure, the second single-sided board includes a stacked third dielectric layer and a second metal foil, the third dielectric layer is bonded between the second metal foil and the antistatic dielectric layer; and performing circuit production on the second single-sided board so that the second metal foil forms another outer circuit layer correspondingly.

[0009] Based on the first aspect, in a possible implementation, the antistatic substance includes at least one of a phosphate antistatic agent, an inorganic semiconductor salt, carbon black and sodium cellulose sulfate, the phosphate antistatic agent includes at least one of an amide phosphate ester and an alkyl phosphate salt, and the inorganic semiconductor salt includes at least one of a cuprous halide and a silver halide.

[0010] Based on the first aspect, in a possible implementation manner, in any direction perpendicular to the thickness direction, an edge of each antistatic dielectric layer exceeds an edge of the electronic component.

[0011] The second aspect of the present application provides an antistatic circuit board, comprising an outer circuit structure, an antistatic dielectric layer and a circuit substrate stacked in sequence along the thickness direction, the antistatic dielectric layer comprising an antistatic glass fiber layer and an inner dielectric layer combined on opposite sides of the antistatic glass fiber layer in the thickness direction.

[0012] Based on the second aspect, in a possible implementation, the outer circuit structure includes at least two outer circuit layers and an outer dielectric layer combined with the outer circuit layers, and the outer circuit structure also includes at least one antistatic glass fiber layer embedded in the outer dielectric layer, and each of the antistatic glass fiber layers is located between any two of the outer circuit layers.

[0013] Based on the second aspect, in a possible implementation manner, the circuit substrate is an embedded substrate with embedded electronic components, and in any direction perpendicular to the thickness direction, an edge of the antistatic dielectric layer exceeds an edge of the electronic components.

[0014] In the above-mentioned antistatic circuit board and its manufacturing method, the antistatic dielectric layer is first pressed before the circuit substrate is layered, which is beneficial to effectively avoid the generation and transmission of static electricity in subsequent process steps, thereby protecting the devices in the circuit substrate and extending the service life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1-Figure 11 This is a cross-sectional schematic diagram corresponding to the steps of a method for manufacturing an antistatic circuit board according to an embodiment of the present application.

[0016] Fig.12 A schematic cross-sectional view of an antistatic circuit board according to an embodiment of the present application.

[0017] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0020] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0021] See also Figures 1 to 11 The present application provides a method for manufacturing an anti-static circuit board according to an embodiment of the present invention, which comprises the following steps:

[0022] Step S1, see Figure 1 and Figure 2, the antistatic dielectric layer 30 is pressed onto at least one side of a circuit substrate 10 to form a pressed structure A. The antistatic dielectric layer 30 includes an antistatic glass fiber layer 31 and an inner dielectric layer 33 combined with opposite sides of the antistatic glass fiber layer 31, and the circuit substrate 10 is combined with the antistatic glass fiber layer 31 through the inner dielectric layer 33.

[0023] In this embodiment, the antistatic dielectric layer 30 may be formed by, but not limited to, the following methods:

[0024] In the first step, an antistatic material is sprayed or coated on the glass fiber layer 31a and dried and solidified to obtain an antistatic glass fiber layer 31. The antistatic material may be, but is not limited to, an antistatic agent (also called an antistatic agent), and the antistatic agent may include, but is not limited to, at least one of a phosphoric acid antistatic agent, an inorganic semiconductor salt, carbon black, and sodium cellulose sulfate. The phosphoric acid antistatic agent may include, but is not limited to, at least one of amide phosphate esters and alkyl phosphate salts. The inorganic semiconductor salt may include, but is not limited to, at least one of cuprous halides and silver halides.

[0025] In the second step, dielectric materials are disposed on opposite sides of the antistatic glass fiber layer 31 and cured to form an inner dielectric layer 33 combined with the antistatic glass fiber layer 31 .

[0026] In some embodiments, the dielectric material can be formed on the opposite sides of the antistatic glass fiber layer 31 by spraying, printing, or coating. The materials of the two inner dielectric layers 33 on the opposite sides of the antistatic glass fiber layer 31 can be the same or different, and the thicknesses of the two inner dielectric layers 33 can be the same or different. In other embodiments, the antistatic glass fiber layer 31 can be immersed in the dielectric material slurry and then taken out, so that the dielectric material is formed on the antistatic glass fiber layer 31.

[0027] In some embodiments, the inner dielectric layer 33 can completely cover the entire antistatic glass fiber layer 31 , that is, the inner dielectric layer 33 is not only disposed on two opposite sides of the antistatic glass fiber layer 31 , but also covers the side surfaces of the antistatic glass fiber layer 31 .

[0028] In this embodiment, the circuit substrate 10 may be an embedded substrate with embedded electronic components. Specifically, the circuit substrate 10 may include an inner dielectric layer 11, an inner circuit layer 13 combined with the inner dielectric layer 11, and electronic components 15 embedded in the inner dielectric layer 11. Figure 1As shown, the circuit substrate 10 may be a double-layer circuit board, including an electronic component 15 and a first inner circuit layer 13a, an inner dielectric layer 11, and a second inner circuit layer 13b stacked in sequence along a thickness direction X. The electronic component 15 is arranged through the first inner circuit layer 13a, the inner dielectric layer 11, and the second inner circuit layer 13b along the thickness direction X. The electronic component 15 includes a body 150 and a plurality of electrical connection terminals 151, and the electrical connection terminals 151 may be located on a side of the body 150 away from the first inner circuit layer 13a.

[0029] In this embodiment, the material of the inner dielectric layer 11 is the same as the material of the inner dielectric layer 33. In other embodiments, the material of the inner dielectric layer 11 may be different from the material of the inner dielectric layer 33.

[0030] In this embodiment, the specific method of forming the pressed structure A may be but is not limited to:

[0031] Step 1, see Figure 3 , a window 10b penetrating the double-layer circuit substrate 10a is provided along the stacking direction of the double-layer circuit substrate 10a, i.e., the thickness direction X. The double-layer circuit substrate 10a includes a first inner circuit layer 13a, an inner dielectric layer 11, and a second inner circuit layer 13b which are sequentially stacked along the thickness direction X. The window 10b penetrates the first inner circuit layer 13a, the inner dielectric layer 11, and the second inner circuit layer 13b.

[0032] Step 2, see Figure 4 A release film 20 is attached to a side of the second inner circuit layer 13b that is away from the first inner circuit layer 13a.

[0033] Step 3, see Figure 5 , an electronic component 15 is placed in the window 10 b and supported by the release film 20 , wherein the electronic component 15 and the double-layer circuit substrate 10 a constitute the circuit substrate 10 .

[0034] Step 4, see Figure 5 and Figure 6 , an antistatic dielectric layer 30 is pressed onto the side of the double-layer circuit substrate 10 a away from the release film 20 and then the release film 20 is peeled off.

[0035] Step 5, see Figure 2 , another antistatic dielectric layer 30 is pressed onto the circuit substrate 10 , so that the two antistatic dielectric layers 30 are located on opposite sides of the circuit substrate 10 .

[0036] Step S2, see Figure 7 or Figure 8 , at least on one side of the antistatic dielectric layer 30 of the pressed structure A away from the circuit substrate 10 , an outer circuit structure 50 is added.

[0037] The outer circuit structure 50 at least includes an outer circuit layer 51. In some embodiments, the outer circuit structure 50 may further include an outer dielectric layer 53. Furthermore, in some embodiments, an outer antistatic glass fiber layer 61 may be embedded in the outer dielectric layer 53.

[0038] The formation of the outer layer circuit structure 50 may include but is not limited to the following steps:

[0039] Step S21, see Figure 2 and Fig. 9 A first single-sided board 50a is laminated on the side of the antistatic dielectric layer 30 of the laminated structure A away from the circuit substrate 10. The first single-sided board 50a includes a stacked first dielectric layer 53a and a first metal foil 51a. The first dielectric layer 53a bonds the first metal foil 51a and the antistatic dielectric layer 30.

[0040] Step S22, see Fig. 9 and Figure 7 , the first single-sided board 50a is subjected to circuit fabrication so that the first metal foil 51a forms an outer circuit layer 51. In some embodiments, if there is no subsequent step, the first dielectric layer 53a can be used as the outer dielectric layer 53, and accordingly, the outer circuit structure 50 can be composed of the first dielectric layer 53a and the outer circuit layer 51.

[0041] Step S23, see Figure 7 and Fig.10 An outer antistatic dielectric layer 60 is pressed onto the side of the outer circuit layer 51 away from the pressed structure A. The outer antistatic dielectric layer 60 includes an outer antistatic glass fiber layer 61 and a second dielectric layer 62 combined with the opposite sides of the outer antistatic glass fiber layer 61. The pressed structure A is combined with the outer antistatic glass fiber layer 61 through the second dielectric layer 62.

[0042] The antistatic dielectric layer 60 may be formed in the same manner as the antistatic dielectric layer 30 , and the material of each layer in the antistatic dielectric layer 60 may be the same as or different from the material of the corresponding layer in the antistatic dielectric layer 30 .

[0043] Step S24, see Fig.10 and Fig.11A second single-sided board 50b is laminated on the side of the outer antistatic dielectric layer 60 away from the laminated structure A, and the second single-sided board 50b includes a stacked third dielectric layer 53b and a second metal foil 51b, and the third dielectric layer 53b is bonded between the second metal foil 51b and the antistatic dielectric layer 60.

[0044] Step S25, see Fig.11 and Figure 8 , the second single-sided board 50b is subjected to circuit manufacturing so that the second metal foil 51b forms the outer circuit layer 51 accordingly. At this time, the outer dielectric layer 53 includes the first dielectric layer 53a, the second dielectric layer 62 and the third dielectric layer 53b, and correspondingly, the outer circuit structure 50 includes the first dielectric layer 53a, the third dielectric layer 53b, the outer antistatic dielectric layer 60 and the two outer circuit layers 51.

[0045] It is understandable that further layers may be added based on step S25, and an antistatic dielectric layer may be laminated before laminating the single-sided board.

[0046] In the above manufacturing method, the antistatic dielectric layer 30 is pressed before adding layers to the circuit substrate 10, which is conducive to effectively avoiding the generation and transfer of static electricity in subsequent process steps, thereby protecting the components in the circuit substrate 10 and extending the service life of the circuit board. In the subsequent process of adding layers to the circuit substrate 10, the outer antistatic dielectric layer 60 is pressed before adding layers, which is conducive to further avoiding the generation and transfer of static electricity in subsequent process steps, thereby further protecting the internal components in the circuit board and extending the service life of the circuit board.

[0047] See also Fig.12 The antistatic circuit board 100 of one embodiment of the present application comprises an outer circuit structure 40, an antistatic dielectric layer 30 and a circuit substrate 10 which are sequentially stacked along a thickness direction X. The antistatic dielectric layer 30 comprises an antistatic glass fiber layer 31 and an inner dielectric layer 33 which is bonded to the antistatic glass fiber layer 31 on opposite sides of the thickness direction X.

[0048] In some embodiments, the outer circuit structure 40 includes at least two outer circuit layers 41 and an outer dielectric layer 43 combined with the outer circuit layer 41. The outer circuit structure 40 may further include at least one antistatic glass fiber layer 45 embedded in the outer dielectric layer 43. Each antistatic glass fiber layer 45 is located between any two outer circuit layers 41.

[0049] The circuit substrate 10 may be an embedded substrate with electronic components 15 embedded therein.

[0050] The above is only the preferred implementation mode of the present application, and is not any form of limitation on the present application. Although the present application has been disclosed as the preferred implementation mode as above, it is not used to limit the present application. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent implementation modes without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent change and modification made to the above implementation modes based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A method for manufacturing an antistatic circuit board, wherein: The following steps are involved: Laminating an antistatic dielectric layer on at least one side of a circuit substrate to form a laminated structure, wherein the antistatic dielectric layer includes an antistatic glass fiber layer and a dielectric layer bonded to opposite sides of the antistatic glass fiber layer, and the circuit substrate is bonded to the antistatic glass fiber layer through the inner dielectric layer; and At least on one side of the antistatic dielectric layer of the pressed structure away from the circuit substrate, a layer is added to form an outer circuit structure.

2. The method for manufacturing an antistatic circuit board according to claim 1, characterized in that: The formation of the antistatic dielectric layer includes: Spraying or coating an antistatic substance on the glass fiber layer and drying and curing the layer to obtain an antistatic glass fiber layer; and A dielectric material is arranged on opposite sides of the antistatic glass fiber layer and cured to form an inner dielectric layer combined with the antistatic glass fiber layer.

3. The method for manufacturing an antistatic circuit board according to claim 1, characterized in that: The step of laminating the antistatic dielectric layer to at least one side of the circuit substrate to form the laminating structure specifically includes: A window penetrating a circuit substrate is provided along a thickness direction of the circuit substrate, wherein the circuit substrate comprises a first inner circuit layer, an inner dielectric layer, and a second inner circuit layer which are sequentially stacked along the thickness direction; A release film is attached to a side of the second inner circuit layer facing away from the first inner circuit layer; Placing the electronic component on the window quilt and supported by the release film; Laminating an antistatic dielectric layer on a side of the circuit substrate away from the release film and then peeling off the release film; Another antistatic dielectric layer is pressed onto the circuit substrate, so that the two antistatic dielectric layers are located on opposite sides of the circuit substrate.

4. The method for manufacturing an antistatic circuit board according to claim 1, characterized in that: The formation of the outer layer circuit structure includes: Laminating a first single-sided board on a side of the antistatic dielectric layer of the lamination structure away from the circuit substrate, wherein the first single-sided board comprises a stacked first dielectric layer and a first metal foil, and the first dielectric layer is bonded between the first metal foil and the antistatic dielectric layer; and The first single-sided board is subjected to circuit fabrication so that the first metal foil forms an outer circuit layer.

5. The method for manufacturing an antistatic circuit board according to claim 4, characterized in that: The forming of the outer layer circuit structure further comprises: Laminating an outer antistatic dielectric layer on the side of the outer circuit layer away from the laminating structure, the outer antistatic dielectric layer comprising an outer antistatic glass fiber layer and a second dielectric layer bonded to opposite sides of the outer antistatic glass fiber layer, the laminating structure being bonded to the outer antistatic glass fiber layer via the second dielectric layer; Laminating a second single-sided board on a side of the outer antistatic dielectric layer away from the laminating structure, wherein the second single-sided board comprises a stacked third dielectric layer and a second metal foil, and the third dielectric layer is bonded between the second metal foil and the antistatic dielectric layer; and The second single-sided board is subjected to circuit fabrication so that the second metal foil forms another outer circuit layer accordingly.

6. The method for manufacturing an antistatic circuit board according to claim 2, characterized in that: The antistatic material includes at least one of a phosphoric acid antistatic agent, an inorganic semiconductor salt, carbon black and sodium cellulose sulfate; the phosphoric acid antistatic agent includes at least one of an amide phosphate ester and an alkyl phosphate salt; and the inorganic semiconductor salt includes at least one of a cuprous halide and a silver halide.

7. The method for manufacturing an antistatic circuit board according to claim 3, characterized in that: In any direction perpendicular to the thickness direction, an edge of each antistatic dielectric layer exceeds an edge of the electronic component.

8. An antistatic circuit board, characterized in that: It comprises an outer circuit structure, an antistatic dielectric layer and a circuit substrate which are sequentially stacked along the thickness direction. The antistatic dielectric layer comprises an antistatic glass fiber layer and an inner dielectric layer combined with the antistatic glass fiber layer on opposite sides in the thickness direction.

9. The antistatic circuit board according to claim 8, characterized in that: The outer circuit structure includes at least two outer circuit layers and an outer dielectric layer combined with the outer circuit layers. The outer circuit structure also includes at least one antistatic glass fiber layer embedded in the outer dielectric layer, and each antistatic glass fiber layer is located between any two of the outer circuit layers.

10. The antistatic circuit board according to claim 8, characterized in that: The circuit substrate is an embedded substrate in which electronic components are embedded. In any direction perpendicular to the thickness direction, the edge of the antistatic dielectric layer exceeds the edge of the electronic components.

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